TPS22970 [TI]
具有输出放电功能的 3.6V、4A、4.7mΩ 负载开关;
| 型号： | TPS22970 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有输出放电功能的 3.6V、4A、4.7mΩ 负载开关 开关 |
| 文件： | 总25页 (文件大小：1228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS22970
SLVSDF2A –MAY 2017–REVISED JULY 2017
TPS22970 3.6-V, 4-A, 4.7-mΩ On-Resistance Load Switch
1 Features
3 Description
The TPS22970 is a small, space-saving load switch
1
•
•
Input Voltage Range (VIN): 0.65 V to 3.6 V
On-Resistance
with controlled Turn-ON to reduce inrush current. The
device contains an N-channel MOSFET that can
operate over an input voltage range of 0.65 V to 3.6
V and pulsed switch currents up to 4 A. An integrated
charge pump biases the NMOS switch in order to
achieve a minimum switch ON resistance (RON). The
switch is controlled by an on and off input (ON),
which is capable of interfacing directly with low-
voltage control signals.
–
–
–
RON = 4.7 mΩ (Typical) at VIN ≥ 1.8 V
RON = 5.1 mΩ (Typical) at VIN = 1.05 V
RON = 6.4 mΩ (Typical) at VIN = 0.65 V
•
•
•
•
Maximum Continuous Switch Current (IMAX): 4 A
ON State (IQ): 30 µA (Typical) at VIN > 1.2 V
OFF State (ISD): 1 µA (Typical) at VIN > 1.8 V
Controlled Slew Rate to Avoid Inrush Current
The TPS22970 is capable of thermal shutdown when
the junction temperature is above the threshold,
turning the switch off. The switch turns on again when
the junction temperature stabilizes to a safe range.
–
–
3.6 V Turn-ON time (tON): 1530 μs
0.65 V Turn-ON time (tON): 815 μs
•
Low Threshold Enable (ON) Supports Use of
Logic as Low as 0.9 V (VIH) of Logic
The TPS22970 has a 150-Ω on-chip resistor for quick
discharge of the output when switch is disabled to
avoid any unknown state caused by floating supply to
the downstream load.
•
•
Thermal Shutdown (TSD
)
Quick Output Discharge (QOD): 150-Ω (Typical)
The TPS22970 has an internally controlled rise time
in order to reduce inrush current.
2 Applications
•
•
•
•
•
Notebook, Tablet
Industrial PC
Smartphones
Telecom
The TPS22970 is available in an ultra-small, space
saving 8-pin WCSP package and is characterized for
operation over the free-air temperature range of
–40°C to +105°C.
Device Information(1)
Storage
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS22970YZPT
DSBGA (8)
1.90 mm × 0.90 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
VOUT
VIN
VIN
VIN
Power Supply
VOUT
CL
CIN
RL
VOUT
TPS22970
GND
ON
ON
GND
OFF
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS22970
SLVSDF2A –MAY 2017–REVISED JULY 2017
www.ti.com
Table of Contents
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
6.7 Typical DC Characteristics........................................ 7
6.8 Typical AC Characteristics........................................ 7
Parameter Measurement Information ................ 10
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11
9
10 Power Supply Recommendations ..................... 15
11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15
11.2 Layout Example .................................................... 15
12 Device and Documentation Support ................. 16
12.1 Documentation Support ....................................... 16
12.2 Receiving Notification of Documentation Updates 16
12.3 Community Resources.......................................... 16
12.4 Trademarks........................................................... 16
12.5 Electrostatic Discharge Caution............................ 16
12.6 Glossary................................................................ 16
7
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2017) to Revision A
Page
•
Changed device status from "Advance Information" to " Production Data" ........................................................................... 1
2
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5 Pin Configuration and Functions
YZP Package
8-Pin DSBGA
Laser Marking View
YZP Package
8-Pin DSBGA
Bump View
D
C
GND
ON
D
C
ON
GONND
VOUT
VOUT
VIN
VIN
VOUT
B
A
B
A
VIN
VOUT
VIN
VIN
2
VOUT
1
VOUT
1
VIN
2
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
GND
NO.
D1
D2
A2
B2
C2
A1
B1
C1
GND
I
Ground
ON
Switch control input. Do not leave floating
VIN
I
Switch input
VOUT
O
Switch output
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
MAX
UNIT
VIN
Input voltage
4
4
4
4
6
V
V
V
A
A
VOUT
VON
IMAX
IPLS
TJ
Output voltage
ON voltage
Maximum continuous switch current
Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle
Maximum junction temperature
Storage temperature
Internally Limited
–65 150
Tstg
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX UNIT
VIN
VOUT
VIH
VIL
TJ
Input voltage
0.65
3.6
VIN
V
V
Output voltage
High-level input voltage, ON
Low-level input voltage, ON
Operating temperature
Operating free-air temperature
0.9
0
3.6
V
0.45
125
105
V
–40
–40
°C
°C
TA
6.4 Thermal Information
TPS22970
(1)
THERMAL METRIC
YZP (DSBGA)
UNIT
8 PINS
130
54
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
51
Junction-to-top characterization parameter
Junction-to-board characterization parameter
1
ψJB
50
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
Unless otherwise noted, VIN = 0.65 V to 3.6 V
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
25°C
30
65
VIN > 1.2 V
VIN ≤ 1.2 V
VIN > 1.8 V
VIN ≤ 1.8 V
75
µA
50
VOUT = Open,
Switch enabled
IQ
Quiescent current
20
1
55
7.5
18
µA
5
VOUT = GND, Switch
disabled
ISD
Shutdown current
0.9
4.7
9.5
8.5
VIN ≥ 1.8 V
VIN = 1.2 V
VIN = 1.05 V
VIN = 0.65 V
–40°C to +85°C
–40°C to +105°C
25°C
9.5
11.5
9.1
4.9
5.1
6.4
–40°C to +85°C
–40°C to +105°C
25°C
10.1
12.1
mΩ
9.4
RON
ON-resistance
IOUT = –200 mA
–40°C to +85°C
–40°C to +105°C
25°C
10.4
12.4
11.5
12.5
14.5
Ω
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
VIN = 3.6 V
150
710
Output pull down
resistance(1)
IOUT = 3 mA, Switch
disabled
RPD
VIN = 0.65 V
Ω
ON input leakage
current
ION
VON = 0 V to 3.6 V
–40°C to +105°C
0.1
µA
°C
°C
TSD
Thermal shutdown
Junction temperature rising
Junction temperature falling
170
30
Thermal shutdown
hysteresis
TSD, HYS
(1) See the Quick Output Discharge (QOD) section.
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6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIN = 3.6 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT Rise time
VOUT Fall time
ON delay time
CL = 0.1 µF, RL = 10 Ω
1530
3.2
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
985
1.8
µs
µs
µs
tF
tD
550
VIN = 1.8 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
1170
4.9
Turn-OFF time
VOUT Rise Time
VOUT Fall time
ON delay time
645
2.2
tF
tD
525
VIN = 0.65 V, VON = 3.6 V,
TA = 25°C (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT Rise time
VOUT Fall time
ON delay time
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
CL = 0.1 µF, RL = 10 Ω
815
61
320
6.3
495
tF
tD
6
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6.7 Typical DC Characteristics
45
9
8
7
6
5
4
3
2
1
0
VIN
3.6 V
2.5 V
1.8 V
=
VIN
3.6 V
=
1.2 V
1.05 V
0.65 V
1.2 V
40
35
30
25
20
15
10
5
2.5 V
1.8 V
1.05 V
0.65 V
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D001
D002
VON = 3.6 V
VOUT = Open
VON = 0 V
VOUT = GND
Figure 1. Quiescent Current vs Temperature
Figure 2. Input Shutdown Current vs Temperature
1000
900
800
700
600
500
400
300
200
100
9
8
7
6
5
4
3
VIN
3.6 V
0.65 V
=
VIN
3.6 V
2.5 V
1.8 V
=
1.2 V
1.05 V
0.65 V
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D003
D004
VON = 3.6 V
IOUT = -200 mA
VON = 0 V
IOUT = 3 mA
Figure 3. On-Resistance vs Temperature
Figure 4. Output Pull-Down Resistance vs Temperature
6.8 Typical AC Characteristics
2100
1900
1700
1500
1300
1100
900
80
VIN =
3.6 V
1.8 V
VIN =
3.6 V
1.8 V
1.05 V
0.65 V
1.05 V
0.65 V
70
60
50
40
30
20
10
0
700
500
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D005
D006
Figure 5. Turn-ON Time vs Temperature
Figure 6. Turn-OFF Time vs Temperature
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Typical AC Characteristics (continued)
1400
8
7
6
5
4
3
2
1
VIN =
3.6 V
1.8 V
VIN =
3.6 V
1.8 V
1.05 V
0.65 V
1.05 V
0.65 V
1200
1000
800
600
400
200
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D007
D008
RL = 10 Ω
CL = 0.1 µF
Figure 7. Rise Time vs Temperature
Figure 8. Fall Time vs Temperature
800
750
700
650
600
550
500
450
400
350
300
250
VIN =
3.6 V
1.8 V
1.05 V
0.65 V
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
D009
RL = 10 Ω
CL = 0.1 µF
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
Figure 9. Delay Time vs Temperature
Figure 10. Turn-ON Response at 3.6 VIN
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
Figure 11. Turn-ON Response at 1.8 VIN
Figure 12. Turn-ON Response at 0.65 VIN
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Typical AC Characteristics (continued)
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
Figure 13. Turn-OFF Response at 3.6 VIN
Figure 14. Turn-OFF Response at 1.8 VIN
RL = 10 Ω
TA = 25°C
CL = 0.1 µF
RL = OPEN
TA = 25°C
CL = 147 µF
Figure 15. Turn-OFF Response at 0.65 VIN
Figure 16. Inrush Current at 3.6 VIN
RL = OPEN
TA = 25°C
CL = 147 µF
Figure 17. Inrush Current at 0.65 VIN
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7 Parameter Measurement Information
VIN
VOUT
SMPS
CIN
OFF
CL
ON
RL
ON
TPS22970
GND
GND
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Figure 18. TPS22970 Test Circuit
Figure 19. tON and tOFF Waveforms
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8 Detailed Description
8.1 Overview
The TPS22970 is a single channel, 4-A load switch in a small, space-saving WCSP-8 package. This device
implements a low resistance N-channel MOSFET with a controlled rise time for applications that need to limit the
inrush current.
This device is also designed to have very low leakage current during off state, which prevents downstream
circuits from pulling high standby current from the supply. Integrated control logic, driver, power supply, and
output discharge FET eliminates the need for additional external components, which reduces solution size and
bill of materials (BOM) count.
8.2 Functional Block Diagram
V
IN
Charge
Pump
Control
Logic
ON
V
OUT
GND
8.3 Feature Description
8.3.1 On and Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON has a low threshold,
making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic. It
can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs. This pin does not have an internal
bias and must not be left floating for proper functionality.
8.3.2 Quick Output Discharge (QOD)
The TPS22970 includes a QOD feature. When the switch is disabled, a discharge resistor is connected between
VOUT and GND. This resistor has a typical value of 150 Ω and prevents the output from floating while the switch
is disabled. The QOD pull-down resistance can vary with input voltage and temperature, see Figure 4
8.4 Device Functional Modes
Table 1 lists the functional modes for the TPS22970.
Table 1. Function Table
TPS22970
ON-Pin
Below VIL
Above VIH
VIN to VOUT
OFF
VOUT to GND
ON
ON
OFF
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Thermal Consideration
It is recommended to limit the junction temperature (TJ) to below 125°C. To calculate the maximum allowable
dissipation, PD(max) for a given output current and ambient temperature, use Equation 1 as a guideline.
TJ(max) - TA
=
P
D(max)
θJA
where
•
•
•
•
PD(max) is maximum allowable power dissipation
TJ(max) is maximum allowable junction temperature
TA is ambient temperature of the device
ΘJA is junction to air thermal impedance. See the Thermal Information section. This parameter is highly
dependent upon board layout
(1)
9.2 Typical Application
VIN
VOUT
SMPS
CIN
OFF
CL
ON
RL
ON
TPS22970
GND
GND
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Figure 20. Typical Application Circuit
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Typical Application (continued)
9.2.1 Design Requirements
For this design example, below, use the input parameters shown in Table 2.
Table 2. Design Parameters
DESIGN PARAMETER
VIN
EXAMPLE VALUE
0.65 V to 3.6 V
10 mA
ILOAD
Load Capacitance (CL)
Maximum voltage drop
Maximum Inrush Current
800 µF
1%
2.5 A
9.2.2 Detailed Design Procedure
9.2.2.1 Maximum Voltage Drop and On-Resistance
At 3.6-V input voltage, with a maximum voltage drop tolerance of 1%, the TPS22970 has a typical RON of 4.7
mΩ. The rail is supplying 10 mA of current; the voltage drop for a rail is calculated based on Equation 2 and
Equation 3.
VDROP = RON × ILOAD
VDROP = 0.047 mV
(2)
(3)
The maximum voltage drop is 1% which is 36 mV. The voltage drop caused by the load current across the on
resistance is 0.047 mV.
9.2.2.2 Managing Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0 V to VIN. This charge arrives in the
form of inrush current. Inrush current may be calculated using Equation 4.
CLì0.8ìVIN
IINRUSH = CL ì SR =
tR
where
•
•
•
•
•
IINRUSH is the Inrush current
CL is the Load capacitance
SR is the Output Slew Rate
VIN is the Input voltage
tR is the Rise time
(4)
The typical rise time is 985 μs at VIN = 3.6 V. When CL = 800 µF, the expected inrush current limit at the typical
rise time is 2.34 A.
The typical rise time is 320 μs at VIN = 0.65 V. When CL = 800 µF, the expected inrush current limit at the typical
rise time is 1.3 A.
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9.2.3 Application Curves
VIN = 3.6 V
RL = OPEN
VON = 3.6 V
TA = 25°C
CIN = 1 µF
VIN = 0.65 V
RL = OPEN
VON = 3.6 V
TA = 25°C
CIN = 1 µF
CL = 800 µF
CL = 800 µF
Figure 21. TPS22970 Inrush Current at 3.6 VIN With CL
800 µF
=
Figure 22. TPS22970 Inrush Current at 0.65 VIN With CL
800 µF
=
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10 Power Supply Recommendations
The device is designed to operate from a VIN range of 0.65 V to 3.6 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance of 1 µF is sufficient to prevent the
supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to
a large transient current or large load current step, additional bulk capacitance may be required on the input.
11 Layout
11.1 Layout Guidelines
All traces must be as short as possible for best performance. Using wide traces for VIN, VOUT, and GND helps
minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.
11.2 Layout Example
VIA to Power Ground Plane
VOUT Bypass
Capacitor
VIN Bypass
Capacitor
VOUT
VOUT
VIN
VIN
VOUT
GND
VIN
ON
To GPIO
control
Figure 23. TPS22970 Package Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
TPS22970 Load Switch Evaluation Module
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
NanoFree is a trademark of Nanofree TM.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
16
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Copyright © 2017, Texas Instruments Incorporated
Product Folder Links: TPS22970
TPS22970
www.ti.com
SLVSDF2A –MAY 2017–REVISED JULY 2017
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
(1) All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.
(2) This drawing is subject to change without notice.
(3) NanoFree™ package configuration.
Copyright © 2017, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: TPS22970
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS22970YZPR
TPS22970YZPT
ACTIVE
ACTIVE
DSBGA
DSBGA
YZP
YZP
8
8
3000 RoHS & Green
250 RoHS & Green
SAC396
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 105
-40 to 105
1CNI
1CNI
SAC396
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22970YZPR
TPS22970YZPT
DSBGA
DSBGA
YZP
YZP
8
8
3000
250
180.0
180.0
8.4
8.4
1.02
1.02
2.02
2.02
0.63
0.63
2.0
2.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2017
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22970YZPR
TPS22970YZPT
DSBGA
DSBGA
YZP
YZP
8
8
3000
250
182.0
182.0
182.0
182.0
20.0
20.0
Pack Materials-Page 2
PACKAGE OUTLINE
YZP0008
DSBGA - 0.5 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.19
0.15
BALL TYP
0.5 TYP
D
C
B
SYMM
1.5
TYP
D: Max = 1.89 mm, Min = 1.83 mm
E: Max = 0.89 mm, Min = 0.83 mm
0.5
TYP
A
0.25
0.21
8X
1
2
0.015
C A B
SYMM
4223082/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.23)
2
1
A
(0.5) TYP
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
(
0.23)
SOLDER MASK
OPENING
0.05 MAX
0.05 MIN
SOLDER MASK
OPENING
(
0.23)
METAL
METAL UNDER
SOLDER MASK
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223082/A 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
(0.5)
TYP
B
C
SYMM
METAL
TYP
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4223082/A 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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