TPD6E004RSERG4 [TI]
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES; 低电容6通道【 15千伏ESD保护阵列高速数据接口
| 型号： | TPD6E004RSERG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES |
| 文件： | 总12页 (文件大小：482K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
1
FEATURES
RSE PACKAGE
(BOTTOM VIEW)
2
•
ESD Protection Exceeds JESD
–
–
–
±15-kV Human-Body Model (HBM)
±8-kV IEC 61000-4-2 Contact Discharge
±12-kV IEC 61000-4-2 Air-Gap Discharge
1
2
3
•
•
•
•
Low 1.6-pF IO Capacitance
0.9-V to 5.5-V Supply-Voltage Range
6-Channel Device
V
4
8
GND
CC
7
6
5
Space-Saving QFN (RSE) Package
APPLICATIONS
•
•
•
•
•
•
•
USB
Ethernet
FireWire
Video
Cell Phones
SVGA Video Connections
Glucose Meters
abc
abc
DESCRIPTION/ORDERING INFORMATION
The TPD6E004 is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive electronics
attached to communication lines. Each channel consists of a pair of diodes that steers ESD current pulses to VCC
or GND. The TPD6E004 protects against ESD pulses up to ±15-kV Human-Body Model (HBM), ±8-kV Contact
Discharge, and ±12-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a typical 1.6-pF
capacitance per channel, making it ideal for use in high-speed data IO interfaces.
The TPD6E004 is a six-channel ESD structure designed for wthernet and FireWire applications.
The TPD6E004 is available in the RSE package and is specified for –40°C to 85°C operation.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RSE
–40°C to 85°C
1.5 mm × 1.5 mm,
Reel of 3000
TPD6E004RSER
2V
Pitch = 0.5 mm, Height = 0.55 mm
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
LOGIC BLOCK DIAGRAM
VCC
IO1
IO2
IO3
IO4
IO5
IO6
GND
PIN DESCRIPTION
RSE NO.
NAME
IOx
FUNCTION
1-3, 5-7
ESD-protected channel
Ground
4
8
GND
VCC
Power-supply input. Bypass VCC to GND with a 0.1-µF ceramic capacitor.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
–65
MAX UNIT
VCC
VIO
5.5
VCC + 0.3
150
V
V
Tstg
TJ
Storage temperature range
Junction temperature
°C
°C
150
Infrared (15 s)
220
Bump temperature (soldering)
°C
°C
Vapor phase (60 s)
215
Lead temperature (soldering, 10 s)
300
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD6E004
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
ELECTRICAL CHARACTERISTICS
VCC = 5 V ± 10%, TA = TMIN to TMAX (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(1)
MAX UNIT
VCC
ICC
VF
Supply voltage
0.9
5.5
V
nA
V
Supply current
500
Diode forward voltage
Channel leakage current
Break-down Voltage
Channel input capacitance
IF = 1 mA
0.8
II
±1
nA
V
VBR
CI/O
II = 10µA
6
8
2
VCC = 5 V, Bias of VCC/2, f = 10MHz
1.6
pF
(1) Typical values are at VCC = 5 V and TA = 25°C.
ESD PROTECTION
PARAMETER
TYP UNIT
HBM
±15
±8
kV
kV
kV
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
±12
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPD6E004
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
TYPICAL OPERATING CHARACTERISTICS
160
140
120
100
80
70
60
50
40
30
20
10
0
60
40
20
0
1.05
1.15
1.25
1.35
1.45
1.55
–40
25
Temperature (°C)
Figure 2. Leakage Current vs Temperature (VIO = 2.5 V)
55
85
IO Voltage (V)
Figure 1. Forward Diode Voltage (Upper Clamp Diode)
(VCC = 0 V, DC Sweep Across the IO Pin)
5.0
16.0
14.0
12.0
10.0
8.0
4.0
3.0
2.0
1.0
0.0
6.0
4.0
2.0
0.0
1
2
3
4
5
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
IO Voltage (V)
IO Voltage (V)
Figure 3. Reverse Diode Curve Current IO to GND
(VCC = Open)
Figure 4. IO Capacitance vs Input Voltage
(VCC = 5 V)
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD6E004
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
TYPICAL OPERATING CHARACTERISTICS (continued)
220
200
180
160
140
120
100
80
60
40
20
0
–20
0
25
50
75
100 125 150 175 200 225 250
Time (ns)
Figure 5. IEC ESD Clamping Waveforms +8-kV Contact,
Average of 10 Waveforms
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPD6E004
TPD6E004
LOW-CAPACITANCE 6-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS799A–FEBRUARY 2008–REVISED FEBRUARY 2008
APPLICATION INFORMATION
VBUS
D+
0.1 µF
VCC
D–
RT
GND
IO5
IO3
IO1
USB
Controller
Open
Open
D1
IO6
IO4
IO2
VBUS
D+
D–
GND
GND
Detailed Description
When placed near the connector, the TPD6E004 ESD solution offers little or no signal distortion during normal
operation due to low IO capacitance and ultra-low leakage current specifications. The TPD6E004 ensures that
the core circuitry is protected and the system is functioning properly in the event of an ESD strike. For proper
operation, the following layout/design guidelines should be followed:
1. Place the TPD6E004 solution close to the connector. This allows the TPD6E004 to take away the energy
associated with ESD strike before it reaches the internal circuitry of the system board.
2. Place a 0.1-µF capacitor very close to the VCC pin. This limits any momentary voltage surge at the IO pin
during the ESD strike event.
3. Make sure that there is enough metallization for the VCC and GND loop. During normal operation, the
TPD6E004 consumes nA leakage current. But during the ESD event, VCC and GND may see 15 A to 30 A of
current, depending on the ESD level. Sufficient current path enables safe discharge of all the energy
associated with the ESD strike.
4. Leave the unused IO pins floating.
5. The VCC pin can be connected in two different ways:
a. If the VCC pin is connected to the system power supply (a 0.1-µF capacitor at VCC is recommended for
ESD bypass), the TPD6E004 works as a transient voltage suppressor for any signal swing above VCC
Vd.
+
b. If the VCC pin is not connected to system power supply (a 0.1-µF capacitor is still recommended at the
VCC pin for ESD bypass), the TPD6E004 can tolerate higher signal swing in the range up to VBR. Note
that initially the bypass capacitor is charged by the signals through clamp diode.
6
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD6E004
PACKAGE OPTION ADDENDUM
www.ti.com
8-Dec-2009
PACKAGING INFORMATION
Orderable Device
TPD6E004RSER
TPD6E004RSERG4
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
UQFN
RSE
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UQFN
RSE
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPD6E004RSER
UQFN
RSE
8
3000
179.0
8.4
1.7
1.7
0.76
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Dec-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
UQFN RSE
SPQ
Length (mm) Width (mm) Height (mm)
220.0 205.0 50.0
TPD6E004RSER
8
3000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
相关型号：
TPD6F003DSVR
IC LIQUID CRYSTAL DISPLAY DRIVER, PDSO12, 0.40 MM PITCH, PLASTIC, SON-12, Display Driver
TI
©2020 ICPDF网 联系我们和版权申明