TPS73625DCQR [TI]
Cap-Free, NMOS, 400mA Low-Dropout Regulator with Reverse Current Protection; 无电容， NMOS ， 400毫安低压差稳压器，反向电流保护
| 型号： | TPS73625DCQR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Cap-Free, NMOS, 400mA Low-Dropout Regulator with Reverse Current Protection |
| 文件： | 总27页 (文件大小：641K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
Cap-Free, NMOS, 400mA Low-Dropout Regulator
with Reverse Current Protection
FEATURES
DESCRIPTION
•
Stable with No Output Capacitor or Any Value
or Type of Capacitor
The TPS736xx family of low-dropout (LDO) linear
voltage regulators uses a new topology: an NMOS
pass element in a voltage-follower configuration. This
topology is stable using output capacitors with low
ESR, and even allows operation without a capacitor.
It also provides high reverse blockage (low reverse
current) and ground pin current that is nearly constant
over all values of output current.
•
•
•
Input Voltage Range of 1.7V to 5.5V
Ultra-Low Dropout Voltage: 75mV typ
Excellent Load Transient Response—with or
without Optional Output Capacitor
•
New NMOS Topology Delivers Low Reverse
Leakage Current
The TPS736xx uses an advanced BiCMOS process
to yield high precision while delivering very low
dropout voltages and low ground pin current. Current
consumption, when not enabled, is under 1µA and
ideal for portable applications. The extremely low
output noise (30µVRMS with 0.1µF CNR) is ideal for
powering VCOs. These devices are protected by
thermal shutdown and foldback current limit.
•
•
•
Low Noise: 30µVRMS typ (10Hz to 100kHz)
0.5% Initial Accuracy
1% Overall Accuracy Over Line, Load, and
Temperature
•
•
Less Than 1µA max IQ in Shutdown Mode
Thermal Shutdown and Specified Min/Max
Current Limit Protection
•
Available in Multiple Output Voltage Versions
– Fixed Outputs of 1.20V to 4.3V
– Adjustable Output from 1.20V to 5.5V
– Custom Outputs Available
DRB PACKAGE
3mm x 3mm SON
(TOP VIEW)
DBV PACKAGE
SOT23
(TOP VIEW)
APPLICATIONS
OUT
N/C
1
2
3
4
8
7
6
5
IN
•
•
•
•
Portable/Battery-Powered Equipment
Post-Regulation for Switching Supplies
Noise-Sensitive Circuitry such as VCOs
1
5
IN
GND
EN
OUT
N/C
N/C
EN
NR/FB
GND
2
NR/FB
3
4
Point of Load Regulation for DSPs, FPGAs,
ASICs, and Microprocessors
DCQ PACKAGE
SOT223
(TOP VIEW)
Optional
Optional
TAB IS GND
4 5
VIN
VOUT
IN
OUT
TPS736xx
GND
EN
NR
1
2
3
Optional
Typical Application Circuit for Fixed Voltage Versions
IN
GND
OUT NR/FB
EN
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS736xxyyyz
XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable(3)).
YYY is package designator.
Z is package quantity.
(1) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet
or see the TI website at www.ti.com.
(2) Additional output voltages from 1.25V to 4.3V in 100mV increments are available on a quick-turn basis using innovative factory
EEPROM programming. Minimum order quantities apply; contact factory for details and availability.
(3) For fixed 1.2V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted(1)
TPS736xx
-0.3 to 6.0
UNIT
VIN range
V
V
V
VEN range
-0.3 to 6.0
VOUT range
-0.3 to 5.5
Peak output current
Output short-circuit duration
Continuous total power dissipation
Junction temperature range, TJ
Storage temperature range
ESD rating, HBM
Internally limited
Indefinite
See Dissipation Ratings Table
-55 to +150
°C
°C
kV
V
-65 to +150
2
ESD rating, CDM
500
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
POWER DISSIPATION RATINGS(1)
DERATING FACTOR
ABOVE TA = 25°C
TA≤ 25°C
TA = 70°C
TA = 85°C
BOARD
PACKAGE
RΘJC
RΘJA
POWER RATING POWER RATING POWER RATING
Low-K(2)
High-K(3)
Low-K(2)
DBV
DBV
DCQ
DRB
64°C/W
64°C/W
15°C/W
1.2°C/W
255°C/W
180°C/W
53°C/W
40°C/W
3.9mW/°C
5.6mW/°C
18.9mW/°C
25.0mW/°C
390mW
560mW
1.89W
2.50W
215mW
310mW
1.04W
1.38W
155mW
225mW
0.76W
1.0W
High-K(3)(4)
(1) See Power Dissipation in the Applications section for more information related to thermal design.
(2) The JEDEC Low-K (1s) board design used to derive this data was a 3inch x 3inch, 2-layer board with 2-ounce copper traces on top of
the board.
(3) The JEDEC High-K (2s2p) board design used to derive this data was a 3inch x 3inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on the top and bottom of the board.
(4) Based on preliminary thermal simulations.
2
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = -40°C to +125°C), VIN = VOUT(nom) + 0.5V(1), IOUT = 10mA, VEN = 1.7V, and
COUT = 0.1µF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER
Input voltage range(1)(2)
TEST CONDITIONS
MIN
1.7
TYP
MAX
5.5
UNIT
V
VIN
VFB
Internal reference (TPS73601)
TJ = 25°C
1.198
1.20
1.210
V
Output voltage range
(TPS73601)
VFB
-0.5
-1.0
5.5 - VDO
+0.5
V
VOUT
Nominal
TJ = 25°C
Accuracy(1)
%
over VIN, IOUT
and T
,
VOUT + 0.5V ≤ VIN≤ 5.5V;
10mA ≤ IOUT≤ 400mA
±0.5
+1.0
∆VOUT%/∆VIN
Line regulation(1)
VO(nom) + 0.5V≤ VIN≤ 5.5V
1mA ≤ IOUT≤ 400mA
0.01
0.002
0.0005
%/V
∆VOUT%/∆IOUT Load regulation
%/mA
10mA ≤ IOUT≤ 400mA
Dropout voltage(3)
(VIN = VOUT(nom) - 0.1V)
VDO
IOUT = 400mA
75
200
mV
ZO(DO)
Output impedance in dropout
1.7V ≤ VIN≤ VOUT + VDO
VOUT = 0.9 × VOUT(nom)
3.6V ≤ VIN≤ 4.2V, 0°C ≤ TJ≤ 70°C
VOUT = 0V
0.25
650
Ω
400
500
800
800
mA
mA
mA
µA
ICL
Output current limit
ISC
Short-circuit current
Reverse leakage current(4) (-IIN
450
0.1
IREV
)
VEN ≤ 0.5V, 0V≤ VIN≤ VOUT
10
550
1000
1
IOUT = 10mA (IQ)
IOUT = 400mA
400
IGND
Ground pin current
µA
800
ISHDN
IFB
Shutdown current (IGND
)
VEN ≤ 0.5V, VOUT≤ VIN≤ 5.5
0.02
µA
µA
FB pin current (TPS73601)
0.1
0.3
f = 100Hz, IOUT = 400mA
f = 10KHz, IOUT = 400mA
COUT = 10µF, No CNR
58
Power-supply rejection ratio
(ripple rejection)
PSRR
dB
37
27 × VOUT
8.5 × VOUT
Output noise voltage
BW = 10Hz - 100KHz
VN
µVRMS
µs
COUT = 10µF, CNR = 0.01µF
VOUT = 3V, RL = 30Ω COUT = 1µF,
CNR = 0.01µF
tSTR
Startup time
600
VEN(HI)
VEN(LO)
IEN(HI)
Enable high (enabled)
1.7
0
VIN
0.5
0.1
V
V
Enable low (shutdown)
Enable pin current (enabled)
VEN = 5.5V
0.02
160
140
µA
Shutdown, temperature increasing
Reset, temperature decreasing
TSD
TJ
Thermal shutdown temperature
Operating junction temperature
°C
°C
-40
125
(1) Minimum VIN = VOUT +VDO or 1.7V, whichever is greater.
(2) For VOUT(nom) <1.6V, when VIN≤ 1.6V, the output will lock to VIN and may result in a damaging over-voltage level on the output. To avoid
this situation, disable the device before powering down the VIN
.
(3) VDO is not measured for the TPS73615 (VOUT(nom) = 1.5V) since minimum VIN = 1.7V.
(4) Refer to Applications section for more information.
3
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
FUNCTIONAL BLOCK DIAGRAMS
IN
4MHz
Charge Pump
EN
Thermal
Protection
Ref
Servo
Ω
27k
Bandgap
Error
Amp
Current
Limit
OUT
Ω
8k
GND
R1
R2
Ω
R1 + R2 = 80k
NR
Figure 1. Fixed Voltage Version
IN
Table 1. Standard 1%
Resistor Values for
Common Output Voltages
V
O
R
1
R
2
4MHz
1.2V
1.5V
1.8V
2.5V
2.8V
3.0V
3.3V
Short
Open
Charge Pump
23.2kΩ
28.0kΩ
39.2kΩ
44.2kΩ
46.4kΩ
52.3kΩ
95.3kΩ
56.2kΩ
36.5kΩ
33.2kΩ
30.9kΩ
30.1kΩ
EN
Thermal
Protection
Ref
Servo
Ω
27k
Bandgap
Error
Amp
NOTE: V
= (R + R )/R × 1.204;
1 2 2
OUT
OUT
FB
Current
Limit
R
R
19kΩ for best
1
2
accuracy.
GND
Ω
80k
Ω
8k
R1
R2
Figure 2. Adjustable Voltage Version
4
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
PIN ASSIGNMENTS
DRB PACKAGE
3mm x 3mm SON
(TOP VIEW)
DCQ PACKAGE
SOT223
(TOP VIEW)
DBV PACKAGE
SOT23
(TOP VIEW)
OUT
N/C
1
2
3
4
8
7
6
5
IN
TAB IS GND
N/C
N/C
EN
5
4
IN
GND
EN
1
2
3
OUT
NR/FB
GND
NR/FB
1
2
3
4
5
IN
GND
EN
OUT
NR/FB
Terminal Functions
SOT23
(DBV)
SOT223
(DCQ)
3x3 SON
(DRB)
NAME
PIN NO.
PIN NO.
PIN NO.
DESCRIPTION
Unregulated input supply
Ground
IN
1
2
3
1
3
5
8
4, Pad
5
GND
EN
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the
regulator into shutdown mode. Refer to the Shutdown section under Applications
Information for more details. EN can be connected to IN if not used.
NR
4
4
5
4
4
2
3
3
1
Fixed voltage versions only—connecting an external capacitor to this pin bypasses
noise generated by the internal bandgap, reducing output noise to very low levels.
FB
Adjustable voltage version only—this is the input to the control loop error amplifier,
and is used to set the output voltage of the device.
OUT
Output of the Regulator. There are no output capacitor requirements for stability.
5
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS
For all voltage versions, at TJ = +25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
LOAD REGULATION
LINE REGULATION
0.20
0.15
0.10
0.05
0
0.5
0.4
0.3
0.2
0.1
0
Referred to IOUT = 10mA
Referred to VIN = VOUT + 0.5V at IOUT = 10mA
−
_
40 C
_
+25
C
_
+25
C
_
+125 C
_
+125
C
−
−
−
−
−
0.1
0.2
0.3
0.4
0.5
−
−
−
−
0.05
0.10
0.15
0.20
−
_
40
C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
50
100
150
200
250
300
350 400
−
VIN VOUT (V)
IOUT (mA)
Figure 3.
Figure 4.
DROPOUT VOLTAGE vs OUTPUT CURRENT
DROPOUT VOLTAGE vs TEMPERATURE
100
80
60
40
20
0
100
80
60
40
20
0
TPS73625DBV
TPS73625DBV
_
+125
C
_
+25
C
−
_
40
C
−
−
25
0
50
100
150
200
250
300
350
400
50
0
25
50
75
100
125
_
IOUT (mA)
Temperature ( C)
Figure 5.
Figure 6.
OUTPUT VOLTAGE ACCURACY HISTOGRAM
OUTPUT VOLTAGE DRIFT HISTOGRAM
30
18
16
14
12
10
8
IOUT = 10mA
All Voltage Versions
IOUT = 10mA
25
20
15
10
5
6
4
2
0
0
VOUT Error (%)
_
Worst Case dVOUT/dT (ppm/ C)
Figure 7.
Figure 8.
6
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
GROUND PIN CURRENT vs OUTPUT CURRENT
GROUND PIN CURRENT vs TEMPERATURE
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
IOUT = 400mA
VIN = 5.5V
VIN = 4V
VIN = 2V
VIN = 5.5V
VIN = 3V
VIN = 2V
0
100
200
300
400
−
−
25
50
0
25
50
75
100
125
IOUT (mA)
_
Temperature ( C)
Figure 9.
Figure 10.
CURRENT LIMIT vs VOUT
(FOLDBACK)
GROUND PIN CURRENT in SHUTDOWN
vs TEMPERATURE
1
800
700
600
500
400
300
200
100
0
VENABLE = 0.5V
VIN = VO + 0.5V
ICL
ISC
0.1
TPS73633
0.5
0.01
−
−
25
50
0
25
50
75
100
125
0
1.0
1.5
2.0
2.5
3.0
3.5
_
Temperature ( C)
VOUT (V)
Figure 11.
CURRENT LIMIT vs VIN
Figure 12.
CURRENT LIMIT vs TEMPERATURE
800
750
700
650
600
550
500
450
400
800
750
700
650
600
550
500
450
400
−
−
25
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
50
0
25
50
75
100
125
_
VIN (V)
Temperature ( C)
Figure 13.
Figure 14.
7
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
PSRR (RIPPLE REJECTION) vs FREQUENCY
PSRR (RIPPLE REJECTION) vs VIN– VOUT
40
35
30
25
20
15
10
5
90
80
70
60
50
40
30
20
10
0
IOUT = 100mA
COUT = Any
IOUT = 1mA
µ
COUT = 1
F
IOUT = 1mA
COUT = 10 F
µ
IO = 100mA
µ
CO = 1 F
IOUT = 1mA
COUT = Any
IOUT = 100mA
COUT = 10
Frequency = 100kHz
µ
F
µ
COUT = 10
F
IOUT = Any
COUT = 0
VOUT = 2.5V
µ
F
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
10
100
1k
10k
100k
1M
10M
−
VIN VOUT (V)
Frequency (Hz)
Figure 15.
Figure 16.
NOISE SPECTRAL DENSITY
NOISE SPECTRAL DENSITY
CNR = 0µF
CNR = 0.01µF
1
1
µ
COUT = 1
F
µ
COUT = 1
F
µ
COUT = 0
F
0.1
0.1
µ
COUT = 10 F
µ
COUT = 0
F
µ
COUT = 10
F
IOUT = 150mA
IOUT = 150mA
10 100
0.01
0.01
10
100
1k
10k
100k
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 17.
Figure 18.
RMS NOISE VOLTAGE vs COUT
RMS NOISE VOLTAGE vs CNR
60
50
40
30
20
10
0
140
120
100
80
VOUT = 5.0V
VOUT = 5.0V
VOUT = 3.3V
VOUT = 1.5V
VOUT = 3.3V
VOUT = 1.5V
60
40
20
µ
CNR = 0.01 F
µ
COUT = 0 F
10Hz < Frequency < 100kHz
10Hz < Frequency < 100kHz
0
0.1
1
10
1p
10p
100p
1n
10n
µ
COUT ( F)
CNR (F)
Figure 19.
Figure 20.
8
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
TPS73633
LOAD TRANSIENT RESPONSE
TPS73633
LINE TRANSIENT RESPONSE
µ
µ
µ
V
IN = 3.8V
COUT = 0
F
F
F
IOUT = 400mA
100mV/tick
50mV/tick
20mV/tick
50mA/tick
VOUT
VOUT
VOUT
IOUT
µ
COUT = 0
F
50mV/div
VOUT
COUT = 1
µ
COUT = 100
F
COUT = 10
50mV/div
1V/div
VOUT
dVIN
dt
5.5V
µ
= 0.5V/
s
400mA
4.5V
VIN
10mA
µ
10 s/div
µ
10 s/div
Figure 21.
Figure 22.
TPS73633
TURN-ON RESPONSE
TPS73633
TURN-OFF RESPONSE
Ω
RL = 1k
RL = 20Ω
COUT = 10µF
VOUT
COUT = 0µF
Ω
RL = 20
Ω
RL = 20
1V/div
1V/div
1V/div
1V/div
µ
COUT = 1
F
µ
COUT = 1
F
Ω
RL = 1k
Ω
RL = 20
COUT = 0µF
µ
COUT = 10
F
VOUT
2V
2V
VEN
0V
0V
VEN
µ
100 s/div
100µs/div
Figure 23.
Figure 24.
TPS73633
POWER UP / POWER DOWN
IENABLE vs TEMPERATURE
10
1
6
5
4
3
2
1
0
VIN
VOUT
0.1
−
−
1
2
0.01
−
−
25
50ms/div
50
0
25
50
75
100
125
_
Temperature ( C)
Figure 25.
Figure 26.
9
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
TYPICAL CHARACTERISTICS (continued)
For all voltage versions, at TJ = +25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
TPS73601
RMS NOISE VOLTAGE vs CADJ
TPS73601
IFB vs TEMPERATURE
60
55
50
45
40
35
30
25
20
160
140
120
100
80
60
VOUT = 2.5V
40
µ
COUT = 0 F
Ω
R1 = 39.2k
20
10Hz < Frequency < 100kHz
0
10p
100p
1n
10n
−
−
25
50
0
25
50
75
100
125
CFB (F)
_
Temperature ( C)
Figure 27.
Figure 28.
TPS73601
TPS73601
LOAD TRANSIENT, ADJUSTABLE VERSION
LINE TRANSIENT, ADJUSTABLE VERSION
CFB = 10nF
VOUT = 2.5V
CFB = 10nF
Ω
R1 = 39.2k
µ
COUT = 0
F
µ
COUT = 0 F
VOUT
VOUT
100mV/div
100mV/div
200mV/div
200mV/div
µ
COUT = 10 F
VOUT
µ
COUT = 10
F
VOUT
4.5V
400mA
3.5V
VIN
10mA
IOUT
µ
µ
s/div
5
25 s/div
Figure 29.
Figure 30.
10
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
APPLICATION INFORMATION
The TPS736xx belongs to a family of new generation
LDO regulators that use an NMOS pass transistor to
achieve ultra-low-dropout performance, reverse cur-
rent blockage, and freedom from output capacitor
constraints. These features, combined with low noise
and an enable input, make the TPS736xx ideal for
portable applications. This regulator family offers a
wide selection of fixed output voltage versions and an
adjustable output version. All versions have thermal
and over-current protection, including foldback cur-
rent limit.
Input and Output Capacitor Requirements
Although an input capacitor is not required for stab-
ility, it is good analog design practice to connect a
0.1µF to 1µF low ESR capacitor across the input
supply near the regulator. This will counteract reac-
tive input sources and improves transient response,
noise rejection, and ripple rejection. A higher-value
capacitor may be necessary if large, fast rise-time
load transients are anticipated or the device is lo-
cated several inches from the power source.
Figure 31 shows the basic circuit connections for the
fixed voltage models. Figure 32 gives the connections
for the adjustable output version (TPS73601). R1 and
R2 can be calculated for any output voltage using the
formula in Figure 32. Sample resistor values for
common output voltages are shown in Figure 2. For
best accuracy, make the parallel combination of R1
and R2 approximately 19kΩ.
The TPS736xx does not require an output capacitor
for stability and has maximum phase margin with no
capacitor. It is designed to be stable for all available
types and values of capacitors. In applications where
VIN – VOUT < 0.5V and multiple low ESR capacitors
are in parallel, ringing may occur when the product of
COUT and total ESR drops below 50nΩF. Total ESR
includes all parasitic resistances, including capacitor
ESR and board, socket, and solder joint resistance.
In most applications, the sum of capacitor ESR and
trace resistance will meet this requirement.
Optional input capacitor.
May improve source
Optional output capacitor.
May improve load transient,
noise, or PSRR.
impedance, noise, or PSRR.
Output Noise
VIN
VOUT
IN
OUT
TPS736xx
GND
A precision band-gap reference is used to generate
the internal reference voltage, VREF. This reference is
the dominant noise source within the TPS736xx and
it generates approximately 32µVRMS (10Hz to
100kHz) at the reference output (NR). The regulator
control loop gains up the reference noise with the
same gain as the reference voltage, so that the noise
voltage of the regulator is approximately given by:
EN
NR
Optional bypass
capacitor to reduce
output noise.
Figure 31. Typical Application Circuit for
Fixed-Voltage Versions
VOUT
VREF
(R1 ) R2)
VN + 32mVRMS
+ 32mVRMS
R2
(1)
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional output capacitor.
May improve load transient,
noise, or PSRR.
Since the value of VREF is 1.2V, this relationship
reduces to:
mVRMS
V
ǒ Ǔ
VN(mVRMS) + 27
VOUT(V)
VIN
VOUT
IN
OUT
FB
(2)
TPS736xx
R1
R2
CFB
for the case of no CNR
.
EN
GND
An internal 27kΩ resistor in series with the noise
reduction pin (NR) forms a low-pass filter for the
voltage reference when an external noise reduction
capacitor, CNR, is connected from NR to ground. For
CNR = 10nF, the total noise in the 10Hz to 100kHz
bandwidth is reduced by a factor of ~3.2, giving the
approximate relationship:
Optional capacitor
reduces output noise
and improves
(R1 + R2)
×
1.204
VOUT
=
R1
transient response.
Figure 32. Typical Application Circuit for
Adjustable-Voltage Versions
mVRMS
ǒ Ǔ
VN(mVRMS) + 8.5
VOUT(V)
V
(3)
for CNR = 10nF.
11
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
This noise reduction effect is shown as RMS Noise
Voltage vs CNR in the Typical Characteristics section.
For large step changes in load current, the TPS736xx
requires a larger voltage drop from VIN to VOUT to
avoid degraded transient response. The boundary of
this transient dropout region is approximately twice
the dc dropout. Values of VIN - VOUT above this line
insure normal transient response.
The TPS73601 adjustable version does not have the
noise-reduction pin available. However, connecting a
feedback capacitor, CFB , from the output to the FB
pin will reduce output noise and improve load transi-
ent performance.
Operating in the transient dropout region can cause
an increase in recovery time. The time required to
recover from a load transient is a function of the
magnitude of the change in load current rate, the rate
of change in load current, and the available head-
room (VIN to VOUT voltage drop). Under worst-case
conditions [full-scale instantaneous load change with
(VIN - VOUT) close to dc dropout levels], the TPS736xx
can take a couple of hundred microseconds to return
to the specified regulation accuracy.
The TPS736xx uses an internal charge pump to
develop an internal supply voltage sufficient to drive
the gate of the NMOS pass element above VOUT. The
charge pump generates ~250µV of switching noise at
~4MHz; however, charge-pump noise contribution is
negligible at the output of the regulator for most
values of IOUT and COUT
.
Board Layout Recommendation to Improve
PSRR and Noise Performance
Transient Response
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended that
the board be designed with separate ground planes
for VIN and VOUT, with each ground plane connected
only at the GND pin of the device. In addition, the
ground connection for the bypass capacitor should
connect directly to the GND pin of the device.
The low open-loop output impedance provided by the
NMOS pass element in a voltage follower configur-
ation allows operation without an output capacitor for
many applications. As with any regulator, the addition
of a capacitor (nominal value 1µF) from the output pin
to ground will reduce undershoot magnitude but
increase duration. In the adjustable version, the
addition of a capacitor, CFB, from the output to the
adjust pin will also improve the transient response.
Internal Current Limit
The TPS736xx internal current limit helps protect the
regulator during fault conditions. Foldback helps to
protect the regulator from damage during output
short-circuit conditions by reducing current limit when
VOUT drops below 0.5V. See Figure 11 in the Typical
The TPS736xx does not have active pull-down when
the output is over-voltage. This allows applications
that connect higher voltage sources, such as alter-
nate power supplies, to the output. This also results
in an output overshoot of several percent if load
current quickly drops to zero when a capacitor is
connected to the output. The duration of overshoot
can be reduced by adding a load resistor. The
overshoot decays at a rate determined by output
capacitor COUT and the internal/external load resist-
ance. The rate of decay is given by:
Characteristics section for a graph of IOUT vs VOUT
.
Shutdown
The Enable pin is active high and is compatible with
standard TTL-CMOS levels. VEN below 0.5V (max)
turns the regulator off and drops the ground pin
current to approximately 10nA. When shutdown capa-
bility is not required, the Enable pin can be connected
to VIN. When a pull-up resistor is used, and operation
down to 1.8V is required, use pull-up resistor values
below 50kΩ.
(Fixed Voltage Version)
VOUT
dVńdt +
COUT 80kW ø RLOAD
(4)
(Adjustable Voltage Version)
VOUT
dVńdt +
Dropout Voltage
(
)
COUT 80kW ø R1 ) R2 ø RLOAD
(5)
The TPS736xx uses an NMOS pass transistor to
achieve extremely low dropout. When (VIN - VOUT) is
less than the dropout voltage (VDO), the NMOS pass
device is in its linear region of operation and the
input-to-output resistance is the RDS-ON of the NMOS
pass element.
12
TPS736xx
www.ti.com
SBVS038K–SEPTEMBER 2003–REVISED SEPTEMBER 2005
Reverse Current
expected ambient temperature and worst-case load.
The NMOS pass element of the TPS736xx provides
inherent protection against current flow from the
output of the regulator to the input when the gate of
the pass device is pulled low. To ensure that all
charge is removed from the gate of the pass element,
the enable pin must be driven low before the input
voltage is removed. If this is not done, the pass
element may be left on due to stored charge on the
gate.
The internal protection circuitry of the TPS736xx has
been designed to protect against overload conditions.
It was not intended to replace proper heat sinking.
Continuously running the TPS736xx into thermal
shutdown will degrade reliability.
Power Dissipation
The ability to remove heat from the die is different for
each package type, presenting different consider-
ations in the PCB layout. The PCB area around the
device that is free of other components moves the
heat from the device to the ambient air. Performance
data for JEDEC low and high K boards are shown in
the Power Dissipation Ratings table. Using heavier
copper will increase the effectiveness in removing
heat from the device. The addition of plated
through-holes to heat-dissipating layers will also im-
prove the heat-sink effectiveness.
After the enable pin is driven low, no bias voltage is
needed on any pin for reverse current blocking. Note
that reverse current is specified as the current flowing
out of the IN pin due to voltage applied on the OUT
pin. There will be additional current flowing into the
OUT pin due to the 80kΩ internal resistor divider to
ground (see Figure 1 and Figure 2).
For the TPS73601, reverse current may flow when
VFB is more than 1.0V above VIN.
Power dissipation depends on input voltage and load
conditions. Power dissipation is equal to the product
of the output current times the voltage drop across
the output pass element (VIN to VOUT):
Thermal Protection
Thermal protection disables the output when the
junction temperature rises to approximately 160°C,
allowing the device to cool. When the junction tem-
perature cools to approximately 140°C, the output
circuitry is again enabled. Depending on power dissi-
pation, thermal resistance, and ambient temperature,
the thermal protection circuit may cycle on and off.
This limits the dissipation of the regulator, protecting
it from damage due to overheating.
PD
(VIN VOUT
)
IOUT
(6)
Power dissipation can be minimized by using the
lowest possible input voltage necessary to assure the
required output voltage.
Package Mounting
Any tendency to activate the thermal protection circuit
indicates excessive power dissipation or an inad-
equate heat sink. For reliable operation, junction
temperature should be limited to 125°C maximum. To
estimate the margin of safety in a complete design
(including heat sink), increase the ambient tempera-
ture until the thermal protection is triggered; use
worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
35°C above the maximum expected ambient con-
dition of your application. This produces a worst-case
junction temperature of 125°C at the highest
Solder pad footprint recommendations for the
TPS736xx are presented in Application Bulletin
Solder Pad Recommendations for Surface-Mount De-
vices (AB-132), available from the Texas Instruments
web site at www.ti.com.
13
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
PACKAGING INFORMATION
Orderable Device
TPS73601DBVR
TPS73601DBVRG4
TPS73601DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
6
6
6
8
8
8
8
8
8
8
8
5
5
5
5
6
6
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOP
DBV
DBV
DBV
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
DCQ
DCQ
DRB
DRB
DRB
DRB
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73601DBVTG4
TPS73601DCQ
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
Call TI
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
TPS73601DCQR
TPS73601DCQRG4
TPS73601DRBR
TPS73601DRBRG4
TPS73601DRBT
TPS73601DRBTG4
TPS736125DRBR
TPS736125DRBRG4
TPS736125DRBT
TPS736125DRBTG4
TPS73615DBVR
TPS73615DBVRG4
TPS73615DBVT
SOP
2500 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOP
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73615DBVTG4
TPS73615DCQ
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
TPS73615DCQR
TPS73615DRBR
TPS73615DRBRG4
TPS73615DRBT
TPS73615DRBTG4
SOP
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
Orderable Device
TPS73618DBVR
TPS73618DBVRG4
TPS73618DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73618DCQ
TPS73618DCQR
TPS73625DBVR
ACTIVE
ACTIVE
ACTIVE
SOP
SOP
DCQ
DCQ
DBV
6
6
5
78
TBD
TBD
Call TI
Call TI
Level-3-240C-168 HR
Level-3-240C-168 HR
2500
SOT-23
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73625DBVRG4
TPS73625DBVT
TPS73625DBVTG4
TPS73625DCQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOP
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
6
6
6
6
5
5
5
6
6
6
6
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
Call TI
Call TI
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
TPS73625DCQG4
TPS73625DCQR
TPS73625DCQRG4
TPS73630DBVR
TPS73630DBVRG4
TPS73630DBVT
TPS73630DCQ
SOP
78 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOP
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
Call TI
Call TI
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
TPS73630DCQG4
TPS73630DCQR
TPS73630DCQRG4
TPS73632DBVR
TPS73632DBVRG4
TPS73632DBVT
TPS73632DBVTG4
TPS73633DBVR
TPS73633DBVRG4
TPS73633DBVT
SOP
78 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
TPS73633DBVTG4
TPS73633DCQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOP
DBV
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
5
6
6
6
6
8
8
8
8
5
5
5
5
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
78 Green (RoHS &
no Sb/Br)
Call TI
Call TI
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
TPS73633DCQG4
TPS73633DCQR
TPS73633DCQRG4
TPS73633DRBR
TPS73633DRBRG4
TPS73633DRBT
TPS73633DRBTG4
TPS73643DBVR
TPS73643DBVRG4
TPS73643DBVT
SOP
78 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SOP
2500 Green (RoHS &
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73643DBVTG4
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2005
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2005
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
TPS73633DRBRG4
TPS73633DRBT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SON
SON
DRB
DRB
DRB
DBV
DBV
DBV
DBV
8
8
8
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73633DRBTG4
TPS73643DBVR
TPS73643DBVRG4
TPS73643DBVT
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73643DBVTG4
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
PACKAGING INFORMATION
Orderable Device
TPS73601DBVR
TPS73601DBVRG4
TPS73601DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
6
6
6
8
8
8
8
8
8
8
8
5
5
5
5
6
6
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SON
DBV
DBV
DBV
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
DCQ
DCQ
DRB
DRB
DRB
DRB
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS73601DBVTG4
TPS73601DCQ
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73601DCQR
TPS73601DCQRG4
TPS73601DRBR
TPS73601DRBRG4
TPS73601DRBT
TPS73601DRBTG4
TPS736125DRBR
TPS736125DRBRG4
TPS736125DRBT
TPS736125DRBTG4
TPS73615DBVR
TPS73615DBVRG4
TPS73615DBVT
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SON
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS73615DBVTG4
TPS73615DCQ
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73615DCQR
TPS73615DRBR
TPS73615DRBRG4
TPS73615DRBT
TPS73615DRBTG4
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Orderable Device
TPS73618DBVR
TPS73618DBVRG4
TPS73618DBVT
TPS73618DBVTG4
TPS73618DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
6
6
5
5
5
5
6
6
6
6
5
5
5
6
6
6
6
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DCQ
DCQ
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73618DCQR
TPS73625DBVR
TPS73625DBVRG4
TPS73625DBVT
TPS73625DBVTG4
TPS73625DCQ
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73625DCQG4
TPS73625DCQR
TPS73625DCQRG4
TPS73630DBVR
TPS73630DBVRG4
TPS73630DBVT
TPS73630DCQ
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73630DCQG4
TPS73630DCQR
TPS73630DCQRG4
TPS73632DBVR
TPS73632DBVRG4
TPS73632DBVT
TPS73632DBVTG4
TPS73633DBVR
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
Orderable Device
TPS73633DBVRG4
TPS73633DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
6
6
6
6
8
8
8
8
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SON
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS73633DBVTG4
TPS73633DCQ
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73633DCQG4
TPS73633DCQR
TPS73633DCQRG4
TPS73633DRBR
TPS73633DRBRG4
TPS73633DRBT
TPS73633DRBTG4
TPS73643DBVR
TPS73643DBVRG4
TPS73643DBVT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73643DBVTG4
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2005
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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amplifier.ti.com
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logic.ti.com
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microcontroller.ti.com
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www.ti.com/wireless
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