TPIC6A596DWRG4 [TI]

用于增强级联、具有使能/关断功能的 8 位移位寄存器 | DW | 24 | -40 to 125;
TPIC6A596DWRG4
型号: TPIC6A596DWRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

用于增强级联、具有使能/关断功能的 8 位移位寄存器 | DW | 24 | -40 to 125

移位寄存器
文件: 总13页 (文件大小:200K)
中文:  中文翻译
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TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
NE PACKAGE  
(TOP VIEW)  
Low r  
. . . 1 Typ  
DS(on)  
Output Short-Circuit Protection  
Avalanche Energy . . . 75 mJ  
DRAIN2  
DRAIN3  
SRCLR  
G
DRAIN1  
DRAN0  
SER IN  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
Eight 350-mA DMOS Outputs  
50-V Switching Capability  
V
CC  
Enhanced Cascading for Multiple Stages  
All Registers Cleared With Single Input  
Low Power Consumption  
PGND  
PGND  
RCK  
PGND  
15 PGND  
14  
13  
12  
11  
LGND  
SRCK  
DRAIN4  
DRAIN5  
SER OUT  
DRAIN7  
DRAIN6  
description  
The TPIC6A596 is a monolithic, high-voltage,  
high-current power logic 8-bit shift register  
designed for use in systems that require relatively  
high load power. The device contains a built-in  
voltage clamp on the outputs for inductive  
transient protection. Power driver applications  
include relays, solenoids, and other medium-  
current or high-voltage loads. Each open-drain  
DMOS transistor features an independent  
chopping current-limiting circuit to prevent  
damage in the case of a short circuit.  
DW PACKAGE  
(TOP VIEW)  
DRAIN2  
DRAIN3  
SRCLR  
G
DRAIN1  
DRAIN0  
SER IN  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
2
3
V
4
CC  
PGND  
PGND  
PGND  
PGND  
RCK  
PGND  
5
PGND  
6
PGND  
7
This device contains an 8-bit serial-in, parallel-out  
shift register that feeds an 8-bit, D-type storage  
register. Data transfers through both the shift and  
storage registers on the rising edge of the shift-  
register clock (SRCK) and the register clock  
(RCK), respectively. The storage register  
transfers data to the output buffer when shift-  
PGND  
8
LGND  
9
SRCK  
DRAIN4  
SER OUT  
DRAIN7  
10  
11  
DRAIN5 12  
13 DRAIN6  
register clear (SRCLR) is high. When SRCLR is low, all registers in the device are cleared. When output enable  
G is held high, all data in the output buffers is held low and all drain outputs are off. When G is held low, data  
from the storage register is transparent to the output buffers. The serial output (SER OUT) is clocked out of the  
device on the falling edge of SRCK to provide additional hold time for cascaded applications. This will provide  
improved performance for applications where clock signals may be skewed, devices are not located near one  
another, or the system must tolerate electromagnetic interference.  
Outputs are low-side, open-drain DMOS transistors with output ratings of 50 V and a 350-mA continuous sink  
currentcapability. Whendataintheoutputbuffersislow, theDMOS-transistoroutputsareoff. Whendataishigh,  
the DMOS-transistor outputs have sink current capability.  
Separate power ground (PGND) and logic ground (LGND) terminals are provided to facilitate maximum system  
flexibility. All PGND terminals are internally connected, and each PGND terminal must be externally connected  
to the power system ground in order to minimize parasitic impedance. A single-point connection between LGND  
and PGND must be made externally in a manner that reduces crosstalk between the logic and load circuits.  
The TPIC6A596 is offered in a thermally-enhanced dual-in-line (NE) package and a wide-body surface-mount  
(DW) package. The TPIC6A596 is characterized for operation over the operating case temperature range of  
40°C to 125°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
logic symbol  
EN3  
C2  
G
RCK  
SRG8  
R
SRCLR  
SRCK  
C1  
1D  
DRAIN0  
DRAIN1  
DRAIN2  
DRAIN3  
DRAIN4  
DRAIN5  
DRAIN6  
DRAIN7  
SER OUT  
2
3
SER IN  
2
3
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
logic diagram (positive logic)  
G
DRAIN0  
RCK  
D
SER IN  
SRCK  
D
C2  
C1  
DRAIN1  
DRAIN2  
DRAIN3  
DRAIN4  
DRAIN5  
DRAIN6  
CLR  
CLR  
SRCLR  
D
D
C1  
CLR  
C2  
CLR  
D
D
C1  
CLR  
C2  
CLR  
D
D
C1  
CLR  
C2  
CLR  
D
D
C2  
C1  
CLR  
CLR  
D
D
C2  
C1  
CLR  
CLR  
D
D
C2  
C1  
CLR  
CLR  
D
D
DRAIN7  
PGND  
C1  
CLR  
C2  
CLR  
D
C1  
CLR  
SER OUT  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
schematic of inputs and outputs  
TYPICAL OF SERIAL OUT  
EQUIVALENT OF EACH INPUT  
TYPICAL OF ALL DRAIN OUTPUTS  
DRAIN  
V
CC  
V
CC  
Input  
25 V  
SER OUT  
12 V  
R
SENSE  
LGND  
LGND  
PGND  
LGND  
absolute maximum ratings over recommended operating case temperature range (unless  
otherwise noted)  
Logic supply voltage, V  
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
CC  
Logic input voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to 7 V  
Power DMOS drain-to-source voltage, V  
I
(see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V  
DS  
Continuous source-drain diode anode current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A  
Pulsed source-drain diode anode current (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 A  
Pulsed drain current, each output, all outputs on, I  
Continuous drain current, each output, all outputs on, I  
T = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . 1.1 A  
Dn,  
A
T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . 350 mA  
A
Dn,  
Peak drain current, single output, T = 25°C (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 A  
A
Single-pulse avalanche energy, E (see Figure 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 mJ  
AS  
Avalanche current, I (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 mA  
AS  
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
Operating case temperature range, T  
Operating virtual junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 150°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C to 125°C  
C
J
Storage temperature range, T  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values are with respect to LGND and PGND.  
2. Each power DMOS source is internally connected to PGND.  
3. Pulse duration 100 µs and duty cycle 2 %.  
4. DRAIN supply voltage = 15 V, starting junction temperature (T ) = 25°C, L = 210 mH, I  
= 600 mA (see Figure 6).  
AS  
JS  
DISSIPATION RATING TABLE  
T
25°C  
DERATING FACTOR  
T = 125°C  
C
POWER RATING  
C
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
C
DW  
NE  
1750 mW  
14 mW/°C  
20 mW/°C  
350 mW  
2500 mW  
500 mW  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
recommended operating conditions  
MIN  
MAX  
UNIT  
V
Logic supply voltage, V  
CC  
4.5  
5.5  
High-level input voltage, V  
IH  
0.85 V  
V
V
CC  
CC  
0.15 V  
Low-level input voltage, V  
IL  
Pulsed drain output current, T = 25°C, V  
0
1.8  
10  
V
CC  
= 5 V (see Notes 3 and 5)  
CC  
0.6  
A
C
Setup time, SER IN high before SRCK, t (see Figure 2)  
su  
Hold time, SER IN high after SRCK, t (see Figure 2)  
ns  
ns  
ns  
°C  
10  
h
Pulse duration, t (see Figure 2)  
20  
w
Operating case temperature, T  
40  
125  
C
NOTES: 3. Pulse duration 100 µs and duty cycle 2%.  
5. Technique should limit T – T to 10°C maximum.  
J
C
electrical characteristics, V  
= 5 V, T = 25°C (unless otherwise noted)  
C
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Drain-to-source  
breakdown voltage  
V
V
I
I
= 1 mA  
50  
V
(BR)DSX  
D
Source-to-drain diode  
forward voltage  
= 350 mA,  
See Note 3  
0.8  
CC  
1.1  
V
V
SD  
F
I
I
I
I
= 20 µA  
= 4 mA  
= 20 µA  
= 4 mA  
V
V
0.1  
0.5  
V
High-level output voltage,  
SER OUT  
OH  
OH  
OL  
OL  
CC  
V
OH  
OL  
V
0.2  
0
CC  
CC  
0.1  
0.5  
1
Low-level output voltage,  
SER OUT  
V
V
0.2  
I
I
High-level input current  
Low-level input current  
V = V  
CC  
µA  
µA  
IH  
I
V = 0  
–1  
IL  
I
Output current at which  
chopping starts  
I
I
I
T
= 25°C,  
See Note 5 and Figures 3 and 4  
0.6  
0.8  
0.5  
1.3  
1.1  
5
A
O(chop)  
CC  
C
Logic supply current  
I
f
= 0,  
V = V  
I
or 0  
mA  
mA  
O
CC  
Logic supply current at  
frequency  
= 5 MHz,  
I
V
= 0,  
C = 30 pF,  
L
SRCK  
O
CC(FRQ)  
V = V  
or 0,  
= 5 V, See Figure 7  
I
CC  
CC  
V
V
= 0.5 V,  
= 5 V,  
I
= I , T = 85°C,  
DS(on)  
(nom) D C  
I
Nominal current  
350  
mA  
(nom)  
D
See Notes 5, 6, and 7  
CC  
DS  
DS  
V
V
= 40 V,  
= 40 V,  
T
T
= 25°C  
0.1  
0.2  
1
1
5
C
C
I
Drain current, off-state  
µA  
= 125°C  
I
I
= 350 mA,  
= 350 mA,  
T
T
= 25°C  
1.5  
2.5  
Static drain-source  
on-state resistance  
D
C
C
See Notes 5 and 6 and  
Figures 10 and 11  
r
)
DS(on  
= 125°C  
1.7  
D
NOTES: 5. Technique should limit T – T to 10°C maximum.  
J
C
6. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.  
7. Nominal current is defined for a consistent comparison between devices from different sources. It is the current that produces a  
voltage drop of 0.5 V at T = 85°C.  
C
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
switching characteristics, V  
= 5 V, T = 25°C  
C
CC  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP MAX  
UNIT  
ns  
t
t
t
t
Propagation delay time, high-to-low-level output from G  
Propagation delay time, low-to-high-level output from G  
Rise time, drain output  
30  
125  
60  
PHL  
ns  
PLH  
C
= 30 pF,  
I = 350 mA,  
D
L
See Figures 1, 2, and 12  
ns  
r
f
Fall time, drain output  
30  
ns  
C
= 30 pF,  
I
I
= 350 mA,  
= 350 mA,  
L
D
t
f
Propagation delay time, SRCKto SEROUT  
20  
ns  
pd  
See Figure 2  
C
= 30 pF,  
L
D
Serial clock frequency  
10  
MHz  
(SRCK)  
See Note 8  
t
t
Reverse-recovery-current rise time  
Reverse-recovery time  
100  
300  
ns  
ns  
I
= 350 mA,  
di/dt = 20 A/µs,  
a
F
See Notes 5 and 6 and Figure 5  
rr  
NOTES: 5. Technique should limit T – T to 10°C maximum.  
J
C
6. These parameters are measured with voltage-sensing contacts separate from the current-carrying contacts.  
8. This is the maximum serial clock frequency assuming cascaded operation where serial data is passed from one stage to a second  
stage. The clock period allows for SRCK SEROUT propagation delay and setup time plus some timing margin.  
thermal resistance  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
10  
UNIT  
DW  
NE  
DW  
NE  
R
R
Thermal resistance, junction-to-case  
Thermal resistance, junction-to-ambient  
All eight outputs with equal power  
°C/W  
θJC  
θJA  
10  
50  
All eight outputs with equal power  
°C/W  
50  
PARAMETER MEASUREMENT INFORMATION  
5 V  
24 V  
7
6
5
4
3
2
1
0
5 V  
SRCK  
0 V  
5 V  
I
D
V
CC  
SRCLR  
SRCK  
G
R
= 68 Ω  
L
0 V  
5 V  
DUT  
Output  
SER IN  
Word  
Generator  
(see Note A)  
0 V  
5 V  
DRAIN  
SER IN  
RCK  
G
RCK  
C
= 30 pF  
L
0 V  
5 V  
(see Note B)  
SRCLR  
0 V  
LGND PGND  
24 V  
DRAIN 0, 1, 4, 5  
DRAIN 2, 3, 6, 7  
0.5 V  
24 V  
TEST CIRCUIT  
0.5 V  
VOLTAGE WAVEFORMS  
NOTES: A. The word generator has the following characteristics: t 10 ns, t 10 ns, t = 300 ns, pulsed repetition rate (PRR) = 5 kHz,  
r
f
w
Z
C
= 50 .  
O
L
B.  
includes probe and jig capacitance.  
Figure 1. Resistive Load Operation  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
PARAMETER MEASUREMENT INFORMATION  
5 V  
0 V  
G
50%  
50%  
t
PLH  
t
PHL  
24 V  
90%  
90%  
Output  
10%  
10%  
0.5 V  
t
t
f
r
5 V  
CC  
24 V  
SWITCHING TIMES  
5 V  
0 V  
I
D
V
50%  
SRCK  
SRCLR  
SRCK  
R
= 68 Ω  
L
t
su  
DUT  
Output  
Word  
t
h
Generator  
(see Note A)  
SER IN  
RCK  
DRAIN  
5 V  
0 V  
SER IN  
50%  
50%  
C
= 30 pF  
L
(see Note B)  
G
t
w
LGND PGND  
INPUT SETUP AND HOLD WAVEFORMS  
TEST CIRCUIT  
50%  
50%  
SRCK  
t
t
pd  
pd  
SER OUT  
50%  
50%  
SER OUT PROPAGATION DELAY WAVEFORM  
NOTES: A. The word generator has the following characteristics: t 10 ns, t 10 ns, t = 300 ns, pulsed repetition rate (PRR) = 5 kHz,  
r
f
w
Z
C
= 50 .  
O
L
B.  
includes probe and jig capacitance.  
Figure 2. Test Circuit, Switching Times, and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
PARAMETER MEASUREMENT INFORMATION  
OUTPUT CURRENT  
vs  
REGION 1 CURRENT WAVEFORM  
TIME FOR INCREASING LOAD RESISTANCE  
1.5  
I
OK  
1.25  
I
OK  
(see Notes A and B)  
1
0.75  
0.5  
0
t
t
t
t
t
1
1
2
1
2
0.25  
t
40 µs  
1
t
2.5 ms  
2
0
Region 2  
Region 1  
Time  
Time  
First output current pulses after turn-on in chopping mode with  
resistive load.  
NOTES: A. Figure 3 illustrates the output current characteristics of the device energizing a load having initially low, increasing resistance, e.g.,  
an incandescent lamp. In region 1, chopping occurs and the peak current is limited to I . In region 2, output current is continuous.  
OK  
The same characteristics occur in reverse order when the device energizes a load having an initially high, decreasing resistance.  
B. Region 1 duty cycle is approximately 2%.  
Figure 3. Chopping-Mode Characteristics  
OUTPUT CURRENT LIMIT  
vs  
CASE TEMPERATURE  
1.5  
V
CC  
= 5.5 V  
1.2  
0.9  
V
CC  
= 4.5 V  
0.6  
0.3  
0
– 50 – 25  
0
25  
50  
75 100 125 150  
T
C
– Case Temperature – °C  
Figure 4  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
PARAMETER MEASUREMENT INFORMATION  
TP K  
DRAIN  
0.35 A  
Circuit  
Under  
Test  
2500 µF  
250 V  
di/dt = 20 A/µs  
+
I
F
24 V  
L = 1 mH  
I
F
(see Note B)  
0
TP A  
25% of I  
RM  
t
2
t
1
t
3
Driver  
I
RM  
(see Note C)  
R
G
t
V
a
GG  
(see Note A)  
50 Ω  
t
rr  
CURRENT WAVEFORM  
double-pulse train is used to set I = 0.35 A, where t = 10 µs,  
TEST CIRCUIT  
NOTES: A. The V  
amplitude and R are adjusted for di/dt = 20 A/µs. A V  
GG  
GG  
= 7 µs, and t = 3 µs.  
G
F
1
t
2
3
B. The DRAIN terminal under test is connected to the TP K test point. All other terminals are connected together and connected to the  
TP A test point.  
C.  
I
= maximum recovery current  
RM  
Figure 5. Reverse-Recovery-Current Test Circuit and Waveforms of Source-Drain Diode  
5 V  
V
15 V  
t
w
t
I
av  
5 V  
0 V  
CC  
1 Ω  
SRCLR  
SRCK  
Input  
I
D
See Note B  
DUT  
= 600 mA  
210 mH  
AS  
SER IN  
RCK  
Word  
Generator  
(see Note A)  
I
D
V
DRAIN  
DS  
V
= 50 V MIN  
(BR)DSX  
G
LGND PGND  
V
DS  
SINGLE-PULSE AVALANCHE ENERGY TEST CIRCUIT  
VOLTAGE AND CURRENT WAVEFORMS  
Non JEDEC symbol for avalanche time.  
NOTES: A. The word generator has the following characteristics: t 10 ns, t 10 ns, Z = 50 .  
r
f
O
B. Input pulse duration, t , is increased until peak current I  
= 600 mA.  
w
AS  
Energy test level is defined as E  
AS  
= (I  
× V  
× t )/2 = 75 mJ.  
(BR)DSX av  
AS  
Figure 6. Single-Pulse Avalanche Energy Test Circuit and Waveforms  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
TYPICAL CHARACTERISTICS  
MAXIMUM CONTINUOUS  
DRAIN CURRENT OF EACH OUTPUT  
vs  
NUMBER OF OUTPUTS CONDUCTING  
SIMULTANEOUSLY  
SUPPLY CURRENT  
vs  
FREQUENCY  
0.7  
0.6  
0.5  
4
V
= 5 V  
V
CC  
= 5 V  
CC  
3.5  
3
T
JS  
= 40°C to 125°C  
T
A
= 25°C  
2.5  
2
0.4  
0.3  
T
= 100°C  
= 125°C  
A
1.5  
1
0.2  
0.1  
T
A
0.5  
0
0
0.1  
1
10  
100  
1
2
3
4
5
6
7
8
N – Number of Outputs Conducting Simultaneously  
f – Frequency – MHz  
Figure 7  
Figure 8  
MAXIMUM PEAK DRAIN CURRENT OF EACH OUTPUT  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
vs  
vs  
NUMBER OF OUTPUTS CONDUCTING  
SIMULTANEOUSLY  
DRAIN CURRENT  
2
0.9  
0.8  
V
= 5 V  
CC  
See Note A  
1.75  
1.5  
1.25  
1
d = 50%  
d = 20%  
T
T
= 125°C  
= 25°C  
C
0.7  
0.6  
Current Limit  
C
0.5  
0.4  
0.3  
0.2  
0.1  
d = 80%  
0.75  
0.5  
T
C
= – 40°C  
V
T
A
= 5 V  
CC  
= 25°C  
0.25  
0
d = t /t  
w period  
d = 1 ms/t  
period  
3
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1
2
4
5
6
7
8
I
D
– Drain Current – A  
N – Number of Outputs Conducting Simultaneously  
NOTE A: Technique should limit T – T to 10°C maximum.  
J
C
Figure 9  
Figure 10  
10  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
TYPICAL CHARACTERISTICS  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
SWITCHING TIME  
vs  
CASE TEMPERATURE  
vs  
LOGIC SUPPLY VOLTAGE  
2
140  
120  
100  
80  
I
= 350 mA  
D
See Note A  
1.75  
1.5  
t
T
= 125°C  
= 25°C  
PLH  
C
1.25  
1
T
C
t
0.75  
r
60  
T
C
= 40°C  
0.5  
0.25  
0
t
PHL  
40  
20  
I
= 350 mA  
D
See Note A  
t
f
– 50  
0
T
50  
100  
150  
4
5
6
7
– Case Temperature – °C  
V
CC  
– Logic Supply Voltage – V  
C
Figure 11  
Figure 12  
NOTE A: Technique should limit T – T to 10°C maximum.  
J
C
TYPICAL R  
THERMAL RESISTANCE  
vs  
θJA  
ON BOARD HEATSINK AREA  
110  
100  
90  
80  
70  
DW Package  
PC Board  
Copper Area  
1oz Copper  
60  
50  
NE Package  
40  
30  
0
1
2
3
4
5
6
7
8
9
10  
2
Copper Heatsink Area – cm  
Figure 13  
11  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
TPIC6A596  
POWER LOGIC 8-BIT SHIFT REGISTER  
SLIS094 – MARCH 2000  
THERMAL INFORMATION  
NE PACKAGE  
TRANSIENT THERMAL IMPEDANCE  
The single-pulse curve represents measured data. The  
curves for various pulse durations are based on the  
following equation:  
vs  
ON TIME  
100  
10  
1
t
t
t
w
w
Z
R
1 –  
Z
t
t
c
w
JA  
JA  
t
c
c
d = 50%  
Z
t
–Z  
t
w
c
Where:  
d = 20%  
d = 10%  
= the single-pulse thermal impedance  
for t = t seconds  
Z
t
w
w
d = 5%  
Z
t
= the single-pulse thermal impedance  
for t = t seconds  
c
c
Z
t
t
c
= the single-pulse thermal impedance  
for t = t + t seconds  
w
w
c
d = 2%  
d = t /t  
w c  
t
c
Single Pulse  
t
w
I
D
0.1  
0.001 0.01  
0.1  
1
10  
100  
1000  
0
t – On Time – s  
Figure 14  
12  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
Customers are responsible for their applications using TI components.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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