TPD4S009DRYR [TI]
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE; 4通道ESD解决方案为高速差分接口
| 型号： | TPD4S009DRYR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE |
| 文件： | 总12页 (文件大小：698K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817–MAY 2008
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE
1
FEATURES
2
•
•
•
•
Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz)
DBV OR DCK PACKAGE
(TOP VIEW)
0.05-pF Matching Capacitance Between
Differential Signal Pairs
D1+
GND
D2+
1
2
3
6
5
4
D1–
Low 0.8-pF Line Capacitance for Each Data
Line to GND
VCC
Flow-Through Single-in-Line Pin Mapping for
High-Speed Lines Ensures No Additional
Board Layout Burden While Placing ESD
Protection Chip Near Connector
D2–
•
IEC 61000-4-2 (Level 4) System-Level ESD
Compliance
DRY PACKAGE
(TOP VIEW)
•
•
•
2.5-A Peak Pulse Current (8/20-µs Pulse)
1
2
3
6
5
4
D1+
GND
D2+
D1–
VCC
Ioff Feature
Industrial Temperature Range:
–40°C to 85°C
D2–
•
Space-Saving Package Options
DESCRIPTION/ORDERING INFORMATION
The TPD4S009 provides an electrostatic discharge (ESD) solution for high-speed differential lines. This device
offers four ESD clamp circuits for dual differential lines. The monolithic silicon technology allows matching
between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF
line-line) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The
TPD4S009 is suitable for high-speed differential applications, such as high-definition multimedia interface
(HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394
(FireWire®), etc.
The TPD4S009 complies with IEC 61000-4-2 (Level 4) ESD. This device is offered in space-saving DBV, DCK,
and DRY packages.
The TPD4S009 is characterized for operation over the ambient air temperature range of –40°C to 85°C.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TPD4S009DRYR 3H
TOP-SIDE MARKING
SON – DRY
Reel of 5000
Reel of 3000
Reel of 3000
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
TPD4S009DBVR
NFJK
TPD4S009DCKR
PREVIEW
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
FireWire is a registered trademark of Apple Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPD4S009
SLVS817–MAY 2008........................................................................................................................................................................................................ www.ti.com
CIRCUIT DIAGRAM
V
CC
D2+
D2–
D1+
D1–
GND
TERMINAL FUNCTIONS
TERMINAL
NAME
TYPE
DESCRIPTION
NO.
D1+, D1–,
D2+, D2–
1, 3,
4, 6
ESD port
High-speed ESD clamp provides ESD protection to the high-speed differential data lines.
GND
VCC
2
5
GND
Ground
Supply
Supply
2
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817–MAY 2008
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
0
MAX
6
UNIT
V
VCC
VIO
Tstg
TA
Supply voltage range
IO signal voltage range
VCC
125
85
V
Storage temperature range
–65
–40
°C
°C
°C
kV
kV
W
Characterized free-air operating temperature range
Lead temperature, 1.6 mm (1/16 in) from case for 10 s)
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
Peak pulse power (tp = 8/20 µs)
Peak pulse current (tp = 8/20 µs)
260
±8
±9
25
2.5
A
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Reverse standoff voltage
Breakdown voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VRWM
VBR
IIO
Any IO pin to ground
IIO = 1 mA
5.5
V
V
Any IO pin to ground
Any IO pin
9
IO port current
VIO = 3.3 V, VCC = 5 V
VIO = 3.3 V, VCC = 5 V
IIO = 8 mA
0.01
0.1
0.1
µA
µA
V
Ioff
Current from IO port to supply pins
Diode forward voltage
Dynamic resistance
Any IO pin
0.01
0.8
1.1
0.8
0.1
VD
Lower clamp diode
Any IO pin
0.6
0.95
RDYN
CIO
ICC
I = 1 A
Ω
IO capacitance
VCC = 5 V, VIO = 2.5 V
VIO = Open, VCC = 5 V
Any IO pin
pF
µA
Operating supply current
VCC pin
1
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPD4S009
TPD4S009
SLVS817–MAY 2008........................................................................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS
2
70
60
50
40
30
20
10
0
D1+
0
-2
D2+
-4
-6
-8
-10
100k
1M
10M
100M
1G
10G
–40
25
55
85
Frequency (Hz)
Temperature,T (°C)
A
Figure 1. Insertion Loss S21 – I/O to GND
Figure 2. Leakage Current vs Temperature (VIO = 2.5 V)
220
200
180
160
140
120
100
80
5.0
4.0
3.0
2.0
1.0
0.0
60
40
20
0
–20
1
2
3
4
5
0
25 50
75 100 125 150 175 200 225 250
Time (nS)
IO Voltage (V)
Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V)
Figure 4. IEC Clamping Waveforms
(8-kV Contact, Average of Ten Waveforms)
3.0
30
2.5
2.0
1.5
1.0
0.5
0.0
25
20
Current (A)
15
10
Power (W)
5
0
0
5
10 15 20 25 30 35 40 45 50
Time (µs)
Figure 5. Pulse Waveform (8/20 µs Pulse)
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817–MAY 2008
TYPICAL CHARACTERISTICS (continued)
Figure 6. Eye Diagram Without TPD4S009
Figure 7. Eye Diagram With TPD4S009
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPD4S009
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TPD4S009DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPD4S009DCKR
TPD4S009DRYR
PREVIEW
ACTIVE
SC70
SON
DCK
DRY
6
6
3000
TBD
Call TI
Call TI
5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPD4S009DBVR
TPD4S009DRYR
SOT-23
SON
DBV
DRY
6
6
3000
5000
180.0
179.0
9.2
8.4
3.23
1.2
3.17
1.65
1.37
0.7
4.0
4.0
8.0
8.0
Q3
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jul-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPD4S009DBVR
TPD4S009DRYR
SOT-23
SON
DBV
DRY
6
6
3000
5000
205.0
220.0
200.0
205.0
33.0
50.0
Pack Materials-Page 2
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