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TPS799315YZUT [TI]

200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator; 200mA，低静态电流，超低噪声，高PSRR低压降线性稳压器
TPS799315YZUT
型号： TPS799315YZUT
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
200mA，低静态电流，超低噪声，高PSRR低压降线性稳压器

线性稳压器IC 调节器 电源电路 输出元件 信息通信管理
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TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR  
Low Dropout Linear Regulator  
1
FEATURES  
DESCRIPTION  
23  
•
200mA Low Dropout Regulator with EN  
The TPS799xx family of low-dropout (LDO)  
low-power linear regulators offer excellent AC  
performance with very low ground current. High  
power-supply rejection ratio (PSRR), low noise, fast  
start-up, and excellent line and load transient  
response are provided while consuming a very low  
40µA (typical) ground current. The TPS799xx is  
stable with ceramic capacitors and uses an advanced  
BiCMOS fabrication process to yield dropout voltage  
typically 100mV at 200mA output. The TPS799xx  
uses a precision voltage reference and feedback loop  
to achieve overall accuracy of 2% over all load, line,  
process, and temperature variations. It is fully  
specified from TJ = –40°C to +125°C and is offered in  
low profile ThinSOT23, Wafer Chip-Scale (WCSP),  
and 2mm × 2mm SON packages, ideal for wireless  
handsets and WLAN cards.  
•
•
Low IQ: 40µA  
Multiple Output Voltage Versions Available:  
–
Fixed Outputs of 1.2V to 4.5V Using  
Innovative Factory EEPROM Programming  
–
Adjustable Outputs from 1.20V to 6.5V  
•
•
•
•
High PSRR: 66dB at 1kHz  
Ultra-low Noise: 29.5µVRMS  
Fast Start-Up Time: 45µs  
Stable with a Low-ESR, 2.0µF Typical Output  
Capacitance  
•
•
•
•
Excellent Load/Line Transient Response  
2% Overall Accuracy (Load/Line/Temp)  
Very Low Dropout: 100mV  
ThinSOT-23, WCSP, and 2mm × 2mm SON-6  
Packages  
APPLICATIONS  
•
•
•
•
Cellular Phones  
Wireless LAN, Bluetooth®  
VCOs, RF  
Handheld Organizers, PDAs  
TPS799xxDDC  
TSOT23-5  
TPS79901DDC  
TSOT23-5  
TPS799xxYZU  
WCSP  
(TOP VIEW)  
TPS79901YZU  
WCSP  
(TOP VIEW)  
(TOP VIEW)  
(TOP VIEW)  
C3  
C1  
C3  
C1  
5
4
5
4
1
2
3
1
2
3
IN  
GND  
EN  
OUT  
FB  
IN  
GND  
EN  
OUT  
NR  
IN  
GND  
NR  
OUT  
EN  
IN  
GND  
FB  
OUT  
EN  
B2  
B2  
A3  
A1  
A3  
A1  
TPS799xxDRV  
2mm x 2mm SON-6  
(TOP VIEW)  
TPS79901DRV  
2mm x 2mm SON-6  
(TOP VIEW)  
OUT  
NR  
1
2
3
OUT  
FB  
1
2
3
6
5
4
IN  
6
5
4
IN  
GND  
GND  
N/C  
EN  
N/C  
EN  
GND  
GND  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
Bluetooth is a registered trademark of Bluetooth SIG, Inc.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2005–2007, Texas Instruments Incorporated  
TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
(2)  
PRODUCT  
VOUT  
TPS799xxyyyz  
XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).(3)  
YYY is package designator.  
Z is package quantity.  
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;  
minimum order quantities may apply. Contact factory for details and availability.  
(3) For fixed 1.2V operation, tie FB to OUT.  
ABSOLUTE MAXIMUM RATINGS  
Over operating temperature range (unless otherwise noted).(1)  
PARAMETER  
TPS799xx  
–0.3 to +7.0  
UNIT  
VIN range  
V
V
V
VEN range  
–0.3 to VIN +0.3  
–0.3 to VIN +0.3  
Internally limited  
VOUT range  
Peak output current  
Continuous total power dissipation  
Junction temperature range, TJ  
Storage junction temperature range , TSTG  
ESD rating, HBM  
See Dissipation Ratings Table  
–55 to +150  
°C  
°C  
kV  
V
–55 to +150  
2
ESD rating, CDM  
500  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
DISSIPATION RATINGS  
DERATING FACTOR  
BOARD  
Low-K(1)  
High-K(2)  
Low-K(1)  
High-K(2)  
Low-K(1)  
High-K(2)  
PACKAGE  
DDC  
RθJC  
RθJA  
ABOVE TA = 25°C  
TA < 25°C  
360mW  
500mW  
390mW  
530mW  
715mW  
1540mW  
TA = 70°C  
200mW  
275mW  
215mW  
295mW  
395mW  
845mW  
TA = 85°C  
145mW  
200mW  
155mW  
215mW  
285mW  
615mW  
90°C/W  
90°C/W  
27°C/W  
27°C/W  
20°C/W  
20°C/W  
280°C/W  
200°C/W  
255°C/W  
190°C/W  
140°C/W  
65°C/W  
3.6mW/°C  
DDC  
5.0mW/°C  
YZU  
3.9mW/°C  
YZU  
5.3mW/°C  
DRV  
7.1mW/°C  
DRV  
15.4mW/°C  
(1) The JEDEC low-K (1s) board used to derive this data was a 3in × 3in, two-layer board with 2-ounce copper traces on top of the board.  
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in × 3in, multilayer board with 1-ounce internal power and ground  
planes and 2-ounce copper traces on top and bottom of the board.  
2
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Copyright © 2005–2007, Texas Instruments Incorporated  
TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
ELECTRICAL CHARACTERISTICS  
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
PARAMETER  
Input voltage range(1)  
TEST CONDITIONS  
MIN  
2.7  
TYP  
MAX  
6.5  
UNIT  
V
VIN  
VFB  
Internal reference (TPS79901)  
Output voltage range (TPS79901)  
1.169  
VFB  
1.193  
1.217  
V
VOUT  
VOUT  
6.5 – VDO  
+1.0  
V
Output accuracy  
Nominal  
Over VIN  
TJ = +25°C  
VOUT + 0.3V ≤ VIN ≤ 6.5V  
–1.0  
%
,
VOUT  
Output accuracy(1)  
–2.0  
±1.0  
+2.0  
%
IOUT, Temp 500µA ≤ IOUT ≤ 200mA  
VOUT(NOM) + 0.3V ≤ VIN ≤ 6.5V  
500µA ≤ IOUT ≤ 200mA  
ΔVOUT%/ ΔVIN Line regulation(1)  
ΔVOUT%/ ΔIOUT Load regulation  
0.02  
%/V  
0.002  
%/mA  
Dropout voltage(2)  
(VIN = VOUT(NOM) – 0.1V)  
VDO  
VOUT < 3.3V IOUT = 200mA  
100  
90  
175  
160  
mV  
mV  
Dropout voltage  
(VIN = VOUT(NOM) – 0.1V)  
VDO  
VOUT ≥ 3.3V IOUT = 200mA  
ICL  
IGND  
ISHDN  
IFB  
Output current limit  
Ground pin current  
VOUT = 0.9 × VOUT(NOM)  
500µA ≤ IOUT ≤ 200mA  
200  
400  
40  
600  
60  
mA  
µA  
µA  
µA  
dB  
dB  
dB  
dB  
µVRMS  
µVRMS  
µs  
Shutdown current (IGND  
)
VEN ≤ 0.4V, 2.7V ≤ VIN ≤ 6.5V  
0.15  
1.0  
0.5  
Feedback pin current (TPS79901)  
–0.5  
f = 100Hz  
70  
66  
51  
38  
Power-supply rejection ratio  
VIN = 3.85V, VOUT = 2.85V,  
CNR = 0.01µF, IOUT = 100mA  
f = 1kHz  
PSRR  
VN  
f = 10kHz  
f = 100kHz  
CNR = 0.01µF  
CNR = none  
CNR = 0.001µF  
CNR = 0.047µF  
CNR = 0.01µF  
CNR = none  
10.5 x VOUT  
Output noise voltage  
BW = 10Hz to 100kHz, VOUT = 2.8V  
94 x VOUT  
45  
45  
50  
50  
Startup time  
VOUT = 2.85V,  
RL = 14Ω, COUT = 2.2µF  
µs  
TSTR  
µs  
µs  
VEN(HI)  
VEN(LO)  
IEN(HI)  
Enable high (enabled)  
Enable low (shutdown)  
Enable pin current, enabled  
1.2  
0
VIN  
0.4  
1.0  
V
V
VEN = VIN = 6.5V  
0.03  
165  
145  
µA  
°C  
Shutdown, temperature increasing  
Reset, temperature decreasing  
TSD  
TJ  
Thermal shutdown temperature  
°C  
Operating junction temperature  
Under-voltage lock-out  
Hysteresis  
–40  
+125  
2.65  
°C  
VIN rising  
VIN falling  
1.90  
2.20  
70  
V
UVLO  
mV  
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.  
(2) VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.  
Copyright © 2005–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
DEVICE INFORMATION  
FUNCTIONAL BLOCK DIAGRAMS  
IN  
OUT  
IN  
OUT  
Ω
400  
Ω
400  
µ
2
A
Ω
3.3M  
Current  
Limit  
Current  
Limit  
Overshoot  
Detect  
Overshoot  
Detect  
Thermal  
Shutdown  
Thermal  
Shutdown  
EN  
EN  
UVLO  
UVLO  
Quickstart  
1.193V  
Bandgap  
1.193V  
Bandgap  
NR  
FB  
500k  
500k  
GND  
GND  
Figure 1. Fixed Voltage Versions  
Figure 2. Adjustable Voltage Versions  
PIN CONFIGURATIONS  
TPS799xxDDC  
TSOT23-5  
TPS79901DDC  
TSOT23-5  
TPS799xxYZU  
WCSP  
(TOP VIEW)  
TPS79901YZU  
WCSP  
(TOP VIEW)  
(TOP VIEW)  
(TOP VIEW)  
C3  
A3  
C1  
A1  
C3  
C1  
5
4
5
4
1
2
3
1
2
3
IN  
GND  
EN  
OUT  
FB  
IN  
GND  
EN  
OUT  
NR  
IN  
GND  
NR  
OUT  
EN  
IN  
GND  
FB  
OUT  
B2  
B2  
A3  
A1  
EN  
TPS799xxDRV  
2mm x 2mm SON-6  
(TOP VIEW)  
TPS79901DRV  
2mm x 2mm SON-6  
(TOP VIEW)  
OUT  
NR  
1
2
3
OUT  
FB  
1
2
3
6
5
4
IN  
6
5
4
IN  
GND  
GND  
N/C  
EN  
N/C  
EN  
GND  
GND  
Table 1. PIN DESCRIPTIONS  
TPS799xx  
NAME  
IN  
DDC  
YZU  
C3  
DRV  
DESCRIPTION  
1
2
6
Input supply.  
GND  
B2  
3, Pad Ground. The pad must be tied to GND.  
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator  
into shutdown mode. EN can be connected to IN if not used.  
EN  
NR  
FB  
3
4
4
A1  
A3  
A3  
4
2
2
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise  
generated by the internal bandgap. This capacitor allows output noise to be reduced to very  
low levels.  
Adjustable version only; this pin is the input to the control loop error amplifier, and is used to  
set the output voltage of the device.  
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0µF ceramic) is  
needed from this pin to ground to assure stability.  
OUT  
N/C  
5
C1  
—
1
5
—
Not internally connected. This pin must either be left open, or tied to GND.  
Copyright © 2005–2007, Texas Instruments Incorporated  
4
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TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
TYPICAL CHARACTERISTICS  
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
LOAD REGULATION  
LINE REGULATION  
28.50  
21.38  
14.25  
7.13  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
IOUT = 100mA  
T
= −40°C  
J
T
= +25°C  
J
T
= +25°C  
J
T
= −40°C  
J
−
−
−
−
−
0.2  
0.4  
0.6  
0.8  
1.0  
−
7.13  
T
= +125°C  
J
T
= +85°C  
−
14.25  
21.38  
28.50  
J
T
= +125°C  
T
= +85°C  
J
J
−
−
2.5  
3.5  
4.5  
5.5  
6.5  
7.5  
0
50  
100  
OUT (mA)  
Figure 3.  
150  
200  
VIN (V)  
I
Figure 4.  
OUTPUT VOLTAGE vs  
JUNCTION TEMPERATURE  
TPS799285 DROPOUT VOLTAGE vs  
OUTPUT CURRENT  
200  
180  
160  
140  
120  
100  
80  
2.0  
1.5  
1.0  
0.5  
0
_
TJ = +125 C  
_
TJ = +85 C  
IOUT = 1mA  
IOUT = 100mA  
−
−
−
−
0.5  
1.0  
1.5  
2.0  
_
TJ = +25 C  
IOUT = 200mA  
60  
40  
−
_
TJ  
= 40 C  
20  
0
0
50  
100  
150  
200  
−
−
−
40 25 15  
5
20 35 50 65 80 95 110 125  
(°C)  
IOUT (mA)  
T
J
Figure 5.  
Figure 6.  
TPS799285 DROPOUT VOLTAGE vs  
JUNCTION TEMPERATURE  
TPS79901 DROPOUT vs  
INPUT VOLTAGE  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
200  
180  
160  
140  
120  
100  
80  
IOUT = 200mA  
IOUT = 200mA  
IOUT = 100mA  
60  
40  
20  
IOUT = 1mA  
0
−
−
−
40 25 15  
5
20 35 50 65 80 95 110 125  
2.5  
3.0  
3.5  
4.0  
4.5  
VIN (V)  
Figure 8.  
5.0  
5.5 6.0  
6.5  
7.0  
T
(°C)  
J
Figure 7.  
Copyright © 2005–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
GROUND PIN CURRENT vs  
INPUT VOLTAGE  
TPS799285 GROUND PIN CURRENT vs  
JUNCTION TEMPERATURE  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
VIN = 3.2V  
VIN = 5.0V  
IOUT = 200mA  
IOUT = 500mA  
VIN = 2.7V  
(dropout)  
VOUT = 2.85V  
IOUT = 200mA  
VOUT = 2.85V  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
6.0  
6.5  
7.0  
−
−
−
40 25 15  
5
20 35 50 65 80 95 110 125  
(°C)  
VIN (V)  
Figure 9.  
T
J
Figure 10.  
GROUND PIN CURRENT (DISABLED) vs  
JUNCTION TEMPERATURE  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 1.0V)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
600  
500  
400  
300  
200  
100  
0
VEN = 0.4V  
IOUT = 100mA  
IOUT = 1mA  
IOUT = 200mA  
VIN = 6.5V  
VIN = 3.2V  
µ
CNR = 0.01 F  
µ
COUT = 2.2 F  
10 100  
1k  
10k  
100k  
1M  
10M  
−
−
−
40 25 15  
5
20 35 50 65 80 95 110 125  
Frequency (Hz)  
T
(°C)  
J
Figure 11.  
Figure 12.  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 0.5V)  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 0.25V)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IOUT = 100mA  
IOUT = 1mA  
IOUT = 1mA  
IOUT = 200mA  
IOUT = 100mA  
IOUT = 200mA  
100k  
µ
CNR = 0.01 F  
µ
CNR = 0.01 F  
µ
COUT = 2.2 F  
µ
COUT = 2.2 F  
10 100  
1k  
10k  
1M  
10M  
10 100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
Figure 14.  
Figure 13.  
6
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Copyright © 2005–2007, Texas Instruments Incorporated  
TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 1.0V)  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 0.25V)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IOUT = 1mA  
IOUT = 1mA  
IOUT = 200mA  
IOUT = 200mA  
µ
CNR = 0.01 F  
µ
CNR = 0.01 F  
µ
COUT = 10.0 F  
µ
COUT = 10.0 F  
10 100  
1k  
10k  
100k  
1M  
10M  
10 100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Frequency (Hz)  
Figure 16.  
Figure 15.  
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs  
FREQUENCY (VIN – VOUT = 1.0V)  
POWER-SUPPLY RIPPLE REJECTION vs  
VIN – VOUT, IOUT = 1mA  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.1kHz  
1MHz  
1kHz  
IOUT = 1mA  
100kHz  
10kHz  
IOUT = 200mA  
CNR = None  
µ
CNR = 0.01 F  
µ
µ
COUT = 2.2 F  
COUT = 10.0 F  
10  
100  
1k  
10k  
100k  
1M  
10M  
0.0  
0.5 1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
Frequency (Hz)  
−
VIN VOUT (V)  
Figure 17.  
Figure 18.  
POWER-SUPPLY RIPPLE REJECTION vs  
VIN – VOUT, IOUT = 100mA  
POWER-SUPPLY RIPPLE REJECTION vs  
VIN – VOUT, IOUT = 200mA  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0.1kHz  
0.1kHz  
1kHz  
1kHz  
10kHz  
10kHz  
100kHz  
100kHz  
1MHz  
CNR = 0.01 F  
1MHz  
2.5  
µ
µ
CNR = 0.01 F  
COUT = 2.2 F  
µ
µ
COUT = 2.2 F  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0 3.5 4.0  
0.0  
0.5  
1.0  
1.5  
2.0  
3.0 3.5 4.0  
−
−
VIN VOUT (V)  
VIN VOUT (V)  
Figure 19.  
Figure 20.  
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TYPICAL CHARACTERISTICS (continued)  
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
TPS799285  
TOTAL NOISE vs CNR  
TPS799285  
TOTAL NOISE vs COUT  
200  
180  
160  
140  
120  
100  
80  
35  
30  
25  
20  
15  
10  
5
IOUT = 1mA  
µ
COUT = 2.2 F  
60  
40  
IOUT = 1mA  
20  
µ
CNR = 0.01 F  
0
0
0.01  
0.1  
1
10  
0
5
10  
COUT ( F)  
15  
20 25  
CNR (nF)  
µ
Figure 21.  
Figure 22.  
TPS799285  
LINE TRANSIENT RESPONSE  
TPS799285  
LOAD TRANSIENT RESPONSE  
VIN = 3.35V  
COUT = 2.2mF  
IOUT = 150mA  
100mV/div  
100mV/div  
VOUT  
µ
COUT = 10 F  
20mV/div  
VOUT  
COUT = 10mF  
VOUT  
µ
COUT = 2.2 F  
20mV/div  
1V/div  
VOUT  
150mA  
dVIN  
dt  
4.15V  
µ
= 1V/  
s
100mA/div  
1mA  
IOUT  
3.15V  
VIN  
µ
20 s/div  
20ms/div  
Figure 23.  
Figure 24.  
TPS799285  
TURN-ON RESPONSE  
TPS799285  
ENABLE RESPONSE  
(VEN = VIN  
)
VIN = 3.85V  
RLOAD = 19W  
COUT = 2.2mF  
RLOAD = 19W  
COUT = 2.2mF  
VOUT  
VOUT  
RLOAD = 19W  
COUT = 10mF  
RLOAD = 19W  
COUT = 10mF  
1V/div  
4V/div  
1V/div  
5V/div  
3.85V  
VIN  
VEN  
0V  
10ms/div  
10ms/div  
Figure 25.  
Figure 26.  
8
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TPS799xx  
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SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
Over operating temperature range (TJ= –40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,  
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.  
Typical values are at TJ = +25°C.  
TPS799285  
POWER-UP/POWER-DOWN  
7
Ω
RL = 19  
6
5
4
3
2
1
0
1
VIN  
VOUT  
−
50ms/div  
Figure 27.  
Copyright © 2005–2007, Texas Instruments Incorporated  
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TPS799xx  
www.ti.com  
SBVS056I–JANUARY 2005–REVISED NOVEMBER 2007  
APPLICATION INFORMATION  
The TPS799xx family of LDO regulators combines  
the high performance required of many RF and  
precision analog applications with ultra-low current  
consumption. High PSRR is provided by a high gain,  
high bandwidth error loop with good supply rejection  
at very low headroom (VIN – VOUT). Fixed voltage  
versions provide a noise reduction pin to bypass  
noise generated by the bandgap reference and to  
improve PSRR while a quick-start circuit fast-charges  
this capacitor at startup. The combination of high  
performance and low ground current also make the  
TPS799xx an excellent choice for portable  
applications. All versions have thermal and  
over-current protection and are fully specified from  
–40°C to +125°C.  
Feedback Capacitor Requirements  
(TPS79901 only)  
The feedback capacitor, CFB, shown in Figure 29 is  
required for stability. For a parallel combination of R1  
and R2 equal to 250kΩ, any value from 3pF to 1nF  
can be used. Fixed voltage versions have an internal  
30pF feedback capacitor which is quick-charged at  
start-up. The adjustable version does not have this  
quick-charge circuit, so values below 5pF should be  
used to ensure fast startup; values above 47pF can  
be used to implement an output voltage soft-start.  
Larger value capacitors also improve noise slightly.  
The TPS79901 is stable in unity-gain configuration  
(OUT tied to FB) without CFB  
.
Figure 28 shows the basic circuit connections for  
fixed voltage models. Figure 29 gives the connections  
for the adjustable output version (TPS79901). R1 and  
R2 can be calculated for any output voltage using the  
formula in Figure 29. Sample resistor values for  
common output voltages are shown in Figure 29.  
Output Noise  
In most LDOs, the bandgap is the dominant noise  
source. If a noise reduction capacitor (CNR) is used  
with the TPS799xx, the bandgap does not contribute  
significantly to noise. Instead, noise is dominated by  
the output resistor divider and the error amplifier  
input. To minimize noise in a given application, use a  
0.01µF noise reduction capacitor; for the adjustable  
version, smaller value resistors in the output resistor  
divider reduce noise. A parallel combination that  
gives 2µA of divider current will have the same noise  
performance as a fixed voltage version. To further  
optimize noise, equivalent series resistance of the  
output capacitor can be set to approximately 0.2Ω.  
This configuration maximizes phase margin in the  
control loop, reducing total output noise by up to  
10%.  
Input and Output Capacitor Requirements  
Although an input capacitor is not required for  
stability, it is good analog design practice to connect  
a 0.1µF to 1µF low ESR capacitor across the input  
supply near the regulator. This will counteract  
reactive input sources and improve transient  
response, noise rejection, and ripple rejection. A  
higher-value capacitor may be necessary if large, fast  
rise-time load transients are anticipated or the device  
is located several inches from the power source. If  
source impedance is not sufficiently low, a 0.1µF  
input capacitor may be necessary to ensure stability.  
space  
space  
space  
space  
The TPS799xx is designed to be stable with standard  
ceramic capacitors of values 2.2µF or larger. X5R  
and X7R type capacitors are best as they have  
minimal variation in value and ESR over temperature.  
Maximum ESR should be < 1.0Ω.  
Optional input capacitor.  
(R1 + R2)  
Optional input capacitor.  
May improve source  
VOUT  
=
´ 1.193  
May improve source  
R2  
impedance, noise, or PSRR.  
impedance, noise, or PSRR.  
VIN  
VOUT  
VIN  
VOUT  
IN  
OUT  
FB  
IN  
OUT  
TPS799xx  
GND  
TPS79901  
R1  
CFB  
2.2mF  
Ceramic  
m
2.2 F  
EN  
NR  
EN  
GND  
Ceramic  
R2  
VEN  
VEN  
Optional bypass capacitor  
to reduce output noise  
and increase PSRR.  
Figure 29. Typical Application Circuit for  
Adjustable Voltage Version  
Figure 28. Typical Application Circuit for  
Fixed Voltage Versions  
10  
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Noise can be referred to the feedback point (FB pin)  
Startup  
such that with CNR  
=
0.01µF total noise is  
Fixed voltage versions of the TPS799xx use a  
quick-start circuit to fast-charge the noise reduction  
capacitor, CNR, if present (see Functional Block  
Diagrams, Figure 1). This allows the combination of  
very low output noise and fast start-up times. The NR  
pin is high impedance so a low leakage CNR capacitor  
must be used; most ceramic capacitors are  
appropriate in this configuration.  
approximately given by Equation 1:  
10.5mVRMS  
VN =  
x VOUT  
V
(1)  
The TPS79901 adjustable version does not have the  
noise-reduction pin available, so ultra-low noise  
operation is not possible. Noise can be minimized  
according to the above recommendations.  
Note that for fastest startup, VIN should be applied  
first, then the enable pin (EN) driven high. If EN is  
tied to IN, startup will be somewhat slower. Refer to  
Figure 25 and Figure 26 in the Typical Characteristics  
section. The quick-start switch is closed for  
approximately 135µs. To ensure that CNR is fully  
charged during the quick-start time, a 0.01µF or  
smaller capacitor should be used.  
Board Layout Recommendations to Improve  
PSRR and Noise Performance  
To improve ac performance such as PSRR, output  
noise, and transient response, it is recommended that  
the board be designed with separate ground planes  
for VIN and VOUT, with each ground plane connected  
only at the GND pin of the device. In addition, the  
ground connection for the bypass capacitor should  
connect directly to the GND pin of the device.  
Transient Response  
As with any regulator, increasing the size of the  
output capacitor will reduce over/undershoot  
magnitude but increase duration of the transient  
response. In the adjustable version, adding CFB  
between OUT and FB will improve stability and  
transient response. The transient response of the  
TPS799xx is enhanced by an active pull-down that  
Internal Current Limit  
The TPS799xx internal current limit helps protect the  
regulator during fault conditions. During current limit,  
the output will source a fixed amount of current that is  
largely independent of output voltage. For reliable  
operation, the device should not be operated in  
current limit for extended periods of time.  
engages  
when  
the  
output  
overshoots  
by  
approximately 5% or more when the device is  
enabled. When enabled, the pull-down device  
behaves like a 350Ω resistor to ground.  
The PMOS pass element in the TPS799xx has a  
built-in body diode that conducts current when the  
voltage at OUT exceeds the voltage at IN. This  
current is not limited, so if extended reverse voltage  
operation is anticipated, external limiting may be  
appropriate.  
Under-Voltage Lock-Out (UVLO)  
The TPS799xx utilizes an under-voltage lock-out  
circuit to keep the output shut off until internal  
circuitry is operating properly. The UVLO circuit has a  
de-glitch feature so that it will typically ignore  
undershoot transients on the input if they are less  
than 50µs duration.  
Shutdown  
The enable pin (EN) is active high and is compatible  
with standard and low voltage TTL-CMOS levels.  
When shutdown capability is not required, EN can be  
connected to IN.  
Minimum Load  
The TPS799xx is stable and well-behaved with no  
output load. To meet the specified accuracy, a  
minimum load of 500µA is required. Below 500µA at  
junction temperatures near +125°C, the output can  
drift up enough to cause the output pull-down to turn  
on. The output pull-down will limit voltage drift to 5%  
typically but ground current could increase by  
approximately 50µA. In typical applications, the  
junction cannot reach high temperatures at light loads  
since there is no appreciable dissipated power. The  
specified ground current would then be valid at no  
load in most applications.  
Dropout Voltage  
The TPS799xx uses a PMOS pass transistor to  
achieve low dropout. When (VIN – VOUT) is less than  
the dropout voltage (VDO), the PMOS pass device is  
in its linear region of operation and the input-to-output  
resistance is the RDS, ON of the PMOS pass element.  
Because the PMOS device behaves like a resistor in  
dropout, VDO will approximately scale with output  
current.  
As with any linear regulator, PSRR and transient  
response are degraded as (VIN – VOUT) approaches  
dropout. This effect is shown in Figure 18 through  
Figure 20 in the Typical Characteristics section.  
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Thermal Information  
Power Dissipation  
Thermal Protection  
Thermal protection disables the output when the  
junction temperature rises to approximately +165°C,  
allowing the device to cool. When the junction  
temperature cools to approximately +145°C the  
output circuitry is again enabled. Depending on power  
dissipation, thermal resistance, and ambient  
temperature, the thermal protection circuit may cycle  
on and off. This cycling limits the dissipation of the  
regulator, protecting it from damage due to  
overheating.  
The ability to remove heat from the die is different for  
each package type, presenting different  
considerations in the PCB layout. The PCB area  
around the device that is free of other components  
moves the head from the device to the ambient air.  
Performance data for JEDEC low- and high-K boards  
are given in the Dissipation Ratings table. Using  
heavier copper will increase the effectiveness in  
removing heat from the device. The addition of plated  
through-holes to heat-dissipating layers will also  
improve the heatsink effectiveness.  
Any tendency to activate the thermal protection circuit  
indicates excessive power dissipation or an  
inadequate heatsink. For reliable operation, junction  
temperature should be limited to +125°C maximum.  
To estimate the margin of safety in a complete design  
Power dissipation depends on input voltage and load  
conditions. Power dissipation is equal to the product  
of the output current time the voltage drop across the  
output pass element, as shown in Equation 2:  
(including  
heatsink),  
increase  
the  
ambient  
ǒ
Ǔ
PD + VIN*VOUT @ IOUT  
(2)  
temperature until the thermal protection is triggered;  
use worst-case loads and signal conditions. For good  
reliability, thermal protection should trigger at least  
+35°C above the maximum expected ambient  
condition of your particular application. This  
configuration produces  
temperature of +125°C at the highest expected  
Package Mounting  
Solder pad footprint recommendations for the  
TPS799xx are available from the Texas Instruments'  
web site at www.ti.com.  
a
worst-case junction  
ambient temperature and worst-case load.  
The internal protection circuitry of the TPS799xx has  
been designed to protect against overload conditions.  
It was not intended to replace proper heatsinking.  
Continuously running the TPS799xx into thermal  
shutdown will degrade device reliability.  
1,060  
0,960  
1,427  
1,327  
(d = 0.30 ±0.05)  
0,625 Max  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. NanoStaräpackage configuration.  
NanoStar is a trademark of Texas Instruments.  
Figure 30. YZU Wafer Chip-Scale Package Dimensions (in mm)  
12  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
TPS79901DDCR  
TPS79901DDCRG4  
TPS79901DDCT  
TPS79901DDCTG4  
TPS79901DRVR  
TPS79901DRVRG4  
TPS79901DRVT  
TPS79901DRVTG4  
TPS79901YZUR  
TPS79901YZUT  
TPS79912DDCR  
TPS79912DDCRG4  
TPS79912DDCT  
TPS79912DDCTG4  
TPS79912DRVR  
TPS79912DRVRG4  
TPS79912DRVT  
TPS79912DRVTG4  
TPS79912YZUR  
TPS79912YZUT  
TPS79913DDCR  
TPS79913DDCRG4  
TPS79913DDCT  
TPS79913DDCTG4  
TPS79913YZUR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT  
DDC  
5
5
5
5
6
6
6
6
5
5
5
5
5
5
6
6
6
6
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
SOT  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
YZU  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
Orderable Device  
TPS79913YZUT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
DSBGA  
YZU  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
5
5
6
6
6
6
5
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79915DDCR  
TPS79915DDCRG4  
TPS79915DDCT  
TPS79915DDCTG4  
TPS79915YZUR  
SOT  
SOT  
DDC  
DDC  
DDC  
DDC  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DRV  
DRV  
DRV  
DRV  
YZU  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79915YZUT  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS799185DDCR  
TPS799185DDCRG4  
TPS799185DDCT  
TPS799185DDCTG4  
TPS79918DDCR  
TPS79918DDCRG4  
TPS79918DDCT  
TPS79918DDCTG4  
TPS79918DRVR  
TPS79918DRVRG4  
TPS79918DRVT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS79918DRVTG4  
TPS79918YZUR  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SON  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79918YZUT  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS799195DRVR  
TPS799195DRVRG4  
TPS799195DRVT  
TPS799195DRVTG4  
TPS79919YZUR  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
Orderable Device  
TPS79919YZUT  
TPS79920YZUR  
TPS79920YZUT  
TPS79921YZUR  
TPS79921YZUT  
TPS79925DDCR  
TPS79925DDCRG4  
TPS79925DDCT  
TPS79925DDCTG4  
TPS79925YZUR  
TPS79925YZUT  
TPS79926YZUR  
TPS79926YZUT  
TPS799275YZUR  
TPS799275YZUT  
TPS79927DDCR  
TPS79927DDCRG4  
TPS79927DDCT  
TPS79927DDCTG4  
TPS79927DRVR  
TPS79927DRVRG4  
TPS79927DRVT  
TPS79927DRVTG4  
TPS79927YZUR  
TPS79927YZUT  
TPS799285DDCR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
DSBGA  
YZU  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
5
5
5
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
3000 Green (RoHS &  
no Sb/Br)  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS &  
no Sb/Br)  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS &  
no Sb/Br)  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS &  
no Sb/Br)  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
Orderable Device  
TPS799285DDCRG4  
TPS799285DDCT  
TPS799285DDCTG4  
TPS799285DRVR  
TPS799285DRVRG4  
TPS799285DRVT  
TPS799285DRVTG4  
TPS799285YZUR  
TPS799285YZUT  
TPS79928DDCR  
TPS79928DDCRG4  
TPS79928DDCT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT  
DDC  
5
5
5
6
6
6
6
5
5
5
5
5
5
6
6
6
6
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
SOT  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
YZU  
YZU  
DDC  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS79928DDCTG4  
TPS79928DRVR  
TPS79928DRVRG4  
TPS79928DRVT  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS79928DRVTG4  
TPS79928YZUR  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79928YZUT  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79930DDCR  
TPS79930DDCRG4  
TPS79930DDCT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS79930DDCTG4  
TPS79930YZUR  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79930YZUT  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS799315DDCR  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
Orderable Device  
TPS799315DDCRG4  
TPS799315DDCT  
TPS799315DDCTG4  
TPS799315YZUR  
TPS799315YZUT  
TPS79932YZUR  
TPS79932YZUT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT  
DDC  
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
SOT  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
YZU  
YZU  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
SnAgCu  
SnAgCu  
SnAgCu  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
3000 Green (RoHS &  
no Sb/Br)  
250 Green (RoHS &  
no Sb/Br)  
TPS79933DDCR  
TPS79933DDCRG4  
TPS79933DDCT  
TPS79933DDCTG4  
TPS79933DRVR  
TPS79933DRVRG4  
TPS79933DRVT  
TPS79933DRVTG4  
TPS79933YZUR  
TPS79933YZUT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SON  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
SOT  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
TPS79942DDCR  
TPS79942DDCRG4  
TPS79942DDCT  
TPS79942DDCTG4  
TPS79945YZUR  
TPS79945YZUT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
250 Green (RoHS &  
no Sb/Br)  
SnAgCu  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
Addendum-Page 5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS79901, TPS79918 :  
Automotive: TPS79901-Q1, TPS79918-Q1  
•
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
•
Addendum-Page 6  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TPS79901DDCR  
TPS79901DDCT  
TPS79901DRVR  
TPS79901DRVT  
TPS79901YZUR  
TPS79901YZUT  
TPS79912DDCR  
TPS79912DDCT  
TPS79912DRVR  
TPS79912DRVT  
TPS79912YZUR  
TPS79912YZUT  
TPS79913DDCR  
TPS79913DDCT  
TPS79913YZUR  
TPS79913YZUT  
TPS79915DDCR  
TPS79915DDCT  
SOT  
SOT  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
DDC  
DDC  
5
5
6
6
5
5
5
5
6
6
5
5
5
5
5
5
5
5
3000  
250  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TPS79915YZUR  
TPS79915YZUT  
TPS799185DDCR  
TPS799185DDCT  
TPS79918DDCR  
TPS79918DDCT  
TPS79918DRVR  
TPS79918DRVT  
TPS79918YZUR  
TPS79918YZUT  
TPS799195DRVR  
TPS799195DRVT  
TPS79919YZUR  
TPS79919YZUT  
TPS79920YZUR  
TPS79920YZUT  
TPS79921YZUR  
TPS79921YZUT  
TPS79925DDCR  
TPS79925DDCT  
TPS79925YZUR  
TPS79925YZUT  
TPS79926YZUR  
TPS79926YZUT  
TPS799275YZUR  
TPS799275YZUT  
TPS79927DDCR  
TPS79927DDCT  
TPS79927DRVR  
TPS79927DRVT  
TPS79927YZUR  
TPS79927YZUT  
TPS799285DDCR  
TPS799285DDCT  
TPS799285DRVR  
TPS799285DRVT  
TPS799285YZUR  
TPS799285YZUT  
TPS79928DDCR  
TPS79928DDCT  
TPS79928DRVR  
TPS79928DRVT  
TPS79928YZUR  
DSBGA  
DSBGA  
SOT  
YZU  
YZU  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DRV  
DRV  
YZU  
YZU  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
5
5
5
5
5
5
6
6
5
5
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
6
6
5
5
5
5
6
6
5
3000  
250  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
179.0  
179.0  
178.0  
178.0  
178.0  
178.0  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q1  
Q1  
Q3  
Q3  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q2  
Q2  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q3  
Q3  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q3  
Q3  
Q2  
Q2  
Q1  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SOT  
3000  
250  
3.2  
3.2  
1.4  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SON  
3000  
250  
1.09  
1.09  
2.2  
1.42  
1.42  
2.2  
0.81  
0.81  
1.2  
3000  
250  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
1.09  
1.09  
1.09  
1.09  
3.2  
1.42  
1.42  
1.42  
1.42  
1.42  
1.42  
3.2  
0.81  
0.81  
0.81  
0.81  
0.81  
0.81  
1.4  
3000  
250  
3000  
250  
3000  
250  
SOT  
3.2  
3.2  
1.4  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
1.09  
1.09  
1.09  
1.09  
3.2  
1.42  
1.42  
1.42  
1.42  
1.42  
1.42  
3.2  
0.81  
0.81  
0.81  
0.81  
0.81  
0.81  
1.4  
3000  
250  
3000  
250  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
3000  
1.09  
1.42  
0.81  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TPS79928YZUT  
TPS79930DDCR  
TPS79930DDCT  
TPS79930YZUR  
TPS79930YZUT  
TPS799315DDCR  
TPS799315DDCT  
TPS799315YZUR  
TPS799315YZUT  
TPS79932YZUR  
TPS79932YZUT  
TPS79933DDCR  
TPS79933DDCT  
TPS79933DRVR  
TPS79933DRVT  
TPS79933YZUR  
TPS79933YZUT  
TPS79942DDCR  
TPS79942DDCT  
TPS79945YZUR  
TPS79945YZUT  
DSBGA  
SOT  
YZU  
DDC  
DDC  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
5
5
250  
3000  
250  
178.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
178.0  
178.0  
178.0  
178.0  
179.0  
179.0  
179.0  
179.0  
178.0  
178.0  
179.0  
179.0  
178.0  
178.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
1.09  
3.2  
1.42  
3.2  
0.81  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q1  
Q3  
Q3  
Q1  
Q1  
Q3  
Q3  
Q1  
Q1  
Q1  
Q1  
Q3  
Q3  
Q2  
Q2  
Q1  
Q1  
Q3  
Q3  
Q1  
Q1  
SOT  
3.2  
3.2  
1.4  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
1.09  
1.09  
3.2  
1.42  
1.42  
1.42  
1.42  
3.2  
0.81  
0.81  
0.81  
0.81  
1.4  
3000  
250  
3000  
250  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
DSBGA  
DSBGA  
SOT  
3000  
250  
1.09  
1.09  
3.2  
1.42  
1.42  
3.2  
0.81  
0.81  
1.4  
3000  
250  
SOT  
3.2  
3.2  
1.4  
DSBGA  
DSBGA  
3000  
250  
1.09  
1.09  
1.42  
1.42  
0.81  
0.81  
Pack Materials-Page 3  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS79901DDCR  
TPS79901DDCT  
TPS79901DRVR  
TPS79901DRVT  
TPS79901YZUR  
TPS79901YZUT  
TPS79912DDCR  
TPS79912DDCT  
TPS79912DRVR  
TPS79912DRVT  
TPS79912YZUR  
TPS79912YZUT  
TPS79913DDCR  
TPS79913DDCT  
TPS79913YZUR  
TPS79913YZUT  
TPS79915DDCR  
TPS79915DDCT  
TPS79915YZUR  
TPS79915YZUT  
SOT  
SOT  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
5
5
6
6
5
5
5
5
6
6
5
5
5
5
5
5
5
5
5
5
3000  
250  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
DSBGA  
DSBGA  
3000  
250  
Pack Materials-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS799185DDCR  
TPS799185DDCT  
TPS79918DDCR  
TPS79918DDCT  
TPS79918DRVR  
TPS79918DRVT  
TPS79918YZUR  
TPS79918YZUT  
TPS799195DRVR  
TPS799195DRVT  
TPS79919YZUR  
TPS79919YZUT  
TPS79920YZUR  
TPS79920YZUT  
TPS79921YZUR  
TPS79921YZUT  
TPS79925DDCR  
TPS79925DDCT  
TPS79925YZUR  
TPS79925YZUT  
TPS79926YZUR  
TPS79926YZUT  
TPS799275YZUR  
TPS799275YZUT  
TPS79927DDCR  
TPS79927DDCT  
TPS79927DRVR  
TPS79927DRVT  
TPS79927YZUR  
TPS79927YZUT  
TPS799285DDCR  
TPS799285DDCT  
TPS799285DRVR  
TPS799285DRVT  
TPS799285YZUR  
TPS799285YZUT  
TPS79928DDCR  
TPS79928DDCT  
TPS79928DRVR  
TPS79928DRVT  
TPS79928YZUR  
TPS79928YZUT  
TPS79930DDCR  
TPS79930DDCT  
SOT  
SOT  
DDC  
DDC  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DRV  
DRV  
YZU  
YZU  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
5
5
5
5
6
6
5
5
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
6
6
5
5
5
5
6
6
5
5
5
5
3000  
250  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
217.0  
217.0  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
217.0  
217.0  
217.0  
217.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
193.0  
193.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
193.0  
193.0  
193.0  
193.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
SOT  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SON  
3000  
250  
3000  
250  
SON  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
SOT  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
3000  
250  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
Pack Materials-Page 5  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Sep-2008  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS79930YZUR  
TPS79930YZUT  
TPS799315DDCR  
TPS799315DDCT  
TPS799315YZUR  
TPS799315YZUT  
TPS79932YZUR  
TPS79932YZUT  
TPS79933DDCR  
TPS79933DDCT  
TPS79933DRVR  
TPS79933DRVT  
TPS79933YZUR  
TPS79933YZUT  
TPS79942DDCR  
TPS79942DDCT  
TPS79945YZUR  
TPS79945YZUT  
DSBGA  
DSBGA  
SOT  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
YZU  
YZU  
DDC  
DDC  
DRV  
DRV  
YZU  
YZU  
DDC  
DDC  
YZU  
YZU  
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
5
5
3000  
250  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
217.0  
217.0  
195.0  
195.0  
195.0  
195.0  
217.0  
217.0  
195.0  
195.0  
217.0  
217.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
193.0  
193.0  
200.0  
200.0  
200.0  
200.0  
193.0  
193.0  
200.0  
200.0  
193.0  
193.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
35.0  
35.0  
45.0  
45.0  
45.0  
45.0  
35.0  
35.0  
45.0  
45.0  
35.0  
35.0  
3000  
250  
SOT  
DSBGA  
DSBGA  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
3000  
250  
SOT  
SON  
3000  
250  
SON  
DSBGA  
DSBGA  
SOT  
3000  
250  
3000  
250  
SOT  
DSBGA  
DSBGA  
3000  
250  
Pack Materials-Page 6  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Amplifiers  
Data Converters  
DSP  
Clocks and Timers  
Interface  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/audio  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
Logic  
Military  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Optical Networking  
Security  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2008, Texas Instruments Incorporated  

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