TPS65233RTET [TI]

具有 I2C 接口电源管理 IC (PMIC) 的 LNB 稳压器 | RTE | 16 | -40 to 85;


型号：	TPS65233RTET
厂家：	TEXAS INSTRUMENTS
描述：	具有 I2C 接口电源管理 IC (PMIC) 的 LNB 稳压器 \| RTE \| 16 \| -40 to 85 集成电源管理电路稳压器
文件：	总18页 (文件大小：1872K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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DS90UB960-Q1

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

具有两个 MIPI CSI-2 端口且适用于 2MP/60fps 摄像头、雷达和其他传感器

的 DS90UB960-Q1 四路 FPD-Link III 解串器集线器

1 特性

3 说明

•

符合 AEC-Q100 的汽车应用标准：

DS90UB960-Q1 是一款多功能摄像头集线器，可通过

FPD-Link III 接口收集从 4 个独立视频数据流接收到的

串行摄像头数据。与 DS90UB953-Q1 串行器配对

时，DS90UB960-Q1 可接收来自成像器的数据，可在

60Hz 帧速率下支持全高清 1080p/2MP 分辨率。接收

的数据将聚合至符合 MIPI CSI-2 标准并与下游处理器

互连的输出端。该器件还配有第二个 MIPI CSI-2 输出

端口，可提供额外带宽或提供第二个复制输出以便进行

数据记录和并行处理。

–

器件温度等级 2 级：环境工作温度范围为

–40℃ 至 +115℃

–

器件 HBM ESD 分类等级 ±4kV

器件 CDM ESD 分类等级 C5

•

四路解串器集线器同时从最多 4 个传感器聚合数据

支持 200 万像素传感器，可在 60Hz 帧速率下支持

全高清 1080p 分辨率

•

多摄像头同步

符合 MIPI DPHY 版本 1.2/CSI-2 版本 1.3 标准

DS90UB960-Q1 包括 4 个 FPD-Link III 解串器，每个

均支持通过具有成本效益的 50Ω 单端同轴或 100Ω 差

分 STP 电缆进行连接。接收均衡器会自动适应以补偿

电缆损耗特性，包括随时间推移而出现的劣化。

–

2 个 CSI-2 输出端口

每个 CSI-2 端口支持 1、2、3、4 个数据通道

CSI-2 数据速率可扩展：每个数据通道支持

400Mbps/800Mbps/1.2Gbps/1.5Gbps/1.6Gbps

–

端口复制模式

每个 FPD-Link III 接口还包括一个单独的低延迟双向控

制通道，该通道可连续传送 I2C、GPIO 和其他控制信

息。通用 I/O 信号（如摄像头同步和诊断特性所需的

信号）也会利用此双向控制通道。

•

超低数据和控制路径延迟

支持单端同轴或屏蔽双绞线 (STP) 电缆

自适应接收均衡

具有快速模式增强版（高达 1Mbps）的 I2C

用于传感器同步和诊断的灵活 GPIO

DS90UB960-Q1 符合 AEC-Q100 的汽车应用要求，

并采用具有成本效益且节省空间的 VQFN-64 封装。

可与 DS90UB953-Q1、DS90UB913A-Q1、

DS90UB933-Q1 串行器兼容

器件信息⁽¹⁾

器件型号

封装

VQFN (64)

封装尺寸（标称值）

•

内部可编程帧同步发生器

线路故障检测和高级诊断

DS90UB960-Q1

9.00mm x 9.00mm

(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品

附录。

2 应用

•

汽车 ADAS

典型应用原理图

–

后视摄像头 (RVC)

环视系统 (SVS)

FPD-Link III

Coax or STP

MIPI CSI-2

Port0:

Up to 4 Lanes

FPD-Link III

Serializer

摄像头监控系统 (CMS)

前视摄像头 (FC)

FPD-Link III

Serializer

驾驶员监控系统 (DMS)

DS90UB960-Q1

FPD-Link III HUB

Processor

SoC

Port1:

Up to 4 Lanes

卫星雷达、飞行时间 (ToF) 和激光雷达传感器

模块

FPD-Link III

Serializer

I2C

FPD-Link III

Serializer

–

传感器融合

GPIO

INTB

•

安全和监控

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SNLS492

DS90UB960-Q1

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

www.ti.com.cn

5.2 接收文档更新通知 ..................................................... 3

5.3 社区资源.................................................................... 3

5.4 商标........................................................................... 3

5.5 静电放电警告............................................................. 3

5.6 Glossary.................................................................... 3

机械、封装和可订购信息 ......................................... 3

6.1 Package Option Addendum ...................................... 4

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

器件和文档支持........................................................ 3

5.1 文档支持 ................................................................... 3

4 修订历史记录

注：之前版本的页码可能与当前版本有所不同。

Changes from Original (September 2016) to Revision A

Page

•

已更改将“产品预览”更改为“生产数据”.................................................................................................................................... 1

DS90UB960-Q1

www.ti.com.cn

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

5 器件和文档支持

5.1 文档支持

5.1.1 相关文档

请参阅如下相关文档：

•

《在 DS90UB913A 设计中进行同轴电缆供电》

《通过具有双向控制通道的 DS90UB913/4 FPD-Link III 进行 I2C 通信》

《通过具有双向控制通道的 FPD-Link III 进行 I2C 通信》

《I2C 总线上拉电阻器计算》

5.2 接收文档更新通知

要接收文档更新通知，请导航至德州仪器 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册，即可每

周接收产品信息更改摘要。有关更改的详细信息，请查看任意已修订文档中包含的修订历史记录。

5.3 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，

并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。

TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在

e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。

设计支持

TI 参考设计支持可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

5.4 商标

E2E is a trademark of Texas Instruments.

5.5 静电放电警告

ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可

能会损坏集成电路。

ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可

能会导致器件与其发布的规格不相符。

5.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

6 机械、封装和可订购信息

以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时，我们可能不

会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航栏。

DS90UB960-Q1

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

www.ti.com.cn

6.1 Package Option Addendum

6.1.1 Packaging Information

Package

Drawing

Package

Qty

Orderable Device

Status

Pins

Eco Plan

Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Device Marking

Type

VQFN

DS90UB960WRTDRQ1

DS90UB960WRTDTQ1

PREVIEW

RTD

2500

250

TBD

Call TI

-40 to 115

DS90UB960-Q1

www.ti.com.cn

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

6.1.2 Tape and Reel Information

Reel

Diameter

(mm)

Reel

Width W1

(mm)

Package

Type

Package

Drawing

(mm)

Pin1

Quadrant

Device

Pins

SPQ

DS90UB960-Q1

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

www.ti.com.cn

TAPE AND REEL BOX DIMENSIONS

Width (mm)

Device

Package Type

Package Drawing Pins

SPQ

Length (mm) Width (mm)

Height (mm)

DS90UB960-Q1

www.ti.com.cn

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

DS90UB960-Q1

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

www.ti.com.cn

DS90UB960-Q1

www.ti.com.cn

ZHCSBM2A –SEPTEMBER 2016–REVISED JUNE 2017

PACKAGE OPTION ADDENDUM

www.ti.com

22-Nov-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS65233RTER

TPS65233RTET

ACTIVE

WQFN

RTE

3000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 85

65233

Samples

NIPDAU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

22-Nov-2022

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

24-Mar-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS65233RTER

TPS65233RTET

WQFN

RTE

3000

250

330.0

180.0

12.4

3.3

1.1

8.0

12.0

250

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

24-Mar-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS65233RTER

TPS65233RTET

WQFN

RTE

3000

250

335.0

367.0

210.0

182.0

335.0

367.0

185.0

182.0

25.0

35.0

20.0

250

Pack Materials-Page 2

GENERIC PACKAGE VIEW

RTE 16

3 x 3, 0.5 mm pitch

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4225944/A

www.ti.com

PACKAGE OUTLINE

RTE0016C

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

3.1

2.9

PIN 1 INDEX AREA

3.1

2.9

SIDE WALL

METAL THICKNESS

DIM A

OPTION 1

0.1

OPTION 2

0.2

0.8 MAX

SEATING PLANE

0.08

0.05

0.00

1.68 0.07

(DIM A) TYP

EXPOSED

THERMAL PAD

12X 0.5

SYMM

1.5

0.30

16X

0.18

PIN 1 ID

(OPTIONAL)

0.1

C A B

SYMM

0.05

0.5

0.3

16X

4219117/B 04/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

RTE0016C

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

1.68)

SYMM

16X (0.6)

16X (0.24)

SYMM

(2.8)

(0.58)

TYP

12X (0.5)

(

0.2) TYP

VIA

(R0.05)

ALL PAD CORNERS

(0.58) TYP

(2.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED

METAL

EXPOSED

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4219117/B 04/2022

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

RTE0016C

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

1.55)

16X (0.6)

16X (0.24)

SYMM

(2.8)

12X (0.5)

METAL

ALL AROUND

SYMM

(2.8)

(R0.05) TYP

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD 17:

85% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:25X

4219117/B 04/2022

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担

保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS65233RTET [TI]

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