TPS62821DLCT [TI]
采用 1.5mm x 2mm VSON-HR 封装、具有 1% 精度的 2.4V 至 5.5V 输入、1A 降压转换器 | DLC | 8 | -40 to 125;型号: | TPS62821DLCT |
厂家: | TEXAS INSTRUMENTS |
描述: | 采用 1.5mm x 2mm VSON-HR 封装、具有 1% 精度的 2.4V 至 5.5V 输入、1A 降压转换器 | DLC | 8 | -40 to 125 开关 光电二极管 输出元件 转换器 |
文件: | 总31页 (文件大小:2545K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
精度为 1% 的 TPS6282x 5.5V、1A/2A/3A 降压转换器系列
1 特性
3 说明
1
•
DCS-Control™拓扑
26/25mΩ 内部电源开关 (TPS62823)
TPS6282x 是一款通用且易于使用的同步降压型直流/
直流转换器,具有仅 4µA 的极低静态电流。此系列器
件具有 2.4V 至 5.5V 的输入电压,可提供高达 3A 的
输出电流 (TPS62823)。此产品基于 DCS-Control™拓
扑,可实现快速瞬态响应。
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
输出电流高达 3A (TPS62823)
极低的静态电流:4µA
典型开关频率为 2.2MHz
反馈电压精度为 1%(完整温度范围)
使能 (EN) 和电源正常 (PG) 引脚
可调输出电压范围为 0.6V 至 4V
100% 占空比模式
由于具有内部基准,此产品可在 -40°C 至 125°C 的结
温范围内以高达 1% 的反馈电压精度将输出电压调节
到低至 0.6V。1A/2A/3A 可扩展引脚对引脚器件系列可
实现 BOM 对 BOM 兼容,并可与 470nH 的小型电感
器结合使用。
内部软启动电路
无缝省电模式转换
TPS6282x 可在超轻负载时自动进入省电模式,并能保
持高效率。
欠压闭锁
有源输出放电
逐周期电流限制
该器件 具有 电源正常信号和内部软启动电路。它能够
以 100% 模式运行。在故障保护方面,它加入了断续
电流限制以及热关断功能。
断续短路保护
过热保护
使用 TPS62822 并借助 WEBENCH® 电源设计器
创建定制设计方案
TPS6282x 采用 2 x 1.5mm QFN-8 封装。
器件信息(1)
2 应用
器件号
TPS62821DLC
TPS62822DLC
TPS62823DLC
封装
封装尺寸(标称值)
•
•
•
•
•
•
便携式/电池供电类设备中的 POL 电源
工厂和楼宇自动化
移动计算、网卡
QFN (8)
2.00mm x 1.50mm
固态驱动器
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
数据终端、销售终端
服务器、投影仪、打印机
空白
空白
典型应用电路原理图
效率与输出电流间的关系
空白
空白
空白
空白
空白
2.4 to 5.5V
4.7µF
470nH
VOUT/2A
10µF
SW
VIN
EN
TPS62822
R1
R2
Cff*
VFB=0.6V
1%
FB
PG
PGND
AGND
Copyright © 2017, Texas Instruments Incorporated
* optional
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSDV6
TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
www.ti.com.cn
目录
8.4 Device Functional Modes.......................................... 8
Application and Implementation ........................ 10
9.1 Application Information............................................ 10
9.2 Typical Application ................................................. 10
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Typical Characteristics.............................................. 6
Detailed Description .............................................. 7
8.1 Overview ................................................................... 7
8.2 Functional Block Diagram ......................................... 7
8.3 Feature Description................................................... 8
9
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 器件和文档支持 ..................................................... 22
12.1 器件支持 ............................................................... 22
12.2 相关链接................................................................ 22
12.3 接收文档更新通知 ................................................. 22
12.4 社区资源................................................................ 22
12.5 商标....................................................................... 22
12.6 静电放电警告......................................................... 22
12.7 术语表 ................................................................... 22
13 机械、封装和可订购信息....................................... 22
8
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (February 2018) to Revision B
Page
•
已更改 将 TPS62822 和 TPS62823 的状态改为生产数据器件。 ......................................................................................... 22
Changes from Original (November 2017) to Revision A
Page
•
已更改 将 TPS62821 的状态改为生产数据器件。................................................................................................................ 22
2
Copyright © 2017–2018, Texas Instruments Incorporated
TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
5 Device Comparison Table
(1)
Part Number
TPS62821DLC
TPS62822DLC
TPS62823DLC
Output Current
Output Voltage
1 A
2 A
3 A
Adjustable
Adjustable
Adjustable
(1) For fixed output voltage versions please contact your TI sales representative.
6 Pin Configuration and Functions
space
DLC Package
8 Pin (VQFN)
Top View
PG
1
2
3
4
8
7
6
5
EN
FB
VIN
SW
AGND
NC
PGND
space
Pin Functions
PIN
I/O
DESCRIPTION
NAME
EN
NO.
1
I
I
Enable input (High=Enabled, Low=Disabled). Do not leave floating.
Output voltage feedback. Connect resistive voltage divider to this pin.
Signal ground. Internally connected to the PGND pin. Can be left floating.
Internally not connected. Can be connected to VOUT, GND or left floating.
Power ground
FB
2
AGND
NC
3
4
PGND
SW
5
Power
Power
Power
O
6
Switch node, connected to the internal MOSFET switches.
Supply voltage
VIN
7
PG
8
Power good output. If unused, leave floating or connect to GND.
Copyright © 2017–2018, Texas Instruments Incorporated
3
TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
www.ti.com.cn
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN
-0.3
-0.3
-1.0
-2.5
MAX
UNIT
VIN, FB, EN, PG, NC
SW (DC)
6
Pin Voltage Range
VIN + 0.3
V
SW (DC, in current limit)
SW (AC), less than 10ns(2)
10
1
Power Good Sink Current
mA
°C
Operating Junction Temperature Range, TJ
Storage temperature, Tstg
-40
-65
150
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) While switching.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
2.4
NOM
MAX
5.5
4
UNIT
V
Supply Voltage Range, VIN
Output Voltage Range, VOUT
0.6
V
TPS62821
TPS62822
TPS62823
1
Maximum Output Current, IOUT
2
A
3
Operating Junction Temperature, TJ
7.4 Thermal Information
-40
125
°C
TPS6282x
THERMAL METRIC(1)
DLC (VQFN) 8 PINS
UNIT
JEDEC PCB
114.1
90.2
TPS6282xEVM-005
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
69.9
n/a(2)
n/a(2)
4.3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
43.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
6.6
ψJB
43.7
44.2
n/a
RθJC(bot)
n/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Not applicable to an EVM.
4
Copyright © 2017–2018, Texas Instruments Incorporated
TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
7.5 Electrical Characteristics
over operating junction temperature range (TJ=-40°C to 125°C) and VIN=2.4V to 5.5V. Typical values at VIN=5V and TJ=25°C
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input Voltage range
2.4
5.5
10
V
EN=High, IOUT=0A, device not
switching
IQ
Operating Quiescent Current
4
µA
ISD
Shutdown Current
EN=Low, TJ = -40°C to 85°C
Falling Input Voltage
0.05
2.2
0.5
2.3
µA
V
Undervoltage Threshold
Undervoltage Hysteresis
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
2.1
1.0
VUVLO
160
150
20
mV
Rising Junction Temperature
TSD
°C
CONTROL (EN, PG)
VH
High-Level Threshold Voltage (EN)
V
V
VL
Low-Level Threshold Voltage (EN)
Input Leakage Current (EN, PG)
0.4
ILKG
EN = High, VPG = 5V
10
100
nA
Time from EN=High to 95% of VOUT
nominal
tSS
Soft-Start Time
1.25
ms
Rising (VFB vs regulation target)
Falling (VFB vs regulation target)
Rising (VFB vs regulation target)
Falling (VFB vs regulation target)
94%
90%
96%
92%
98%
94%
Power Good Lower Threshold
Voltage
VPGTL
108%
103%
110%
105%
112%
107%
Power Good Upper Threshold
Voltage
VPGTH
VPGL
tPGD
Power Good Logic Low Level Output
Voltage
IPG = -1mA
0.4
V
rising
falling
100
20
Power Good delay
µs
POWER SWITCH
FSW
Switching Frequency
PWM Mode Operation
TPS62821
2.2
35
MHz
High-Side FET ON-Resistance
Low-Side FET ON-Resistance
High-Side FET Current Limit
TPS62822
35
RDS(on)
mΩ
TPS62823
26
TPS62821,2,3
TPS62821
25
1.7
2.7
3.7
2.1
3.3
4.3
2.4
3.7
5.0
ILIM
TPS62822
A
TPS62823
OUTPUT
ILKG_FB
VFB
Input Leakage Current (FB)
Feedback Voltage Accuracy
Output Discharge Current
DC Load Regulation
EN=High, VFB=0.6V
PWM Mode
10
600
400
0.2
50
nA
mV
mA
%/A
%/V
594
75
606
IDIS
EN=Low, VSW = 0.4V
PWM Mode Operation
PWM Mode Operation
DC Line Regulation
0.05
版权 © 2017–2018, Texas Instruments Incorporated
5
TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
www.ti.com.cn
.0
7.6 Typical Characteristics
图 1. Quiescent Current
图 2. Shutdown Current
图 3. High-Side Switch Resistance (TPS62821/2)
图 4. High-Side Switch Resistance (TPS62823)
图 5. Low-Side Switch Resistance (TPS62821/2/3)
图 6. Active Output Discharge Current (EN=Low)
版权 © 2017–2018, Texas Instruments Incorporated
6
TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
8 Detailed Description
8.1 Overview
The TPS6282x are synchronous step-down converters based on the DCS-Control™ topology with an adaptive
constant on-time control and a stabilized switching frequency. It operates in PWM (pulse width modulation) mode
for medium to heavy loads and in PSM (power save mode) at light load conditions, keeping the output voltage
ripple small. The nominal switching frequency is about 2.2MHz with a small and controlled variation over the
input voltage range. As the load current decreases, the converter enters PSM, reducing the switching frequency
to keep efficiency high over the entire load current range. Since combining both PWM and PSM within a single
building block, the transition between modes is seamless and without effect on the output voltage. The devices
offer both excellent dc voltage and fast load transient regulation, combined with a very low output voltage ripple.
8.2 Functional Block Diagram
space
VPGTH
Control Logic
EN
PG
VFB
Thermal
Shutdown
VPGTL
Soft-Start
UVLO
VFB
VIN
Ramp
VSW
FB
VIN
Peak Current Detect
errAmp
VREF
Comp
HICCUP
VSW
Modulator
Gate Drive
AGND
SW
TON
VIN VSW
Zero Current Detect
VREF
SW
EN
VREF
NC
PGND
Discharge
版权 © 2017–2018, Texas Instruments Incorporated
7
TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
www.ti.com.cn
8.3 Feature Description
8.3.1 Enable / Shutdown and Output Discharge
The device starts operation, when Enable (EN) is set High. The input threshold levels are typically 0.9V for rising
and 0.7V for falling signals. Do not leave EN floating. Shutdown is forced if EN is pulled Low with a shutdown
current of typically 50nA. During shutdown, the internal power MOSFETs as well as the entire control circuitry are
turned off and the output voltage is actively discharged through the SW pin by a current sink. Therefore, VIN must
remain present for the discharge to function.
8.3.2 Soft-Start
About 250µs after EN goes High, the internal soft-start circuitry controls the output voltage during startup. This
avoids excessive inrush current and ensures a controlled output voltage rise time of about 1ms. It also prevents
unwanted voltage drops from high-impedance power sources or batteries. TPS6282x can start into a pre-biased
output.
8.3.3 Power Good (PG)
The TPS6282x has a built in power good (PG) function. The PG pin goes high impedance, when the output
voltage has reached its nominal value. Otherwise, including when disabled, in UVLO or in thermal shutdown, PG
is Low (see 表 1). The PG function is formed with a window comparator, which has an upper and lower voltage
threshold (see Electrical Characteristics). The PG pin is an open drain output that requires a pull-up resistor and
can sink up to 1mA. If not used, the PG pin can be left floating or connected to GND.
表 1. Power Good Pin Logic
PG Logic Status
Device State
FB ≥ VPGTL and VFB ≤ VPGTH
High Impedance
Low
V
√
Enable (EN=High)
V
FB ≤ VPGTL or VFB ≥ VPGTH
√
√
√
√
Shutdown (EN=Low)
UVLO
0.7 V < VIN < VUVLO
TJ > TSD
Thermal Shutdown
Power Supply Removal
VIN < 0.7 V
√
At startup, PG transitions from low to floating about 100µs after the output voltage has reached regulation. Once
in operation, PG has a deglitch delay of about 20µs before going low. When the output voltage returns to
regulation, the same 100µs delay occurs.
8.3.4 Undervoltage Lockout (UVLO)
The undervoltage lockout (UVLO) function prevents misoperation of the device, if the input voltage drops below
the UVLO threshold. It is set to about 2.2V with a hysteresis of typically 160mV.
8.3.5 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 150°C
(typ.), the device goes in thermal shutdown with a hysteresis of typically 20°C. Once the TJ has decreased
enough, the device resumes normal operation.
8.4 Device Functional Modes
8.4.1 Pulse Width Modulation (PWM) Operation
At load currents larger than half the inductor ripple current, the device operates in pulse width modulation in
continuous conduction mode (CCM).
The PWM operation is based on an adaptive constant on-time control with stabilized switching frequency. To
achieve a stable switching frequency in a steady state condition, the on-time is calculated as:
space
8
版权 © 2017–2018, Texas Instruments Incorporated
TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
Device Functional Modes (接下页)
VOUT
TON
=
× 450ns
V
IN
(1)
space
With that, the typical switching frequency is about 2.2MHz.
8.4.2 Power Save Mode (PSM) Operation
To maintain high efficiency at light loads, the device enters power save mode (PSM) at the boundary to
discontinuous conduction mode (DCM). This happens when the output current becomes smaller than half of the
inductor's ripple current. The device operates now with a fixed on-time and the switching frequency further
decreases proportional to the load current. It can be calculated as:
space
2×IOUT
fPSM
=
V
V -V
é
ù
TO2N
×
IN
IN
OUT
ê
ú
VOUT
L
ë
û
(2)
space
In PSM, the output voltage rises slightly above the nominal target, which can be minimized using larger output
capacitance. At duty cycles larger than 90%, the device may not enter PSM. The device maintains output
regulation in PWM mode.
8.4.3 Minimum Duty Cycle and 100% Mode Operation
There is no limitation for small duty cycles, since even at very low duty cycles the switching frequency is reduced
as needed to always ensure a proper regulation.
If the output voltage level comes close to the input voltage, the device enters 100% mode. While the high-side
switch is constantly turned on, the low-side switch is switched off. The difference between VIN and VOUT is
determined by the voltage drop across the high-side FET and the dc resistance of the inductor. The minimum VIN
that is needed to maintain a specific VOUT value is estimated as:
space
VIN(min) =VOUT + IOUT (RDS(on) + RDC(L)
space
)
(3)
8.4.4 Current Limit and Short Circuit Protection
The peak switch current of TPS6282x is internally limited, cycle by cycle, to a maximum dc value as specified in
Electrical Characteristics. This prevents the device from drawing excessive current in case of externally caused
over current or short circuit condition. Due to an internal propagation delay of about 60ns, the actual ac peak
current can exceed the static current limit during that time.
If the current limit threshold is reached, the device delivers its maximum output current. Detecting this condition
for 32 switching cycles (about 13µs), the device turns off the high-side MOSFET for about 100µs which allows
the inductor current to decrease through the low-side MOSFET's body diode and then restarts again with a soft
start cycle. As long as the overload condition is present, the device hiccups that way, limiting the output power.
版权 © 2017–2018, Texas Instruments Incorporated
9
TPS62821, TPS62822, TPS62823
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
www.ti.com.cn
9 Application and Implementation
space
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
space
9.1 Application Information
The TPS6282x is a switched mode step-down converter, able to convert a 2.4-V to 5.5-V input voltage into a
lower 0.6-V to 4-V output voltage, providing up to 3A continuous output current (TPS62823). It needs a very low
amount of external components. Apart from the inductor and the output and input capacitors, additional parts are
only needed to set the output voltage and to enable the Power Good (PG) feature.
9.2 Typical Application
space
2.4 to 5.5V
470nH
VOUT/2A
SW
VIN
EN
VPG
TPS62822
C1
R3
R1
R2
Cff*
C2
C3*
FB
PG
PGND
AGND
Copyright © 2017, Texas Instruments Incorporated
* optional
图 7. A typical 2.4 to 5.5-V, 2-A Power Supply
space
9.2.1 Design Requirements
The following design guideline provides a range for the component selection to operate within the recommended
operating conditions. 表 2 shows the components selection that was used for the measurements shown in the
Application Curves.
表 2. List of Components
REFERENCE
DESCRIPTION
5.5-V, step-down converter
MANUFACTURER
TPS6282xDLC, Texas Instruments
XFL4015-471MEB, Coilcraft
JMK107BB7475MA-T, Taiyo Yuden
GRM188Z71A106MA73D, MuRata
GRM1885C1H121JA01D, MuRata
Standard
IC
L1
C1
470 nH ±20%, 7.6mΩ DCR, 6.6A ISAT
4.7 µF ±20%, 6.3V, ceramic, 0603, X7R
10 µF ±20%, 10V, ceramic, 0603, X7R
120pF ±5%, 50V, 0603
C2, C3
Cff
R1, R2
R3
Depending on VOUT, chip, 0603
100-kΩ, chip, 0603, 0.1W, 1%
Standard
10
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TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62822 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Setting the Adjustable Output Voltage
While the device regulates the feedback voltage to 0.6V, the output voltage is specified from 0.6 to 4V. A
resistive divider (from VOUT to FB to AGND) sets the actual output voltage of the TPS6282x. 公式 4 and 公式 5
calculate the values of the resistors. IFB is recommended to be in the range of 5µA, but can differ if needed.
space
0.6V
R2 =
IFB
(4)
space
VOUT
R1 =
- R2
IFB
(5)
space
表 3 shows standard resistor values for typical output voltages.
space
表 3. Feedback Resistor Values for Typical Output Voltages
VOUT (V)
1.0
R1 (kΩ)
R2 (kΩ)
100
100
200
475
732
150
100
100
150
162
1.2
1.8
2.5
3.3
space
9.2.2.3 Output Filter Selection
The TPS6282x is internally compensated and optimized for a range of output filter component values, which is
specified in 表 4. Using these values simplifies the output filter component selection. Checked cells represent
combinations that are proven for stability by simulation and lab test. Further combinations are possible, but
should be checked for each individual application.
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150 µF
表 4. Recommended LC Output Filter Combinations(1)
4.7 µF
10 µF
22 µF
47 µF
100 µF
0.33 µH
0.47 µH
1.0 µH
1.5 µH
(2)
(3)
√
√
√
√
(3)
√
(3)
√
√
√
(1) The values in the table are the nominal values of inductors and ceramic capacitors. The effective capacitance can vary depending on
package size, voltage rating and dielectric material (typical variations are from +20% to -50%).
(2) This combination is recommended as the standard value for most of all applications.
(3) Cff is recommended for large COUT values.
9.2.2.4 Inductor Selection
The TPS6282x is designed to work with inductors of 470nH nominal and can be used with 1µH inductors as well.
The inductor has to be selected for adequate saturation current and a low dc resistance (DCR). The minimum
inductor current rating, that is needed under static load conditions is calculated using 公式 6 and 公式 7.
space
DIL(max)
Ipeak(max) = IL(min) = IOUT(max)
+
2
(6)
space
VOUT
æ
ç
ö
÷
1-
ç
ç
ç
ç
è
÷
÷
÷
÷
ø
V
IN
DIL(max) =VOUT
L
(min) ×fSW
(7)
space
This calculation gives the minimum saturation current of the inductor needed and an additional margin is
recommended to cover dynamic overshoot due to startup or load transients. Inductors are available in different
dimensions. Choosing the smallest size might result in less efficiency due to larger DCR and ac losses. The
following inductors have been tested with the TPS6282x:
表 5. List of Recommended Inductors
Nominal
INDUCTANCE
Saturation Current and DC
Resistance
(1)
TYPE
Dimensions [mm]
Manufacturer(2)
max. ISAT [A](3)
max. RDC [mΩ]
HTEN20161T-R47MDR
HTEH20121T-R47MSR
DFE201610E - R47M
DFE201210S - R47M
TFM201610ALM-R47MTAA
TFM201610ALC-R47MTAA
XFL4015-471ME
0.47
0.47
0.47
0.47
0.47
0.47
0.47
4.8
4.6
4.8
4.8
5.1
5.2
6.6
32
25
2.0 x 1.6 x 1.0
2.0 x 1.2 x 1.0
2.0 x 1.6 x 1.0
2.0 x 1.2 x 1.0
2.0 x 1.6 x 1.0
2.0 x 1.6 x 1.0
4.0 x 4.0 x 1.6
Cyntec
Cyntec
muRata
muRata
TDK
32
32
34
25
TDK
8.36
Coilcraft
(1) Inductance Tolerance ±20%
(2) See Third-party Products disclaimer.
(3) ΔL/L≈30%
12
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9.2.2.5 Output Capacitor Selection
The output voltage range of TPS6282x is 0.6V to 4V. While stability is a first criteria for the output filter selection
(L and COUT), the output capacitor value also determines transient response behavior and ripple of VOUT. The
recommended typical value for the output capacitor is 2x10µF (or 1x 22µF) and can be small ceramic capacitors
with low equivalent series resistance (ESR). For lower VOUT (VOUT ≤ 2V) and where only moderate load
transients are present, 10µF can be sufficient. In either case a minimum effective output capacitance of 5µF
should be present.
To keep low resistance and to get a narrow capacitance variation with temperature, it is recommended to use
X7R or X5R dielectric. Using an even higher value has advantages like smaller voltage ripple and tighter output
voltage accuracy in PSM.
9.2.2.6 Input Capacitor Selection
For typical application, an input capacitor of 4.7µF is sufficient and recommended. A larger value reduces input
current ripple further. The input capacitor buffers the input voltage for transient events and also decouples the
converter from the supply. A low ESR ceramic capacitor is recommended for best filtering and should be placed
between VIN and PGND as close as possible to those pins. In either case a minimum effective input capacitance
of 3µF should be present.
9.2.2.7 Feed-forward Capacitor Selection
To improve regulation speed, TPS6282x preferably operates with a feed-forward capacitor, connected between
VOUT and FB. The appropriate value is calculated using 公式 8.
space
12ms
Cff
=
R2
(8)
space
Therewith, for typical values of feedback resistors (R2=100kΩ), the feed-forward capacitance is 120pF.
图 44 and 图 45 show the results of a frequency domain analysis for both use cases, with and without a feed-
forward capacitor. The larger unity gain frequency, caused by the feed forward capacitor, results in a significant
improvement of the transient response.
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13
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9.2.3 Application Curves
VIN=5V, VOUT=1.8V, TA=25°C, BOM = 表 2, (unless otherwise noted)
100% mode
100% mode
图 8. Efficiency TPS62821 at VOUT=3.3V
图 9. Efficiency TPS62821 at VOUT=3.3V
100% mode
100% mode
图 10. Efficiency TPS62822 at VOUT=3.3V
图 11. Efficiency TPS62822 at VOUT=3.3V
100% mode
100% mode
图 12. Efficiency TPS62823 at VOUT=3.3V
图 13. Efficiency TPS62823 at VOUT=3.3V
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图 14. Efficiency TPS62821 at VOUT=1.8V
图 16. Efficiency TPS62822 at VOUT=1.8V
图 18. Efficiency TPS62823 at VOUT=1.8V
图 15. Efficiency TPS62821 at VOUT=1.8V
图 17. Efficiency TPS62822 at VOUT=1.8V
图 19. Efficiency TPS62823 at VOUT=1.8V
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图 20. Efficiency TPS62821 at VOUT=1V
图 21. Efficiency TPS62821 at VOUT=1V
图 22. Efficiency TPS62822 at VOUT=1V
图 23. Efficiency TPS62822 at VOUT=1V
图 24. Efficiency TPS62823 at VOUT=1V
图 25. Efficiency TPS62823 at VOUT=1V
16
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TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
图 26. Efficiency TPS62821 at VOUT=0.6V
图 28. Efficiency TPS62822 at VOUT=0.6V
图 30. Efficiency TPS62823 at VOUT=0.6V
图 27. Efficiency TPS62821 at VOUT=0.6V
图 29. Efficiency TPS62822 at VOUT=0.6V
图 31. Efficiency TPS62823 at VOUT=0.6V
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图 32. Output Voltage Accuracy (Load Regulation)
图 33. Output Voltage Accuracy (Line Regulation)
图 34. Switching Frequency vs Output Current
图 35. Switching Frequency vs Input Voltage
COUT=2x10µF
图 36. Typical Operation PWM
IOUT=1A
COUT=2x10µF
IOUT=0.1A
图 37. Typical Operation PSM
18
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ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
COUT=2x10µF
图 38. Startup into 0.6-Ohm (TPS62823)
COUT=2x10µF
图 39. Startup at No Load
COUT=2x10µF
图 40. Active Output Discharge at load 1.8-Ohm
COUT=2x10µF
图 41. Active Output Discharge at No Load
COUT=2x10µF
Cff=120pF
COUT=2x10µF
Cff=120pF
图 42. Load Transient Response, 50mA to 1A, TPS62822
图 43. Load Transient Response, 1A to 2A, TPS62822
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COUT=2x10µF
CFF=120pF
COUT=2x10µF
no CFF
图 45. Frequency Response (TPS62823), IOUT=3A
图 44. Frequency Response (TPS62823), IOUT=3A
图 46. Overload Response of TPS62823
图 47. Overload Response of TPS62823 (Hiccup cycle)
图 48. Device Temperature Rise on TPS62823 EVM at IOUT=3A
20
版权 © 2017–2018, Texas Instruments Incorporated
TPS62821, TPS62822, TPS62823
www.ti.com.cn
ZHCSHQ2B –NOVEMBER 2017–REVISED MAY 2018
10 Power Supply Recommendations
The TPS6282x is designed to operate from a 2.4-V to 5.5-V input voltage supply. The input power supply's
output current needs to be rated according to the output voltage and the output current of the power rail
application.
11 Layout
11.1 Layout Guidelines
The recommended PCB layout for the TPS6282x is shown below. It ensures best electrical and optimized
thermal performance considering the following important topics:
- The input capacitor(s) must be placed as close as possible to the VIN and PGND pins of the device. This
provides low resistive and inductive paths for the high di/dt input current.
- The SW node connection from the IC to the inductor conducts alternating high currents. It should be kept short.
- The VOUT regulation loop is closed with COUT and its ground connection. To avoid load regulation and EMI
noise, the loop should be kept short.
- The FB node is sensitive to dv/dt signals. Therefore the resistive divider should be placed close to the FB and
AGND pins.
For more detailed information about the actual EVM solution, see the EVM users guide.
11.2 Layout Example
space
space
space
VOUT
L1
VIN
C1
C2 C3
GND
GND
R2
R1
Cff
图 49. TPS6282x Board Layout
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12 器件和文档支持
12.1 器件支持
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息,不能构成与此类产品或服务或保修的适用性有关的认可,不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.2 相关链接
下表列出了快速访问链接。类别包括技术文档、支持和社区资源、工具和软件,以及立即订购快速访问。
表 6. 相关链接
器件
产品文件夹
请单击此处
请单击此处
请单击此处
立即订购
请单击此处
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
请单击此处
TPS62821
TPS62822
TPS62823
12.3 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
12.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.5 商标
DCS-Control, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
22
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PACKAGE OPTION ADDENDUM
www.ti.com
14-Jul-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS62821DLCR
TPS62821DLCT
TPS62822DLCR
TPS62822DLCT
TPS62823DLCR
TPS62823DLCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
DLC
DLC
DLC
DLC
DLC
DLC
8
8
8
8
8
8
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
Call TI | NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
A1
A1
A2
A2
A3
A3
Samples
Samples
Samples
Samples
Samples
Samples
Call TI | NIPDAU
Call TI
Call TI
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62821DLCR
TPS62821DLCT
TPS62823DLCR
TPS62823DLCT
VSON-
HR
DLC
DLC
DLC
DLC
8
8
8
8
3000
250
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
1.8
1.8
1.8
1.8
2.25
2.25
2.25
2.25
1.15
1.15
1.15
1.15
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
VSON-
HR
VSON-
HR
3000
250
VSON-
HR
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62821DLCR
TPS62821DLCT
TPS62823DLCR
TPS62823DLCT
VSON-HR
VSON-HR
VSON-HR
VSON-HR
DLC
DLC
DLC
DLC
8
8
8
8
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DLC 8
2.0 x 1.5 mm, 0.5 mm pitch
VSON-HR - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224379/A
PACKAGE OUTLINE
VSON-HR - 1 mm max height
PLASTIC SMALL OUTLINE- NO LEAD
DLC0008A
1.6
1.4
A
B
2.1
1.9
PIN 1 INDEX AREA
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
(0.1) TYP
SYMM
6X 0.5
4
5
SYMM
2X
1.5
8
1
0.3
0.2
8X
0.1
0.05
C A B
C
0.4
0.3
8X
4223754/A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
VSON-HR - 1 mm max height
PLASTIC SMALL OUTLINE- NO LEAD
DLC0008A
8X (0.55)
8X (0.25)
SYMM
1
8
6X (0.5)
SYMM
5
4
(R0.05) TYP
(1.35)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 30X
SOLDER MASK
OPENING
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
NON- SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4223754/A 06/2017
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
VSON-HR - 1 mm max height
PLASTIC SMALL OUTLINE- NO LEAD
DLC0008A
8X (0.55)
8X (0.25)
SYMM
1
8
6X (0.5)
SYMM
5
4
(R0.05) TYP
(1.35)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE: 30X
4223754/A 06/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
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