TPS79601DCQG4
更新时间:2024-09-18 06:51:23
品牌:TI
描述:ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS
TPS79601DCQG4 概述
ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS 超低噪声,高PSRR ,快速, RF , 1A低压降线性稳压器 稳压芯片
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A
LOW-DROPOUT LINEAR REGULATORS
FEATURES
DESCRIPTION
•
1A Low-Dropout Regulator With Enable
The TPS796xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in small outline, 3 × 3 SON, SOT223-6,
and DDPAK-5 packages. Each device in the family is
stable with a small 1µF ceramic capacitor on the
output. The family uses an advanced, proprietary
BiCMOS fabrication process to yield extremely low
dropout voltages (e.g., 250mV at 1A). Each device
achieves fast start-up times (approximately 50µs with
a 0.001µF bypass capacitor) while consuming very
low quiescent current (265 µA typical). Moreover,
when the device is placed in standby mode, the
supply current is reduced to less than 1µA. The
TPS79630 exhibits approximately 40µVRMS of output
voltage noise at 3.0V output, with a 0.1µF bypass
capacitor. Applications with analog components that
are noise sensitive, such as portable RF electronics,
benefit from the high PSRR, low noise features, and
the fast response time.
•
Available in Fixed and Adjustable (1.2V to
5.5V) Versions
•
•
•
•
•
•
High PSRR (53dB at 10kHz)
Ultralow-Noise (40µVRMS, TPS79630)
Fast Start-Up Time (50µs)
Stable With a 1µF Ceramic Capacitor
Excellent Load/Line Transient Response
Very Low Dropout Voltage (250mV at Full
Load, TPS79630)
•
3 × 3 SON, SOT223-6, and
DDPAK-5 Packages
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Bluetooth™, Wireless LAN
Cellular and Cordless Telephones
Handheld Organizers, PDAs
DRB PACKAGE
3mm x 3mm SON
(TOP VIEW)
TPS79630
RIPPLE REJECTION
vs
TPS79630
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
0.7
DCQ PACKAGE
IN
IN
1
2
3
4
8
7
6
5
EN
FREQUENCY
SOT223-6
NC
80
70
60
50
40
30
20
10
0
(TOP VIEW)
OUT
OUT
GND
NR
V
= 4 V
V
C
C
= 5.5 V
IN
IN
1
2
3
4
0.6
0.5
0.4
0.3
0.2
0.1
0.0
EN
IN
GND
OUT
NR/FB
C
C
= 10 µF
= 2.2 µF
OUT
= 0.01 µF
OUT
= 0.1 µF
NR
I
= 1 mA
OUT
NR
6
GND
I
= 1 A
OUT
5
KTT (DDPAK) PACKAGE
(TOP VIEW)
I
= 1 mA
OUT
EN
1
2
IN
GND
OUT
I
= 1.5 A
OUT
3
4
1
10 100
1k 10k 100k 1M 10M
100
1k
10k
100k
NR/FB
Frequency (Hz)
Frequency (Hz)
5
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2006, Texas Instruments Incorporated
TPS796xx
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS796xxyyyz
XX is nominal output voltage (for example, 28 = 2.8V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Output voltages from 1.3V to 4.9V in 100mV increments are available; minimum order quantities may apply. Contact factory for details
and availability.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted)(1)
UNIT
VIN range
–0.3V to 6V
VEN range
–0.3V to VIN + 0.3V
6V
VOUT range
Peak output current
ESD rating, HBM
Internally limited
2kV
ESD rating, CDM
500V
Continuous total power dissipation
Junction temperature range, TJ
Storage temperature range, Tstg
See Dissipation Ratings Table
–40°C to +150°C
–65°C to +150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE DISSIPATION RATINGS
PACKAGE
DDPAK
BOARD
High-K(1)
Low-K(2)
High-K(1)
RθJC
RθJA
2°C/W
23°C/W
53°C/W
40°C/W
SOT223
15°C/W
1.2°C/W
3 × 3 SON
(1) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), multilayer board with 1-ounce
internal power and ground planes and 2-ounce copper traces on top and bottom of the board.
(2) The JEDEC low-K (1s) board design used to derive this data was a 3-inch × 3-inch (7,5-cm × 7,5-cm), two-layer board with 2-ounce
copper traces on top of the board.
2
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range (TJ = –40°C to +125°C), VEN = VIN,, VIN = VOUT(nom) + 1 V(1), IOUT = 1mA,
COUT = 10µF, and CNR = 0.01µF, unless otherwise noted. Typical values are at +25°C.
PARAMETER
VIN Input voltage(1)
TEST CONDITIONS
MIN
TYP
MAX UNIT
2.7
5.5
1.250
1
V
V
A
VFB Internal reference (TPS79601)
IOUT Continuous output current
Output
1.200 1.225
0
voltage
range
TPS79601
1.225
5.5 – VDD
V
TPS79601(2)
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)
0.98VOUT VOUT 1.02VOUT
V
Output
voltage
Fixed
VOUT < 5V
–2.0
–3.0
+2.0
+3.0
0.12
%
Accuracy
Fixed
VOUT = 5V
0µA ≤ IOUT ≤ 1A, VOUT + 1V ≤ VIN ≤ 5.5V(1)
VOUT + 1V ≤ VIN≤ 5.5V
%
Output voltage line regulation
0.05
%/V
mV
(1)
(∆VOUT%/VIN
Load regulation (∆VOUT%/∆IOUT
TPS79628
)
)
0µA ≤ IOUT ≤ 1A
5
270
52
IOUT = 1A
365
90
TPS79628DRB IOUT = 250mA
Dropout voltage(3)
(VIN = VOUT (nom)– 0.1V)
TPS79630
TPS79633
TPS79650
IOUT = 1A
250
220
200
345
325
300
4.2
385
1
mV
IOUT = 1A
IOUT = 1A
Output current limit
Ground pin current
Shutdown current(4)
FB pin current
VOUT = 0V
2.4
A
0µA ≤ IOUT ≤ 1A
VEN = 0V, 2.7V ≤ VIN ≤ 5.5V
VFB = 1.225V
265
µA
µA
µA
0.07
1
f = 100Hz, IOUT = 10mA
f = 100Hz, IOUT = 1A
f = 10Hz, IOUT = 1A
f = 100Hz, IOUT = 1A
59
54
53
42
54
46
41
40
50
75
110
Power-supply ripple
rejection
TPS79630
dB
CNR = 0.001µF
CNR = 0.0047µF
CNR = 0.01µF
CNR = 0.1µF
BW = 100Hz to 100kHz,
IOUT = 1A
Output noise voltage (TPS79630)
Time, start-up (TPS79630)
µVRMS
CNR = 0.001µF
CNR = 0.0047µF
CNR = 0.01µF
RL = 3Ω, COUT = 1µF
µs
EN pin current
VEN = 0V
–1
1.7
0
1
VIN
0.7
µA
V
High-level enable input voltage
Low-level enable input voltage
2.7V ≤ VIN ≤ 5.5V
2.7V ≤ VIN ≤ 5.5V
V
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater. TPS79650 is tested at VIN = 5.5V.
(2) Tolerance of external resistors not included in this specification.
(3) VDO is not measured for TPS79618 and TPS79625 because minimum VIN = 2.7V.
(4) For adjustable version, this applies only after VIN is applied; then VEN transitions high to low.
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
FUNCTIONAL BLOCK DIAGRAM—ADJUSTABLE VERSION
IN
OUT
Current
Sense
UVLO
SHUTDOWN
ILIM
R
1
_
GND
EN
+
FB
UVLO
R
2
Thermal
Shutdown
Quickstart
External to
the Device
Bandgap
Reference
1.225 V
250 kΩ
V
REF
V
IN
FUNCTIONAL BLOCK DIAGRAM—FIXED VERSION
IN
OUT
UVLO
Current
Sense
GND
EN
SHUTDOWN
ILIM
R
1
_
+
UVLO
Thermal
Shutdown
R
2
Quickstart
R = 40k
2
Bandgap
Reference
1.225 V
250 kΩ
V
REF
V
IN
NR
Table 1. Terminal Functions
TERMINAL
ADJ
DESCRIPTION
NAME
FIXED
NR
N/A
5
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This
improves power-supply rejection and reduces output noise.
EN
1
1
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown
mode. EN can be connected to IN if not used.
FB
5
N/A
This terminal is the feedback input voltage for the adjustable device.
GND
IN
3, Tab
3, Tab Regulator ground
2
4
2
4
Unregulated input to the device.
Output of the regulator.
OUT
4
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
TYPICAL CHARACTERISTICS
TPS79630
OUTPUT VOLTAGE
vs
TPS79628
OUTPUT VOLTAGE
vs
TPS79628
GROUND CURRENT
vs
OUTPUT CURRENT
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
2.795
4
350
3.05
V
C
= 4 V
= 10 µF
OUT
= 25°C
V
C
= 3.8 V
V
C
= 3.8 V
IN
IN
IN
3.04
3.03
3.02
3.01
3.00
2.99
2.98
2.97
2.96
2.95
= 10 µF
= 10 µF
OUT
OUT
340
330
320
310
300
290
T
J
I
= 1 mA
OUT
2.790
2.785
I
= 1 A
I
= 1 A
OUT
OUT
2.780
I
= 1 mA
OUT
2.775
0.0
0.2
0.4
0.6
(A)
0.8
1.0
−40−25−10
5
20 35 50 65 80 95 110 125
(°C)
−40−25−10
5
20 35 50 65 80 95 110 125
(°C)
I
T
J
T
J
OUT
Figure 1.
Figure 2.
Figure 3.
TPS79630
TPS79630
TPS79630
OUTPUT SPECTRAL NOISE
OUTPUT SPECTRAL NOISE
OUTPUT SPECTRAL NOISE
DENSITY
vs
FREQUENCY
DENSITY
vs
FREQUENCY
DENSITY
vs
FREQUENCY
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
2.5
2.0
1.5
1.0
0.5
0.0
V
C
C
= 5.5 V
V
C
C
= 5.5 V
V
C
= 5.5 V
IN
IN
IN
= 2.2 µF
= 10 µF
= 10 µF
OUT
= 0.1 µF
OUT
= 0.1 µF
OUT
I = 1 A
OUT
NR
NR
C
NR
= 0.01 µF
C
NR
= 0.1 µF
I
= 1 mA
OUT
C
NR
= 0.0047 µF
I
= 1 mA
OUT
C
= 0.001 µF
NR
I
= 1 A
OUT
I
= 1.5 A
1k
OUT
100
10k
100k
100
1k
10k
100k
100
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
Figure 4.
Figure 5.
Figure 6.
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)
TPS79630
ROOT MEAN SQUARED OUTPUT
TPS79628
DROPOUT VOLTAGE
vs
TPS79630
NOISE
vs
BYPASS CAPACITANCE
RIPPLE REJECTION
vs
JUNCTION TEMPERATURE
FREQUENCY
350
300
250
200
150
100
50
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
VIN = 2.7 V
V
C
C
= 4 V
IN
µ
COUT = 10
F
= 10 µF
OUT
= 0.01 µF
I
= 1 mA
OUT
IOUT = 1 A
NR
I
= 1 A
OUT
I
C
= 250 mA
= 10 µF
OUT
OUT
BW = 100 Hz to 100 kHz
IOUT = 250 mA
0
−40−25−10
5
20 35 50 65 80 95 110 125
0.001 µF
0.0047 µF
0.01 µF
(µF)
0.1 µF
1
10
100
1k 10k 100k 1M 10M
_
(
TJ
C)
C
NR
Frequency (Hz)
Figure 7.
Figure 8.
Figure 9.
TPS79630
RIPPLE REJECTION
vs
TPS79630
RIPPLE REJECTION
vs
FREQUENCY
FREQUENCY
START-UP TIME
3
2.75
2.50
2.25
2
80
70
60
50
40
30
20
10
80
70
60
50
40
30
20
10
0
V
= 4 V,
= 10 µF,
IN
V
C
C
= 4 V
V
C
C
= 4 V
IN
= 2.2 µF
OUT
= 0.01 µF
NR
IN
C
=
NR
C
OUT
I = 1.0 A
OUT
= 10 µF
OUT
= 0.1 µF
0.0047 µF
I
= 1 mA
I
= 1 mA
OUT
OUT
NR
Enable
C
=
NR
0.001 µF
I
= 1 A
I
= 1 A
OUT
OUT
1.75
1.50
1.25
1
C
=
NR
0.01 µF
0.75
0.50
0.25
0
0
1
0
100
200
300
400
500
600
10
100
1k 10k 100k 1M 10M
1
10
100
1k 10k 100k 1M 10M
t (ms)
Frequency (Hz)
Frequency (Hz)
Figure 10.
TPS79618
Figure 11.
Figure 12.
TPS79630
LINE TRANSIENT RESPONSE
TPS79628
LOAD TRANSIENT RESPONSE
LINE TRANSIENT RESPONSE
5
4
6
5
4
3
2
1
3
0
I
C
C
= 1 A
V
C
C
= 3.8 V
IN
= 10 µF
OUT
= 0.01 µF
NR
OUT
dv
dt
dv
dt
di
dt
1 V
ms
1 V
ms
1 A
ms
2
−1
I
C
C
= 1 A
= 10 µF
OUT
= 0.01 µF
OUT
+
+
+
= 10 µF
OUT
= 0.01 µF
NR
40
20
40
20
150
75
NR
0
0
0
−20
−40
−20
−40
−75
−150
0
0
20 40 60 80 100 120 140 160 180 200
0
20 40 60 80 100 120 140 160 180 200
100 200 300 400 500 600 700 800 900 1000
t (µs)
t (µs)
t (µs)
Figure 13.
Figure 14.
Figure 15.
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
TYPICAL CHARACTERISTICS (continued)
TPS79630
DROPOUT VOLTAGE
vs
TPS79601
DROPOUT VOLTAGE
vs
TPS79625
POWER UP/POWER DOWN
OUTPUT CURRENT
INPUT VOLTAGE
300
250
200
150
100
50
4.0
3.5
3.0
2.5
350
300
250
200
150
100
50
V
R
C
= 2.5 V
= 10 Ω
= 0.01 µF
OUT
L
NR
T
J
= 125°C
T
= 125°C
J
T
= 25°C
J
T
J
= 25°C
2.0
1.5
1.0
0.5
0
T
= −40°C
J
V
IN
T
J
= −40°C
I
C
C
= 1 A
= 10 µF
OUT
= 0.01 µF
OUT
V
OUT
NR
0
0
0
1
2
3
4
5
6
7
8
9
10
0
100 200 300 400 500 600 700 800 9001000
(mA)
2.5
3.0
3.5
4.0
4.5
5.0
I
V
(V)
IN
200 µs/Div
OUT
Figure 16.
Figure 17.
Figure 18.
TPS79630
TPS79630
TPS79630
TYPICAL REGIONS OF STABILITY
TYPICAL REGIONS OF STABILITY
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
EQUIVALENT SERIES RESISTANCE
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
(ESR)
vs
(ESR)
vs
OUTPUT CURRENT
OUTPUT CURRENT
OUTPUT CURRENT
100
100
10
100
10
C
OUT
= 10.0 µF
C
OUT
= 1 µF
C
OUT
= 2.2 µF
Region of
Instability
Region of
Instability
10
Region of
Instability
1
0.1
1
0.1
1
0.1
Region of Stability
Region of Stability
Region of Stability
0.01
1
10 30 60 125 250 500 750 1000
(mA)
0.01
0.01
I
OUT
1
10 30 60 125 250 500 750 1000
(mA)
1
10 30 60 125 250 500 750 1000
(mA)
I
I
OUT
OUT
Figure 19.
Figure 20.
Figure 21.
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SLVS351I–SEPTEMBER 2002–REVISED MAY 2006
APPLICATION INFORMATION
The TPS796xx family of low-dropout (LDO)
regulators has been optimized for use in
noise-sensitive equipment. The device features
extremely low dropout voltages, high PSRR, ultralow
output noise, low quiescent current (265µA typically),
and enable input to reduce supply currents to less
than 1µA when the regulator is turned off.
For example, the TPS79630 exhibits 40µVRMS of
output voltage noise using a 0.1µF ceramic bypass
capacitor and a 10µF ceramic output capacitor. Note
that the output starts up slower as the bypass
capacitance increases due to the RC time constant
at the bypass pin that is created by the internal
250kΩ resistor and external capacitor.
A typical application circuit is shown in Figure 22.
Board Layout Recommendation to Improve
PSRR and Noise Performance
VIN
VOUT
IN
OUT
TPS796xx
GND
To improve ac measurements like PSRR, output
noise, and transient response, it is recommended
that the board be designed with separate ground
planes for VIN and VOUT, with each ground plane
connected only at the ground pin of the device. In
addition, the ground connection for the bypass
capacitor should connect directly to the ground pin of
the device.
2.2µF
1 µF
EN
NR
µ
0.01 F
Figure 22. Typical Application Circuit
External Capacitor Requirements
Although not required, it is good analog design
practice to place a 0.1µF — 2.2µF capacitor near the
input of the regulator to counteract reactive input
sources. A 2.2µF or larger ceramic input bypass
capacitor, connected between IN and GND and
located close to the TPS796xx, is required for
stability and improves transient response, noise
rejection, and ripple rejection. A higher-value input
capacitor may be necessary if large, fast-rise-time
load transients are anticipated and the device is
located several inches from the power source.
Regulator Mounting
The tab of the SOT223-6 package is electrically
connected to ground. For best thermal performance,
the tab of the surface-mount version should be
soldered directly to a circuit-board copper area.
Increasing the copper area improves heat
dissipation.
Solder pad footprint recommendations for the
devices are presented in an application bulletin
Solder Pad Recommendations for Surface-Mount
Devices, literature number AB-132, available for
download from the TI web site (www.ti.com).
Like most low dropout regulators, the TPS796xx
requires an output capacitor connected between
OUT and GND to stabilize the internal control loop.
The minimum recommended capacitor is 1µF. Any
1µF or larger ceramic capacitor is suitable.
Programming the TPS79601 Adjustable LDO
Regulator
The output voltage of the TPS79601 adjustable
regulator is programmed using an external resistor
divider as shown in Figure 28. The output voltage is
calculated using Equation 1:
The internal voltage reference is a key source of
noise in an LDO regulator. The TPS796xx has an
NR pin which is connected to the voltage reference
through
a 250kΩ internal resistor. The 250kΩ
internal resistor, in conjunction with an external
bypass capacitor connected to the NR pin, creates a
low-pass filter to reduce the voltage reference noise
and, therefore, the noise at the regulator output. In
order for the regulator to operate properly, the
current flow out of the NR pin must be at a minimum,
because any leakage current creates an IR drop
across the internal resistor, thus creating an output
error. Therefore, the bypass capacitor must have
minimal leakage current. The bypass capacitor
should be no more than 0.1µF in order to ensure that
it is fully charged during the quickstart time provided
by the internal switch shown in the functional block
diagram.
R1
R2
ǒ Ǔ
VOUT + VREF 1)
(1)
where:
•
VREF = 1.2246V typ (the internal reference
voltage)
Resistors R1 and R2 should be chosen for
approximately 40µA divider current. Lower value
resistors can be used for improved noise
performance, but the device wastes more power.
Higher values should be avoided, as leakage current
at FB increases the output voltage error.
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The recommended design procedure is to choose
R2 = 30.1kΩ to set the divider current at 40µA, C1 =
15pF for stability, and then calculate R1 using
Equation 2:
Regulator Protection
The TPS796xx PMOS-pass transistor has a built-in
back diode that conducts reverse current when the
input voltage drops below the output voltage (e.g.,
during power-down). Current is conducted from the
output to the input and is not internally limited. If
extended reverse voltage operation is anticipated,
external limiting might be appropriate.
R1 + ǒVOUT Ǔ
VREF
*1 R2
(2)
In order to improve the stability of the adjustable
version, it is suggested that a small compensation
capacitor be placed between OUT and FB. The
approximate value of this capacitor can be calculated
as Equation 3:
The TPS796xx features internal current limiting and
thermal protection. During normal operation, the
TPS796xx limits output current to approximately
2.8A. When current limiting engages, the output
voltage scales back linearly until the overcurrent
condition ends. While current limiting is designed to
prevent gross device failure, care should be taken
not to exceed the power dissipation ratings of the
package. If the temperature of the device exceeds
approximately +165°C, thermal-protection circuitry
shuts it down. Once the device has cooled down to
below approximately +140°C, regulator operation
resumes.
–7
(3 x 10 ) x (R1 ) R2)
C1 +
(R1 x R2)
(3)
The suggested value of this capacitor for several
resistor ratios is shown in the table below (see
Figure 23). If this capacitor is not used (such as in a
unity-gain configuration) then the minimum
recommended output capacitor is 2.2µF instead of
1µF.
OUTPUT VOLTAGE
VOUT
VIN
PROGRAMMING GUIDE
IN
OUT
TPS79601
R1
R2
C1
OUTPUT
VOLTAGE
2.2 µF
EN
1 µF
R1
R2
C1
GND
FB
1.8 V
3.6V
14.0 kΩ 30.1 kΩ
33 pF
57.9 kΩ 30.1 kΩ 15 pF
Figure 23. TPS79601 Adjustable LDO Regulator Programming
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THERMAL INFORMATION
dissipation. The temperature rise is computed by
multiplying the maximum expected power dissipation
by the sum of the thermal resistances between the
junction and the case (RθJC), the case to heatsink
(RθCS), and the heatsink to ambient (RθSA). Thermal
resistances are measures of how effectively an
object dissipates heat. Typically, the larger the
device, the more surface area available for power
dissipation and the lower the object's thermal
resistance.
The amount of heat that an LDO linear regulator
generates is directly proportional to the amount of
power it dissipates during operation. All integrated
circuits have
a
maximum allowable junction
temperature (TJmax) above which normal operation
is not assured. A system designer must design the
operating environment so that the operating junction
temperature (TJ) does not exceed the maximum
junction temperature (TJmax). The two main
environmental variables that a designer can use to
improve thermal performance are air flow and
external heatsinks. The purpose of this information is
to aid the designer in determining the proper
operating environment for a linear regulator that is
operating at a specific power level.
Figure 24 illustrates these thermal resistances for (a)
a SOT223 package mounted in a JEDEC low-K
board, and (b) a DDPAK package mounted on a
JEDEC high-K board.
Equation 5 summarizes the computation:
In general, the maximum expected power (PD(max)
consumed by a linear regulator is computed as
Equation 4:
)
ǒ
θSAǓ
T
+ T ) P max x R
) R
) R
D
J
A
θJC
θCS
(5)
ǒ
Ǔ
PD max + VIN(avg)* VOUT(avg) IOUT(avg))VIN(avg) I(Q)
The RθJC is specific to each regulator as determined
by its package, lead frame, and die size provided in
the regulator's data sheet. The RθSA is a function of
the type and size of heatsink. For example, black
body radiator type heatsinks can have RθCS values
ranging from 5°C/W for very large heatsinks to
50°C/W for very small heatsinks. The RθCS is a
function of how the package is attached to the
heatsink. For example, if a thermal compound is
used to attach a heatsink to a SOT223 package,
(4)
where:
•
•
•
•
VIN(avg) is the average input voltage.
VOUT(avg) is the average output voltage.
IOUT(avg) is the average output current.
I(Q) is the quiescent current.
For most TI LDO regulators, the quiescent current is
insignificant compared to the average output current;
therefore, the term VIN(avg) × I(Q) can be neglected.
The operating junction temperature is computed by
adding the ambient temperature (TA) and the
increase in temperature due to the regulator's power
RθCS of 1°C/W is reasonable.
T
T
A
J
A
CIRCUIT BOARD COPPER AREA
R
θ
JC
B
C
B
C
B
R
R
θ
CS
A
C
θ
SA
C
DDPAK Package
(b)
SOT223 Package
(a)
T
A
Figure 24. Thermal Resistances
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Even if no external black body radiator type heatsink
is attached to the package, the board on which the
regulator is mounted provides some heatsinking
through the pin solder connections. Some packages,
like the DDPAK and SOT223 packages, use a
copper plane underneath the package or the circuit
board's ground plane for additional heatsinking to
improve their thermal performance. Computer-aided
thermal modeling can be used to compute very
accurate approximations of an integrated circuit's
R
max + (125 * 55)°Cń2.5 W + 28°CńW
θJA
(9)
From Figure 25, DDPAK Thermal Resistance vs
Copper Heatsink Area, the ground plane needs to be
1cm2 for the part to dissipate 2.5W. The operating
environment used in the computer model to construct
Figure 25 consisted of a standard JEDEC High-K
board (2S2P) with a 1-oz. internal copper plane and
ground plane. The package is soldered to a 2-oz.
copper pad. The pad is tied through thermal vias to
the 1-oz. ground plane. Figure 26 shows the side
view of the operating environment used in the
computer model.
thermal
performance
in
different
operating
environments (e.g., different types of circuit boards,
different types and sizes of heatsinks, and different
air flows, etc.). Using these models, the three
thermal resistances can be combined into one
thermal resistance between junction and ambient
(RθJA). This RθJA is valid only for the specific
operating environment used in the computer model.
40
No Air Flow
35
Equation 5 simplifies into Equation 6:
150 LFM
30
T
+ T ) P max x R
D
J
A
θJA
(6)
(7)
Rearranging Equation 6 gives Equation 7:
T –T
+
250 LFM
25
J
A
R
θJA
P max
D
Using Equation 6 and the computer model generated
curves shown in Figure 25 and Figure 28, a designer
can quickly compute the required heatsink thermal
20
15
resistance/board area for
a
given ambient
temperature, power dissipation, and operating
environment.
0.1
1
10
100
2
Copper Heatsink Area − cm
DDPAK Power Dissipation
Figure 25. DDPAK Thermal Resistance vs Copper
Heatsink Area
The DDPAK package provides an effective means of
managing power dissipation in surface mount
applications. The DDPAK package dimensions are
provided in the Mechanical Data section at the end
of the data sheet. The addition of a copper plane
directly underneath the DDPAK package enhances
the thermal performance of the package.
2 oz. Copper Solder Pad
with 25 Thermal Vias
1 oz. Copper
Power Plane
To illustrate, the TPS72525 in a DDPAK package
was chosen. For this example, the average input
voltage is 5V, the output voltage is 2.5V, the average
output current is 1A, the ambient temperature 55°C,
the air flow is 150 LFM, and the operating
environment is the same as documented below.
Neglecting the quiescent current, the maximum
average power is calculated as Equation 8:
1 oz. Copper
Ground Plane
Thermal Vias, 0.3 mm
Diameter, 1,5 mm Pitch
Figure 26. DDPAK Thermal Resistance
(
)
P max + 5 * 2.5 V x 1 A + 2.5 W
D
(8)
From the data in Figure 27 and rearranging
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed.
Substituting TJmax for TJ into Equation 6 gives
Equation 9:
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5
180
160
No Air Flow
T
A
= 55°C
140
120
100
250 LFM
4
3
150 LFM
80
60
40
No Air Flow
2
20
0
1
0.1
1
10
0.1
1
10
100
2
2
PCB Copper Area − in
Copper Heatsink Area − cm
Figure 28. SOT223 Thermal Resistance vs PCB
Area
Figure 27. Maximum Power Dissipation vs
Copper Heatsink Area
From the data in Figure 28 and rearranging
Equation 6, the maximum power dissipation for a
different ground plane area and a specific ambient
temperature can be computed (see Figure 29).
SOT223 Power Dissipation
The SOT223 package provides an effective means
of managing power dissipation in surface mount
applications. The SOT223 package dimensions are
provided in the Mechanical Data section at the end
of the data sheet. The addition of a copper plane
directly underneath the SOT223 package enhances
the thermal performance of the package.
6
T
A
= 25°C
5
4
To illustrate, the TPS72525 in a SOT223 package
was chosen. For this example, the average input
voltage is 3.3V, the output voltage is 2.5V, the
average output current is 1A, the ambient
temperature 55°C, no air flow is present, and the
operating environment is the same as documented
below. Neglecting the quiescent current, the
maximum average power is calculated as
Equation 10:
2
4 in PCB Area
3
2
2
0.5 in PCB Area
1
0
(
)
P max + 3.3 * 2.5 V x 1 A + 800 mW
D
(10)
Substituting TJmax for TJ into Equation 6 gives
Equation 11:
0
25
50
75
100
125
150
R
max + (125 * 55)°Cń800 mW + 87.5°CńW
θJA
T
A
(°C)
(11)
Figure 29. SOT223 Power Dissipation
From Figure 28, RθJA vs PCB Copper Area, the
ground plane needs to be 0.55in2 for the part to
dissipate 800mW. The operating environment used
to construct Figure 28 consisted of a board with 1-oz.
copper planes. The package is soldered to a 1-oz.
copper pad on the top of the board. The pad is tied
through thermal vias to the 1-oz. ground plane.
12
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
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applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Applications
Audio
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/audio
Automotive
Broadband
Digital Control
Military
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
interface.ti.com
logic.ti.com
Logic
Power Mgmt
Microcontrollers
power.ti.com
Optical Networking
Security
www.ti.com/opticalnetwork
www.ti.com/security
microcontroller.ti.com
www.ti.com/lpw
Low Power
Wireless
Telephony
www.ti.com/telephony
Video & Imaging
Wireless
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
TPS79601DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-223
DCQ
6
6
6
6
5
5
5
5
5
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79601DCQG4
TPS79601DCQR
TPS79601DCQRG4
TPS79601KTT
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DCQ
KTT
KTT
KTT
KTT
KTT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
TPS79601KTTR
TPS79601KTTRG3
TPS79601KTTT
TPS79601KTTTG3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
TPS79613DRBR
TPS79613DRBT
TPS79618DCQ
PREVIEW
PREVIEW
ACTIVE
SON
SON
DRB
DRB
DCQ
8
8
6
TBD
TBD
Call TI
Call TI
Call TI
Call TI
SOT-223
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79618DCQG4
TPS79618DCQR
TPS79618DCQRG4
TPS79618KTT
ACTIVE
ACTIVE
ACTIVE
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DCQ
KTT
KTT
KTT
KTT
KTT
DCQ
DCQ
DCQ
DCQ
KTT
KTT
6
6
6
5
5
5
5
5
6
6
6
6
5
5
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
TPS79618KTTR
TPS79618KTTRG3
TPS79618KTTT
TPS79618KTTTG3
TPS79625DCQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
SOT-223
SOT-223
SOT-223
SOT-223
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79625DCQG4
TPS79625DCQR
TPS79625DCQRG4
TPS79625KTT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
Call TI
TPS79625KTTR
ACTIVE
DDPAK/
500 Green (RoHS &
CU SN
Level-2-260C-1 YEAR
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO-263
no Sb/Br)
TPS79625KTTRG3
TPS79625KTTT
TPS79625KTTTG3
TPS79628DCQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
KTT
KTT
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
KTT
KTT
KTT
KTT
KTT
DCQ
DCQ
DCQ
DCQ
KTT
KTT
KTT
KTT
KTT
5
5
5
6
6
6
6
8
8
8
8
5
5
5
5
5
6
6
6
6
5
5
5
5
5
500 Green (RoHS &
no Sb/Br)
CU SN
CU SN
CU SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
SOT-223
SOT-223
SOT-223
SOT-223
SON
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79628DCQG4
TPS79628DCQR
TPS79628DCQRG4
TPS79628DRBR
TPS79628DRBRG4
TPS79628DRBT
TPS79628DRBTG4
TPS79628KTT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
TPS79628KTTR
TPS79628KTTRG3
TPS79628KTTT
TPS79628KTTTG3
TPS79630DCQ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
SOT-223
SOT-223
SOT-223
SOT-223
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79630DCQG4
TPS79630DCQR
TPS79630DCQRG4
TPS79630KTT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
TPS79630KTTR
TPS79630KTTRG3
TPS79630KTTT
TPS79630KTTTG3
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
50 Green (RoHS &
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
Orderable Device
TPS79633DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-223
DCQ
6
6
6
6
5
5
5
5
5
6
6
6
6
8
8
8
8
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79633DCQG4
TPS79633DCQR
TPS79633DCQRG4
TPS79633KTT
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DCQ
KTT
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
OBSOLETE DDPAK/
TO-263
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
Call TI
TPS79633KTTR
TPS79633KTTRG3
TPS79633KTTT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTT
500 Green (RoHS &
no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
DDPAK/
TO-263
KTT
500 Green (RoHS &
no Sb/Br)
DDPAK/
TO-263
KTT
50 Green (RoHS &
no Sb/Br)
TPS79633KTTTG3
TPS79650DCQ
DDPAK/
TO-263
KTT
50 Green (RoHS &
no Sb/Br)
SOT-223
SOT-223
SOT-223
SOT-223
SON
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS79650DCQG4
TPS79650DCQR
TPS79650DCQRG4
TPS79650DRBR
TPS79650DRBRG4
TPS79650DRBT
TPS79650DRBTG4
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
180
330
330
330
330
180
(mm)
8
TPS79601DCQR
TPS79618DCQR
TPS79625DCQR
TPS79628DCQR
TPS79628DRBR
TPS79628DRBT
TPS79630DCQR
TPS79633DCQR
TPS79650DCQR
TPS79650DRBR
TPS79650DRBT
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DCQ
DCQ
DCQ
DRB
DRB
6
6
6
6
8
8
6
6
6
8
8
HNT
HNT
HNT
HNT
MLA
MLA
HNT
HNT
HNT
MLA
MLA
6.8
6.8
6.8
6.8
3.3
3.3
6.8
6.8
6.8
3.3
3.3
7.3
7.3
7.3
7.3
3.3
3.3
7.3
7.3
7.3
3.3
3.3
1.88
1.88
1.88
1.88
1.1
8
8
8
8
8
8
8
8
8
8
8
12
12
12
12
12
12
12
12
12
12
12
Q3
Q3
Q3
Q3
Q2
Q2
Q3
Q3
Q3
Q2
Q2
8
8
8
12
12
8
1.1
1.88
1.88
1.88
1.1
8
8
12
12
1.1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS79601DCQR
TPS79618DCQR
TPS79625DCQR
TPS79628DCQR
TPS79628DRBR
TPS79628DRBT
TPS79630DCQR
TPS79633DCQR
TPS79650DCQR
TPS79650DRBR
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DCQ
DCQ
DCQ
DRB
6
6
6
6
8
8
6
6
6
8
HNT
HNT
HNT
HNT
MLA
MLA
HNT
HNT
HNT
MLA
358.0
358.0
358.0
358.0
346.0
190.0
358.0
358.0
358.0
346.0
335.0
335.0
335.0
335.0
346.0
212.7
335.0
335.0
335.0
346.0
35.0
35.0
35.0
35.0
29.0
31.75
35.0
35.0
35.0
29.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
15-May-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TPS79650DRBT
DRB
8
MLA
190.0
212.7
31.75
Pack Materials-Page 3
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Wireless
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Copyright © 2007, Texas Instruments Incorporated
TPS79601DCQG4 替代型号
型号 | 制造商 | 描述 | 替代类型 | 文档 |
TPS79601DCQ | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 类似代替 | |
TPS79601DCQR | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 类似代替 | |
TPS79601DCQRG4 | TI | ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS | 类似代替 |
TPS79601DCQG4 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
TPS79601DCQR | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 获取价格 | |
TPS79601DCQRG4 | TI | ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS | 获取价格 | |
TPS79601DRBR | TI | Ultralow-Noise, High PSRR, Fast, RF, 1A Low-Dropout Linear Regulators | 获取价格 | |
TPS79601DRBRG4 | TI | Ultralow-Noise, High PSRR, Fast, RF, 1A Low-Dropout Linear Regulators | 获取价格 | |
TPS79601DRBT | TI | Ultralow-Noise, High PSRR, Fast, RF, 1A Low-Dropout Linear Regulators | 获取价格 | |
TPS79601DRBTG4 | TI | Ultralow-Noise, High PSRR, Fast, RF, 1A Low-Dropout Linear Regulators | 获取价格 | |
TPS79601KTT | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 获取价格 | |
TPS79601KTTR | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 获取价格 | |
TPS79601KTTRG3 | TI | ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS | 获取价格 | |
TPS79601KTTT | TI | ULTRALOW-NOISE, HIGH PSRR, FAST RF 1-A LOW-DROPOUT LINEAR REGULATORS | 获取价格 |
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