TPS22971YZPR [TI]
具有可调节上升时间、电源正常指示和输出放电功能的 3.6V、3A、6.7mΩ 负载开关 | YZP | 8 | -40 to 85;
| 型号： | TPS22971YZPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有可调节上升时间、电源正常指示和输出放电功能的 3.6V、3A、6.7mΩ 负载开关 | YZP | 8 | -40 to 85 开关 |
| 文件： | 总28页 (文件大小：1181K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
TPS22971 具备可调节快速接通电源和电源正常的 3.6V，3A，6.7mΩ 导通
阻抗负载开关
1 特性
3 说明
1
•
•
输入电压范围 (VIN)：0.65V 至 3.6V
导通电阻
TPS22971是一款节省空间的单通道负载开关，具有受
控和可调节的接通转换率和集成的电源正常指示器。该
器件包括一个 N 通道金属氧化物半导体场效应晶体管
(MOSFET)，可在 0.65V 至 3.6V 的低输入电压范围内
运行，可支持 3A 的最大持续电流。6.7mΩ 的低导通
电阻可最大限度降低功耗和整个负载开关的压降。开关
可由一个打开和关闭输入 (ON) 控制，此输入可与低压
控制信号直接连接。
–
–
–
RON = 6.7mΩ（VIN ≥ 1.8V 时的典型值）
RON = 7.2mΩ（VIN = 1.05V 时的典型值）
RON = 8.9mΩ（VIN = 0.65V 时的典型值）
•
•
•
•
最大持续开关电流 (IMAX)：3A
导通状态 (IQ)：30µA（3.6 VIN时的典型值）
断开状态 (ISD)：1µA（3.6 VIN时的典型值）
通过 CT 引脚的可调节转换率
默认情况下，TPS22971 有快速打开时间，以最大程
度减少系统启动和等待时间。也可以减小可调节转换率
以限制浪涌电流。电源正常 (PG) 信号在内部监控栅极
阈值，并指示开关何时完全接通电源。禁用开关时，一
个 150Ω 的片上电阻可快速将输出电压对地放电，防
止其浮动。
–
在 VIN = 1V 时，快速接通电源时间 ≤ 65µs
•
•
打开开关后的电源正常 (PG) 指示器
低阈值启用 (ON) 0.9V (VIH) 支持使用低电压控制逻
辑单元
•
•
热关断 (TSD
)
快速输出放电 (QOD)：150Ω（典型值）
TPS22971 采用超小型节省空间的 8 引脚 WCSP 封
装，可在 –40°C 至 105°C 的大气温度范围内运作，并
集成了热关断和关闭功能，以防过热。
2 应用
•
•
•
•
•
笔记本电脑，平板电脑
工业 PC
智能手机
电信
器件信息(1)
器件型号
TPS22971
封装
DSBGA (8)
封装尺寸（标称值）
1.90mm × 0.90mm
存储
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
典型应用
Power Supply
VIN
VOUT
CIN
RPU
VIN
CT
VOUT
PG
CL
RL
PG
CT
ON
OFF
ON
GND
TPS22971
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSDK7
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
目录
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 17
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
6.7 Typical DC Characteristics........................................ 7
6.8 Typical AC Characteristics........................................ 7
Parameter Measurement Information ................ 11
Detailed Description ............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12
9
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 器件和文档支持 ..................................................... 20
12.1 文档支持 ............................................................... 20
12.2 接收文档更新通知 ................................................. 20
12.3 社区资源................................................................ 20
12.4 商标....................................................................... 20
12.5 静电放电警告......................................................... 20
12.6 Glossary................................................................ 20
13 机械、封装和可订购信息....................................... 20
7
8
4 修订历史记录
Changes from Original (April 2017) to Revision A
Page
•
已更改 将器件状态从“高级信息”更改为“生产数据”.................................................................................................................. 1
Changes from Revision A (July 2017) to Revision B
Page
•
•
•
已删除 从器件信息 表的器件型号中删除了 YZPT................................................................................................................... 1
已更改 将特性 部分中的 1.1µA 更改成了 1µA ........................................................................................................................ 1
已删除 删除了重复封装图 ....................................................................................................................................................... 1
2
Copyright © 2017, Texas Instruments Incorporated
TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
5 Pin Configuration and Functions
YZP Package
8-Pin DSBGA
Laser Marking View
YZP Package
8-Pin DSBGA
Bump View
D
C
B
A
ON
CT
GND
PG
ON
CT
D
C
B
A
GND
PG
VOUT
VIN
VIN
VOUT
VOUT
VIN
VIN
2
VOUT
1
2
1
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
VOUT slew rate control. Adding capacitance from this pin to ground lowers the output slew
rate
CT
C2
O
GND
ON
D1
D2
GND
Ground
I
Switch enable control input. Do not leave floating
PG
C1
O
O
I
Power Good Indication. Open drain releases when the switch is fully on
VOUT
VIN
A1, B1
A2, B2
Switch output
Switch input
Copyright © 2017, Texas Instruments Incorporated
3
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
MAX
UNIT
V
VIN
Input voltage
4
4
4
4
3
4
VOUT
VON
VPG
IMAX
IPLS
TJ
Output voltage
V
ON voltage
V
PG voltage
V
Maximum continuous switch current
Maximum pulsed switch current, pulse < 300-µs, 2% duty cycle
Maximum junction temperature
Storage temperature
A
A
Internally Limited
–65 150
Tstg
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
3.6
UNIT
V
VIN
VOUT
VIH
VIL
TJ
Input voltage
0.65
Output voltage
VIN
V
High-level input voltage, ON
Low-level input voltage, ON
Operating temperature
Operating free-air temperature
CT pin capacitor voltage rating
0.9
0
3.6
V
0.45
125
105
V
–40
–40
7
°C
°C
V
TA
CT
6.4 Thermal Information
TPS22971
(1)
THERMAL METRIC
YZP (DSBGA)
UNIT
8 PINS
130
54
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
51
Junction-to-top characterization parameter
Junction-to-board characterization parameter
1
ψJB
50
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2017, Texas Instruments Incorporated
TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
6.5 Electrical Characteristics
Unless otherwise noted, VIN = 0.65 V to 3.6 V
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
–40°C to +85°C
–40°C to +105°C
25°C
30
65
VIN > 1.2 V
VIN ≤ 1.2 V
VIN > 1.8 V
VIN ≤ 1.8 V
75
µA
50
VOUT = Open,
Switch enabled
IQ
Quiescent current
20
1
55
7.5
18
µA
5.5
VOUT = GND, Switch
disabled
ISD
Shutdown current
0.9
6.7
9.5
10
12
12
10
12
VIN ≥ 1.8 V
VIN = 1.2 V
VIN = 1.05 V
VIN = 0.65 V
–40°C to +85°C
–40°C to +105°C
25°C
6.9
7.2
8.9
–40°C to +85°C
–40°C to +105°C
25°C
13
mΩ
RON
ON-resistance
IOUT = –200 mA
10.5
–40°C to +85°C
–40°C to +105°C
25°C
13
14
14
18
19
Ω
–40°C to +85°C
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
VIN = 3.6 V
150
710
Output pull down
resistance(1)
IOUT = 3 mA, Switch
disabled
RPD
VIN = 0.65 V
Ω
ON input leakage
current
ION
VON =0 V to 3.6 V
VPG = 0 V to 3.6 V
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
0.1
8.5
0.2
µA
µA
Leakage current into
PG pin
IPG,LK
VON ≤ VIL
0.1
VON ≥ VIH, IPG = 1
mA
VPG,OL
TSD
PG output low voltage VPG = 0 V to 3.6 V
V
Thermal shutdown
TJ rising
TJ falling
170
30
°C
°C
Thermal shutdown
hysteresis
TSD, HYS
(1) See the Quick Output Discharge (QOD) section.
Copyright © 2017, Texas Instruments Incorporated
5
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
6.6 Switching Characteristics
All typical values are at 25°C unless otherwise noted
PARAMETER
VIN = 3.6 V
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CT = 0 pF
54
198
1520
35
tON
Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
tR
VOUT Rise time
PG Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
150
1230
134
314
1990
1.9
µs
tPG,ON
CT = 1000 pF
CT = 10000 pF
tPG,OFF
tOFF
PG Turn-Off time
Turn-Off time
3.5
tF
VOUT Fall time
CL = 0.1 µF, RL = 10 Ω
2.1
VIN = 1.8 V
CT = 0 pF
41
126
857
21
tON
Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
tR
VOUT Rise time
PG Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
82
628
105
220
1230
0.8
µs
tPG,ON
CT = 1000 pF
CT = 10000pF
tPG,OFF
tOFF
PG Turn-Off time
Turn-Off time
4.8
tF
VOUT Fall time
CL = 0.1 µF, RL = 10 Ω
2.1
VIN = 0.65 V
CT = 0 pF
54
127
720
21
tON
Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
tR
VOUT Rise time
PG Turn-On time
CT = 1000 pF
CT = 10000 pF
CT = 0 pF
61
386
165
290
1290
0.5
55
µs
tPG,ON
CT = 1000 pF
CT = 10000 pF
tPG,OFF
tOFF
tF
PG Turn-Off time
Turn-Off time
VOUT Fall time
CL = 0.1 µF, RL = 10 Ω
8
VIN = 1 V, TA = 0°C to 85°C
tON Fast Turn-On time
CT = 0 pF
30
65
µs
6
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TPS22971
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ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
6.7 Typical DC Characteristics
45
10
8
VIN
3.6 V
2.5 V
1.8 V
=
VIN
3.6 V
=
1.2 V
1.05 V
0.65 V
1.2 V
40
35
30
25
20
15
10
5
2.5 V
1.8 V
1.05 V
0.65 V
6
4
2
0
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D001
D002
VON = 3.6 V
IOUT = 0
VON = 0 V
VOUT = 0
图 1. Quiescent Current vs Temperature
图 2. Input Shutdown Current vs Temperature
12
10
8
1000
800
600
400
200
0
VIN
3.6 V
2.5 V
1.8 V
=
VIN =
3.6 V
0.65 V
1.2 V
1.05 V
0.65 V
6
4
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D003
D005
VON = 3.6 V
IOUT = -200 mA
VON = 3.6 V
Initially VOUT = VIN
图 3. On-Resistance vs Temperature
图 4. Output Pull-Down Resistance vs Temperature
6.8 Typical AC Characteristics
80
75
70
65
60
55
50
45
40
35
30
25
52.5
50
VIN
0.65 V
0.8 V
1 V
=
Fast tON
1.5 V
1.8 V
2.5 V
3.6 V
47.5
45
1.2 V
42.5
40
37.5
35
32.5
30
27.5
25
-40 -25 -10
5
20
35
50
65
80
95 105
-60 -40 -20
0
20
40
60
80 100 120 140
Temperature (°C)
Temperature (èC)
D007
D006
VIN = 1V
CT = 0 pF
CL = 0.1 µF
RL = 10 Ω
图 5. Turn-On Time vs Temperature
图 6. Fast Turn-On Time vs Temperature
版权 © 2017, Texas Instruments Incorporated
7
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
Typical AC Characteristics (接下页)
50
205
190
175
160
145
130
115
100
85
VIN
=
VIN
1 V
1.2 V
=
0.65 V
0.8 V
1 V
1.5 V
1.8 V
2.5 V
3.6 V
0.65 V
0.8 V
1.5 V
1.8 V
2.5 V
3.6 V
45
40
35
30
25
20
15
10
1.2 V
70
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D009
D012
图 7. Rise Time vs Temperature
图 8. PG Turn-On Time vs Temperature
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
3
2.5
2
VIN
0.65 V
0.8 V
1 V
=
VIN
1 V
1.2 V
=
1.5 V
0.65 V
0.8 V
1.5 V
1.8 V
2.5 V
3.6 V
1.8 V
2.5 V
3.6 V
1.2 V
1.5
1
0.5
0
0
-40 -25 -10
5
20
35
50
65
80
95 105
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
Temperature (°C)
D013
D008
图 9. PG Turn-Off Time vs Temperature
图 10. Turn-Off Time vs Temperature
10
9.5
9
8.5
8
VIN
0.65 V
0.8 V
1 V
=
1.5 V
1.8 V
2.5 V
3.6 V
1.2 V
7.5
7
6.5
6
5.5
5
4.5
4
3.5
3
2.5
2
-40 -25 -10
5
20
35
50
65
80
95 105
Temperature (°C)
D010
RL = 10 Ω
TA = 25°C
CT = 0 pF
RL = 10 Ω
CL = 0.1 μF
CL = 0.1 µF
图 11. Fall Time vs Temperature
图 12. Turn-On Response at 3.6 VIN
8
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TPS22971
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ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
Typical AC Characteristics (接下页)
RL = 10 Ω
CT = 0 pF
CL = 0.1 µF
RL = 10 Ω
TA = 25°C
CT = 0 pF
TA = 25°C
CL = 0.1 µF
图 13. Turn-On Response at 1.8 VIN
图 14. Turn-On Response at 0.65 VIN
RL = 10 Ω
TA = 25°C
CT = 0 pF
RL = 10 Ω
TA = 25°C
CT = 0 pF
CL = 0.1 µF
CL = 0.1 µF
图 15. Turn-Off Response at 3.6 VIN
图 16. Turn-Off Response at 1.8 VIN
RL = 10 Ω
TA = 25°C
CIN = 0 pF
CT = 1000 pF
RL = OPEN
CL = 33 µF
TA = 25°C
CL = 0.1 µF
图 17. Turn-Off Response at 0.65 VIN
图 18. Low Inrush Current at 3.6 VIN
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TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
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Typical AC Characteristics (接下页)
CT = 1000 pF
RL = OPEN
CL = 133 µF
TA = 25°C
CT = 1000 pF
RL = OPEN
CL = 33 µF
TA = 25°C
图 19. High Inrush Current at 3.6 VIN
图 20. Low Inrush Current at 0.65 VIN
CT = 1000 pF
RL = OPEN
CL = 133 µF
TA = 25°C
CT = 0 pF
RL = 10 Ω
CL = 0.1 µF
TA = 25°C
图 21. High Inrush Current at 0.65 VIN
图 22. Fast Turn-On Response
CIN = 0 pF
CL = 0.1 µF
TA = 25°C
RL = 10 Ω
图 23. Fast Turn-Off Response
10
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TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
7 Parameter Measurement Information
Power Supply
VIN
VOUT
CIN
RPU
VIN
CT
VOUT
PG
CL
RL
PG
CT
ON
ON
GND
OFF
TPS22971
Copyright © 2017, Texas Instruments Incorporated
图 24. TPS22971 Test Circuit
图 25. AC Timing Waveforms
版权 © 2017, Texas Instruments Incorporated
11
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
8 Detailed Description
8.1 Overview
The TPS22971 is a single channel, 3-A load switch in a small, space-saving WCSP-8 package. This device
implements a low resistance N-channel MOSFET with a controlled rise time for applications that need to limit the
inrush current.
The controlled rise time for the device greatly reduces inrush current caused by large bulk load capacitances,
thereby reducing or eliminating power supply droop. The adjustable slew rate through CT provides the design
flexibility to trade off the inrush current and power up timing requirements. Integrated PG indicator notifies the
system about the status of the load switch to facilitate seamless power sequencing.
This device is also designed to have very low leakage current during off state, which prevents downstream
circuits from pulling high standby current from the supply. Integrated control logic, driver, power supply, and
output discharge FET eliminates the need for additional external components, which reduces solution size and
bill of materials (BOM) count.
8.2 Functional Block Diagram
PG
VIN
Charge Pump
ON
CT
Control Logic
Driver
VOUT
GND
Copyright © 2017, Texas Instruments Incorporated
8.3 Feature Description
8.3.1 On and Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON has a low threshold,
making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic. It
can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs. This pin does not have an internal
bias and must not be left floating for proper functionality.
12
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ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
Feature Description (接下页)
8.3.2 Controlled Turn-On
The TPS22971 has controlled Turn-On for inrush current control. A capacitor to GND on the CT pin adjusts the
slew rate. For a given input voltage and desired slew rate, 公式 1 can be used to find the required CT value. For
calculated CT values less than 220 pF, use 0 pF instead when solving for tON and tPG,ON
.
VIN
æ
ö
- 3.1´ VIN - 14.2 ´ 800
(
)
ç
è
÷
SR
ø
CT VIN, SR =
(
)
32.5 ´ VIN + 12.5
(
(
)
)
where
•
•
•
CT is the capacitor on the CT pin (in pF)
VIN is the input voltage (in V)
SR is the desired slew rate (in V/µs)
(1)
The CT value determined in 公式 1 can be used to find the total Turn-On time, tON, in 公式 2 or 公式 3 depending
on VIN.
CT
æ
ö
tON VIN ³ 0.95 V, CT = 15 + 33 ´ VIN
´
+
3.9 ´ VIN + 35
(
)
(
)
)
(
(
)
(
)
ç
è
÷
ø
1000
(2)
CT
æ
ö
tON VIN < 0.95 V, CT = 45 + 33 ´ VIN
´
+
3.9 ´ VIN + 55
(
)
(
)
)
(
(
)
(
)
ç
÷
ø
1000
è
where
•
•
•
tON is the Turn-On time (in µs)
CT is the capacitor on the CT pin (in pF)
VIN is the input voltage (in V)
(3)
8.3.3 Power Good (PG)
The TPS22971 has a power good (PG) output signal to indicate the gate of the pass FET is driven high and the
switch is fully on (full load ready). The signal is an active high and open drain output which can be connected to
a voltage source through an external pull up resistor, RPU. This voltage source can be VOUT from the TPS22971
or another external voltage. 公式 4 and 公式 5 show the approximate equation for the relationship between CT
setting, VIN and PG Turn-On time (tPG,ON):
CT
æ
ö
tPG, ON VIN ³ 0.95 V, CT = 40 + 36 ´ VIN
´
+
10.7 ´ VIN + 85
(
)
(
)
)
(
(
)
(
)
ç
è
÷
ø
1000
(4)
CT
æ
ö
tPG, ON VIN < 0.95 V, CT = 80 + 36 ´ VIN
´
+
10.7 ´ VIN + 155
(
)
(
)
)
(
(
)
(
)
ç
÷
ø
1000
è
where
•
•
•
tPG,ON is the PG Turn-On time (in µs)
VIN is the input voltage (in V)
CT is the capacitance value on the CT pin (in pF)
(5)
8.3.4 Quick Output Discharge (QOD)
The TPS22971 includes a QOD feature. When the switch is disabled, a discharge resistor is connected between
VOUT and GND. This resistor has a typical value of 150 Ω and prevents the output from floating while the switch
is disabled. The QOD pull-down resistance can vary with input voltage and temperature, see 图 4.
版权 © 2017, Texas Instruments Incorporated
13
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
8.4 Device Functional Modes
表 1 lists the functional modes for the TPS22971.
表 1. Function Table
TPS22971
VOUT to GND
ON-Pin
Below VIL
Above VIH
VIN to VOUT
OFF
PG to GND
ON
ON
ON
OFF
OFF
14
版权 © 2017, Texas Instruments Incorporated
TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Thermal Consideration
It is recommended to limit the junction temperature (TJ) to below 125°C. To calculate the maximum allowable
dissipation, PD(max) for a given output current and ambient temperature, use 公式 6 as a guideline:
TJ max - TA
(
)
PD max
=
(
)
qJA
where
•
•
•
•
PD(max) is maximum allowable power dissipation
TJ(max) is maximum allowable junction temperature
TA is ambient temperature of the device
ΘJA is junction to air thermal impedance. See the Thermal Information section. This parameter is highly
dependent upon board layout
(6)
9.1.2 PG Pull Up Resistor
The PG output is an open drain signal which connects to a voltage source through a pull up resistor RPU. The PG
signal can be used to drive the enable pins of downstream devices, EN. PG is active high, and its voltage is
given by 公式 7.
VPG = VOUT - I
(
+ IEN,LK ´ R
PU
)
PG,LK
where
•
•
•
•
VOUT is the voltage where PG is tied to
IPG,LK is the leakage current into PG pin
IEN,LK is the leakage current into the EN pin driven by PG
RPU is the pull up resistance
(7)
VPG needs to be higher than VIH,MIN of the EN pin to be treated as logic high. The maximum RPU is determined by
公式 8.
VOUT - V
IH,MIN
RPU,MAX
=
IPG,LK + IEN,LK
(8)
When PG is disabled, with 1 mA current into PG pin (IPG = 1 mA), VPG.OL is less than 0.2 V and treated as logic
low as long as VIL,MAX of the EN pin is greater than 0.2 V. The minimum RPU is determined by 公式 9.
VOUT
RPU,MIN =
IPG + IEN,LK
(9)
RPU can be chosen within the range defined by RPU,MIN and RPU,MAX. RPU = 10 kΩ is used for characterization.
9.1.3 Power Sequencing
The TPS22971 has an integrated power good indicator which can be used for power sequencing. As shown in 图
26, the switch to the second load is controlled by the PG signal from the first switch. This ensures that the power
to load 2 is only enabled after the same power to load 1 is enabled after the first switch has turned on.
版权 © 2017, Texas Instruments Incorporated
15
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
Application Information (接下页)
Power Supply
Load 1
VIN
VOUT
CIN
RPU
VIN
CT
VOUT
PG
CT
ON
GND
MCU
TPS22971
Power Supply
Load 2
VIN
VOUT
CIN
RPU
VIN
CT
VOUT
PG
CT
ON
GND
TPS22971
Copyright © 2017, Texas Instruments Incorporated
图 26. Power Sequencing
16
版权 © 2017, Texas Instruments Incorporated
TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
9.2 Typical Application
Power Supply
VIN
VOUT
CIN
RPU
VIN
CT
VOUT
PG
CL
RL
PG
CT
ON
OFF
ON
GND
TPS22971
Copyright © 2017, Texas Instruments Incorporated
图 27. Typical Application Circuit
9.2.1 Design Requirements
For this design example, below, use the input parameters shown in 表 2.
表 2. Design Parameters
DESIGN PARAMETER
VIN
EXAMPLE VALUE
3.6 V
10 mA
33 μF
1%
ILOAD
Load Capacitance (CL)
Maximum Voltage Drop
Maximum Inrush Current
630 mA
9.2.2 Detailed Design Procedure
9.2.2.1 Maximum Voltage Drop and On-Resistance
At 3.6-V input voltage, with a maximum voltage drop tolerance of 1%, the TPS22971 has a typical RON of 6.7
mΩ. The rail is supplying 10 mA of current; the voltage drop for a rail is calculated based on 公式 10.
VDROP = RON ´ ILOAD
(10)
VDROP = 0.067 mV
(11)
The maximum voltage drop is 1% which is 36 mV. The voltage drop caused by the load current across the on
resistance is 0.067 mV.
9.2.2.2 Managing Inrush Current
When the switch is enabled, the output capacitors must be charged up from 0 V to VIN. This charge arrives in the
form of inrush current. Given a load capacitance (CL) of 33 μF, an input voltage (VIN) of 3.6V and a maximum
inrush (IINRUSH) of 630 mA, use 公式 12 and 公式 13 to solve for Slew Rate (SR).
I
INRUSH
SR =
CL
(12)
SR = 0.0191V / ms
(13)
Now that the desired slew rate has been calculated, use SR and VIN in in 公式 14 to calculate a CT capacitance
value.
CT VIN, SR = 1007 pF
)
(
(14)
A capacitance value of 1007pF is a non-standard value therefore a 1000 pF CT capacitance is used moving
forward.
The calculated CT value can be used with 公式 2 and 公式 4 to determine tON and tPG,ON, respectively as shown
in 公式 15 and 公式 16.
版权 © 2017, Texas Instruments Incorporated
17
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
tON VIN, CT = 182.8 ms
)
(
(15)
(16)
tPG, ON VIN, CT = 293.1ms
)
(
9.2.3 Application Curves
VIN = 3.6 V
RL = OPEN
VON = 3.6 V
TA = 25°C
CIN = 1 µF
CL = 33 µF
VIN = 3.6 V
RL = OPEN
VON = 3.6 V
TA = 25°C
CIN = 1 µF
CL = 33 µF
图 28. TPS22971 Inrush Current With CT = 0 pF
图 29. TPS22971 Inrush Current With CT = 1000 pF
18
版权 © 2017, Texas Instruments Incorporated
TPS22971
www.ti.com.cn
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
10 Power Supply Recommendations
The device is designed to operate from a VIN range of 0.65 V to 3.6 V. The VIN power supply must be well
regulated and placed as close to the device terminal as possible. The power supply must be able to withstand all
transient load current steps. In most situations, using an input capacitance of 1 µF is sufficient to prevent the
supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to
a large transient current or large load current step, additional bulk capacitance may be required on the input.
The requirements for larger input capacitance can be mitigated by adding additional capacitance to the CT pin.
This causes the load switch to turn on more slowly. Not only does this reduce transient inrush current, but it also
gives the power supply more time to respond to the load current step.
11 Layout
11.1 Layout Guidelines
All traces must be as short as possible for best performance. Using wide traces for VIN, VOUT, and GND helps
minimize the parasitic electrical effects along with minimizing the thermal impedance. The CT trace must be as
short as possible to reduce parasitic capacitance.
11.2 Layout Example
图 30. Package Layout Examples
版权 © 2017, Texas Instruments Incorporated
19
TPS22971
ZHCSGK9B –APRIL 2017–REVISED DECEMBER 2017
www.ti.com.cn
12 器件和文档支持
12.1 文档支持
12.1.1 相关文档
请参阅如下相关文档：
《TPS22971 负载开关评估模块用户指南》
12.2 接收文档更新通知
如需接收文档更新通知，请访问 ti.com 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产品
信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.3 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知和修
订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
20
版权 © 2017, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS22971YZPR
TPS22971YZPT
ACTIVE
ACTIVE
DSBGA
DSBGA
YZP
YZP
8
8
3000 RoHS & Green SAC396 | SNAGCU
250 RoHS & Green SAC396 | SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
1CKI
1CKI
Samples
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
12-May-2023
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Jul-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22971YZPR
TPS22971YZPR
TPS22971YZPT
TPS22971YZPT
DSBGA
DSBGA
DSBGA
DSBGA
YZP
YZP
YZP
YZP
8
8
8
8
3000
3000
250
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
1.02
1.0
2.02
2.06
2.06
2.02
0.63
0.63
0.63
0.63
2.0
2.0
2.0
2.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
1.0
250
1.02
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
13-Jul-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22971YZPR
TPS22971YZPR
TPS22971YZPT
TPS22971YZPT
DSBGA
DSBGA
DSBGA
DSBGA
YZP
YZP
YZP
YZP
8
8
8
8
3000
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
250
Pack Materials-Page 2
PACKAGE OUTLINE
YZP0008
DSBGA - 0.5 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.5 MAX
SEATING PLANE
0.05 C
0.19
0.15
BALL TYP
0.5 TYP
D
C
B
SYMM
1.5
TYP
D: Max = 1.89 mm, Min = 1.83 mm
E: Max = 0.89 mm, Min = 0.83 mm
0.5
TYP
A
0.25
0.21
8X
1
2
0.015
C A B
SYMM
4223082/A 07/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.23)
2
1
A
(0.5) TYP
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
(
0.23)
SOLDER MASK
OPENING
0.05 MAX
0.05 MIN
SOLDER MASK
OPENING
(
0.23)
METAL
METAL UNDER
SOLDER MASK
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223082/A 07/2016
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YZP0008
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.5) TYP
8X ( 0.25)
(R0.05) TYP
1
2
A
(0.5)
TYP
B
C
SYMM
METAL
TYP
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
4223082/A 07/2016
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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Copyright © 2023，德州仪器 (TI) 公司
相关型号：
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TI
TPS22975NDSGR
具有可调节上升时间、可选输出放电和热关断功能的 5.7V、6A、16mΩ 负载开关 | DSG | 8 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS22975NDSGT
具有可调节上升时间、可选输出放电和热关断功能的 5.7V、6A、16mΩ 负载开关 | DSG | 8 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS22976
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS22976ADPUR
TPS22976 5.7-V, 6-A, 14-mΩ On-Resistance Dual-Channel Load SwitchWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS22976DPUR
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TPS22976DPUT
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS22976NDPUR
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS22976NDPUT
具有可调节上升时间和可选输出放电功能的 2 通道、5.7V、6A、14mΩ 负载开关 | DPU | 14 | -40 to 105Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
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