TPS92613-Q1 [TI]
具有 600mA 输出、开路和短路检测功能的汽车类单通道 LED 驱动器;型号: | TPS92613-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有 600mA 输出、开路和短路检测功能的汽车类单通道 LED 驱动器 驱动 驱动器 |
文件: | 总31页 (文件大小:2439K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
TPS92613-Q1 汽车单通道 LED 驱动器
1 特性
2 应用
1
•
符合面向汽车 应用的 AEC-Q100 标准:
温度等级 1:–40°C 至 +125°C,TA
提供功能安全
可帮助创建功能安全系统设计的文档
•
•
车内照明:顶灯、阅读灯
车外照明 - 小灯:车门把手、盲点检测指示灯、充
电口
–
•
•
•
车外照明 - 后灯:尾灯、中央高位刹车灯、侧标志
灯
–
•
•
•
宽输入电压范围:4.5V 至 40V
低静态电流和低故障模式电流:典型值 200µA
单路高精度电流调节:
通用 LED 驱动器 应用
3 说明
–
–
–
–
在整个结温范围内精度为 ±4.6%
可通过外部感应电阻器调节的恒定电流
高达 600mA 的最大电流
随着 LED 在汽车 应用中广泛使用,简单的 LED 驱动
器越来越受欢迎。与分立式解决方案相比,低成本单片
解决方案可降低系统级组件数量,并显著提高电流精度
和可靠性。
通过输入 PWM 占空比进行亮度控制
•
•
与外部电阻器实现热共享
TPS92613-Q1 器件是一款单通道、高侧 LED 驱动
器,由汽车电池供电。这是一种简单而巧妙的解决方
案,能够为单个 LED 灯串提供恒定电流,并具有全面
的 LED 诊断功能。“连带失效”功能可与其他 LED 驱动
器(如 TPS9261x-Q1、TPS9263x-Q1 和 TPS92830-
Q1 器件)一起工作,从而满足不同的要求。
低压降电压(包含感应电阻器压降):
–
–
–
–
最大压降:10mA 时为 150mV
最大压降:70mA 时为 400mV
最大压降:150mA 时为 700mV
最大压降:300mA 时为 1.3V
•
•
诊断和保护:
器件信息(1)
–
–
–
具有自动恢复功能的 LED 开路与短路检测
在低压降运行情况下支持诊断并具有可调阈值
器件型号
封装
封装尺寸(标称值)
多达 15 个器件的故障总线,可配置为“连带失
效”或“仅关闭失效的通道”(N-1)
TPS92613-Q1
TO-263 (7)
10.16mm × 9.85mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
–
热关断
工作结温范围:–40°C 至 +150°C
典型应用图
4.5 V to 40 V
TPS92613 œ Q1
C(SUPPLY)
SUPPLY
R(SNS)
DIAGEN
PWM
DIAGEN
PWM
IN
OUT
FAULT
FAULT
GND
C(OUT)
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSEC4
TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 15
Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Applications ................................................ 16
Power Supply Recommendations...................... 23
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Timing Requirements................................................ 5
6.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
8
9
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Example .................................................... 23
11 器件和文档支持 ..................................................... 24
11.1 文档支持 ............................................................... 24
11.2 接收文档更新通知 ................................................. 24
11.3 支持资源................................................................ 24
11.4 商标....................................................................... 24
11.5 静电放电警告......................................................... 24
11.6 Glossary................................................................ 24
12 机械、封装和可订购信息....................................... 24
7
4 修订历史记录
Changes from Revision A (December 2019) to Revision B
Page
•
向特性 部分添加了提供功能安全的链接.................................................................................................................................. 1
Changes from Original (April 2019) to Revision A
Page
•
将数据表状态从“预告信息”更改为“生产数据” ......................................................................................................................... 1
2
Copyright © 2019–2020, Texas Instruments Incorporated
TPS92613-Q1
www.ti.com.cn
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
5 Pin Configuration and Functions
NDR Package
7-Pin TO-263 With Exposed Thermal Pad
Top View
Thermal
Pad
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
Enable pin for LED open-circuit detection to avoid false open diagnostics during low-
dropout operation
1
DIAGEN
I
2
PWM
FAULT
GND
I
I/O
—
O
I
PWM input for current output ON/OFF control
Fault output, support one-fails–all-fail fault bus
Ground
3
4
5
OUT
Constant-current output, connect to anode of the top LED in LED-string
Current input
6
IN
7
SUPPLY
I
Device supply voltage
—
Thermal pad
—
Thermal pad, connect to ground
Copyright © 2019–2020, Texas Instruments Incorporated
3
TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–40
MAX
45
UNIT
V
High-voltage input
High-voltage output
Fault bus
DIAGEN, IN, PWM, SUPPLY
OUT
45
V
FAULT
22
V
IN to OUT
V(IN) – V(OUT)
V(SUPPLY) – V(IN)
45
V
SUPPLY to IN
1
V
Operating junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–40
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Device HBM ESD Classification Level H2
All pins
±2000
V(ESD)
Electrostatic discharge
V
All pins
±500
±750
Charged-device model (CDM), per AEC Q100-011
Device CDM ESD Classification Level C3B
Corner pins (1 and 7)
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
4.5
4.4
0
NOM
MAX
40
UNIT
V
SUPPLY
IN
Device supply voltage
Sense voltage
PWM inputs
40
V
PWM
40
V
DIAGEN
OUT
Diagnostics enable pin
Driver output
0
40
V
0
40
V
FAULT
Fault bus
0
7
V
Operating ambient temperature, TA
–40
125
°C
6.4 Thermal Information
TPS92613-Q1
THERMAL METRIC(1)
NDR (TO-263)
UNIT
7 PINS
28.4
23.1
10.1
4.2
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
9.9
RθJC(bot)
3.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
V(SUPPLY) = 5 V to 40 V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
BIAS
V(POR_rising)
Supply voltage POR rising threshold
3.2
4
V
4
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TPS92613-Q1
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ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
Electrical Characteristics (continued)
V(SUPPLY) = 5 V to 40 V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
2.2
0.1
0.1
TYP
3
MAX UNIT
V(POR_falling)
I(Quiescent)
I(FAULT)
Supply voltage POR falling threshold
Device standby current
V
PWM = HIGH
0.2
0.2
0.25
0.25
mA
mA
Device current in fault mode
PWM = HIGH, FAULT externally pulled LOW
LOGIC INPUTS (DIAGEN, PWM)
VIL(DIAGEN)
VIH(DIAGEN)
VIL(PWM)
Input logic-low voltage, DIAGEN
1.045
1.16
1.1
1.2
1.1
1.2
1.155
1.24
V
V
V
V
Input logic-high voltage, DIAGEN
Input logic-low voltage, PWM
Input logic-high voltage, PWM
1.045
1.16
1.155
1.24
VIH(PWM)
CONSTANT-CURRENT DRIVER
I(OUT)
Device output-current range
100% duty cycle
4
94
600
102
mA
mV
Ω
TA = 25°C, V(SUPPLY) = 4.5 V to 18 V
TA = –40°C to +125°C, V(SUPPLY) = 4.5 V to 18 V
98
98
V(CS_REG)
R(CS_REG)
Sense-resistor regulation voltage
Sense-resistor range
93.5
0.16
102.5
50
V(CS_REG) voltage included, current setting of 10 mA
V(CS_REG) voltage included, current setting of 70 mA
120
250
150
400
V(CS_REG) voltage included, current setting of 150
mA
V(DROPOUT)
Voltage dropout from SUPPLY to OUT
mV
430
800
700
V(CS_REG) voltage included, current setting of 300
mA
1300
DIAGNOSTICS
V(OPEN_th_rising)
V(OPEN_th_falling)
LED open rising threshold, V(IN) – V(OUT)
LED open falling threshold, V(IN) – V(OUT)
235
70
290
100
335
135
mV
mV
Channel output V(OUT) short-to-ground
rising threshold
V(SG_th_rising)
V(SG_th_falling)
I(Retry)
1.14
0.82
0.64
1.2
0.865
1.08
1.26
0.91
V
V
Channel output V(OUT) short-to-ground
falling threshold
Channel output V(OUT) short-to-ground
retry current
1.528
mA
FAULT
VIL(FAULT)
Logic input low threshold
0.7
V
V
VIH(FAULT)
Logic input high threshold
Logic output low threshold
Logic output high threshold
FAULT internal pulldown current
FAULT internal pullup current
2
VOL(FAULT)
VOH(FAULT)
I(FAULT_pulldown)
I(FAULT_pullup)
With 500-µA external pullup
0.4
7
V
With 1-µA external pulldown, V(SUPPLY) = 12 V
5
500
5
V
750
8
1000
12
µA
µA
THERMAL PROTECTION
Thermal shutdown junction temperature
threshold
T(TSD)
157
172
15
187
°C
°C
Thermal shutdown junction temperature
hysteresis
T(TSD_HYS)
6.6 Timing Requirements
MIN NOM MAX UNIT
PWM rising edge delay, 50% PWM voltage to 10% of output current closed loop, t2 - t1 as shown
in Figure 1
t(PWM_delay_rising)
t(PWM_delay_falling)
t(DEVICE_STARTUP)
10
15
17
21
25
30
µs
µs
µs
PWM falling edge delay, 50% PWM voltage to 90% of output current open loop, t5 - t4 as shown
in Figure 1
SUPPLY rising edge to 10% output current at 200-mA set current and 14 V, t8 - t7 as shown
in Figure 1
100
150
t(OPEN_deg)
t(SG_deg)
t(TSD_deg)
t(Recover_deg)
LED-open fault-deglitch time
80
80
125
125
50
175
175
µs
µs
µs
µs
Output short-to-ground detection deglitch time
Thermal over temperature deglitch timer
Fault recovery deglitch timer
8.5
16
25
Copyright © 2019–2020, Texas Instruments Incorporated
5
TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
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SUPPLY
Input duty-cycle
PWM
90%
90%
IOUT
Output duty-cycle
10%
t1
10%
t6
10%
t8
t7
t2
t3
t4
t5
图 1. Output Timing Diagram
6
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TPS92613-Q1
www.ti.com.cn
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
6.7 Typical Characteristics
500
450
400
350
300
250
200
150
100
50
500
450
400
350
300
250
200
150
100
50
I(OUT) setting = 300 mA
I(OUT) setting = 150 mA
I(OUT) setting = 300 mA
I(OUT) setting = 150 mA
0
0
8
0
0
12
16
Supply Voltage (V)
20
24
-40
-20
0
20
40
60
80
100 120 140
Temperature (oC)
D001
D002
图 2. Output Current vs Supply Voltage
图 3. Output Current vs Temperature
500
450
400
350
300
250
200
150
100
50
250
200
150
100
50
I(OUT) setting = 300 mA
I(OUT) setting = 200 mA
I(OUT) setting = 150 mA
I(OUT) setting = 150 mA -40oC
I(OUT) setting = 150 mA 25oC
I(OUT) setting = 150 mA 125oC
0
0
0.5
1 1.5
Dropout Voltage (V)
2
2.5
0
0.5
1 1.5
Dropout Voltage (V)
2
2.5
D003
D004
图 4. Output Current vs Dropout Voltage
图 5. Output Current vs Dropout Voltage
500
450
400
350
300
250
200
150
100
50
100%
I(OUT) setting = 300 mA -40oC
I(OUT) setting = 300 mA 25oC
I(OUT) setting = 300 mA 125oC
10%
1%
0.5%
0
1%
10%
PWM Duty Cycle (%)
100%
0.5
1 1.5
Dropout Voltage (V)
2
2.5
D006
D005
图 7. PWM Output Duty Cycle vs Input Duty Cycle
图 6. Output Current vs Dropout Voltage
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7
TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
www.ti.com.cn
Typical Characteristics (接下页)
Ch. 1 = V(SUPPLY)
ƒ(PWM) = 200 Hz
Ch. 3 = V(PWM)
Ch. 4 = I(OUT)
Ch. 1 = V(SUPPLY)
ƒ(PWM) = 2 kHz
Ch. 3 = V(PWM)
Ch. 4 = I(OUT)
Duty cycle = 50%
Duty cycle = 50%
图 8. PWM Dimming at 200 Hz
图 9. PWM Dimming at 2 kHz
Ch. 1 = V(SUPPLY)
Ch. 4 = I(OUT)
Ch. 2 = FAULT
Ch. 3 = V(OUT)
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
f(PWM) = 1000 Hz
Duty cycle = 30%
FAULT floating
SUPPLY dimming between 2.5 V and 12 V
图 10. Supply Dimming at 1 kHz
图 11. Transient Undervoltage
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 12. Transient Overvoltage
图 13. Jump Start
8
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www.ti.com.cn
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
Typical Characteristics (接下页)
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 14. Superimposed Alternating Voltage, 15 Hz
图 15. Superimposed Alternating Voltage, 1 kHz
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
Ch. 1 = SUPPLY
Ch. 4 = I(OUT)
Ch. 2 = V(OUT)
Ch. 3 = FAULT
图 17. Slow Decrease and Slow Increase of Supply Voltage
图 16. Slow Decrease and Quick Increase of Supply Voltage
Ch. 1 = V(OUT)
Ch. 2 = FAULT
Ch. 4 = I(OUT)
Ch. 1 = V(OUT)
Ch. 2 = FAULT
Ch. 4 = I(OUT)
图 18. LED Open-Circuit Protection and Recovery
图 19. LED Short-Circuit Protection and Recovery
版权 © 2019–2020, Texas Instruments Incorporated
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TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
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7 Detailed Description
7.1 Overview
The TPS92613-Q1 is one device of single-channel linear LED driver family including TPS92610-Q1, TPS92611-
Q1 and TPS92612-Q1. The family provides a simple solution for automotive LED applications. Different package
options in the family provide variable current ranges and diagnostic options. The TPS92613-Q1 device in a TO-
263 package supports both LED open-circuit detection and short-to-ground detection. The TPS92613-Q1 can be
used with other TPS9261x-Q1, TPS9263x-Q1 and TPS92830-Q1 family devices together to realize one-fails-all-
fail protection by tying all FAULT pins together as a fault bus.
The current output at OUT pin can be set by an external R(SNS) resistor. Current flows from the supply through
the R(SNS) resistor into the integrated current regulation circuit and to the LEDs through OUT pin.
7.2 Functional Block Diagram
4.5 œ 40V
TPS92613-Q1
R(SNS)
IN
SUPPLY
DIAGEN
Supply
and
Control
PWM
Output Driver
OUT
FAULT
LED Diagnostics
GND
7.3 Feature Description
7.3.1 Power Supply
7.3.1.1 Power-On Reset (POR)
The TPS92613-Q1 device has an internal power-on-reset (POR) function. When power is applied to the SUPPLY
pin, the internal POR circuit holds the device in reset state until V(SUPPLY) is above V(POR_rising)
.
7.3.1.2 Low-Quiescent-Current
The TPS92613-Q1 device consumes minimal quiescent current, less than 250 µA into SUPPLY when the FAULT
pin is externally pulled LOW. At the same time, the device shuts down the output driver.
If device detects an internal fault, it pulls down the FAULT pin by an internal typical 750-µA constant current as a
fault indication to the fault bus.
10
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Feature Description (接下页)
7.3.2 Constant-Current Driver
The TPS92613-Q1 device is a high-side current driver for driving LEDs. The device controls the output current
through regulating the voltage drop on an external high-side current-sense resistor, R(SNS). An integrated error
amplifier drives an internal power transistor to maintain the voltage drop on the current-sense resistor R(SNS) to
V(CS_REG) and therefore regulates the current output to target value. When the output current is in regulation, the
current value can be calculated by using 公式 1.
V
(CS _REG)
I(OUT)
=
R(SNS)
where
•
V(CS_REG) = 98 mV (typical)
(1)
When the supply voltage drops below total LED string forward voltage plus required dropout voltage, V(DROPOUT)
,
the TPS92613-Q1 is not able to deliver enough current output as set by the value of R(SNS), and the voltage
across the current-sense resistor R(SNS) is less than V(CS_REG)
.
7.3.3 PWM Control
The pulse width modulation (PWM) input of the TPS92613-Q1 functions as enable for the output current. When
the voltage applied on the PWM pin is higher than VIH(PWM), the output current is enabled. When the voltage
applied on PWM pin is lower than VIL(PWM), the output current is disabled as well as the diagnostic features.
Besides output current enable and disable function, the PWM input of TPS92613-Q1 also supports adjustment of
the average current output for brightness control if the frequency of applied PWM signal is higher than 100 Hz,
which is out of visible frequency range of human eyes. TI recommends a 200-Hz PWM signal with 1% to 100%
duty cycle input for brightness control. See to 图 20 for typical PWM dimming application.
4.5 œ 40V
TPS92613 œ Q1
C(SUPPLY)
SUPPLY
R(SNS)
DIAGEN
DIAGEN
PWM
IN
PWM
1%~100%@200Hz
OUT
FAULT
FAULT
GND
C(OUT)
图 20. Typical Application Schematic for PWM Dimming
7.3.4 Supply Control
The TPS92613-Q1 supports supply control to turn ON and OFF output current. When the voltage applied on the
SUPPLY pin is higher than the LED string forward voltage plus needed V(DROPOUT) at required current, and the
PWM pin voltage is high, the output current is turned ON and well regulated. However, if the voltage applied on
the SUPPLY pin is lower than V(POR_falling), the output current is turned OFF. With this feature, the power-supply
voltage in the designed pattern controls the output current ON/OFF. The brightness can be adjustable if the
ON/OFF frequency is fast enough. Because of the high accuracy design of PWM threshold in TPS92613-Q1, TI
recommends a resistor divider on the PWM pin to set the SUPPLY threshold higher than LED forward voltage
plus V(DROPOUT) as shown in 图 21. When the voltage on the PWM pin is higher than VIH(PWM), the output current
is turned ON. However, when the voltage on the PWM is lower than VIL(PWM), the output current is turned OFF.
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11
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Feature Description (接下页)
TPS92613 œ Q1
SUPPLY
C(SUPPLY)
R(SNS)
DIAGEN
PWM
DIAGEN
PWM
IN
OUT
FAULT
FAULT
GND
C(OUT)
图 21. Typical Application Schematic for SUPPLY Control
7.3.5 Diagnostics and Protection
The TPS92613-Q1 device provides advanced diagnostics and fault-protection features for automotive exterior
lighting systems. The device is able to detect and protect fault from LED-string short-to-GND, LED-string open-
circuit and junction overtemperature scenarios. It also supports a one-fails–all-fail fault bus design that can
flexibly fit different regulatory requirements.
7.3.5.1 Open-Circuit Detection
The TPS92613-Q1 device has LED open-circuit detection. The LED open-circuit detection monitors the output
voltage when the current output is enabled. The LED open-circuit detection is only enabled when DIAGEN is
HIGH. A short-to-battery fault is also detected and recognized as an LED open-circuit fault.
The TPS92613-Q1 monitors dropout-voltage differences between the IN and OUT pins when PWM is HIGH. The
voltage difference V(IN) – V(OUT) is compared with the internal reference voltage V(OPEN_th_falling) to detect an LED
open-circuit incident. If V(IN) – V(OUT) falls below the V(OPEN_th_falling) voltage longer than the deglitch time of
t(OPEN_deg), the device asserts an open-circuit fault. Once an LED open-circuit failure is detected, the internal
constant-current sink pulls down the FAULT pin voltage. During the deglitch time period, if V(IN) – V(OUT) rises
above V(OPEN_th_rising), the deglitch timer is reset.
The TPS92613-Q1 keeps the current output enabled to retry after LED open-circuit fault is detected if the PWM
input is HIGH; the device sources a small current I(retry) from IN to OUT when PWM input is LOW. In either
scenario, once the fault condition is removed, the device resumes normal operation and releases the FAULT pin.
7.3.5.2 Short-to-GND Detection
The TPS92613-Q1 device has LED short-to-GND detection. The LED short-to-GND detection monitors the
output voltage when the output current is enabled. Once a short-to-GND LED failure is detected, the device turns
off the output channel and retries automatically, regardless of the state of the PWM input. If the retry mechanism
detects the removal of the LED short-to-GND fault, the device resumes to normal operation.
The TPS92613-Q1 monitors the V(OUT) voltage and compares it with the internal reference voltage to detect a
short-to-GND failure. If V(OUT) falls below V(SG_th_falling) longer than the deglitch time of t(SG_deg), the device asserts
the short-to-GND fault and pulls low the FAULT pin. During the deglitching time period, if V(OUT) rises above
V(SG_th_rising), the timer is reset.
Once the TPS92613-Q1 has asserted a short-to-GND fault, the device turns off the output channel and retries
automatically with a small current. During retrying the device sources a small current I(retry) from IN to OUT to pull
up the LED loads continuously. Once auto-retry detects output voltage rising above V(SG_th_falling), it clears the
short-to-GND fault and resumes to normal operation.
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Feature Description (接下页)
7.3.5.3 Overtemperature Protection
The TPS92613-Q1 device monitors device junction temperature. When the junction temperature reaches thermal
shutdown threshold T(TSD), the output shuts down. Once the junction temperature falls below T(TSD) – T(TSD_HYS)
the device recovers to normal operation. During overtemperature protection, the FAULT pin is pulled low.
,
7.3.5.4 DIAGEN
The TPS92613-Q1 device supports the DIAGEN pin with an accurate threshold to disable the LED open-circuit
diagnostic functions. The DIAGEN pin can be used to enable or disable LED open-circuit protection based on
SUPPLY pin voltage sensed by an external resistor divider. When the voltage applied on DIAGEN pin is higher
than the threshold VIH(DIAGEN), the device enables LED open-circuit diagnosis. When V(DIAGEN) is lower than the
threshold VIL(DIAGEN), the device disables LED-open-circuit detection.
Only LED open-circuit detection can be disabled by pulling down the DIAGEN pin. The LED short-to-GND
detection and overtemperature protection cannot be turned off by pulling down the DIAGEN pin.
7.3.5.5 Low-Dropout Operation
When the supply voltage drops below LED string total forward voltage plus V(DROPOUT) at required current, the
TPS92613-Q1 device operates in low-dropout conditions to deliver current output as close as possible to target
value. The actual current output is less than preset value due to insufficient headroom voltage for power
transistor. As a result, the voltage across the sense resistor fails to reach the regulation target.
If the TPS92613-Q1 is designed to operate in low-dropout condition, and the open-circuit diagnostics must be
disabled by pulling the DIAGEN pin voltage lower than VIL(DIAGEN). Otherwise, the TPS92613-Q1 detects an
open-circuit fault and reports a fault indication on the FAULT pin. The DIAGEN pin is used to avoid false
diagnostics due to low supply voltage.
In low-dropout operation, a diode in parallel with the sense resistor is recommended to clamp the voltage
between SUPPLY and IN (across the sense resistor) in case of a large current pulse during recovery.
7.3.6 FAULT Bus Output With One-Fails–All-Fail
During normal operation, The FAULT pin of TPS92613-Q1 is weakly pulled up by an internal pullup current
source, I(FAULT_pullup) higher than VOH(FAULT). If any fault scenario occurs, the FAULT pin is strongly pulled low by
the internal pulldown current sink, I(FAULT_pulldown) to report out the fault alarm.
Meanwhile, the TPS92613-Q1 also monitors the FAULT pin voltage internally. If the FAULT pin of the
TPS92613-Q1 is pulled low by external current sink below VIL(FAULT), the current output is turned off even though
there is no fault detected on owned output. The device does not resume to normal operation until the FAULT pin
voltage rises above VIH(FAULT)
.
4.5 œ 40V
TPS92613 œ Q1
TPS92613 œ Q1
C(SUPPLY)
C(SUPPLY)
B
A
SUPPLY
SUPPLY
R(SNS)
R(SNS)
DIAGEN
PWM
DIAGEN
PWM
DIAGEN
PWM
IN
DIAGEN
PWM
IN
OUT
OUT
FAULT
FAULT
FAULT
GND
FAULT
GND
C(OUT)
C(OUT)
FAULT
BUS
图 22. Typical Application Schematic for One-Fails-All-Fail
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Feature Description (接下页)
Based on this feature, the TPS92613-Q1 device is able to construct a FAULT bus by tying FAULT pins from
multiple TPS9261x-Q1, TPS9263x-Q1 or TPS92830-Q1 devices to realize one-fails-all-fail function as 图 22
showing. The right side TPS92613-Q1 (B) detects either LED open-circuit fault or LED short-to-GND fault and
pulls low the FAULT pin. The low voltage on FAULT pin is detected by left side TPS92613-Q1 (A) because the
FAULT pins are connected of two devices. The left TPS92613-Q1 (A) turns off the output current as a result.
If the FAULT pin is externally pulled up with a current larger than I(FAULT_pulldown), the one-fails–all-fail function is
disabled and only the faulty channel is turned off.
The FAULT bus is able to support up to 15 pieces of TPS9261x-Q1, TPS9263x-Q1, or TPS92830-Q1 devices.
7.3.7 Fault Table
表 1. Fault Table With DIAGEN = HIGH
FAULT BUS
STATUS
DETECTION CURRENT DEGLITCH
FAULT HANDLING
ROUTINE
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
MECHANISM
OUTPUT
TIME
Device works normally
with FAULT pin pulled
low. Device sources
I(retry) current when
PWM is LOW. Device
keeps output normal
when PWM is HIGH.
Constant-
current
pulldown
Open-circuit or
short-to-supply
V(IN) – V(OUT)
V(OPEN_th_falling)
<
On
t(OPEN_deg)
Auto recovery
Auto recovery
FAULT floating
or externally
pulled up
Device turns output off
and retries with
Constant-
current
pulldown
V(OUT)
<
Short-to-ground
On
t(SG_deg)
V(SG_th_falling)
constant current I(retry)
,
ignoring the PWM input.
Constant-
current
Overtemperature TJ > T(TSD)
On or off
t(TSD_deg)
Device turns output off. Auto recovery
pulldown
Externally
pulled low
Device turns output off
表 2. Fault Table With DIAGEN = LOW
FAULT BUS
STATUS
DETECTION CURRENT DEGLITCH
FAULT BUS
FAULT HANDLING
ROUTINE
FAULT
RECOVERY
FAULT TYPE
MECHANISM
OUTPUT
TIME
Open-circuit or
short-to-supply
Ignored
Device turns output off
and retries with
Constant-
current
pulldown
FAULT floating
or externally
pulled up
VOUT
V(SG_th_falling)
<
Short-to-ground
On
t(SG_deg)
Auto recovery
constant current I(retry)
,
ignoring the PWM input.
Constant-
current
Overtemperature TJ > T(TSD)
On or off
t(TSD_deg)
Device turns output off. Auto recovery
pulldown
Externally
pulled low
Device turns output off
14
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7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
When the device is in undervoltage lockout status, the TPS92613-Q1 device disables all functions until the
supply rises above the V(POR_rising) threshold.
7.4.2 Normal Operation V(SUPPLY) ≥ 4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
7.4.3 Low-Voltage Dropout Operation
When the device drives an LED string in low-dropout operation, if the voltage drop is less than the open-circuit
detection threshold, the device may report a false open-circuit fault. TI recommends only enabling the open-
circuit detection when SUPPLY voltage is enough higher than LED string voltage to avoid a false open-circuit
detection.
7.4.4 Fault Mode
When the device detects an open circuit or a shorted LED, the device tries to pull down the FAULT pin with a
constant current. If the FAULT bus is pulled down, the device switches to fault mode and consumes a fault
current of I(FAULT)
.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
In automotive lighting applications, thermal performance and LED diagnostics are always design challenges for
linear LED drivers.
The TPS92613-Q1 device is capable of detecting LED open-circuit and LED short-circuits. To increase current-
driving capability, the TPS92613-Q1 device supports using an external parallel resistor to help dissipate heat as
following section Single-Channel LED Driver With Heat Sharing describes. This method provides a low-cost
solution of using external resistors to minimize thermal accumulation on the device itself due to large voltage
difference between input voltage and LED string forward voltage, while still keeping high accuracy of the total
current output. Note that the one-fails–all-fail feature is not supported by this topology.
8.2 Typical Applications
8.2.1 Single-Channel LED Driver With Diagnostics
The TPS92613-Q1 is an easy-to-use solution for LED driver applications with diagnostics requirements.
9 œ 16V
TPS92613 œ Q1
C(SUPPLY)
SUPPLY
R2
R(SNS)
DIAGEN
DIAGEN
PWM
IN
R1
PWM
OUT
FAULT
FAULT
GND
C(OUT)
图 23. Typical Application Diagram
8.2.1.1 Design Requirements
Input voltage range is from 9 V to 16 V, LED maximum forward voltage VF_MAX = 2.5 V, minimum forward voltage
VF_MIN = 1.9 V, current I(LED) = 250 mA. PWM input is adopted for LED brightness adjust and LED ON/OFF
control.
8.2.1.2 Detailed Design Procedure
STEP 1: Determine the current setting resistor, R(SNS) value by using 公式 2.
V
(CS _REG)
R(SNS)
=
= 0.392W
I(LED)
where
•
•
V(CS_REG) = 98 mV (typical.)
I(LED) = 250 mA
(2)
16
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Typical Applications (接下页)
STEP 2: Design the threshold voltage for SUPPLY to enable the LED open-circuit diagnostics and calculate the
resistor divider value.
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V. To avoid the open-circuit fault reported in low-dropout
operation conditions, additional headroom between SUPPLY and OUT needs to be considered. The TPS92613-
Q1 device must disable open-circuit detection when the supply voltage is below LED-string maximum forward
voltage plus maximum V(OPEN_th_rising) and maximum V(CS_REG). The voltage divider resistor, R1 and R2 value can
be calculated by 公式 3.
V
+ V(CS _REG) + V
R1 + R2
ìR1
(
(OUT)
)
OPEN_ th_rising
(
)
V
=
IL(DIAGEN)
where
•
•
•
•
VIL(DIAGEN) = 1.045 V (minimum)
V(OPEN_th_rising) = 335 mV (maximum)
V(CS_REG) = 102.5 mV (maximum)
R1 = 10 kΩ recommended
(3)
The calculated result for R2 is 65.7 kΩ when V(OUT) maximum voltage is 7.5 V.
STEP 3: Thermal analysis for the worst application conditions.
Normally the thermal analysis is necessary for linear LED-driver applications to ensure that the operation junction
temperature of TPS92613-Q1 is well managed. The total power consumption on the TPS92613-Q1 itself is one
important factor determining operation junction temperature, and it can be calculated by using 公式 4. Based on
the worst-case analysis for maximum power consumption on device, consider either optimizing PCB layout for
better power dissipation as Layout describes or adding an extra heat-sharing resistor as described in Single-
Channel LED Driver With Heat Sharing.
PDEV = V
- V CS _REG - V OUT ìI
+ V(SUPPLY ìI(Quiescent
) ) )
(
)
SUPPLY
LED
(
)
(
)
(
)
(
)
(
PDEV _ MAX = 16 - 3 ì1.9 - 0.098 ì0.25 +16 ì0.00025 = 2.55W
(
)
where
•
•
V(CS_REG) = 98 mV (typical)
I(Quiescent) = 250 µA (maximum)
(4)
In this application, the calculated result for maximum power consumption on the TPS92613-Q1 is 2.55 W at
V(SUPPLY) = 16 V and I(LED) = 250 mA conditions.
TI recommends to add capacitors C(SUPPLY) at SUPPLY and C(OUT)at OUT. TI recommends one 1-μF capacitor
plus one 100-nF decoupling ceramic capacitor close to the SUPPLY pin for C(SUPPLY) and a 10-nF ceramic
capacitor close to the OUT pin for C(OUT). The larger capacitor for C(SUPPLY) or C(OUT) is helpful for EMI and ESD
immunity; however, large C(OUT) takes a longer time to charge up the capacitor and may affect PWM dimming
performance.
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Typical Applications (接下页)
8.2.1.3 Application Curves
Ch. 1 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
Ch. 1 = V(OUT)
Ch. 2 = V(PWM)
Ch. 4 = I(OUT)
图 24. Output Current With PWM Input
图 25. Output Current With PWM Input
8.2.2 Single-Channel LED Driver With Heat Sharing
Using parallel resistors, thermal performance can be improved by balancing current between the TPS92613-Q1
device and the external resistors as follows. As the current-sense resistor controls the total LED string current,
the LED string current I(LED) is set by V(CS_REG) / R(SNS), while the TPS92613-Q1 current I(DRIVE) and parallel
resistor current I(P) combine to the total current.
TPS92613 œ Q1
C(SUPPLY)
SUPPLY
R2
R4
R(SNS)
I(DRIVE)
I(LED)
R1
R3
DIAGEN
DIAGEN
PWM
IN
R(P)
I(P)
PWM
OUT
FAULT
FAULT
GND
C(OUT)
图 26. Supply Control With Heat Sharing Resistor
8.2.2.1 Design Requirements
Input voltage range is 9 V to 16 V, LED maximum forward voltage VF_MAX= 2.5 V, minimum forward voltage
VF_MIN = 1.9 V, current I(LED) = 500 mA. And supply control is adopted for LED brightness adjust and LED
ON/OFF control. The high level of V(SUPPLY) is 9 V to 16 V, and the low level of V(SUPPLY) is between 0 V to 3 V.
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Typical Applications (接下页)
8.2.2.2 Detailed Design Procedure
Note that the parallel resistor path cannot be shut down by PWM or fault protection. If PWM control is required,
TI recommends an application circuit as described in 图 27.
In linear LED driver applications, the large input voltage variation generates the most of the thermal concerns.
The resistor current, as indicated by Ohm's law, depends on the voltage across the external resistors. The
TPS92613-Q1 controls the driver current I(DRIVE) to attain the desired total current. If I(P) increases, the
TPS92613-Q1 device decreases I(DRIVE) to compensate, and vice versa.
While in low-dropout operation, the voltage across the R(P) resistor may be close to zero, so that almost no
current can flow through the external resistor R(P)
.
When the input voltage is high, the parallel-resistor current I(P) is proportional to the voltage across the parallel
resistor R(P). The parallel resistor R(P) takes the majority of the total string current, generating maximum heat.
In this case, the parallel resistor value must be carefully calculated to ensure that 1) enough output current is
achieved in low-dropout operation, 2) thermal dissipation for both the TPS92613-Q1 device and the resistor is
within their thermal dissipation limits, and 3) device current in the high-voltage mode is above the minimal output-
current requirement.
STEP 1: Determine the current setting resistor, R(SNS) value by using 公式 5.
V
(CS _REG)
R(SNS)
=
= 0.196W
I(LED)
where
•
•
V(CS_REG) = 98 mV (typical)
I(LED) = 500 mA
(5)
The calculated result for R(SNS) is 0.196 Ω.
STEP 2: Calculate the parallel resistor, R(P) value by using 公式 6.
The parallel resistor R(P) is recommended to consume 50% of the total current at maximum supply voltage.
V
- V
- V
16 - 0.098 - 3ì1.9
0.5ì0.5
(SUPPLY)
(CS _REG) (OUT)
R(P)
=
=
ö 40W
0.5ìI(LED)
where
•
•
V(CS_REG) = 98 mV (typical)
I(LED) = 500 mA
(6)
The calculated result for R(P) is about 40 Ω at V(SUPPLY) = 16 V.
STEP 3: Design the threshold voltage for SUPPLY to enable the LED open-circuit diagnostics and calculate
voltage divider resistor value for R1 and R2.
LED-string maximum forward voltage = 3 × 2.5 V = 7.5 V. To avoid the open-circuit fault reported in low-dropout
operation conditions, additional headroom between SUPPLY and OUT needs to be considered. The TPS92613-
Q1 device must disable open-circuit detection when the supply voltage is below LED-string maximum forward
voltage plus maximum V(OPEN_th_rising) and maximum V(CS_REG). The voltage divider resistor, R1 and R2 value can
be calculated by 公式 7.
V
+ V(CS _REG) + V
R1 + R2
ìR1
(
(OUT)
)
OPEN_ th_rising
(
)
V
=
IL(DIAGEN)
where
•
•
•
•
VIL(DIAGEN) = 1.045 V (minimum)
V(OPEN_th_rising) = 335 mV (maximum)
V(CS_REG) = 102.5 mV (maximum)
R1 = 10 kΩ recommended
(7)
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Typical Applications (接下页)
The calculated result for R2 is 65.7 kΩ when V(OUT) maximum voltage is 7.5 V.
STEP 4: Design the threshold voltage for PWM to enable current output and calculate voltage divider resistor
value for R3 and R4.
Because the supply control is adopted for the LED ON/OFF and brightness control, a pulse square voltage with
power capability is applied on the SUPPLY pin to enable and disable current output to OUT. In order to ensure
the current output of TPS92613-Q1 is fully enabled when applied voltage on SUPPLY pin is high enough and the
current output is truly shutdown when the applied voltage goes low. A voltage divider from supply to control PWM
needs to be designed to setup a threshold of supply voltage. The resistor R3 and R4 of voltage divider can be
calculated by 公式 8.
V (
) ìR3
R3 + R4
SUPPLY
V
=
IL(PWM)
where
•
•
VIL(PWM) = 1.24 V (maximum)
R3 = 10 kΩ recommended
(8)
The calculated result for R4 is 30.5 kΩ if LED must be turned on when V(SUPPLY) voltage is higher than 5 V.
STEP 5: Thermal analysis for the worst application conditions.
The total device power consumption can be calculated by 公式 9.
≈
’
÷
V(SUPPLY - V(CS _REG - V(OUT
)
)
)
∆
PDEV = V
- V CS _REG - V OUT ì I
-
LED
+ V(SUPPLY ìI(Quiescent
)
(
)
SUPPLY
(
)
(
)
(
)
(
)
(
)
)
∆
R(P
÷
)
«
◊
16 - 0.098 - 3ì1.9
40
≈
’
PDEV _MAX = 16 - 0.098 - 3ì1.9 ì 0.5 -
+16ì0.00025 = 2.50W
(
)
∆
÷
(
)
«
◊
where
•
•
V(CS_REG) = 98 mV (typical)
I(Quiescent) = 250 µA (maximum)
(9)
The calculated maximum power consumption on the TPS61193-Q1 is 2.5 W at V(SUPPLY) = 16 V, V(OUT) = 3 × 1.9
V = 5.7 V and I(LED) = 500 mA.
The power consumption on resistor R(P) can be calculated through 公式 10.
2
V
(SUPPLY) - V(CS _REG) - V
(
)
(OUT)
P
=
(RP)
R(P)
2
16 - 3 ì1.9 - 0.098
(
)
P
=
= 2.6W
(RP _MAX)
40
where
•
V(CS_REG) = 98 mV (Typ.)
(10)
The calculated maximum power consumption on the 40 Ω, R(P) parallel resistor is 2.6 W at V(SUPPLY) = 16 V and
V(OUT) = 3 × 1.9 V = 5.7 V.
TI recommends adding capacitors C(SUPPLY) at SUPPLY and C(OUT)at OUT. One 1-μF capacitor plus one 100-nF
decoupling ceramic capacitor close to the SUPPLY pin is recommended for C(SUPPLY), and a 10-nF ceramic
capacitor close to the OUT pin is recommended for C(OUT). The larger capacitor for C(SUPPLY) or C(OUT) is helpful
for EMI and ESD immunity, however large C(OUT) takes a longer time to charge up the capacitor and could affect
PWM dimming performance.
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Typical Applications (接下页)
9 œ 16V
TPS92613 œ Q1
SUPPLY
C(SUPPLY)
R2
R1
R(SNS)
I(DRIVE)
I(LED)
DIAGEN
PWM
DIAGEN
PWM
IN
R(P)
I(P)
OUT
FAULT
FAULT
GND
C(OUT)
R5
PWM
PWM
图 27. PWM Control With Heat Sharing Resistor
For PWM control scenarios, a NPN bipolar transistor with a base current-limiting resistor, R5 can modulate the
output current together with the device PWM function as 图 27. The resistor value of R5 needs to be calculated
based on the applied PWM voltage and β value of selected NPN transistor.
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Typical Applications (接下页)
8.2.2.3 Application Curves
Ch. 1 = V(SUPPLY)
Ch. 4 = I(LED)
Ch. 2 = V(OUT)
Ch. 3 = I(P)
Ch. 1 = V(SUPPLY)
Ch. 4 = I(LED)
Ch. 2 = V(OUT)
Ch. 3 = I(P)
Duty Cycle = 30%
F(SUPPLY) = 200 Hz
V(SUPPLYLO) = 2.5V
Duty Cycle = 5%
F(SUPPLY) = 200 Hz
V(SUPPLYLO) = 2.5V
V(SUPPLYHI) = 12V
V(SUPPLYHI) = 12V
图 28. Pulse Supply Control Output Current (D = 5%)
图 29. Pulse Supply Control Output Current (D = 30%)
700
600
500
400
300
200
100
0
I(OUT) setting = 500 mA -40oC
I(OUT) setting = 500 mA 25oC
I(OUT) setting = 500 mA 125oC
I(OUT) setting = 600 mA -40oC
I(OUT) setting = 600 mA 25oC
I(OUT) setting = 600 mA 125oC
0
0.5
1
1.5
2
2.5
Current Output (mA)
3
3.5
4
D007
Ch. 1 = V(SUPPLY)
Ch. 4 = I(LED)
Ch. 2 = V(OUT)
Ch. 3 = I(P)
V(SUPPLY) increases from 9 V to 16 V
图 30. Constant Output Current With Supply Voltage
图 31. Output Current vs Dropout Voltage
Increasing
22
版权 © 2019–2020, Texas Instruments Incorporated
TPS92613-Q1
www.ti.com.cn
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
9 Power Supply Recommendations
The TPS92613-Q1 is designed to operate from an automobile electrical power system within the range specified
in the Recommended Operating Conditions. The V(SUPPLY) input must be protected from reverse voltage and
voltage dump condition over 40 V. The impedance of the input supply rail must be low enough that the input
current transient does not cause drop below LED string required forward voltage. If the input supply is connected
with long wires, additional bulk capacitance may be required in addition to normal input capacitor.
10 Layout
10.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92613-Q1 layout. TI recommends large thermal
dissipation area connected to thermal pads with multiple thermal vias.
10.2 Layout Example
GND
SUPPLY
DIAGEN
IN
PWM
FAULT
GND
OUT
图 32. TPS92613-Q1 Example Layout Diagram
版权 © 2019–2020, Texas Instruments Incorporated
23
TPS92613-Q1
ZHCSJM3B –APRIL 2019–REVISED JANUARY 2020
www.ti.com.cn
11 器件和文档支持
11.1 文档支持
11.1.1 相关文档
请参阅如下相关文档:
•
•
•
•
•
•
•
《TPS92610-Q1 汽车单通道线性 LED 驱动器》
《TPS92611-Q1 汽车单通道线性 LED 驱动器》
《TPS92612-Q1 汽车单通道线性 LED 驱动器》
《TPS92610-Q1 EVM 用户指南》
《如何在汽车外部照明应用中计算 TPS92630-Q1 最大输出 电流》
《适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计》
《适用于中央高位刹车灯 (CHMSL) 的汽车线性 LED 驱动器参考设计指南》
11.2 接收文档更新通知
要接收文档更新通知,请导航至 ti.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.3 支持资源
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是适用于指定器件的最新数据。数据如有变更,恕不另行通知,
且不会对此文档进行修订。如需获取此数据表的浏览器版本,请查看左侧的导航面板。
24
版权 © 2019–2020, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92613QNDRRQ1
ACTIVE
TO-263
NDR
7
1000 RoHS & Green
SN
Level-3-260C-168 HR
-40 to 125
TPS92613Q
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92613QNDRRQ1
TO-263
NDR
7
1000
330.0
24.4
10.6
15.4
2.45
12.0
24.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
TO-263 NDR
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 45.0
TPS92613QNDRRQ1
7
1000
Pack Materials-Page 2
PACKAGE OUTLINE
NDR0007A
TO-263 - 2.25 mm max height
S
C
A
L
E
1
.
0
0
0
TO-263
10.1
9.6
A
0.735
0.635
7X
B
PIN 1 ID
0.25
C A B
1
10.41
9.91
7.62
7
6X 1.27
14.36
13.66
12.45
11.95
R0.7
MAX TYP
10.76
10.26
2.1
1.9
0.508
7X
C
0.381
0 -6
0.15
7
1.05
0.95
0-0.15
STAND-OFF
NOTE 5
ALL AROUND
7.1
6.5
6.11
5.85
EXPOSED PAD
(OUTLINE DOES NOT
INCLUDE MOLD FLASH)
5.75
5.40
4.1 6.6
3.9 6.3
1.05
0.65
6.5
6.1
(2.66)
4219872/A 04/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Features may not exist and shape may vary per different assembly sites.
4. Reference JEDEC registration TO-279B.
5. Under all conditions, leads must not be above Datum C
www.ti.com
EXAMPLE BOARD LAYOUT
NDR0007A
TO-263 - 2.25 mm max height
TO-263
7X (2.41)
1
(6.35)
7X (0.91)
6X (1.27)
SYMM
8
(7.62)
(5.59)
7
(8.28)
(0.91)
PKG
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219872/A 04/2019
NOTES: (continued)
6. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
7. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
NDR0007A
TO-263 - 2.25 mm max height
TO-263
7X (2.41)
7X (0.91)
EXPOSED METAL
TYP
1
(1.2) TYP
(0.29)
6X (1.27)
(1.33) TYP
R(0.05) TYP
SYMM
(0.665)
8
(7.62)
20X (1.13)
20X (1)
7
(8.28)
0.91
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
64% PRINTED SOLDER COVERAGE BY AREA
SCALE:7X
4219872/A 04/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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