TPS536C5 [TI]

适用于 AMD 平台且具有 SVI3 和 PMBus 的 12 相数字降压多相控制器;
TPS536C5
型号: TPS536C5
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

适用于 AMD 平台且具有 SVI3 和 PMBus 的 12 相数字降压多相控制器

控制器
文件: 总14页 (文件大小:1209K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS536C5  
ZHCSQN8 DECEMBER 2022  
TPS536C5 AMD-SVI3 PMBus 接口的  
双通道(N + M ≤ 12 相)D-CAP+、降压多相控制器  
1 特性  
3 说明  
• 输入电压范围4.5V 17V  
• 输出电压范围0.25V 5.5V  
• 支N+M 12 相、M 6 相的双路输出  
• 自带跨电感稳压(TLVR) 拓扑支持  
• 符AMD® SVI3 标准  
• 增强D-CAP+控制可提供卓越的瞬态性能和出  
色的动态电流共享  
• 可编程环路补偿  
• 灵活的相位触发时序控制  
• 单独的相电流校准和报告  
• 可通过可编程电流阈值实现动态切相从而提高轻  
负载和重负载下的效率  
• 快速增相可实现下冲衰减  
• 无驱动器配置有助于实现高效的高频开关  
TI NexFET功率级完全兼容可实现高密度解  
决方案  
TPS536C5 是一款完全符合 AMD SVI3 标准的降压控  
制器具有双通道、内置非易失性存储器 (NVM) 和  
PMBus接口而且与 TI NexFET智能功率级完  
全兼容。D-CAP+架构和下冲衰减 (USR) 等高级控  
制特性可提供快速瞬态响应、低输出电容和良好的电流  
共享。该器件还提供全新的相位交错策略和动态切相功  
可有效提升轻负载条件下的效率。VCORE 压摆率  
和电压定位的可调节控制完善了 AMD SVI3 特性。此  
该器件还支持 PMBus 通信接口可向系统报告遥  
测的电压、电流、功率、温度和故障状况。所有可编程  
参数均可通过 PMBus 接口进行配置而且可作为新的  
默认值存储NVM 以尽可能减少外部组件数量。  
TPS536C5 器件采用热增强型 48 引脚 QFN 封装额  
定工作温度40°C 125°C。  
器件信息  
器件型号(1)  
TPS536C5  
封装尺寸标称值)  
• 精确可调电压定位  
• 获得专利AutoBalance相电流平衡  
• 每相位电流限值可选  
封装  
QFN (48)  
6.00 × 6.00 mm  
PMBus系统接口用于遥测电压、电流、功率、  
温度和故障条件  
(1) 如需了解所有可用封装请参阅数据表末尾的可订购产品附  
录。  
6.00 × 6.00 mm48 0.4 mm QFN 封装  
TPS536C5  
2 应用  
PWM1  
Power  
Stage  
ACSP1  
机架式服务器  
微服务器和塔式服务器  
高性能计算  
PWM2  
ACSP2  
PMBus  
SVI3  
基带单(BBU)  
Power  
Stage  
PWM12  
ACSP12  
Power  
Stage  
Copyright © 2021, Texas Instruments Incorporated  
本文档旨在为方便起见提供有TI 产品中文版本的信息以确认产品的概要。有关适用的官方英文版本的最新信息请访问  
www.ti.com其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前请务必参考最新版本的英文版本。  
English Data Sheet: SLUSEZ6  
 
 
 
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
Table of Contents  
1 特性................................................................................... 1  
2 应用................................................................................... 1  
3 说明................................................................................... 1  
4 Revision History.............................................................. 2  
5 Device and Documentation Support..............................3  
5.1 Documentation Support.............................................. 3  
5.2 接收文档更新通知....................................................... 3  
5.3 支持资源......................................................................3  
5.4 Trademarks.................................................................3  
5.5 Electrostatic Discharge Caution..................................3  
5.6 术语表......................................................................... 3  
6 Mechanical, Packaging, and Orderable Information....4  
6.1 Tape and Reel Information..........................................4  
4 Revision History  
以前版本的页码可能与当前版本的页码不同  
DATE  
REVISION  
NOTES  
December 2022  
*
Initial Release  
Copyright © 2022 Texas Instruments Incorporated  
2
Submit Document Feedback  
Product Folder Links: TPS536C5  
 
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
5 Device and Documentation Support  
5.1 Documentation Support  
5.1.1 Related Documentation  
For related documentation see the following:  
Texas Instruments, Dual channel DCAP+ multiphase controllers: TPS53685, TPS536C5 Technical Reference  
Manual SLUUCN5  
5.2 接收文档更新通知  
要接收文档更新通知请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册即可每周接收产品信息更  
改摘要。有关更改的详细信息请查看任何已修订文档中包含的修订历史记录。  
5.3 支持资源  
TI E2E支持论坛是工程师的重要参考资料可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解  
答或提出自己的问题可获得所需的快速设计帮助。  
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范并且不一定反映 TI 的观点请参阅  
TI 《使用条款》。  
5.4 Trademarks  
D-CAP+, NexFET, AutoBalance, TI E2Eare trademarks of Texas Instruments.  
PMBusis a trademark of SMIF, Inc..  
AMD® is a registered trademark of Advanced Micro Devices, Inc..  
所有商标均为其各自所有者的财产。  
5.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
5.6 术语表  
TI 术语表  
本术语表列出并解释了术语、首字母缩略词和定义。  
Copyright © 2022 Texas Instruments Incorporated  
Submit Document Feedback  
3
Product Folder Links: TPS536C5  
 
 
 
 
 
 
 
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
6 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
6.1 Tape and Reel Information  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
Reel  
Diameter  
(mm)  
Reel  
Width W1  
(mm)  
Package  
Type  
Package  
Drawing  
A0  
(mm)  
B0  
(mm)  
K0  
(mm)  
P1  
(mm)  
W
(mm)  
Pin1  
Quadrant  
Device  
Pins  
SPQ  
TPS536C5RSLR  
VQFN  
RSL  
48  
3000  
330.0  
16.4  
6.3  
6.3  
1.1  
12.0  
16.0  
Q2  
Copyright © 2022 Texas Instruments Incorporated  
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Product Folder Links: TPS536C5  
 
 
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
Device  
Package Type  
VQFN  
Package Drawing Pins  
RSL 48  
SPQ  
Length (mm) Width (mm)  
367.0 367.0  
Height (mm)  
TPS536C5RSLR  
3000  
38.0  
Copyright © 2022 Texas Instruments Incorporated  
Submit Document Feedback  
5
Product Folder Links: TPS536C5  
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
Copyright © 2022 Texas Instruments Incorporated  
6
Submit Document Feedback  
Product Folder Links: TPS536C5  
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
Copyright © 2022 Texas Instruments Incorporated  
Submit Document Feedback  
7
Product Folder Links: TPS536C5  
TPS536C5  
ZHCSQN8 DECEMBER 2022  
www.ti.com.cn  
Copyright © 2022 Texas Instruments Incorporated  
8
Submit Document Feedback  
Product Folder Links: TPS536C5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Dec-2022  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS536C5RSLR  
ACTIVE  
VQFN  
RSL  
48  
3000 RoHS & Green  
NIPDAUAG  
Level-3-260C-168 HR  
-40 to 105  
TPS  
536C5  
Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OUTLINE  
VQFN - 1 mm max height  
RSL0048B  
PLASTIC QUAD FLATPACK- NO LEAD  
A
6.1  
5.9  
B
PIN 1 INDEX AREA  
6.1  
5.9  
1 MAX  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
4.4  
13  
24  
44X 0.4  
12  
23  
SYMM  
49  
4.5  
4.3  
4.4  
1
36  
0.25  
0.15  
48X  
PIN 1 IDENTIFICATION  
(OPTIONAL)  
37  
48  
0.1  
C A B  
C
SYMM  
0.5  
0.3  
0.05  
48X  
4219205/A 02/2020  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
VQFN - 1 mm max height  
RSL0048B  
PLASTIC QUAD FLATPACK- NO LEAD  
(5.8)  
(
4.4)  
SYMM  
48  
37  
48X (0.6)  
48X (0.2)  
1
36  
44X (0.4)  
SYMM  
(5.8)  
10X (1.12)  
49  
6X (0.83)  
(R0.05) TYP  
12  
25  
13  
6X (0.83)  
24  
(Ø0.2) VIA  
10X (1.12)  
TYP  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE: 12X  
0.05 MAX  
0.05 MIN  
ALL AROUND  
ALL AROUND  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED  
METAL  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
EXPOSED METAL  
NON SOLDER MASK  
SOLDER MASK  
DEFINED  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4219205/A 02/2020  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
VQFN - 1 mm max height  
RSL0048B  
PLASTIC QUAD FLATPACK- NO LEAD  
(5.8)  
SYMM  
48  
37  
48X (0.6)  
48X (0.2)  
1
49  
36  
44X (0.4)  
16X  
(
0.92)  
SYMM  
8X (0.56)  
(5.8)  
8X (1.12)  
(R0.05) TYP  
12  
25  
13  
8X (1.12)  
24  
METAL TYP  
8X (0.56)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
EXPOSED PAD  
70% PRINTED COVERAGE BY AREA  
SCALE: 12X  
4219205/A 02/2020  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
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