TPS92610QPWPRQ1 [TI]
具有 450mA 输出、开路、短路和单 LED 短路检测功能的汽车类单通道 LED 驱动器 | PWP | 14 | -40 to 125;型号: | TPS92610QPWPRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 450mA 输出、开路、短路和单 LED 短路检测功能的汽车类单通道 LED 驱动器 | PWP | 14 | -40 to 125 驱动 光电二极管 接口集成电路 驱动器 |
文件: | 总31页 (文件大小:4025K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
TPS92610-Q1 汽车单通道线性 LED 驱动器
1 特性
3 说明
1
•
•
符合汽车类应用 要求
具有符合 AEC-Q100 标准的下列特性:
随着 LED 在汽车 应用中广泛使用,简单的 LED 驱动
器越来越受欢迎。与分立式解决方案相比,低成本单片
解决方案可降低系统级组件数量,并显著提高电流精度
和可靠性。
–
温度等级 1:–40°C 至 125°C 的环境工作温度
范围
–
–
器件 HBM ESD 分类等级 H2
器件 CDM ESD 分类等级 C3B
TPS92610-Q1 器件是一款简单的单通道高侧 LED 驱
动器,由汽车蓄电池供电。这是一种简单而巧妙的解决
方案,能够为单个 LED 灯串提供恒定电流,并具有全
面的 LED 诊断功能。此器件的“连带失效”功能可与其
他 LED 驱动器(如 TPS9261x-Q1、TPS9263x-Q1 和
TPS9283x-Q1 器件)一起工作,从而满足不同的要
求。
•
•
提供功能安全
可帮助创建功能安全系统设计的文档
–
具有 PWM 调光功能的单通道恒定电流 LED 驱动
器
•
•
•
宽输入电压范围:4.5V - 40V
可由检测电阻器进行调节的恒定输出电流
器件信息(1)
精密电流调节,在 –40°C 至 150°C 的结温范围内
具有 ±4.6% 的容差
器件型号
封装
封装尺寸(标称值)
•
•
•
最大电流:450mA
TPS92610-Q1
HTSSOP (14)
5mm × 4.4mm
与外部电阻器实现热共享
低压降电压(包含检测电阻器压降)
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
–
–
–
–
最大压降:10mA 时为 150mV
最大压降:70mA 时为 400mV
最大压降:150mA 时为 700mV
最大压降:300mA 时为 1.3V
典型应用图
4.5 œ 40V
TPS92610 œ Q1
•
诊断和保护
EN
–
–
–
–
单 LED 短路检测及自动恢复
SUPPLY
IN
EN
R(SNS)
LED 开路与短路检测及自动恢复
DIAGEN
PWM
DIAGEN
PWM
在低压降运行情况下支持诊断并具有可调阈值
多达 15 个器件的故障总线,可配置为“连带失
效”或“仅失效的通道关闭”
OUT
R2
R1
FAULT
GND
–
较低的静态电流和故障模式电流(每个器件小于
250µA)
FAULT
GND
SSH
SSL
•
工作结温范围:–40°C 至 150°C
2 应用
•
•
•
汽车便利照明:座舱顶灯、车门把手、阅读灯和其
他灯具
Copyright © 2017, Texas Instruments Incorporated
汽车尾灯、中央高位刹车灯、侧面标志灯、盲点监
测指示灯、充电口指示灯
通用 LED 驱动器应用
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLDS233
TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
目录
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Application .................................................. 16
Layout ................................................................... 21
9.1 Layout Guidelines ................................................... 21
9.2 Layout Example ...................................................... 21
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements................................................ 6
6.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
8
9
10 器件和文档支持 ..................................................... 22
10.1 文档支持 ............................................................... 22
10.2 接收文档更新通知 ................................................. 22
10.3 社区资源................................................................ 22
10.4 商标....................................................................... 22
10.5 静电放电警告......................................................... 22
10.6 Glossary................................................................ 22
11 机械、封装和可订购信息....................................... 23
7
4 修订历史记录
Changes from Revision A (December 2017) to Revision B
Page
•
向特性 部分添加了提供功能安全的链接.................................................................................................................................. 1
Changes from Original (November 2017) to Revision A
Page
•
产品说明书从“预告信息”更改为“生产数据”.............................................................................................................................. 1
2
Copyright © 2017–2020, Texas Instruments Incorporated
TPS92610-Q1
www.ti.com.cn
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
5 Pin Configuration and Functions
PWP PowerPAD™ Package
14-Pin HTSSOP With Exposed Termal Pad
Top View
EN
DIAGEN
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
SUPPLY
IN
NC
Thermal
Pad
PWM
NC
OUT
NC
FAULT
GND
SSH
SSL
8
Not to scale
NC – No internal connection
Pin Functions
PIN
I/O
DESCRIPTION
NAME
DIAGEN
EN
NO.
2
I
I
Diagnostics enable, to avoid false open-circuit diagnostics during low-voltage operation
1
Device enable
FAULT
GND
6
I/O
—
I
One-fails–all-fail fault bus
Ground
7
IN
13
Current input
NC
3, 5, 10, 12
—
O
I
Not connected
OUT
11
4
Constant-current output
PWM input
PWM
SSH
9
I
Single-LED short high-side reference
Single-LED short low-side reference
Device supply voltage
SSL
8
I
SUPPLY
14
I
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–40
MAX
45
UNIT
V
High-voltage input
High-voltage output
Fault bus
DIAGEN, EN ,IN, PWM, SSH, SSL, SUPPLY
OUT
45
V
FAULT
22
V
IN to OUT
V(IN) – V(OUT)
V(SUPPLY) – V(IN)
45
V
SUPPLY to IN
1
V
Operating junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Copyright © 2017–2020, Texas Instruments Incorporated
3
TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
6.2 ESD Ratings
TPS92610-Q1
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC
Q100-002(1)
All pins
All pins
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per AEC
Q100-011
Corner pins (1, 7, 8, and
14)
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
4.5
4.4
0
NOM
MAX
40
40
40
40
40
5
UNIT
V
SUPPLY
IN
Device supply voltage
Sense voltage
V
PWM
DIAGEN
OUT
SSH
PWM input
V
Diagnostics enable pin
Driver output
0
V
0
V
Single LED short high-side reference
Single LED short low-side reference
Device enable
0
V
SSL
0
5
V
EN
0
40
7
V
FAULT
TA
Fault bus
0
V
Operating ambient temperature
–40
125
°C
6.4 Thermal Information
TPS92610-Q1
THERMAL METRIC(1)
PWP (HTSSOP)
UNIT
14 PINS
52.4
43.5
22
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.6
ψJB
22.3
6.5
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
6.5 Electrical Characteristics
V(SUPPLY) = 5 V – 40 V, TJ = –40°C–150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
BIAS
Supply voltage POR rising
threshold
V(POR_rising)
3.2
3
4
V
V
Supply voltage POR falling
threshold
V(POR_falling)
2.2
I(Shutdown)
I(Quiescent)
Device shutdown current
Device quiescent current
EN = LOW
5
10
µA
PWM = HIGH, EN = HIGH
0.1
0.1
0.2
0.25
mA
EN = HIGH, PWM = HIGH, FAULT
externally pulled LOW
I(FAULT)
Device current in fault mode
0.2
0.25
mA
4
Copyright © 2017–2020, Texas Instruments Incorporated
TPS92610-Q1
www.ti.com.cn
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
Electrical Characteristics (continued)
V(SUPPLY) = 5 V – 40 V, TJ = –40°C–150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LOGIC INPUTS (DIAGEN, PWM, EN)
VIL(DIAGEN)
VIH(DIAGEN)
VIL(PWM)
VIH(PWM)
VIL(EN)
Input logic-low voltage, DIAGEN
1.045
1.14
1.1
1.2
1.1
1.2
1.155
1.26
1.155
1.26
0.7
V
V
Input logic-high voltage, DIAGEN
Input logic-low voltage, PWM
Input logic-high voltage, PWM
Input logic-low voltage, EN
Input logic-high voltage, EN
EN pin pulldown current
1.045
1.14
V
V
V
VIH(EN)
2
V
IPD(EN)
V(EN) = 12 V
1.5
3.3
4.5
µA
CONSTANT-CURRENT DRIVER
I(OUT)
Device output-current range
100% duty-cycle
4
450
102
mA
mV
Ω
TA = 25°C, V(SUPPLY) = 4.5 V to 18 V
94
98
98
V(CS_REG)
R(SNS)
Sense-resistor regulation voltage
Sense-resistor range
TA = –40°C to 125°C, V(SUPPLY) = 4.5 V to
18 V
93.5
102.5
24.5
150
V(CS_REG) voltage included, current setting
= 10 mA
120
250
430
800
V(CS_REG) voltage included, current setting
= 70 mA
400
700
Voltage dropout from SUPPLY to
OUT
V(DROPOUT)
mV
V(CS_REG) voltage included, current setting
= 150 mA
V(CS_REG) voltage included, current setting
= 300 mA
1300
DIAGNOSTICS
LED open rising threshold, V(IN)
V(OUT)
–
V(OPEN_th_rising)
70
235
100
290
1.2
135
335
mV
mV
V
LED open falling threshold, V(IN)
V(OUT)
–
V(OPEN_th_falling)
V(SG_th_falling)
V(SG_th_rising)
I(Retry)
Channel output V(OUT) short-to-
ground falling threshold
1.14
1.26
Channel output V(OUT) short-to-
ground rising threshold
0.82
0.64
140
0.865
1.08
190
0.91
1.528
235
V
Channel output retry current
V(OUT) = 0 V
mA
mV
Single-LED short-detection high-
side threshold
V(SSH_th)
V(SSL) – V(SSH)
Single-LED short-detection low-
side threshold
V(SSL_th)
0.8
0.86
0.91
0.7
V
FAULT
VIL(FAULT)
VIH(FAULT)
VOL(FAULT)
Logic-input low threshold
Logic-input high threshold
Logic-output low voltage
V
V
V
2
5
With 500-µA external pullup
0.4
7
With 1-µA external pulldown, V(SUPPLY)
12 V
=
VOH(FAULT)
Logic-output high voltage
V
I(FAULT_pulldown)
I(FAULT_pullup)
FAULT internal pulldown current
FAULT internal pullup current
500
5
750
8
1000
12
µA
µA
THERMAL PROTECTION
Thermal shutdown junction
temperature threshold
T(TSD)
167
172
15
178
°C
°C
Thermal shutdown junction
temperature hysteresis
T(TSD_HYS)
Copyright © 2017–2020, Texas Instruments Incorporated
5
TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
MAX UNIT
6.6 Timing Requirements
MIN
NOM
PWM rising edge delay, 50% PWM voltage to 10% of output current, t2 – t1
as shown in 图 1
t(PWM_delay_rising)
10
17
25
30
µs
PWM falling edge delay, 50% PWM voltage to 90% of output current, t5 – t4
as shown in 图 1
t(PWM_delay_falling)
t(TSD_deg)
15
21
60
µs
µs
µs
Thermal overtemperature deglitch time
EN rising edge to 10% output current at 150-mA set current and 12-V supply
voltage
t(DEVICE_STARTUP)
100
150
t(OPEN_deg)
t(SG_deg)
LED open-circuit fault-deglitch time
Channel-output short-to-ground detection deglitch time
Single-LED short-detection deglitch time
Recovery deglitch time
80
80
80
125
125
125
16
175
175
175
µs
µs
µs
µs
t(SS_deg)
t(Recover_deg)
Input duty-cycle
PWM
90%
90%
Channel
Current
IOUT
Output duty-cycle
10%
t1
10%
t6
t2
t3
t4
t5
Copyright © 2017, Texas Instruments Incorporated
图 1. Output Timing Diagram
6
版权 © 2017–2020, Texas Instruments Incorporated
TPS92610-Q1
www.ti.com.cn
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
6.7 Typical Characteristics
250
200
150
100
50
500
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
300
200
100
70
50
30
20
10
7
5
3
2
0
4
10
16
22
Supply Voltage (V)
28
34
40
0.2 0.3 0.5 0.7
1
2
3
4 5 6 78 10
20 30 50
R(SNS) (W)
D001
D001
图 2. Output Current vs Supply Voltage
图 3. Output Current vs Current-Sense Resistor
240
200
160
120
80
180
150
120
90
I(OUT) setting = 10 mA
I(OUT) setting = 70 mA
I(OUT) setting = 150 mA
60
-40èC
25èC
125èC
40
30
0
0
0
0.5
1
Dropout Voltage (V)
1.5
2
0
0.5
1
Dropout Voltage (V)
1.5
2
D002
D003
图 4. Output Current vs Dropout Voltage
图 5. Output Current vs Temperature
250
100
100%
-40èC, I(Shutdown)
25èC, I(Shutdown)
125èC, I(Shutdown)
-40èC, I(FAULT)
25èC, I(FAULT)
125èC, I(FAULT)
-40èC, I(Quiescent)
25èC, I(Quiescent)
125èC, I(Quiescent)
10%
10
1%
0.5%
2
1%
10%
PWM Duty Cycle
100%
4
10
16
22
Supply Voltage (V)
28
34
40
D005
D004
图 7. PWM Output Duty Cycle vs Input Duty Cycle
图 6. Shutdown, Quiescent, and Fault Current vs Supply
Voltage
版权 © 2017–2020, Texas Instruments Incorporated
7
TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
Typical Characteristics (接下页)
Ch. 1 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
Ch. 1 = V(SUPPLY)
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Duty cycle = 30%
FAULT floating
ƒ(PWM) = 200 Hz
Duty cycle = 50%
f(PWM) = 1000 Hz
SUPPLY dimming between 2.5 V and 12 V
图 8. PWM Dimming via External Input
图 9. PWM Dimming via Power Supply
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 4 = I(OUT)
图 11. Transient Overvoltage
图 10. Transient Undervoltage
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 13. Superimposed Alternating Voltage, 15 Hz
图 12. Jump Start
8
版权 © 2017–2020, Texas Instruments Incorporated
TPS92610-Q1
www.ti.com.cn
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
Typical Characteristics (接下页)
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 14. Superimposed Alternating Voltage, 1 kHz
图 15. Slow Decrease, Quick Increase of Supply Voltage
Ch. 1 = V(OUT)
Ch. 2 = FAULT
Ch. 4 = I(OUT)
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 17. LED Open-Circuit Protection and Recovery
图 16. Slow Decrease and Slow Increase of Supply Voltage
Ch. 1 = V(OUT)
Ch. 2 = FAULT
Ch. 4 = I(OUT)
Ch. 1 = V(SSH)
Ch. 4 = I(OUT)
Ch. 2 = FAULT
Ch. 3 = V(SSL)
图 18. LED Short-Circuit Protection and Recovery
图 19. Single-LED-Short Protection and Recovery
版权 © 2017–2020, Texas Instruments Incorporated
9
TPS92610-Q1
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TPS92610-Q1 device is one of a family of single-channel linear LED drivers. The family provides a simple
solution for automotive LED applications. Different package options in the family provide a variety of current
ranges and diagnostic options. The TPS92610-Q1 device in an HTSSOP-14 package supports LED open-circuit
detection and short-to-ground detection. Unique single-LED-short detection in the TPS92610-Q1 device can help
diagnose if one LED within a string is shorted. A one-fails–all-fail fault bus allows the TPS92610-Q1 device to be
used together with the TPS9261x-Q1, TPS9263x-Q1, and TPS9283x-Q1 families.
The output current can be set by an external R(SNS) resistor. Current flows from the supply through the R(SNS)
resistor into the internal current source and to the LEDs.
7.2 Functional Block Diagram
TPS92610-Q1
R(SNS)
SUPPLY
IN
EN
DIAGEN
OUT
SSH
SSL
Output Driver
Supply &
Control
PWM
LED Diagnostics
FAULT
GND
Copyright ©2017, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Device Bias
7.3.1.1 Power-On Reset (POR)
The TPS92610-Q1 device has an internal power-on-reset (POR) function. When power is applied to SUPPLY,
the internal POR holds the device in the reset state until V(SUPPLY) is above V(POR_rising)
.
7.3.1.2 Low-Quiescent-Current Fault Mode
The TPS92610-Q1 device consumes minimal quiescent current when its FAULT pin is externally pulled LOW. At
the same time, the device shuts down the output driver.
10
版权 © 2017–2020, Texas Instruments Incorporated
TPS92610-Q1
www.ti.com.cn
ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
Feature Description (接下页)
If device detects an internal fault, it pulls the FAULT output LOW with constant current to signal a fault alarm on
the one-fails–all-fail fault bus.
7.3.2 Constant-Current Driver
The TPS92610-Q1 device has a high-side constant-current integrated driver. The device senses channel current
with an external high-side current-sense resistor, R(SNS). A current regulation loop drives an internal transistor
and regulates the current-sense voltage at the current-sense resistor to V(CS_REG). When the output driver is in
regulation, the output current can be set using the following equation.
V
(CS _REG)
I(OUT)
=
R(SNS)
(1)
7.3.3 Device Enable
The TPS92610-Q1 device has an enable input, EN. When EN is low, the device is in sleep mode with ultralow
quiescent current I(Shutdown). This low current helps to save system-level current consumption in applications
where battery voltage directly connects to the device without high-side switches.
7.3.4 PWM Dimming
The TPS92610-Q1 device supports PWM output dimming via PWM input dimming and supply dimming.
The PWM input functions as an enable for the output current. When the PWM input is low, the device also
disables the diagnostic features.
Supply dimming applies PWM dimming on the power input. For an accurate PWM threshold, TI recommends
using a resistor divider on the PWM input to set the PWM threshold higher than V(POR_rising)
.
7.3.5 Diagnostics
The TPS92610-Q1 device provides advanced diagnostics and fault protection features for automotive exterior
lighting systems. The device is able to detect and protect from LED string short-to-GND, LED string open-circuit,
and single-LED-short scenarios. It also supports a one-fails–all-fail fault bus that could flexibly fit different
legislative requirements.
7.3.5.1 DIAGEN
The TPS92610-Q1 device supports the DIAGEN pin with an accurate threshold to disable the open-circuit and
single-LED-short diagnostic functions. With a resistor divider, the DIAGEN pin can be used to sense SUPPLY
voltage with a resistor-programmable threshold. With the DIAGEN feature, the device is able to avoid false error
reports due to low-dropout voltage and to drive maximum current in low-dropout mode when the input voltage is
not high enough for current regulation.
When V(DIAGEN) is higher than the threshold VIH(DIAGEN), the device enables LED open-circuit and single-LED-short
diagnostics. When V(DIAGEN) is lower than the threshold VIL(DIAGEN), the device disables LED-open-circuit and
single-LED-short diagnostics.
7.3.5.2 Low-Dropout Mode
When the supply voltage drops, the TPS92610-Q1 device tries to regulate current by driving internal transistors
in the linear region, also known as low-dropout mode, because the voltage across the sense resistor fails to
reach the regulation target.
In low-dropout mode, the open-circuit diagnostic must be disabled. Otherwise, the device treats the low-dropout
mode as an open-circuit fault. The DIAGEN pin is used to avoid false diagnostics on the output channel due to
low supply voltage.
When the DIAGEN voltage is low, single-LED short- and open-circuit detection is ignored. When the DIAGEN
voltage is high, single-LED short- and open-circuit detection return to normal operation.
In dropout mode, a diode in parallel with the sense resistor is recommended to clamp the voltage between
SUPPLY and IN (across the sense resistor) in case of a large current pulse during recovery.
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Feature Description (接下页)
7.3.5.3 Open-Circuit Detection
The TPS92610-Q1 device has LED open-circuit detection. Open-circuit detection monitors the output voltage
when the channel is in the ON state. Open-circuit detection is only enabled when DIAGEN is HIGH. A short-to-
battery fault is also detected as an LED open-circuit fault.
The device monitors dropout-voltage differences between the IN and OUT pins when PWM is HIGH. The voltage
difference V(IN) – V(OUT) is compared with the internal reference voltage V(OPEN_th_rising) to detect an LED open-
circuit failure. If V(IN) – V(OUT) falls below the V(OPEN_th_rising) voltage longer than the deglitch time of t(OPEN_deg), the
device asserts an open-circuit fault. Once an LED open-circuit failure is detected, the constant-current source
pulls the fault bus down. During the deglitch time period, if V(IN) – V(OUT) rises above V(OPEN_th_falling), the deglitch
timer is reset.
When the device is in auto-retry, the device keeps the output ON to retry if the PWM input is HIGH; the device
sources a small current I(retry) from IN to OUT when PWM input is LOW. In either scenario, once a faulty channel
recovers, the device resumes normal operation and releases the FAULT pulldown.
7.3.5.4 Short-to-GND Detection
The TPS92610-Q1 device has LED short-to-GND detection. Short-to-GND detection monitors the output voltage
when the channel is in the ON state. Once a short-to-GND LED failure is detected, the device turns off the output
channel and retries automatically, ignoring the PWM input. If the retry mechanism detects removal of the LED
short-to-GND fault, the device resumes normal operation.
The device monitors the V(OUT) voltage and compares it with the internal reference voltage to detect a short-to-
GND failure. If V(OUT) falls below V(SG_th_rising) longer than the deglitch time of t(SG_deg), the device asserts the
short-to-GND fault and pulls FAULT low. During the deglitching time period, if V(OUT) rises above V(SG_th_falling), the
timer is reset.
Once the device has asserted a short-to-GND fault, the device turns OFF the output channel and retries
automatically with a small current. When retrying, the device sources a small current I(retry) from IN to OUT to pull
up the LED loads continuously. Once auto-retry detects output voltage rising above V(SG_th_falling), it clears the
short-to-GND fault and resumes normal operation.
7.3.5.5 Single-LED-Short Detection
The TPS92610-Q1 device supports single-LED-short detection by using the SSH and SSL pins. In case there is
no need of this feature, SSH and SSL must be tied together to a resistor divider to avoid false alarms as shown
in 图 21.
The TPS92610-Q1 device has integrated a precision comparator to monitor a single-LED-short failure. The
comparator uses the bottom LED forward voltage V(SSL) as a reference and monitors the string voltage V(OUT)
with resistor divider R1 and R2 at V(SSH)
.
If a single-LED short is detected, the device turns off the output channel and retries with a small current I(RETRY)
.
Once the fault is removed, the device automatically resumes normal operation.
OUT
R2
SSH
R1
SSL
VSSL – VSSH > V(SSH_th)
+
–
V(SSL_th)
VSSL < V(SSL_th)
+
–
Copyright © 2017, Texas Instruments Incorporated
图 20. Single-LED Short Detection
12
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Feature Description (接下页)
Use the following equation to calculate the ratio of R1 and R2.
R2 = (No. of LEDs - 1) ´ R1
(2)
By using the resistor divider with values calculated in 公式 2, the voltages of SSH and SSL are then equal to the
forward voltage of a single LED. With built-in comparators, the device can report failure if any of the LEDs is
shorted within this string.
An internal resistor string on SSL and resistors R1 and R2 draw current from OUT. TI recommends total
resistance of R1 and R2 greater than 100-kΩ, so the current has negligible effect on LED luminance.
Even within the same batch of LEDs, the LED forward voltage may vary from one to another. Taking account of
forward voltage differences is necessary to avoid any false faults.
4.5 œ 40V
4.5 œ 40V
TPS92610 œ Q1
TPS92610 œ Q1
EN
EN
SUPPLY
SUPPLY
EN
EN
R(SNS)
R(SNS)
DIAGEN
DIAGEN
DIAGEN
PWM
IN
DIAGEN
PWM
IN
PWM
PWM
OUT
OUT
R2
R1
R2
R1
FAULT
GND
FAULT
GND
FAULT
GND
SSH
SSL
FAULT
GND
SSH
SSL
Copyright © 2017, Texas Instruments Incorporated
Copyright © 2017, Texas Instruments Incorporated
图 21. Bypass Single-LED Short Detection
图 22. With Single-LED Short Detection
7.3.5.6 Overtemperature Protection
The TPS92610-Q1 device monitors device junction temperature. When the junction temperature reaches thermal
shutdown threshold T(TSD), the output shuts down. Once the junction temperature falls below T(TSD) – T(TSD_HYS)
the device resumes normal operation. During overtemperature protection, the FAULT bus is pulled low.
,
7.3.6 FAULT Bus Output With One-Fails–All-Fail
The TPS92610-Q1 device has a FAULT bus for diagnostics output. In normal operation, FAULT is weakly pulled
up by an internal pullup current source I(FAULT_pullup) higher than VOH(FAULT). If any fault scenario occurs, the
FAULT bus is strongly pulled low by the internal pulldown current source I(FAULT_pulldown). Once V(FAULT) falls below
VIL(FAULT), all outputs shut down for protection. The faulty channel keeps retrying until the fault scenario is
removed.
If FAULT is externally pulled up with a current larger than I(FAULT_pulldown), the one-fails–all-fail function is disabled
and only the faulty channel is turned off.
The FAULT bus is able to support up to 15 pieces of TPS9261x-Q1, TPS9263x-Q1, or TPS9283x-Q1 devices.
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Feature Description (接下页)
表 1. Fault Table With DIAGEN = HIGH
FAULT BUS
STATUS
FAULT TYPE
DETECTION
MECHANISM
CHANNEL
STATE
DEGLITCH
TIME
FAULT BUS
FAULT
HANDLING
ROUTINE
FAULT
RECOVERY
FAULT floating Open-circuit or V(IN) – V(OUT)
<
On
t(OPEN_deg)
Constant-
current
pulldown
Device works
normally with
FAULT pin
Auto recover
or externally
pulled up
short-to-supply V(OPEN_th_rising)
pulled low.
Device sources
I(retry) current
when PWM is
LOW. Device
keeps output
normal when
PWM is HIGH.
Short-to-ground V(OUT)
<
On
t(SG_deg)
t(SS_deg)
t(TSD_deg)
Constant-
current
pulldown
Device turns
output off and
retries with
constant
Auto recover
Auto recover
Auto recover
V(SG_th_rising)
current I(retry)
ignoring the
PWM input.
,
Single-LED
short
V(SSL) – V(SSH) On
> V(SS_th) or
Constant-
current
pulldown
Device turns
output off and
retry with
V(SSL)
V(SSL_th)
<
constant
current I(retry)
ignoring the
PWM input.
,
Overtemperatur TJ > T(TSD)
e
On or off
Constant-
current
Devices turns
output off.
pulldown
Externally
pulled low
Device turns output off
表 2. Fault Table With DIAGEN = LOW
FAULT BUS
STATUS
FAULT TYPE
DETECTION
MECHANISM
CHANNEL
STATE
DEGLITCH
TIME
FAULT BUS
FAULT
HANDLING
ROUTINE
FAULT
RECOVERY
FAULT floating Open-circuit or
Ignored
or externally
pulled up
short-to-supply
Short-to-ground VOUT
V(SG_th_rising)
<
On
t(SG_deg)
Constant-
current
pulldown
Device turns
output off and
retries with
constant
Auto recover
current I(retry)
ignoring the
PWM input.
,
Single-LED
short
Ignored
Overtemperatur TJ > T(TSD)
e
On or off
t(TSD_deg)
Constant-
current
Device turns
output off.
Auto recover
pulldown
Externally
pulled low
Device turns output off
7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY)<V(POR_rising)
When the device is in undervoltage lockout mode, the TPS92610-Q1 device disables all functions until the supply
rises above the UVLO-rising threshold.
14
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Device Functional Modes (接下页)
7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
7.4.3 Low-Voltage Dropout
When the device drives an LED string in low-dropout mode, if the voltage drop is less than open-circuit detection
threshold, the device may report a false open-circuit fault. Set the DIAGEN threshold higher than LED string
voltage to avoid a false open-circuit detection.
7.4.4 Fault Mode
When the device detects an open circuit or a shorted LED, the device tries to pull down the FAULT pin with a
constant current. If the FAULT bus is pulled down, the device switches to fault mode and consumes a fault
current of I(FAULT)
.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
In automotive lighting applications, thermal performance and LED diagnostics are always design challenges for
linear LED drivers.
The TPS92610-Q1 device is capable of detecting LED open-circuit, LED short-circuit and single-LED short
failures. To increase current-driving capability, the TPS92610-Q1 device supports using an external a parallel
resistor to help dissipate heat as shown in the following application, 图 25. This technique provides the low-cost
solution of using external resistors to dissipate heat due to high input voltage, and still keeps high accuracy of the
total current output. Note that the one-fails–all-fail feature is not supported by this topology.
8.2 Typical Application
8.2.1 Single-Channel LED Driver With Full Diagnostics
The TPS92610-Q1 device is a potential choice for LED driver for applications with diagnostics requirements. In
many cases, single-LED short diagnostics are mandatory for applications such as sequential turn indicators.
SUPPLY
TPS92610 œ Q1
EN
SUPPLY
IN
EN
R4
R3
I(LED)
R(SNS)
DIAGEN
PWM
DIAGEN
PWM
OUT
R2
R1
FAULT
GND
FAULT
GND
SSH
SSL
Copyright © 2017, Texas Instruments Incorporated
图 23. Typical Application Diagram
8.2.1.1 Design Requirements
Input voltage ranges from 9 V to 16 V, LED maximum forward voltage Vfmax = 2.5 V, minimum forward voltage
Vfmin = 1.9 V, current I(LED) = 50 mA.
8.2.1.2 Detailed Design Procedure
Current setting by sense resistor is as described in公式 1.
R(CS _REG)
R(SNS)
=
= 1.96 W
I(LED)
(3)
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V.
16
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Typical Application (接下页)
With 400-mV headroom reserved for the TPS92610-Q1 device between SUPPLY and OUT, the TPS92610-Q1
device must disable open-circuit detection when the supply voltage is below 7.9 V by using the DIAGEN feature.
7.9´R3
VIL(DIAG,min)
=
R3 + R4
(4)
(5)
(6)
Set R4 = 10 kΩ, R3 = 65.6 kΩ.
The single-LED short-detection resistor ratio can be calculated as follows.
R2
= 2
R1
If R1 = 50 kΩ, R2 = 100 kΩ
Total device power consumption at worst case is with 16-V input and LEDs at minimal froward voltage.
P
= (V
- V
- V(OUT) )´I(LED) + V(SUPPLY) ´I(Quiescent)
(Max)
(SUPPLY)
(CS _REG)
= (16 - 3´1.9 - 0.098)´0.05 +16 ´0.00025 = 0.5141 W
8.2.1.3 Application Curve
Ch. 1 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
图 24. Output Current With PWM Input
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Typical Application (接下页)
8.2.2 Single-Channel LED Driver With Heat Sharing
SUPPLY
TPS92610 œ Q1
EN
SUPPLY
IN
EN
I(LED)
R(SNS)
I(DRIVE)
DIAGEN
DIAGEN
PWM
I(P)
R(P)
PWM
OUT
FAULT
GND
FAULT
GND
SSH
SSL
Copyright © 2017, Texas Instruments Incorporated
图 25. Heat Sharing With a Parallel Resistor
8.2.2.1 Design Requirements
Input voltage range is 9 V to 16 V, LED maximum forward voltage Vfmax= 2.5 V, minimum forward voltage Vfmin
=
1.9 V, current I(LED) = 200 mA.
8.2.2.2 Detailed Design Procedure
Using parallel resistors, thermal performance can be improved by balancing current between the TPS92610-Q1
device and the external resistors as follows. As the current-sense resistor controls the total LED string current,
the LED string current I(LED) is set by V(CS_REG) / R(SNS), while the TPS92610-Q1 current I(DRIVE) and parallel
resistor current I(P) combine to the total current.
Note that the parallel resistor path cannot be shut down by PWM or fault protection. If PWM or one-fails–all-fail
feature is required, TI recommends an application circuit as described in Single-Channel LED Driver With Full
Diagnostics.
In linear LED driver applications, the input voltage variation contributes to most of the thermal concerns. The
resistor current, as indicated by Ohm’s law, depends on the voltage across the external resistors. The
TPS92610-Q1 controls the driver current I(DRIVE) to attain the desired total current. If I(P) increases, the
TPS92610-Q1 device decreases I(DRIVE) to compensate, and vice versa.
While in low-dropout mode, the voltage across the R(P) resistor may be close to zero, so that almost no current
can flow through the external resistor R(P)
.
When the input voltage is high, the parallel-resistor current I(P) is proportional to the voltage across the parallel
resistor R(P). The parallel resistor R(P) takes the majority of the total string current, generating maximum heat.
The device must prevent current from draining out to ensure current regulation capability.
In this case, the parallel resistor value must be carefully calculated to ensure that 1) enough output current is
achieved in low-dropout mode, 2) thermal dissipation for both the TPS92610-Q1 device and the resistor is within
their thermal dissipation limits, and 3) device current in the high-voltage mode is above the minimal output-
current requirement.
Current setting by sense resistor is as described in 公式 7.
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Typical Application (接下页)
V
(CS _REG)
R(SNS)
=
= 0.49W
I(LED)
(7)
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V.
Parallel resistor R(P) is recommended to consume 50% of the total current at maximum supply voltage.
V
(SUPPLY) - V
- V
16 - 3ì1.9 - 0.098
0.5ì0.2
(CS _REG) (OUT)
R(P)
=
=
ö 100W
0.5ìI(LED)
(8)
Total device power consumption is maximum at 16 V input and LED minimal forward voltage.
æ
ö
÷
÷
ø
V(SUPPLY) - V(CS _ REG) - V(OUT)
P
= (V(SUPPLY) - V(CS _ REG) - V(OUT) )´ I
-
+ V(SUPPLY) ´I(Quiescent)
ç
ç (LED)
(DEV _ MAX)
R(P)
è
= (16 - 3 ´1.9 - 0.098)´ 0.1+ 16 ´ 0.00025 = 1.0242 W
(9)
Resistor R(P) maximum power consumption is at 16-V input.
2
2
V(SUPPLY) - V
- V
(
)
16 - 3ì1.9 - 0.098
(
)
(CS _REG) (OUT)
P
=
=
= 1.04W
(RP _MAX)
R(P)
100
(10)
Users must consider the maximum power of both of the device and the parallel resistor.
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Typical Application (接下页)
8.2.2.3 Application Curve
Ch. 1 = V(SUPPLY)
Ch. 2 = V(OUT)
Ch. 3 = I(P)
Ch. 4 = I(LED) V(SUPPLY) increases from 9 V to 16 V
图 26. Constant Output Current With Increasing Supply Voltage
20
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ZHCSH65B –OCTOBER 2017–REVISED JANUARY 2020
9 Layout
9.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92610-Q1 layout. TI recommends good thermal
dissipation area connected to thermal pads with thermal vias.
9.2 Layout Example
SUPPLY
TPS92610-Q1
1
2
3
4
5
6
7
14
13
12
11
10
9
EN
SUPPLY
DIAGEN
NC
IN
NC
PWM
NC
OUT
NC
FAULT
GND
SSH
SSL
8
GND
Copyright © 2017, Texas Instruments Incorporated
图 27. TPS92610-Q1 Example Layout Diagram
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10 器件和文档支持
10.1 文档支持
10.1.1 相关文档
请参阅如下相关文档:
•
•
•
•
《TPS92610-Q1 EVM 用户指南》
《如何在汽车外部照明应用中计算 TPS92630-Q1 最大输出 电流》
《适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计》
《用户指南:适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计》
10.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
10.3 社区资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.4 商标
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
10.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
10.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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11 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是适用于指定器件的最新数据。数据如有变更,恕不另行通知,
且不会对此文档进行修订。如需获取此数据表的浏览器版本,请查看左侧的导航面板。
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23
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92610QPWPRQ1
ACTIVE
HTSSOP
PWP
14
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
TP92610
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92610QPWPRQ1 HTSSOP PWP
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 14
SPQ
Length (mm) Width (mm) Height (mm)
350.0 350.0 43.0
TPS92610QPWPRQ1
2000
Pack Materials-Page 2
GENERIC PACKAGE VIEW
PWP 14
4.4 x 5.0, 0.65 mm pitch
PowerPAD TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224995/A
www.ti.com
PACKAGE OUTLINE
PWP0014K
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX
AREA
SEATING
PLANE
12X 0.65
14
1
2X
5.1
4.9
3.9
NOTE 3
7
8
0.30
14X
0.19
4.5
4.3
B
0.1
C A B
SEE DETAIL A
(0.15) TYP
2X (0.6)
NOTE 5
2X (0.4)
NOTE 5
THERMAL
PAD
7
8
0.25
1.2 MAX
GAGE PLANE
2.59
1.89
15
0.15
0.05
0.75
0.50
0 -8
A
20
1
14
DETAIL A
TYPICAL
2.6
1.9
4229706/A 06/2023
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0014K
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 9
(2.6)
METAL COVERED
BY SOLDER MASK
SYMM
14X (1.5)
(1.2) TYP
14
14X (0.45)
1
(5)
NOTE 9
(R0.05) TYP
SYMM
(0.6)
15
(2.59)
12X (0.65)
7
8
(
0.2) TYP
VIA
SEE DETAILS
(1.1) TYP
SOLDER MASK
DEFINED PAD
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 12X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
SOLDER MASK DETAILS
4229706/A 06/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0014K
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(2.6)
BASED ON
0.125 THICK
STENCIL
METAL COVERED
BY SOLDER MASK
14X (1.5)
14X (0.45)
14
1
(R0.05) TYP
(2.59)
SYMM
15
BASED ON
0.125 THICK
STENCIL
12X (0.65)
7
8
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 12X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
2.91 X 2.90
2.60 X 2.59 (SHOWN)
2.37 X 2.36
0.125
0.15
0.175
2.20 X 2.19
4229706/A 06/2023
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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