TPS92622-Q1 [TI]
具有热共享功能的汽车类双通道 40V 高侧 LED 驱动器;
| 型号： | TPS92622-Q1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有热共享功能的汽车类双通道 40V 高侧 LED 驱动器 驱动 驱动器 |
| 文件： | 总35页 (文件大小：6904K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS92622-Q1
ZHCSQI1 –NOVEMBER 2022
TPS92622-Q1 具有热共享功能的汽车类双通道高侧LED 驱动器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准：
• 车外尾灯：尾灯、中央高位刹车灯、侧标志灯
• 车外小灯：门把手、盲点检测指示灯、充电口
• 车内灯：顶灯、阅读灯
– 温度等级1: –40 ° C 至125 ° C 、T A
• 宽输入电压范围：4.5V 至40V
• 通过外部分流电阻器实现热共享功能
• 故障模式下具有低电源电流
• 通用LED 驱动器应用
3 说明
• 双通道高精度电流调节：
TPS92622-Q1 双通道 LED 驱动器采用独特的热管理
设计，可减少器件温升。TPS92622-Q1 是由汽车电池
直接供电的线性驱动器，具有宽电压范围，每个通道可
输出高达 150mA 的全电流负载。外部分流电阻器可用
来共享输出电流并由驱动器驱动。该器件具有全面的诊
断功能，包括 LED 开路、LED 接地短路和器件过热保
护。
– 每个通道的电流输出高达150mA
– 在整个温度范围内精度为±5%
– 通过电阻器独立设置电流
– 用于亮度控制的独立PWM 引脚
• 低压降：
– 最大压降：150mA 时为350mV
• 诊断和保护
– LED 开路，具有自动恢复功能
– LED 接地短路，具有自动恢复功能
– 支持诊断并具有可调阈值
– 可配置为连带失效或仅失效通道关闭的故障总线
(N-1)
– 热关断
TPS92622-Q1 的连带失效功能可与其他 LED 驱动器
（如 TPS9261x-Q1、TPS9262x-Q1、TPS9263x-Q1
和TPS92830-Q1 器件）配合工作，从而满足不同的要
求。
封装信息
封装(1)
封装尺寸（标称值）
4.00mm × 3.00mm
3.00mm × 3.00mm
器件型号
• 工作结温范围：–40°C 至150°C
DGN（HVSSOP，
12）(2)
TPS92622-Q1
DRR（WSON，12）
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
(2) 产品预发布。
4.5 V to 40 V
3
C(OUT1)
R(RES1)
TPS92622-Q1
P(DEVICE) R(RESx) = 55 2LEDs
P(RESx) R(RESx) = 55 2LEDs
RES1
OUT1
RES2
OUT2
GND
SUPPLY
R(SNS1)
R(SNS2)
P(DEVICE) R(RESx) = 55 3LEDs
IN1
2.5
C(SUPPLY)
R(RES2)
P(RESx) R(RESx) = 55 3LEDs
C(OUT2)
IN2
2
DIAGEN
PWM1
PWM2
1.5
1
FAULT
典型应用图
0.5
0
3
6
9
12
15
18
21
24
27
30
Supply Voltage (V)
器件功耗
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSGW4
TPS92622-Q1
ZHCSQI1 –NOVEMBER 2022
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Table of Contents
7.3 Feature Description...................................................11
7.4 Device Functional Modes..........................................21
8 Application and Implementation..................................22
8.1 Application Information............................................. 22
8.2 Typical Applications.................................................. 22
8.3 Power Supply Recommendations.............................26
8.4 Layout....................................................................... 26
9 Device and Documentation Support............................28
9.1 接收文档更新通知..................................................... 28
9.2 支持资源....................................................................28
9.3 Trademarks...............................................................28
9.4 Electrostatic Discharge Caution................................28
9.5 术语表....................................................................... 28
10 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 绝对最大额定值...........................................................4
6.2 ESD 等级.................................................................... 4
6.3 建议运行条件.............................................................. 4
6.4 热性能信息..................................................................4
6.5 电气特性......................................................................5
6.6 Typical Characteristics................................................7
7 Detailed Description......................................................11
7.1 Overview................................................................... 11
7.2 Functional Block Diagram......................................... 11
Information.................................................................... 29
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
November 2022
*
Initial release.
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5 Pin Configuration and Functions
SUPPLY
IN1
1
2
3
4
5
6
12
11
10
9
RES1
OUT1
RES2
OUT2
GND
IN2
Thermal
Pad
DIAGEN
PWM1
PWM2
8
7
FAULT
Not to scale
A. HVSSOP is product preview.
图5-1. DGN Package 12-Pin HVSSOP With PowerPAD™ Integrated Circuit Package (Top View)
12
11
10
9
1
2
3
4
5
6
RES1
OUT1
RES2
OUT2
GND
SUPPLY
IN1
IN2
Thermal
Pad
DIAGEN
8
PWM1
PWM2
7
FAULT
Not to scale
图5-2. DRR Package 12-Pin WSON With PowerPAD™ Integrated Circuit Package (Top View)
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
SUPPLY
IN1
NO.
1
I
I
I
Device power supply
2
Current input for channel 1
Current input for channel 2
IN2
3
Enable pin for LED open-circuit detection to avoid false open diagnostics during low-dropout
operation.
DIAGEN
4
I
PWM1
PWM2
FAULT
GND
5
6
I
I
PWM input for OUT1 and RES1 current output ON and OFF control
PWM input for OUT2 and RES2 current output ON and OFF control
Fault output, support one-fails–all-fail fault bus
Ground
7
I/O
8
—
O
O
O
O
OUT2
RES2
OUT1
RES1
9
Current output for channel 2
10
11
12
Current output for channel 2 with external thermal resistor
Current output for channel 1
Current output for channel 1 with external thermal resistor
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6 Specifications
6.1 绝对最大额定值
在自然通风条件下的工作温度范围内测得（除非另有说明）(1)
最小值
–0.3
–0.3
–0.3
–0.3
-40
最大值
单位
45
V(SUPPLY) + 0.3
V(SUPPLY) + 0.3
V(SUPPLY) + 0.3
150
V
电源
电源
V
V
DIAGEN、IN1、IN2、PWM1、PWM2
OUT1、OUT2、RES1、RES2
FAULT
高压输入
高电压输出
V
故障总线
TJ
°C
°C
工作结温
存储温度
Tstg
-40
150
(1) 超出绝对最大额定值运行可能会对器件造成永久损坏。绝对最大额定值并不表示器件在这些条件下或在建议运行条件以外的任何其他条
件下能够正常运行。如果超出建议运行条件但在绝对最大额定值范围内使用，器件可能不会完全正常运行，这可能影响器件的可靠性、
功能和性能并缩短器件寿命。
6.2 ESD 等级
值
单位
人体放电模型(HBM)，符合AEC Q100-002(1)
HBM ESD 分类等级1C
±2000
±500
±750
V(ESD)
V
静电放电
所有引脚
充电器件模型(CDM)，符合AEC Q100–011
CDM ESD 分类等级C4B
转角引脚（SUPPLY、RES1、
FAULT、PWM2）
(1) AEC Q100-002 指示应当按照ANSI/ESDA/JEDEC JS-001 规范执行HBM 应力测试。
6.3 建议运行条件
在自然通风条件下的工作温度范围内测得（除非另有说明）
最小值
标称值
最大值
单位
4.5
40
V
电源
器件电源电压
检测电压
V(SUPPLY) - V(CS_REG)
V
V
V
IN1、IN2
PWM1、PWM2
DIAGEN
0
0
V(SUPPLY)
V(SUPPLY)
PWM 输入
诊断使能引脚
OUT1、OUT2、RES1、
RES2
0
0
V(SUPPLY)
V
驱动器输出
故障总线
FAULT
V(SUPPLY)
125
V
-40
°C
工作环境温度，TA
6.4 热性能信息
TPS92622-Q1
DRR (WSON) DGN (HVSSOP)
热指标(1)
单位
12 引脚
51.2
50.7
25.2
1.3
12 引脚
39.7
60.9
15.5
2.6
RθJA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
结至环境热阻
RθJC(top)
RθJB
结至外壳（顶部）热阻
结至电路板热阻
ψJT
结至顶部特征参数
25.2
9.4
15.5
2.6
ψJB
结至电路板特征参数
结至外壳（底部）热阻
RθJC(bot)
(1) 有关新旧热指标的更多信息，请参阅半导体和IC 封装热指标应用报告。
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6.5 电气特性
V(SUPPLY) = 5V 至40V，TJ = –40°C 至+150°C（除非另有说明）
参数
测试条件
最小值 典型值 最大值
单位
BIAS
V(POR_rising)
V(POR_falling)
I(Quiescent)
I(FAULT)
3.6
3.4
4.0
V
V
电源电压POR 上升阈值
电源电压POR 下降阈值
器件待机接地电流
3.0
1.2
1.6
mA
mA
PWM = 高电平
0.21
0.32
0.45
PWM = 高电平，FAULT 从外部下拉至低电平
故障模式下的器件电源电流
逻辑输入（DIAGEN，PWM）
VIL(DIAGEN)
VIH(DIAGEN)
VIL(PWM)
1.045
1.14
1.1
1.2
1.1
1.2
1.155
1.26
V
V
V
V
输入逻辑低电平电压，DIAGEN
输入逻辑高电平电压，DIAGEN
输入逻辑低电平电压，PWM
输入逻辑高电平电压，PWM
1.045
1.14
1.155
1.26
VIH(PWM)
恒流驱动器
I(OUTx_Tot)
5
144
-3
150
156
+3
mA
mV
%
100% 占空比
每个通道的器件输出电流
检测电阻调节电压
通道间失配
V(CS_REG)
150
TA = -40°C 至+125°C
所有ΔV(CS_c2c)
所有ΔV(CS_d2d)
R(CS_REG)
ΔV(CS_c2c) = 1 –V(CS_REGx) / Vavg(CS_REG)
ΔV(CS_d2d) = 1 –Vavg(CS_REG) / Vnom(CS_REG)
+4
%
–4
器件间失配
0.96
31.2
250
350
450
700
检测电阻范围
Ω
120
180
230
350
mV
100mA 的电流设置
150mA 的电流设置
100mA 的电流设置
150mA 的电流设置
从INx 到OUTx 的压降，RESx 开路
mV
mV
mV
V(DROPOUT)
从INx 到RESx 的压降，OUTx 开路
RESx 电流与总电流之比
I(RESx)/I(OUTx_Tot), V(INx) –V(RESx) > 1V，
Itotal=150mA
I(RESx)
95
%
诊断
V(OPEN_th_rising)
180
300
450
1.2
420
mV
mV
V
LED 开路上升阈值，V(IN) –V(OUT)
LED 开路下降阈值，V(IN) –V(OUT)
通道输出接地短路上升阈值
V(OPEN_th_falling)
V(SG_th_rising)
V(SG_th_falling)
I(Retry_OUTx)
I(Retry_RESx)
FAULT
1.14
0.855
0.64
1.26
0.945
1.528
1.528
0.9
V
通道输出接地短路下降阈值
1.14
1.14
mA
mA
通道输出V(OUT) 接地短路重试电流
通道输出V(RES) 接地短路重试电流
0.64
VIL(FAULT)
0.7
V
V
逻辑输入低电平阈值
VIH(FAULT)
2
逻辑输入高电平阈值
t(FAULT_rising)
t(FAULT_falling)
I(FAULT_pulldown)
I(FAULT_pullup)
I(FAULT_leakage)
10
20
µs
µs
mA
µA
µA
故障检测上升沿抗尖峰脉冲时间
故障检测下降沿抗尖峰脉冲时间
FAULT 内部下拉电流
FAULT 内部上拉电流
FAULT 漏电流
V(FAULT) = 0.4V
V(FAULT) = 40V
2
6
3
4
14
2
10
0.01
时序
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 1Ω 且R(RESx) = 68Ω
=
=
=
=
3.7
2.2
4.0
3.6
µs
µs
µs
µs
PWM 上升沿到输出电流10% 的延迟，如图7-1
所示的t1
t(PWM_delay_rising)
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 30Ω 且R(RESx) = 56Ω
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 1Ω 且R(RESx) = 68Ω
PWM 下降沿到输出电流90% 的延迟，如图7-1
所示的t2
t(PWM_delay_falling)
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 30Ω 且R(RESx) = 56Ω
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6.5 电气特性(continued)
V(SUPPLY) = 5V 至40V，TJ = –40°C 至+150°C（除非另有说明）
参数
测试条件
最小值 典型值 最大值
单位
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 1Ω 且R(RESx) = 68Ω
=
=
=
=
=
=
1.8
1.8
5.7
0.3
96
µs
输出电流从10% 上升到90%，如图7-1 所示的
t(Current_rising)
t(Current_falling)
t(STARTUP)
t3
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 30Ω 且R(RESx) = 56Ω
µs
µs
µs
µs
µs
µs
µs
µs
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 1Ω 且R(RESx) = 68Ω
输出电流从90% 下降至10%，如图7-1 所示的
t4
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 30Ω 且R(RESx) = 56Ω
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 1Ω 且R(RESx) = 68Ω
电源上升沿至10% 输出电流，如图7-1 所示的t5
V(SUPPLY) = 12V、V(OUT) = 6V、V(CS_REG)
150mV、R(SNSx) = 30Ω 且R(RESx) = 56Ω
85
LED 开路故障检测抗尖峰脉冲时间，如图7-4 所
示的t6
t(OPEN_deg)
125
125
125
输出接地短路检测抗尖峰脉冲时间，如图7-3 所
示的t7
t(SG_deg)
开路和短路故障恢复抗尖峰脉冲时间，如图7-4
和图7-3 所示的t8
t(Recover_deg)
t(FAULT_deg)
t(FAULT_recovery)
t(TSD_deg)
20
50
50
µs
µs
µs
故障引脚抗尖峰脉冲时间
故障恢复延迟时间，如图7-4 和图7-3 所示的t9
过热抗尖峰脉冲时间
过热保护
T(TSD)
157
172
15
187
°C
°C
热关断结温阈值
热关断结温迟滞
T(TSD_HYS)
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6.6 Typical Characteristics
200
175
150
125
100
75
225
200
175
150
125
100
75
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 150 mA
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 150 mA
50
50
25
25
0
0
-40
-20
0
20
40
60
80
100 120 140
3
6
9
12
15
18
21
24
27
30
Temperature (C)
Supply Voltage (V)
图6-2. Output Current vs Temperature
图6-1. Output Current vs Supply Voltage
300
250
200
150
100
50
225
200
175
150
125
100
75
I(OUTx_Tot) = 150 mA
I(OUTx_Tot) = 50 mA
50
I(OUTx_Tot) = 250 mA -40 o
C
I(OUTx_Tot) = 250 mA 25 o
C
25
I(OUTx_Tot) = 250 mA 125 o
C
0
0
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
Dropout Voltage (V)
Dropout Voltage (V)
图6-3. Output Current vs Dropout Voltage
图6-4. Output Current vs Dropout Voltage
100
90
80
70
60
50
40
30
20
10
0
175
150
125
100
75
I(OUTx) R(RESx) = 34
I(RESx) R(RESx) = 34
I(OUTx) R(RESx) = 41
I(RESx) R(RESx) = 41
I(OUTx) R(RESx) = 55
I(RESx) R(RESx) = 41
I(OUTx) R(RESx) = 65
I(RESx) R(RESx) = 65
I(OUTx) R(RESx) = 80
I(RESx) R(RESx) = 80
50
25
0
0
10
20
30
40
50
60
70
80
90 100
3
6
9
12
15
18
21
24
27
30
Input PWM Duty Cycle ()
Supply Voltage (V)
图6-5. PWM Output Duty Cycle vs PWM Input Duty Cycle
图6-6. Output Current Distribution vs Supply Voltage
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6.6 Typical Characteristics (continued)
5
225
200
175
150
125
100
75
I(OUTx) R(RESx) = 55 2LEDs
P(DEVICE) R(RESx) = 34
P(Resx) R(RESx) = 34
P(DEVICE) R(RESx) = 41
P(Resx) R(RESx) = 41
P(DEVICE) R(RESx) = 55
P(Resx) R(RESx) = 55
P(DEVICE) R(RESx) = 65
P(Resx) R(RESx) = 65
P(DEVICE) R(RESx) = 80
P(Resx) R(RESx) = 80
I(RESx) R(RESx) = 55 2LEDs
I(OUTx) R(RESx) = 55 3LEDs
I(RESx) R(RESx) = 55 3LEDs
4
3
2
1
0
50
25
0
3
6
9
12
15
18
21
24
27
30
3
3
6
9
12
15
18
21
24
27
30
Supply Voltage (V)
Supply Voltage (V)
图6-8. Output Current Distribution vs Supply Voltage
图6-7. Power Dissipation vs Supply Voltage
P(DEVICE) R(RESx) = 55 2LEDs
P(RESx) R(RESx) = 55 2LEDs
P(DEVICE) R(RESx) = 55 3LEDs
P(RESx) R(RESx) = 55 3LEDs
2.5
2
1.5
1
0.5
0
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
3
6
9
12
15
18
21
24
27
30
Supply Voltage (V)
图6-10. Power-Up Sequence
图6-9. Power Dissipation vs Supply Voltage
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-12. PWM Dimming at 200 Hz
Ch2 = V(OUT1)
Ch3 = V(PWM1)
图6-11. Supply Dimming at 200 Hz
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6.6 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
图6-13. PWM Dimming at 1 kHz
图6-14. LED Open Protection
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-15. LED Open Protection Recovery
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-16. LED Short-Circuit Protection
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
图6-17. LED Short-Circuit Protection Recovery
图6-18. Transient Undervoltage
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6.6 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-19. Transient Overvoltage
图6-20. Slow Decrease and Quick Increase of Supply Voltage
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-21. Slow Decrease and Slow Increase of Supply Voltage
图6-22. Superimposed Alternating Voltage 15 Hz
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-23. Superimposed Alternating Voltage 1 kHz
图6-24. Jump Start
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7 Detailed Description
7.1 Overview
The TPS92622-Q1 is a two-channel, high-side linear LED driver supporting external thermal sharing resistor to
achieve the controllable junction temperature rising. The device can be directly powered by automotive battery
and output full load up to 300-mA current to LED with limited power dissipation on the device. The current output
at each channel can be independently set by external R(SNSx) resistors. Current flows from the supply through
the R(SNSx) resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and RESx
pin. TPS92622-Q1 device supports both supply control and PWM control to turn LED ON and OFF. The LED
brightness is also adjustable by voltage duty cycle applied on either SUPPLY or PWMx pins with frequency
above 100 Hz. The TPS92622-Q1 provides full diagnostics to keep the system operating reliably including LED
open and short-circuit detection, supply POR and thermal shutdown protection. TPS92622-Q1 device is in a
HTSSOP package with total 16 leads. The TPS92622-Q1 can be used with other TPS9261x-Q1, TPS9262x-Q1,
TPS9263x-Q1 and TPS92830-Q1 family devices together to achieve one-fails-all-fail protection by tying all
FAULT pins together as a fault bus.
7.2 Functional Block Diagram
VSUPPLY
R(SNS1)
TPS92622-Q1
Channel 1
IN1
SUPPLY
DIAGEN
PWM1
PWM2
RES1
OUT1
VCC
IN2
Logic
RES2
FAULT
Channel 2
OUT2
GND
7.3 Feature Description
7.3.1 Power Supply (SUPPLY)
7.3.1.1 Power-On Reset (POR)
The TPS92622-Q1 device has an internal power-on-reset (POR) function. When power is applied to the
SUPPLY pin, the internal POR circuit holds the device in reset state until V(SUPPLY) is above V(POR_rising)
.
7.3.1.2 Suppply Current in Fault Mode
The TPS92622-Q1 device consumes minimal quiescent current, I(FAULT), into SUPPLY when the FAULT pin is
externally pulled LOW. At the same time, the device shuts down all three output drivers.
If device detects an internal fault, it pulls down the FAULT pin by an internal typical 3-mA constant current as a
fault indication to the fault bus.
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7.3.2 Enable and Shutdown
The device starts to operate as long as the SUPPLY voltage is higher than V(POR_rising). The TPS92622-Q1 shuts
down when SUPPLY voltage is lower than V(POR_falling)
.
7.3.3 Constant-Current Output and Setting (INx)
The TPS92622-Q1 device is a high-side current driver for driving LEDs. The device controls each output current
through regulating the voltage drop on an external high-side current-sense resistor, R(SNSx) independently for
each channel. An integrated error amplifier drives an internal power transistor to maintain the voltage drop on the
current-sense resistor R(SNSx) to V(CS_REG) and therefore regulates the current output to target value. When the
output current is in regulation, use 方程式1 to calculate the current value for each channel.
V
(CS _REG)
I(OUTx _ Tot)
=
R(SNSx)
(1)
where
• V(CS_REG) = 150 mV
• x = 1, or 2 for output channel 1 or 2
When the supply voltage drops below total LED string forward voltage plus required headroom voltage, the sum
of V(DROPOUT) and V(CS_REG), the TPS92622-Q1 is not able to deliver enough current output as set by the value
of R(SNSx), and the voltage across the current-sense resistor R(SNSx) is less than V(CS_REG)
.
7.3.4 Thermal Sharing Resistor (OUTx and RESx)
The TPS92622-Q1 device provides two current output paths for each channel. Current flows from the supply
through the R(SNSx) resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and
RESx pin. The current output on both OUTx pin and RESx pin is independently regulated to achieve total
required current output. The summed current of OUTx and RESx is equal to the current through the R(SNSx)
resistor in the channel. The OUTx connects to anode of LEDs load in serial directly, however RESx connects to
the LEDs through an external resistor to share part of the power dissipation and reduce the thermal
accumulation in TPS92622-Q1.
The integrated independent current regulation in TPS92622-Q1 dynamically adjusts the output current on both
OUTx and RESx output to maintain the stable summed current for LED. The TPS92622-Q1 always regulates the
current output to the RESx pin as much as possible until the RESx current path is saturated, and the rest of
required current is regulated out of the OUTx. As a result, the most of the current to LED outputs through the
RESx pin when the voltage dropout is large between SUPPLY and LED required total forward voltage. In the
opposite case, the most of the current to LED outputs through the OUTx pin when the voltage headroom is
relative low between SUPPLY and LED required forward voltage.
7.3.5 PWM Control (PWMx)
The pulse width modulation (PWM) input of the TPS92622-Q1 functions as enable for the output current. When
the voltage applied on the PWM pin is higher than VIH(PWM), the relevant output current is enabled. When the
voltage applied on PWM pin is lower than VIL(PWM), the output current is disabled as well as the diagnostic
features. Besides output current enable and disable function, the PWM input of TPS92622-Q1 also supports
adjustment of the average current output for brightness control if the frequency of applied PWM signal is higher
than 100 Hz, which is out of visible frequency range of human eyes. TI recommends a 200-Hz PWM signal with
1% to 100% duty cycle input for brightness control. Please refer to 图8-4 for typical PWM dimming application.
The TPS92622-Q1 device has two PWM input pins: PWM1, PWM2 to control each of current output channel
independently. PWM1 input controls the output channel 1 for both OUT1 and RES1, PWM2 input controls the
output channel 2 for both OUT2 and RES2. 图7-1 illustrates the timing for PWM input and current output.
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SUPPLY
PWMx
t1
t2
tt5t
t3
t4
IOUTx
图7-1. Power-On Sequence and PWM Dimming Timing
The detailed information and value of each time period in 图 7-1 is described in TIMING section of the Electrical
Characteristics.
7.3.6 Supply Control
The TPS92622-Q1 can support supply control to turn ON and OFF output current. When the voltage applied on
the SUPPLY pin is higher than the LED string forward voltage plus needed headroom voltage at required
current, and the PWM pin voltage is high, the output current is turned ON and well regulated. However, if the
voltage applied on the SUPPLY pin is lower than V(POR_falling), the output current is turned OFF. With this feature,
the power supply voltage in designed pattern can control the output current ON and OFF. The brightness is
adjustable if the ON and OFF frequency is fast enough. Because of the high accuracy design of PWM threshold
in TPS92622-Q1, TI recommends a resistor divider on the PWM pin to set the SUPPLY threshold higher than
LED forward voltage plus required headroom voltage as shown in 图 7-2. The headroom voltage is basically the
summation of V(DROPOUT) and V(CS_REG). When the voltage on the PWM pin is higher than VIH(PWM), the output
current is turned ON. However, when the voltage on the PWM is lower than VIL(PWM), the output current is turned
OFF. Use 方程式2 to calculate the SUPPLY threshold voltage.
4.5 V to 40 V
TPS92622-Q1
R(RES1)
SUPPLY
RES1
R(SNS1)
R(SNS2)
IN1
OUT1
RES2
C(SUPPLY)
R(RES2)
IN2
R(UPPER)
DIAGEN
OUT2
GND
PWM1
PWM2
R(LOWER)
FAULT
*: 10 nF ceramic capacitor is recommended for each OUT
图7-2. Application Schematic for Supply Control LED Brightness
≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _PWM_ th _rising)
IH(PWM)
R(LOWER)
(2)
where
• VIH(PWM) = 1.26 V (maximum)
7.3.7 Diagnostics
The TPS92623-Q1 device provides advanced diagnostics and fault-protection features for automotive exterior
lighting systems. The device can detect and protect fault from LED-string short-to-GND, LED-string open-circuit
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and junction overtemperature scenarios. The device also supports a one-fails–all-fail fault bus design that can
flexibly fit different regulatory requirements.
7.3.7.1 LED Short-to-GND Detection
The TPS92622-Q1 device has LED short-to-GND detection. The LED short-to-GND detection monitors the
output voltage when the output current is enabled. After a short-to-GND LED failure is detected, the device turns
off the faulty channel and retries automatically, regardless of the state of the PWM input. If the retry mechanism
detects the removal of the LED short-to-GND fault, the device resumes to normal operation.
The TPS92622-Q1 monitors both V(OUTx) voltage and V(RESx) voltage of each channel and compares it with the
internal reference voltage to detect a short-to-GND failure. If V(OUTx) or V(RESx) voltage falls below V(SG_th_falling)
longer than the deglitch time of t(SG_deg), the device asserts the short-to-GND fault and pulls low the FAULT pin.
During the deglitching time period, if V(OUTx) and V(RESx) rises above V(SG_th_rising), the timer is reset.
After the TPS92622-Q1 has asserted a short-to-GND fault, the device turns off the faulty output channel and
retries automatically with a small current. During retrying, the device sources a small current I(Retry) from
SUPPLY to OUT and RES to pull up the LED loads continuously. After auto-retry detects output voltage rising
above V(SG_th_rising), it clears the short-to-GND fault and resumes to normal operation. 图 7-3 illustrates the
timing for LED short-circuit detection, protection, retry and recovery.
SUPPLY
PWMx
Short
Removed
LED
Short
Short
Removed
VOUTx
IOUTx
LED
Short
tt7t
tt7t
tt7t
I(retry)
tt8t
tt8t
tt9t
FAULT
No external
pullup
图7-3. LED Short-to-GND Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图 7-3 is described in TIMING section of the Electrical
Characteristics.
7.3.7.2 LED Open-Circuit Detection
The TPS92622-Q1 device has LED open-circuit detection. The LED open-circuit detection monitors the output
voltage when the current output is enabled. The LED open-circuit detection is only enabled when DIAGEN is
HIGH. A short-to-battery fault is also detected and recognized as an LED open-circuit fault.
The TPS92622-Q1 monitors dropout-voltage differences between the IN and OUT pins for each LED channel
when PWM is HIGH. The voltage difference V(INx) – V(OUTx) is compared with the internal reference voltage
V(OPEN_th_rising) to detect an LED open-circuit incident. If V(OUTx) rises and causes V(INx) – V(OUTx) less than the
V(OPEN_th_rising) voltage longer than the deglitch time of t(OPEN_deg), the device asserts an open-circuit fault. After
a LED open-circuit failure is detected, the internal constant-current sink pulls down the FAULT pin voltage.
During the deglitch time period, if V(OUTx) falls and makes V(INx) – V(OUTx) larger than V(OPEN_th_falling), the
deglitch timer is reset.
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The TPS92622-Q1 shuts down the output current regulation for the error channel after LED open-circuit fault is
detected. The device sources a small current I(Retry) from SUPPLY to OUT and RES when DIAGEN input is logic
High. After the fault condition is removed, the device resumes normal operation and releases the FAULT pin. 图
7-4 illustrates the timing for LED open-circuit detection, protection, retry and recovery.
SUPPLY
PWMx
Open
Removed
LED
Open
Open
Removed
VOUTx
IOUTx
LED
Open
tt6t
tt6t
tt6t
I(retry)
tt8t
tt8t
tt9t
FAULT
No external
pullup
图7-4. LED Open-Circuit Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图 7-4 is described in TIMING section of the Electrical
Characteristics.
7.3.7.3 LED Open-Circuit Detection Enable (DIAGEN)
The TPS92622-Q1 device supports the DIAGEN pin with an accurate threshold to disable the LED open-circuit.
The DIAGEN pin can be used to enable or disable LED open-circuit detection based on SUPPLY pin voltage
sensed by an external resistor divider as illustrated in 图 7-5. When the voltage applied on DIAGEN pin is higher
than the threshold VIH(DIAGEN), the device enables LED open-circuit detection. When V(DIAGEN) is lower than the
threshold VIL(DIAGEN), the device disables LED open-circuit detection.
Only LED open-circuit detection can be disabled by pulling down the DIAGEN pin. The LED short-to-GND
detection and overtemperature protection cannot be turned off by pulling down the DIAGEN pin. Use 方程式 3 to
calculate the SUPPLY threshold voltage.
4.5 V to 40 V
TPS92622-Q1
R(RES1)
SUPPLY
RES1
R(SNS1)
R(SNS2)
IN1
OUT1
RES2
C(SUPPLY)
R(RES2)
IN2
R(UPPER)
DIAGEN
OUT2
GND
PWM1
PWM2
R(LOWER)
FAULT
*: 10 nF ceramic capacitor is recommended for each OUT
图7-5. Application Schematic For DIAGEN
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≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _DIAGEN_ th _ falling)
IL(DIAGEN)
R(LOWER)
(3)
where
• VIL(DIAGEN) = 1.045 V (minimum)
7.3.7.4 Overtemperature Protection
The TPS92622-Q1 device monitors device junction temperature. When the junction temperature reaches
thermal shutdown threshold T(TSD), the output shuts down. After the junction temperature falls below T(TSD)
–
T(TSD_HYS), the device recovers to normal operation. During overtemperature protection, the FAULT pin is pulled
low.
7.3.7.5 Low Dropout Operation
When the supply voltage drops below LED string total forward voltage plus headroom voltage at required
current, the TPS92622-Q1 device operates in low-dropout conditions to deliver current output as close as
possible to target value. The actual current output is less than preset value due to insufficient headroom voltage
for power transistor. As a result, the voltage across the sense resistor fails to reach the regulation target. The
headroom voltage is the summation of V(DROPOUT) and V(CS_REG)
.
If the TPS92622-Q1 is designed to operate in low-dropout condition, the open-circuit diagnostics must be
disabled by pulling the DIAGEN pin voltage lower than VIL(DIAGEN). Otherwise, the TPS92622-Q1 detects an
open-circuit fault and reports a fault on the FAULT pin. The DIAGEN pin is used to avoid false diagnostics due to
low supply voltage.
7.3.8 FAULT Bus Output With One-Fails-All-Fail
During normal operation, The FAULT pin of TPS92622-Q1 is weakly pulled up by an internal pullup current
source, I(FAULT_pullup). If any fault scenario occurs, the FAULT pin is strongly pulled low by the internal pulldown
current sink, I(FAULT_pulldown) to report out the fault alarm.
Meanwhile, the TPS92622-Q1 also monitors the FAULT pin voltage internally. If the FAULT pin of the TPS92622-
Q1 is pulled low by external current sink below VIL(FAULT), the current output is turned off even though there is no
fault detected on owned outputs. The device does not resume to normal operation until the FAULT pin voltage
rises above VIH(FAULT)
.
Based on this feature, the TPS92622-Q1 device is able to construct a FAULT bus by tying FAULT pins from
multiple TPS92622-Q1 devices to achieve one-fails-all-fail function as 图 7-6 showing. The lower side
TPS92622-Q1 (B) detects any kind of LED fault and pulls low the FAULT pin. The low voltage on FAULT pin is
detected by upper side TPS92622-Q1 (A) because the FAULT pins are connected of two devices. The upper
side TPS92622-Q1 (A) turns off all output current for each channel as a result. If the FAULT pins of each
TPS92622-Q1 are all connected to drive the base of an external PNP transistor as illustrated in 图 7-7, the one-
fails–all-fail function is disabled and only the faulty channel device is turned off.
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TPS92622-Q1
A
TPS92622-Q1
VCC
VCC
VSUPPLY
10 kΩ
VSUPPLY
A
20 k
20 kΩ
FAULT
FAULT
10 kΩ
Logic
Logic
10 kΩ
TPS92622-Q1
VCC
TPS92622-Q1
B
VCC
B
FAULT
FAULT
Logic
Logic
图7-7. FAULT Bus for One-Fails-Others-On
图7-6. FAULT Bus for One-Fails-All-Fail
Application
Application
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7.3.9 FAULT Table
表7-1. Fault Table With DIAGEN = HIGH (Full Function)
FAULT BUS
STATUS
DETECTION CONTROL DEGLITCH
MECHANISM INPUT TIME
FAULT HANDLING
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
ROUTINE
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
Constant-
current
pulldown
Open circuit or
short-to-supply
V
(IN) –V(OUT) <
PWMx = H t(OPEN_deg)
Auto recovery
V(OPEN_th_rising)
V(OUT)
V(SG_th_falling)
OR
V(RES)
V(SG_th_falling)
<
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
FAULT = H
Constant-
current
pulldown
Short-to-ground
PWMx = H t(SG_deg)
Auto recovery
Auto recovery
<
Constant-
current
pulldown
Device turns all output
channels off.
Overtemperature TJ > T(TSD)
t(TSD_deg)
Device turns all remained channels off and keeps retry on the failed channels. After the Fault pin is
released, all channels are turned on after t(FAULT_recovery) time.
Fault is detected
FAULT = L
No fault is
detected
Device turns all output channels off.
表7-2. Fault Table With DIAGEN = LOW (Full Function)
FAULT BUS
STATUS
DETECTION CURRENT DEGLITCH
MECHANISM OUTPUT TIME
FAULT HANDLING
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
ROUTINE
Open circuit or
short-to-supply
Ignored
V(OUT)
V(SG_th_falling)
OR
V(OUT)
V(SG_th_falling)
<
Device turns output off
and retries with constant
current I(retry), ignoring
the PWM input.
Constant-
current
pulldown
Short-to-ground
PWMx = H t(SG_deg)
Auto recovery
Auto recovery
FAULT = H
<
Constant-
current
pulldown
Device turns all output
channels off.
Overtemperature TJ > T(TSD)
t(TSD_deg)
Device turns all remained channels off and keeps retry on the failed channels. After the Fault pin is
released, all channels are turned on after t(FAULT_recovery) time.
Fault is detected
FAULT = L
No fault is
detected
Device turns all output channels off.
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7.3.10 LED Fault Summary
表7-3. LED Connection Fault Summary
Case 1
Case 2
Case 3
Case 4
LED Short-to-GND Fault
LED Short-to-GND Fault
LED Short-to-GND Fault
LED Short-to-GND Fault
Case 5
Case 6
Case 7
Case 8
LED Open Fault
No Fault
LED Open Fault
LED Open Fault
Case 9
Case 10
Case 11
Case 12
No Fault
No Fault
LED Open Fault
No Fault
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7.3.11 IO Pins Inner Connection
SUPPLY
SUPPLY
PWMx
DIAGEN
GND
GND
图7-8. PWMx Pins
图7-9. DIAGEN Pin
SUPPLY
INx
FAULT
OUTx
GND
GND
图7-10. FAULT Pin
图7-11. OUTx Pins
INx
SUPPLY
RESx
INx
GND
OUTx
图7-12. RESx Pins
图7-13. INx Pins
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7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
When the device is in undervoltage lockout status, the TPS92622-Q1 device disables all functions until the
supply rises above the V(POR_rising) threshold.
7.4.2 Normal Operation V(SUPPLY) ≥4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device can drive the output in constant-current mode.
7.4.3 Low-Voltage Dropout Operation
When the device drives an LED string in low-dropout operation, if the V(DROPOUT) is less than the open-circuit
detection threshold, the device can report a false open-circuit fault. TI recommends only enabling the open-
circuit detection when the voltage across the IN and OUTx is higher than the maximum voltage of LED open
rising threshold to avoid a false open-circuit detection.
7.4.4 Fault Mode
When the TPS92622-Q1 detects a fault, the device tries to pull down the FAULT pin with a constant current. If
the FAULT bus is pulled down, the device switches to fault mode and consumes a fault current of I(FAULT)
.
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
In automotive lighting applications, thermal performance and LED diagnostics are always design challenges for
linear LED drivers.
The TPS92622-Q1 device is capable of detecting LED open-circuit and LED short-circuits. To increase current
driving capability, the TPS92622-Q1 device supports using an external shunt resistor to help dissipate heat as
the following section, Thermal Sharing Resistor (OUTx and RESx), describes. This method provides a low-cost
solution of using external resistors to minimize thermal accumulation on the device itself due to large voltage
difference between input voltage and LED string forward voltage, while still keeping high accuracy of the total
current output.
8.2 Typical Applications
8.2.1 BCM Controlled Rear Lamp With One-Fails-All-Fail Setup
The multiple TPS92622-Q1 devices are capable of driving different functions for automotive rear lamp including
stop, turn indicator, tail, fog, reverse and center-high-mounted-stop-lamp. The one-fails-all-fail single lamp mode
can be easily achieved by FAULT bus by shorting the FAULT pins.
BCM_STOP
TPS92622-Q1
10 nF
R(RES1)
C(SUPPLY)
SUPPLY
RES1
R(SNS1)
R(SNS2)
IN1
OUT1
RES2
OUT2
GND
10 nF
R(RES2)
IN2
DIAGEN
V(SUPPLY)
20 k
R1
R2
PWM1
PWM2
FAULT
R3
R4
图8-1. Typical Application Schematic
8.2.1.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 6 strings with 3 LEDs in each string are required to achieve
stop function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, while the minimum forward
voltage, VF_MIN is 1.9 V. The current requirement for each LED, I(LED) is 130 mA. The LED brightness and ON
and OFF control is manipulated by body control module (BCM) directly by connecting and disconnecting the
power supply to the LED load.
8.2.1.2 Detailed Design Procedure
Step 1: Use 方程式4 to determine the current sensing resistor, R(SNSx)
.
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V
(CS _REG)
R(SNSx)
=
I(OUTx _ Tot)
(4)
where
• V(CS_REG) = 150 mV (typical)
• I(OUTx_Tot) = 130 mA
According to design requirements, output current for each channel is same so that the R(SNS1) = R(SNS2) = 1.15
Ω. Two resistors in parallel can be used to achieve equivalent resistance when sense resistor is not a standard
decade resistance value.
Step 2: Design the current distribution between I(OUTx) and I(RESx), and use 方程式 5 to calculate the current
sharing resistor, R(RESx). The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path. TI recommends the current sharing resistor R(RESx) to consume 50% of the total current at typical supply
operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(5)
where
• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 130 mA
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) is 85.4 Ω when V(OUTx) is typical 3 ×
2.15 V = 6.45 V.
Step 3: Design the threshold voltage of SUPPLY to enable the LED open-circuit diagnostics, and calculate
voltage divider resistor value for R1 and R2 on DIAGEN pin.
The maximum forward voltage of LED-string is 3 × 2.5 V = 7.5 V. To avoid the open-circuit fault reported in low-
dropout operation conditions, additional headroom between SUPPLY and OUTx must be considered. The
TPS92622-Q1 device must disable open-circuit detection when the supply voltage is below LED-string maximum
forward voltage plus V(OPEN_th_rising) and V(CS_REG). Use 方程式6 to calculate the voltage divider resistor, R1 and
R2 value.
≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(6)
where
• V(OPEN_th_rising) = 420 mV (maximum)
• V(CS_REG) = 156 mV
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
The calculated result for R1 is 67.3 kΩwhen V(OUTx) maximum voltage is 7.5 V and V(CS_REG) is 156 mV.
Step 4: Design the threshold voltage of SUPPLY to turn on and off each channel of LED, and calculate voltage
divider resistor value for R3 and R4 on PWM input pin.
The minimum forward voltage of LED string is 3 × 1.9 V = 5.7 V. To make sure the current output on each of
LED-string is normal, each LED-string must be turned off when SUPPLY voltage is lower than LED minimum
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required forward voltage plus dropout voltage between INx to OUTx and V(CS_REG). Use 方程式7 to calculate the
voltage divider resistor, R3 and R4 value.
≈
’
÷
◊
V
+ V
+ V
(DROPOUT)
(CS _REG) (OUTx)
R =
-1 ìR
∆
∆
«
÷
3
4
V
IH(PWM)
(7)
where
• V(DROPOUT) = 300 mV (typical)
• V(CS_REG) = 156 mV (maximum)
• VIH(PWM) = 1.26 V (maximum)
• R4 = 10 kΩ(recommended)
The calculated result for R3 is 38.9 kΩwhen V(OUTx) minimum voltage is 5.7 V and V(CS_REG) is 156 mV.
8.2.1.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
图8-3. 200-Hz Supply Dimming 80% Brightness
图8-2. 200-Hz Supply Dimming 20% Brightness
8.2.2 Independent PWM Controlled Rear Lamp By MCU
The TPS92622-Q1 device can drive the each current output channel independently by PWM input at PWM1,
PWM2 and PWM3 pins. The PWM input signals comes from MCU to achieve sequential turn indicator feature.
BCM_TURN
TPS92622-Q1
10 nF
R(RES1)
C(SUPPLY)
SUPPLY
RES1
R(SNS1)
R(SNS2)
IN1
OUT1
RES2
OUT2
GND
10 nF
R(RES2)
IN2
R1
R2
DIAGEN
VCC
20 k
PWM1
PWM2
FAULT
GPIO
GPIO
GPIO
MCU
图8-4. Typical Application Schematic
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8.2.2.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 2 strings with 2 LEDs in each string are required to achieve
turn indicator function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, however the minimum
forward voltage, VF_MIN is 1.9 V. Each LED current is 130 mA and each output channel is independent controlled
by MCU through individual GPIO.
8.2.2.2 Detailed Design Procedure
Step 1: Use 方程式8 to determine the current sensing resistor, R(SNSx)
.
V
(CS _REG)
R(SNSx)
=
I(OUTx _ Tot)
(8)
where
• V(CS_REG) = 150 mV (typical)
• I(OUTx_Tot) = 130 mA
According to design requirements, output current for each channel is same so that the calculated R(SNS1)
=
R(SNS2) = 1.15 Ω.
Step 2: Design the current distribution between I(OUTx) and I(RESx), and use 方程式 9 to calculate the current
sharing resistor, R(RESx). The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path, basic principle is to design the R(RESx) to consume appropriate 50% total power dissipation at typical
supply operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(9)
where
• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 130 mA (maximum)
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) is 117 Ωwhen V(OUTx) is typical 2 × 2.2
V = 4.4 V.
Step 3: Design the threshold voltage of SUPPLY to enable the LED open circuit, and calculate voltage divider
resistor value for R1 and R2 on the DIAGEN pin.
The maximum forward voltage of LED-string is 2 × 2.5 V = 5 V. To avoid the open-circuit fault reported in low-
dropout operation conditions, additional headroom between SUPPLY and OUTx must be considered. The
TPS92622-Q1 device must disable open-circuit detection when the supply voltage is below LED-string maximum
forward voltage plus V(OPEN_th_rising) and V(CS_REG). Use 方程式 10 to calculate the voltage divider resistor, R1
and R2 value.
≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(10)
where
• V(OPEN_th_rising) = 420 mV (maximum)
• V(CS_REG) = 156 mV (maximum)
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
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The calculated result for R1 is 43.4 kΩwhen V(OUTx) maximum voltage is 5 V and V(CS_REG) is 156 mV.
8.2.2.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
图8-5. 200-Hz PWM Dimming at 80% Duty Cycle
图8-6. 600-Hz PWM Dimming at 20% Duty Cycle
8.3 Power Supply Recommendations
The TPS92622-Q1 is designed to operate from an automobile electrical power system within the range specified
in Power Supply. The V(SUPPLY) input must be protected from reverse voltage and voltage dump condition over
40 V. The impedance of the input supply rail must be low enough that the input current transient does not cause
drop below LED string required forward voltage. If the input supply is connected with long wires, additional bulk
capacitance can be required in addition to normal input capacitor.
8.4 Layout
8.4.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92622-Q1 layout.
• TI recommends large thermal dissipation area in both top and bottom layers of PCB. The copper pouring
area in same layer with TPS92622-Q1-Q1 footprint must directly cover the thermal pad land of the device
with wide connection as much as possible. The copper pouring in opposite PCB layer or inner layers must be
connected to thermal pad directly through multiple thermal vias.
• TI recommends to place R(RESx) resistors away from the TPS92622-Q1 device with more than 20-mm
distance, because R(RESx) resistors are dissipating some amount of the power as well as the TPS92622-Q1.
Place two heat source components apart to reduce the thermal accumulation concentrated at small PCB
area. The large copper pouring area is also required surrounding the R(RESx) resistors for helping thermal
dissipating.
The noise immunity is the secondary consideration for TPS92622-Q1 layout.
• TI recommends to place the noise decoupling capacitors for SUPPLY pin as close as possible to the pins.
• TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track
to SUPPLY pin.
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8.4.2 Layout Example
GND
R(RES1)
LED String1
C(SUPPLY)
GND
SUPPLY
IN1
RES1
OUT1
R(RNS1)
R(RNS2)
IN2
RES2
OUT2
GND
R(RES2)
LED String2
DIAGEN
PWM1
PWM2
DIAGEN
PWM1
PWM2
FAULT
GND
图8-7. TPS92622-Q1 Example Layout Diagram
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9 Device and Documentation Support
9.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
9.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
9.3 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
9.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
9.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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10 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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4-Jan-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92622QDRRRQ1
ACTIVE
WSON
DRR
12
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
92622Q
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
DRR0012C
WSON - 0.8 mm max height
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE - NO LEAD
3.1
2.9
A
B
PIN 1 INDEX AREA
3.1
2.9
C
0.8 MAX
SEATING PLANE
0.08
0.05
0.00
EXPOSED
THERMAL PAD
1.5±0.1
(0.1) TYP
10X 0.5
6
7
2X
13
SYMM
2.5±0.1
2.5
1
12
0.3
12X
SYMM
PIN 1 ID
(OPTIONAL)
0.2
0.1
0.05
C A B
0.5
0.3
12X
4222932/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
DRR0012C
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.5)
12X (0.6)
(R0.05) TYP
12
SYMM
1
12X (0.25)
13
SYMM
(2.5)
(1)
10X (0.5)
6
7
(0.5)
(
0.2) VIA
TYP
(2.8)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222932/A 05/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
DRR0012C
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
12X (0.6)
2X (1.38)
1
12
12X (0.25)
2X (1.11)
SYMM
(0.66)
10X (0.5)
7
6
SYMM
(2.8)
13
METAL
TYP
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 13
81.7% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4222932/A 05/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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