TPS92665QPHPRQ1 [TI]

具有内部时钟的 16 通道低噪声 LED 矩阵管理器 | PHP | 48 | 125 to -40;


型号：	TPS92665QPHPRQ1
厂家：	TEXAS INSTRUMENTS
描述：	具有内部时钟的 16 通道低噪声 LED 矩阵管理器 \| PHP \| 48 \| 125 to -40 时钟
文件：	总9页 (文件大小：1186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TPS92665-Q1

ZHCSR12 –SEPTEMBER 2022

TPS92665-Q1 具有高级诊断功能和集成振荡器的

汽车类低噪声16 通道LED 矩阵管理器

1 特性

3 说明

• 符合面向汽车应用的AEC-Q100 标准

TPS92665 LED 矩阵管理器器件通过提供单个像素级

LED 控制来实现完全动态的自适应照明解决方案。该

器件的 4 个串联集成开关各有 4 个子灯串，可绕过单

个 LED。各个子灯串允许器件接受单个或多个电流

源。

– 1 级：–40°C 至+125°C 环境温度

– 器件HBM 分类等级H1C

– 器件CDM 分类等级C5

• 功能安全型

– 可提供用于功能安全系统设计的文档

• 16 个集成旁路开关

TPS92665 具有一个内部振荡器。内部振荡器可通过内

部低噪声 LVDS 发送器和接收器块共享给其他系统器

件。多点通用异步接收器发送器 (UART) 串行接口与

TPS92664、TPS92667、TPS92662x 和 TPS92663x

器件兼容。具有多路复用输入的板载 ADC 可对所有

LED 通道以及 IC 内核温度进行采样。该 ADC 还对专

用ADC 输入进行采样，可用于系统温度补偿、LED 分

级和编码。

– 可编程10 位PWM 调光

– 可编程压摆率控制

– LED 开路检测和保护

– 单LED 短路检测

• UART 串行通信

– 用于系统时钟的内部振荡器

– 用于同步器件的LVDS 时钟驱动器

– 兼容上一代LMM

TPS92665 包含寄存器，可用于对灯串中单个 LED 的

相移和脉冲宽度进行编程以及报告 LED 开路、短路故

障和功能参数。

– 兼容CAN 收发器

• 集成ADC

封装信息

封装⁽¹⁾

– 每个开关的LED 电压

– 内核温度

封装尺寸（标称值）

器件型号

– 2x 通用ADC 输入（兼容热敏电阻）

PHP（HTQFP、

48）

TPS92665-Q1

7.00mm × 7.00mm

2 应用

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

• 汽车前照灯系统

• ADB 或无眩光远光灯

• 连续转向、动画日间行车灯

VBAT

BOOST

BUCK

TPS92665

NTC

ADCx

CP_TOP

CP_BOT

SYNC

CLK_H

CLK_L

Other 66x

devices

MCU

….. ….. …..

UART

CAN

MTP

UART

ECU

4 x 4

series

switches

VDD

GND

简化版应用

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLUSF31

TPS92665-Q1

ZHCSR12 –SEPTEMBER 2022

www.ti.com.cn

4 Device and Documentation Support

4.1 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

4.2 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

4.3 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

4.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

4.5 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

Submit Document Feedback

Product Folder Links: TPS92665-Q1

TPS92665-Q1

ZHCSR12 –SEPTEMBER 2022

www.ti.com.cn

5 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Submit Document Feedback

Product Folder Links: TPS92665-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

25-Sep-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS92665QPHPRQ1

ACTIVE

HTQFP

PHP

1000 RoHS & Green

NIPDAU

Level-3-260C-168 HR

125 to -40

TPS92665Q

Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

GENERIC PACKAGE VIEW

PHP 48

7 x 7, 0.5 mm pitch

TQFP - 1.2 mm max height

QUAD FLATPACK

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4226443/A

www.ti.com

PACKAGE OUTLINE

PHP0048L

PowerPAD^TMHTQFP - 1.2 mm max height

SCALE 1.900

PLASTIC QUAD FLATPACK

7.2

6.8

NOTE 3

PIN 1 ID

7.2

6.8

9.2

TYP

8.8

NOTE 3

0.27

48X

44X 0.5

0.17

0.08

C A B

4X 5.5

1.2 MAX

SEATING PLANE

SEE DETAIL A

(0.13)

TYP

0.08

0.25

(1)

GAGE PLANE

5.00

4.23

0.75

0.45

0.15

0.05

0 -7

DETAIL A

TYPICAL

5.00

4.23

4X (0.25) NOTE 5

4226599/A 05/2021

PowerPAD is a trademark of Texas Instruments.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MS-026.

5. Feature may not be present.

www.ti.com

EXAMPLE BOARD LAYOUT

PHP0048L

PowerPAD^TMHTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(

6.5)

NOTE 10

(5)

SYMM

SOLDER MASK

DEFINED PAD

48X (1.6)

48X (0.3)

(5)

SYMM

(1.1 TYP)

(8.5)

44X (0.5)

(R0.05) TYP

(

0.2) TYP

VIA

METAL COVERED

BY SOLDER MASK

(1.1 TYP)

SEE DETAILS

(8.5)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:8X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

METAL UNDER

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4226599/A 05/2021

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,

Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).

9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged

or tented.

10. Size of metal pad may vary due to creepage requirement.

www.ti.com

EXAMPLE STENCIL DESIGN

PHP0048L

PowerPAD^TMHTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

(5)

BASED ON

0.125 THICK STENCIL

SEE TABLE FOR

SYMM

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES

48X (1.6)

48X (0.3)

(8.5)

(5)

BASED ON

0.125 THICK

STENCIL

SYMM

44X (0.5)

(R0.05) TYP

METAL COVERED

BY SOLDER MASK

(8.5)

SOLDER PASTE EXAMPLE

EXPOSED PAD

100% PRINTED SOLDER COVERAGE BY AREA

SCALE:8X

STENCIL

THICKNESS

SOLDER STENCIL

OPENING

0.1

5.59 X 5.59

5.00 X 5.00 (SHOWN)

4.56 X 4.56

0.125

0.150

0.175

4.23 X 4.23

4226599/A 05/2021

NOTES: (continued)

11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

12. Board assembly site may have different recommendations for stencil design.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

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TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS92665QPHPRQ1 [TI]

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