TPD4S010 [TI]
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE; 4通道ESD解决方案为高速差分接口
| 型号： | TPD4S010 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE |
| 文件： | 总18页 (文件大小：1052K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD4S009
TPD4S010
www.ti.com
SLVS817D –MAY 2008–REVISED MARCH 2010
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE
Check for Samples: TPD4S009, TPD4S010
1
FEATURES
•
•
•
•
Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz)
•
IEC 61000-4-2 (Level 4) System-Level ESD
Compliance
Ultra-low Matching Capacitance Between
Differential Signal Pairs
•
•
•
2.5-A Peak Pulse Current (8/20-ms Pulse)
Ioff Feature for the TPD4S009
Low 0.8-pF Line Capacitance for Each Data
Line to GND
Industrial Temperature Range:
–40°C to 85°C
Flow-Through Single-in-Line Pin Mapping for
High-Speed Lines Ensures No Additional
Board Layout Burden While Placing ESD
Protection Chip Near Connector
•
Space-Saving Package Options
TPD4S009...DGS PACKAGE
(TOP VIEW)
TPD4S009...DBV OR DCK PACKAGE
(TOP VIEW)
TPD4S010...DQA PACKAGE
(TOP VIEW)
TPD4S009...DRY PACKAGE
(TOP VIEW)
1
2
3
6
5
4
D1+
GND
D2+
D1–
VCC
1
2
3
10
9
D1+
D1–
GND
D2+
D2–
N.C.
N.C.
D1+
D1+
D1–
GND
D2+
D2–
10
9
N.C.
N.C.
VCC
1
2
3
6
5
4
D1–
1
2
3
4
5
D2–
GND
D2+
8
VCC
D2–
GND
N.C.
N.C.
8
4
5
7
6
7
N.C.
N.C.
6
DESCRIPTION/ORDERING INFORMATION
The TPD4S009 and TPD4S010 provide system level electrostatic discharge (ESD) solution for high-speed
differential lines. These devices offer four ESD clamp circuits for dual pair differential lines. The TPD4S009 offers
an optional VCC supply pin which can be connected to system supply plane. There is a blocking diode at the VCC
pin to enable the Ioff feature for the TPD4S009. The TPD4S009 can handle live signal at the D+, D- pins when
the VCC pin is connected to zero volt. The VCC pin allows all the internal circuit nodes of the TPD4S009 to be at
known potential during start up time. However, connecting the optional VCC pin to board supply plane doesn't
affect the system level ESD performance of the TPD4S009. The TPD4S010 does not offer the VCC pin.
The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPDS4010 is offered in DQA package.
The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential
lines. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout option to reduce signal
glitches due to mismatch between the D+ and D- signal pair routing.
The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching
between the differential pair signal lines (0.05-pF line-line capacitance for the TPD4S009DRY) enables this
device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The TPD4S009 and
TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia interface
(HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394
( FireWire®), etc.
TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD.
TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPD4S009
TPD4S010
SLVS817D –MAY 2008–REVISED MARCH 2010
www.ti.com
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
TA
PACKAGE(1) (2)
Reel of
NOMINAL DIMENSIONS (mm)
MARKING(3)
MSOP – DGS
W = 4.9, L = 3, H < 1.1, Pitch = 0.5
W = 1, L = 2.5, H < 1.1, Pitch = 0.5
W = 1, L = 1.45, H = 0.55, Pitch = 0.5
W = 2.1, L = 2, H = 0.95, Pitch = 0.65
TPD4S009DGSR
TPD4S010DQAR
TPD4S009DRYR
TPD4S009DCKR
3HR
3000
Reel of
3000
SON – DQA
4UR
3H
Reel of
5000
–40°C to 85°C SON – DRY
SOT (SC-70) – DCK
SOT (SOT-23) – DBV
Reel of
3000
3H_
NFJK
Reel of
3000
W = 2.9, L = 2.8, H < 1.45, Pitch = 0.95 TPD4S009DBVR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCK: The actual top-side marking has one additional character that designates wafer fab/assembly site.
CIRCUIT DIAGRAMS
TPD4S009
V
CC
D2+
D2–
D1+
D1–
GND
TPD4S010
D2+
D2–
D1+
D1–
GND
2
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
www.ti.com
SLVS817D –MAY 2008–REVISED MARCH 2010
TERMINAL FUNCTIONS
DBV, DCK,
OR DRY
PIN NO.
DGS
PIN NO.
DQA
PIN NO.
NAME
I/O
DESCRIPTION
1, 6,
3, 4
1, 2,
4, 5
1, 2,
4, 5
D1+, D1–,
D2+, D2–
High-speed ESD clamp provides ESD protection to the
high-speed differential data lines.
ESD port
2
–
5
3
6, 7, 9, 10
8
3, 8
6, 7, 9, 10
–
GND
N.C.
VCC
GND
–
Ground
Not internally connected
Supply
Power
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
SLVS817D –MAY 2008–REVISED MARCH 2010
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
0
MAX
6
UNIT
V
VCC
VIO
Tstg
TA
Supply voltage range for TPD4S009
IO signal voltage range
VCC
125
85
V
Storage temperature range
–65
–40
°C
°C
°C
kV
kV
W
Characterized free-air operating temperature range
Lead temperature, 1.6 mm (1/16 in) from case for 10 s)
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
Peak pulse power (tp = 8/20 ms)
260
±8
±9
25
Peak pulse current (tp = 8/20 ms)
2.5
A
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Reverse standoff voltage
Breakdown voltage
TEST CONDITIONS
MIN
TYP
MAX
5.5
UNIT
V
VRWM
VBR
IIO
Any IO pin to ground
IIO = 1 mA
Any IO pin to ground
Any IO pin
9
V
IO port current
VIO = 3.3 V, VCC = 5 V
VIO = 3.3 V, VCC = 5 V
IIO = 8 mA
0.01
0.1
0.1
mA
mA
V
Ioff
Current from IO port to supply pins
Diode forward voltage
Dynamic resistance
Any IO pin
0.01
0.8
1.1
0.8
0.1
VD
Lower clamp diode
Any IO pin
0.6
0.95
RDYN
CIO
ICC
I = 1 A
Ω
IO capacitance
VCC = 5 V, VIO = 2.5 V
VIO = Open, VCC = 5 V
Any IO pin
pF
mA
Operating supply current
VCC pin
1
4
Submit Documentation Feedback
Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
www.ti.com
SLVS817D –MAY 2008–REVISED MARCH 2010
TYPICAL CHARACTERISTICS
2
0
70
60
50
40
30
20
10
0
D1+
D2+
-2
-4
-6
-8
-10
100k
1M
10M
100M
1G
10G
–40
25
55
85
Frequency (Hz)
Temperature,T (°C)
A
Figure 1. Insertion Loss S21 – I/O to GND
Figure 2. Leakage Current vs Temperature (VIO = 2.5 V)
220
5.0
4.0
3.0
2.0
1.0
0.0
200
180
160
140
120
100
80
60
40
20
0
–20
1
2
3
4
5
0
25 50
75 100 125 150 175 200 225 250
Time (nS)
IO Voltage (V)
Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V)
Figure 4. IEC Clamping Waveforms
(8-kV Contact, Average of Ten Waveforms)
Copyright © 2008–2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
SLVS817D –MAY 2008–REVISED MARCH 2010
www.ti.com
TYPICAL CHARACTERISTICS (continued)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
30
25
20
15
10
5
Current (A)
Power (W)
0
0
5
10 15 20 25 30 35 40 45 50
Time (µs)
Figure 5. Pulse Waveform (8/20 ms Pulse)
Figure .
Figure 6. Eye Diagram Without TPD4S009
Figure 7. Eye Diagram With TPD4S009
6
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Copyright © 2008–2010, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009 TPD4S010
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPD4S009DBVR
TPD4S009DBVRG4
TPD4S009DCKR
TPD4S009DCKRG4
TPD4S009DGSR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DGS
6
6
3000
3000
3000
3000
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
6
Green (RoHS
& no Sb/Br)
SC70
6
Green (RoHS
& no Sb/Br)
MSOP
10
Green (RoHS
& no Sb/Br)
TPD4S009DRYR
TPD4S010DQAR
ACTIVE
ACTIVE
SON
SON
DRY
DQA
6
5000
3000
TBD
Call TI
Call TI
Request Free Samples
Request Free Samples
10
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
31-Jul-2010
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPD4S009DBVR
TPD4S009DCKR
TPD4S010DQAR
SOT-23
SC70
SON
DBV
DCK
DQA
6
6
3000
3000
3000
180.0
180.0
180.0
9.2
8.4
8.4
3.23
2.25
1.3
3.17
2.4
1.37
1.22
0.65
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q1
10
2.83
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPD4S009DBVR
TPD4S009DCKR
TPD4S010DQAR
SOT-23
SC70
SON
DBV
DCK
DQA
6
6
3000
3000
3000
205.0
202.0
202.0
200.0
201.0
201.0
33.0
28.0
28.0
10
Pack Materials-Page 2
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