TPIC84125-Q1 [TI]
LOW-FREQUENCY ANTENNA DRIVER FOR PASSIVE START AND PASSIVE ENTRY; 低频天线驱动器进行被动启动和被动进入
| 型号： | TPIC84125-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-FREQUENCY ANTENNA DRIVER FOR PASSIVE START AND PASSIVE ENTRY |
| 文件： | 总29页 (文件大小：839K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPIC84134-Q1
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SLDS176 –AUGUST 2010
LOW-FREQUENCY ANTENNA DRIVER
FOR PASSIVE START AND PASSIVE ENTRY
Check for Samples: TPIC84134-Q1
1
FEATURES
•
Output Stage Consists of Eight Programmable
Half-Bridge MOSFET Drivers (Configurable in
Half, Full, or Parallel Bridges) Which Deliver
Modulated Current to Each Coil
•
Divider Block Generates an Internal Frequency
From the Input Clock (Main Controller); Used
for the Internal Logic
•
•
•
Sophisticated Failure Detection and Handling
HTSSOP (PWP) 28-Pin Package
•
Linear Mode Output: Generates a Sine Wave
Voltage That is Controlled by the
Microcontroller
Operating Temperature Range:
-40°C to +105°C
•
•
•
Output Stage is Overload Protected for Short
and Over Temperature
APPLICATIONS
•
Driver Control and Diagnosis Blocks Drive the
Gates of the MOSFETS Via Data From the SPI
Automotive Passive Start and Passive Entry
Applications
Antenna Diagnostics: Short to GND, Short to
VBAT, And Open Load Via Current
Measurement
DESCRIPTION
The low-frequency (LF) antenna driver is dedicated to automotive applications requiring passive entry or passive
start operational control. It allows for up to eight dedicated drivers, consisting of MOSFET transistors. The device
also incorporates sophisticated diagnosis, protection and monitoring features.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPIC84134-Q1
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VS/2
VS
Sine Wave
Generation
Gains
Out1
MUX
Clock
Divider
Out1
CLK_IN
VA
VD
Power
Management
Current
Measurement
(ADC)
Out2
Out2
RBIAS
Out3
Out3
Out4
Out5
Out6
Out7
Out8
SDO
SDI
Out4
Out5
Out6
Out7
Out8
SPI
Control Logic
SCLK
NCS
GND
PGND
Figure 1. Block Diagram
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–40°C to 105°C
HTSSOP – PWP Reel of 2000
TPIC84134TPWPRQ1
TPIC84000TPWPRQ1
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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PWP PACKAGE
(TOP VIEW)
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VS/2
AT1
VS
2
Out1
Out2
PGND
Out3
Out4
VS
3
AT2
4
Test
5
VA
6
RBIAS
Exposed
Thermal
Pad
7
GND
GND
VD
8
VS
9
Out5
Out6
PGND
Out7
Out8
VS
10
11
12
13
14
CLK_IN
SDO
SDI
SCLK
NCS
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TERMINAL FUNCTIONS
NAME
VS/2
AT1
NO.
1
I/O
O
O
O
I
DESCRIPTION
VS/2 decoupling point. (Requires a 100nF, 10%, ESR < 50mΩ capacitor)
2
Internal use, connect to ground
Internal use, connect to ground
Internal use, connect to ground
Analog 5V supply
Current reference resistor (requires a 62kΩ, 1%, 50ppm resistor)
Analog ground
AT2
3
Test
4
VA
5
I
RBIAS
GND
GND
VD
6
O
-
7
8
-
Digital ground
9
I
Digital 5V supply
Input clock signal
Serial data out for SPI
Serial data in for SPI
Serial clock for SPI
Chip select for SPI (active low)
Supply voltage
CLK_IN
SDO
SDI
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
I
O
I
SCLK
NCS
VS
I
I
I
Out8
Out7
Pgnd
Out6
Out5
VS
O
O
-
Output 8
Output 7
Power ground
O
O
I
Output 6
Output 5
Supply voltage
VS
I
Supply voltage
Out4
Out3
Pgnd
Out2
Out1
VS
O
O
-
Output 4
Output 3
Power ground
O
O
I
Output 2
Output 1
Supply voltage
Thermal Pad
-
Must be connected to ground
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DEVICE INFORMATION
The TPIC84134 is designed to control Passive Entry, Passive Start (PEPS) systems as a part of the central body
control module. Functionally, the TPIC84134 transmits a magnetic field signal via antenna coils located
throughout the vehicle. The data is transmitted using amplitude shift keying (ASK). Such a signal is received by
an external RFID card or key, which then activates the card or key to then process and send an authenticating
signal back to the vehicle, thus authenticating the driver. Once authenticated, the driver is able to open doors or
start the vehicle depending on the systems specific configuration. In general, the antenna load of the TPIC84134
is a coil, which generates a magnetic field which is high enough to transmit data to the ID card, and accurate
enough for location recognition outside of the vehicle.
Functional Description
Power Management
The TPIC84134 operates with three types of supply voltage: Digital 5V (VD), Analog 5V (VA ), and Power (VS).
While VD is used for the internal digital circuitry and VA voltage determines:
•
•
•
The accuracy of the output voltage in data and destroy modes, because the sine wave signal is derived from
the VA voltage.
The accuracy of the current measurements, because the Current Measurement (ADC) reference voltage is
derived from the VA voltage.
The supply currents for the IC, as the bias current is derived from the VA voltage.
NOTE
VD and VA must be tied together to avoid latch up.
VS must be powered on all VS pins regardless of which outputs are used.
Biasing: Biasing of the circuit is done by an external resistor, RBIAS = 62kΩ, 1%, 50ppm. The value of the RBIAS
resistance determines:
•
The accuracy of the current measurements, because the ADC reference voltage is proportional to the VA
voltage divided by the value of RBIAS
The supply currents for the IC, as the biasing current is proportional to the VA voltage divided by the value of
RBIAS
.
•
.
Clock Divider
The Clock Divider generates a 2.1472 MHz internal clock signal from the external clock. The internal clock
frequency is used for:
•
•
Clearing and latching the fault bits within Control and Status Register (CSR).
For generating the frequency of the sine wave
The divider can be programmed to either: /1, /2, /4, /8, with the default being /8. Table 1 shows the possible
CLK_IN input frequencies to generate 134.2 kHz signal.
Table 1. Clock Divider
Divider
CLK_IN
/1
2.1472 MHz
4.2944 MHz
8.5888 MHz
17.1776 MHz
/2
/4
/8 (default)
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To function properly the following conditions must be satisfied:
•
The incoming clock (CLK_IN) has to be provided for at least 4 cycles of the internal clock after writing to
Configuration register via SPI
•
In the case of a wake up command (i.e. sleep bit = 0 in the Config Reg), CLK_IN has to be provided during
124 additional cycles of the internal clock for fault blanking after writing the Config Register. During that time:
–
–
Data1 buffer cannot be written to if sending mode bit in Config Reg is set to 1 (autosend mode).
SPI command "Start Transmission" cannot be programmed
•
In the case of CSR read and if a fault is cleared then, CLK_IN also has to be provided during a total of 128
clock cycles for the same reason of fault blanking.
CLK_IN electrical levels:
•
•
When the CLK_IN is OFF, the electrical level should be high (typically 5V)
The clock should be turned OFF after a low to high transition of CLK_IN
Sine Wave Generation
The sine wave generation block generates the 134.2 kHz sine wave from the internal clock. This sine wave is
used to generate the carrier frequency which is used for transmitting the signal as well as Destroy bits.
Note that the Destroy bits consist of bringing the selected channel to VS/2, transmitting a small number of bits
(1-4 programmable through SPI) at a reduced peak-to-peak voltage, then the channel is grounded again (HS off,
LS on). The purpose of the destroy bits is to actively stop any unwanted transmission signal that may be present
on the antenna due to coupling from the transmitting antenna.
For example, Figure 2 shows the first 6 Transmitted Bits (3 Manchester Bits) of a telegram together with three
destroy bits on the non-active outputs. The counter for start of destroy bits is set to 3, and it starts counting down
at the beginning of the transmission telegram denoted by "start" in the below diagram.
4.2 kBaud (Manchester encoded "100")
( V )
Data
VS
0
1
1
0
1
0
Out 1
VS/2
0
VS
Out 2
VS/2
0
Time
(µs)
Start
119
239
358
478
597
717
Figure 2. Transmitted Telegram Sample With Destroy Bits
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Gains
Gain1 is a programmable gain for the output antenna working in normal mode to control the transmission power.
Gain2 allows the user to change the gain of the transmitted telegram for a programmable number of data bits
after which the telegram is continued in gain1. The time at which gain2 begins is programmable in the CSR;
alternatively, if the length of bits sent in gain2 is zero (0) the entire telegram is transmitted in gain1. Note, these
gains are not cascaded; it is either Gain1 or Gain2.
Gain for destroy bit transmission dictates the gain for the output channels set to "destroy bits". The gain for
destroy bits is a logarithmic scale and it is set to 500 mVpp by default.
Figure 3 shows an example in which Out1 is configured to transmit the telegram, using both Gain1 and Gain2.
The counter for start of transmission with Gain2 = 2 Bytes, and the counter for transmission in gain2 = 16 bits.
Note that the transmission resumes at Gain1 after the transmission at Gain2. The diagram also displays Out2
with destroy bits where counter for start of destroy bits = 8 bits, and Length of destroy = 4 bits.
Counter for start of
transmission with Gain 2:
Counter for transmission
2 Bytes
( V )
in Gain 2:
16 bits
VS
VS/2
0
Out1
Counter for start
:
of destroy bits
8 bits
VS
Length of
destroy bits :
4 bits
Out2
VS /2
0
Transmitted
Data (Bits)
Start
8
16
32
56
Figure 3. Transmitted Telegram Sample Gain1 And Gain2
Multiplexer (Mux)
A multiplexer is used to pick between the various gains of the signal to each output, as well as selecting the
phase ( 0° or 180°) of the transmitting antennas.
A maximum of two outputs, or 2 half-bridges, can be activated at the same time in normal mode, where each is
designed to drive the required power into the antenna. Further, all other outputs can also be activated with
destroy bits at the same time(at a lower Vpp). As the bridges operate in a linear mode, the sine wave generation
at the bridge output is optimized to reduce EMI emissions and power dissipation.
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Current Measurement
From a system's point of view, diagnostics of the antenna operation is done by measuring the load current
across the antenna and providing the measured value to the microcontroller via SPI. The microcontroller
retrieves the current value and evaluates if there is a failure or not. Within the TPIC84134 the current
measurement is done at each Low Side-transistor (LS), though the measurement of the various currents is done
sequentially (i.e. first LS1 measurement followed by the LS2 measurement, etc.). The actual measured analog
values are converted into five bit resolution digital values and are then stored in the control and status register.
As the load current can take between 2 to 10 wave-forms to reach its maximum value; current measurement can
depend on the actual application and the specific Q-factor of the antenna circuit. Therefore it is necessary to
program the exact time when the current measurement must be performed, and it is also necessary to measure
at the specific time within the wave to measure the maximum value.
A programmed parameter indicates which outputs are measured, where the low side of the programmed output
is measured sequentially. Here the edge (rising or falling) is also programmed, where during the odd (1st, 3rd,
5th, etc) rising or falling edge, the current on the low side of the first programmed output is measured; during the
even (2nd, 4th, 6th, etc) rising or falling edge, the current in the low side of the second programmed output is
measured. The measurement is performed continuously and the current value updated (over written) every time
within the Control and Status register.
Figure 4 shows an example of current measurement in a full-bridge configuration. In order to diagnose the
operation of the device in full-bridge, it is necessary to measure the current of LS1 and LS2. The two measured
values are stored in the Control and Status register.
Odd rising edge
Even rising edge
I_Antenna
I_LS2
I_LS1
LS2 measurement at second rising edge
(Timer2 programmed to 68: 31.902 µs)
LS1 measurement at first rising edge
(Timer1 programmed to 76: 35.627 µs)
Time
(µs)
0
7.5 14.9 22.4 29.8 37.3
0
7.5 14.9 22.4 29.8 37.3
Figure 4. Current Measurement Timing For Full Bridge Setup
Control Logic
The control logic block contains the SPI interface along with all the other circuitry necessary to convert the SPI
commands into the desired outputs.
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Operation Modes
There are two operating modes: SLEEP mode and WAKE-UP mode.
In WAKE-UP mode, the device is either ready for the next transmission, or it is transmitting data. The wake-up
command and the output configuration command are separated to avoid noise on the VS/2 signal at wake up.
Note that the start command must happen at least 128 clock cycles after the wake-up command. The device
transitions from the WAKE-UP mode to the SLEEP mode when the following conditions occur:
•
•
•
The Sleep bit in Configuration Register is set to 1 via SPI
or
An over temperature fault condition is detected
or
VS or VD under voltage is detected
In SLEEP mode, the sine wave generation block is off, the outputs are in tri-state, the SPI is functioning, but the
flags are not updated. The device goes from SLEEP mode to WAKE-UP mode when the following conditions
occur:
•
The Sleep bit is set to 0 via the SPI
or
•
The Sleep bit is set to 0 via the SPI and the CSR is read in case of an over temperature detection or VS
under voltage
NOTE
When operating in the tri-state mode, there is a pull down of typically 150 kΩ at the Outx
pins.
Diagnosis
As a function of protecting the TPIC84134 various diagnostic features such as over temperature warning, over
temperature pre-warning and energy limiting protection have been implemented. Flags within a register are used
to highlight a particular fault, or diagnosis, to the main controller, where each fault is essentially latched within the
register until it is read by SPI interface. After having been read by the SPI, the register is then cleared. This
protection scheme is implemented within the TPIC84134 itself, as follows:
Over Temperature
When over-temperature occurs while the device is operating in WAKE-UP mode; where upon over temperature
the device goes to SLEEP mode and the "over temperature" and "failure" flags are set to 1 in the CSR.
If the device is in SLEEP mode, it stays in this mode but no SPI flag is updated.
Temperature Pre-Warning
Temperature pre-warning has no impact on the operating mode of the device. If the device is in WAKE-UP
mode, the "temperature pre-warning" flag is set to 1 in the CSR; if the device is in SLEEP mode, no SPI flag is
updated.
Under Voltage
•
VS under voltage: Occurs when VS goes below the VS under voltage threshold
–
If the device is in WAKE-UP mode, it goes to SLEEP mode and the "under voltage at VS" and "failure"
flags are set to 1 in the CSR.
–
If the device is in SLEEP mode, it stays in this mode but no SPI flag is updated.
•
VD under voltage: Occurs when VD goes below the VD under voltage
–
If the device is in WAKE-UP mode, it goes to SLEEP mode and the "under voltage at VD" and "failure"
flags are set to 1 in the CSR.
–
If the device is in SLEEP mode, it stays in this mode but no SPI flag is updated.
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IFAULT Flag: Energy Limiting Scheme
Two types of output device energy limiting schemes are used:
1. Detection of DC currents flowing in the output transistors
In normal operation, with an AC coupled load, continuous DC currents of greater than several mA will not
flow in the output transistors. If a current greater than 150mA (nominal) flows in either output transistor for a
duration greater than 4ms then the IFAULT condition will be activated and that channel will be placed in
tri-state. The exact time before the IFAULT is activated is a function of the voltage across the transistor
conducting >150mA load current. Larger voltages across this transistor will cause the deglitch time to be
shorter. With VS = 38V and with the output at VS/2 the minimum deglitch time is 4ms. The deglitch timer is
reset when the current level falls below 150mA.
2. Detection of excess bi-directional peak currents flowing in the output transistors
If a current greater than 0.9A flows in both output transistors when the sine wave signal is driven through the
output transistors, then the IFAULT condition will be activated and that channel will be placed in tri-state. The
IFAULT condition is activated when both high side and low side transistors have conducted >0.9A at any
time during the sine wave burst. The IFAULT signal will be activated immediately when the second output
transistor current exceeds 0.9A. The high side and low side detectors are reset during the transmission of a
"0" bit.
IFAULT has no impact on the operating mode.
•
If the device is in WAKE-UP mode, the "IFAULT" and "failure" flags are set to 1 in the CSR and the channel
which has failed is put in tri-state.
•
If the device is in SLEEP mode, no SPI flag is updated. However the data buffer will continue to be read out
until software stops the data buffer read by sending new Configuration data.
SPI Interface
A Serial Peripheral Interface (SPI) circuit is integrated into the device to set various internal registers and read
out current measurement and status information from the drivers. TPIC84134 operates in slave mode and the
microcontroller always acts as a master. The interface to the external micro-controller consists of 4 pins: NCS,
SCLK, SDO and SDI.
SPI Frame Structure
Each SPI communication frame for the TPIC84134 has a length of 64 bits, where it is forbidden to send more
than 64 bits. Each 64bit frame consists of 8 command-bits and 56-data-bits. The format of the 64 bits entering at
SDI and sent out at SDO is shown in Figure 5:
Figure 5. SPI Frame Structure
The MSB is the first "in" at the SDI and first "out" at the SDO, where the command sent out on SDO is the
command that was sent in the SDI's previous cycle
When NCS is high, any signals at the SCLK and SDI pins are ignored, and the SDO is forced into a high
impedance state.
During a High to Low transition on NCS, the SPI response word is loaded into a shift register, where the SCLK
pin must be low when NCS goes low.
At each rising edge of SCLK after NCS goes low, the response bit is serially shifted out on the SDO pin. Further,
the Control and Status register has to be cleared after readout at next NCS falling edge.
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At each falling edge of SCLK (after NCS goes low), a new control bit is serially shifted in from the SDI pin. The
SPI command is decoded to determine the destination address for the associated data. After a complete frame is
received, during the next low to high transition on NCS, the SPI shift register data is transferred into the internal
memory at the last decoded address.
Bit63
Bit62
Bit61
Bit60
Bit2
Bit1
Bit0
NCS
SCLK
SDO
SDI
R63
D63
R62
D62
R61
D61
R60
D60
R2
D2
R1
D1
R0
D0
Figure 6. SPI Protocol
Each SPI register in TPIC84134 has a length of 56 bits. The device has two registers for data transmission, one
configuration register and one control and status register (CSR).
Buffers for Data Transmission
The TPIC84134 has two buffers for data transmission with a size of 56 bits each, thus a maximum of 112bits can
be stored. After transmission begins, in order for the telegram to be endless, the buffers must be reloaded
continuously. The inactive buffer can be reloaded while the TPIC84134 is transmitting from the active buffer, and
the active buffer cannot be reloaded during transmission.
SPI Command Structure
The encoding of the specific SPI commands is based on, and specifically limited within the SPI shift register, to
64bits. Table 2 highlights the required basic commands to be sent via SPI. The encoding is optimized to reduce
the size of the digital part and to fulfill the application software preferences. One command and its associated
data are sent in the same frame. Any un-specified command or frame received by TPIC84134 will take the
device into an undefined state.
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Basic Commands and Data Structure
Table 2. Commands
COMMAND
MSB....LSB
COMMAND DESCRIPTION
DATA SENT ON SDO AT NEXT FALLING EDGE OF NCS
0xxx xxxx
Read back the programmed register.
Programmed register will be loaded into SPI register at next
falling edge of NCS.
Programmed register
1xxx xxxx
Request control and status register.
The control and status register will be loaded into SPI
register at next falling edge of NCS.
Control and status register
Control and status register
All bits '0'
1000 xxxx
x110 xxxx
x111 xxxx
No operation only feedback. Data bits are unused. The
control and status register will be loaded into SPI register at
next falling edge of NCS.
0000 xxxx
x001 xxxx
No operation only feedback.
Program configuration register. Data bits contain data for
configuration register.
Programmed register or control and status register
depending on MSB
x010 xxxx
x011 xxxx
x100 xxxx
x101 xxxx
Program control and status register. Data bits contain data Control and status register whatever is the MSB
for control and status register.
Program data buffer1. Data bits contain data for buffer1.
Programmed register or control and status register
depending to MSB
Program data buffer2. Data bits contain data for buffer2.
Programmed register or control and status register
depending to MSB
Start transmission. Data bits are unused. (When not in
automode)
Control and status register
The command that is sent out on SDO is the command that was sent on SDI at the previous cycle. The fifth MSB
bit is a failure bit which is set to '1' by the device when one of the following failures occurs: over temperature,
temperature pre-warning, under voltage at VS or VD, output over-current. Default is '0' for this bit then value is
latched until is read by SPI. This bit is the same as bit 18 in Control and Status register.
Figure 7. Format for 64 Bits Returned on SDO
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Register Definitions
Table 3. Register Definitions
NO. OF
BITS
DEFAULT VALUE
MODE
R/W
NAME
DESCRIPTION
AT POR
0........0
0...............0
SPI register
64
8 bit command 56 bit data
R/W
Data buffer 1
Data buffer 2
56
56
56 bit data
56 bit data
0...............0
0...............0
R/W
R/W
Configuration register
00 = no division
01 = division by 2
10 = division by 4
11 = division by 8
clock division
baud rate
output 1
2
1
2
Division by 8
1
R/W
R/W
R/W
0 = 8.37 kHz Baud
1 = 16.75 kHz Baud
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
output 2
output 3
output 4
output 5
output 6
output 7
output 8
2
2
2
2
2
2
2
R/W
R/W
R/W
R/W
R/W
R/W
R/W
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00 = LowSide "ON" – HighSide "OFF"
01 = transmit data with 180° phase
10 = transmit data with 0° phase
11 = transmit destroy bits
LowSide "ON"
HighSide "OFF"
00000 = 1Vpp
00001 = 2Vpp
…
11111 = 32Vpp
n = (n+1)Vpp
Gain1 for data transmission
Gain2 for data transmission
5
28Vpp (11011)
R/W
00000 = 1Vpp
…
11111 = 32Vpp
n = (n+1)Vpp
5
4
14Vpp (01101)
R/W
R/W
0000 = 32/(2^15) Vpp
0001 = 32/(2^14) Vpp
…
gain for destroy-bit
transmission
32/(2^6) Vpp (1001)
1111 = 32 Vpp
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Table 3. Register Definitions (continued)
NO. OF
BITS
DEFAULT VALUE
AT POR
MODE
R/W
NAME
DESCRIPTION
00 0000
counter for start of
transmission with gain2
…
6
00 0000
R/W
11 1111 = after 63 data bytes
after x bytes the transmission will be sent with gain 2
000 0000 = 0 bit
…
1111111 = 127 bit
counter for bits transmitted
with gain2
7
6
2
000 0000
000 010
1 bit
R/W
R/W
R/W
After x normal bits, destroy bits will be transmitted. Values
'000 000' and '000 001' are not allowed. If they are
programmed, this will give '000 010'.
counter for start of transmit
destroy bits
00 = 1 bit
…
length of destroy bit
11 = 4 bit
0 = wait for trigger command via SPI
1 = start transmission as soon as buffer1 has received the
full 56 bits
selection of sending mode
1
1
1
1
R/W
R/W
0 = wake-up mode
1= sleep mode (outputs are tri-state during this mode)
Sleep bit
Control and Status Register
time from 699ns to 237.75µs after selected edge (rising or
falling) 1st, 3rd ,5th ...
00...000: not used
00..001: 699 ns
00..010: 1164 ns
00..011: 1630 ns
…
timer1 for current
measurement 1
9
1
9
00..001
R/W
R/W
R/W
11..101: 232.63 µs
11..110: 237.75 µs
11..111: not used
Timer (ns) = 232.86 ns + Bit data * 465.7228 ns(1)(2)
Bit must be set to "1" by the microcontroller to ensure
accurate current measurement
Must be set to "1" by micro
0
time from 699ns to 237.75µs after selected edge (rising or
falling) 1st, 3rd ,5th ...
00...000: not used
00..001: 699 ns
00..010: 1164 ns
00..011: 1630 ns
timer2 for current
measurement 2
00..001
…
11..101: 232.63 µs
11..110: 237.75 µs
11..111: not used
Timer (ns) = 232.86 ns + Bit data * 465.7228 ns(3)(4)
Bit must be set to "1" by microcontroller to ensure accurate
current measurement
Must be set to "1" by micro
trigger for measurement1
1
1
0
R/W
R/W
0 = measurement is done at 1st, 3rd ,5th ... rising edge of
Data_bit
1 = measurement is done at 1st , 3rd,5th... falling edge of
Data_bit
rising edge of Data_bit
0 = measurement is done at 2nd , 4th,6th... rising edge of
Data_bit
trigger for measurement2
1
3
rising edge of Data_bit
R/W
R/W
1 = measurement is done at 2nd , 4th,6th... falling edge of
Data_bit
000 = output 1 selected
001 = output 2 selected
010 = output 3 selected
011 = output 4 selected
…
selected output for
measurement1
0
(1) The programmed value must not exceed the duration of one bit at the chosen baud rate.
(2) The programmed value can not be max value.
(3) The programmed value must not exceed the duration of one bit at the chosen baud rate.
(4) The programmed value can not be max value.
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Table 3. Register Definitions (continued)
NO. OF
BITS
DEFAULT VALUE
MODE
R/W
NAME
DESCRIPTION
AT POR
000 = output 1 selected
001 = output 2 selected
010 = output 3 selected
011 = output 4 selected
…
selected output for
measurement2
3
1
R/W
unused
2
2
Bits unused
-
0x = ready for next transmission
10 = busy – transmitting data 1
11 = busy – transmitting data 2
additional there is the sleep
mode
mode of device
R
0 = wake-up mode
1= sleep mode (outputs are tri-state during this mode)
Sleep status
1
1
1
R
R
Default is '0' then value is
latched until it is read by
SPI
0 = below pre-warning temperature
1 = above pre-warning temperature
temperature pre-warning
Default is '0' then value is
latched until it is read by
SPI
0 = no over-temperature
1 = over-temperature
over-temperature
under voltage at VD
under voltage at VS
failure
1
1
1
1
R
R
R
R
Default is '0' then value is
latched until it is read by
SPI
0 = normal supply voltage at VD
1 = under voltage at VD
Default is '0' then value is
latched until it is read by
SPI
0 = normal supply voltage at VS
1 = under voltage at VS
0 = no failure
Default is '0' then value is
latched until it is read by
SPI
1 = one of the following failures: over-temperature, under
voltage at VS, or VD output over-current.
0000 0001 = over-current on output 1
0000 0010 = over-current on output 2
0000 0011 = over-current on outputs 1 and 2
0000 0100 = over-current on output 3
…
Default is '0000 0000' then
value is latched until it is
read by SPI
output over-current
8
R
Default is '0 0000' then
value is latched until new
measurement is done
current value 1
current value 2
5
5
measured current at one active output
measured current at other active output
R
R
Default is '0 0000' then
value is latched until new
measurement is done
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Table 4. Typical Sequence of Commands
1.)
SPI Frame:
0001 xxxx
Program configuration register for wake up (outputs configured: High Side OFF – Low Side
ON)
SDO: Returns programmed register (config. Reg. in this case) Note 1.
Program configuration register for output configuration
SDO: Returns programmed register (config. Reg. in this case)
Program data1
2.)
3.)
4.)
5.)
6.)
7.)
8.)
9.)
10.)
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
SPI Frame:
0001 xxxx
0011 xxxx
0100 xxxx
*000 xxxx
1010 xxxx
1101 xxxx
1010 xxxx
*000 xxx
SDO: Returns configuration data programmed in previous frame
Program data2
SDO: Returns data1 programmed in previous frame
No command
SDO: Returns data2 programmed in previous frame
Program triggers & timers for current measurement for diagnosis
SDO: Returns Config. Reg. or CSR (depending on MSB in last frame)
Start transmission
SDO: Returns CSR (Control and Status register)
Re-program triggers & timers for new current measurement for diagnostics
SDO: Returns updated CSR (Control and Status register)
No command
SDO: Returns Config. Reg. or CSR (depending on MSB in last frame)
Program config. Reg. for Sleep mode
*001 xxx
SDO: Returns Config. Reg. or CSR (depending on MSB in last frame)
SPI Registers
Before being programmed, at POR, the TPIC84134 is in the default configuration. The default mode is sleep
mode and waiting for NCS. After POR, the SPI register (8bits command, 56bits data) is all "0". When it is in sleep
mode, the device will wake up when a "0" is programmed to "sleep bit" in configuration register. At wake up, the
registers remain with the same content as before standby. The wake-up command and the output configuration
command are separated to avoid noise on VS/2 signal at wake-up. The start command must happen at least 64
µs after the wake-up command. For transmission of LF on outputs, the MSB which is the first bit in the data
buffer is first out on LF driver.
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APPLICATION OVERVIEW
Typical Application Circuit
C1
0.1uF, 0805, 100V, 10%, X7R, ESR<50mOhm
U1
VS2_decoup
Vs
R2
R3
2
1
1
2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
GND
VS
Out1
Out2
PGND
Out3
Out4
VS
Out1
Out2
L_ant
C_ant
AT1
3
GND
AT2
5V
4
Test
5
Out3
Out4
VA
62k, 0805, 1/10W, .5%, 25ppm
6
Rbias
AGND
DGND
VD
R1
7
GND
Vs
5V
8
VS
9
Out5
Out6
R4
Out5
Out6
PGND
Out7
Out8
VS
CLK_IN
SDO
10
11
12
13
14
CLK_IN
SDO
SDI
L_ant
SDI
Out7
Out8
SCLK
NCS
SCLK
NCS
Vs
C_ant
GND
GND
GND
NOTE: Analog ground, digital ground, power ground, as well as the power pad must be connected together with a low
impedance path.
Figure 8. Typical Application Circuit
Necessary External Components
VS/2: Pin 1 requires a 100nF capacitor with at least 10% tolerance or better, and ESR (equivalent series
resistance) of less than 50mΩ.
RBIAS: Pin 6 requires a 62kΩ, 1% or better tolerance, 50ppm or better temperature coefficient.
Output Channels
The output channels require current limiting resistors to insure the source/sink current of the outputs does not
exceed the minimum AC current detection threshold of 0.9 A. Besides current limiting, these resistors affect the
Q-factor of the antenna. The output channels require 3V headroom at each rail to avoid clipping. Therefore, for
an output signal of 24 Vpp, VS must be at least 30V.
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MAX UNIT
ABSOLUTE MAXIMUM RATINGS(1)
MIN
-0.3
-0.3
Supply
VS
Vbat or Vstep-up
42
1.3
7
V
A
V
V
I_VS
Current on one VS pin
VDD
Ground offset
VS_RAMP
Ground offset from PGND to AGND or DGND
VS ramp up rate
0.15
0.5 V/µs
Antenna driver outputs
V_Outx
-0.3
-0.6
VS + 0.3
V
A
A
I_Outx_source/sink Sourcing/sinking current at HS, LS ON
Current limit implemented; see
parametric section
3
I_Outx_reverse
Digital
Reverse current at HS, LS OFF
0.6
V_digital
I_digital
Voltage on digital pins: CS, SDI, SCLK, CLK_IN
Current on digital pins: CS, SDI, SCLK, CLK_IN
Voltage necessary to clamp ±20mA
-0.3 VDD + 0.3
V
-20
20
mA
Power dissipation
TA
Ambient temperature
-40
105
205
°C
°C
ThSD
Over-temperature detection and shutdown
150
Electrostatic Discharge (ESD)
HBM
CDM
MM
Human Body Model
2000
1500
50
V
V
V
Charge Device Model
Machine Model
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
PWP
THERMAL METRIC(1)
UNIT
28 PINS
34.5
25.9
14.2
3.6
qJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
qJC(TOP)
qJB
Junction-to-case(top) thermal resistance
Junction-to-board thermal resistance
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(bottom) thermal resistance
ΨJB
10.2
1.3
qJC(BOTTOM)
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
7
MAX UNIT
VS
VD
TA
Supply voltage
38
5.25
105
V
V
Digital supply voltage
Ambient free-air temperature
4.75
-40
°C
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DIGITAL ELECTRICAL CHARACTERISTICS
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
Low input level
TEST CONDITIONS
MIN
-0.3
2
TYP
MAX UNIT
VIL
0.8
V
V
V
VIH
High input level
VDD + 0.3
VIHYS
IILEAKAGE
Input hysteresis
0.2
Input leakage current on SDI, SCLK pins
VIN = VD
-5
5
5
mA
mA
mA
VIN = GND
VIN = VD
-5
IILEAKAGE
Input leakage current on TEST pin (internal
pulldown resistor)
23.75
- 5
105
5
VIN = GND
VIN = VD
IILEAKAGE
Input leakage current on NCS, CLK_IN pins
-5
5
VIN = GND
-105
50
-23.75
200
RIPU
Input pullup resistor only for NCS, CLK_IN
High output level on SDO
kΩ
V
VOH_SDO
VOL_SDO
IOZ_SDO
ISDO = -1.85mA
ISDO = +1.85mA
VDD - 0.4
Low output level on SDO
0.4
5
V
Tristate leakage current on SDO
-5
mA
ANTENNA DRIVER / POWER AMPLIFIER INCLUDING H-BRIDGE
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
I_PWR
Output current capability for one output(1)(2)
1.2
App
V_PWR
Gain Error of output voltage amplitude peak–peak on 1
TA=-40°C, 25°C, 105°C
-10%
8%
Gain Error half-bridge for normal mode(3)(4)
V_PWR
Offset
Error
Offset Error of output voltage amplitude peak–peak on 1 TA=-40°C, 25°C, 105°C
half-bridge for normal mode(3)(4)
-0.17
0.1
1.40%
0.1
V
VPWR_7V
Gain Error of output voltage amplitude peak–peak on 1
n=0 to 3
-
Gain Error half-bridge for normal mode with Vs=7V
TA=-40°C, 25°C, 105°C
8.75%
VPWR_7V
Offset
Error
Offset Error of output voltage amplitude peak–peak on 1 n=0 to 3
half-bridge for normal mode with Vs=7V
TA=-40°C, 25°C, 105°C
-0.25
V
Δerr
Output voltage load dependency for normal mode(5)
Gain Error of output voltage amplitude peak–peak on 1
TA=-40°C, 25°C, 105°C
n=8 to 15
0
6.5
%
VDTOY
-14%
5.50%
Gain Error half-bridge for destroy bits(6)
VDTOY
Offset
Error
Offset Error of output voltage amplitude peak–peak on 1 n=8 to 15
half-bridge for destroy bits(6)
-0.3
0.15
V
THD
Voltage harmonic distortion at 125kHz including total
sine wave generation at 28V output amplitude
Baud rate accuracy of transmitted data(7)
0
6.4
1%
%
BR
-1%
VCT
Maximum level of peak to peak noise (crosscoupling) at
non active output(8)
100
mV
µs
tRVSDIV2
Rise Time for VS/2 at wake-up command, with VS
already set
With 0.1µF capacitor
700
(1) All other parameters in antenna driver section are specified for this I_PWR limit
(2) Test of output current at PGA=31, 23.3Ω connected between Outx and VS/2 Reference voltage.
(3) Test circuit: 23.3Ω connected between Outx and VS/2 Reference voltage.
(4) The sine wave output amplitude accuracy is linearly related to VA: the nominal value is (n+1)×0.95 at VA = 4.75V and (n+1)*1.05 at VA
5.25V.
=
(5) Formula: for a given programmed gain, Δerr = error at 46.6Ω load – error at 23.3Ω load
(6) The destroy bit amplitude peak to peak is measured at the filtered frequency of 134.2 kHz.
(7) The Baud Rate accuracy is dependant from CLK_IN accuracy
(8) Test conditions: one channel programmed in normal mode with 0.6A peak – all other channels inactive, 48Ω load connected to GND –
production test limit = 200mV because of ATE socket.
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MAX UNIT
DESTROY BIT EMISSION SPECIFICATION
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
DTYDTOY
Duty cycle of destroy bits sent on one output
1.3
%
POWER MANAGEMENT
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
IVDD_zero
Current consumption on VDD
All outputs configured LS ON –
HS OFF
6
0
5
mA
IVDD_active Current consumption on VDD per active output – non
transmitting mode
15
5
0
0
mA
IVS_grd
Current consumption on Vs at all H-Bridges configured
LS ON – HS OFF
mA
mA
mA
W
ITOT_idle
Ichannel
SLEEP mode current on Vs + VDD
VS = 16V
50
25
Current consumption on VS per active output
non-transmitting mode(1)
15
Pd_manch
Pd_pulse2
Total power dissipation during 100ms(2), 50% duty cycle
Continuous 134.2kHz sent during 50ms(3), 100% duty
cycle
5.6
8.7
W
(1) Test conditions: The current is measured in PGND pin with one output active, the other ones not active.
(2) Typical power dissipation given at 2 channels transmitting 50% duty cycle (data "010101…) – PGA = 28Vpp – Iant = 0.6A peak – the
other 6 channels are transmitting 4destroy bits of 1Vpp. The device shall be active for 100ms with this sine wave, having a duty cycle of
50% and 900ms off – simulation results.
(3) Continuous power dissipation at 2 channels transmitting logic "111…" – PGA = 28Vpp – Iant = 0.6A peak – the other 6 channels are in
LS ON – HS OFF mode. The device shall be active for 50ms, with this continuous sine wave transmission, then 950ms off – simulated
results.
SINE WAVE GENERATION
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
Sine wave frequency
TEST CONDITIONS
With appropriate CLK_IN(1)
MIN
TYP
MAX UNIT
F_sine
134.2
kHz
(1) The sinewave frequency accuracy depends only on CLK_IN accuracy.
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DIAGNOSTICS
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
3
TYP
MAX UNIT
(1)
UVDD
UVS
ThW
ThM
Under voltage detection threshold on VDD
4.5
7
V
V
(2)
Under voltage detection on VS
3
6
Over-temperature prewarning
120
170
°C
Delta between Over-temperature prewarning and
Over-temperature Shutdown
23
4
40
12
°C
ms
ms
A
tcond1
tcond2
IDC
Glitch time filter before over-current protection
activated(3)
Glitch time filter before over-current protection
activated(4)
9
22
DC current detection threshold in Low Side or in High
Side transistor
0.15
0.375
IDC
DC current detection threshold when output configured
"High Side OFF – Low Side ON"
0.5
0.9
-2
1.2
2
A
A
IAcpeak
Resonant current detection threshold
Total accuracy for current measurement
Acc_IMP
In the peak area ( timer code 7,
8)
2
LSB
Acc_IMNP Total accuracy for current measurement
In the non-peak area(5)
-2.5
2.5 LSB
Irge_IM
trge_IM
tres_IM
ResA/D
tA/D
Maximum peak current measurement(6)
Timer range (for the two timers)
Timer resolution (for the two timers)
A/D resolution
775
800
mA
µs
0.699
237.75
9
5
bits
bits
µs
A/D conversion time
Time shift on the A/D measure(7)
10
150
50
tshift
-350
0
ns
Idetect_IM
Minimum peak current detection
mA
(1) Test conditions: ramp down on VA and VD – Positive hysteresis is specified by design.
(2) Test conditions: ramp down on VS – Positive hysteresis is specified by design.
(3) Test conditions: VS = 38V, Vantx = VS/2, 24Ω connected to VS or to GND.
(4) Test conditions: VS = 16V, Vantx = VS/2, 24Ω connected to VS or to GND.
(5) This parameter does not include the error due to the time shift of the ADC measurement specified in tshift
.
(6) The ADC is 5-bits resolution with a nominal LSB value of 25mA. Two ranges of accuracy are defined:
First for the whole sine wave: 2.5LSB
Second for peak currents in the range of 50mA to 800mA: 2LSB
(7) The propagation delay between the zero-crossing detection at sine output and the power amplifier output results in a phase shift
between the timer start and the output current zero-crossing.
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MAX UNIT
SPI CHARACTERISTICS
VS = 38V, VD = 5V, over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
fclk
SPI Clock frequency (50% duty cycle)(1)
SDO transition speed, 20-80%
Minimum time SCLK=HIGH(1)
3
MHz
ns
tSDO_trans
tclh
10
100
100
40
ns
tcll
Minimum time SCLK=LOW(1)
ns
tpcld
Propagation delay (SCLK to data at SDO valid)
100
ns
tsclch
SCLK low before NCS low(1) (setup time SCLK to
NCS change H/L)
SCLK change L/H after NCS=low(1)
SDI input setup time(1) (SCLK change H/L after SDI
data valid)
100
100
20
ns
ns
ns
thclcl
tscld
thcld
SDI input hold time(1) (SDI data hold after SCLK
change H/L)
20
ns
tsclcl
SCLK low before NCS high(1)
SCLK high after NCS high(1)
150
150
ns
ns
ns
ns
pF
ns
thclch
tpchdz
tonNCS
CSPI
NCS L/H to SDO at high impedance
NCS min. high time(1)
Capacitance at SDI; SDO; SCLK; NCS(2)
NCS Filter time (Pulses ≤ tfNCS will be ignored)
SCLK filter number of cycles(3)
100
300
10
10
40
tfNCS
64
tNCS_send
Delay to send out LF on output after rising edge of
NCS (after sending START command)
µs
(1) This parameter is given from the application point of view.
(2) Not measured in series production.
(3) NCS pulse duration must be equal to 64 times SCLK period. If this condition is not met, the SPI message is not understood.
NCS
SCLK
SDO
MSB
LSB
SDI
MSB
LSB
Figure 9. Worst Case SPI Timing
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PACKAGE OPTION ADDENDUM
www.ti.com
30-Jul-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPIC84000TPWPRQ1
TPIC84134TPWPRQ1
ACTIVE
ACTIVE
HTSSOP
HTSSOP
PWP
PWP
28
28
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPIC84000TPWPRQ1 HTSSOP PWP
28
2000
330.0
16.4
6.9
10.2
1.8
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 28
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
TPIC84000TPWPRQ1
2000
Pack Materials-Page 2
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