TPD6E05U06 [TI]
1, 4, 6 Channel ESD Protection Device for Super-Speed (up to 6 Gbps) Interface;
| 型号： | TPD6E05U06 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1, 4, 6 Channel ESD Protection Device for Super-Speed (up to 6 Gbps) Interface |
| 文件： | 总15页 (文件大小：518K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPD1E05U06
TPD4E05U06
TPD6E05U06
www.ti.com
SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
1, 4, 6 CHANNEL PROTECTION SOLUTION FOR SUPER-SPEED (UP TO 6 GBPS)
INTERFACE
Check for Samples: TPD1E05U06, TPD4E05U06, TPD6E05U06
1
FEATURES
•
Easy Straight-through Routing Packages
•
Provides System Level ESD Protection for
Low- Voltage IO Interface
APPLICATIONS
•
•
•
•
•
•
•
HDMI1.4
•
IEC 61000-4-2 Level 4
USB3.0
–
–
±15kV (Air gap discharge)
±12kV (Contact discharge)
MHL
LVDS Interfaces
DisplayPort
PCI Express
eSata Interfaces
•
•
•
•
•
IO Capacitance 0.42pF (Typ)
DC Breakdown Voltage 6.5V (Min)
Ultra low Leakage Current 10nA (Max)
Low ESD Clamping Voltage
Industrial Temperature Range: -40°C to 125°C
1
2
3
14
13
12
11
10
9
D1+
D1–
D2+
D2–
GND
D3+
D3–
NC
NC
NC
1
10
9
D1+
N.C.
N.C.
I/O
2
D1–
1
3
8
4
5
6
7
GND
GND
NC
4
7
6
D2+
D2–
2
N.C.
N.C.
GND
NC
5
GND
8
NC
DQA
2.5 mm x 1 mm x 0.5 mm
(0.5-mm pitch)
DPY
1 mm x 0.6 mm x 0.35 mm
(0.65-mm pitch)
RVZ
3.5 mm x 1.35 mm x 0.5 mm
(0.5-mm pitch)
DESCRIPTION
The TPDxE05U06 is a family of unidirectional ESD protection devices with ultra low capacitance. This family of
devices is constructed with a central ESD clamp with two hiding diodes to reduce the capacitive loading. They
are rated to dissipate ESD strikes above the maximum level specified in the IEC61000-4-2 level 4 international
standard. Its ultra low loading capacitance makes it ideal for protecting any high-speed signal pins.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPD1E05U06
TPD4E05U06
TPD6E05U06
SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
TOP-SIDE
TA
PACKAGE(1) (2)
QUANTITY
ORDERABLE PART NUMBER
MARKING(3)
SON – DPY
SON – DPY
SON – DQA
SON – RVZ
Tape and reel
10K
250
TPD1E05U06DPYR
TPD1E05U06DPYT
TPD4E05U06DQAR
TPD6E05U06RVZR
C1
Tape and reel
Tape and reel
Tape and reel
TBD
TBD
TBD
–40°C to 85°C
3000
3000
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DQA: The actual top-side marking has one additional character that designates wafer fab/assembly site.
FUNCTIONAL BLOCK DIAGRAM
Figure 1. Single Channel Schematic Diagram
2
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Product Folder Links: TPD1E05U06 TPD4E05U06 TPD6E05U06
TPD1E05U06
TPD4E05U06
TPD6E05U06
www.ti.com
SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
Figure 2. Quad Channel Schematic Diagram
Figure 3. 6-Channel Schematic Diagram
SINGLE CHANNEL TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
USAGE
NAME
I/O
PIN NO.
1
2
I/O
ESD protected channel
Ground
Connect pin 1 as close to the connector as possible
Connect to ground
GND
GND
Copyright © 2012–2013, Texas Instruments Incorporated
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TPD1E05U06
TPD4E05U06
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SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
www.ti.com
QUAD CHANNEL TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
USAGE
NAME
PIN NO.
D1+
D1–
D2+
D2–
1
2
4
5
I/O
I/O
I/O
I/O
ESD protected channel
ESD protected channel
ESD protected channel
ESD protected channel
Connect it as close to the connector as possible
Connect it as close to the connector as possible
Connect it as close to the connector as possible
Connect it as close to the connector as possible
Used for optional straight-through routing from D+;
otherwise can be left floating or grounded
NC
6, 7, 9, 10
3, 8
NC
No connect
Ground
GND
GND
Connect to ground
QUAD CHANNEL TERMINAL FUNCTIONS
TERMINAL
TYPE
DESCRIPTION
USAGE
NAME
D1+
D1–
D2+
D2–
D3+
D3–
PIN NO.
14
13
12
12
9
I/O
I/O
I/O
I/O
ESD protected channel
ESD protected channel
ESD protected channel
ESD protected channel
Connect it as close to the connector as possible
Connect it as close to the connector as possible
Connect it as close to the connector as possible
Connect it as close to the connector as possible
8
1, 2, 3, 4, 6,
7
Used for optional straight-through routing from D+;
otherwise can be left floating or grounded
NC
NC
No connect
Ground
GND
5, 10
GND
Connect to ground
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
–40
–65
MAX
125
155
±12
±15
2.5
UNIT
°C
°C
kV
kV
A
TA
Operating free-air temperature range
Storage temperature range
Tstg
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
ESD protection
IPP
Peak pulse current (tp = 8/20 μs)
Peak pulse power (tp = 8/20 μs)
PPP
40
W
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
4
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TPD1E05U06
TPD4E05U06
TPD6E05U06
www.ti.com
SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VRWM
Reverse stand-off voltage
IIO = 10 µA
5.5
V
IPP= 1 A, tp = 8/20 μs, from I/O to ground(1)
IPP= 2.5A, tp = 8/20 μs, from I/O to ground(1)
IPP= 1A, tp = 8/20 μs, from ground to I/O(1)
IPP= 3A, tp = 8/20 μs, from ground to I/O(1)
Pin x to GND Pin(2)
10.4
13.4
3.3
Vclamp
Clamp voltage
V
7.6
0.65
0.8
DPY package dynamic
resistance
Ω
Ω
Ω
(2)
GND Pin to Pin x
Pin x to GND Pin(2)
TBD
TBD
TBD
TBD
0.42
DQA package dynamic
resistance
RDYN
(2)
GND Pin to Pin x
Pin x to GND Pin(2)
RVZ package dynamic
resistance
(2)
GND Pin to Pin x
CL
Line capacitance(3)
VIO = 2.5 V, F = 1 MHz, I/O to GND
0.5
pF
pF
Channel to channel input
capacitance
GND Pin = 0 V, F = 1 GHz, VBIAS = 2.5 V, between
channel pins
CCROSS
0.1
0.15
ΔCIO-TO-
GND
Variation of channel input
capacitance
GND Pin = 0 V, F = 1 GHz, VBIAS = 2.5 V,
channel_x pin to gnd – channel_y pin to gnd
0.05
0.07
pF
VBR
Break-down voltage
Leakage current
IIO = 1 mA
VIO = 2.5 V
6.5
8.5
10
V
ILEAK
1
nA
(1) Non-repetitive current pulse 8/20us exponentially decaying waveform according to IEC61000-4-5.
(2) Extraction of RDYIN using least squares fit of TLP characteristics between I = 10 A and I = 20 A.
(3) Capacitance data is taken at 25°C.
Copyright © 2012–2013, Texas Instruments Incorporated
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SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
www.ti.com
TYPICAL CHARACTERISTICS
CURRENT
vs
VOLTAGE
CURRENT and POWER
vs
TIME
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
50
45
40
35
30
25
20
15
10
5
1.0
0.8
Current
Power
0.6
0.4
0.2
0.0
œ0.2
œ0.4
œ0.6
œ0.8
œ1.0
0
œ5
0
5
10 15 20 25 30 35 40 45 50
œ2 œ1
0
1
2
3
4
5
6
7
8
9
10
C002
Time (ꢀs)
C001
Voltage (V)
Figure 4. DC Voltage Sweep I-V Curve
Figure 5. Surge Curve (tp = 8/20μs), Pin IO to GND
CURRENT
vs
VOLTAGE
CURRENT
vs
TEMPERATURE
10
8
300
250
200
150
100
50
6
4
2
0
œ2
œ4
œ6
œ8
œ10
0
œ15 œ10
œ5
0
5
10
15
20
25
30
œ40
œ20
0
20
40
60
80
100
120
C003
C004
Voltage (V)
Temperature (°C)
Figure 6. TLP Plot IO to GND
Figure 7. Leakage vs Temp
VOLTAGE
vs
TIME
VOLTAGE
vs
TIME
80
70
60
50
40
30
20
10
0
10
0
œ10
œ20
œ30
œ40
œ50
œ60
œ70
œ80
œ90
œ10
0
25
50
75
100
125
150
175
200
0
25
50
75
100
125
150
175
200
C005
C006
Time (ns)
Time (ns)
Figure 8. +8kV IEC Waveform
Figure 9. –8kV IEC Waveform
6
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SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
TYPICAL CHARACTERISTICS (continued)
INSERTION LOSS
vs
FREQUENCY
0
œ1
œ2
œ3
œ4
œ5
œ6
œ7
œ8
œ9
œ10
œ11
œ12
100k
1M
10M
100M
1G
10G
C007
Frequency (Hz)
Figure 10. TPD1E05U06 Insertion Loss
Copyright © 2012–2013, Texas Instruments Incorporated
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SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Figure 11. TPD1E05U06 Eye Diagrams
8
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SLVSBO7B –DECEMBER 2012–REVISED JANUARY 2013
REVISION HISTORY
Changes from Original (December 2012) to Revision A
Page
•
Added TPS2EUSB30A part to document. ............................................................................................................................ 1
Changes from Revision A (December 2012) to Revision B
Page
•
•
Added Insertion Loss Graphic. ............................................................................................................................................. 6
Added Eye Diagrams. ........................................................................................................................................................... 8
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
TPD1E05U06DPYR
TPD1E05U06DPYT
TPD4E05U06DQAR
TPD6E05U06RVZR
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
ACTIVE
X2SON
X2SON
SON
DPY
2
2
10000
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
C1
C1
ACTIVE
PREVIEW
PREVIEW
DPY
DQA
RVZ
Green (RoHS
& no Sb/Br)
-40 to 85
10
14
3000
3000
Green (RoHS
& no Sb/Br)
-40 to 85
UQFN
TBD
-40 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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相关型号：
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