TPL0102-EP_15 [TI]
TPL0102-EP 256-Taps Dual-Channel Digital Potentiometer With Non-Volatile Memory;型号: | TPL0102-EP_15 |
厂家: | TEXAS INSTRUMENTS |
描述: | TPL0102-EP 256-Taps Dual-Channel Digital Potentiometer With Non-Volatile Memory |
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中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPL0102-EP
SLIS149 –JUNE 2014
TPL0102-EP 256-Taps Dual-Channel Digital Potentiometer With Non-Volatile Memory
1 Features
2 Applications
1
•
•
•
•
•
Dual-Channel, 256-Position Resolution
Non-Volatile Memory Stores Wiper Settings
2-mm × 2-mm, 14-Pin TSSOP Package
100-kΩ End-to-End Resistance (TPL0102-100)
•
•
•
•
•
Adjustable Gain Amplifiers and Offset Trimming
Adjustable Power Supplies
Precision Calibration of Set Point Thresholds
Sensor Trimming and Calibration
Fast Power-Up Response Time to Wiper Setting:
<100 µs
Mechanical Potentiometer Replacement
3 Description
•
±0.5 LSB INL, ±0.25 LSB DNL (Voltage-Divider
Mode)
The TPL0102-EP is a two-channel, linear-taper digital
potentiometer with 256 wiper positions. Each
potentiometer can be used as a three-terminal
potentiometer or as a two-terminal rheostat. The
TPL0102-EP-100 has an end-to-end resistance of
100 kΩ.
•
•
•
•
•
4 ppm/°C Ratiometric Temperature Coefficient
I2C-Compatible Serial Interface
2.7- to 5.5-V Single-Supply Operation
±2.25 to ±2.75 V Dual-Supply Operation
The
TPL0102-EP
has
non-volatile
memory
Operating Temperature Range From
–40°C to 125°C
(EEPROM) which can be used to store the wiper
position. The internal registers of the TPL0102-EP
can be accessed using the I2C interface.
•
•
ESD Performance Tested Per JESD 22
–
2000-V Human Body Model
(A114-B, Class II)
The TPL0102-EP is available in a 14-pin TSSOP
package with a specified temperature range of –40°C
to 125°C.
Supports Defense, Aerospace, and Medical
Applications
Device Information(1)
–
–
–
–
Controlled Baseline
ORDER NUMBER
PACKAGE
BODY SIZE (NOM)
One Assembly and Test Site
One Fabrication Site
TPL0102-
100QPWREP
TSSOP (14)
5.00 mm × 4.40 mm
Available in Extended (Q) Temperature –40°C
to 125°C
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
–
–
–
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
4 Functional Block Diagram
A0 A1 A2
VDD
VSS
HA
HB
SCL
VOLATILE
I2C INTERFACE
WA
REGISTERS
SDA
WB
NON-VOLATILE
REGISTERS
GND
LA
LB
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPL0102-EP
SLIS149 –JUNE 2014
www.ti.com
Table of Contents
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 22
8.5 Register Maps......................................................... 23
Application and Implementation ........................ 26
9.1 Application Information............................................ 26
9.2 Typical Application ................................................. 26
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Functional Block Diagram .................................... 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 Handling Ratings....................................................... 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Operating Characteristics.......................................... 8
7.7 Timing Requirements................................................ 9
7.8 Typical Characteristics............................................ 10
Detailed Description ............................................ 12
9
10 Layout................................................................... 27
10.1 Layout Example .................................................... 27
11 Device and Documentation Support ................. 29
11.1 Trademarks........................................................... 29
11.2 Electrostatic Discharge Caution............................ 29
11.3 Glossary................................................................ 29
12 Mechanical, Packaging, and Orderable
Information ........................................................... 29
8
5 Revision History
DATE
REVISION
NOTES
June 2014
*
Initial release.
2
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6 Pin Configuration and Functions
TSSOP – PW Package
14 Pins
(Top View)
1
2
3
4
5
6
7
14
13
12
11
10
9
VDD
A0
HA
LA
A1
WA
HB
LB
GND
SCL
SDA
WB
A2
8
VSS
Pin Functions
PIN
I/O
DESCRIPTION
NAME
HA
NO.
1
I/O
I/O
I/O
I/O
I/O
I/O
I
High pin of potentiometer A
Low pin of potentiometer A
Wiper pin of potentiometer A
High pin of potentiometer B
Low pin of potentiometer B
Wiper pin of potentiometer B
Address bit 2
LA
2
WA
HB
3
4
LB
5
WB
A2
6
7
VSS
SDA
SCL
GND
A1
8
Power
I/O
I
Negative or GND power supply pin
I2C data I/O
I2C clock input
9
10
11
12
13
14
—
Ground
I
Address bit 1
A0
I
Address bit 0
VDD
Power
Positive power supply pin
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7 Specifications
7.1 Absolute Maximum Ratings(1)(2)(3)
MIN
–0.3
–7
MAX
7
UNIT
V
VDD to GND
VSS to GND
VDD to VSS
VH, VL, VW
VI
Supply voltage
0.3
7
V
V
Voltage at resistor pins
Digital input voltage
Pulse current
VSS – 0.3 VDD + 0.3
V
–0.3 VDD + 0.3
V
±20
±2
mA
mA
IH, IL, IW
Continuous current
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.
7.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
Single supply operation (VSS = 0 V)
2.7
±2.25
VSS
VDD, VSS
V
Dual supply operation
±2.75
VDD
VH, VL
VIH
VIL
Pin voltage
V
V
Voltage input high (SCL, SDA, A0, A1, A2)
Voltage input low (SCL, SDA, A0, A1, A2)
Wiper current
0.7 × VDD
0
5.5
0.3 × VDD
±2
V
IW
mA
°C
TJ
Junction temperature
–40
125
4
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7.4 Thermal Information
TPL0102-EP
PW
THERMAL METRIC(1)
UNIT
14 PINS
112.9
39.9
RθJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
RθJC(top)
RθJB
55.9
°C/W
ψJT
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
3.5
ψJB
55.2
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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7.5 Electrical Characteristics
VDD = 2.7 to 5.5 V, VSS = 0 V, VH= VDD, VL= GND, TJ = –40°C to 125°C (unless otherwise noted). Typical values are at
VDD = 5 V, TJ = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
End-to-end resistance
(Between H and L pins)
RTOT
TPL0102-100
80
100
120
kΩ
RH, RL
RW
Pin resistance
60
25
22
16
200
120
Ω
Ω
Wiper resistance
Pin capacitance
Wiper capacitance
(1)(2)
CH, CL
pF
pF
(1)(2)
CW
VH = VSS to VDD, VL = Floating
or
ILKG
Pin leakage current
0.1
1
µA
VL = VSS to VDD, VH = Floating
Resistance temperature
coefficient
TCR
Input Code = 0x80h
92
ppm/°C
%
Channel-to-channel resistance
match
RTOT,MATCH
0.1
VOLTAGE DIVIDER MODE
INL(3)(4)
DNL(3)(5)
ZSERROR
FSERROR
Integral non-linearity
–0.5
–0.25
0
0.5
0.25
2
LSB
LSB
LSB
LSB
Differential non-linearity
Zero-scale error
(6)(7)
(6)(8)
0.1
Full-scale error
–2
–0.1
0
Wiper at the same tap position, same voltage
at all H and same voltage at all L pins
(6)(9)
VMATCH
TCV
Channel-to-channel matching
–2
2
LSB
Ratiometric temperature
coefficient
Wiper set at mid-scale
4
ppm/°C
Wiper set at
BW
Bandwidth
TPL0102-100
TPL0102-100
midscale
CLOAD = 10 pF
229
3.6
kHz
µS
%
TSW
THD
Wiper setting time
Total harmonic distortion
VH = 1 VRMS at 1 kHz,
VL = (VDD – VSS)/2,
Measurement at W
TPL0102-100
0.03
ƒH = 1 kHz,
XTALK
Crosstalk
VL = GND,
–82
dB
Measurement at W
(1) Pin and wiper capacitance extracted from self admittance of three port network measurement
I
i
Y =
ii
Vk =0 for k¹i
V
i
(2) Digital Potentiometer Macromodel
H
CH
R
TOTAL
W
CW
CL
L
(3) LSB = (VMEAS[code 255] – VMEAS[code 0]) / 255
(4) INL = ((VMEAS[code x] – VMEAS[code 0]) / LSB) – [code x]
(5) DNL = ((VMEAS[code x] – VMEAS[code x-1]) / LSB) – 1
(6) IDEAL_LSB = (VH – VL) / 256
(7) ZSERROR = VMEAS[code 0] / IDEAL_LSB
(8) FSERROR = [(VMEAS[code 255] – (VH – VL)) / IDEAL_LSB] + 1
(9) VMATCH = (VMEAS_A[code x] – VMEAS_B[code x]) / IDEAL_LSB
6
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Electrical Characteristics (continued)
VDD = 2.7 to 5.5 V, VSS = 0 V, VH= VDD, VL= GND, TJ = –40°C to 125°C (unless otherwise noted). Typical values are at
VDD = 5 V, TJ = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
RHEOSTAT MODE (Measurements between W and L with H not connected, or between W and H with L not connected)
RINL(10)(11)
RDNL(10)(12)
Integral non-linearity
Differential non-linearity
Offset
–1
–0.5
0
1
0.5
2
LSB
LSB
LSB
LSB
(13)(14)
ROFFSET
0.2
54
(13)(15)
RMATCH
RBW
Channel-to-channel matching
–2
2
Code = 0x00h,
L Floating,
Input applied to W, Measure
at H, CLOAD = 10 pF
Bandwidth
TPL0102-100
kHz
(10) RLSB = (RMEAS[code 255] – RMEAS[code 0]) / 255
(11) RINL =( (RMEAS[code x] – RMEAS[code 0]) / RLSB) – [code x]
(12) RDNL =( (RMEAS[code x] – RMEAS[code x-1]) / RLSB ) – 1
(13) IDEAL_RLSB = RTOT / 256
(14) ROFFSET = RMEAS[code 0] / IDEAL_RLSB
(15) RMATCH = (RMEAS_A[code x] – RMEAS_B[code x]) / IDEAL_RLSB
100
10
1
85
95
105
Operating Junction Temperature (ºC)
115
125
C020
(1) See data sheet for absolute maximum and minimum recommended operating conditions.
(2) Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect
life).
(3) Enhanced plastic product disclaimer applies.
Figure 1. TPL0102-EP Electromigration Fail Mode/Wirebond Life Derating Chart
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7.6 Operating Characteristics
VDD = 2.7 to 5.5 V, VSS = 0 V, VH = VDD, VL = GND, TJ= –40°C to 125°C (unless otherwise noted). Typical values are at
VDD = 5 V, TJ = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.5
1
UNIT
–40°C
25°C
0.2
VDD = 2.75 V, VSS = –2.75 V,
I2C interface in standby mode
IDD(STBY)
VDD standby current
µA
125°C
–40°C
25°C
16
–1.5
–1
–0.2
0.2
VDD = 2.75 V, VSS = –2.75 V,
I2C interface in standby mode
ISS(STBY)
VSS standby current
VDD shutdown current
VSS shutdown current
µA
µA
µA
125°C
–40°C
25°C
–16
1.5
1
VDD = 2.75 V, VSS = –2.75 V,
I2C interface in standby mode
IDD(SHUTDOWN)
125°C
–40°C
25°C
16
–1.5
–1
–0.2
VDD = 2.75 V, VSS = –2.75 V,
I2C interface in standby mode
ISS(SHUTDOWN)
125°C
–16
IDD
ISS
VDD current during non-volatile write VDD = 2.75 V, VSS = –2.75 V
350
1
µA
µA
VSS current during non-volatile write
VDD = 2.75 V, VSS = –2.75 V
-350
–1
Digital pins leakage current (A0, A1,
A2, SDA, and SCL)
ILKG-DIG
VPOR
µA
V
Power-on recall voltage
Minimum VDD at which memory recall occurs
2
EEPROM SPECIFICATION
EEPROM endurance
1000
100000
20
Cycles
Hours
ms
EEPROM retention
tWC
Non-volatile write cycle time
WIPER TIMING CHARACTERISTICS
tWRT
Wiper response time
SCL falling edge of last bit of wiper data byte to wiper
new position
600
800
ns
ns
tSHUTDOWNREC
Wiper position recall time from shut- SCL falling edge of last bit of ACR data byte to wiper
down mode
stored position and H connection
tD
Power-up delay
VDD above VPOR, to wiper initial value register recall
completed, and I2C interface in standby mode
35
7
100
5.5
µs
pF
CIN
Pin capacitance
A0, A1, A2, SDA SCL pins
I2C INTERFACE SPECIFICATIONS
VIH
Input high voltage
0.7 ×
VDD
V
V
VIL
Input low voltage
0.3 ×
VDD
0
VOL
CIN
Output low voltage
Pin capacitance
SDA pin, IOL = 4 mA
0.4
V
A0, A1, A2, SDA SCL pins
7
pF
8
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7.7 Timing Requirements
VDD = 2.7 to 5.5 V, VSS = 0 V, VH = VDD, VL = GND, TJ = –40°C to 125°C (unless otherwise noted). Typical values are at
VDD = 5 V, TJ = 25°C (unless otherwise noted).
STANDARD MODE I2C BUS
FAST MODE I2C BUS
UNIT
MIN
MAX
MIN MAX
I2C INTERFACE TIMING REQUIREMENTS
ƒSCL
tSCH
tSCL
tsp
I2C clock frequency
I2C clock high time
I2C clock low time
I2C spike time
I2C serial data setup time
I2C serial data hold time
I2C input rise time
0
4
100
50
0
0.6
1.3
0
400 kHz
µs
µs
4.7
0
50
ns
ns
ns
ns
ns
ns
µs
µs
µs
µs
µs
µs
tSDS
tSDH
tICR
tICF
250
0
100
0
(1)
1000
300
20 + 0.1Cb
300
300
300
I2C input fall time
20 + 0.1Cb
(1)
(1)
tICF
I2C output fall time, 10- to 400-pF bus
I2C bus free time between stop and start
I2C start or repeater start conditions setup time
I2C start or repeater start condition hold time
I2C stop condition setup time
300
20 + 0.1Cb
tBUF
tSTS
tSTH
tSPS
4.7
4.7
4
1.3
1.3
0.6
0.6
4
tVD(DATA) Valid data time, SCL low to SDA output valid
1
1
1
1
tVD(DATA) Valid data time of ACK condition, ACK signal from
SCL low to SDA (out) low
(1) Cb = total capacitance of one bus line in pF
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7.8 Typical Characteristics
6
5
0.0
±0.5
±1.0
±1.5
±2.0
±2.5
4
3
2
1
0
±1
±2
IDD(STBY) Current
ISS(STBY) Current
0
20
40
60
80
100
120
±40
±20
0
20
40
60
80
100
120
±40
±20
Free-Air Temperature (C)
Free-Air Temperature (C)
C001
C002
Figure 2. IDD Standby Current vs Temperature
Figure 3. ISS Standby Current vs Temperature
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
±0.2
0.0
±0.5
±1.0
±1.5
±2.0
±2.5
IDD(SHUTDOWN) Current
ISS(SHUTDOWN) Current
0
20
40
60
80
100
120
0
20
40
60
80
100
120
±40
±20
±40
±20
Free-Air Temperature (C)
Free-Air Temperature (C)
C003
C004
Figure 4. IDD Shutdown Current vs Temperature
Figure 5. ISS Shutdown Current vs Temperature
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
±0.145
±0.150
±0.155
±0.160
±0.165
±0.170
0
20
40
60
80
100
120
0
20
40
60
80
100
120
±40
±20
±40
±20
Free-Air Temperature (C)
Free-Air Temperature (C)
C005
C006
Figure 6. IDD Current (Non-Volatile Write) vs Temperature
Figure 7. ISS Current (Non-Volatile Write) vs Temperature
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Typical Characteristics (continued)
90
90
80
70
60
50
40
30
20
10
2.7 V
5.5 V
2.7 V
5.5 V
80
70
60
50
40
30
20
10
0
20
40
60
80
100
120
0
20
40
60
80
100
120
±40
±20
±40
±20
Free-Air Temperature (C)
Free-Air Temperature (C)
C007
C007
Figure 8. Wiper Resistance (RW) vs Temperature
Figure 9. End-to-End Resistance (Between H and L Pins) vs
Temperature
0.32
0.28
0.24
0.20
0.16
0.12
0.08
0.04
±0.40
±0.50
±0.60
±0.70
±0.80
±0.90
±1.00
2.7 V
5.5 V
2.7 V
5.5 V
0
20
40
60
80
100
120
0
20
40
60
80
100
120
±40
±20
±40
±20
Free-Air Temperature (C)
Free-Air Temperature (C)
C009
C010
Figure 10. Zero-Scale Error vs Temperature
Figure 11. Full-Scale Error vs Temperature
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
2.7 V
5.5 V
0
20
40
60
80
100
120
±40
±20
Free-Air Temperature (C)
C011
Figure 12. Offset vs Temperature
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8 Detailed Description
8.1 Overview
The TPL0102-EP is a two-channel, linear-taper digital potentiometer with 256 wiper positions. Each
potentiometer can be used as a three-pin potentiometer or as a two-pin rheostat. The TPL0102-EP-100 has an
end-to-end resistance of 100 kΩ.
The TPL0102-EP has non-volatile memory (EEPROM) which can be used to store the wiper position. When the
device is powered down, the last value stored in the IVR register will be maintained in the non-volatile memory.
When power is restored, the contents of the IVR register are recalled and loaded into the corresponding WR
register to set the wipers to the initial position. The internal registers of the TPL0102-EP can be accessed using
the I2C interface.
The position of the wiper pin is controlled by the value in the WR 8-bit register. When the WR contains all zeroes,
the wiper pin W is closest to its L (low) pin. As the value of the WR increases from all zeroes to all ones (255
decimal), the wiper moves monotonically from the position closest to L to the position closest to H. At the same
time, the resistance between W and L increases monotonically, whereas the resistance between W and H
decreases monotonically.
8.2 Functional Block Diagram
A0 A1 A2
VDD
VSS
HA
HB
SCL
SDA
VOLATILE
I2C INTERFACE
WA
REGISTERS
WB
NON-VOLATILE
REGISTERS
GND
LA
LB
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8.3 Feature Description
Table 1. Summary of Features
Feature
Number of potentiometers
TPL0102-EP
2
I2C
Digital interface
Steps
256
Wiper memory
Taper
Non-volatile
Linear
100 kΩ
20%
End-to-end resistance
End-to-end resistance tolerance
Wiper resistance
25 Ω (typ)
8.3.1 Potentiometer Pin Description
8.3.1.1 HA, HB, LA, LB
The high (HA, HB) and low (LA, LB) pins of the TPL0102-EP are equivalent to the fixed pins of a mechanical
potentiometer. The H and L pins do not have any polarity restrictions, i.e. H can be at a higher voltage than L, or
L can be at a higher voltage than H. The WA and WB pins are the wipers and equivalent to the movable pin of a
mechanical potentiometer. The position of the wiper is set using the WR register. With the WR register set to 255
decimal, the wiper is closest to the H pin, and with the WR register set to 0, the wiper is closest to the L pin.
8.3.1.2 SDA, SCL
SDA is a bi-directional serial data input/output pin for I2C communication. SDA is an open drain output and
requires an external pull-up resistor.
SCL is the serial clock input for I2C communication. SCL requires an external pull-up resistor.
8.3.1.3 A0, A1, A2
These inputs are used to set the last three bits of the I2C address of the device. By using different values for A0,
A1, A2, up to eight TPL0102-EP devices can be used on the same I2C bus.
From Processor to DPOT
From DPOT to Processor
I2C Write to A Register
Address (1010_ _ _)
Start
0
Ack
Register Addr
DataN
Ack
Stop
Ack
Ack
Data1
I2C Read From A Register
Address (1010_ _ _)
Start
0
1
Ack
Ack
Register Addr
Ack
reStart
Ack
Address (1010_ _ _)
First Read Data Byte
Ack
noAck
Last Read Data Byte
Stop
Figure 13. I2C Interface
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The following is a sample sequence to set wipers of both potentiometers at mid-scale. Assume A0, A1, and A2
are 0 and device has just been powered up.
From Processor to DPOT
From DPOT to Processor
Method 1: First Write 0x80 to IVRA and then write 0x80 to IVRB Register
Address (1010000b)
IVRA Register (0x00h)
Start
0
Ack
Ack
Ack
Data (0x80)
Ack
Stop
Address (1010 000b)
IVRB Register (0x01h)
Start
0
Ack
Data (0x80h)
Ack
Stop
Method 2: Perform a multi byte write to IVRA and IVRB Register
Address (1010000b)
IVRA Register (0x00h)
Start
0
Ack
Ack
Data (0x80h)
Ack
Data (0x80h)
Ack
Stop
Data written to Register 0x00h
Data written to Register 0x01h
Figure 14. tI2C Interface Example
8.3.2 Standard I2C Interface Details
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be
connected to a positive supply via a pullup resistor when connected to the output stages of a device. Data
transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by the master sending a start condition, a high-to-low transition on
the SDA input/output while the SCL input is high (see Figure 15). After the start condition, the device address
byte is sent, MSB first, including the data direction bit (R/W). This device does not respond to the general call
address. After receiving the valid address byte, this device responds with an ACK, a low on the SDA input/output
during the high of the ACK-related clock pulse
Figure 15. Definition of Start and Stop Conditions
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The data byte follows the address ACK. The R/W bit is kept low for transfer from the master to the slave. The
data byte is followed by an ACK sent from this device. Data are output only if complete bytes are received and
acknowledged. The output data is valid at time (tpv) after the low-to-high transition of SCL, during the clock cycle
for the ACK. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line
must remain stable during the high pulse of the clock period, as changes in the data line at this time are
interpreted as control commands (start or stop) (see Figure 16).
Figure 16. Bit Transfer
A stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the
master (see Figure 15).
The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the
receiver can send an ACK bit.
A slave receiver that is addressed must generate an ACK after the reception of each byte. The device that
acknowledges has to pull down the SDA line during the ACK clock pulse so that the SDA line is stable low during
the high pulse of the ACK-related clock period (see Figure 17). Setup and hold times must be taken into account.
Figure 17. Acknowledgment on the I2C Bus
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8.3.3 Ideal Resistance Values
H
RHW
RWL = RTOT x D/256
RTOT
W
RHW = RTOT x (1 –(D/256))
RWL
Where D = Decimal Value of Wiper Code
Figure 18.
Table 2 shows the ideal values for DPOT with end-to-end resistance of 100 kΩ. The absolute values of
resistance can vary significantly, but the ratio (RWL / RHW) is extremely accurate.
Table 2.
Step
0
Binary
0
RWL (kΩ)
0.00
0.39
0.78
1.17
1.56
1.95
2.34
2.73
3.13
3.52
3.91
4.30
4.69
5.08
5.47
5.86
6.25
6.64
7.03
7.42
7.81
8.20
8.59
8.98
9.38
9.77
10.16
10.55
10.94
11.33
11.72
12.11
RHW (kΩ)
100.00
99.61
99.22
98.83
98.44
98.05
97.66
97.27
96.88
96.48
96.09
95.70
95.31
94.92
94.53
94.14
93.75
93.36
92.97
92.58
92.19
91.80
91.41
91.02
90.63
90.23
89.84
89.45
89.06
88.67
88.28
87.89
RWL / RHW
0.00
0.00
0.01
0.01
0.02
0.02
0.02
0.03
0.03
0.04
0.04
0.04
0.05
0.05
0.06
0.06
0.07
0.07
0.08
0.08
0.08
0.09
0.09
0.10
0.10
0.11
0.11
0.12
0.12
0.13
0.13
0.14
1
1
2
10
3
11
4
100
5
101
6
110
7
111
8
1000
1001
1010
1011
1100
1101
1110
1111
10000
10001
10010
10011
10100
10101
10110
10111
11000
11001
11010
11011
11100
11101
11110
11111
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
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Table 2. (continued)
Step
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
Binary
100000
100001
100010
100011
100100
100101
100110
100111
101000
101001
101010
101011
101100
101101
101110
101111
110000
110001
110010
110011
110100
110101
110110
110111
111000
111001
111010
111011
111100
111101
111110
111111
1000000
1000001
1000010
1000011
1000100
1000101
1000110
1000111
1001000
1001001
1001010
1001011
1001100
1001101
1001110
RWL (kΩ)
12.50
12.89
13.28
13.67
14.06
14.45
14.84
15.23
15.63
16.02
16.41
16.80
17.19
17.58
17.97
18.36
18.75
19.14
19.53
19.92
20.31
20.70
21.09
21.48
21.88
22.27
22.66
23.05
23.44
23.83
24.22
24.61
25.00
25.39
25.78
26.17
26.56
26.95
27.34
27.73
28.13
28.52
28.91
29.30
29.69
30.08
30.47
RHW (kΩ)
87.50
87.11
86.72
86.33
85.94
85.55
85.16
84.77
84.38
83.98
83.59
83.20
82.81
82.42
82.03
81.64
81.25
80.86
80.47
80.08
79.69
79.30
78.91
78.52
78.13
77.73
77.34
76.95
76.56
76.17
75.78
75.39
75.00
74.61
74.22
73.83
73.44
73.05
72.66
72.27
71.88
71.48
71.09
70.70
70.31
69.92
69.53
RWL / RHW
0.14
0.15
0.15
0.16
0.16
0.17
0.17
0.18
0.19
0.19
0.20
0.20
0.21
0.21
0.22
0.22
0.23
0.24
0.24
0.25
0.25
0.26
0.27
0.27
0.28
0.29
0.29
0.30
0.31
0.31
0.32
0.33
0.33
0.34
0.35
0.35
0.36
0.37
0.38
0.38
0.39
0.40
0.41
0.41
0.42
0.43
0.44
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Table 2. (continued)
Step
79
Binary
RWL (kΩ)
30.86
31.25
31.64
32.03
32.42
32.81
33.20
33.59
33.98
34.38
34.77
35.16
35.55
35.94
36.33
36.72
37.11
37.50
37.89
38.28
38.67
39.06
39.45
39.84
40.23
40.63
41.02
41.41
41.80
42.19
42.58
42.97
43.36
43.75
44.14
44.53
44.92
45.31
45.70
46.09
46.48
46.88
47.27
47.66
48.05
48.44
48.83
RHW (kΩ)
69.14
68.75
68.36
67.97
67.58
67.19
66.80
66.41
66.02
65.63
65.23
64.84
64.45
64.06
63.67
63.28
62.89
62.50
62.11
61.72
61.33
60.94
60.55
60.16
59.77
59.38
58.98
58.59
58.20
57.81
57.42
57.03
56.64
56.25
55.86
55.47
55.08
54.69
54.30
53.91
53.52
53.13
52.73
52.34
51.95
51.56
51.17
RWL / RHW
0.45
0.45
0.46
0.47
0.48
0.49
0.50
0.51
0.51
0.52
0.53
0.54
0.55
0.56
0.57
0.58
0.59
0.60
0.61
0.62
0.63
0.64
0.65
0.66
0.67
0.68
0.70
0.71
0.72
0.73
0.74
0.75
0.77
0.78
0.79
0.80
0.82
0.83
0.84
0.86
0.87
0.88
0.90
0.91
0.92
0.94
0.95
1001111
1010000
1010001
1010010
1010011
1010100
1010101
1010110
1010111
1011000
1011001
1011010
1011011
1011100
1011101
1011110
1011111
1100000
1100001
1100010
1100011
1100100
1100101
1100110
1100111
1101000
1101001
1101010
1101011
1101100
1101101
1101110
1101111
1110000
1110001
1110010
1110011
1110100
1110101
1110110
1110111
1111000
1111001
1111010
1111011
1111100
1111101
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
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Table 2. (continued)
Step
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
Binary
RWL (kΩ)
49.22
49.61
50.00
50.39
50.78
51.17
51.56
51.95
52.34
52.73
53.13
53.52
53.91
54.30
54.69
55.08
55.47
55.86
56.25
56.64
57.03
57.42
57.81
58.20
58.59
58.98
59.38
59.77
60.16
60.55
60.94
61.33
61.72
62.11
62.50
62.89
63.28
63.67
64.06
64.45
64.84
65.23
65.63
66.02
66.41
66.80
67.19
RHW (kΩ)
50.78
50.39
50.00
49.61
49.22
48.83
48.44
48.05
47.66
47.27
46.88
46.48
46.09
45.70
45.31
44.92
44.53
44.14
43.75
43.36
42.97
42.58
42.19
41.80
41.41
41.02
40.63
40.23
39.84
39.45
39.06
38.67
38.28
37.89
37.50
37.11
36.72
36.33
35.94
35.55
35.16
34.77
34.38
33.98
33.59
33.20
32.81
RWL / RHW
0.97
0.98
1.00
1.02
1.03
1.05
1.06
1.08
1.10
1.12
1.13
1.15
1.17
1.19
1.21
1.23
1.25
1.27
1.29
1.31
1.33
1.35
1.37
1.39
1.42
1.44
1.46
1.49
1.51
1.53
1.56
1.59
1.61
1.64
1.67
1.69
1.72
1.75
1.78
1.81
1.84
1.88
1.91
1.94
1.98
2.01
2.05
1111110
1111111
10000000
10000001
10000010
10000011
10000100
10000101
10000110
10000111
10001000
10001001
10001010
10001011
10001100
10001101
10001110
10001111
10010000
10010001
10010010
10010011
10010100
10010101
10010110
10010111
10011000
10011001
10011010
10011011
10011100
10011101
10011110
10011111
10100000
10100001
10100010
10100011
10100100
10100101
10100110
10100111
10101000
10101001
10101010
10101011
10101100
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Table 2. (continued)
Step
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216
217
218
219
Binary
RWL (kΩ)
67.58
67.97
68.36
68.75
69.14
69.53
69.92
70.31
70.70
71.09
71.48
71.88
72.27
72.66
73.05
73.44
73.83
74.22
74.61
75.00
75.39
75.78
76.17
76.56
76.95
77.34
77.73
78.13
78.52
78.91
79.30
79.69
80.08
80.47
80.86
81.25
81.64
82.03
82.42
82.81
83.20
83.59
83.98
84.38
84.77
85.16
85.55
RHW (kΩ)
32.42
32.03
31.64
31.25
30.86
30.47
30.08
29.69
29.30
28.91
28.52
28.13
27.73
27.34
26.95
26.56
26.17
25.78
25.39
25.00
24.61
24.22
23.83
23.44
23.05
22.66
22.27
21.88
21.48
21.09
20.70
20.31
19.92
19.53
19.14
18.75
18.36
17.97
17.58
17.19
16.80
16.41
16.02
15.63
15.23
14.84
14.45
RWL / RHW
2.08
2.12
2.16
2.20
2.24
2.28
2.32
2.37
2.41
2.46
2.51
2.56
2.61
2.66
2.71
2.76
2.82
2.88
2.94
3.00
3.06
3.13
3.20
3.27
3.34
3.41
3.49
3.57
3.65
3.74
3.83
3.92
4.02
4.12
4.22
4.33
4.45
4.57
4.69
4.82
4.95
5.10
5.24
5.40
5.56
5.74
5.92
10101101
10101110
10101111
10110000
10110001
10110010
10110011
10110100
10110101
10110110
10110111
10111000
10111001
10111010
10111011
10111100
10111101
10111110
10111111
11000000
11000001
11000010
11000011
11000100
11000101
11000110
11000111
11001000
11001001
11001010
11001011
11001100
11001101
11001110
11001111
11010000
11010001
11010010
11010011
11010100
11010101
11010110
11010111
11011000
11011001
11011010
11011011
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Table 2. (continued)
Step
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
Binary
RWL (kΩ)
85.94
86.33
86.72
87.11
87.50
87.89
88.28
88.67
89.06
89.45
89.84
90.23
90.63
91.02
91.41
91.80
92.19
92.58
92.97
93.36
93.75
94.14
94.53
94.92
95.31
95.70
96.09
96.48
96.88
97.27
97.66
98.05
98.44
98.83
99.22
99.61
RHW (kΩ)
14.06
13.67
13.28
12.89
12.50
12.11
11.72
11.33
10.94
10.55
10.16
9.77
RWL / RHW
6.11
11011100
11011101
11011110
11011111
11100000
11100001
11100010
11100011
11100100
11100101
11100110
11100111
11101000
11101001
11101010
11101011
11101100
11101101
11101110
11101111
11110000
11110001
11110010
11110011
11110100
11110101
11110110
11110111
11111000
11111001
11111010
11111011
11111100
11111101
11111110
11111111
6.31
6.53
6.76
7.00
7.26
7.53
7.83
8.14
8.48
8.85
9.24
9.38
9.67
8.98
10.13
10.64
11.19
11.80
12.47
13.22
14.06
15.00
16.07
17.29
18.69
20.33
22.27
24.60
27.44
31.00
35.57
41.67
50.20
63.00
84.33
127.00
255.00
8.59
8.20
7.81
7.42
7.03
6.64
6.25
5.86
5.47
5.08
4.69
4.30
3.91
3.52
3.13
2.73
2.34
1.95
1.56
1.17
0.78
0.3
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8.4 Device Functional Modes
VOLTAGE DIVIDER MODE
VH
VHW
VHW = (VH – VL) x (1 – (D/256))
VH - VL
W
VWL = (VH – VL) x D/256
VWL
Where D = Decimal Value of Wiper Code
VL
RHEOSTAT MODE A
H
H (Floating)
RWL = RTOT x D/256
RTOT
OR
RTOT
W
W
Where D = Decimal Value of Wiper Code
RWL
RWL
L
L
RHEOSTAT MODE B
H
H
RHW
RHW
RHW = RTOT x (1 – (D/256))
RTOT
OR
RTOT
Where D = Decimal Value of Wiper Code
W
W
L
L (Floating)
Figure 19. Digital Potentiometer Configurations
22
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8.5 Register Maps
8.5.1 Slave Address
Bit 7
(MSB)
Bit 0
(LSB)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 2
1
0
1
0
A2
A1
A0
R/W
8.5.2 TPL0102-EP Register Maps
REGISTER ADDRESS (HEX)
NON-VOLATILE
IVRA
VOLATILE
WRA
WRB
N/A
0
1
IVRB
2
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
General purpose
3
N/A
4
N/A
5
N/A
6
N/A
7
N/A
8
N/A
9
N/A
A
B
C
E
D
F
10
N/A
N/A
N/A
N/A
N/A
Reserved
N/A
ACR
8.5.3 IVRA (Initial Value Register for Potentiometer A)
•
•
•
Register address: 00H
Factory programmed value: 80H
Type: non-volatile write/read
NAME
SIZE (BITS)
DESCRIPTION
Non-volatile register to store wiper position for potentiometer A
IVRA
8
8.5.4 WRA (Wiper Resistance Register for Potentiometer A)
•
•
•
Register address: 00H
Reset value: same as IVRA
Type: volatile write/read
NAME
SIZE (BITS)
DESCRIPTION
WRA
8
Volatile register to change wiper position for potentiometer A
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8.5.5 IVRB (Initial Value Register for Potentiometer B)
•
•
•
Register address: 01H
Factory programmed value: 80H
Type: non-volatile write/read
NAME
SIZE (BITS)
DESCRIPTION
IVRB
8
Non-volatile register to store wiper position for potentiometer B
8.5.6 WRB (Wiper Resistance Register for Potentiometer B)
•
•
•
Register address: 01H
Reset value: same as IVRB
Type: volatile write/read
NAME
SIZE (BITS)
DESCRIPTION
WRB
8
Volatile register to change wiper position for potentiometer B
8.5.7 ACR (Access Control Register)
•
•
•
Register address: 00H
Reset value: 40H
Type: non-volatile write/read
NAME
SIZE (BITS)
DESCRIPTION
IVRA
8
Non-volatile register to store wiper position for potentiometer A
Bit 7
VOL
0
Bit 6
SHDN
1
Bit 5
WIP
0
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
ACR
8
0
0
0
0
0
0
0
0
0
0
Default Value
NAME
SIZE (BITS)
DESCRIPTION
0: Non-volatile registers (IVRA, IVRB) are accessible. Value written to IVRi register is
also written to the corresponding WRi.
VOL
1
1: Only volatile registers (WRi) are accessible.
0: Shut-down mode is enabled. Potentiometers are in shut-down mode.
(see Figure 20)
SHDN
1
1
1: Shut-down mode is disabled
0: Non-volatile write operation is not in progress
WIP (read-only bit)
1: Non-volatile write operation is in progress (it is not possible to write to the WRi or
ACR while WIP = 1)
24
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H
SHDN
Switch Open when SHDN = Low,
Switch Closed when SHDN = High
SHDN
Switch Open when SHDN = Low,
Switch Closed when SHDN = High
W
L
Figure 20. Potentiometer in Shut-Down Mode
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9 Application and Implementation
9.1 Application Information
In a simple operational amplifier configuration, like the one found in Figure 21, the TPL0102-EP is used to control
the gain and offset voltage of the operational amplifier. Using the TPL0102-EP in a rheostat mode (like Rheostat
Mode A in Figure 19), the gain setting of the negative feedback loop can be adjusted freely. To have maximum
control of the offset voltage correction of the operational amplifier, the voltage divider mode can be used; giving
the user an increased amount of control and precision for systems sensitive to DC offset.
9.2 Typical Application
5V
WA
½ TPL0102-EP
LA
to Nullify Offset Voltage
HA
1
7
3
2
VIN
+
8
TLE2027
VOUT
-
4
R1
HB
LB
½ TPL0102-EP
to Adjust Gain
WB
Figure 21. Offset Voltage and Gain Adjustment
26
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10 Layout
10.1 Layout Example
Positive Power
Supply Pin
Negative Power
Supply Pin
Address Bit 2 Address Bit1 Address Bit 0
High pin of
Potentiometer A
Wiper pin of
Potentiometer A
Low pin of
Potentiometer A
High pin of
Potentiometer B
Wiper pin of
Potentiometer B
I2C Clock Input
I2C Data I/O
Low pin of
Potentiometer B
Figure 22. TPL0102-EP Layout (Top Layer)
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Layout Example (continued)
Positive Power
Supply Pin
Negative Power
Supply Pin
Address Bit 2 Address Bit1 Address Bit 0
High pin of
Potentiometer A
Wiper pin of
Potentiometer A
Low pin of
Potentiometer A
Highpin of
Potentiometer B
Wiper pin of
Potentiometer B
I2C Clock Input
I2C Data I/O
Low pin of
Potentiometer B
Figure 23. TPL0102-EP Layout (Bottom Layer)
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11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2014
PACKAGING INFORMATION
Orderable Device
TPL0102-100QPWREP
V62/14613-01XE
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
TSSOP
TSSOP
PW
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
EL-100EP
EL-100EP
ACTIVE
PW
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Jun-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPL0102-100QPWREP TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jun-2014
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TSSOP PW 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
TPL0102-100QPWREP
2000
Pack Materials-Page 2
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