TPS92623QPWPRQ1 [TI]
具有热共享功能的汽车类三通道高侧 LED 驱动器 | PWP | 16 | -40 to 125;
| 型号： | TPS92623QPWPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有热共享功能的汽车类三通道高侧 LED 驱动器 | PWP | 16 | -40 to 125 驱动 驱动器 |
| 文件： | 总38页 (文件大小：6261K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS92623-Q1
ZHCSLI9A –DECEMBER 2021 –REVISED JUNE 2022
TPS92623-Q1 具有热共享控制功能的三通道、汽车类高侧LED 驱动器
1 特性
2 应用
• 符合面向汽车应用的AEC-Q100 标准：
• 车外尾灯：尾灯、中央高位刹车灯、侧标志灯
• 车外小灯：门把手、盲点检测指示灯、充电口
• 车内灯：顶灯、阅读灯
– 温度等级1: –40 ° C 至125 ° C 、T A
• 宽输入电压范围：4.5V 至40V
• 通过外部分流电阻器实现热共享功能
• 故障模式下具有低电源电流
• 通用LED 驱动器应用
3 说明
• 三通道高精度电流调节：
TPS92623-Q1 三通道 LED 驱动器采用独特的热管理
设计，可减少器件温升。TPS92623-Q1 是由汽车电池
直接供电的线性驱动器，具有宽电压范围，每个通道可
输出高达 150mA 的全电流负载。外部分流电阻器可用
来共享输出电流并由驱动器驱动。该器件具有全面的诊
断功能，包括 LED 开路、LED 接地短路和器件过热保
护。
– 每个通道的电流输出高达150 mA
– 在整个温度范围内精度为±5%
– 通过电阻器独立设置电流
– 用于亮度控制的独立PWM 引脚
• 低压降：
– 最大压降：150 mA 时为600 mV
• 诊断和保护
– LED 开路，具有自动恢复功能
– LED 接地短路，具有自动恢复功能
– 支持诊断并具有可调阈值
– 可配置为连带失效或仅失效通道关闭的故障总线
(N-1)
– 热关断
TPS92623-Q1 的连带失效功能可与其他 LED 驱动器
（如 TPS9261x-Q1、TPS9262x-Q1、TPS92630/8-
Q1 和 TPS92830-Q1 器件）配合工作，从而满足不同
的要求。
表3-1. 器件信息
封装(1)
封装尺寸（标称值）
器件型号
• 工作结温范围：–40°C 至150°C
TPS92623-Q1
HTSSOP (16)
4.40mm × 5.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
4.5 V to 40 V
4
TPS92623-Q1
C(OUT1)
C(OUT2)
C(OUT3)
R(RES1)
R(RES2)
R(RES3)
P(DEVICE) R(RESx) = 82 W
P(RESx) R(RESx) = 82 W
P(DEVICE) R(RESx) = 64.9 W
P(RESx) R(RESx) = 64.9 W
SUPPLY
RES1
R(SNS1)
R(SNS2)
R(SNS3)
3.2
IN1
C(SUPPLY)
OUT1
RES2
OUT2
RES3
OUT3
GND
IN2
2.4
IN3
DIAGEN
1.6
0.8
0
PWM1
PWM2
PWM3
FAULT
典型应用图
4
8
12 16
Supply Voltage (V)
20
24
器件功耗
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSFS4
TPS92623-Q1
ZHCSLI9A –DECEMBER 2021 –REVISED JUNE 2022
www.ti.com.cn
Table of Contents
7.4 Device Functional Modes..........................................21
8 Application and Implementation..................................22
8.1 Application Information............................................. 22
8.2 Typical Applications.................................................. 22
9 Power Supply Recommendations................................27
10 Layout...........................................................................28
10.1 Layout Guidelines................................................... 28
10.2 Layout Example...................................................... 28
11 Device and Documentation Support..........................29
11.1 接收文档更新通知................................................... 29
11.2 支持资源..................................................................29
11.3 Trademarks............................................................. 29
11.4 Electrostatic Discharge Caution..............................29
11.5 术语表..................................................................... 29
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................7
7 Detailed Description......................................................11
7.1 Overview................................................................... 11
7.2 Functional Block Diagram......................................... 11
7.3 Feature Description...................................................11
Information.................................................................... 30
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision * (December 2021) to Revision A (June 2022)
Page
• 将状态从“预告信息”更改为“量产数据”....................................................................................................... 1
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5 Pin Configuration and Functions
SUPPLY
IN1
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
RES1
OUT1
RES2
OUT2
RES3
OUT3
GND
IN2
IN3
Thermal
Pad
DIAGEN
PWM1
PWM2
PWM3
FAULT
Not to scale
图5-1. PWP Package 16-Pin HTSSOP With PowerPAD™ Top View
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
SUPPLY
IN1
NO.
1
I
I
I
I
Device power supply
2
Current input for channel 1
Current input for channel 2
Current input for channel 3
IN2
3
IN3
4
Enable pin for LED open-circuit detection to avoid false open diagnostics during low-dropout
operation.
DIAGEN
5
I
PWM1
PWM2
PWM3
FAULT
GND
6
I
I
PWM input for OUT1 and RES1 current output ON and OFF control
PWM input for OUT2 and RES2 current output ON and OFF control
PWM input for OUT3 and RES3 current output ON and OFF control
Fault output, support one-fails–all-fail fault bus
Ground
7
8
I
9
I/O
10
11
12
13
14
15
16
—
O
O
O
O
O
O
OUT3
RES3
OUT2
RES2
OUT1
RES1
Current output for channel 3
Current output for channel 3 with external thermal resistor
Current output for channel 2
Current output for channel 2 with external thermal resistor
Current output for channel 1
Current output for channel 1 with external thermal resistor
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–40
–40
MAX
UNIT
V
Supply
SUPPLY
45
V(SUPPLY)+0.3
V(SUPPLY)+0.3
V(SUPPLY)+0.3
150
High-voltage input
DIAGEN, IN1, IN2, IN3, PWM1, PWM2, PMW3
OUT1, OUT2, OUT3, RES1, RES2, RES3
FAULT
V
High-voltage output
V
Fault bus
TJ
V
Operating junction temperature
Storage temperature
°C
°C
Tstg
150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per AEC Q100-002(1)
HBM ESD Classification Level 1C
V(ESD)
Electrostatic discharge
All pins
V
Charged-device model (CDM), per AEC
Q100-011
CDM ESD Classification Level C4B
Corner pins (SUPPLY, RES1,
FAULT, PWM3, )
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
SUPPLY
Device supply voltage
Sense voltage
4.5
40
V
V
V
V
IN1, IN2, IN3
PWM1, PWM2, PWM3
DIAGEN
V
(SUPPLY) –V(CS_REG)
PWM inputs
0
0
V(SUPPLY)
V(SUPPLY)
Diagnostics enable pin
OUT1, OUT2, OUT3,
RES1, RES2, RES3
Driver output
Fault bus
0
0
V(SUPPLY)
V
FAULT
V(SUPPLY)
125
V
Operating ambient temperature, TA
°C
–40
6.4 Thermal Information
TPS92623-Q1
THERMAL METRIC(1)
PWP
16 PINS
46.3
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
41.9
Junction-to-board thermal resistance
22.8
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.4
ψJT
22.8
ψJB
RθJC(bot)
6.1
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
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6.5 Electrical Characteristics
V(SUPPLY) = 5 V to 40 V, V(EN) = 5V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
BIAS
V(POR_rising)
V(POR_falling)
I(Quiescent)
I(FAULT)
Supply voltage POR rising threshold
Supply voltage POR falling threshold
Device standby ground current
3.6
3.4
4.0
V
V
3.0
PWM = HIGH
1.6
2.5
mA
mA
Device supply current in fault mode
PWM = HIGH, FAULT externally pulled LOW
0.21
0.350
0.45
LOGIC INPUTS (DIAGEN, PWM)
VIL(DIAGEN)
VIH(DIAGEN)
VIL(PWM)
Input logic-low voltage, DIAGEN
1.045
1.14
1.1
1.2
1.1
1.2
1.155
1.26
V
V
V
V
Input logic-high voltage, DIAGEN
Input logic-low voltage, PWM
Input logic-high voltage, PWM
1.045
1.14
1.155
1.26
VIH(PWM)
CONSTANT-CURRENT DRIVER
I(OUTx_Tot) Device output-current for each channel
V(CS_REG)
100% duty cycle
5
150
156
+3
mA
mV
%
Sense-resistor regulation voltage
Channel to channel mismatch
Device to device mismatch
Sense-resistor range
144
150
TA = –40°C to +125°C
ALL ΔV(CS_c2c)
ALL ΔV(CS_d2d)
R(CS_REG)
ΔV(CS_c2c) = 1 –V(CS_REGx)/Vavg(CS_REG)
ΔV(CS_d2d) = 1 –Vavg(CS_REG)/Vnom(CS_REG)
–3
–4
+4
%
0.96
31.2
400
600
600
900
Ω
current setting of 100 mA
200
300
280
400
Voltage dropout from INx to OUTx, RESx open
mV
current setting of 150 mA
V(DROPOUT)
current setting of 100 mA
Voltage dropout from INx to RESx, OUTx open
Ratio of RESx current to total current
mV
%
current setting of 150 mA
I(RESx)
95
I(RESx)/I(OUTx_Tot), V(INx) –V(RESx) > 1 V
DIAGNOSTICS
V(OPEN_th_rising)
V(OPEN_th_falling)
V(SG_th_rising)
V(SG_th_falling)
180
300
450
1.2
0.9
420
mV
mV
V
LED open rising threshold, V(IN) –V(OUT)
LED open falling threshold, V(IN) –V(OUT)
Channel output short-to-ground rising threshold
Channel output short-to-ground falling threshold
1.14
1.26
0.855
0.945
V
Channel output V(OUT) short-to-ground retry
current
I(Retry_OUTx)
I(Retry_RESx)
0.64
0.64
1.08
1.08
1.528
1.528
mA
mA
Channel output V(OUT) short-to-ground retry
current
FAULT
VIL(FAULT)
Logic input low threshold
0.7
V
V
VIH(FAULT)
Logic input high threshold
2
t(FAULT_rising)
t(FAULT_falling)
I(FAULT_pulldown)
I(FAULT_pullup)
I(FAULT_leakage)
TIMING
Fault detection rising edge deglitch time
Fault detection falling edge deglitch time
FAULT internal pulldown current
FAULT internal pullup current
FAULT leakage current
10
20
µs
µs
mA
µA
µA
V(FAULT) = 0.4 V
V(FAULT) = 20 V
2
6
3
4
14
2
10
0.01
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 1 Ω and R(RESx) = 56 Ω
3
3
µs
µs
µs
µs
PWM rising edge delay to 10% of output
current, t1 as shown in 图7-1
t(PWM_delay_rising)
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 30 Ω and R(RESx) = 56 Ω
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 1 Ω and R(RESx) = 56 Ω
3.8
3.8
PWM falling edge delay to 90% of output
current, t2 as shown in 图7-1
t(PWM_delay_falling)
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 30 Ω and R(RESx) = 56 Ω
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6.5 Electrical Characteristics (continued)
V(SUPPLY) = 5 V to 40 V, V(EN) = 5V, TJ = –40°C to +150°C unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 1 Ω and R(RESx) = 56 Ω
2
µs
Output current rising from 10% to 90%, t3 as
shown in 图7-1
t(Current_rising)
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 30 Ω and R(RESx) = 56 Ω
1
5
µs
µs
µs
µs
µs
µs
µs
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 1 Ω and R(RESx) = 56 Ω
Output current falling from 90% to 10%, t4 as
shown in 图7-1
t(Current_falling)
V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
mV, R(SNSx) = 30 Ω and R(RESx) = 56 Ω
0.2
85
SUPPLY rising edge to 10% output current, t5 as V(SUPPLY) = 12 V, V(OUT) = 6 V, V(CS_REG) = 150
t(STARTUP)
t(OPEN_deg)
t(SG_deg)
shown in 图7-1
mV, R(SNSx) = 1 Ω and R(RESx) = 56 Ω
LED-open fault detection deglitch time, t6 as
shown in 图7-4
125
125
125
Output short-to-ground detection deglitch time, t7
as shown in 图7-3
Open and Short fault recovery deglitch time, t8
as shown in 图7-3 and 图7-4
t(Recover_deg)
Fault recovery delay time, t9 as shown in 图7-3
and 图7-4
t(FAULT_recovery)
t(TSD_deg)
50
50
µs
µs
Thermal over temperature deglitch time
THERMAL PROTECTION
Thermal shutdown junction temperature
threshold
T(TSD)
157
172
15
187
°C
°C
Thermal shutdown junction temperature
hysteresis
T(TSD_HYS)
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6.6 Typical Characteristics
225
200
175
150
125
100
75
225
200
175
150
125
100
75
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 150 mA
I(OUTx_Tot) = 50 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 150 mA
50
50
25
25
0
4
8
12
16
20
24
0
-40
Supply Voltage (V)
-20
0
20
40
60
80
100 120 140
图6-1. Output Current vs Supply Voltage
Temperature (C)
图6-2. Output Current vs Temperature
225
200
175
150
125
100
75
225
200
175
150
125
100
75
I(OUTx_Tot) = 150 mA -40 C
I(OUTx_Tot) = 150 mA 25 C
I(OUTx_Tot) = 150 mA 125 C
I(OUTx_Tot) = 150 mA
I(OUTx_Tot) = 100 mA
I(OUTx_Tot) = 50 mA
50
50
25
25
0
0
0
0.4
0.8
1.2
1.6
2
0
0.4
0.8
1.2
1.6
2
Dropout Voltage (V)
Dropout Voltage (V)
图6-3. Output Current vs Dropout Voltage
图6-4. Output Current vs Dropout Voltage
100
50
175
150
125
100
75
30
20
10
5
I(OUTx) R(RESx) = 34
I(RESx) R(RESx) = 34
I(OUTx) R(RESx) = 41
I(RESx) R(RESx) = 41
I(OUTx) R(RESx) = 55
I(RESx) R(RESx) = 55
I(OUTx) R(RESx) = 65
I(RESx) R(RESx) = 65
I(OUTx) R(RESx) = 80
I(RESx) R(RESx) = 80
3
2
1
50
0.5
0.3
0.2
25
0
0.1
5
10
15
20
25
30
0.1 0.2 0.3 0.5
1
2
3 4 567 10
20 30 50 70100
Supply Voltage (V)
Input PWM Duty Cycle (%)
图6-6. Output Current Distribution vs Supply Voltage
图6-5. PWM Output Duty Cycle vs PWM Input Duty Cycle
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6.6 Typical Characteristics (continued)
225
200
175
150
125
100
75
9
I(OUTx) R(RESx) = 55 2LEDs
P(Resx) R(RESx) = 34
8
I(RESx) R(RESx) = 55 2LEDs
I(OUTx) R(RESx) = 55 3LEDs
I(RESx) R(RESx) = 55 3LEDs
P(Device) R(RESx) = 34
P(Resx) R(RESx) = 41
7
P(Device R(RESx) = 41
P(Resx) R(RESx) = 55
6
P(Device R(RESx) = 55
P(Resx) R(RESx) = 65
5
P(Device) R(RESx) = 65
P(Resx) R(RESx) = 80
4
P(Device) R(RESx) = 80
3
50
2
1
0
25
0
3
6
9
12
15
18
21
24
27
30
0
3
6
9
12
15
18
21
24
27
30
Supply Voltage (V)
Supply Voltage (V)
图6-8. Output Current Distribution vs Supply Voltage
图6-7. Power Dissipation vs Supply Voltage
5
4
3
2
1
0
P(RESx) R(RESx) = 55 3LEDs
P(DEVICE) R(RESx) = 55 3LEDs
P(RESx) R(RESx) = 55 2LEDs
P(DEVICE) R(RESx) = 55 2LEDs
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
3
6
9
12
15
18
21
24
27
30
Supply Voltage (V)
图6-10. Power Up Sequence
图6-9. Power Dissipation vs Supply Voltage
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-12. PWM Dimming at 200 Hz
Ch2 = V(OUT1)
Ch3 = V(PWM1)
图6-11. Supply Dimming at 200 Hz
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6.6 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
图6-13. PWM Dimming at 1 kHz
图6-14. LED Open Protection
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-15. LED Open Protection Recovery
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
图6-16. LED Short-Circuit Protection
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
图6-17. LED Short-Circuit Protection Recovery
图6-18. Transient Undervoltage
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6.6 Typical Characteristics (continued)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-19. Transient Overvoltage
图6-20. Slow Decrease and Quick Increase of Supply Voltage
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-21. Slow Decrease and Slow Increase of Supply Voltage
图6-22. Superimposed Alternating Voltage 15 Hz
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
Ch1 = V(SUPPLY)
Ch4 = I(OUT_Tot)
Ch2 = V(OUT1)
Ch3 = V(FAULT)
DIAGEN = High when Supply > 8 V
DIAGEN = High when Supply > 8 V
图6-23. Superimposed Alternating Voltage 1 kHz
图6-24. Jump Start
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7 Detailed Description
7.1 Overview
The TPS92623-Q1 is a three-channel, high-side linear LED driver supporting external thermal sharing resistor to
achieve the controllable junction temperature rising. The device can be directly powered by automotive battery
and output full load up to 450-mA current to LED with limited power dissipation on the device. The current output
at each channel can be independently set by external R(SNSx) resistors. Current flows from the supply through
the R(SNSx) resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and RESx
pin. TPS92623-Q1 device supports both supply control and PWM control to turn LED ON and OFF. The LED
brightness is also adjustable by voltage duty cycle applied on either SUPPLY or PWMx pins with frequency
above 100 Hz. The TPS92623-Q1 provides full diagnostics to keep the system operating reliably including LED
open/short circuit detection, supply POR and thermal shutdown protection. TPS92623-Q1 device is in a
HTSSOP package with total 16 leads. The TPS92623-Q1 can be used with other TPS9261x-Q1, TPS9262x-Q1,
TPS9263x-Q1 and TPS92830-Q1 family devices together to achieve one-fails-all-fail protection by tying all
FAULT pins together as a fault bus.
7.2 Functional Block Diagram
VSUPPLY
R(SNS1)
TPS92623-Q1
Channel 1
IN1
SUPPLY
DIAGEN
PWM1
RES1
OUT1
PWM2
PWM3
IN2
RES2
VCC
Logic
Channel 2
OUT2
IN3
FAULT
RES3
Channel 3
OUT3
GND
7.3 Feature Description
7.3.1 Power Supply (SUPPLY)
7.3.1.1 Power-On Reset (POR)
The TPS92623-Q1 device has an internal power-on-reset (POR) function. When power is applied to the
SUPPLY pin, the internal POR circuit holds the device in reset state until V(SUPPLY) is above V(POR_rising)
.
7.3.1.2 Suppply Current in Fault Mode
The TPS92623-Q1 device consumes minimal quiescent current, I(FAULT), into SUPPLY when the FAULT pin is
externally pulled LOW. At the same time, the device shuts down all three output drivers.
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If device detects an internal fault, it pulls down the FAULT pin by an internal typical 3-mA constant current as a
fault indication to the fault bus.
7.3.2 Enable and Shutdown
The device starts to operate as long as the SUPPLY voltage is higher than V(POR_rising). The TPS92623-Q1 shuts
down when SUPPLY voltage is lower than V(POR_falling)
.
7.3.3 Constant-Current Output and Setting (INx)
The TPS92623-Q1 device is a high-side current driver for driving LEDs. The device controls each output current
through regulating the voltage drop on an external high-side current-sense resistor, R(SNSx) independently for
each channel. An integrated error amplifier drives an internal power transistor to maintain the voltage drop on the
current-sense resistor R(SNSx) to V(CS_REG) and therefore regulates the current output to target value. When the
output current is in regulation, the current value for each channel can be calculated by using 方程式1.
V
(CS _REG)
I(OUTx _ Tot)
=
R(SNSx)
(1)
where
• V(CS_REG) = 150 mV
• x = 1, 2 or 3 for output channel 1, 2 or 3
When the supply voltage drops below total LED string forward voltage plus required headroom voltage, the sum
of V(DROPOUT) and V(CS_REG), the TPS92623-Q1 is not able to deliver enough current output as set by the value
of R(SNSx), and the voltage across the current-sense resistor R(SNSx) is less than V(CS_REG)
.
7.3.4 Thermal Sharing Resistor (OUTx and RESx)
The TPS92623-Q1 device provides two current output paths for each channel. Current flows from the supply
through the R(SNSx) resistor into the integrated current regulation circuit and to the LEDs through OUTx pin and
RESx pin. The current output on both OUTx pin and RESx pin is independently regulated to achieve total
required current output. The summed current of OUTx and RESx is equal to the current through the R(SNSx)
resistor in the channel. The OUTx connects to anode of LEDs load in serial directly, however RESx connects to
the LEDs through an external resistor to share part of the power dissipation and reduce the thermal
accumulation in TPS92623-Q1.
The integrated independent current regulation in TPS92623-Q1 dynamically adjusts the output current on both
OUTx and RESx output to maintain the stable summed current for LED. The TPS92623-Q1 always regulates the
current output to the RESx pin as much as possible until the RESx current path is saturated, and the rest of
required current is regulated out of the OUTx. As a result, the most of the current to LED outputs through the
RESx pin when the voltage dropout is large between SUPPLY and LED required total forward voltage. In the
opposite case, the most of the current to LED outputs through the OUTx pin when the voltage headroom is
relative low between SUPPLY and LED required forward voltage.
7.3.5 PWM Control (PWMx)
The pulse width modulation (PWM) input of the TPS92623-Q1 functions as enable for the output current. When
the voltage applied on the PWM pin is higher than VIH(PWM), the relevant output current is enabled. When the
voltage applied on PWM pin is lower than VIL(PWM), the output current is disabled as well as the diagnostic
features. Besides output current enable and disable function, the PWM input of TPS92623-Q1 also supports
adjustment of the average current output for brightness control if the frequency of applied PWM signal is higher
than 100 Hz, which is out of visible frequency range of human eyes. TI recommends a 200-Hz PWM signal with
1% to 100% duty cycle input for brightness control. Please refer to 图8-4 for typical PWM dimming application.
The TPS92623-Q1 device has three PWM input pins: PWM1, PWM2, and PWM3 to control each of current
output channel independently. PWM1 input controls the output channel1 for both OUT1 and RES1, PWM2 input
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controls the output channel2 for both OUT2 and RES2, and PWM3 input controls the output channel3 for both
OUT3 and RES3. 图7-1 illustrates the timing for PWM input and current output.
SUPPLY
PWMx
t1
t2
tt5t
t3
t4
IOUTx
图7-1. Power On Sequence and PWM Dimming Timing
The detailed information and value of each time period in 图7-1 is described in Electrical Characteristics.
7.3.6 Supply Control
The TPS92623-Q1 can support supply control to turn ON and OFF output current. When the voltage applied on
the SUPPLY pin is higher than the LED string forward voltage plus needed headroom voltage at required
current, and the PWM pin voltage is high, the output current is turned ON and well regulated. However, if the
voltage applied on the SUPPLY pin is lower than V(POR_falling), the output current is turned OFF. With this feature,
the power supply voltage in designed pattern can control the output current ON and OFF. The brightness is
adjustable if the ON and OFF frequency is fast enough. Because of the high accuracy design of PWM threshold
in TPS92623-Q1, TI recommends a resistor divider on the PWM pin to set the SUPPLY threshold higher than
LED forward voltage plus required headroom voltage as shown in 图 7-2. The headroom voltage is basically the
summation of V(DROPOUT) and V(CS_REG). When the voltage on the PWM pin is higher than VIH(PWM), the output
current is turned ON. However, when the voltage on the PWM is lower than VIL(PWM), the output current is turned
OFF. The SUPPLY threshold voltage can be calculated by using 方程式2.
4.5 V to 40 V
TPS92623-Q1
R(RES1)
SUPPLY
RES1
R(SNS1)
R(SNS2)
R(SNS3)
IN1
C(SUPPLY)
OUT1
RES2
OUT2
RES3
OUT3
GND
R(RES2)
IN2
IN3
R(RES3)
DIAGEN
PWM1
PWM2
PWM3
R(UPPER)
R(LOWER)
FAULT
*: 10 nF ceramic capacitor is recommended for each OUT to GND
图7-2. Application Schematic for Supply Control LED Brightness
≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _PWM_ th _rising)
IH(PWM)
R(LOWER)
(2)
where
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• VIH(PWM) = 1.26 V (maximum)
7.3.7 Diagnostics
The TPS92623-Q1 device provides advanced diagnostics and fault-protection features for automotive exterior
lighting systems. The device is able to detect and protect fault from LED-string short-to-GND, LED-string open-
circuit and junction over-temperature scenarios. The device also supports a one-fails–all-fail fault bus design
that can flexibly fit different regulatory requirements.
7.3.7.1 LED Short-to-GND Detection
The TPS92623-Q1 device has LED short-to-GND detection. The LED short-to-GND detection monitors the
output voltage when the output current is enabled. Once a short-to-GND LED failure is detected, the device turns
off the faulty channel and retries automatically, regardless of the state of the PWM input. If the retry mechanism
detects the removal of the LED short-to-GND fault, the device resumes to normal operation.
The TPS92623-Q1 monitors both V(OUTx) voltage and V(RESx) voltage of each channel and compares it with the
internal reference voltage to detect a short-to-GND failure. If V(OUTx) or V(RESx) voltage falls below V(SG_th_falling)
longer than the deglitch time of t(SG_deg), the device asserts the short-to-GND fault and pulls low the FAULT pin.
During the deglitching time period, if V(OUTx) and V(RESx) rises above V(SG_th_rising), the timer is reset.
Once the TPS92623-Q1 has asserted a short-to-GND fault, the device turns off the faulty output channel and
retries automatically with a small current. During retrying, the device sources a small current I(Retry) from
SUPPLY to OUT and RES to pull up the LED loads continuously. After auto-retry detects output voltage rising
above V(SG_th_rising), it clears the short-to-GND fault and resumes to normal operation. 图 7-3 illustrates the
timing for LED short-circuit detection, protection, retry and recovery.
SUPPLY
PWMx
Short
Removed
LED
Short
Short
Removed
VOUTx
IOUTx
LED
Short
tt7t
tt7t
tt7t
I(retry)
tt8t
tt8t
tt9t
FAULT
No external
pullup
图7-3. LED Short-to-GND Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图7-3 is described in Electrical Characteristics.
7.3.7.2 LED Open-Circuit Detection
The TPS92623-Q1 device has LED open-circuit detection. The LED open-circuit detection monitors the output
voltage when the current output is enabled. The LED open-circuit detection is only enabled when DIAGEN is
HIGH. A short-to-battery fault is also detected and recognized as an LED open-circuit fault.
The TPS92623-Q1 monitors dropout-voltage differences between the IN and OUT pins for each LED channel
when PWM is HIGH. The voltage difference V(INx) – V(OUTx) is compared with the internal reference voltage
V(OPEN_th_rising) to detect an LED open-circuit incident. If V(OUTx) rises and causes V(INx) – V(OUTx) less than the
V(OPEN_th_rising) voltage longer than the deglitch time of t(OPEN_deg), the device asserts an open-circuit fault. After
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a LED open-circuit failure is detected, the internal constant-current sink pulls down the FAULT pin voltage.
During the deglitch time period, if V(OUTx) falls and makes V(INx) – V(OUTx) larger than V(OPEN_th_falling), the
deglitch timer is reset.
The TPS92623-Q1 shuts down the output current regulation for the error channel after LED open-circuit fault is
detected. The device sources a small current I(Retry) from SUPPLY to OUT and RES when DIAGEN input is logic
High. After the fault condition is removed, the device resumes normal operation and releases the FAULT pin. 图
7-4 illustrates the timing for LED open-circuit detection, protection, retry and recovery.
SUPPLY
PWMx
Open
Removed
LED
Open
Open
Removed
VOUTx
IOUTx
LED
Open
tt6t
tt6t
tt6t
I(retry)
tt8t
tt8t
tt9t
FAULT
No external
pullup
图7-4. LED Open-Circuit Detection and Recovery Timing Diagram
The detailed information and value of each time period in 图7-4 is described in Electrical Characteristics.
7.3.7.3 LED Open-Circuit Detection Enable (DIAGEN)
The TPS92623-Q1 device supports the DIAGEN pin with an accurate threshold to disable the LED open-circuit.
The DIAGEN pin can be used to enable or disable LED open-circuit detection based on SUPPLY pin voltage
sensed by an external resistor divider as illustrated in 图 7-5. When the voltage applied on DIAGEN pin is higher
than the threshold VIH(DIAGEN), the device enables LED open-circuit detection. When V(DIAGEN) is lower than the
threshold VIL(DIAGEN), the device disables LED open-circuit detection.
Only LED open-circuit detection can be disabled by pulling down the DIAGEN pin. The LED short-to-GND
detection and overtemperature protection cannot be turned off by pulling down the DIAGEN pin. The SUPPLY
threshold voltage can be calculated by using 方程式3.
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4.5 V to 40 V
TPS92623-Q1
R(RES1)
R(RES2)
R(RES3)
SUPPLY
RES1
R(SNS1)
R(SNS2)
R(SNS3)
IN1
OUT1
RES2
OUT2
RES3
OUT3
GND
C(SUPPLY)
IN2
IN3
R(UPPER)
DIAGEN
PWM1
PWM2
PWM3
R(LOWER)
FAULT
*: 10 nF ceramic capacitor is recommended for each OUT
图7-5. Application Schematic For DIAGEN
≈
∆
«
’
R(UPPER)
V
= V
ì 1+
∆
÷
÷
◊
(SUPPLY _DIAGEN_ th _ falling)
IL(DIAGEN)
R(LOWER)
(3)
where
• VIL(DIAGEN) = 1.045 V (minimum)
7.3.7.4 Overtemperature Protection
The TPS92623-Q1 device monitors device junction temperature. When the junction temperature reaches
thermal shutdown threshold T(TSD), the output shuts down. After the junction temperature falls below T(TSD)
–
T(TSD_HYS), the device recovers to normal operation. During overtemperature protection, the FAULT pin is pulled
low.
7.3.7.5 Low Dropout Operation
When the supply voltage drops below LED string total forward voltage plus headroom voltage at required
current, the TPS92623-Q1 device operates in low-dropout conditions to deliver current output as close as
possible to target value. The actual current output is less than preset value due to insufficient headroom voltage
for power transistor. As a result, the voltage across the sense resistor fails to reach the regulation target. The
headroom voltage is the summation of V(DROPOUT) and V(CS_REG)
.
If the TPS92623-Q1 is designed to operate in low-dropout condition, the open-circuit diagnostics must be
disabled by pulling the DIAGEN pin voltage lower than VIL(DIAGEN). Otherwise, the TPS92623-Q1 detects an
open-circuit fault and reports a fault on the FAULT pin. The DIAGEN pin is used to avoid false diagnostics due to
low supply voltage.
7.3.8 FAULT Bus Output with One-Fails-All-Fail
During normal operation, The FAULT pin of TPS92623-Q1 is weakly pulled up by an internal pullup current
source, I(FAULT_pullup). If any fault scenario occurs, the FAULT pin is strongly pulled low by the internal pulldown
current sink, I(FAULT_pulldown) to report out the fault alarm.
Meanwhile, the TPS92623-Q1 also monitors the FAULT pin voltage internally. If the FAULT pin of the TPS92623-
Q1 is pulled low by external current sink below VIL(FAULT), the current output is turned off even though there is no
fault detected on owned outputs. The device does not resume to normal operation until the FAULT pin voltage
rises above VIH(FAULT)
.
Based on this feature, the TPS92623-Q1 device is able to construct a FAULT bus by tying FAULT pins from
multiple TPS92623-Q1 devices to achieve one-fails-all-fail function as 图 7-6 showing. The lower side
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TPS92623-Q1 (B) detects any kind of LED fault and pulls low the FAULT pin. The low voltage on FAULT pin is
detected by upper side TPS92623-Q1 (A) because the FAULT pins are connected of two devices. The upper
side TPS92623-Q1 (A) turns off all output current for each channel as a result. If the FAULT pins of each
TPS92623-Q1 are all connected to drive the base of an external PNP transistor as illustrated in 图 7-7, the one-
fails–all-fail function is disabled and only the faulty channel device is turned off.
TPS92623-Q1
A
TPS92623-Q1
A
VCC
VCC
VSUPPLY
VSUPPLY
10 kΩ
20 kΩ
20 kΩ
FAULT
FAULT
10 kΩ
Logic
Logic
10 kΩ
TPS92623-Q1
B
VCC
TPS92623-Q1
B
VCC
FAULT
FAULT
Logic
Logic
图7-7. FAULT Bus for One-Fails-Others-On
图7-6. FAULT Bus for One-Fails-All-Fail
Application
Application
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7.3.9 FAULT Table
表7-1. Fault Table With DIAGEN = HIGH (Full Function)
FAULT BUS
STATUS
DETECTION CONTROL DEGLITCH
MECHANISM INPUT TIME
FAULT HANDLING
ROUTINE
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
Constant-
current
pulldown
Open-circuit or
short-to-supply
V
(IN) –V(OUT) <
PWMx = H t(OPEN_deg)
Auto recovery
V(OPEN_th_rising)
V(OUT)
V(SG_th_falling)
OR
V(RES)
V(SG_th_falling)
<
Device turns failed
output off and retries
with constant current
I(retry), ignoring the PWM
input.
FAULT = H
Constant-
current
pulldown
Short-to-ground
PWMx = H t(SG_deg)
Auto recovery
Auto recovery
<
Constant-
current
pulldown
Device turns all output
channels off.
Overtemperature TJ > T(TSD)
t(TSD_deg)
Device turns all remained channels off and keeps retry on the failed channels. After the Fault pin is
released, all channels are turned on after t(FAULT_recovery) time.
Fault is detected
FAULT = L
No fault is
detected
Device turns all output channels off.
表7-2. Fault Table With DIAGEN = LOW (Full Function)
FAULT BUS
STATUS
DETECTION CURRENT DEGLITCH
MECHANISM OUTPUT TIME
FAULT HANDLING
FAULT
RECOVERY
FAULT TYPE
FAULT BUS
ROUTINE
Open-circuit or
short-to-supply
Ignored
V(OUT)
V(SG_th_falling)
OR
V(OUT)
V(SG_th_falling)
<
Device turns output off
and retries with constant
current I(retry), ignoring
the PWM input.
Constant-
current
pulldown
Short-to-ground
PWMx = H t(SG_deg)
Auto recovery
Auto recovery
FAULT = H
<
Constant-
current
pulldown
Device turns all output
channels off.
Overtemperature TJ > T(TSD)
t(TSD_deg)
Device turns all remained channels off and keeps retry on the failed channels. After the Fault pin is
released, all channels are turned on after t(FAULT_recovery) time.
Fault is detected
FAULT = L
No fault is
detected
Device turns all output channels off.
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7.3.10 LED Fault Summary
表7-3. LED Connection Fault Summary
Case 1
Case 2
Case 3
Case 4
LED Short-to-GND Fault
LED Short-to-GND Fault
LED Short-to-GND Fault
LED Short-to-GND Fault
Case 5
Case 6
Case 7
Case 8
LED Open Fault
No Fault
LED Open Fault
LED Open Fault
Case 9
Case 10
Case 11
Case 12
No Fault
No Fault
LED Open Fault
No Fault
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7.3.11 IO Pins Inner Connection
SUPPLY
SUPPLY
PWMx
DIAGEN
GND
GND
图7-8. PWMx Pins
图7-9. DIAGEN Pin
SUPPLY
INx
FAULT
OUTx
GND
GND
图7-10. FAULT Pin
图7-11. OUTx Pins
INx
SUPPLY
RESx
INx
GND
OUTx
图7-12. RESx Pins
图7-13. INx Pins
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7.4 Device Functional Modes
7.4.1 Undervoltage Lockout, V(SUPPLY) < V(POR_rising)
When the device is in undervoltage lockout status, the TPS92623-Q1 device disables all functions until the
supply rises above the V(POR_rising) threshold.
7.4.2 Normal Operation V(SUPPLY) ≥4.5 V
The device drives an LED string in normal operation. With enough voltage drop across SUPPLY and OUT, the
device is able to drive the output in constant-current mode.
7.4.3 Low-Voltage Dropout Operation
When the device drives an LED string in low-dropout operation, if the V(DROPOUT) is less than the open-circuit
detection threshold, the device can report a false open-circuit fault. TI recommends only enabling the open-
circuit detection when the voltage across the IN and OUTx is higher than the maximum voltage of LED open
rising threshold to avoid a false open-circuit detection.
7.4.4 Fault Mode
When the TPS92623-Q1 detects a fault, the device tries to pull down the FAULT pin with a constant current. If
the FAULT bus is pulled down, the device switches to fault mode and consumes a fault current of I(FAULT)
.
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8 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
8.1 Application Information
In automotive lighting applications, thermal performance and LED diagnostics are always design challenges for
linear LED drivers.
The TPS92623-Q1 device is capable of detecting LED open-circuit and LED short-circuits. To increase current
driving capability, the TPS92623-Q1 device supports using an external shunt resistor to help dissipate heat as
the following section, Thermal Sharing Resistor (OUTx and RESx), describes. This method provides a low-cost
solution of using external resistors to minimize thermal accumulation on the device itself due to large voltage
difference between input voltage and LED string forward voltage, while still keeping high accuracy of the total
current output.
8.2 Typical Applications
8.2.1 BCM Controlled Rear Lamp With One-Fails-All-Fail Setup
The multiple TPS92623-Q1 devices are capable of driving different functions for automotive rear lamp including
stop, turn indicator, tail, fog, reverse and center-high-mounted-stop-lamp. The one-fails-all-fail single lamp mode
can be easily achieved by FAULT bus by shorting the FAULT pins.
BCM_STOP
TPS92623-Q1
10 nF
10 nF
10 nF
R(RES1)
R(RES2)
R(RES3)
C(SUPPLY)
SUPPLY
RES1
R(SNS1)
R(SNS2)
R(SNS3)
IN1
OUT1
RES2
OUT2
RES3
OUT3
GND
IN2
IN3
R1
R2
DIAGEN
PWM1
PWM2
PWM3
V(SUPPLY)
20 k
R3
R4
FAULT
图8-1. Typical Application Schematic
8.2.1.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 9 strings with 3 LEDs in each string are required to achieve
stop function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, while the minimum forward
voltage, VF_MIN is 1.9 V. The current requirement for each LED, I(LED) is 130 mA. The LED brightness and ON
and OFF control is manipulated by body control module (BCM) directly by connecting and disconnecting the
power supply to the LED load.
8.2.1.2 Detailed Design Procedure
Step 1: Determine the current sensing resistor, R(SNSx), by using 方程式4.
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V
(CS _REG)
R(SNSx)
=
I(OUTx _ Tot)
(4)
where
• V(CS_REG) = 150 mV (typical)
• I(OUTx_Tot) = 130 mA
According to design requirements, output current for each channel is same so that the R(SNS1) = R(SNS2)
(SNS3) = 1.15 Ω. Two resistors in parallel can be used to achieve equivalent resistance when sense resistor is
not a standard decade resistance value.
=
R
Step 2: Design the current distribution between I(OUTx) and I(RESx), and calculate the current sharing resistor,
R(RESx), by using 方程式 5. The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path. TI recommends the current sharing resistor R(RESx) to consume 50% of the total current at typical supply
operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(5)
where
• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 130 mA
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) and R(RES3) is 85.4 Ω when V(OUTx) is
typical 3 × 2.15 V = 6.45 V.
Step 3: Design the threshold voltage of SUPPLY to enable the LED open-circuit diagnostics, and calculate
voltage divider resistor value for R1 and R2 on DIAGEN pin.
The maximum forward voltage of LED-string is 3 × 2.5 V = 7.5 V. To avoid the open-circuit fault reported in low-
dropout operation conditions, additional headroom between SUPPLY and OUTx must be considered.
TheTPS92623-Q1 device must disable open-circuit detection when the supply voltage is below LED-string
maximum forward voltage plus V(OPEN_th_rising) and V(CS_REG). The voltage divider resistor, R1 and R2 value can
be calculated by 方程式6.
≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(6)
where
• V(OPEN_th_rising) = 420 mV (maximum)
• V(CS_REG) = 156 mV
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
The calculated result for R1 is 67.3 kΩwhen V(OUTx) maximum voltage is 7.5 V and V(CS_REG) is 156 mV.
Step 4: Design the threshold voltage of SUPPLY to turn on and off each channel of LED, and calculate voltage
divider resistor value for R3 and R4 on PWM input pin.
The minimum forward voltage of LED string is 3 × 1.9 V = 5.7 V. To make sure the current output on each of
LED-string is normal, each LED-string must be turned off when SUPPLY voltage is lower than LED minimum
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required forward voltage plus dropout voltage between INx to OUTx and V(CS_REG). The voltage divider resistor,
R3 and R4 value can be calculated by 方程式7.
≈
’
÷
◊
V
+ V
+ V
(DROPOUT)
(CS _REG) (OUTx)
R =
-1 ìR
∆
∆
«
÷
3
4
V
IH(PWM)
(7)
where
• V(DROPOUT) = 300 mV (typical)
• V(CS_REG) = 156 mV (maximum)
• VIH(PWM) = 1.26 V (maximum)
• R4 = 10 kΩ(recommended)
The calculated result for R3 is 38.9 kΩwhen V(OUTx) minimum voltage is 5.7 V and V(CS_REG) is 156 mV.
8.2.1.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
图8-3. 200-Hz Supply Dimming 80% Brightness
图8-2. 200-Hz Supply Dimming 20% Brightness
8.2.2 Independent PWM Controlled Rear Lamp By MCU
The TPS92623-Q1 device is able to drive the each current output channel independently by PWM input at
PWM1, PWM2 and PWM3 pins. The PWM input signals comes from MCU to achieve sequential turn indicator
feature.
BCM_TURN
TPS92623-Q1
10 nF
10 nF
10 nF
R(RES1)
R(RES2)
R(RES3)
C(SUPPLY)
SUPPLY
RES1
R(SNS1)
R(SNS2)
R(SNS3)
IN1
OUT1
RES2
OUT2
RES3
OUT3
GND
IN2
R1
R2
IN3
DIAGEN
PWM1
PWM2
PWM3
VCC
20 k
GPIO
GPIO
GPIO
GPIO
FAULT
MCU
图8-4. Typical Application Schematic
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8.2.2.1 Design Requirements
Input voltage range is from 9 V to 16 V, and a total 6 strings with 2 LEDs in each string are required to achieve
turn indicator function. The LED maximum forward voltage, VF_MAX is 2.5 V for each LED, however the minimum
forward voltage, VF_MIN is 1.9 V. Each LED current is 130 mA and each output channel is independent controlled
by MCU through individual GPIO.
8.2.2.2 Detailed Design Procedure
Step 1: Determine the current sensing resistor, R(SNSx) by using 方程式8.
V
(CS _REG)
R(SNSx)
=
I(OUTx _ Tot)
(8)
where
• V(CS_REG) = 150 mV (typical)
• I(OUTx_Tot) = 130 mA
According to design requirements, output current for each channel is same so that the calculated R(SNS1)
=
R(SNS2) = R(SNS3)= 1.15 Ω.
Step 2: Design the current distribution between I(OUTx) and I(RESx), and calculate the current sharing resistor,
R(RESx), by using 方程式 9. The R(RESx) value actually decides the current distribution for I(OUTx) path and I(RESx)
path, basic principle is to design the R(RESx) to consume appropriate 50% total power dissipation at typical
supply operating voltage.
V
- V
(OUTx)
(SUPPLY)
R(RESx)
=
I(OUTx _ Tot) ì0.5
(9)
where
• V(SUPPLY) = 12 V (typical)
• I(OUTx_Tot) = 130 mA (maximum)
The calculated result for R(RESx) resistor value including R(RES1), R(RES2) and R(RES3) is 117 Ω when V(OUTx) is
typical 2 × 2.2 V = 4.4 V.
Step 3: Design the threshold voltage of SUPPLY to enable the LED open-circuit, and calculate voltage divider
resistor value for R1 and R2 on DIAGEN pin.
The maximum forward voltage of LED-string is 2 × 2.5 V = 5 V. To avoid the open-circuit fault reported in low-
dropout operation conditions, additional headroom between SUPPLY and OUTx must be considered.
TheTPS92623-Q1 device must disable open-circuit detection when the supply voltage is below LED-string
maximum forward voltage plus V(OPEN_th_rising) and V(CS_REG). The voltage divider resistor, R1 and R2 value can
be calculated by 方程式10.
≈
’
÷
◊
V
+ V
+ V
(OUTx)
(OPEN_ th_rising)
(CS _REG)
R =
-1 ìR
∆
∆
«
÷
1
2
V
IL(DIAGEN)
(10)
where
• V(OPEN_th_rising) = 420 mV (maximum)
• V(CS_REG) = 156 mV (maximum)
• VIL(DIAGEN) = 1.045 V (minimum)
• R2 = 10 kΩ(recommended)
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The calculated result for R1 is 43.4 kΩwhen V(OUTx) maximum voltage is 5 V and V(CS_REG) is 156 mV.
8.2.2.3 Application Curves
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
Ch1 = V(SUPPLY)
Ch4 = V(OUT1)
Ch2 = V(DIAGEN)
Ch5 = I(OUT_Tot)
Ch3 = V(PWM1)
图8-5. 200-Hz PWM Dimming at 80% Duty Cycle
图8-6. 600-Hz PWM Dimming at 20% Duty Cycle
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9 Power Supply Recommendations
The TPS92623-Q1 is designed to operate from an automobile electrical power system within the range specified
in Power Supply. The V(SUPPLY) input must be protected from reverse voltage and voltage dump condition over
40 V. The impedance of the input supply rail must be low enough that the input current transient does not cause
drop below LED string required forward voltage. If the input supply is connected with long wires, additional bulk
capacitance can be required in addition to normal input capacitor.
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10 Layout
10.1 Layout Guidelines
Thermal dissipation is the primary consideration for TPS92623-Q1 layout.
• TI recommends large thermal dissipation area in both top and bottom layers of PCB. The copper pouring
area in same layer with TPS92623-Q1 footprint must directly cover the thermal pad land of the device with
wide connection as much as possible. The copper pouring in opposite PCB layer or inner layers must be
connected to thermal pad directly through multiple thermal vias.
• TI recommends to place R(RESx) resistors away from the TPS92623-Q1 device with more than 20-mm
distance, because R(RESx) resistors are dissipating some amount of the power as well as the TPS92623-Q1.
Place two heat source components apart to reduce the thermal accumulation concentrated at small PCB
area. The large copper pouring area is also required surrounding the R(RESx) resistors for helping thermal
dissipating.
The noise immunity is the secondary consideration for TPS92623-Q1 layout.
• TI recommends to place the noise decoupling capacitors for SUPPLY pin as close as possible to the pins.
• TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track
to SUPPLY pin.
10.2 Layout Example
GND
GND
R(RES1)
LED String1
C(SUPPLY)
GND
SUPPLY
IN1
RES1
OUT1
RES2
OUT2
RES3
OUT3
GND
R(RNS1)
R(RNS2)
R(RNS3)
IN2
R(RES2)
LED String2
IN3
DIAGEN
PWM1
PWM2
PWM3
DIAGEN
PWM1
PWM2
PWM3
FAULT
GND
C(OUT3)
R(RES3)
LED String3
GND
GND
图10-1. TPS92623-Q1 Example Layout Diagram
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11 Device and Documentation Support
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
11.3 Trademarks
PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
7-Jul-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92623QPWPRQ1
ACTIVE
HTSSOP
PWP
16
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
92623Q
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS92623QPWPRQ1 HTSSOP PWP
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
HTSSOP PWP 16
SPQ
Length (mm) Width (mm) Height (mm)
356.0 356.0 35.0
TPS92623QPWPRQ1
2000
Pack Materials-Page 2
PACKAGE OUTLINE
PWP0016C
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
6.6
6.2
C
TYP
A
PIN 1 INDEX
AREA
0.1 C
SEATING
PLANE
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
B
0.19
0.1
C A B
SEE DETAIL A
(0.15) TYP
2X 0.95 MAX
NOTE 5
4X (0.3)
8
9
2X 0.23 MAX
NOTE 5
2.31
1.75
17
0.25
GAGE PLANE
1.2 MAX
0.15
0.05
0.75
0.50
0 -8
16
1
A
20
DETAIL A
TYPICAL
THERMAL
PAD
2.46
1.75
4224559/B 01/2019
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0016C
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 9
(2.46)
16X (1.5)
METAL COVERED
BY SOLDER MASK
SYMM
1
16X (0.45)
16
(1.2) TYP
(2.31)
(R0.05) TYP
SYMM
17
(5)
NOTE 9
(0.6)
14X (0.65)
(
0.2) TYP
VIA
9
8
SOLDER MASK
DEFINED PAD
(1) TYP
SEE DETAILS
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
SOLDER MASK DETAILS
4224559/B 01/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
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EXAMPLE STENCIL DESIGN
PWP0016C
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(2.46)
BASED ON
0.125 THICK
STENCIL
16X (1.5)
METAL COVERED
BY SOLDER MASK
1
16
16X (0.45)
(R0.05) TYP
SYMM
(2.31)
17
BASED ON
0.125 THICK
STENCIL
14X (0.65)
9
8
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
2.75 X 2.58
2.46 X 2.31 (SHOWN)
2.25 X 2.11
0.125
0.15
0.175
2.08 X 1.95
4224559/B 01/2019
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
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