TPS8268180SIPR [TI]
TPS8268x 1600-mA High-Efficiency MicroSiP Step-Down Converter Module;
| 型号： | TPS8268180SIPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TPS8268x 1600-mA High-Efficiency MicroSiP Step-Down Converter Module 开关 |
| 文件： | 总32页 (文件大小：2912K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
TPS8268x 1600-mA High-Efficiency MicroSiP™ Step-Down Converter Module
(Profile < 1.0mm)
The TPS8268x is based on
a high-frequency
1 Features
synchronous step-down dc-dc converter optimized for
battery-powered portable applications in which high
load currents in a very small solution size and height
are required. The TPS8268x is optimized for high
efficiency and low output voltage ripple and supports
up to 1600-mA load current. With an input voltage
range of 2.5-V to 5.5-V, the device supports
applications powered by Li-Ion batteries as well as 5-
V and 3.3-V rails.
1
•
•
•
•
•
•
•
Wide VIN Range From 2.5V to 5.5V
Total Solution Size < 6.7 mm2
Sub 1-mm Profile Solution
±1.5% DC Voltage Accuracy
Up to 1600-mA Load Current
Up to 90% Efficiency
Fixed Output Voltage:
The TPS8268x operates at a 5.5-MHz switching
frequency with spread spectrum capability. For noise-
sensitive applications, this provides a lower noise
regulated output, as well as low noise at the input.
The device supports a fixed output voltage, requiring
no external feedback network.
–
–
–
–
–
TPS8268180: 1.80V
TPS8268150: 1.50V
TPS8268120: 1.20V
TPS8268105: 1.05V
TPS8268090: 0.90V
These features, combined with high PSRR and AC
load regulation performance, make this device
suitable to replace a linear regulator to obtain better
power conversion efficiency with the same size.
•
Low EMI by Spread Spectrum PWM Frequency
Dithering
•
•
•
Best in Class Load and Line Transient Response
Internal Soft Start
The TPS8268x is packaged in a compact (2.3mm x
2.9mm) and low profile BGA package suitable for
automated assembly by standard surface mount
equipment.
Current Overload and Thermal Shutdown
Protection
2 Applications
Device Information(1)
•
•
•
•
Optical Modules
PART NUMBER
TPS8268180
TPS8268150
TPS8268120
TPS8268105
TPS8268090
PACKAGE
BODY SIZE (NOM)
2.30 mm × 2.90 mm
2.30 mm × 2.90 mm
2.30 mm × 2.90 mm
2.30 mm × 2.90 mm
2.30 mm × 2.90 mm
Cell Phones, Smart-Phones
Solid State Disk Drive Applications
Space constrained applications
µSIP
µSIP
µSIP
µSIP
3 Description
µSIP
The TPS8268x device is a complete DC/DC step-
down power supply optimized for small solution size.
Included in the package are the switching regulator,
inductor and input/output capacitors. Integration of all
passive components enables a tiny solution size of
only 6.7mm2.
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
.
Efficiency vs Load Current for TPS8268180
Typical Application
100
TPS8268180SIP
2.5 V
90
3 V
DC/DC Converter
L
80
70
60
50
40
30
20
10
0
3.6 V
4.2 V
5 V
V
SW
VIN
BAT
CI
V
CO
OUT
1.80V / up to 1.6A
MODE pin;
tie to VIN
FB
MODE
EN
ENABLE
GND
0.0001
0.001
0.01
0.1
1
Iout (A)
C006
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information.................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Timing Requirements................................................ 6
7.7 Typical Characteristics.............................................. 6
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 11
9
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application ................................................. 13
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 20
11.3 Surface Mount Information ................................... 20
11.4 Thermal and Reliability Information ...................... 21
12 Device and Documentation Support ................. 23
12.1 Documentation Support ....................................... 23
12.2 Related Links ........................................................ 23
12.3 Trademarks........................................................... 23
12.4 Electrostatic Discharge Caution............................ 23
12.5 Glossary................................................................ 23
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 24
13.1 Package Summary................................................ 24
13.2 MicroSiP™ DC/DC Module Package Dimensions 24
4 Revision History
Changes from Revision B (June 2015) to Revision C
Page
•
Deleted "Preview" from Device Comparison Table and Electrical Characteristics table for TPS8268120 and
TPS8268180 devices ............................................................................................................................................................ 3
Changes from Revision A (November 2014) to Revision B
Page
•
•
Added Preview devices TPS8268180 and TPS8268120 specifications and typical application curves to the data
sheet. ..................................................................................................................................................................................... 1
Moved timing specs from Electrical Characteristics table to Timing Requirements table ..................................................... 6
Changes from Original (October 2014) to Revision A
Page
•
Changed from Product Preview to Production Data .............................................................................................................. 1
2
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Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090
TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
www.ti.com
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
(1)
5 Device Comparison Table
DEVICE NUMBER
FEATURES
OUTPUT VOLTAGE
Marking
TPS8268180
TPS8268150
TPS8268120
TPS8268105
TPS8268090
PWM Spread Spectrum Modulation
Output Capacitor Discharge
1.80V
HK
PWM Spread Spectrum Modulation
Output Capacitor Discharge
1.50V
1.20V
1.05V
0.90V
YR
HJ
PWM Spread Spectrum Modulation
Output Capacitor Discharge
PWM Spread Spectrum Modulation
Output Capacitor Discharge
YO
YP
PWM Spread Spectrum Modulation
Output Capacitor Discharge
(1) For other voltage options please contact a TI sales representative.
6 Pin Configuration and Functions
SIP-9
(TOP VIEW)
SIP-9
(BOTTOM VIEW)
C3
B3
A3
C2
B2
A2
C1
B1
A1
C1
B1
A1
C2
B2
A2
C3
B3
A3
GND
VIN
GND
MODE
VOUT
GND
VIN
GND
MODE
VOUT
VIN
VIN
EN
EN
Pin Functions
PIN
I/O
DESCRIPTION
NAME
VOUT
VIN
NO.
A1, A2
A3, B3
O
I
Power output pin. Apply output load between this pin and GND.
Supply voltage connection
This is the enable pin of the device. Connecting this pin low forces the device into shutdown
mode. Pulling this pin high enables the device. This pin must not be left floating and must be
terminated.
EN
B2
I
MODE
GND
B1
I
This pin must be tied to the input supply voltage VIN.
Ground pin.
C1, C2, C3
–
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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
–0.3
–0.3
–0.3
MAX
6
UNIT
Voltage at VIN(2)
Voltage at VOUT(2)
Voltage at EN, MODE(2)
VI
3.6
V
VIN + 0.3
1600
125
Peak output current
mA
°C
TJ
Operating internal junction temperature range
Storage temperature range
–40
–55
Tstg
125
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model
Charge device model
Machine model
V
V
V
(1) (2)
V(ESD)
Electrostatic discharge
±100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX UNIT
VIN
Input voltage range
2.5
5.5
V
IOUT
Peak output current for TPS8268090, TPS8268105,
TPS8268120
VIN ≥ 2.8V
VIN ≥ 3.2V
VIN ≥ 2.7V
0
0
1600(1)
mA
Peak output current for TPS8268150, TPS8268180
IOUT
Average output current for TPS8268090,
TPS8268105, TPS8268120
1200(1)
1000(2)
mA
Average output current for TPS8268150,
TPS8268180
VIN ≥ 2.9V
IOUT
Average output current during soft-start
Additional effective input capacitance
Additional effective output capacitance
Operating ambient temperature range
Vout ≤ 0.9 x VOUT,nom
0
0
mA
µF
µF
°C
0
30(3)
85
TA
–40
(1) See Thermal and Reliability Information for additional details
(2) See Soft Start for additional details
(3) Due to the dc bias effect of ceramic capacitors, the effective capacitance is lower then the nominal value when a voltage is applied.
7.4 Thermal Information
TPS8268x
THERMAL METRIC(1)
SIP
9 PINS
62
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
22
25
ψJT
11
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090
TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
www.ti.com
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
Thermal Information (continued)
TPS8268x
THERMAL METRIC(1)
SIP
9 PINS
25
UNIT
ψJB
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
°C/W
RθJC(bot)
n/a
7.5 Electrical Characteristics
Minimum and maximum values are at VIN = 2.5 V to 5.5 V, EN = VIN and TA = –40°C to 85°C; Circuit of Parameter
Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6 V, EN = VIN and TA = 25°C
(unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY CURRENT
IQ
Operating quiescent current
IOUT = 0mA
EN = low
7
0.5
mA
ISD
Shutdown current
5
2.3
μA
V
VIN rising
VIN falling
2.1
UVLO
Undervoltage lockout threshold
1.95
2.25
V
ENABLE, MODE
VIH
VIL
High-level input voltage
0.9
V
V
Low-level input voltage
Input leakage current
0.4
1.5
Input connected to GND or VIN; TJ = –40°C to
85°C
Ilkg
0.01
μA
PROTECTION
Thermal shutdown
Temperature rising
Temperature falling
140
10
°C
°C
Thermal shutdown hysteresis
Average output current limit
ILIM
2100
mA
Input current limit under short-circuit
condition
ISC
VOUT shorted to ground
150
mA
OUTPUT
TPS8268180
TPS8268150
TPS8268120
1.80
1.50
1.20
V
V
V
Nominal output
TPS8268105
voltage
VOUT,NOM
1.05
0.90
V
V
TPS8268090
TPS8268120,
TPS8268105,
TPS8268090
2.8V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1600 mA
TJ = –40°C to 85°C
0.985×VOUT,NOM VOUT,NOM 1.015×VOUT,NOM
V
V
TPS8268180, 3.2V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1600 mA
TPS8268150 TJ = –40°C to 85°C
Output voltage
accuracy
TPS8268120,
2.7V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1200 mA
TPS8268105,
TJ = –40°C to 125°C
TPS8268090
0.98×VOUT,NOM VOUT,NOM 1.025×VOUT,NOM
TPS8268180, 2.9V ≤ VIN ≤ 5.5V, 0mA ≤ IOUT ≤ 1200 mA
TPS8268150 TJ = –40°C to 125°C
Line regulation
Load regulation
VIN = 2.5V to 5.5V, IOUT = 200 mA
IOUT = 0mA to 1600 mA
0.2
–0.85
5.5
%/V
%/A
MHz
Ω
fSW
Nominal oscillator frequency
VOUT discharge resistor
IOUT = 0mA
RDIS
12
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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
www.ti.com
7.6 Timing Requirements
Minimum and maximum values are at VIN = 2.5 V to 5.5 V, EN = VIN and TA = –40°C to 85°C; Circuit of Parameter
Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6 V, EN = VIN and TA = 25°C
(unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
OUTPUT
Start-up delay time
Ramp time
Time from EN = high to start switching
120
150
300
μs
μs
IOUT = 0mA, Time from start switching until 95%
of nominal output voltage
tRAMP
7.7 Typical Characteristics
1.81
1.805
1.8
100
2.5 V
90
3 V
80
70
60
50
40
30
20
10
0
3.6 V
4.2 V
5 V
1.795
1.79
2.9 V
3.0 V
3.6 V
4.2 V
5.0 V
1.785
0.0001
0.001
0.01
IOUT (A)
0.05
0.2 0.5
1
2
0.0001
VOUT = 1.80V
Figure 1. Efficiency vs Output Current
0.001
0.01
0.1
1
D024
Iout (A)
C006
VOUT = 1.80 V
Figure 2. Output Voltage vs Output Current
25°C
25°C
1.854
1.842
1.83
8
7
6
5
4
3
2
1
0
1.818
1.806
1.794
1.782
1.77
1 mA
3 V
316 mA
501 mA
1 A
3.5 V
4 V
1.758
1.746
1.6 A
5 V
2.5
3
3.5
4
4.5
VIN (V)
5
5.5
6
0.0001
0.001
0.01
0.1
1
D023
Iout (A)
C014
VOUT = 1.80 V
25°C
VOUT = 1.80 V
25°C
Figure 3. Output Voltage vs Input Voltage
Figure 4. Switching Frequency vs Output Current
6
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Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090
TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
www.ti.com
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
Typical Characteristics (continued)
100
1.545
1.530
1.515
1.500
2.5 V
90
3 V
80
70
60
50
40
30
20
10
0
3.6 V
4.2 V
5 V
2.5 V
1.485
3 V
3.6 V
1.470
4.2 V
5 V
1.455
0.0001
0.001
0.01
Iout (A)
0.1
1
0.0001
0.001
0.01
Iout (A)
0.1
1
C001
C002
VOUT = 1.50V
25°C
VOUT = 1.50 V
25°C
Figure 5. Efficiency vs Output Current
Figure 6. Output Voltage vs Output Current
1.545
1.530
1.515
1.500
1.485
1.470
1.455
8
7
6
5
4
3
2
1
0
1 mA
316 mA
501 mA
1 A
3 V
3.5 V
4 V
1.58 A
5 V
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.01
0.1
Iout (A)
1
Vin (V)
C003
C019
VOUT = 1.50 V
25°C
VOUT = 1.50 V
25°C
Figure 7. Output Voltage vs Input Voltage
Figure 8. Switching Frequency vs Output Current
100
90
80
70
60
50
40
30
20
10
0
1.236
2.5 V
3 V
2.5 V
3 V
1.224
1.212
1.200
1.188
1.176
1.164
3.6 V
4.2 V
5 V
3.6 V
4.2 V
5 V
0.0001
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
Iout (A)
Iout (A)
C005
C008
VOUT = 1.20V
25°C
VOUT = 1.20 V
25°C
Figure 9. Efficiency vs Output Current
Figure 10. Output Voltage vs Output Current
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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
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Typical Characteristics (continued)
1.236
1.224
1.212
1.2
8
7
6
5
4
3
2
1
2.5 V
3 V
1.188
1.176
1.164
1 mA
3.5 V
4 V
316 mA
501 mA
1 A
5 V
0
1.6 A
0.0001
0.001
0.01
0.1
1
2
2.5
3
3.5
4
4.5
5
5.5
6
Iout (A)
C013
VIN (V)
D022
VOUT = 1.20 V
25°C
VOUT = 1.20 V
25°C
Figure 12. Switching Frequency vs Output Current
Figure 11. Output Voltage vs Input Voltage
1.0815
100
90
80
70
60
50
40
30
20
10
0
2.5 V
3 V
1.0710
1.0605
1.0500
1.0395
1.0290
1.0185
3.3 V
4.2 V
5 V
2.5 V
3 V
3.3 V
4.2 V
5 V
0.0001
0.001
0.01
0.1
1
0.001
0.01
0.1
1
Iout (A)
Iout (A)
C011
C010
VOUT = 1.05 V
25°C
VOUT = 1.05V
25°C
Figure 14. Output Voltage vs Output Current
Figure 13. Efficiency vs Output Current
1.0815
1.0710
1.0605
1.0500
1.0395
1.0290
1.0185
9
8
7
6
5
4
3
2
1
0
1 mA
316 mA
501 mA
1 A
3 V
3.5 V
4 V
5 V
1.6 A
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0.01
0.1
Iout (A)
1
Vin (V)
C012
C018
VOUT = 1.05 V
25°C
VOUT = 1.05 V
25°C
Figure 15. Output Voltage vs Input Voltage
Figure 16. Switching Frequency vs Output Current
8
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Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090
TPS8268180, TPS8268150, TPS8268120, TPS8268105, TPS8268090
www.ti.com
SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
Typical Characteristics (continued)
0.927
0.918
0.909
0.900
100
2.5 V
90
3 V
80
70
60
50
40
30
20
10
0
3.6 V
4.2 V
5 V
2.5 V
0.891
3 V
3.6 V
0.882
4.2 V
5 V
0.873
0.0001
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
Iout (A)
Iout (A)
C007
C004
VIN = 0.9 V
25°C
VOUT = 0.9 V
25°C
Figure 18. Output Voltage vs Output Current
Figure 17. Efficiency vs Output Current
0.927
0.918
0.909
0.900
0.891
0.882
0.873
9
8
7
6
5
4
3
2
1
0
1 mA
316 mA
501 mA
1 A
3 V
3.5 V
4 V
5 V
1.6 A
2
2.5
3
3.5
Vin (V)
4
4.5
5
5.5
0.01
0.1
Iout (A)
1
C016
C017
VIN = 0.9 V
25°C
VIN = 0.9 V
25°C
Figure 19. Output Voltage vs Input Voltage
Figure 20. Switching Frequency vs Output Current
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SLVSBR0C –OCTOBER 2014–REVISED JUNE 2015
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8 Detailed Description
8.1 Overview
The TPS8268x is a complete DC/DC step-down power supply intended for small size and low profile
applications. Included in the package are the switching regulator, inductor and input/output capacitors. It is a
complete Plug & Play Solution, meaning typically no additional components are required to finish the design.
Integration of all required passive components enables a tiny solution size of only 6.7mm2. The converter
operates with fixed frequency pulse width modulation (PWM).
The TPS8268x integrates an input current limit to protect the device against heavy load or short circuits and
features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages.
8.2 Functional Block Diagram
MODE
EN
VIN
CI
DC/DC CONVERTER
Undervoltage
Lockout
Bias Supply
VIN
Soft-Start
Negative Inductor
Current Detect
Bandgap
VIN
VREF = 0.8 V
Timing Generator
VOUT
Thermal
Shutdown
Current Sense
SSFM
R
1
-
L
Gate Driver
VOUT
Anti
Shoot-Through
R
VREF
2
CO
+
Feedback Divider
GND
8.3 Feature Description
8.3.1 Soft Start
The TPS8268x has an internal soft start circuit that controls the ramp up of the output voltage. Once the
converter is enabled and the input voltage is above the undervoltage lockout threshold VUVLO, the output voltage
ramps up to 95% of its nominal value within tRamp of typ. 150μs. This ensures a controlled ramp up of the output
voltage and limits the input voltage drop when a battery or a high-impedance power source is connected to the
input of the DC/DC converter.
The inrush current during start-up is directly related to the effective capacitance and load present at the output of
the converter.
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Feature Description (continued)
During soft start, the current limit is reduced to 2/3 of its nominal value. The maximum load current during soft
start should be less than 1A. Once the internal reference voltage has reached 90% of its target value, the current
limit is set to its nominal target value.
8.3.2 Undervoltage Lockout
The undervoltage lockout circuit prevents the device from misoperation at low input voltages. It prevents the
converter from turning on either MOSFET under undefined conditions. The TPS8268x has a rising UVLO
threshold of 2.1V (typical).
8.3.3 Short-Circuit Protection
The TPS8268x integrates current limit circuitry to protect the device against heavy load or short circuits. When
the average current in the high-side MOSFET reaches its current limit, the high-side MOSFET is turned off and
the low-side MOSFET is turned on ramping down the inductor current.
As soon as the converter detects a short circuit condition, it shuts down. After a delay of approximately 20 µs, the
converter restarts. In case the short circuit condition remains, the converter shuts down again after hitting the
current limit threshold. In case the short circuit condition remains present on the converters output, the converter
periodically re-starts with a small duty cycle and shuts down again, thereby limiting the current drawn from the
input.
8.3.4 Thermal Shutdown
As soon as the junction temperature, TJ, exceeds typically 140°C, the device goes into thermal shutdown. In this
mode, the power stage is turned off. The device continues its operation when the junction temperature falls
below typically 130°C.
8.3.5 Enable
The TPS8268x device starts operation when EN is set high. For proper operation, the EN pin must be terminated
and must not be left floating.
Pulling the EN pin low forces the device into shutdown, with a shutdown current of typically 0.5μA. In this mode,
the internal high-side and low-side MOSFETs are turned off, the internal resistor feedback divider is
disconnected, and the entire internal control circuitry is switched off. The TPS8268x device actively discharges
the output capacitor when it turns off. The integrated discharge resistor has a typical resistance of 12Ω. This
internal discharge transistor is only turned on after the device had been enabled at least once. The required time
to discharge the output capacitor at the output node depends on load current and the effective output
capacitance.
The TPS8268x is designed such that it can start into a pre-biased output, in case the output discharge circuit
was active for too short a time to fully discharge the output capacitor. In this case, the converter starts switching
as soon as the internal reference has approximately reached the equivalent voltage to the output voltage
present. It then ramps the output from that voltage level to its target value.
8.3.6 MODE Pin
This pin must be tied to the input voltage VIN and must not be left floating.
8.4 Device Functional Modes
8.4.1 Spread Spectrum, PWM Frequency Dithering
The goal is to spread out the emitted RF energy over a larger frequency range, so that the resulting EMI is
similar to white noise. The end result is a spectrum that is continuous and lower in peak amplitude, making it
easier to comply with electromagnetic interference (EMI) standards and with power supply ripple requirements in
cellular and non-cellular wireless applications. Radio receivers are typically susceptible to narrowband noise that
is focused on specific frequencies.
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Device Functional Modes (continued)
Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is
a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to their output. In most
cases, the frequency of operation is either fixed or regulated, based on the output load. This method of
conversion creates large components of noise at the frequency of operation (fundamental) and multiples of the
operating frequency (harmonics).
The spread spectrum architecture varies the switching frequency by around ±10% of the nominal switching
frequency, thereby significantly reducing the peak radiated and conducted noise on both the input and output
supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency fm.
0 dBV
F
Dfc
ENV,PEAK
Dfc
Non-modulated harmonic
F
1
Side-band harmonics
window after modulation
0 dBVref
B = 2×fm ×(1+ mf )= 2×(Dfc + fm )
Bh = 2×fm ×(1+ mf ×h)
B = 2×fm ×(1+ mf )= 2×(Dfc + fm )
Figure 21. Spectrum Of A Frequency Modulated
Sin. Wave With Sinusoidal Variation In Time
Figure 22. Spread Bands Of Harmonics In
(1)
Modulated Square Signals
The above figures show that after modulation the side-band harmonic is attenuated compared to the non-
modulated harmonic, and the harmonic energy is spread into a certain frequency band. The higher the
modulation index (mf), the larger the attenuation.
δ ´ ƒc
mƒ
=
ƒm
(1)
where:
fc is the carrier frequency (5.5 MHz)
fm is the modulating frequency (approx. 0.008*fc)
δ is the modulation ratio (approx 0.1)
Dƒc
d =
ƒc
(2)
The maximum switching frequency fc is limited by the device and finally the parameter modulation ratio (δ),
together with fm , which is the side-band harmonic´s bandwidth around the carrier frequency fc . The bandwidth of
a frequency modulated waveform is approximately given by Carson’s rule and is summarized as:
B = 2 ´ ¦m ´ 1 + m = 2 ´ D¦ + ¦m
(
)
(
)
¦
c
(3)
fm < RBW (resolution bandwidth): The receiver is not able to distinguish individual side-band harmonics, so,
several harmonics are added in the input filter and the measured value is higher than expected in theoretical
calculations.
fm > RBW: The receiver is able to properly measure each individual side-band harmonic separately, so the
measurements match with the theoretical calculations.
(1) Spectrum illustrations and formulae (Figure 21 and Figure 22) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC
COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See References Section for full citation.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS8268x device is a complete DC/DC step-down power supply optimized for small solution size. Included
in the package are the switching regulator, inductor and input/output capacitors. Integration of passive
components enables a tiny solution size of only 6.7mm2.
9.2 Typical Application
TPS8268105SIP
V
BAT
DC/DC Converter
L
2.5V .. 5.5V
V
OUT
SW
VIN
1.05 V / up to 1.6A
+
C1
CI
CO
FB
GND
EN
MODE pin;
tie to VIN
MODE
Figure 23. Typical Application Schematic
9.2.1 Design Requirements
Figure 23 shows the schematic of the typical application. The following design guidelines provide all information
to operate the device within the recommended operating conditions. An external input capacitor may be required
depending on the source impedance of the battery or pre-regulator used to power TPS8268x. See also Power
Supply Recommendations.
Reference
Description
Manufacturer
IC1
MicroSIP Module TPS8268xSIP
Texas Instruments
Tantalum Capacitor;
T520B157M006ATE025; 150uF/6.3V
C1
Kemet
9.2.2 Detailed Design Procedure
The TPS8268x allows the design of a complete power supply with no additional external components. The input
capacitance can be increased in case the source impedance is large or if there are high load transients expected
at the output. The dc bias effect of the input and output capacitors must be taken into account and the total
capacitance on the output must not exceed the value given in the recommended operating conditions.
9.2.2.1 Input Capacitor Selection
Because the nature of the buck converter has a pulsating input current, a low ESR input capacitor is required.
For most applications, the input capacitor that is integrated into the TPS8268x is sufficient. If the application
exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance to find a
remedy.
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The TPS8268x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable
inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing
can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,
additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the
converter and the power source lead to reduce ringing that can occur between the inductance of the power
source leads and CI.
9.2.2.2 Output Capacitor Selection
The advanced fast-response voltage mode control scheme of the TPS8268x allows the use of tiny ceramic
output capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are
recommended. For most applications, the output capacitor integrated in the TPS8268x is sufficient. An additional
output capacitor may be used for the purpose of improving AC voltage accuracy during large load transients.
To further reduce the voltage drop during load transients, additional external output capacitance up to 30µF can
be added. A low ESR multilayer ceramic capacitor (MLCC) is suitable for most applications. The total effective
output capacitance must remain below 30µF.
As the device operates in PWM mode, the overall output voltage ripple is the sum of the voltage step that is
caused by the output capacitor´s ESL and the ripple current that flows through the output capacitor´s impedance.
Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor
DCR, power-stage rDS(on), PCB DC resistance, load switches rDS(on) …) that are temperature dependant, the
converter´s small and large signal behavior should be checked over the input voltage range, load current range
and temperature range.
The easiest test is to evaluate, directly at the converter’s output, the following items:
•
•
•
efficiency
load transient response
output voltage ripple
During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or
ringing that helps judge the converter’s stability. Without any ringing, the loop typically has more than 45° of
phase margin.
9.2.3 Application Curves
Figure 24. Load Transient Response for TPS8268180
(Vout = 1.80V, Iout = 170mA to 1.47A to 170mA, Vin = 5V)
Figure 25. Line Transient Response for TPS8268180
(Vout = 1.80V; Iout = 800mA, Vin = 4V to 5V to 4V)
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Figure 27. Output Voltage Ripple for TPS8268180
Figure 26. Startup for TPS8268180
(Vin = 5V, Vout = 1.80V)
(Vin = 5V, Vout = 1.80V, Iout = 900mA)
Figure 28. Load Transient Response for TPS8268150
(Vout = 1.5V, Iout = 160mA to 1.44A to 160mA, Vin = 5V)
Figure 29. Line Transient Response for TPS8268150
(Vout = 1.5V, Iout = 800mA, Vin = 4V to 5V to 4V)
Figure 31. Output Voltage Ripple for TPS8268150
(Vin = 5V, Vout = 1.5V, Iout = 900mA)
Figure 30. Startup for TPS8268150
(Vin = 5V, Vout = 1.5V)
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Figure 32. Load Transient Response for TPS8268120
(Vout = 1.20V, Iout = 170mA to 1.47A to 170mA, Vin = 5V)
Figure 33. Line Transient Response for TPS8268120
(Vout = 1.20V; Iout = 800mA, Vin = 4V to 5V to 4V)
Figure 34. Startup for TPS8268120
(Vin = 5V, Vout = 1.20V)
Figure 35. Output Voltage Ripple for TPS8268120
(Vin = 5V, Vout = 1.20V, Iout = 900mA)
Figure 36. Load Transient Response for TPS8268105
(Vout = 1.05V, Iout = 160mA to 1.44A to 160mA, Vin = 5V)
Figure 37. Line Transient Response for TPS8268105
(Vout = 1.05V; Iout = 900mA, Vin = 4V to 5V to 4V)
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Figure 39. Output Voltage Ripple for TPS8268105
(Vin = 5V, Vout = 1.05V, Iout = 900mA)
Figure 38. Startup for TPS8268105
(Vin = 5V, Vout = 1.05V)
Figure 40. Load Transient Response for TPS8268090
(Vout = 0.9V, Iout = 170mA to 1.47A to 170mA, Vin = 5V)
Figure 41. Line Transient Response for TPS8268090
(Vout = 0.90V; Iout = 900mA, Vin = 4V to 5V to 4V)
Figure 42. Startup for TPS8268090
(Vin = 5V, Vout = 0.9V)
Figure 43. Output Voltage Ripple for TPS8268090
(Vin = 5V, Vout = 0.9V, Iout = 900mA)
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10 Power Supply Recommendations
The input power supply to the TPS8268x must have a current rating according to the input voltage and output
current of the TPS8268x. TPS8268x provides a fast transient response due to its high switching frequency and
fast control loop. For highly dynamic loads, the device demands high inputs currents within a short time. The
power supply to TPS8268x therefore needs to have a low output impedance in order to keep the input voltage
stable during fast load changes. Make sure the input voltage to TPS8268x at any time is above the minimum
voltage level required to supply the load at the output. See the electrical characteristics for the minimum input
voltage for a given load current for the different output voltage versions. Additional input capacitance needs to be
added if the input voltage dops below the minimum level required.
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11 Layout
11.1 Layout Guidelines
TPS8268x allows the design of a power supply with small solution size. In order to properly dissipate the heat,
wide copper traces for the power connections should be used to distribute the heat across the PCB. If possible, a
GND plane should be used as it provides a low impedance connection as well as serves as a heat sink.
In making the pad size for the SiP LGA balls, it is recommended that the layout use a non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 44 shows the appropriate diameters for a MicroSiPTM
layout.
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
Figure 44. Recommended Land Pattern Image and Dimensions
(5)
(6)
SOLDER PAD
SOLDER MASK
OPENING
COPPER
THICKNESS
STENCIL
COPPER PAD
STENCIL THICKNESS
DEFINITIONS(1)(2)(3)(4)
OPENING
Non-solder-mask
defined (NSMD)
0.30mm
0.360mm
1oz max (0.032mm)
0.34mm diameter
0.1mm thick
(1) Circuit traces from non-solder-mask defined PCB lands should be 75μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and slightly reduce reliability. However, wider traces may be used to improve the
thermal relief of the device as well as to provide sufficient current handling.
(2) Best reliability results are achieved when the PCB laminate glass transition temperature is above the operating the range of the intended
application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PCB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
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11.2 Layout Example
GND
VOUT
VIN
EN
MODE
Figure 45. Recommended PCB Layout
11.3 Surface Mount Information
The TPS8268x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum to allow the MicroSiP™ device to be handled similarly
to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
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11.4 Thermal and Reliability Information
The TPS8268x´s output current may need to be de-rated if it is required to operate in a high ambient temperature
or deliver a large amount of continuous power. The amount of current de-rating is dependent upon the input
voltage, output power and environmental thermal conditions. Care should especially be taken in applications
where the localized PCB temperature exceeds 65°C.
The TPS8268x die and inductor temperature should be kept lower than the maximum rating of 125°C, so care
should be taken in the circuit layout to ensure good heat sinking. Sufficient cooling should be provided to ensure
reliable operation.
Three basic approaches for enhancing thermal performance are listed below:
•
•
•
Improve the power dissipation capability of the PCB design.
Improve the thermal coupling of the component to the PCB.
Introduce airflow into the system.
To estimate the junction temperature, approximate the power dissipation within the TPS8268x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking an actual power
measurement. Then, calculate the internal temperature rise of the TPS8268x above the surface of the printed
circuit board by multiplying the TPS8268x´s power dissipation by its thermal resistance.
The thermal resistance numbers listed in the Thermal Information table are based on modeling the MicroSiP™
package mounted on a high-K test board specified per the JEDEC standard. For increased accuracy and fidelity
to the actual application, it is recommended to run a thermal image analysis of the actual system.
Thermal measurements have been taken on the EVM to give a guideline on what temperature can be expected
when the device is operated in free air at 25°C ambient under a certain load. The temperatures have been
checked at 4 different spots as listed below:
•
•
•
•
Spot1: temperature of the input capacitor
Spot2: temperature of the output capacitor
Spot3: temperature of the inductor
Spot4: temperature on the main pcb next to the module
Figure 46. VIN= 5V, VOUT=1.05V, IOUT= 1A
388mW Power Dissipation
Figure 47. VIN= 5V, VOUT= 1.05V, IOUT= 1.2A
466mW Power Dissipation
The TPS8268x contains a thermal shutdown that inhibits switching at high junction temperatures. The activation
threshold of this function, however, is above 125°C to avoid interfering with normal operation. Thus, prolonged or
repetitive operation under a condition in which the thermal shutdown activates necessarily means that the
components internal to the MicroSiP™ package are subjected to high temperatures for prolonged or repetitive
intervals, which may decrease the reliability of the device.
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Thermal and Reliability Information (continued)
MLCC capacitor reliability/lifetime depends on temperature and applied voltage. At higher temperatures, MLCC
capacitors are subject to stronger stress. On the basis of frequently evaluated failure rates determined with
standardized test conditions, the reliability of all MLCC capacitors can be calculated for their actual operating
temperature and voltage.
Failures caused by systematic degradation are described by the Arrhenius model. The most critical parameter
(IR) is the Insulation Resistance (i.e. leakage current). The drop of IR below a lower limit (e.g. 1 MΩ) is used as
the failure criterion. See Figure 48 and Figure 49. Note that the wear-out mechanisms occurring in the MLCC
capacitors are not reversible but cumulative over time.
Input Capacitor Lifetime
vs
Output Capacitor Lifetime
vs
Temperature and Voltage
Temperature and Voltage
1M
100k
10k
1k
100k
10k
1k
Vin = 3.6 V
Vin = 4.5 V
Vin = 5 V
Vout = 1.5 V
Vout = 2 V
Vin = 5.5 V
100
10
100
10
1
1
0
20
40
60
80
100
120
140
0
20
40
60
80
100
120
140
Capacitor Case Temperature (C)
Capacitor Case Temperature (C)
C020
C021
Figure 48. Input Capacitor Lifetime
Figure 49. Output Capacitor Lifetime
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 References
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TPS8268180
TPS8268150
TPS8268120
TPS8268105
TPS8268090
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
12.3 Trademarks
MicroSiP is a trademark of Texas Instruments.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
13.1 Package Summary
SIP PACKAGE
TOP VIEW
BOTTOM VIEW
A1
YML
C1
B1
A1
C2
C3
D
B2
B3
A3
A2
E
LSB
CC
Code:
•
•
•
CC — Customer Code (device/voltage specific)
YML — Y: Year, M: Month, L: Lot trace code
LSB — L: Lot trace code, S: Site code, B: Board locator
13.2 MicroSiP™ DC/DC Module Package Dimensions
TheTPS8268x is available in an 9-bump ball grid array (BGA) package. The package dimensions are:
•
•
D = 2.30 ±0.05 mm
E = 2.90 ±0.05 mm
24
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Copyright © 2014–2015, Texas Instruments Incorporated
Product Folder Links: TPS8268180 TPS8268150 TPS8268120 TPS8268105 TPS8268090
PACKAGE OUTLINE
SIP0009B
MicroSiPTM - 1 mm max height
S
C
A
L
E
5
.
5
0
0
MICRO SYSTEM IN PACKAGE
A
2.95
2.85
B
PIN A1 INDEX
AREA
2.35
2.25
PICK AREA
NOTE 3
1 MAX
C
SEATING PLANE
0.05 C
0.10
0.06
2 TYP
1 TYP
C
0.8
TYP
1.6
B
A
0.35
9X
TYP
0.25
0.015
C A
B
1
2
3
4218356/B 11/2014
MicroSiP is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. For pick and place nozzle recommendation, see product datasheet.
4. Location, size and quantity of each component are for reference only and may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
SIP0009B
MicroSiPTM - 1 mm max height
MICRO SYSTEM IN PACKAGE
SYMM
2
9X ( 0.3)
SEE DETAILS
3
1
A
SYMM
B
C
(0.8)
TYP
(1) TYP
LAND PATTERN EXAMPLE
SCALE:20X
0.05 MIN
(
0.3)
0.05 MAX
(
0.3)
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER MASK
SOLDER MASK
DEFINED
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4218356/B 11/2014
NOTES: (continued)
5. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
www.ti.com
EXAMPLE STENCIL DESIGN
SIP0009B
MicroSiPTM - 1 mm max height
MICRO SYSTEM IN PACKAGE
SYMM
2
(
0.34) TYP
SEE DETAIL
1
3
A
SYMM
B
C
(0.8)
TYP
(1) TYP
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:20X
(
0.34)
METAL
UNDER PASTE
SOLDER PASTE DETAIL
TYPICAL
4218356/B 11/2014
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
PACKAGING INFORMATION
Orderable Device
TPS8268090SIPR
TPS8268090SIPT
TPS8268105SIPR
TPS8268105SIPT
TPS8268120SIPR
TPS8268120SIPT
TPS8268150SIPR
TPS8268150SIPT
TPS8268180SIPR
TPS8268180SIPT
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
9
9
9
9
9
9
9
9
9
9
3000
Green (RoHS
& no Sb/Br)
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
YP
TXI682
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
250
3000
250
Green (RoHS
& no Sb/Br)
YP
TXI682
Green (RoHS
& no Sb/Br)
YO
TXI681
Green (RoHS
& no Sb/Br)
YO
TXI681
3000
250
Green (RoHS
& no Sb/Br)
HJ
TXI8120EC
Green (RoHS
& no Sb/Br)
HJ
TXI8120EC
3000
250
Green (RoHS
& no Sb/Br)
YR
TXI685
Green (RoHS
& no Sb/Br)
YR
TXI685
3000
250
Green (RoHS
& no Sb/Br)
HK
TXI8180EC
Green (RoHS
& no Sb/Br)
HK
TXI8180EC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2015
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS8268090SIPR
TPS8268105SIPR
TPS8268120SIPR
TPS8268150SIPR
TPS8268180SIPR
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
9
9
9
9
9
3000
3000
3000
3000
3000
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
2.45
2.45
2.5
3.05
3.05
3.1
1.1
1.1
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
1.35
1.1
2.45
2.5
3.05
3.1
1.35
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jul-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS8268090SIPR
TPS8268105SIPR
TPS8268120SIPR
TPS8268150SIPR
TPS8268180SIPR
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
9
9
9
9
9
3000
3000
3000
3000
3000
223.0
223.0
223.0
223.0
223.0
194.0
194.0
194.0
194.0
194.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 2
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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