TPSM846C23MOLR [TI]

4.5V 至 15V 输入、0.35V 至 2.0V 输出、35A PMBus 电源模块 | MOL | 59 | -40 to 105;
TPSM846C23MOLR
型号: TPSM846C23MOLR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

4.5V 至 15V 输入、0.35V 至 2.0V 输出、35A PMBus 电源模块 | MOL | 59 | -40 to 105

电源电路
文件: 总93页 (文件大小:2039K)
中文:  中文翻译
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TPSM846C23  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
TPSM846C23 4.5V 15V 输入、0.35V 2V 输出、35A PMBus™电源  
模块  
1 特性  
3 说明  
1
完全集成 PMBus™电源解决方案  
TPSM846C23 是一款 35A 固定频率降压电源模块,兼  
PMBus 并支持 PMBus 命令,可实现对电源稳压器  
主要功能的配置、控制和监控。该模块包含控制器、电  
MOSFET、电感器和相关组件,采用坚固耐用的耐  
热增强型表面贴装式封装。用户提供输入和输出电容器  
及少量其他无源组件即可设置该模块的运行参数。这两  
个模块可配置为并联工作,以提供最高可达 70A 的两  
相电源解决方案。  
TPSM846C24 引脚兼容(非 PMBus)  
可堆叠,最高可达 70A,具有电流共享  
输出电压范围:0.35V 2V  
输出电压准确度高达 0.5%  
15mm × 16mm 尺寸(最大高度 6.4mm)  
300kHz 1MHz 开关频率  
可与外部时钟保持同步  
差动遥感  
PMBus 接口提供输出电压、UVLO、软启动、软停  
止、过电流和热关断等参数的转换器配置。该接口还具  
有遥测支持功能,可报告实际输出电压、输出电流和器  
件温度。此外还支持标准 PMBus 警告故障功能。该  
器件支持 PMBus 通信,速度最高可达 400kHz,并在  
PMBus 1.3 规范下支持一小组命令。  
电源正常输出  
预偏置输出单调启动  
PMBus 遥测:电流、电压、温度  
可编程保护和故障响应  
可编程 UVLO、软启动/停止、延迟  
工作 IC 结温范围:-40°C +125°C  
工作环境温度范围:-40°C +105°C  
增强的热性能:8.7°C/W  
该器件采用 15mm × 16mm 组件尺寸,可轻松焊接到  
印刷电路板上,并可实现紧凑的负载点设计。  
器件信息(1)  
符合 EN55022 A 类辐射发射标准  
使用 TPSM846C23 并借助 WEBENCH® 电源设计  
创建定制设计方案  
器件型号  
封装  
封装尺寸(标称值)  
TPSM846C23  
MOL (59)  
15.00mm × 16.00mm  
(1) 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品  
附录。  
2 应用  
紧凑型 PCI/PCI 快速接口/PXI 快速接口  
空白  
空白  
宽带和通信基础设施  
自动化测试和医疗设备  
DSP FPGA 负载点 应用  
简化电路原理图  
效率与输出电流间的关系  
VIN  
VIN  
VS+  
100  
95  
90  
85  
80  
75  
70  
VOUT  
VOUT  
PGND  
PGND  
VS-  
TPSM846C23  
DATA  
CLK  
PMBUS  
INTERFACE  
ALERT  
CNTL  
DIFFO  
FB  
ADDR1  
ADDR0  
65  
PGND AGND  
VOUT = 1.8 V  
VIN = 5 V  
VIN = 12 V  
60  
55  
0
5
10  
15  
20  
25  
30  
35  
Copyright © 2018, Texas Instruments Incorporated  
Output Current (A)  
Eff1  
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确  
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。  
English Data Sheet: SLVSDF3  
 
 
 
 
 
TPSM846C23  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
www.ti.com.cn  
目录  
7.5 Register Maps......................................................... 31  
Application and Implementation ........................ 72  
8.1 Typical Application .................................................. 72  
Power Supply Recommendations...................... 76  
1
2
3
4
5
6
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 5  
6.1 Absolute Maximum Ratings ...................................... 5  
6.2 ESD Ratings ............................................................ 5  
6.3 Recommended Operating Conditions....................... 5  
6.4 Thermal Information ................................................. 6  
6.5 Electrical Characteristics........................................... 6  
6.6 Switching Characteristics.......................................... 8  
6.7 Programmable Characteristics.................................. 8  
6.8 Typical Characteristics (VIN = 12 V)........................ 10  
6.9 Typical Characteristics (VIN = 5 V).......................... 11  
Detailed Description ............................................ 12  
7.1 Overview ................................................................. 12  
7.2 Functional Block Diagram ....................................... 12  
7.3 Feature Description................................................. 13  
7.4 Device Functional Modes........................................ 31  
8
9
10 Layout................................................................... 77  
10.1 Layout Guidelines ................................................. 77  
10.2 Layout Example .................................................... 77  
10.3 Package Specifications......................................... 79  
10.4 EMI........................................................................ 79  
10.5 Mounting and Thermal Profile Recommendation.. 81  
11 器件和文档支持 ..................................................... 82  
11.1 器件支持................................................................ 82  
11.2 文档支持................................................................ 82  
11.3 接收文档更新通知 ................................................. 82  
11.4 社区资源................................................................ 82  
11.5 ....................................................................... 82  
11.6 静电放电警告......................................................... 82  
11.7 术语表 ................................................................... 82  
12 机械、封装和可订购信息....................................... 83  
12.1 Tape and Reel Information ................................... 83  
7
4 修订历史记录  
注:之前版本的页码可能与当前版本有所不同。  
Changes from Revision E (September 2018) to Revision F  
Page  
Changed HBM ESD from 500 V to 1000 V ........................................................................................................................... 5  
Changes from Revision D (January 2018) to Revision E  
Page  
Updated PCB Top-side Layout Recommendation figure ..................................................................................................... 77  
Changes from Revision C (August 2017) to Revision D  
Page  
首次发布生产数据产品说明书 ................................................................................................................................................ 1  
Changes from Revision B (March 2017) to Revision C  
Page  
产品说明书标记为预告信息”- 可提供原型样片 ...................................................................................................................... 1  
将器件的最大高度更改为 6.4mm ............................................................................................................................................ 1  
Added link to the parallel EVM and user's guide ................................................................................................................. 27  
Added the EMI section ........................................................................................................................................................ 79  
Changes from Revision A (March 2017) to Revision B  
Page  
特性 中添加了器件高度 ...................................................................................................................................................... 1  
Changes from Original (March 2017) to Revision A  
Page  
Corrected 3 pin names on the 19 .................................................................................................................................... 72  
2
Copyright © 2017–2019, Texas Instruments Incorporated  
 
TPSM846C23  
www.ti.com.cn  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
5 Pin Configuration and Functions  
MOL Package  
59-Pin BQFN  
Top View  
40 39 38 37 36 35 34 33 32 31 30 29 28  
41  
27  
VOUT  
PH  
55  
56  
VOUT  
PGND  
PGND  
PGND  
VIN  
PH  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
54  
PH  
57  
PGND  
PH  
PGND  
VIN  
PH  
53  
VIN  
PH  
58  
PGND  
VIN  
DNC  
ALERT  
CLK  
BP3  
BP6_RTN  
BP6  
59  
PGND  
DATA  
ADDR0  
ADDR1  
VINBP  
BP_RTN  
PGOOD  
NC  
1
15  
NC  
2
3
4
5
6
7
8
9
10 11 12 13 14  
Copyright © 2017–2019, Texas Instruments Incorporated  
3
TPSM846C23  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
www.ti.com.cn  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NAME  
NO.  
Connect a resistor from this pin to AGND to set the low-order 3 bits of the desired PMBus address.  
Do not leave this pin floating. See PMBus Address.  
ADDR0  
17  
I
I
Connect a resistor from this pin to AGND to set the high-order 3 bits of the desired PMBus address.  
Do not leave this pin floating. See PMBus Address.  
ADDR1  
16  
AGND  
10  
20  
51  
G
O
G
Analog ground for the controller circuitry. This pin is internally connected to PGND.  
PMBus ALERT pin. See PMBus specification.  
ALERT  
BP_RTN  
Return path for VINBP and BP3. This pin is internally connected to PGND, pad 59.  
Output of the internal 3.3-V regulator. Bypass this pin with a minimum of 2.2-µF to BP_RTN. Can be  
used as a pullup termination voltage for PGOOD and PMBus signals.  
BP3  
BP6  
47  
49  
O
O
Output of the internal 6.5-V regulator that powers the driver stage of the device. Bypass this pin with  
a minimum of 2.2-µF to BP6_RTN.  
BP6_RTN  
CLK  
48  
19  
12  
9
G
I
Power ground return path for BP6 bypass capacitor.  
PMBus CLK pin. See PMBus specification.  
PMBus CNTL pin. See PMBus specification.  
Output of the error amplifier.  
CNTL  
I
COMP  
DATA  
O
I/O  
18  
PMBus DATA pin. See PMBus specification.  
Output of the remote sense differential amplifier. This provides remote sensing for output voltage  
reporting and the voltage control loop.  
DIFFO  
DNC  
6
O
Do Not Connect. Do not connect these pins to AGND, PGND, to another DNC pin, or to any other  
voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad.  
8, 21, 30, 31  
FB  
7
2
I
I
Feedback pin for the control loop.  
ISHARE  
Current sharing signal for parallel operation.  
Not Connected. These pins are internally isolated from any signal and all other pins. Each pin must  
be soldered to a pad on the PCB. These pins can be left isolated or connected to AGND or PGND.  
NC  
1, 15  
32, 33, 34,  
35,  
36,42, 43, 54,  
56, 57, 58, 59  
Power ground of the device. This is the return current path for the power stage of the device.  
Connect these pins to the bypass capacitors associated with VIN and VOUT. Connect pads 56, 57,  
58, and 59 to the PCB ground planes using multiple vias for optimal thermal performance. All pins  
should be connected together externally with a copper plane or pour directly under the device.  
PGND  
G
Power good indicator. This pin is an open-drain output and will assert low during any fault/warn  
conditions. See Power Good Indicator section for details. Requires a pullup resistor.  
PGOOD  
PH  
52  
O
O
22, 23, 24,  
25, 26, 27,  
28, 29  
Phase switch node. Do not connect any external components to these pins or tie them to a pin of  
another function.  
Frequency-setting resistor. To operate the device at its default switching frequency, do not connect to  
this pin. To operate at a different switching frequency, connect a resistor from this pin to AGND.  
RT  
13  
14  
I
I
RT resistor select. To operate the device at its default switching frequency, connect this pin to  
AGND. To operate at a different switching frequency, let this pin float.  
RT_SEL  
Frequency synchronization pin. In a stand-alone application or as the Master device in a parallel  
configuration, the SYNC pin is configured as a SYNC-IN pin and power conversion is synchronized  
to the rising edge of a 50% duty cycle external clock applied to this pin.  
SYNC  
11  
I/O  
For a Slave device in a parallel configuration, power conversion is synchronized to the falling edge of  
the incoming clock.  
44, 45,  
46, 53  
VIN  
I
I
Input switching voltage pins. These pins supply voltage to the power switches of the converter.  
Input power to the controller circuitry. Bypass this pin with a minimum of 1 µF to BP_RTN. This pin is  
internally connected to VIN.  
VINBP  
VOUT  
VS+  
50  
37, 38, 39,  
40, 41, 55  
Output voltage. These pins are connected to the internal output inductor. Connect these pins to the  
output load and connect external bypass capacitors between these pins and PGND.  
O
I
Positive input of the remote amplifier. Connect this pin to VOUT at the load for best voltage  
regulation. Do not let this pin float.  
4
Negative input of the remote amplifier. Connect this pin to ground at the load for best voltage  
regulation. Do not let this pin float.  
VS–  
5
3
I
VSHARE  
I/O  
Voltage sharing signal for parallel operation.  
4
Copyright © 2017–2019, Texas Instruments Incorporated  
TPSM846C23  
www.ti.com.cn  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
6 Specifications  
6.1 Absolute Maximum Ratings  
Over operating ambient temperature range (unless otherwise noted)(1)  
PARAMETER  
MIN  
MAX  
18  
UNIT  
VIN  
–0.3  
VIN < 2-ms transient  
VIN–PH (VIN TO PH differentially)  
19  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–1  
25  
Input voltage  
ADDR0, ADDR1, FB  
3.6  
5.5  
7
V
CLK, DATA  
VS+, VS–, RT, CNTL, SYNC, PGOOD, ISHARE, RT_SEL  
BP6_RTN, BP_RTN, AGND  
0.3  
25  
PH  
PH < 100-ns transient  
–5  
25  
Output voltage  
BP6, COMP, DIFFO, VSHARE  
–0.3  
–0.3  
–0.3  
–40  
–40  
–55  
7
V
ALERT  
BP3  
5.5  
3.6  
125  
105  
150  
500  
10  
Operating IC junction temperature, TJ  
Operating ambient temperature, TA  
Storage temperature, Tstg  
Mechanical shock  
°C  
°C  
G
Mechanical vibration  
G
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
6.2 ESD Ratings  
VALUE  
±1000  
±1500  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
Over operating ambient temperature range (unless otherwise noted)  
PARAMETER  
MIN  
NOM  
12  
MAX  
15  
UNIT  
VIN  
4.5  
Input voltage  
SYNC  
3.3  
6.5  
V
PGOOD pull-up voltage  
3.3  
5.5  
Output voltage  
Output current  
Frequency  
VOUT  
IOUT  
0.35  
0
2.0  
V
A
35  
300  
–40  
–40  
500  
1000  
105  
125  
kHz  
°C  
°C  
Operating ambient temperature  
Operating IC junction temperature  
Temperature  
Copyright © 2017–2019, Texas Instruments Incorporated  
5
TPSM846C23  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
www.ti.com.cn  
6.4 Thermal Information  
TPSM846C23  
MOL (QFN)  
59 PINS  
8.7  
THERMAL METRIC(1)  
UNIT  
RθJA  
ψJT  
Junction-to-ambient thermal resistance(2)  
Junction-to-top characterization parameter(3)  
Junction-to-board characterization parameter(4)  
°C/W  
°C/W  
°C/W  
0.9  
ψJB  
4.3  
(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.  
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 100 mm × 100 mm, 6-layer PCB with 2 oz.  
copper and natural convection cooling. Additional airflow reduces RθJA  
.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a  
procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is  
the temperature of the top of the device.  
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a  
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is  
the temperature of the board 1mm from the device.  
6.5 Electrical Characteristics  
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT(max), ƒSW = 500 kHz,  
CIN1 = 4 × 22 µF, 25 V, 1210 ceramic, CIN2 = 2 × 330 µF electrolytic bulk, COUT1 = 4 × 47 µF, 6.3 V, 1210 ceramic,  
COUT2 = 2 × 470 µF, 6.3-V polymer bulk (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT VOLTAGE (VIN  
)
VIN  
IVIN  
Input voltage  
Over IOUT range  
4.5  
15  
12  
V
Input operating current  
Non-switching supply current  
7.7  
mA  
OUTPUT VOLTAGE (VOUT  
)
RSET = Not loaded, VOUT_SCALE_LOOP = 1  
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5  
RSET = Not loaded, VOUT_SCALE_LOOP = 1.0  
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5  
RSET = Not loaded, VOUT_SCALE_LOOP = 1  
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5  
RSET = Not loaded, TJ = 25°C, IOUT = 0 A  
RSET = 10 kΩ, 1%, TJ = 25°C, IOUT = 0 A(4)  
0°C < TJ < 85°C, IOUT = 0 A(2)  
500  
1
mV  
V
Factory default setting  
0.35  
0.7  
1.65  
2(3)  
V
VOUT programmable range(1)(2)  
VOUT programmable step size  
Setpoint voltage tolerance  
Temperature variation  
V
1.953  
3.906  
mV  
mV  
VOUT  
–1%  
–1.5%  
–0.5%  
–1%  
1%  
1.5%  
0.5%  
1%  
–40°C < TJ < 125°C, IOUT = 0 A(2)  
Line regulation  
4.5 V < VIN < 15 V, IOUT = 0 A  
±0.05%  
±0.2%  
13  
Load regulation  
Output voltage ripple  
Over IOUT range, using remote sense  
20-MHz bandwidth  
mV  
OUTPUT CURRENT  
IOUT Output current  
Natural Convection. See SOA graph for derating.  
Factory default setting  
0
5
35  
52  
A
A
42  
37  
IOCF  
Overcurrent fault threshold  
Programmable range  
Factory default setting  
IOCWF  
Overcurrent warning threshold  
Overcurrent fault accuracy  
Output current share accuracy  
A
Programmable range  
4
–15%  
–15%  
–3%  
50  
15%  
15%  
3%  
IOCF(acc)  
ISH(acc)  
IOUT 20 A  
(IOUT1 – IOUT2) ÷ ITOTAL, IOUT 20 A per module(5)  
(IOUTx – ITOTAL) ÷ 2, IOUT < 20 A per module(5)  
(1) Output voltage is set by the VOUT_COMMAND PMBus command.  
(2) Specified by design. Not production tested.  
(3) While the PMBus permits setting the output voltage higher than 2 V, this product is not designed to be operated beyond this limit.  
(4) The stated limit of the set-point tolerance includes the tolernace of both the internal voltage reference and the internal adjustment  
resistor. The overall output voltage tolerance will be affected by the tolerance of the external RSET resistor.  
(5) Specified by correlation. Not production tested.  
6
Copyright © 2017–2019, Texas Instruments Incorporated  
TPSM846C23  
www.ti.com.cn  
ZHCSG68F MARCH 2017REVISED JANUARY 2019  
Electrical Characteristics (continued)  
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT(max), ƒSW = 500 kHz,  
CIN1 = 4 × 22 µF, 25 V, 1210 ceramic, CIN2 = 2 × 330 µF electrolytic bulk, COUT1 = 4 × 47 µF, 6.3 V, 1210 ceramic,  
COUT2 = 2 × 470 µF, 6.3-V polymer bulk (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
POWER GOOD (PGOOD) AND OVERVOLTAGE / UNDERVOLTAGE THRESHOLD  
VIN = 4 V, VOUT = 0 V, IPGOOD = 5 mA  
0.3  
0.8  
VPG(OL)  
PGOOD output low voltage  
V
VIN = 0 V, IPGOOD = 80 µA  
VPG(rise)  
PGOOD threshold VOUT rising  
PGOOD threshold VOUT falling  
Overvoltage warning threshold  
Overvoltage fault threshold  
Undervoltage warning threshold  
Undervoltage fault threshold  
95  
105  
112  
117  
88  
%VO  
%VO  
%VO  
%VO  
%VO  
%VO  
VPG(fall)  
VOVWARN  
VOVFAULT  
VUVWARN  
VUVFAULT  
VOUT setting = 1.2 V  
83  
PERFORMANCE  
VOUT = 0.8 V  
VOUT = 1.2 V  
VOUT = 1.8 V  
VOUT = 0.8 V  
VOUT = 1.2 V  
VOUT = 1.8 V  
VOUT over/undershoot  
83%  
87%  
90%  
84%  
88%  
91%  
60  
VIN = 12 V, IOUT = 25 A  
(6)  
Efficiency  
VIN = 5 V, IOUT = 25 A  
10 A / µs load step from  
25% to 75% of IOUT(max)  
COUT = 1000 µF,  
RC = 1 kΩ, CC = 1 nF  
mV  
µs  
,
Recovery time  
60  
40  
60  
27  
60  
10 A / µs load step from  
25% to 75% of IOUT(max)  
COUT = 2000 µF,  
RC = 665 Ω, CC = 1.5 nF  
VOUT over/undershoot  
Recovery time  
mV  
µs  
,
(6)  
Transient response  
10 A / µs load step from  
25% to 75% of IOUT(max)  
COUT = 4000 µF,  
VOUT over/undershoot  
Recovery time  
mV  
µs  
,
RC = 499 Ω, CC = 2.2 nF  
INTERNAL LOAD (BP6, BP3)  
VBP6  
BP6 regulator output voltage  
7.5V VIN 15 V, switching  
(VVIN – VBP6), VIN = 4.5 V, switching  
VIN 4.5 V  
5.85  
3
6.4  
3.2  
6.95  
400  
3.4  
V
mV  
V
VBP6(DO)  
VBP3  
Dropout voltage  
BP3 regulator output voltage  
CAPACITANCE  
ceramic  
88  
µF  
µF  
µF  
µF  
mΩ  
CIN  
External input capacitance  
non-ceramic  
ceramic(7)  
660  
188  
940  
COUT  
External output capacitance  
4000(8)  
5
non-ceramic(7)  
ESR(9)  
(6) Specified by design. Not production tested.  
(7) The minimum required output capacitance consists of 4 × 47-µF ceramic capacitors and 2 × 470-µF, 10-mΩ ESR (5 mΩ equivalent).  
(8) The proper frequency compensation network values are determined by the total amount of output capacitance. (See the Setting the  
Compensation Network section.)  
(9) The maximum ESR refers to the combined equivalent ESR of all non-ceramic output capacitors. For example, two 10-mΩ ESR  
capacitors have a combined equivalent ESR of 5 mΩ.  
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6.6 Switching Characteristics  
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT max, ƒSW = 500 kHz, CIN1 = 4 × 22-µF  
25-V 1210 ceramic, CIN2 = 2 × 330-µF electrolytic bulk, COUT1 = 4 × 47-µF, 6.3-V 1210 ceramic, COUT2 = 2 × 470-µF, 6.3-V  
polymer bulk (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
OSCILLATOR  
Factory default setting. RT_SEL  
grounded, No RT resistor  
425  
500  
575  
RT = 68.1 k, 1% RT_SEL open  
RT = 20.0 k, 1% RT_SEL open  
Adjustment range  
255  
850  
300  
300  
345  
1150  
1000  
ƒSW  
Switching frequency  
kHz  
1000  
PWM  
tON-MIN  
tOFF-MIN  
Minimum on time(1)  
Minimum off time(1)  
50  
100  
560  
ns  
ns  
fSW = 1MHz  
515  
SYNCHRONIZATION  
VIH(sync)  
VIL(sync)  
DSYNC  
ƒSYNC  
High-level input voltage  
2.2  
V
V
Low-level input voltage  
Sync input duty cycle  
Sync frequency range  
0.8  
ƒSW = 300 kHz to 1 MHz  
50%  
300  
1000  
kHz  
(1) Specified by design. Not production tested.  
6.7 Programmable Characteristics  
Over operating free-air temperature range, VIN = 12 V, ƒSW = 500 kHz (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SOFT START (PMBus Programmable)  
Factory default setting  
3
ms  
ms  
TON_RISE  
Soft-start time  
Programmable range, 16 discrete settings(1)(2)  
Accuracy, TON_RISE = 3 ms  
Factory default setting(3)  
Programmable range, 16 discrete settings(1)(3)  
Accuracy(1)  
0
100  
–10%  
10%  
0
0
ms  
ms  
TON_MAX_  
FAULT_LIMIT  
Upper limit in time to power up  
the output  
0
100  
–10%  
10%  
Factory default setting  
ms  
ms  
(1)  
TON_DELAY  
Turnon delay  
Programmable range, 16 discrete settings  
0
100  
Accuracy(1)  
–10%  
10%  
SOFT STOP (PMBus Programmable)  
Factory default setting  
3
0
ms  
ms  
(1)(2)  
TOFF_FALL  
Soft-start time  
Turnon delay  
Programmable range, 16 discrete settings  
0
100  
Accuracy, TOFF_FALL= 1 ms  
Factory default setting(2)  
Programmable range, 16 discrete settings(1)  
Accuracy(1)  
–10%  
10%  
ms  
ms  
TOFF_DELAY  
0
100  
–10%  
10%  
UNDERVOLTAGE LOCKOUT (UVLO) (PMBus Programmable)  
Factory default setting  
4.5  
4
V
V
(1)  
VIN_ON  
Input turnon voltage  
Programmable range, 15 discrete settings  
Accuracy  
4.25  
–5%  
7.75  
5%  
Factory default setting  
V
V
VIN_OFF  
Input turnoff voltage  
Programmable range, 15 discrete settings(1)  
Accuracy(1)  
4
7.5  
–10%  
10%  
TEMPERATURE SENSE AND THERMAL SHUTDOWN  
(1) Specified by design. Not production tested.  
(2) Setting TON_RISE or TOFF_FALL to 0 ms programs the device to bring its output voltage up to the programmed regulation value or  
down to 0 V as quickly as possible, resulting in an effective TON_RISE and TOFF_FALL time of 1 ms.  
(3) Setting TON_MAX_FAULT_LIMIT to 0 disables the TON_MAX_FAULT response.  
8
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Programmable Characteristics (continued)  
Over operating free-air temperature range, VIN = 12 V, ƒSW = 500 kHz (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Junction thermal shutdown  
temperature(1)  
TSD  
145  
160  
°C  
THYST  
Thermal shutdown hysteresis(1)  
25  
°C  
°C  
°C  
°C  
°C  
Factory default setting  
145  
OT_FAULT  
_LIMIT  
Overtemperature fault limit  
Programmable range(1)  
Factory default setting  
Programmable range(1)  
120  
165  
120  
20  
OT_WARN  
_LIMIT  
Overtemperature warning limit  
100  
15  
140  
25  
Overtemperature fault warning  
hysteresis(1)  
TOT(hys)  
°C  
MEASUREMENT SYSTEM  
Output voltage measurement  
MVOUT(rng)  
MVOUT(acc)  
MVOUT(lsb)  
MIOUT(mg)  
0
5.8  
2%  
V
range(1)  
Output voltage measurement  
accuracy(1)  
VOUT = 1.2 V  
–2%  
Output voltage measurement bit  
resolution(1)  
2 – 9  
V
A
Output current measurement  
range(1)  
0
52  
I
OUT 20 A  
–15%  
–3  
15%  
3
Output current measurement  
accuracy  
MIOUT(acc)  
3 A IOUT 20 A  
A
Output current measurement bit  
resolution(1)  
MIOUT(lsb)  
MTSNS(mg)  
MTSNS(acc)  
MTSNS(lsb)  
62.5  
mA  
Internal temperature sense  
range(1)  
–40  
–5  
165  
5
°C  
°C  
°C  
Internal temperature sense  
accuracy(1)  
–40°C TJ 165°C  
Internal temperature sense bit  
resolution(1)  
1
PMBus INTERFACE  
Logic-high voltage on CLK,  
DATA, CNTL  
VIH(PMBUS)  
1.35  
–10  
V
Logic-low voltage on CLK,  
DATA, CNTL  
VIL(PMBUS)  
VhysCNTL  
IIH(PMBUS)  
0.8  
10  
V
Hysteresis on CNTL  
170  
mV  
µA  
Input high-level current into CLK,  
DATA  
Input low-level current into CLK,  
DATA  
IIL(PMBUS)  
ICNTL  
–10  
5
10  
10  
µA  
µA  
V
CNTL pin pullup current  
Output low-level voltage on  
DATA, ALERT  
VOL(PMBUS)  
VIN > 4.5 V, IOL(PMBUS) = 4 mA  
0.4  
Output high-level leakage current  
into DATA, ALERT  
IOH(PMBUS)  
Voltage on DATA, ALERT = 5.5 V  
10  
µA  
Output low-level sinking current  
into DATA, ALERT  
IOL(PMBUS)  
ƒPMBUS  
Voltage on DATA, ALERT< 0.4 V  
Slave mode  
4
mA  
PMBus operating frequency  
10  
400  
kHz  
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6.8 Typical Characteristics (VIN = 12 V)  
VIN = 12 V, TA = 25°C, fSW = 500 kHz (unless otherwise specified). Safe operating area curves were measured using a Texas  
Instruments evaluation module (EVM).  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
10  
8
1.8 V  
1.2 V  
0.8 V  
6
4
2
1.8 V  
1.2 V  
0.8 V  
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D001  
D002  
VIN = 12 V  
fSW = 500 kHz  
VIN = 12 V  
fSW = 500 kHz  
1. Efficiency vs Output Current  
2. Power Dissipation vs Output Current  
115  
105  
95  
20  
18  
16  
14  
12  
10  
8
1.8 V  
1.2 V  
0.8 V  
85  
75  
65  
55  
400LFM  
200LFM  
100LFM  
Nat conv  
45  
35  
6
25  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D003  
D007  
VIN = 12 V  
fSW = 500 kHz  
VIN = 12 V  
VOUT = 0.8 V  
4. Safe Operating Area  
fSW = 500 kHz  
3. Voltage Ripple vs Output Current  
115  
105  
95  
85  
75  
65  
55  
45  
35  
25  
115  
105  
95  
85  
75  
65  
55  
400LFM  
400LFM  
200LFM  
100LFM  
Nat conv  
45  
200LFM  
100LFM  
Nat conv  
35  
25  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D009  
D008  
VIN = 12 V  
VOUT = 1.8 V  
6. Safe Operating Area  
fSW = 500 kHz  
VIN = 12 V  
VOUT = 1.2 V  
5. Safe Operating Area  
fSW = 500 kHz  
10  
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6.9 Typical Characteristics (VIN = 5 V)  
VIN = 5 V, TA = 25°C, fSW = 500 kHz (unless otherwise specified). Safe operating area curves were measured using a Texas  
Instruments evaluation module (EVM).  
100  
95  
90  
85  
80  
75  
70  
65  
60  
55  
10  
8
1.8 V  
1.2 V  
0.8 V  
6
4
2
1.8 V  
1.2 V  
0.8 V  
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D004  
D005  
VIN = 5 V  
fSW = 500 kHz  
VIN = 5 V  
fSW = 500 kHz  
7. Efficiency vs Output Current  
8. Power Dissipation vs Output Current  
20  
18  
16  
14  
12  
10  
8
115  
105  
95  
1.8 V  
1.2 V  
0.8 V  
85  
75  
65  
55  
400LFM  
200LFM  
100LFM  
Nat conv  
45  
35  
6
25  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D006  
D010  
VIN = 5 V  
fSW = 500 kHz  
VIN = 5 V  
VOUT = 0.8 V  
10. Safe Operating Area  
fSW = 500 kHz  
9. Voltage Ripple vs Output Current  
115  
105  
95  
115  
105  
95  
85  
85  
75  
75  
65  
65  
55  
55  
400LFM  
200LFM  
100LFM  
Nat conv  
400LFM  
200LFM  
100LFM  
45  
45  
35  
35  
Nat conv  
25  
25  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Output Current (A)  
Output Current (A)  
D011  
D012  
VIN = 5 V  
VOUT = 1.2 V  
fSW = 500 kHz  
VIN = 5 V  
VOUT = 1.8 V  
fSW = 500 kHz  
11. Safe Operating Area  
12. Safe Operating Area  
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7 Detailed Description  
7.1 Overview  
The TPSM846C23 device is a PMBus-1.3-compliant, 35-A, high-performance, synchronous buck-power module,  
enabling high-power density and minimal PCB area. This device implement the industry-standard fixed switching  
frequency, voltage-mode control with input feed-forward topology that responds instantly to input voltage change.  
This device can be synchronized to the external clock to eliminate beat noise and reduce EMI and EMC.  
Monotonic prebias capability eliminates concerns about damaging sensitive loads. Two TPSM846C23 devices  
can be paralleled together to provide up to 70-A load. Current sensing for overcurrent protection, current  
reporting, and current sharing between two devices are implemented by sampling a small portion of the power-  
stage current, which provides accurate information independent of the device temperature. The integrated  
PMBus interface capability provides precise current monitoring, voltage monitoring, and internal die-temperature  
monitoring, as well as many user-programmable configuration options including adaptive voltage scaling (AVS)  
function through standard VOUT_COMMAND on the PMBus.  
7.2 Functional Block Diagram  
RT_SEL  
RT  
SYNC  
BP6  
BP3  
VINBP  
TPSM846C23  
40.2 kO  
Linear  
Regulators  
Oscillator  
VS+  
VS-  
Remote  
Sense  
Amplifier  
VIN  
DIFFO  
10 kO  
Power  
Stage  
and  
Comp  
PH  
FB  
Driver  
Control  
VOUT  
VREF  
+
COMP  
VSHARE  
ISHARE  
Current  
Share  
PGND  
Temp  
Sensing  
VREF  
BP6_RTN  
AGND  
Analog  
Inputs and  
ADC  
CLK  
PMBus 1.3  
Interface  
and  
DATA  
BP_RTN  
IC  
Interface  
ALRT  
CNTL  
Commands  
EEPROM  
ADDR0 ADDR1  
PGOOD  
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7.3 Feature Description  
7.3.1 PMBus  
7.3.1.1 PMBus General Description  
Timing and electrical characteristics of the PMBus interface specification can be found in the PMB Power  
Management Protocol Specification, Part 1, revision 1.3 available at http://pmbus.org. The TPSM846C23 device  
supports both the 100-kHz and 400-kHz bus timing requirements. The devices do not stretch pulses when  
communicating with the master device.  
Communication over the PMBus interface can support the packet error checking (PEC) scheme if desired. If the  
master supplies clock (CLK pin) pulses for the PEC byte, PEC is used. If the CLK pulses are not present before  
a STOP, the PEC is not used.  
The devices support a subset of the commands in the PMBus 1.3 Power Management Protocol Specification.  
See Supported PMBus Commands for more information  
The devices contain nonvolatile memory that stores configuration settings and scale factors. However, the device  
does not automatically save the settings programmed into this nonvolatile memory. The STORE_DEFAULT_ALL  
(11h) or STORE_USER_ALL (15h) command must be used to commit the current settings to nonvolatile memory  
as device defaults. The settings that are capable of being stored in nonvolatile memory are noted in the detailed  
command descriptions.  
7.3.1.2 PMBus Address  
The PMBus specification requires that each device connected to the PMBus have a unique address on the bus.  
The TPSM846C23 device has 64 possible addresses (0 through 63 in decimal) that can be assigned by  
connecting resistors from the ADDR0 and ADDR1 pins to AGND. The address is set in the form of two octal  
digits (0 to 7), one digit for each pin. ADDR1 is the high order digit, and ADDR0 is the low-order digit. These  
address selection resistors must be 1% tolerance or better. Using resistors other than the recommended values  
can result in devices responding to adjacent addresses. The PMBus address, in decimal, is given by the  
following expression:  
PMBus Address = 8 × ADDR1(level) + ADDR0(level)  
The E96 series resistors with no worse than 1% tolerance suggested for each digit value are shown in 1.  
1. Required Address Resistors  
LEVEL  
RESISTOR VALUE (kΩ)  
0
1
2
3
4
5
6
7
7.15  
14  
22.6  
34.8  
51.1  
78.7  
121  
187  
The TPSM846C23 device also detects values that are out of range on the ADDR0 and ADDR1 pins. If the device  
detects that either pin has an out-of-range resistance connected to it, the device continues to respond to PMBus  
interface commands, but does so at address 127 decimal, which is outside of the possible programmed  
addresses. It is possible, but not recommended, to use the device in this condition, especially if other devices are  
present on the bus or if another device could possibly occupy the 127 decimal address.  
Certain addresses in the I2C address space are reserved for special functions, and it is possible to set the  
address of the devices to respond to these addresses. The user is responsible for knowing which of these  
reserved addresses are in use in a system and for setting the address of the devices accordingly so as not to  
interfere with other system operations. The devices can be set to respond to the global call address or 0. TI  
recommends not setting the devices to this address unless the user is certain that no other devices respond to  
this address and that the overall bus is not affected by having such an address present.  
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7.3.1.3 PMBus Connections  
The PMBus interface implemented in the TPSM846C23 device consists of four signal lines: CLK, DATA, ALERT,  
and CNTL. The electrical specifications for the hardware interface follow the specifications given in System  
Management Bus (SMBus) specification V2.0. The module supports both the 100-kHz and 400-kHz bus speeds.  
For 400-kHz operation, observe the high-power DC specifications found in section 3.1.3 of the SMBus  
specification.  
Communication over the PMBus using packet error checking (PEC) is supported but is optional. If the master  
supplies CLK pulses for the PEC byte, the PEC is used. If CLK pulses are not present before a STOP, the PEC  
is not used. When data is transmitted over the bus, the lowest order byte is sent first, and the highest order byte  
is sent last. Within any byte, the most significant bit (MSB) is sent first, and the least significant bit (LSB) is sent  
last.  
The TPSM846C23 supports the SMBALERT response protocol. This protocol is a mechanism by which a slave  
(the TPSM846C23) can alert the bus master, via the ALERT pin, that it must communicate. The master  
processes this event and simultaneously accesses all slaves on the bus (that support the protocol) through the  
alert response address. Only the slave that caused the alert acknowledges this request. The host performs a  
modified receive byte operation to get the slave address. At this point, the master can use the PMBus status  
commands to query the slave that caused the alert. For more information on the SMBus alert protocol, see the  
SMBus specification.  
The CNTL signal is an input signal on the PMBus. It can be used to turn the power-conversion function of the  
module on and off in conjunction with commands received over the bus. It can be configured as an active high or  
active low signal through the ON_OFF_CONFIG command. The CNTL signal is programmed at the factory to be  
an active high signal; that is, the CNTL pin must be pulled high for power conversion to occur. The customer can  
change this configuration if desired.  
For more information, see the PMBus Interface section of the Programmable Characteristics table.  
7.3.1.4 Supported PMBus Commands  
The commands listed in 2 are implemented as described to conform to the PMBus 1.3 specification. 2 also  
lists the default for the bit behavior and register values.  
2. Supported PMBus Commands and Default Values  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.3  
COMMAND NAME  
PMBus COMMAND DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
Can be configured through ON_OFF_CONFIG  
to be used to turn the output on and off with or  
without input from the CTRL pin.  
OPERATION is not used to  
enable regulation  
01h  
02h  
OPERATION  
00h  
16h  
No  
Configures the combination of CNTL pin input  
and OPERATION command for turning output  
on and off.  
ON_OFF_CONFIG  
CNTL only. Active High  
Yes  
Clears all fault status registers to 0x00 and  
releases SMBALERT.  
03h  
10h  
11h  
12h  
15h  
16h  
CLEAR_FAULTS  
Write-only  
n/a  
00h  
n/a  
n/a  
n/a  
n/a  
No  
Yes  
No  
No  
No  
No  
Used to control writing to the volatile operating  
memory (PMBus and restore from EEPROM).  
WRITE_PROTECT  
Allow writes to all registers  
Write-only  
Stores all current storable register settings into  
EEPROM as new defaults.  
STORE_DEFAULT_ALL  
RESTORE_DEFAULT_ALL  
STORE_USER_ALL  
RESTORE_USER_ALL  
Restores all storable register settings from  
EEPROM.  
Write-only  
Stores all current storable register settings into  
EEPROM as new defaults.  
Write-only  
Restores all storable register settings from  
EEPROM.  
Write-only  
Read-only. PMBus v1.3, 400  
kHz, PEC and SMBus Alert  
Response Protocol supported  
Provides a way for a host system to determine  
key PMBus capabilities of the device.  
19h  
CAPABILITY  
B0h  
No  
1Bh  
20h  
21h  
SMBALERT_MASK  
VOUT_MODE  
Mask Warn or Fault status bits  
Read-only output mode indicator.  
Default regulation setpoint  
Mask PGOOD only  
Fixed at 2–9 (1.953 mV/count)  
500 mV  
n/a  
17h  
Yes  
No  
VOUT_COMMAND  
0100h  
Yes  
14  
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2. Supported PMBus Commands and Default Values (接下页)  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.3  
COMMAND NAME  
PMBus COMMAND DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
If VOUT_SCALE_LOOP = 1:  
VOUT_MAX restores to 1.65 V  
034Dh  
069Ah  
0C00h  
D03Ch  
F004h  
00B3h  
0166h  
02CCh  
F012h  
F010h  
E000h  
Sets the maximum output voltage. VOUT_MAX  
imposes a higher bound to any attempted VOUT  
setting.  
If VOUT_SCALE_LOOP = 0.5:  
VOUT_MAX restores to 3.3 V  
24h  
VOUT_MAX  
No  
If VOUT_SCALE_LOOP = 0.25:  
VOUT_MAX restores to 6 V  
Sets the rate at which the output should change  
voltage.  
27h  
29h  
VOUT_TRANSITION_RATE  
VOUT_SCALE_LOOP  
1 mV/us  
1
No  
Sets output sense scaling ratio for main control  
loop.  
Yes  
If VOUT_SCALE_LOOP = 1:  
VOUT_MIN restores to 0.35 V  
Sets the minimum output voltage. VOUT_MIN  
imposes a lower bound to any attempted VOUT  
setting.  
If VOUT_SCALE_LOOP = 0.5:  
VOUT_MIN restores to 0.7 V  
2Bh  
VOUT_MIN  
No  
If VOUT_SCALE_LOOP = 0.25:  
VOUT_MIN restores to 1.4 V  
Sets value of input voltage at which the device  
must start power conversion.  
35h  
36h  
39h  
VIN_ON  
4.5 V  
Yes  
Yes  
Yes  
Sets value of input voltage at which the device  
must stop power conversion.  
VIN_OFF  
4 V  
Can be set to null out offsets in the current  
sensing circuit.  
IOUT_CAL_OFFSET  
0.0000 A  
41h  
45h  
VOUT_OV_FAULT_RESPONSE  
VOUT_UV_FAULT_RESPONSE  
Sets output overvoltage fault response.  
Sets output undervoltage fault response.  
Restart  
Ignore  
BFh  
3Fh  
Yes  
Yes  
Sets the limit value of the output current that  
causes an overcurrent fault condition.  
46h  
47h  
4Ah  
4Fh  
50h  
IOUT_OC_FAULT_LIMIT  
IOUT_OC_FAULT_RESPONSE  
IOUT_OC_WARN_LIMIT  
OT_FAULT_LIMIT  
42 A  
F854h  
FFh  
Yes  
Yes  
No  
Sets response to output overcurrent faults to  
latch-off, hiccup mode or ignore.  
Hiccup/Restart  
37 A (87.5% of OCF)  
145°C  
Sets the limit value of the output current that  
causes an overcurrent warning condition.  
F84Ah  
0091h  
BFh  
Sets the limit value of the sensed temperature  
that causes an overtemperature fault condition.  
Yes  
Yes  
Sets response to over temperature faults to  
latch-off, hiccup mode or ignore.  
OT_FAULT_RESPONSE  
Hiccup/Restart  
Sets the limit value of the sensed temperature  
that causes an overtemperature warning  
condition.  
51h  
60h  
61h  
OT_WARN_LIMIT  
TON_DELAY  
TON_RISE  
120°C (OTF – 25°C)  
0078h  
0000h  
0003h  
No  
Sets the turnon delay.  
0 ms  
3 ms  
Yes  
Yes  
Sets the time from when the output starts to rise  
until the voltage has entered the regulation  
band.  
Sets an UPPER limit, in milliseconds, that the  
unit can attempt to power up the output without  
62h  
TON_MAX_FAULT_LIMIT  
reaching the output undervoltage fault limit. The Disabled  
time begins counting as the device enters the  
soft-start period.  
0000h  
No  
63h  
64h  
65h  
TON_MAX_FAULT_RESPONSE  
TOFF_DELAY  
Sets the soft-start timeout fault response.  
Sets the turnoff delay.  
Restart  
0 ms  
BFh  
Yes  
Yes  
Yes  
0000h  
0003h  
TOFF_FALL  
Sets the soft stop fall time.  
3 ms  
Returns one byte summarizing the most critical  
faults.  
78h  
79h  
7Ah  
7Bh  
7Ch  
STATUS_BYTE  
STATUS_WORD  
STATUS_VOUT  
STATUS_IOUT  
STATUS_INPUT  
Current status  
Current status  
Current status  
Current status  
Current status  
No  
No  
No  
No  
No  
Returns two bytes summarizing fault and  
warning conditions.  
Returns one byte detailing if an output fault or  
warning has occurred.  
Returns one byte detailing if an overcurrent fault  
or warning has occurred.  
Returns one byte of information relating to the  
status of the converter's input related faults.  
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15  
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2. Supported PMBus Commands and Default Values (接下页)  
DEFAULT  
REGISTER  
VALUE  
CMD  
CODE  
PMBus 1.3  
COMMAND NAME  
PMBus COMMAND DESCRIPTION  
DEFAULT BEHAVIOR  
NVM  
Returns one byte detailing if a sensed  
temperature fault or warning has occurred.  
7Dh  
7Eh  
STATUS_TEMPERATURE  
STATUS_CML  
Current status  
Current status  
No  
No  
Returns one byte containing PMBus serial  
communication faults.  
Returns one byte detailing if internal  
overtemperature or address detection fault has  
occurred.  
80h  
STATUS_MFR_SPECIFIC  
Current status  
No  
8Bh  
8Ch  
READ_VOUT  
READ_IOUT  
Returns the output voltage in volts.  
Returns the output current in amps.  
Read only  
Current status  
Current status  
No  
No  
Read only  
Read-only  
Returns the sensed die temperature in degrees  
Celsius.  
8Dh  
98h  
READ_TEMPERATURE_1  
PMBUS_REVISION  
Current status  
33h  
No  
No  
Returns PMBus revision to which the device is  
compliant.  
PMBus 1.3  
This read-only block read command returns a  
single word (16 bits) with the unique device  
code identifier for each device for which this  
device can be configured. The BYTE_COUNT  
field in the block read command is 2 (indicating  
2 bytes follow): low byte first, then high byte.  
ADh  
AEh  
IC_DEVICE_ID  
TPS546C23  
4623h  
0001h  
No  
No  
This read-only block read command returns a  
single word (16 bits) with the unique device  
revision identifier. The BYTE_COUNT field in  
the block read command is 2 (indicating 2 bytes  
follow): low byte first, then high byte.  
IC_DEVICE_REV  
Read only  
D0h  
D4h  
MFR_SPECIFIC_00  
User scratch pad.  
0000h  
0000h  
Yes  
Yes  
VREF_TRIM (MFR_SPECIFIC_04)  
(D4h)  
Applies a fixed offset voltage to the error  
amplifier reference voltage (EA_REF).  
Fixed offset of 0 mV  
If RSMHI_VAL = 0:  
STEP_VREF_MARGIN_HIGH  
will restore to 17.6 mV  
0009h  
000Fh  
FFF7h  
FFF1h  
STEP_VREF_MARGIN_HIGH  
(MFR_SPECIFIC_05) (D5h)  
Increases the value of the reference voltage by  
shifting the reference higher.  
D5h  
No  
If RSMHI_VAL = 1:  
STEP_VREF_MARGIN_HIGH  
will restore to 29.3 mV  
If RSMLO_VAL = 0:  
STEP_VREF_MARGIN_LOW will  
restore to –17.6 mV  
STEP_VREF_MARGIN_LOW  
(MFR_SPECIFIC_06) (D6h)  
Decreases the value of the reference voltage by  
shifting the reference lower.  
D6h  
D7h  
No  
If RSMLO_VAL = 1:  
STEP_VREF_MARGIN_LOW will  
restore to –29.3 mV  
–17% for UV Fault,  
–12% for UV Warning,  
+12% for OV Warning,  
+17% for OV Fault  
Sets the PGOOD, VOUT_UNDER_VOLTAGE  
(UV) and VOUT_OVER_VOLTAGE (OV) Limits  
as a percentage of nominal.  
PCT_OV_UV_WRN_FLT_LIMITS  
(MFR_SPECIFIC_07) (D7h)  
00h  
Yes  
See detailed command  
description  
E5h  
F0h  
OPTIONS (MFR_SPECIFIC_21)  
Sets user-selectable options.  
1084h  
0193h  
Yes  
Yes  
MISC_CONFIG_OPTIONS  
(MFR_SPECIFIC_32)  
See detailed command  
description  
Sets miscellaneous user-selectable options.  
16  
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7.3.2 Minimum Capacitance Requirements  
For proper operation, the minimum required input capacitance network consists of four 22-µF (or two 47-µF)  
ceramic capacitors plus a 330-µF bulk capacitor. See capacitors C1 thru C5 in 13. Place the ceramic  
capacitors as close as possible to the VIN pins. Connect the ground return path of the capacitors to PGND pins  
42, 43, 54, and 59 of the TPSM846C23.  
The minimum required output capacitance network consists of four 47-µF (or two 100µF) ceramic capacitors plus  
two 470-µF, low-ESR polymer capacitors. See capacitors C10 thru C15 in 13. The combined ESR of the  
polymer capacitors must not be greater than 5 mΩ. Place the ceramic capacitors as close as possible to the  
VOUT and PGND pins of the module. This minimum network insures good transient response and minimal ripple  
amplitude. The total amount of output capacitance determines the values of the frequency compensation  
network. For more details see Setting the Compensation Network.  
Additionally, the analog power path (VINBP) requires its own bypass network consisting of a 10-nF ceramic  
capacitor (C8 in 13) and 1-µF ceramic capacitor (C7 in 13) connected directly across pins 50 and 51 of the  
module. For proper operation, the two internal power supply rails of the module must also be bypassed. The 6.5-  
V rail (BP6) requires a 4.7-µF ceramic capacitor (C6 in 13) placed across pins 48 and 49 of the module with  
short, direct traces. The 3.3-V rail (BP3) requires a 2.2-µF ceramic capacitor (C9 in 13) placed very close to  
pins 47 and 51.  
TPSM846C23  
4
VS+  
44  
45  
46  
53  
37  
38  
39  
40  
41  
55  
VIN  
VIN  
VIN  
VIN  
VOUT  
VOUT  
VOUT  
VOUT  
VOUT  
VOUT  
VIN  
VOUT  
49  
BP6  
C1  
C2  
C3  
C4  
C5  
C10  
C11  
C12  
C13  
C14  
C15  
+
+
C6  
+
32  
33  
34  
35  
36  
56  
57  
58  
4.7 F  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
22 F  
22 F  
22 F  
22 F  
47 F  
47 F  
47 F  
47 F  
330 F  
48  
470 F  
470 F  
BP6_RTN  
42  
43  
54  
59  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
50  
51  
47  
VINBP  
BP_RTN  
BP3  
C7  
C8  
5
VS-  
1 F  
10 nF  
C9  
2.2 F  
Copyright © 2017, Texas Instruments Incorporated  
13. Required Capacitor Schematic  
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7.3.3 Setting the Compensation Network  
The TPSM846C23 requires an external series resistor and capacitor compensation network to be connected  
between the DIFFO pin (pin 6) and the FB pin (pin 7). These are RCOMP and CCOMP in 14. The value of these  
components is determined by the total amount of output capacitance and the switching frequency. Only ceramic  
and low-ESR, polymer-type capacitors are recommended. These parts should be placed as close as possible to  
the module and away from noisy signal traces. Suggested values for RCOMP and CCOMP for some typical values of  
output capacitance are given in 3. Determine final values by testing system stability using standard power  
supply evaluation techniques.  
TPSM846C23  
6
DIFFO  
R
COMP  
C
COMP  
7
FB  
Copyright © 2017, Texas Instruments Incorporated  
14. Compensation Components  
3. Recommended Compensation Components  
SWITCHING FREQUENCY  
TOTAL COUT (µF)  
TYPICAL COUT  
300 - 400 kHz  
400 - 600 kHz  
600 - 1000 kHz  
MIN  
1000  
1500  
3000  
MAX  
1500  
3000  
5000  
RCOMP  
CCOMP  
1000 pF  
1500 pF  
2200 pF  
RCOMP  
CCOMP  
1500 pF  
2200 pF  
4700 pF  
RCOMP  
CCOMP  
2200 pF  
4700 pF  
6800 pF  
Ceramic  
Polymer  
2 x 470 µF  
4 x 470 µF  
4 x 1000 µF  
1.0 kΩ  
665 Ω  
499 Ω  
665 Ω  
499 Ω  
249 Ω  
499 Ω  
249 Ω  
124 Ω  
4 x 47 µF  
4 x 47 µF  
4 x 47 µF  
18  
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7.3.4 Transient Response  
The TPSM846C23 is designed to have an exceptional output voltage transient response to output current load  
steps. 4 shows the voltage deviation for several transient conditions.  
4. Output Voltage Transient Response  
CIN = 4 × 22-µF Ceramic, 2 × 330-µF Electrolytic  
(1)  
COUT  
NON-CERAMIC  
VOLTAGE  
VOUT (V)  
VIN (V)  
fSW (kHz)  
RCOMP  
CCOMP  
(2)  
DEVIATION (mV)  
Ceramic  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
4× 47 µF  
500  
500  
500  
750  
500  
750  
500  
500  
500  
500  
500  
500  
500  
750  
500  
750  
500  
500  
300  
500  
300  
500  
499 Ω  
249 Ω  
249 Ω  
124 Ω  
499 Ω  
124 Ω  
499 Ω  
249 Ω  
665 Ω  
499 Ω  
249 Ω  
665 Ω  
499 Ω  
499 Ω  
665 Ω  
499 Ω  
665 Ω  
499 Ω  
1.0 kΩ  
665 Ω  
1.0 kΩ  
665 Ω  
2200 pF  
4700 pF  
4700 pF  
6800 pF  
2200 pF  
6800 pF  
2200 pF  
4700 pF  
1500 pF  
2200 pF  
4700 pF  
1500 pF  
2200 pF  
2200 pF  
1500 pF  
2200 pF  
1500 pF  
2200 pF  
1000 pF  
1500 pF  
1000 pF  
1500 pF  
4× 470 µF  
4× 1000 µF  
4× 470 µF  
4× 1000 µF  
4× 470 µF  
4× 1000 µF  
4× 470 µF  
4× 1000 µF  
2× 470 µF  
4× 470 µF  
4× 1000 µF  
2× 470 µF  
4× 470 µF  
2× 470 µF  
2× 470 µF  
2× 470 µF  
2× 470 µF  
4× 470 µF  
2× 470 µF  
2× 470 µF  
2× 470 µF  
2× 470 µF  
33  
22  
24  
18  
37  
19  
33  
20  
48  
38  
26  
41  
32  
26  
38  
34  
39  
35  
50  
38  
57  
42  
5
12  
5
0.6  
0.8  
1.0  
12  
5
12  
5
12  
5
1.2  
2.0  
12  
(1) 50% load step at 2.5 A/µs.  
(2) The combined equivalent ESR of all non-ceramic output capacitance must be 5 mΩ.  
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7.3.5 Setting the Output Voltage via PMBus  
The output voltage of the TPSM846C23 is designed to be set via the PMBus using the VOUT_COMMAND (21h).  
The output voltage is also dependant on the value of VOUT_SCALE_LOOP (29h) and the presence of a resistor,  
RSET, from the FB pin (pin 7) to AGND. 5 illustrates the possible combinations. The module is programmed at  
the factory for a VOUT_SCALE_LOOP value of 1 and a VOUT_COMMAND value of 256 (100h), which produces  
an output voltage of 0.500 V.  
5. VOUT_SCALE_LOOP and Output Voltage Range  
OUTPUT VOLTAGE  
RANGE (V)  
VOUT_COMMAND  
DATA VALID RANGE  
VOUT_SCALE_LOOP  
RSET VALUE  
MIN  
0.35  
0.7  
MAX  
MIN (Hex) MAX (Hex)  
179 (0B3h) 845 (34Dh)  
358 (166h) 1024 (400h)  
1
Not required  
1.65  
2(1)  
0.5  
10 kΩ, 1%  
(1) The TPSM846C23 is designed to be operated with output voltages no higher than 2 V.  
The output voltage is set by writing a value with the PMBus VOUT_COMMAND (21h). The VOUT_COMMAND  
value can be calculated using 公式 1, (round to the nearest integer value), and then converted to a 16 bit  
hexadecimal value. Using the Write Word protocol, write the hexadecimal word to the device using the  
VOUT_COMMAND.  
VOUT_COMMAND value = (desired VOUT × 512)  
(1)  
The value written using the VOUT_COMMAND is held in RAM and remains until it is re-written with a new value  
or if power is removed. If power is removed and then reapplied, the output voltage and the value in the  
VOUT_COMMAND register are restored to the value stored in the non-volatile memory of the device. To save  
the VOUT_COMMAND value to non-volatile memory and make it the new default value, issue the  
STORE_DEFAULT_ALL command.  
For output voltages 1.65 V, RSET is not required. If an output voltage greater than 1.65 V is required, a 10-kΩ  
RSET resistor must be populated. See 15 for the proper connection of RSET  
.
This device is electrically and thermally characterized up to a maximum of 2-V output, and a maximum of 70-W  
output power. Operation at higher output voltages may be possible, provided the maximum output power and  
other internal parameters are not exceeded. Higher output voltages require derating to the output current and  
may require higher switching frequencies. Consult the TI factory applications engineers for support.  
TPSM846C23  
6
DIFFO  
R
COMP  
C
COMP  
7
FB  
R
SET  
10  
AGND  
Copyright © 2017, Texas Instruments Incorporated  
15. RSET Resistor  
7.3.6 Setting the Output Voltage Without PMBus  
It is possible to operate the module without the need for a PMBus interface. To set the output voltage, the  
adjustment method requires a resistor, RSET, connected between the FB pin and AGND as shown in 15. To  
calculate the correct RSET value, the default value of VOUT_COMMAND must be known. The factory default  
value of VOUT_COMMAND is 256 (100h), which produces an output voltage of 0.500 V if the RSET resistor is not  
populated. 公式 2 can be used to calculate the RSET value for a given output voltage, VOUT. Additionally, the RSET  
value can be selected from 6.  
Do not set the output voltage higher than 2 V.  
20  
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10  
RSET  
=
kW  
(
)
V  
ì512  
(
)
OUT  
-1  
«
÷
256  
(2)  
6. Standard RSET Resistor Values  
VOUT (V)  
0.5  
RSET (k)  
open  
49.9  
VOUT (V)  
1.3  
RSET (k)  
6.19  
0.6  
1.4  
5.49  
0.7  
24.9  
1.5  
4.99  
0.8  
16.5  
1.6  
4.53  
0.9  
12.4  
1.7  
4.12  
1
10  
1.8  
3.83  
1.1  
8.25  
1.9  
3.57  
1.2  
7.15  
2
3.32  
7.3.7 Differential Remote Sense  
The TPSM846C23 device implements a differential remote-sense amplifier to provide excellent load regulation by  
cancelling IR-drop in high-current applications. The VS+ and VS– pins must be Kelvin-connected to the output  
capacitor bank directly at the load and routed back to the device as a tightly coupled differential pair. Ensure that  
these traces are isolated from fast switching signals and high current paths on the final PCB layout, as these can  
add differential-mode noise.  
7.3.8 Voltage Reference  
A reference digital-to-analog converter (DAC) with a 350-mV to 1650-mV range and 2–9-V (1.953 mV) resolution  
connects to the noninverting input of the error amplifier. The tight tolerance on the reference voltage allows the  
user to design power supply with very-high DC accuracy.  
7.3.9 Switching Frequency and Synchronization  
7.3.9.1 Setting the Switching Frequency  
The TPSM846C23 is set to a default switching frequency of 500 kHz. To operate the TPSM846C23 at the default  
switching frequency, connect the RT_SEL pin (pin 14) to AGND, and leave the RT pin (pin 13) open. To change  
the switching frequency, leave the RT_SEL pin open and connect a resistor from the RT pin (RRT) to AGND. Use  
公式 3 to calculate the RRT resistor value.  
18290 + 120 ì V  
(
)
kW  
IN  
RRT  
=
(
)
fSW kHZ  
(
)
(3)  
The TPSM846C23 devices are designed to operate from 300 kHz to 1 MHz.  
7.3.9.2 Synchronization  
The TPSM846C23 device can synchronize to an external clock that is ±20% of the free-running frequency set by  
RRT. It is required that the external clock waveform is a square wave with a duty cycle of 50%.  
7.3.9.2.1 Stand-Alone Device  
The SYNC pin is factory-configured as an input pin. When power is applied, if no external clocking signal is  
present on the SYNC pin, the device operates at the switching frequency set by the internal or an external timing  
resistor. If an external clock signal that meets the specification of the Synchronization section of Switching  
Characteristics is applied to the SYNC pin, the device synchronizes to the leading edge of the applied waveform.  
The rising edge of the PH node lags the rising edge of the clocking waveform by approximately 500 ns. The  
external clock must be a 50% duty-cycle square wave. The external-clock frequency must be with ±20% of the  
free-running frequency set by the RRT resistor. It is permissible for the SYNC signal to become active after the  
module has powered up. If this is done, there is a small disturbance in the output voltage while the module locks  
to the SYNC clock. If the SYNC signal is lost during operation, the module quickly detects the loss and reverts to  
switching at the frequency set by the RRT resistor. A disturbance occurs in the output voltage upon loss of SYNC.  
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7.3.9.2.2 Paralleled Devices  
When two TPSM846C23 devices are paralleled, the SYNC pins of the master and the slave must be supplied  
with a 50% duty-cycle clock signal at the desired switching frequency. The master device locks to the rising edge  
of the clock; the slave locks to the falling edge. The 50% duty cycle requirement insures the modules operate  
180° out of phase to minimize ripple. Both the master and slave module must have an RRT resistor present  
whose value sets a switching frequency within ±20% of the SYNC clock frequency. See Parallel Application for  
more information when paralleling devices.  
7.3.10 Input Undervoltage Lockout (UVLO)  
The TPSM846C23 device provides flexible user adjustment of the undervoltage lockout (UVLO) threshold and  
hysteresis. The minimum VIN voltage required for power conversion is set by the stored VIN_ON (35h) value. The  
factory default value is 4.5 V. The turnon value can be set from 4.25 V to 7.75 V in 250-mV steps. The turnoff  
threshold voltage is stored in the VIN_OFF (36h) value. The factory default is 4 V. The value can be set from 4 V  
to 7.5 V in 250-mV steps. For more information, see 2.  
7.3.11 Turnon and Turnoff Delay and Sequencing  
The TPSM846C23 device provides many sequencing options. Using the ON_OFF_CONFIG command, the  
device can be configured to start up whenever the input voltage is above the UVLO threshold, to require an  
additional signal on the CNTL pin, to receive an update to the OPERATION command through the PMBus  
interface, or  
a combination of these configurations. When the gating signal as specified by the  
ON_OFF_CONFIG command is asserted, a programmable turnon delay can be set with the TON_DELAY  
command to delay the start of power conversion. Similarly, a programmable turnoff delay can be set with the  
TOFF_DELAY command to delay the stop of power delivery once the gating signal is deasserted. Delay times  
are specified in milliseconds (ms), from 0 to 100 ms.  
The TPSM846C23, as supplied by the factory, is programmed for zero TOFF_DELAY and 3-ms TOFF_FALL  
parameters. The power stage discharges the output capacitors when CNTL is de-asserted or under a fault  
condition. Note that the power stage sinks current as it ramps the output voltage to zero. Once the output voltage  
is ramped to approximately 200 mV, the power stage will tri-state. This default behavior is set by the  
ON_OFF_CONFIG command register. The user can set the cpa bit if a controlled soft-stop discharge of the  
output capacitors is not desired. If this bit is set, the power stage is immediately tri-stated when CNTL is de-  
asserted or when a fault occurs. The load on the regulator output provides the only means of discharging the  
output capacitors.  
16 shows control of the start-up and shutdown operations of the device when the device is configured to  
respond to both the CNTL signal and the OPERATION command. The device can also be configured to  
independently use either the CNTL signal or the OPERATION command or to convert power when a sufficient  
input voltage is available.  
TON_DELAY  
TOFF_DELAY  
TON_RISE  
TOFF_FALL  
VIN  
OFF  
ON  
OFF  
OPERATION[7]  
CNTL  
V
OUT  
Time  
16. Turnon Controlled by Both Operation(1) and Control  
(1)  
(1) Bit 7 of OPERATION is used to control power conversion.  
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7.3.12 Soft-Start Time and TON_RISE Command  
To control the inrush current required to charge the output capacitor bank during start up, the TPSM846C23  
device implements a soft-start time. When the device is enabled, the feedback reference voltage, VREF, ramps  
from 0 V to the final level at a slew rate defined by the TON_RISE command. The specified rise times are  
defined by the slew rate required to ramp the reference voltage from 0 V to the final value at each given rise  
time.  
The TPSM846C23 devices support several soft-start times from 1 ms to 100 ms, which are selected by the  
TON_RISE command.  
7.3.13 Soft-Stop Time and TOFF_FALL Command  
The TPSM846C23 device implements the TOFF_FALL command to define the time for the output voltage to drop  
from regulation to 0 as shown in 16. Negative current in the TPSM846C23 device can occur during the  
TOFF_FALL time to discharge the output voltage. The setting of the TOFF_FALL command to 0 ms causes the  
TPSM846C23 to bring the output voltage down to 0 as quickly as possible, which results in an effective  
TOFF_FALL time of 1 ms (fastest time supported). The time is factory-set to 3 ms. This feature can be disabled  
in the ON_OFF_CONFIG command for the turnoff controlled by the CNTL pin or bit 6 of the OPERATION  
register if the regulator is turned off by the OPERATION command. If the regulator is turned off by the  
OPERATION command, both the high-side and low-side FET drivers are turned off immediately, and the output  
voltage is discharged only by the load.  
7.3.14 Prebiased Output Start-Up  
The TPSM846C23 device prevents current from being discharged from the output during start-up when a  
prebiased output condition exists. If the output is prebiased, no PH pulses occur until the internal soft-start  
voltage rises above the error-amplifier input voltage (FB pin). As soon as the soft-start voltage exceeds the error-  
amplifier input, and PH pulses start. The device limits synchronous rectification after each PH pulse with a  
narrow on-time. The on-time of the low-side MOSFET slowly increases on a cycle-by-cycle basis until 128 pulses  
have been generated and the synchronous rectifier runs fully complementary to the high-side MOSFET. This  
approach prevents the sinking of current from a prebiased output and ensures the output-voltage start-up and  
ramp-to-regulation sequences are smooth and monotonic.  
If the prebias voltage is close to, or exceeds, the VOUT setpoint voltage, the mandatory 128 switching cycles, as  
previously described, may induce a non-monotonic dip in the output voltage. The output voltage quickly recovers  
to the setpoint value once the 128 cycle interval is completed.  
The output overvoltage warn is tripped when the FB pin is prebiased to higher than 5% above the regulation  
level. These devices respond to a prebiased output overvoltage condition immediately upon VIN powered up and  
when the BP6 regulator voltage is above the BP6 UVLO of 3.73 V (typical).  
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7.3.15 Power Good (PGOOD) Indicator  
PGOOD is an open-drain digital active-high output signal that indicates if the output voltage is within regulation  
limits. A pullup resistor value between 10 kΩ and 100 kΩ to a voltage source of 5.5 V or less is required. The  
PGOOD window is defined by OV warning limit and UV warning limit in PCT_OV_UV_WRN_FLT_LIMITS  
(MFR_SPECIFIC_07) (D7h), which can be programmed through the PMBus interface, as shown in 17. The  
PGOOD pin pulls low upon any fault condition by default. See 7 for the possible sources to pull down the  
PGOOD pin.  
The PGOOD signal can be connected to the CNTL pin of another device to provide additional controlled turnon  
and turnoff sequencing.  
The OVW or PGOOD signal trips when the FB pin is prebiased to higher than 5% above the regulation level.  
This level of prebias is unusual, and it is beneficial to flag a warning in this situation.  
OV Fault  
OV Warn  
OVW  
Hysteresis  
VOUT_COMMAND  
UV Warn  
UVW  
Hysteresis  
FB  
UV Fault  
PGOOD  
(non-latch)  
Time  
17. PGOOD Threshold and Hysteresis  
The presence of a pullup voltage at the PGOOD pin high before the TPSM846C23 device  
receives input power causes the PGOOD pin to be pulled above a logic-low-voltage level  
due to the limited pulldown capability in an un-powered condition. If this is not desired,  
increase the pullup resistance or reduce the external pullup-supply voltage.  
7.3.16 Linear Regulators BP3 and BP6  
The TPSM846C23 device has two onboard linear regulators to provide suitable power for the internal circuitry of  
the device. Bypass the BP3 and BP6 pins externally for the converter to function properly. The BP3 pin requires  
a minimum of 2.2 µF of capacitance connected to BP_RTN. The BP6 pin requires a minimum 4.7µF of  
capacitance connected to BP6_RTN.  
The use of the internal regulators to power other circuits is not recommended because the loads placed on the  
regulators might adversely affect operation of the controller.  
Place bypass capacitors as close as possible to the device pins, with a minimum return  
loop back to ground and the return loop should be kept away from fast switching voltage  
and main current path. For more information, see the Layout section. Poor bypassing can  
degrade the performance of the regulator.  
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7.3.17 VREF_TRIM  
The nominal output voltage of the converter can also be adjusted by changing the feedback voltage, VFB, using  
the VREF_TRIM command. The adjustment range is from –64 × 1.953 mV to +63 × 1.953 mV from the nominal  
FB voltage. This command adjusts the final output voltage of the converter to a high degree of accuracy without  
relying on high-precision feedback resistors. The resolution of the adjustment is approximately 1.953 mV. The  
trim value can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
7.3.18 MARGIN  
The TPSM846C23 device also allows simple testing of the output-voltage margin, by applying a either a positive  
or negative offset to the feedback voltage. The STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h) and  
STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h) commands control the size of the applied high offset  
or low offset (respectively). The adjustment range is from –64 × 1.953 mV to 31 × 1.953 mV from the nominal  
feedback voltage. The OPERATION command toggles the converter between the following three states:  
Margin none (no output margining)  
Margin high  
Margin low  
Use 公式 4 to calculate the resulted internal-reference voltage.  
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×  
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4])] × 1.953 mV  
(4)  
The total adjustable range of the output voltage, including VOUT_COMMAND, MARGIN, and VREF_TRIM, is  
limited by the internal reference DAC range of 0.35 V – 1.65 V. For more information on the implementation, see  
the Supported PMBus Commands section.  
The VOUT_SCALE_LOOP is limited to only 2 possible options: 1 (default, no bottom  
resistor required for the divider), or 0.5 (RSET= 10 kΩ).  
When VOUT_SCALE_LOOP is set to 1 (default), no bottom RSET resistor is required.  
The reference voltage is equal to the output voltage, which allows tighter system DC  
accuracy by removing the resistor divider tolerance.  
If the divider ratio, RSET / (RSET + R1), does not match the programed  
VOUT_SCALE_LOOP, the user should be aware that the actual output voltage  
determined by 公式 2 and 公式 4 may not match the programed VOUT_COMMAND.  
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7.3.19 Parallel Application  
Two TPSM846C23 devices can be paralleled for increased output current up to 70 A. Multiple connections must  
be made between the paralleled devices and the component selection is slightly different than for a stand-alone  
TPSM846C23 device. 18 shows a typical schematic for two TPSM846C23 devices in parallel. Parallel  
operation can be evaluated using the TPSM846C23DEVM-807 evaluation board.  
VIN  
VIN  
BP3  
VS+  
VOUT  
VOUT  
PGND  
PGND  
VS-  
DATA  
TPSM846C23  
MASTER  
CLK  
PMBUS  
INTERFACE  
ALERT  
CNTL  
DIFFO  
FB  
VSHARE  
ISHARE  
SYNC  
ADDR1  
ADDR0  
RT_SEL  
PGND AGND  
VIN  
BP3  
VS+  
VOUT  
PGND  
PGND  
VS-  
DATA  
TPSM846C23  
SLAVE  
CLK  
ALERT  
CNTL  
DIFFO  
FB  
VSHARE  
ISHARE  
SYNC  
ADDR1  
ADDR0  
RT_SEL  
500 kHz CLOCK  
50% Duty  
PGND AGND  
Copyright © 2018, Texas Instruments Incorporated  
18. TPSM846C23 Parallel  
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7.3.20 Parallel Operation  
To operate two TPSM846C23 devices in parallel, one of the devices must act as the master and the other act as  
a slave. To configure one of the devices as the slave device, connect a 1-kΩ resistor between the device FB pin  
and BP3 pin. Additionally, the SYNC, VSHARE, and ISHARE pins of both devices must be connected as shown  
in 18. Both devices share the same VSHARE voltage. Essentially, the internal COMP voltage is shared  
between the two devices by connecting the VSHARE pin of each device together. By connecting the ISHARE pin  
of each device, the sensed current in each phase is compared, then the error current is added into the internal  
COMP. The resulting voltage is compared with the PWM ramp to generate the PWM pulse. This current sharing  
loop maintains the current balance between devices.  
In addition to sharing the same internal COMP voltage, the VSHARE pin is also used for fault communication  
between the loop master and slave devices. The VSHARE pin voltage is pulled low if any device encounters any  
fault conditions so that the other device sharing VSHARE pin is alerted and stops switching accordingly.  
The master and slave devices must be set to two different PMBus addresses. The telemetry data from the  
master and slave devices must be retrieved seperately.  
When configured for parallel operation, the SYNC pins of the master and the slave must be supplied with a 50%  
duty cycle clock signal at the desired switching frequency. The master device locks to the rising edge of the  
clock; the slave locks to the falling edge. The 50% duty cycle requirement insures the modules operate 180° out  
of phase to minimize ripple. Both the master and slave module must have an RRT resistor present whose value  
sets a switching frequency within ±20% of the SYNC clock frequency.  
An optional high-frequency capacitor can be added between the VSHARE pin and ground in noisy systems, but  
the capacitance must not exceed 10 pF.  
If operating conditions result in an on-time pulse width of 150 ns, jitter may be observed on the master and  
slave PH pins. The addition of a 10-kΩ resistor in series with the ISHARE connection between the devices helps  
to reduce, but may not eliminate the jitter.  
To evaluate the TPSM846C23 in parallel configuration, an evaluation board is available. Also refer to the  
Operating TPSM846C23 in Parallel user's guide for operation instructions and layout recommendations.  
7.3.21 Telemetry  
7.3.21.1 Output Current Telemetry  
The TPSM846C23 device senses the average output current using an internal sense FET. A sense FET  
conducts a scaled-down version of the power-stage current. Sampling this current in the middle of the low-side  
drive signal determines the average output current. This architecture achieves excellent current monitoring and  
better overcurrent threshold accuracy than the current sensing of a DC-resistance (DCR) inductor with minimal  
temperature variation and no dependence on power loss in a higher DCR inductor. Use the IOUT_CAL_OFFSET  
command to improve current sensing and overcurrent accuracy by removing systematic errors related to board  
layout after assembly. The device continually digitizes the sensed output current, and averages it to reduce  
measurement noise. The device then places the current value in the read-only register, READ_IOUT, which  
enables output-current telemetry.  
This device cannot report negative (sinking) current. Any negative current is reported as zero amps.  
7.3.21.2 Output Voltage Telemetry  
The output voltage is sensed at the remote sense amplifier output pin, and the device continually digitizes the  
sensed output voltage, and averages it to reduce measurement noise. The device then stores the average value  
in the read-only register, READ_VOUT, which enables output voltage telemetry. Refer to OPTIONS  
(MFR_SPECIFIC_21) for details of programming output voltage telemetry signal range, averaging and update  
rate.  
7.3.21.3 Junction Temperature Telemetry  
The TPSM846C23 device also provides temperature telemetry and programmable internal overtemperature fault  
or warning thresholds using measurements from an internal temperature sensor. The temperature-sensor circuit  
applies two bias currents to an internal diode-connected NPN transistor and measures ΔVBE to infer the junction  
temperature of the sensor. The device then digitizes the result and compares it to the user-configured  
overtemperature fault and warning thresholds. When an internal overtemperature fault (OTF) is detected, power  
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conversion stops until the sensed temperature decreases by 20°C. The READ_TEMPERATURE_1 (8Dh)  
register is continually updated with the digitized temperature measurement, enabling temperature telemetry. The  
OT_FAULT_LIMIT (4Fh) and OT_WARN_LIMIT (51h) commands set the overtemperature fault and warning  
thresholds through the PMBus interface. When an overtemperature event is detected, the device sets the  
appropriate flags in STATUS_TEMPERATURE (7Dh) command and triggers the SMBALERT signal if it is not  
masked.  
7.3.22 Overtemperature Protection  
An internal temperature sensor based off the bandgap reference protects the TPSM846C23 device from thermal  
runaway. The internal thermal shutdown threshold, TSD, is fixed at 145°C (typical), which is different from the  
user programmable OT_FAULT_LIMIT. When the device senses a temperature above TSD, an otf_bg bit in the  
STATUS_MFR_SPECIFIC command is flagged, and power conversion stops until the sensed junction  
temperature decreases by the amount of the thermal shutdown hysteresis, THYST (20°C typical). The SMBALERT  
signal is triggered if the signal is not masked.  
The device response to an OT_FAULT_LIMIT event can be set to Latch-off, Restart and Ignore in  
OT_FAULT_RESPONSE. The default response to an over temperature fault is to shut down and then restart.  
Fixed band gap-detected overtemperature (OT) faults are never ignored. The band gap OT faults always  
respond in a shutdown and attempted restart once the device cools. 7 summarizes the fault-response  
scheme.  
7.3.23 Overcurrent Protection  
Both low-side overcurrent and high-side short-circuit protection are implemented. The low-side overcurrent fault  
and warning thresholds are programmed via PMBus. The low-side MOSFET average current is compared to the  
set fault threshold. High-side pulses are terminated on a cycle-by-cycle basis whenever the current through the  
high-side MOSFET exceeds the fixed short circuit threshold.  
When either a low-side overcurrent or high-side short-circuit threshold is exceeded in a switching cycle, a counter  
is incremented. If no overcurrent condition is detected in a switching cycle, the counter is decremented. When  
the counter counts to three, an overcurrent fault condition is declared, and the output shuts down and restarts  
after 7 × TON_RISE time or is latched off until re-enabled, or ignored depending on the fault response setting.  
The behavior of the power stage during the various fault scenarios is shown in 7.  
7.3.24 Output Overvoltage and Undervoltage Protection  
The TPSM846C23 device includes both output overvoltage protection and output undervoltage protection  
capability by comparing the FB pin voltage to internal selectable pre-set voltages, as defined by the  
PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h) command.  
If the FB pin voltage rises above the output overvoltage-protection threshold, the device terminates normal  
switching and turns on the low-side MOSFET to discharge the output capacitor and prevent further increases in  
the output voltage. The device also declares an OV fault, flagging the appropriate status registers, triggering  
SMBALERT if it is not masked. Then the device enters continuous-restart-hiccup mode or latches off according  
to the VOUT_OV_FAULT_RESPONSE command. The TPSM846C23 device responds to the output overvoltage  
condition immediately upon VIN power up and BP6 regulator voltage above its own UVLO of 3.73 V (typical).  
The VOUT_OV_FAULT_RESPONSE can also be set to ignore the output overvoltage fault and continue without  
interruption. Under this configuration, the control loop continues to respond and adjust PWM duty cycle to keep  
output voltage within regulation.  
If the FB pin voltage falls below the undervoltage protection level after soft start has completed, the device  
terminates normal switching and forces both the high-side and low-side MOSFETs off and awaits an external  
reset or begins  
a
hiccup time-out delay prior to restart, depending on the value of the  
VOUT_UV_FAULT_RESPONSE command. The device also declares a UV fault by flagging the appropriate  
status registers and triggering SMBALERT if it is not masked. The VOUT_UV_FAULT_RESPONSE can also be  
set to ignore the output undervoltage fault and continue without interruption for debug purpose.  
7 summarizes the fault-response scheme.  
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7.3.25 Fault Protection Responses  
7 summarizes the various fault protections and associated responses.  
When configured as parallel operation, the best practice is to have the fault response of the loop master and slave device set as  
the same to avoid unexpected behavior.  
7. Fault Protection Summary  
FAULT  
RESPONSE  
SETTING  
ACTIVE DURING  
TON_RISE  
SOURCE OF  
SMBALERT  
SMBALERT  
MASKABLE  
FAULT or WARN  
PROGRAMMING  
FET BEHAVIOR  
PGOOD  
Latch-off  
Restart  
Ignore  
Both FETs off  
Both FETs off, then restart after cooling down(1)  
Low  
Low  
High  
Internal Overtemperature  
Fault  
OT_FAULT_LIMIT (4Fh)  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
FETs still controlled by PWM  
Latch-off or restart  
on fault  
Low  
Internal Overtemperature  
Warn  
OT_WARN_LIMIT (51h)  
Threshold fixed internally  
PWM maintains control of FETs  
Ignore fault  
Latch-off  
Restart  
High  
Both FETs off  
Bandgap Overtemperature  
Fault  
Both FETs off, then restart after cooling down(1)  
Both FETs off, then restart after cooling down(2)  
3 PWM counts, then both FETs off  
Low  
Ignore  
Latch-off  
Low  
Low  
High  
Low  
IOUT_OC_FAULT_LIMIT  
(46h)  
3 PWM counts, then both FETs off, restart after 7×  
TON_RISE  
Low-Side OC Fault  
Low-Side OC Warn  
High-Side OC Fault  
Restart  
Ignore  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
FETs still controlled by PWM  
PWM maintains control of FETs  
3 PWM counts, then both FETs off  
Latch-off or Restart  
on Fault  
IOUT_OC_WARN_LIMIT  
Ignore Fault  
Latch-off  
High  
Low  
3 PWM counts, then both FETs off, restart after 7 ×  
TON_RISE  
Restart  
Ignore  
Low  
Cycle-by-cycle peak current limit  
High  
High-side FET OFF, low-side FET response configured  
byOV_RESP_SEL Bit: latch ON or turn on till FB drops  
below 0.2 V  
Latch-off  
PCT_OV_UV_WRN_FLT_LIMI  
TS (MFR_SPECIFIC_07)  
(D7h)  
VOUT OV Fault  
High-side FET OFF, low-side FET response configured  
byOV_RESP_SEL Bit: latch ON or turn on till FB drops  
below 0.2 V. Then restart after 7 × TON_RISE  
Yes  
Yes  
Yes  
Low  
Restart  
Ignore  
PWM maintains control of FETs  
(1) When the overtemperature fault is tripped, the device shuts off both FETs and restarts until the sensed temperature decreases 20°C from the tripping threshold.  
(2) The bandgap-overtemperature fault cannot be ignored, the device shuts off both FETs and restarts after the internal die temperature drops below the threshold.  
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7. Fault Protection Summary (接下页)  
FAULT  
RESPONSE  
SETTING  
ACTIVE DURING  
TON_RISE  
SOURCE OF  
SMBALERT  
SMBALERT  
MASKABLE  
FAULT or WARN  
PROGRAMMING  
FET BEHAVIOR  
PGOOD  
Latch-off or restart  
on fault  
PCT_OV_UV_WRN_FLT_LIMI  
TS (MFR_SPECIFIC_07)  
(D7h)  
VOUT OV Warn  
PWM maintains control of FETs  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Low  
Ignore Fault  
Latch-off  
Restart  
Both FETs off  
PCT_OV_UV_WRN_FLT_LIMI  
TS (MFR_SPECIFIC_07)  
(D7h)  
VOUT UV Fault  
VOUT UV Warn  
Both FETs off, then restart after 7 × TON_RISE  
PWM maintains control of FETs  
Low  
Low  
Ignore  
Latch-off or restart  
on fault  
PCT_OV_UV_WRN_FLT_LIMI  
TS (MFR_SPECIFIC_07)  
(D7h)  
PWM maintains control of FETs  
No  
Ignore fault  
Latch-off  
Restart  
Both FETs off  
Both FETs off, then restart after 7 × TON_RISE  
PWM maintains control of FETs  
Both FETs off  
TON Max Fault  
VIN UVLO  
TON_MAX_FAULT_LIMIT  
VIN_ON, VIN_OFF  
No  
Yes  
Yes  
Yes  
Yes  
Low  
Low  
Ignore  
Shutdown  
Yes  
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7.4 Device Functional Modes  
7.4.1 Continuous Conduction Mode  
The TPSM846C23 device operates in continuous conduction mode (CCM) at a fixed frequency, regardless of the  
output current. For the first 128 switching cycles, the low-side MOSFET on-time is slowly increased to prevent  
excessive current sinking in the event the device is started with a prebiased output. Following the first 128 clock  
cycles, the low-side MOSFET and the high-side MOSFET on-times are fully complementary.  
7.4.2 Operation With CNTL Signal Control  
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to use  
the CNTL pin to enable or disable regulation, regardless of the state of the OPERATION command. The CNTL  
pin can be configured as either active high or active low (inverted) logic. The TPSM846C23 is factory-  
programmed to use the CNTL pin only using active high logic.  
7.4.3 Operation With OPERATION Control  
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to use  
the OPERATION command to enable or disable regulation, regardless of the state of the CNTL signal.  
7.4.4 Operation With CNTL and OPERATION Control  
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to  
require both a signal on the CNTL pin, and the OPERATION command to enable or disable regulation.  
7.5 Register Maps  
This family of devices supports the following commands from the PMBus 1.3 specification.  
Table 8. Legend for Register Access Type  
Access Type  
Read Type  
R
Code  
Description  
r
Read  
Write Type  
W
w
Write  
Other  
E
superscript E  
r/wE  
Bit is backed up with nonvolatile EEPROM  
7.5.1 OPERATION (01h)  
The OPERATION command turns the device output on or off in conjunction with input from the CNTL signal. It is  
also used to set the output voltage to the upper or lower margin voltages. The unit stays in the commanded  
operating mode until a subsequent OPERATION command or a change in the state of the CNTL pin instructs the  
device to change to another mode.  
For PWM loop slave device, which is recognized during power-up calibration, this command cannot be accessed.  
Any writes to this command will be ignored. An attempt to read or write this command will result in a NACK’d  
command, the reporting of an IVC fault, and triggering of SMB_ALERT.  
COMMAND  
OPERATION  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/w  
ON  
0
6
r/w  
OFF  
0
5
4
3
2
1
r
0
r
r/w  
r/w  
r/w  
r/w  
Function  
MARGIN  
X
X
X
X
Default Value  
0
0
0
0
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7.5.1.1 On Bit  
This bit is an enable command to the converter.  
0: output switching is disabled. Both drivers placed in an off or low state.  
1: output switching is enabled if the input voltage is above undervoltage lockout, OPERATION is configured  
as a gating signal in ON_OFF_CONFIG, and no fault conditions exist.  
7.5.1.2 Off Bit  
This bit sets the turnoff behavior when commanding the unit to turn off through OPERATION[7] ( the On bit).  
0: Immediately turn off the output (not honoring the programmed turnoff delay (TOFF_DELAY) and ramp  
down (TOFF_FALL)) when commanded off through OPERATION[7] ( the On bit).  
1: Use the programmed turnoff delay (TOFF_DELAY) and ramp down (TOFF_FALL) when commanded off  
through OPERATION[7] (also called soft off).  
NOTE  
The device ignores any values written to read-only bits. Additionally, both the on and off  
bits being set at the same time is not allowed and considered invalid data per section 12.1  
of the PMBus Specification Part II; any attempt to do so causes the device to set the cml  
bit in the STATUS_BYTE and the ivd bit in the STATUS_CML registers, and triggers  
SMBALERT signal.  
7.5.1.3 Margin Bit  
If Margin Low is enabled, load the value from the STEP_VREF_MARGIN_LOW command. If Margin High is  
enabled, load the value from the STEP_VREF_MARGIN_HIGH command.  
0001: Margin Off. Output voltage source is VOUT_COMMAND. OV and UV faults are ignored.  
0000, 0010, 0011: Margin Off. Output voltage source is VOUT_COMMAND. OV/UV faults behave normally as  
programmed in their respective fault response registers.  
0101: Margin Low (Ignore Fault). Output voltage defined directly below.  
0110: Margin Low (Act On Fault). Output voltage defined directly below.  
1001: Margin High (Ignore Fault). Output voltage defined directly below.  
1010: Margin High (Act On Fault). Output voltage defined directly below.  
11XX, 0100, 0111, 1000, 1011: Shall be invalid and shall declare an Invalid Data Fault (Part II Rev 1.3  
Section 10.9.3, Page 52)  
VOUT_MARGIN_LOW data shall be equal to:  
VOUT_COMMAND + (VREF_TRIM – STEP_VREF_MARGIN_LOW) / VOUT_SCALE_LOOP  
VOUT_MARGIN_HIGH data shall be equal to:  
VOUT_COMMAND + (VREF_TRIM + STEP_VREF_MARGIN_HIGH) / VOUT_SCALE_LOOP  
For the Margin Low, Ignore Fault configuration (essentially [5:2] = 4’b0101), any incoming UV faults shall trigger  
the normal UVF status, and trigger SMB_ALERT (albeit the state machine response will be to ignore and not  
respond). If the desired response is to have the device to not trigger SMB_ALERT for UVF events when  
margining, they must set the UVF SMBALERT_MASK bit. For the Margin High, Ignore Fault configuration  
(essentially [5:2] = 4’b1001), any incoming OV faults shall trigger the normal OVF status, and trigger  
SMB_ALERT (albeit the state machine response will be to ignore and not respond). If the desired response is to  
have the device to not trigger SMB_ALERT for UVF events when margining, they must set the UVF  
SMBALERT_MASK bit. OVF and UVF can also be ignored when VOUT_COMMAND is the VOUT source by  
programming [5:2] to a value of 4’b0001. OVF and UVF events will still set status and trigger SMB_ALERT.  
7.5.2 ON_OFF_CONFIG (02h)  
The ON_OFF_CONFIG command configures the combination of CNTL pin input and serial bus commands  
needed to turn the unit on and off. The contents of this register can be stored to nonvolatile memory using the  
STORE_DEFAULT_ALL (11h) command. The default value in ON_OFF_CONFIG register is to have the device  
power up by CNTL pin only with the active high polarity and use the programmed turnoff delay (TOFF_DELAY)  
and ramp down (TOFF_FALL) for powering off the converter.  
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For PWM loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
COMMAND  
ON_OFF_CONFIG  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r/wE  
pu  
1
3
2
r/wE  
cpr  
1
1
r/wE  
pol  
1
0
r/wE  
cpa  
0
r/wE  
cmd  
0
Function  
X
X
X
X
X
X
Default Value  
7.5.2.1 pu Bit  
The pu bit sets the default to either operate any time power is present or for power conversion to be controlled by  
CNTL pin and PMBus OPERATION command. This bit is used in conjunction with the cpr, cmd, and on bits to  
determine start up.  
BIT VALUE  
ACTION  
0
Device powers up any time power is present regardless of state of the CNTL pin.  
Device does not power up until commanded by the CNTL pin and/or OPERATION  
command as programmed in bits [3:0] of the ON_OFF_CONFIG register.  
1
7.5.2.2 cmd Bit  
The cmd bit controls how the device responds to the OPERATION command. This bit is used in conjunction with  
the cpr, pu, and on bits to determine start up.  
BIT VALUE  
ACTION  
0
1
Device ignores the “on” bit in the OPERATION command.  
Device responds to the “on” bit in the OPERATION command.  
7.5.2.3 cpr Bit  
The cpr bit sets the CNTL pin response. This bit is used in conjunction with the cmd, pu, and on bits to determine  
start up.  
BIT VALUE  
ACTION  
Device ignores the CNTL pin. Power conversion is controlled only by the OPERATION  
command.  
0
1
Device requires the CNTL pin to be asserted to start the unit.  
7.5.2.4 pol Bit  
The pol bit controls the polarity of the CNTL pin. For a change to become effective, the contents of the  
ON_OFF_CONFIG register must be stored to nonvolatile memory using the STORE_DEFAULT_ALL command  
and the device power cycled. Simply writing a new value to this bit does not change the polarity of the CNTL pin.  
BIT VALUE  
ACTION  
0
1
CNTL pin is active low.  
CNTL pin is active high.  
7.5.2.5 cpa Bit  
The cpa bit sets the CNTL pin action when turning the converter off.  
BIT VALUE  
ACTION  
0
Use the programmed turnoff delay (TOFF_DELAY) and ramp down (TOFF_FALL).  
Immediately turn off the output (not honoring the programmed turnoff delay  
(TOFF_DELAY) and ramp down (TOFF_FALL)).  
1
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7.5.3 CLEAR_FAULTS (03h)  
The CLEAR_FAULTS command is used to clear any fault bits that have been set. This command clears all bits  
in all status registers simultaneously. At the same time, the device negates (clears, releases) its SMBALERT  
signal output if the device is asserting the SMBALERT signal. The CLEAR_FAULTS command does not cause a  
unit that has latched off for a fault condition to restart. If the fault is still present when the bit is cleared, the fault  
bit is immediately reset and the host notified by the usual means.  
NOTE  
To get a reliable clear fault result, the clear_fault command should be issued (8 ×  
TON_RISE + TON_DELAY) after the switcher shuts down.  
In the case of OV fault with a latch off response, the LS FET latches on when the fault  
is detected. If the OV_RESP_SEL Bit in (F0h) MFR_SPECIFIC_32 is set to 1, then the  
LS FET releases when the FB pin voltage falls below 0.2 V. Otherwise, it remains on  
until the CLEAR_FAULTS command is issued. The CLEAR FAULTS command causes  
the LS FET to turn off.  
CNTL pin toggling can also clear fault, but the logic low duration should be higher than  
100 ns for the internal circuit to recognize.  
7.5.4 WRITE_PROTECT (10h)  
The WRITE_PROTECT command is used to control writing to the PMBus device. The intent of this command is  
to provide protection against accidental changes. This command is not intended to provide protection against  
deliberate or malicious changes to the device configuration or operation. All supported command parameters  
may have their parameters read, regardless of the WRITE_PROTECT settings. Write protection also prevents  
protected registers from being updated in the event of a RESTORE_DEFAULT_ALL. The contents of this register  
can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
WRITE_PROTECT  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
bit7  
0
6
r/wE  
bit6  
0
5
r/wE  
bit5  
0
4
X
X
X
3
X
X
X
2
X
X
X
1
X
X
X
0
X
X
X
Function  
Default Value  
7.5.4.1 bit5  
7.5.4.2 bit6  
7.5.4.3 bit7  
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit6 or bit7  
Disable all writes except the WRITE_PROTECT, OPERATION, ON_OFF_CONFIG,  
and VOUT_COMMAND. (bit6 and bit7 must be 0 to be valid data)  
1
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit5 or bit7  
Disable all writes except for the WRITE_PROTECT, and OPERATION commands. (bit5  
and bit7 must be 0 to be valid data)  
1
BIT VALUE  
ACTION  
0
Enable all writes as permitted in bit5 or bit6  
Disable all writes except for the WRITE_PROTECT command. (bit5 and bit6 must be 0  
to be valid data)  
1
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In any case, only one of the three bits may be set at any one time. Attempting to set more than one bit results in  
an alert being generated and the cml bit is STATUS_WORD being set. An invalid setting of the  
WRITE_PROTECT command results in no write protection.  
Data Byte  
ACTION  
Value  
1000 0000  
0100 0000  
Disables all WRITES except to the WRITE_PROTECT command.  
Disables all WRITES except to the WRITE_PROTECT, and OPERATION commands.  
Disables all WRITES except to the WRITE_PROTECT, OPERATION,  
ON_OFF_CONFIG, and VOUT_COMMAND commands.  
0010 0000  
7.5.5 STORE_DEFAULT_ALL (11h)  
The STORE_DEFAULT_ALL command stores all of the current storable register settings in the EEPROM  
memory as the new defaults on power up.  
It is permissible to use this command while the device is switching. Note however that the device continues to  
switch but ignores all fault conditions until the internal store process has completed. Issuing  
STORE_DEFAULT_ALL also causes the device to be unresponsive through PMBus for a period of  
approximately 100 ms.  
EEPROM programming faults cause the device to NACK and set the cml bit in the STATUS_BYTE and the mem  
bit in the STATUS_CML registers.  
7.5.6 RESTORE_DEFAULT_ALL (12h)  
The RESTORE_DEFAULT_ALL command restores all of the storable register settings from EEPROM memory to  
those registers which are unprotected according to current setting of WRITE_PROTECT. Issuing  
RESTORE_DEFAULT_ALL also causes the device to be unresponsive through PMBus for a period of  
approximately 100 ms.  
NOTE  
Do not use this command while the device is actively switching, this causes the device to  
stop switching and the output voltage to fall during the restore event. Depending on  
loading conditions, the output voltage could reach an undervoltage level and trigger an  
undervoltage fault response if programmed to do so. The command can be used while the  
device is switching, but this usage is not recommended as it results in a restart that could  
disrupt power sequencing requirements in more complex systems. TI strongly  
recommends stopping the device before issuing this command.  
7.5.7 STORE_USER_ALL (15h)  
The STORE_USER_ALL command stores all of the current storable register settings in the EEPROM memory as  
the new defaults on power up.  
It is permissible to use this command while the device is switching. Note however that the device continues to  
switch but ignores all fault conditions until the internal store process has completed. Issuing STORE_USER_ALL  
also causes the device to be unresponsive through PMBus for a period of approximately 100 ms.  
EEPROM programming faults cause the device to NACK and set the cml bit in the STATUS_BYTE and the mem  
bit in the STATUS_CML registers.  
This command is equivalent to STORE_DEFAULT_ALL.  
7.5.8 RESTORE_USER_ALL (16h)  
The RESTORE_USER_ALL command restores all of the storable register settings from EEPROM memory to  
those registers which are unprotected according to current setting of WRITE_PROTECT. Issuing  
RESTORE_USER_ALL also causes the device to be unresponsive through PMBus for a period of approximately  
100 ms.  
This command is equivalent to RESTORE_DEFAULT_ALL.  
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NOTE  
Do not use this command while the device is actively switching, this causes the device to  
stop switching and the output voltage to fall during the restore event. Depending on  
loading conditions, the output voltage could reach an undervoltage level and trigger an  
undervoltage fault response if programmed to do so. The command can be used while the  
device is switching, but this usage is not recommended as it results in a restart that could  
disrupt power sequencing requirements in more complex systems. TI strongly  
recommends stopping the device before issuing this command.  
7.5.9 CAPABILITY (19h)  
The CAPABILITY command provides a way for a host system to determine some key capabilities of this PMBus  
device.  
COMMAND  
CAPABILITY  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
3
r
2
r
1
r
0
r
r
ALRT  
1
Function  
PEC  
1
SPD  
Reserved  
Default Value  
0
1
0
0
0
0
The default values indicate that the device supports packet-error checking (PEC), a maximum bus speed of  
400 kHz (SPD) and the SMBus alert-response protocol using SMBALERT.  
7.5.10 SMBALERT_MASK (1Bh)  
The SMBALERT_MASK command can be used to prevent a warning or fault condition from asserting the  
SMBALERT signal.  
NOTE  
The command uses the SMBus Write Word command protocol to overlay a “mask byte”  
with an associated/designated status register. It uses the SMBus Block Write/Block Read  
protocol – with a block size = 1, to read the mask settings for any given status register. If  
the host in the Block_Count field of the Block Write portion sends a block size unequal to  
1 the device returns a NACK. The device always returns a Block Count of 1 upon reads of  
SMBALERT_MASK.  
The bits in the mask byte align with the bits in the corresponding status register. For example, if the  
STATUS_TEMPERATURE command were sent with the mask byte 01000000b, then an Overtemperature  
Warning condition would be blocked from asserting SMBALERT. Please refer to the PMBus v1.3 specification -  
section 15.38 (SMBALERT_MASK Command) and the SMBus specification Block Write/Block Read protocol for  
further details.  
There are 19 maskable SMBALERT sources in the TPSM846C23. Each of these 19 status conditions has an  
associated EEPROM backed mask bit. These sources are represnted and identified in the status register  
command descriptions by a particular status bit denoted as having EEPROM backup (for example a bit access of  
r/wE). Writes and reads to SMBALERT_MASK command code accepts only the following as valid STATUS_x  
command codes:  
STATUS_WORD  
STATUS_VOUT  
STATUS_IOUT  
STATUS_INPUT  
STATUS_TEMPERATURE  
STATUS_CML  
STATUS_MFR_SPECIFIC  
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Attempting to write a mask byte for any STATUS_X command code other than this list causes the device to set  
the cml bit in the STATUS_BYTE and the ivd bit in the STATUS_CML registers, and triggers SMBALERT.  
Attempting to read a mask byte for any STATUS_x command code other than this list returns 00h for the mask  
byte. Refer to these individual command descriptions for further details on their specific SMBALERT masking  
capabilities.  
There is one unique status bit in the that warrants special clarification: PGOOD_Z (STATUS_WORD[10]) is  
maskable as an SMBALERT source through SMBALERT_MASK commands to STATUS_WORD. If the user  
wants to write, or read, the mask bit for PGOOD_Z, the user must put 79h in the STATUS_x COMMAND_CODE  
field of the SMBALERT_MASK command. PGOOD_Z SMBALERT_MASK bit default to 1.  
7.5.11 VOUT_MODE (20h)  
The PMBus specification dictates that the data word for the VOUT_MODE command is one byte that consists of  
a 3-bit mode and 5-bit exponent parameter, as shown below. The 3-bit mode sets whether the device uses the  
Linear or Direct modes for output voltage related commands. The 5-bit parameter sets the exponent value for the  
linear data mode. The mode and exponent parameters are fixed and do not permit the user to change the  
values.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
COMMAND  
Bit Position  
VOUT_MODE  
7
r
6
5
r
4
r
3
r
2
1
r
0
r
Access  
r
Mode  
0
r
Exponent  
1
Function  
Default Value  
0
0
1
0
1
1
7.5.11.1 Mode Bit  
Value fixed at 000, linear mode.  
7.5.11.2 Exponent Bit  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent to 1.953 mV/count).  
7.5.12 VOUT_COMMAND (21h)  
The VOUT_COMMAND command sets the output voltage in volts. The contents of this register can be stored to  
nonvolatile memory using the STORE_DEFAULT_ALL command. The exponent is set be VOUT_MODE at –9  
(equivalent of 1.953 mV/count). The programmed internal reference voltage is computed as:  
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×  
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4] )] × 2–9 (V)  
(5)  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The range of valid VOUT_COMMAND values is dependent upon the configured VOUT_SCALE_LOOP (29h) as  
follows:  
VOUT_SCALE_LOOP  
Vout Range (volts)  
VOUT_COMMAND data valid range  
179 to 845  
1
0.35 to 1.65  
(1)  
0.5  
0.7 to 2.0  
358 to 1024  
(1) The TPSM846C23 is designed to be operated with output voltages no higher than 2.0V.  
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Any VOUT_COMMAND > 2816 (5.5-V maximum VOUT equivalent) is treated as invalid data:  
NACK the data byte  
Do not update VOUT_COMMAND  
Set CML bit in STATUS_BYTE  
Set IVD bit in STATUS_CML  
If the value programmed to VOUT_COMMAND exceeds the value stored in either VOUT_MIN or VOUT_MAX. In  
this case, VOUT_COMMAND will be set to the appropriate VOUT_MIN or VOUT_MAX value (which ever was  
violated). See the command descriptions for (28h) VOUT_MIN or (24h) VOUT_MAX for the specific status bits  
set in either case.  
COMMAND  
Format  
VOUT_COMMAND  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Mantissa  
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Function  
Default Value  
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
7.5.12.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent to 1.953 mV/count, specified in  
VOUT_MODE command).  
7.5.12.2 Mantissa  
This is the Mantissa for the linear format. The default for this bit value is: 0000 0001 0000 0000 (binary) 256  
(decimal) (equivalent Vout default = 0.5 V).  
7.5.13 VOUT_MAX (24h)  
The VOUT_MAX command sets the maximum output voltage. The purpose is to protect the devices on the  
output rail supplied by this device from a higher than acceptable output voltage. VOUT_MAX imposes an upper  
bound to any attempt to program the output voltage to a VOUT_EQUIV setting by changing any of the following  
registers:  
VOUT_COMMAND  
VOUT_MAX  
VOUT_MIN  
OPERATION[5]  
OPERATION[4]  
VREF_TRIM  
STEP_VREF_MARGIN_HIGH  
STEP_VREF_MARGIN_LOW  
VOUT_SCALE_LOOP  
The exponent is set be VOUT_MODE at –9 (equivalent to 1.953 mV/count). Use Equation 6 to calculate the  
programmed output voltage.  
MAXIMUM VOUT allowed = VOUT_MAX × VOUT_MODE (V) = VOUT_MAX × 2–9 (V)  
(6)  
The range of valid VOUT_MAX values is dependent upon the configured (29h) VOUT_SCALE_LOOP as shown  
in Equation 7.  
MAXIMUM VOUT Reference allowed = VOUT_MAX × VOUT_SCALE_LOOP x VOUT_MODE (V) = VOUT_MAX ×  
VOUT_SCALE_LOOP × 2–9 (V)  
(7)  
If the output voltage is turned on and any attempt is made to program any one of the following: (1) VOUT_EQUIV  
to be greater than VOUT_MAX; (2) VOUT_MAX to be less than, or equal to, VOUT_MIN, or; (3) VOUT_MIN to  
be greater than, or equal to, VOUT_MAX, – the TPSM846C23 will:  
Clamp the internal reference voltage to VOUT_MAX × VOUT_SCALE_LOOP × VOUT_MODE value. In the  
event VOUT_MAX < VOUT_MIN, VOUT_MAX shall dominate.  
Sets the OTH (other) bit in the STATUS_BYTE  
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Sets the VFW bit in the STATUS_WORD  
Sets the VOUT_MAX_MIN_Warning bit in the STATUS_VOUTregister  
Notifies the host through the SMBALERT pin  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
COMMAND  
Format  
VOUT_MAX  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
7.5.13.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95 mV/count, specified in  
VOUT_MODE command).  
7.5.13.2 Mantissa  
The range of valid VOUT_MAX values is dependent upon the configured (29h) VOUT_SCALE_LOOP as follows.  
If VOUT_SCALE_LOOP = 1:  
default: 0000 0011 0100 1101 (binary) 845 (decimal) (equivalent VOUT_MAX = 1.65 V)  
Minimum: 0000 0001 0001 1010 (binary) 282 (decimal) (equivalent VOUT_MAX = 0.55 V)  
Maximum: 0000 0011 0100 1101 (binary) 845 (decimal) (equivalent VOUT_MAX = 1.65 V)  
If VOUT_SCALE_LOOP = 0.5:  
default: 0000 0110 1001 1010 (binary) 1690 (decimal) (equivalent VOUT_MAX = 3.3 V)  
Minimum: 0000 0010 0011 0100 (binary) 564 (decimal) (equivalent VOUT_MAX = 1.1 V)  
Maximum: 0000 0110 1001 1010 (binary) 1690 (decimal) (equivalent VOUT_MAX = 3.3 V)  
7.5.14 VOUT_TRANSITION_RATE (27h)  
The VOUT_TRANSITION_RATE command sets the rate of change in mV/µs of any output voltage change  
during normal operation (also includes output voltage changes in TOFF_DELAY state. In contrast, the soft-start  
transition rate is controlled by TON_RISE and the TOFF_FALL transition rate is controlled by TOFF_FALL  
command).  
For PWM loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
Only 8 fixed output voltage transition rates are available in the device. As such, the range of programmed VOUT  
-
transition rates are sub-divided into 8 buckets that then selects one of the 8 fixed VOUT-transition rates.  
Programmed values are rounded to the nearest bucket/transition rate as outlined below:  
COMMAND  
Format  
VOUT_TRANSITION_RATE  
Linear, two’s complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
r/w  
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
1
Default Value  
1
1
1
0
0
0
0
0
0
1
1
1
0
0
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7.5.14.1 Exponent  
default: 11010 (binary) –6 (decimal) (0.015625)  
These default settings are not programmable.  
7.5.14.2 Mantissa  
default: 000 0011 1100 (binary) 60 (decimal) (equivalent VOUT_TRANSITION_RATE = 1 mV/µs)  
NOTE  
Using VOUT_TRANSITION_RATE to slew Vref faster than the voltage loop can track is  
possible, but may result in a overshoot/undershoot on the output voltage.  
VOUT_TRANSITION Mantissa (d)  
VOUT_TRANSITION  
rate (mV/µs)  
Greater than  
Less than or equal to  
0.067  
0.1  
5
5
7
0.143  
0.222  
0.333  
0.5  
7
12  
17  
25  
47  
79  
12  
17  
25  
47  
79  
1
1.5  
7.5.15 VOUT_SCALE_LOOP (29h)  
The VOUT_SCALE_LOOP command is is limited to only 2 possible options/ratios: 1 (default, no RSET needed),  
0.5 (RSET= 10 kΩ). Attempting to write a value unequal to one of these options cause the device to set the cml bit  
in the STATUS_BYTE, and the ivd bit in the STATUS_CML registers. Additionally, SMBALERT is asserted and  
the value of VOUT_SCALE_LOOP remains unchanged. The contents of this register can be stored to nonvolatile  
memory using the STORE_DEFAULT_ALL command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
NOTE  
Construct the feedback resistor ratio appropriately (see 5). If the  
VOUT_SCALE_LOOP does not match the external feedback resistor ratio, the converter  
will regulate the output with the reference voltage as outlined in 公式 2. Program the  
VOUT_SCALE_LOOP setting before the output is turned on.  
For the range checking to work properly and to avoid invalid data scenarios:  
VOUT_SCALE_LOOP should be changed first, if needed.  
VOUT_MIN and VOUT_MAX should be changed after VOUT_SCALE_LOOP, if needed.  
Additionally, it is assumed that VOUT_SCALE_LOOP will be programmed before the output is turned on; but,  
the hardware will not do anything to prohibit changing VOUT_SCALE_LOOP in any state.  
COMMAND  
Format  
VOUT_SCALE_LOOP  
Linear, two’s complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
1
0
r/wE  
r/wE  
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
0
0
1
0
0
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7.5.15.1 Exponent  
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25)  
These default settings are not programmable.  
7.5.15.2 Mantissa  
default: 000 0000 0100 (binary) 4 (decimal) (equivalent VOUT_SCALE_LOOP voltage = 1)  
For VOUT_SCALE_LOOP = 1, mantissa = 004h. (4 × 2–2 = 1)  
For VOUT_SCALE_LOOP = 0.5, mantissa = 002h. (2 × 2–2 = 0.5)  
7.5.16 VOUT_MIN (2Bh)  
The VOUT_MIN command sets the minimum output voltage. The purpose is to protect the devices on the output  
rail supplied by this device from a lower than acceptable output voltage. VOUT_MIN imposes a lower bound to  
any attempt to program the output voltage to a VOUT_EQUIV setting by changing any of the following registers:  
VOUT_COMMAND  
VOUT_MAX  
VOUT_MIN  
OPERATION[5]  
OPERATION[4]  
VREF_TRIM  
STEP_VREF_MARGIN_HIGH  
STEP_VREF_MARGIN_LOW  
VOUT_SCALE_LOOP  
The exponent is set be VOUT_MODE at –9 (equivalent of 1.953 mV/count). Use Equation 8 to calculate the  
programmed output voltage.  
MINIMUM VOUT allowed = VOUT_MIN × VOUT_MODE (V) = VOUT_MIN × 2–9 (V)  
(8)  
The range of valid VOUT_MIN values is dependent upon the configured (29h) VOUT_SCALE_LOOP as shown  
in Equation 9.  
MINIMUM VOUT allowed = VOUT_MIN × VOUT_SCALE_LOOP × VOUT_MODE (V) = VOUT_MIN ×  
VOUT_SCALE_LOOP × 2–9 (V)  
(9)  
If, while the output voltage is turned on, any attempt is made to program: (1) VOUT_EQUIV to be less than  
VOUT_MIN, the device will:  
Clamp the internal reference voltage to VOUT_MIN × VOUT_SCALE_LOOP × VOUT_MODE value. In the  
event VOUT_MAX < VOUT_MIN, VOUT_MAX shall dominate.  
Sets the OTH (other) bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the VOUT_MAX_MIN_Warning bit in the STATUS_VOUTregister  
Notifies the host through the SMBALERT pin  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
COMMAND  
Format  
VOUT_MIN  
Linear, unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
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7.5.16.1 Exponent  
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95 mV/count, specified in  
VOUT_MODE command).  
7.5.16.2 Mantissa  
The range of valid VOUT_MIN values is dependent upon the configured (29h) VOUT_SCALE_LOOP as follows.  
If VOUT_SCALE_LOOP = 1:  
default: 0000 0000 1011 0011 (binary) 179 (decimal) (equivalent VOUT_MIN = 0.35 V)  
Minimum: 0000 0000 1011 0011 (binary) 179 (decimal) (equivalent VOUT_MIN = 0.35 V)  
Maximum: 0000 0011 0000 0000 (binary) 768 (decimal) (equivalent VOUT_MIN = 1.5 V)  
If VOUT_SCALE_LOOP = 0.5:  
default: 0000 0001 0110 0110 (binary) 358 (decimal) (equivalent VOUT_MIN = 0.7 V)  
Minimum: 0000 0001 0110 0110 (binary) 358 (decimal) (equivalent VOUT_MIN = 0.7 V)  
Maximum: 0000 0110 0000 0000 (binary) 1536 (decimal) (equivalent VOUT_MIN = 3 V)  
7.5.17 VIN_ON (35h)  
The VIN_ON command sets the value of the input voltage at which the unit should start operation assuming all  
other required startup conditions are met. Values are mapped to the nearest supported increment. Values  
outside the supported range are treated as invalid data and cause the device set the CML bit in the  
STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers, and trigger SMBALERT signal. The  
value of VIN_ON remains unchanged on an out-of-range write attempt. The contents of this register can be  
stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The supported VIN_ON values are shown in Table 9:  
Table 9. Supported VIN_ON Values  
VIN_ON Values (V)  
4.25  
5.5  
4.5 (default)  
4.75  
6
5
5.25  
6.5  
5.75  
7
6.25  
7.5  
6.75  
7.25  
7.75  
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF  
higher than VIN_ON results in the new value being rejected, SMBALERT signal being asserted along with the  
CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
The data word that accompanies this command is divided into a fixed 5-bit exponent and an 11-bit mantissa. The  
four most significant bits of the mantissa are fixed, while the lower 4 bits may be altered.  
COMMAND  
Format  
VIN_ON  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
1
0
0
1
0
7.5.17.1 Exponent  
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25 V)  
These default settings are not programmable.  
7.5.17.2 Mantissa  
default: 000 0001 0010 (binary) 18 (decimal) (equivalent VIN_ON voltage = 4.5 V)  
Minimum: 000 0001 0001 (binary) 17 (decimal) (equivalent VIN_ON voltage = 4.25 V)  
42  
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Maximum: 000 0001 1111 (binary) 31 (decimal) (equivalent VIN_ON voltage = 7.75 V)  
7.5.18 VIN_OFF (36h)  
The VIN_OFF command sets the value of the input voltage at which the unit should stop operation. Values are  
mapped to the nearest supported increment. Values outside the supported range is treated as invalid data and  
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML  
registers, and trigger SMBALERT signal. The value of VIN_OFF remains unchanged during an out-of-range write  
attempt. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL  
command.  
The supported VIN_OFF values are shown in Table 10:  
Table 10. Supported VIN_OFF Values  
VIN_OFF Values (V)  
4 (default)  
5.25  
4.25  
5.5  
4.5  
5.75  
7
4.75  
6
5
6.25  
7.5  
6.5  
6.75  
7.25  
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF  
higher than VIN_ON results in the new value being rejected, SMBALERT being asserted along with the cml bit in  
STATUS_BYTE and the invalid data bit in STATUS_CML.  
The data word that accompanies this command is divided into a fixed 5 bit exponent and an 11 bit mantissa. The  
4 most significant bits of the mantissa are fixed, while the lower 7 bits may be altered.  
COMMAND  
Format  
VIN_OFF  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
1
r
Mantissa  
0
Function  
Default Value  
1
1
1
0
0
0
0
0
0
1
0
0
0
0
7.5.18.1 Exponent  
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25 V)  
These default settings are not programmable.  
7.5.18.2 Mantissa  
default: 000 0001 0000 (binary) 16 (decimal) (equivalent VIN_OFF voltage = 4 V)  
Minimum: 000 0001 0000 (binary) 16 (decimal) (equivalent VIN_OFF voltage = 4 V)  
Maximum: 000 0001 1110 (binary) 30 (decimal) (equivalent VIN_OFF voltage = 7.5 V)  
7.5.19 IOUT_CAL_OFFSET (39h)  
The IOUT_CAL_OFFSET command is used to compensate for offset errors in the READ_IOUT results and the  
IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT thresholds. The units are amperes. The default setting is  
0 A. The resolution of the argument for this command is 62.5 mA and the range is +3.9375 A to –4 A. Values  
written outside of this range alias into the supported range. This occurs because the read-only bits are fixed. The  
exponent is always –4 and the 5 MSB bits of the Mantissa are always equal to the sign bit. The contents of this  
register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
IOUT_CAL_OFFSET  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Function  
Exponent  
Mantissa  
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COMMAND  
IOUT_CAL_OFFSET  
Default Value  
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.19.1 Exponent  
default: 11100 (binary) –4 (decimal) (LSB = 62.5 mA)  
These default settings are not programmable.  
7.5.19.2 Mantissa  
MSB is programmable with sign, next 4 bits are sign extend only.  
Lower six bits are programmable with a default value of 0 (decimal).  
7.5.20 VOUT_OV_FAULT_RESPONSE (41h)  
The VOUT_OV_FAULT_RESPONSE command instructs the device on what action to take in response to an  
Output Over Voltage Fault based on MFR_SPECIFIC_07 (PCT_OV_UV_WRN_FLT_LIMITS). The device also:  
Sets the OVF bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the OVF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The default response to a output overvoltage fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
VOUT_OV_FAULT_RESPONSE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
1
0
r
TD[2]  
1
r
TD[1]  
1
r
TD[0]  
1
Function  
0
0
RS[1]  
1
RS[0]  
1
Default Value  
7.5.20.1 RSP[1] Bit  
This bit sets the output voltage overvoltage response to either ignore or not. The default for this bit is 1.  
BIT VALUE  
ACTION  
The PMBus device continues operation without interruption. Note: In this ignore fault  
response mode, the associated fault status bits is set. Additionally, SMBALERT  
remains triggered if it is not masked.  
0
1
The PMBus device shuts down and restarts according to RS[2:0].  
7.5.20.2 RS[2:0] Bits  
These bits are output voltage overvoltage retry setting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry setting means that the unit does not attempt to restart. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry setting means that the unit goes through a normal startup (Soft  
start) continuously, without limitation, until it is commanded off or bias power is  
removed or another fault condition causes the unit to shutdown.  
111  
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Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the  
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
Note: because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
7.5.20.3 TD[2:0] Bits  
These bits are output voltage overvoltage retry time delay retting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry time delay setting means that the unit does not attempt to  
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry time delay setting means that the unit waits 7 TON_RISE  
times before it goes through a normal startup (Soft start). This is only supported when  
Restart is enabled by RS[2:0] = 111.  
111  
These bits are direct reflections of the RS[2] (bit 5) value in this register.  
7.5.21 VOUT_UV_FAULT_RESPONSE (45h)  
The VOUT_UV_FAULT_RESPONSE command instructs the device on what action to take in response to an  
Output Under Voltage Fault based on MFR_SPECIFIC_07 (PCT_OV_UV_WRN_FLT_LIMITS). The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the UVF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The default response to a output undervoltage fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
VOUT_UV_FAULT_RESPONSE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
1
0
r
TD[2]  
1
r
TD[1]  
1
r
TD[0]  
1
Function  
0
0
RS[1]  
1
RS[0]  
1
Default Value  
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7.5.21.1 RSP[1] Bit  
This bit sets the output voltage undervoltage response to either ignore or not. The default for this bit is 1.  
BIT VALUE  
ACTION  
The PMBus device continues operation without interruption. Note: In this ignore fault  
response mode, the associated fault status bits are set. Additionally, SMBALERT  
continues to be triggered if it is not masked.  
0
1
The PMBus device shuts down and restarts according to RS[2:0].  
7.5.21.2 RS[2:0] Bits  
These bits are output voltage undervoltage retry setting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry setting means that the unit does not attempt to restart. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry setting means that the unit goes through a normal startup (soft  
start) continuously, without limitation, until it is commanded off or bias power is  
removed or another fault condition causes the unit to shutdown.  
111  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the  
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
7.5.21.3 TD[2:0] Bits  
These bits are output voltage undervoltage retry time delay retting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry time delay setting means that the unit does not attempt to  
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry time delay setting means that the unit waits 7 TON_RISE  
times before it goes through a normal startup (Soft start). This is only supported when  
Restart is enabled by RS[2:0] = 111.  
111  
These bits are direct reflections of the RS[2] (bit 5) value in this register.  
7.5.22 IOUT_OC_FAULT_LIMIT (46h)  
The IOUT_OC_FAULT_LIMIT command sets the value of the output current, in amperes, that causes the  
overcurrent detector to indicate an overcurrent fault condition. The IOUT_OC_FAULT_LIMIT should be set equal  
to or greater than the IOUT_OC_WARN_LIMIT. Writing a value to IOUT_OC_FAULT_LIMIT less than  
IOUT_OC_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd)  
bit in the STATUS_CML registers as well as assert the SMBALERT signal. The contents of this register can be  
stored to nonvolatile memory using the STORE_DEFAULT_ALL command. Since 2-LSBs are not stored in  
EEPROM, on STORE, always round up. If IOUT_OC_FAULT_LIMIT [1:0] > 0, add 1 to IOUT_OC_FAULT_LIMIT  
[6:2]  
The IOUT_OC_FAULT_LIMIT takes a two-byte data word formatted as shown below:  
COMMAND  
Format  
IOUT_OC_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
r/w  
r/w  
Function  
Exponent  
Mantissa  
Default Value  
See Below  
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7.5.22.1 Exponent  
default: 11111 (binary) –1 (decimal) (0.5 A)  
These default settings are not programmable.  
7.5.22.2 Mantissa  
The upper four bits are fixed at 0.  
The lower seven bits are programmable.  
Use Equation 10 to calculate the actual output current for a given mantissa and exponent.  
Mantissa  
=
IOUT(oc) = Mantissa´ 2Exponent  
2
(10)  
The default values and allowable ranges for each device are summarized below:  
OC_FAULT_LIMIT  
DEFAULT  
42  
DEVICE  
UNIT  
MIN  
MAX  
TPSM846C23  
5
52  
A
7.5.23 IOUT_OC_FAULT_RESPONSE (47h)  
The IOUT_OC_FAULT_RESPONSE command instructs the device on what action to take in response to an  
IOUT_OC_FAULT_LIMIT. The device also:  
Sets the OCF bit in the STATUS_BYTE  
Sets the OCFW bit in the STATUS_WORD  
Sets the OCF bit in the STATUS_IOUT register, and  
Notifies the host by asserting SMBALERT  
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The default response to an overcurrent fault is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
IOUT_OC_FAULT_RESPONSE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r/w  
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
1
0
r
TD[2]  
1
r
TD[1]  
1
r
TD[0]  
1
Function  
RSP[0]  
1
RS[1]  
1
RS[0]  
1
Default Value  
7.5.23.1 RSP[1:0] Bits  
These bits set the overcurrent fault response to either ignore or not. The default for this bit is 11b. Any value  
other than 00b or 11b will not be accepted, such and attempt will cause the ’cml’ bit in the STATUS_BYTE  
register and the ivd bit in the STATUS_CML register to be set, and assert SMBALERT. Because both bits must  
be the same, only one (bit 7) is stored in EEPROM. The default for this bit is 11b.  
BIT VALUE  
ACTION  
The PMBus device continues operation without interruption. Note: In this “ignore” fault  
response mode, the associated fault status bits are set. Additionally, SMBALERT  
continues to be triggered if it is not masked.  
00  
11  
The PMBus device shuts down and restarts according to RS[2:0].  
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7.5.23.2 RS[2:0] Bits  
These bits are overcurrent fault retry setting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry setting means that the unit does not attempt to restart. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry setting means that the unit goes through a normal startup  
(soft-start) continuously, without limitation, until it is commanded off or bias power is  
removed or another fault condition causes the unit to shutdown.  
111  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the  
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
7.5.23.3 TD[2:0] Bits  
These bits are over current retry time delay retting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry time delay setting means that the unit does not attempt to  
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry time delay setting means that the unit waits 7 TON_RISE  
times before it goes through a normal startup (Soft start). This is only supported when  
Restart is enabled by RS[2:0] = 111.  
111  
These bits are direct reflections of the RS[2] (bit 5) value in this register.  
7.5.24 IOUT_OC_WARN_LIMIT (4Ah)  
The IOUT_OC_WARN_LIMIT command sets the value of the output current, in amperes, that causes the  
overcurrent detector to indicate an overcurrent warning. When this current level is exceeded the device:  
Sets the oth bit in the STATUS_BYTE  
Sets the OCFW bit in the STATUS_WORD  
Sets the OCW bit in the STATUS_IOUT register, and  
Notifies the host by asserting SMBALERT  
The IOUT_OC_WARN_LIMIT threshold should always be set to less than or equal to the  
IOUT_OC_FAULT_LIMIT. Writing a value to IOUT_OC_WARN_LIMIT greater than IOUT_OC_FAULT_LIMIT  
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML  
registers as well as assert the SMBALERT signal. In such case, the register content will remain unchanged. This  
behavior can be overridden by the user setting Data Limit Override (DLO) in MFR_SPECIFIC_21[4].  
The default IOUT_OC_WARN_LIMIT is always set to 87.5% of the OCF value. Because the  
IOUT_OC_WARN_LIMIT is not stored in EEPROM, the IOUT_OC_WARN_LIMIT register is set to 12.5% less  
than the stored OCF threshold upon any RESTORE from EEPROM (reset_restore, or  
RESTORE_DEFAULT_ALL command). The digital math to achieve this is: OCW_default = (OCF – OCF/8).  
The IOUT_OC_WARN_LIMIT takes a two byte data word formatted as shown below:  
COMMAND  
Format  
IOUT_OC_WARN_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Exponent  
Mantissa  
Default Value  
See Below  
48  
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7.5.24.1 Exponent  
default: 11111 (binary) –1 (decimal) (0.5 A)  
These default settings are not programmable.  
7.5.24.2 Mantissa  
The upper four bits are fixed at 0.  
Lower seven bits are programmable.  
The actual output warning current level for a given mantissa and exponent is:  
Mantissa  
IOUT (OCW ) = Mantissa × 2Exponent  
=
2
(11)  
The default values and allowable ranges for each device are summarized below:  
OC_WARN_LIMIT  
DEVICE  
UNIT  
MIN  
DEFAULT  
MAX  
TPSM846C23  
4
37  
50  
A
7.5.25 OT_FAULT_LIMIT (4Fh)  
The OT_FAULT_LIMIT command sets the value of the temperature, in degrees Celsius, that causes an  
overtemperature fault condition, when the sensed temperature from the internal sensor exceeds this limit.  
The OT_FAULT_LIMIT must always be greater than the OT_WARN_LIMIT. Writing a value to OT_FAULT_LIMIT  
less than or equal to OT_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the  
invalid data (ivd) bit in the STATUS_CML registers as well as asserts the SMBALERT signal. The contents of  
this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The OT_FAULT_LIMIT takes a two byte data word formatted as shown below.  
COMMAND  
Format  
OT_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
6
5
r/wE  
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
1
0
1
0
0
0
1
7.5.25.1 Exponent  
default: 00000 (binary) 0 (decimal) (represents mantissa with steps of 1 degree Celcius)  
These default settings are not programmable.  
7.5.25.2 Mantissa  
default: 000 1001 0001 (binary) 145 (decimal) (145°C)  
Minimum: 000 0111 1000 (binary) (equivalent OTF = 120°C)  
Maximum: 000 1010 0101 (binary) (equivalent OTF = 165°C)  
7.5.26 OT_FAULT_RESPONSE (50h)  
The OT_FAULT_RESPONSE command instructs the device on what action to take in response to an  
OT_FAULT_LIMIT. The device also:  
Sets the OTFW bit in the STATUS_BYTE  
Sets the OTF bit in the STATUS_TEMPERATURE  
Notifies the host by asserting SMBALERT  
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When the overtemperature fault is tripped, the fault flag is latched until the internal sensed temperature  
decreases 20°C from the OT_FAULT_LIMIT.  
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The default response to an over temperature fault is to ignore. Fixed Bandgap Detected Overtemperature faults  
are never ignored. The Bandgap OT faults always respond in a shutdown and attempted restart once the part  
cools.  
COMMAND  
OT_FAULT_RESPONSE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
0
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
1
0
r
TD[2]  
1
r
TD[1]  
1
r
TD[0]  
1
Function  
0
0
RS[1]  
1
RS[0]  
1
Default Value  
7.5.26.1 RSP[1] Bit  
This bit sets the over temperature fault response to either ignore or not. The default for this bit is 0.  
BIT VALUE  
ACTION  
The PMBus device continues operation without interruption. Note: In this “ignore” fault  
response mode, the associated fault status bits are set. Additionally, SMBALERT  
continues to be triggered if it is not masked.  
0
1
The PMBus device shuts down and restarts according to RS[2:0].  
7.5.26.2 RS[2:0] Bits  
These bits are over temperature fault retry setting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the Retry Setting means that the unit does not attempt to restart. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the Retry Setting means that the unit goes through a normal startup (Soft  
start) continuously, without limitation, until it is commanded off or bias power is removed  
or another fault condition causes the unit to shutdown.  
111  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the  
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
NOTE  
The programmed response here is also applied to the bandgap-detected overtemperture  
(OT) faults with the one exception of the ignore response. The fixed Bandgap-detected  
overtemperature faults are never ignored. The bandgap OT faults always respond in a  
shutdown and attempted restart when the part cools.  
7.5.26.3 TD[2:0] Bits  
These bits are overtemperature fault retry time delay retting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry time delay setting means that the unit does not attempt to delay a  
restart. This is only supported when restart is disabled by RS[2:0] = 000. The output  
remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry time delay setting means that the unit waits 7 TON_RISE times  
before it goes through a normal startup (soft start). This is only supported when restart is  
enabled by RS[2:0] = 111.  
111  
50  
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These bits are direct reflections of the RS[2] (bit 5) value in this register.  
7.5.27 OT_WARN_LIMIT (51h)  
The OT_WARN_LIMIT command sets the value of the temperature, in degrees Celsius, that causes an  
overtemperature warning condition, when the sensed temperature from the internal sensor exceeds this limit.  
Upon triggering the overtemperature warning, the device takes the following actions:  
Sets the TEMPERATURE bit in the STATUS_BYTE  
Sets the OT Warning bit in the STATUS_TEMPERATURE  
Notifies the host by asserting SMBALERT  
Once the overtemperature warning is tripped, the warning flag is latched until the internal sensed temperature  
decreases 20°C from the OT_WARN_LIMIT.  
The OT_WARN_LIMIT must always be less than the OT_FAULT_LIMIT. Writing a value to OT_WARN_LIMIT  
greater than or equal to OT_FAULT_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the  
invalid data (ivd) bit in the STATUS_CML registers as well as assert the SMBALERT signal. In such case, the  
register content will remain unchanged. This behavior can be overridden by the user setting Data Limit Override  
(DLO) in MFR_SPECIFIC_21[4].  
The default OT_WARN_LIMIT is mathematically derived from the EEPROM backed OTF limit by subtracting 25  
from (4Fh) OT_FAULT_LIMIT to reach the default OT_WARN_LIMIT. If the calculated OTW is less than 100°C,  
then the default value is set to 100°C. OTW=max(OTF-25, 100)  
The OT_WARN_LIMIT takes a two byte data word formatted as shown below:  
COMMAND  
Format  
OT_WARN_LIMIT  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
6
5
r/w  
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
1
Default Value  
0
0
0
0
0
0
0
0
1
1
1
0
0
0
7.5.27.1 Exponent  
default: 00000 (binary) 0 (decimal) (represents mantissa with steps of 1 degree Celcius)  
These default settings are not programmable.  
7.5.27.2 Mantissa  
default: 000 0111 1000 (binary) 120 (decimal) (120°C) 25°C less than default OTF  
Minimum: 000 0110 0100 (binary) (equivalent OTF = 100°C)  
Maximum: 000 1000 1100 (binary) (equivalent OTF = 140°C)  
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7.5.28 TON_DELAY (60h)  
The TON_DELAY command sets the time in milliseconds, from when a start condition is received to when the  
output voltage starts to rise. The contents of this register can be stored to nonvolatile memory using the  
STORE_DEFAULT_ALL command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The TON_DELAY command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_DELAY  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.28.1 Exponent  
default: 00000 (binary) 0 (decimal) (1 millisecond)  
These default settings are not programmable.  
7.5.28.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000  
(binary) (0 ms).  
Only 16 fixed TON_DELAY times are available in the device. As such, the range of programmed TON_DELAY  
settings are sub-divided into 16 buckets that then selects one of the 16 supported times. Programmed values are  
rounded to the nearest bucket/transition rate as outlined in the table Supported TON_DELAY Values:  
Table 11. Supported TON_DELAY Values  
EFFECTIVE  
TON_DELAY  
(ms)  
PROGRAMMED TON_DELAY MANTISSA (decimal)  
Greater than  
Less than or equal to  
0 (50 us)  
0
0
1
1
2
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
52  
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7.5.29 TON_RISE (61h)  
The TON_RISE command sets the time in milliseconds, from when the reference starts to rise until the voltage  
has entered the regulation band. The contents of this register can be stored to nonvolatile memory using the  
STORE_DEFAULT_ALL command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
Programming a value of 0 instructs the unit to bring its output voltage to the programmed regulation value as  
quickly as possible. For the device, this results in an effective TON_RISE time of 1ms (fastest time supported).  
The TON_RISE command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_RISE  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
1
1
7.5.29.1 Exponent  
default: 00000 (binary) 0 (decimal) (1 millisecond)  
These default settings are not programmable.  
7.5.29.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0011  
(binary) (3 ms). For PWM loop slave device, the effective TON_RISE time is locked at 100 ms.  
The supported TON_RISE times over PMBus are shown in Table 12:  
Table 12. Supported TON_RISE Values  
Programmed TON_RISE Mantissa (d)  
Effective  
TON_RISE (ms)  
Greater than  
Less than or equal to  
1
2
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
72  
100  
9
12  
17  
22  
32  
44  
62  
86  
12  
17  
22  
32  
44  
62  
86  
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7.5.30 TON_MAX_FAULT_LIMIT (62h)  
The TON_MAX_FAULT_LIMIT command sets an UPPER limt in milliseconds, on how long the unit can attempt  
to power up the output without reaching the output undervoltage fault limit. The time begins counting as soon as  
the device enters the soft-start state begins to ramp the output. In other words, the TON_MAX_FAULT_LIMIT  
timer starts at the beginning of the TON_RISE state.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
When TON_MAX_FAULT_LIMIT is set to 0, the TON_MAX_FAULT timer is disabled, which means that there is  
no limit and that the unit can attempt to bring up the output voltage indefinitely.  
The device does not prohibit setting TON_MAX_FAULT_LIMIT < TON_RISE, however, in this configuration, the  
device will trigger a TON_MAX_FAULT if the VOUT has not risen above the UVF threshold by 4 seconds after  
the TON_DELAY and TON_RISE times expire.  
The TON_MAX_FAULT_LIMIT command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TON_MAX_FAULT_LIMIT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r
Exponent  
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.30.1 Exponent  
default: 00000 (binary) 0 (decimal) (Disable)  
These default settings are not programmable.  
7.5.30.2 Mantissa  
The upper four bits are fixed at 0.  
This register is not EEPROM backed,  
a
RESTORE_DEFAULT_ALL command causes the  
TON_MAX_FAULT_LIMIT to restore to the default 0 ms value.  
The supported TON_MAX_FAULT_LIMIT times over PMBus are shown below:  
Table 13. Supported TON_MAX_FAULT_LIMIT Values  
Effective  
TON_MAX_FAULT_LI  
MIT (ms)  
Programmed TON_MAX_FAULT_LIMIT Mantissa (d)  
Greater than  
Less than or equal to  
No Limit (timer  
disabled)  
0
1
2
0
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
27  
37  
52  
9
12  
17  
22  
32  
44  
62  
12  
17  
22  
32  
44  
54  
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Table 13. Supported TON_MAX_FAULT_LIMIT Values (continued)  
Effective  
TON_MAX_FAULT_LI  
MIT (ms)  
Programmed TON_MAX_FAULT_LIMIT Mantissa (d)  
Greater than  
Less than or equal to  
72  
62  
86  
86  
100  
7.5.31 TON_MAX_FAULT_RESPONSE (63h)  
The TON_MAX_FAULT_RESPONSE command instructs the device on what action to take in response to an  
TON_MAX_FAULT_LIMIT.  
The device also:  
Sets the oth bit in the STATUS_BYTE  
Sets the VFW bit in the STATUS_WORD  
Sets the TONMAXF bit in the STATUS_VOUT register, and  
Notifies the host by asserting SMBALERT  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
The default response to a TON_MAX_FAULT is to shut down and restart with 7 × TON_RISE time delay.  
COMMAND  
TON_MAX_FAULT_RESPONSE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
RSP[1]  
1
6
r
5
r/wE  
RS[2]  
1
4
r/w  
3
r/w  
2
1
0
r
TD[2]  
1
r
TD[1]  
1
r
TD[0]  
1
Function  
0
0
RS[1]  
1
RS[0]  
1
Default Value  
7.5.31.1 RSP[1] Bit  
This bit sets the TON_MAX_FAULT response to either ignore or not. The default for this bit is 1.  
BIT VALUE  
ACTION  
The PMBus device continues operation without interruption. Note: In this ignore fault  
response mode, the associated fault status bits are set. Additionally, SMBALERT  
continues to be triggered if it is not masked.  
0
1
The PMBus device shuts down and restarts according to RS[2:0].  
7.5.31.2 RS[2:0] Bits  
These bits are TON_MAX_FAULT retry setting. The default for this bit is 111b.  
BIT VALUE  
ACTION  
A zero value for the retry setting means that the unit does not attempt to restart. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
A one value for the retry setting means that the unit goes through a normal startup (soft  
start) continuously, without limitation, until it is commanded off or bias power is  
removed or another fault condition causes the unit to shutdown.  
111  
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the  
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.  
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.  
7.5.31.3 TD[2:0] Bits  
These bits are TON_MAX_FAULT retry time delay retting. The default for this bit is 111b.  
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BIT VALUE  
ACTION  
A zero value for the retry time delay setting means that the unit does not attempt to  
delay a restart. This is only supported when restart is disabled by RS[2:0] = 000. The  
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus  
specification)  
000  
111  
A one value for the retry time delay setting means that the unit waits 7 TON_RISE  
times before it goes through a normal startup (soft start). This is only supported when  
restart is enabled by RS[2:0] = 111.  
These bits are direct reflections of the RS[2] (bit 5) value in this register.  
7.5.32 TOFF_DELAY (64h)  
The TOFF_DELAY command sets the time in milliseconds, from when a stop condition is received and when the  
output voltage starts to fall. The contents of this register can be stored to nonvolatile memory using the  
STORE_DEFAULT_ALL command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The TOFF_DELAY command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TOFF_DELAY  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.32.1 Exponent  
default: 00000 (binary) 0 (decimal) (1 millisecond)  
These default settings are not programmable.  
7.5.32.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000  
(binary) (0 ms).  
Only 16 fixed TOFF_DELAY times are available in the device. As such, the range of programmed TOFF_DELAY  
settings are sub-divided into 16 buckets that then selects one of the 16 supported times. Programmed values are  
rounded to the nearest bucket/transition rate as outlined in the table Supported TOFF_DELAY Values:  
Table 14. Supported TOFF_DELAY Values  
EFFECTIVE  
TOFF_DELAY  
(ms)  
PROGRAMMED TOFF_DELAY MANTISSA (decimal)  
Greater than  
Less than or equal to  
0
1
0
0
1
2
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
9
12  
17  
22  
12  
17  
56  
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Table 14. Supported TOFF_DELAY Values (continued)  
EFFECTIVE  
TOFF_DELAY  
(ms)  
PROGRAMMED TOFF_DELAY MANTISSA (decimal)  
Greater than  
Less than or equal to  
27  
37  
22  
32  
44  
62  
86  
32  
44  
62  
86  
52  
72  
100  
7.5.33 TOFF_FALL (65h)  
The TOFF_FALL command sets the time in milliseconds, from the end of the TOFF_DELAY time until the  
voltage reaches 0 V. The contents of this register can be stored to nonvolatile memory using the  
STORE_DEFAULT_ALL command.  
Programming a value of 0 instructs the unit to bring its output voltage down to 0 as quickly as possible. For the  
device, this results in actively ramping down the output voltage in 1 ms (the fastest supported ramp down).  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The TOFF_FALL command is formatted as a linear mode two’s complement binary integer.  
COMMAND  
Format  
TOFF_FALL  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r
Exponent  
0
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.33.1 Exponent  
default: 00000 (binary) 0 (decimal) (1 millisecond)  
These default settings are not programmable.  
7.5.33.2 Mantissa  
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0011  
(binary) (3 ms).  
The supported TOFF_FALL times over PMBus are shown in Supported TOFF_FALL Values:  
Table 15. Supported TOFF_FALL Values  
Programmed TOFF_FALL Mantissa (d)  
Greater than Less than or equal to  
Effective  
TOFF_FALL (ms)  
1
2
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10  
14  
19  
9
12  
17  
22  
12  
17  
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Table 15. Supported TOFF_FALL Values (continued)  
Programmed TOFF_FALL Mantissa (d)  
Greater than Less than or equal to  
Effective  
TOFF_FALL (ms)  
27  
37  
22  
32  
44  
62  
86  
32  
44  
62  
86  
52  
72  
100  
7.5.34 STATUS_BYTE (78h)  
The STATUS_BYTE command returns one byte of information with a summary of the most critical device faults.  
COMMAND  
STATUS_BYTE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW  
0
Function  
X
0
OFF  
X
OVF  
0
OCF  
0
X
0
CML  
0
oth  
1
Default Value  
A 1 in any of these bit positions indicates that:  
OFF  
The device is not providing power to the output, regardless of the reason. In this family of devices,  
this flag means that the converter is not enabled.  
OVF  
An output overvoltage fault has occurred. This bit directly reflects the state of STATUS_VOUT[7] –  
OVF. If the user wants this fault source to be masked and not trigger SMBALERT, they must do it  
by masking STATUS_VOUT[7]. Per the PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not  
clearable through a PMBus write. In contrast, the bit is to be cleared by clearing the bits in  
STATUS_VOUT that cause this bit to be set. For loop slave device, this bit is 0.  
OCF  
An output overcurrent fault has occurred. This bit directly reflect the state of STATUS_IOUT[7] –  
OCF. If the user wants this fault sourced to be masked and not trigger SMBALERT, they must do it  
by masking STATUS_IOUT[7]. Per the PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not  
clearable through a PMBus write. In contrast, the bit is to be cleared by clearing the bits in  
STATUS_IOUT that cause this bit to be set.  
OTFW  
A temperature fault or warning has occurred. Check STATUS_TEMPERATURE. Per the PMBus  
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,  
the bit is to be cleared by clearing the bits in STATUS_TEMPERATURE that cause this bit to be  
set.  
CML  
oth  
A communications, memory or logic fault has occurred. Check STATUS_CML. Per the PMBus v1.3  
spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit  
is to be cleared by clearing the bits in STATUS_CML that cause this bit to be set.  
A fault or warning not listed through bits 1-7 has occurred, which include an undervoltage fault, over  
current warning, overvotlge warning, undervoltage warning, TON_MAX_FAULT, LOW_VIN,  
VOUT_MAX_MIN_Warning, OTF_BG, or IV_PPV1. Check other status registers. Per the PMBus  
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,  
the bit is to be cleared by clearing the bits in STATUS_VOUT, STATUS_IOUT, STATUS_IOUT  
(7Bh), or STATUS_MFR_SPECIFIC (80h)that cause this bit to be set. The default for this bit is 1  
because the default of STATUS_INPUT[3] LOW_Vin defaulting to 1.  
7.5.35 STATUS_WORD (79h)  
The STATUS_WORD command returns two bytes of information with a summary of the device fault and warning  
conditions. The low byte is identical to the STATUS_BYTE above. The additional byte reports the warning  
conditions for output overvoltage and overcurrent, as well as the power good status of the converter.  
58  
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COMMAND  
Format  
STATUS_WORD (low byte) = STATUS_BYTE  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW  
0
Function  
X
0
OFF  
X
OVF  
0
OCF  
0
x
0
CML  
0
oth  
1
Default Value  
COMMAND  
Format  
STATUS_WORD (high byte)  
Unsigned binary  
Bit Position  
Access  
7
6
5
4
r
3
2
r
1
r
0
r
rE  
PGOOD_Z  
X
r
VFW  
0
r
OCFW  
0
r
INPUT  
X
Function  
MFR  
X
0
X
0
X
0
Default Value  
0
A 1 in any of the high byte bit positions indicates that:  
VFW  
An output voltage fault or warning has occurred (OVF or OVW or UVW or UVF or  
VOUT_MAX_Warning or TONMAXF). Check STATUS_VOUT. Per the PMBus v1.3 spec sections  
10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit is to be  
cleared by clearing the bits in STATUS_VOUT that cause this bit to be set.  
OCFW  
INPUT  
MFR  
An output current warning or fault has occurred (OCF or OCW). Check STATUS_IOUT. Per the  
PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In  
contrast, the bit is to be cleared by clearing the bits in STATUS_IOUT that cause this bit to be set.  
INPUT fault or warning in STATUS_INPUT is present. Check STATUS_INPUT. Per the PMBus  
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,  
the bit is to be cleared by clearing the bits in STATUS_INPUT that cause this bit to be set.  
An manufacturer specific fault or warning condition has occurred (over temperature fault from  
Bandgap or IV_PPV1). Check STATUS_MFR_SPECIFIC. Per the PMBus v1.3 spec sections  
10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit is to be  
cleared by clearing the bits in STATUS_MFR_SPECIFIC that cause this bit to be set.  
PGOOD_Z Power is not good, and the following condition is present: output over or under voltage warning or  
fault, TON_MAX_FAULT, over temperature warning or fault, over current warning or fault,  
insufficient input voltage. Please refer to the FAULT RESPONSE table for the possible sources to  
trigger PGOOD_Z. The signal is unlatched and always represents the current state of the device.  
The factory default setting for PGOOD_Z mask bit is 1, indicating that PGOOD_Z itself cannot  
trigger SMBALERT by default. If unmask PGOOD_Z bit, the SMBALERT is set not to trigger before  
Power Good going high the first time, which is to avoid the device holding up SMBALERT bus when  
it is not commanded to start up and PGOOD stays low.  
7.5.36 STATUS_VOUT (7Ah)  
The STATUS_VOUT command returns one byte of information relating to the status of the output voltage related  
faults.  
COMMAND  
STATUS_VOUT  
Format  
Unsigned binary  
Bit Position  
Access  
7
6
5
4
3
2
1
r
0
r
r/wE  
r/wE  
r/wE  
r/wE  
UVF  
0
r/wE  
r/wE  
VOUT_MAX  
_MIN_Warni TONMAXF  
ng  
Function  
OVF  
0
OVW  
0
UVW  
0
X
0
X
0
Default Value  
0
0
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A 1 in any of these bit positions indicates that:  
OVF  
OVW  
UVW  
UVF  
The device has seen the output voltage rise above the output overvoltage fault threshold  
VOUT_OV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
The device has seen the output voltage rise above the output overvoltage warn threshold  
VOUT_OV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
The device has seen the output voltage fall below the output undervoltage warn threshold  
VOUT_UV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
The device has seen the output voltage fall below the output undervoltage fault threshold  
VOUT_UV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
VOUT_MAX_MIN_Warning An attempt is made to program the VOUT_COMMAND in excess of the value in  
VOUT_MAX or under the value in VOUT_MIN. This bit is writeable to clear and the EEPROM bit is  
for SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
TONMAXF A TON_MAX_FAULT has occurred. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. For loop slave device, this bit is forced to 0.  
7.5.37 STATUS_IOUT (7Bh)  
The STATUS_IOUT command returns one byte of information relating to the status of the output current related  
faults.  
COMMAND  
STATUS_IOUT  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
OCF  
0
6
r
5
r/wE  
OCW  
0
4
r
3
r
2
r
1
r
0
r
Function  
X
0
X
0
X
0
X
0
X
0
X
0
Default Value  
A 1 in any of these bit positions indicates that:  
OCF  
The device has seen the output current rise above the level set by IOUT_OC_FAULT_LIMIT. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
OCW  
The device has seen the output current rise above the level set by IOUT_OC_WARN_LIMIT. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
7.5.38 STATUS_INPUT (7Ch)  
The STATUS_INPUT command returns one byte of information relating to the status of the input-related faults of  
the converter.  
COMMAND  
STATUS_INPUT  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
2
r
1
r
0
r
r/wE  
Function  
X
0
X
0
X
0
X
0
LOW_Vin  
1
X
0
X
0
X
0
Default Value  
A 1 in any of these bit positions indicates that:  
LOW_Vin  
The unit is off because of insufficient input voltage. The bit sets when the unit powers up and stays  
set until the first time VIN exceeds VIN_ON. During the initial power up, LOW_Vin is not latched  
and does not trigger SMBALERT. Once VIN does exceed VIN_ON for the first time, any  
subsequent VIN < VIN_OFF events are latched, trigger SMBALERT. This bit is writeable to clear  
and the EEPROM bit is for SMBALERT_MASK.  
60  
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7.5.39 STATUS_TEMPERATURE (7Dh)  
The STATUS_TEMPERATURE command returns one byte of information relating to the status of the internal  
temperature related faults.  
COMMAND  
STATUS_TEMPERATURE  
Format  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
OTF  
0
6
r/wE  
OTW  
0
5
r
4
r
3
r
2
r
1
r
0
r
Function  
X
0
X
0
X
0
X
0
X
0
X
0
Default Value  
A 1 in any of these bit positions indicates that:  
OTF  
The measured internal temperature value of READ_TEMPERATURE_1 is equal to or greater than  
the level set by OT_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in  
READ_TEMPERATURE_1 has fallen 20°C from the OT_FAULT_LIMIT.  
OTW  
The measured internal temperature value of READ_TEMPERATURE_1 is equal to or greater than  
the level set by OT_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in  
READ_TEMPERATURE_1 has fallen 20°C from the OT_WARN_LIMIT.  
7.5.40 STATUS_CML (7Eh)  
The STATUS_CML command returns one byte of information relating to the status of the communication-related  
faults of the converter.  
COMMAND  
Format  
STATUS_CML  
Unsigned binary  
Bit Position  
Access  
7
r/wE  
ivc  
0
6
r/wE  
ivd  
0
5
r/wE  
pec  
0
4
3
r
2
r
1
r/wE  
oth  
0
0
r
r/wE  
mem  
0
Function  
X
0
X
0
X
0
Default Value  
A 1 in any of these bit positions indicates that:  
ivc  
An invalid or unsupported command has been received. This bit is writeable to clear and the  
EEPROM bit is for SMBALERT_MASK.  
ivd  
An invalid or unsupported data has been received. This bit is writeable to clear and the EEPROM  
bit is for SMBALERT_MASK.  
pec  
mem  
oth  
A packet error check failed. This bit is writeable to clear and the EEPROM bit is for  
SMBALERT_MASK.  
A fault has been detected with the internal memory. This bit is writeable to clear and the EEPROM  
bit is for SMBALERT_MASK.  
Some other communication fault or error has occurred. This bit is writeable to clear and the  
EEPROM bit is for SMBALERT_MASK.  
7.5.41 STATUS_MFR_SPECIFIC (80h)  
The STATUS_MFR_SPECIFIC command returns one byte of information relating to the status of manufacturer-  
specific faults or warnings.  
COMMAND  
Format  
STATUS_MFR_SPECIFIC  
Unsigned binary  
Bit Position  
Access  
7
6
r
5
4
3
2
r
1
0
r/wE  
r/wE  
r
r
r
r
Function  
otf_bg  
illzero  
illmany1s  
iv_ppv1  
iv_ppv0  
0
is_Slave  
sync_flt  
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COMMAND  
STATUS_MFR_SPECIFIC  
Default Value  
0
0
0
0
0
0
0
0
A 1 in any of these bit positions indicates that:  
otf_bg  
The internal temperature from bandgap is above the thermal shutdown (TSD) fault threshold. This  
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.  
illzero  
The operation FSM has hit an illegal ZERO state. The FSM is a one-step implementation, so all  
zeros in the state is illegal and should never occur. This event is informational only and would not  
trigger SMBALERT.  
illmany1s The operation FSM for has hit an illegal more than one hot state. The FSM is a one-hot  
implementation, so a state where multiple state bits are HI is illegal and should never occur. This  
event is informational only and would not trigger SMBALERT.  
iv_ppv1  
The ADDR1 detection fails to resolve 4 consecutive values. To avoid initial turnon events from  
clearing this condition and the user not being aware why the default ADDR1 value was used, this  
bit is only clearable through the CLEAR_FAULTS command or writing a logic 1 to this bit,  
essentially off and on events do not clear it as with the other standard status bits. This condition will  
trigger SMBALERT.  
iv_ppv0  
sync_flt  
The ADDR0 detection fails.  
A synchronization fault. This could be because (a) Clock slave: an expected external SYNC was  
never present; or present, then lost, or (b) Clock master: an internal SYNC signal is not sensed on  
the SYNC pin. This bit is a live (essentially, unlatched) indicator. This event is informational only  
and would not trigger SMBALERT. This bit will always read 0 if the DIS_SYNC_FLT bit is set.  
7.5.42 READ_VOUT (8Bh)  
The READ_VOUT commands returns two bytes of data in the linear data format that represent the output voltage  
of the converter. The output voltage is sensed at the remote sense amplifier output pin so voltage drop to the  
load is not accounted for. The data format is as shown below:  
COMMAND  
Format  
READ_VOUT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Function  
Mantissa  
0
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.42.1 Exponent  
Value fixed at 10111, Exponent for linear mode values is –9 (equivalent of 1.95 mV/count, specified in the  
VOUT_MODE command).  
7.5.42.2 Mantissa  
Use Equation 12 to calculate the output voltage.  
Exponent  
OUT  
V
= Mantissa´ 2  
(12)  
7.5.43 READ_IOUT (8Ch)  
The READ_IOUT commands returns two bytes of data in the linear data format that represent the output current  
of the converter. The average output current is sensed according to the method described in Low-Side MOSFET  
Current Sensing and Overcurrent Protection. The data format is as shown below:  
COMMAND  
Format  
READ_IOUT  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
62  
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COMMAND  
Function  
READ_IOUT  
Exponent  
1
Mantissa  
Default Value  
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
The device scales the output current before it reaches the internal analog to digital converter so that resolution of  
the output current read is 62.5 mA. The maximum value that can be reported is 40 A. The user must set the  
IOUT_CAL_OFFSET parameter correctly to obtain accurate results. Use Equation 13 to calculate the output  
current.  
Exponent  
I
= Mantissa´ 2  
OUT  
(13)  
7.5.43.1 Exponent  
default: 11100 (binary) -4 (decimal) (62.5 mA LSB)  
These default settings are not programmable.  
7.5.43.2 Mantissa  
The lower 10 bits are the result of the ADC conversion of the average output current, as indicated by the output  
of the internal current sense amplifier. The 11th bit is fixed at 0 because only positive numbers are considered  
valid. Any computed negative current is reported as 0 A.  
7.5.44 READ_TEMPERATURE_1 (8Dh)  
The READ_TEMPERATURE_1 command returns the internal die temperature in degrees Celsius.  
COMMAND  
Format  
READ_TEMPERATURE_1  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
r
r
Function  
Exponent  
Mantissa  
7.5.44.1 Exponent  
default: 00000 (binary) 0 (decimal)  
These default settings are not programmable.  
7.5.44.2 Mantissa  
The lower 11 bits are the result of the ADC conversion of the external temperature.  
7.5.45 PMBUS_REVISION (98h)  
The PMBUS_REVISION command returns a single, unsigned binary byte that indicates that these devices are  
compatible with the 1.3 revision of the PMBus specification (Part I and Part II).  
COMMAND  
PMBUS_REVISION  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
Default Value  
0
0
1
1
0
0
1
1
7.5.46 IC_DEVICE_ID (ADh)  
Th IC_DEVICE_ID command is a read-only block-read command that returns a single word (16 bits) with the  
unique device-code identifier for each device for which this device can be configured. The BYTE_COUNT field in  
the block read command is 2 (indicating 2 bytes follow): low byte first, high byte second.  
COMMAND  
Format  
IC_DEVICE_ID  
Linear, binary  
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COMMAND  
IC_DEVICE_ID  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
5
r
4
r
3
r
2
r
1
r
0
r
r
r
Default Value  
See below  
The default for the device identifier code is 4623h – Code Identifier for TPSM846C23.  
7.5.47 IC_DEVICE_REV (AEh)  
The IC_DEVICE_REV command is a read-only block-read command that returns a single word (16 bits) with the  
unique Device revision identifier. The DEVICE_REV starts at 0 with the first silicon and is incremented with each  
subsequent silicon revision. The BYTE_COUNT field in the Block Read command is 2 (indicating 2 bytes follow):  
low byte first, high byte second.  
COMMAND  
Format  
IC_DEVICE_REV  
Linear, tbinary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Default Value  
See below  
The default of the device identifier code is 0001b.  
7.5.48 MFR_SPECIFIC_00 (D0h)  
The MFR_SPECIFIC_00 command is dedicated as a user scratch pad. Only the lower 8 bits are writeable for  
users. This is a read word command, with only the lower 8 bits accessible. This command is not a read byte  
command. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL  
command.  
COMMAND  
Format  
MFR_SPECIFIC_00  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Function  
User scratch pad  
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.49 VREF_TRIM (MFR_SPECIFIC_04) (D4h)  
The VREF_TRIM command applies a fixed offset voltage to the Error Amplifier reference (EA_REF) voltage. It is  
most typically used to trim the output voltage at the time the PMBus device is assembled into the end user’s  
system. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL  
command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The settings of the VOUT_MODE command determine the effect of VREF_TRIM command. In this device, the  
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal).  
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×  
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4])] × 1.953 mV  
(14)  
The maximum trim ranges between –64*1.953 mV to +63*1.953 mV in 1.953-mV steps.  
If a value outside this range is given with this command, the device sets the reference voltage to the upper or  
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE  
and the invalid data bit in STATUS_CML.  
The value of EA_REF including VREF_TRIM is also limited by the values of VOUT_MAX, VOUT_MIN,  
VOUT_COMMAND, VOUT_SCALE_LOOP and STEP_VREF_MARGIN_HIGH/LOW. See VOUT_MAX and  
VOUT_MIN for additional details.  
The EA_REF voltage transition occurs at the rate determined by the current state:  
64  
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Soft-Start: TON_RISE command  
Steady-State: VOUT_TRANSITION_RATE command  
TOFF_DELAY: VOUT_TRANSITION_RATE command  
Soft-Stop: TOFF_FALL command  
The VREF_TRIM has two data bytes formatted as two’s complement binary integer and can have positive and  
negative values.  
COMMAND  
Format  
VREF_TRIM  
Linear, two’s complement binary  
Bit Position  
Access  
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Function  
High Byte  
Low Byte  
Default Value  
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
High Byte:  
default: 0000 0000 (binary) 0 (decimal)  
Minimum: 1111 1111 (binary) (sign extended)  
Maximum: 0000 0000 (binary) (sign extended)  
Low Byte:  
default: 0000 0000 (binary) 0 (decimal)  
Minimum: 1100 0000 (binary) –64 (decimal) (–125 mV) (sign extended, two's compliment)  
Maximum: 0011 1111 (binary) 63 (decimal) (123 mV)  
7.5.50 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)  
The STEP_VREF_MARGIN_HIGH command, specifing a positive offset voltage on EA_VREF, is used to  
increase the reference voltage by shifting the reference higher. When the OPERATION command is set to  
Margin High, the output will increase by the voltage indicated by this command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The effect of this command is determined by the settings of the VOUT_MODE command. In this device, the  
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal). The actual reference voltage commanded by a  
margin high command can be found in Equation 14.  
The margin high range is between 0 and 31 × 1.953 mV in 1.953-mV steps.  
If a value outside this range is given with this command, the device sets the reference voltage to the upper or  
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE  
and the invalid data bit in STATUS_CML.  
The value of EA_REF including STEP_VREF_MARGIN_HIGH is also limited by the values of VOUT_MAX,  
VOUT_MIN, VOUT_COMMAND, VOUT_SCALE_LOOP and VREF_TRIM. See VOUT_MAX and VOUT_MIN for  
additional details.  
The EA_REF voltage transition occurs at the rate determined by the current state:  
Soft-Start: TON_RISE command  
Steady-State: VOUT_TRANSITION_RATE command  
TOFF_DELAY: VOUT_TRANSITION_RATE command  
Soft-Stop: TOFF_FALL command  
COMMAND  
Format  
STEP_VREF_MARGIN_HIGH  
Linear, two's complement binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
High Byte  
Low Byte  
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High Byte:  
default: 0000 0000 (binary) 0 (decimal)  
Low Byte:  
Minimum: 0000 0000 (binary) 0 (decimal) (0 mV)  
Maximum: 0001 1111 (binary) 31 (decimal) (60.5 mV)  
The read-writeable bits in this register do NOT have direct EEPROM backup; however, the register does restore  
to one of two configurable values as determined by RSMHI_VAL in (E5h) MFR_SPECIFIC_21 (OPTIONS).  
RSMHI_VAL = 0: STEP_VREF_MARGIN_HIGH will restore to 0009h (9 decimal or 17.6 mV).  
RSMHI_VAL = 1: STEP_VREF_MARGIN_HIGH will restore to 000fh (15 decimal or 29.3 mV).  
7.5.51 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)  
The STEP_VREF_MARGIN_LOW command, specifying a negative offset voltage on EA_VREF, is used to  
decrease the reference voltage by shifting the reference lower. When the OPERATION command is set to  
Margin Low, the output will decrease by the voltage indicated by this command.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The effect of this command is determined by the settings of the VOUT_MODE command. In this device, the  
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal). The actual reference voltage commanded by a  
margin low command can be found in Equation 14.  
The margin low range is between -64*1.953 mV and -1*1.953 mV in 1.953-mV steps.  
If a value outside this range is given with this command, the device sets the reference voltage to the upper or  
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE  
and the invalid data bit in STATUS_CML.  
The value of EA_REF including STEP_VREF_MARGIN_LOW is also limited by the values of VOUT_MAX,  
VOUT_MIN, VOUT_COMMAND, VOUT_SCALE_LOOP and VREF_TRIM. See VOUT_MAX and VOUT_MIN for  
additional details.  
The EA_REF voltage transition occurs at the rate determined by the current state:  
Soft-Start: TON_RISE command  
Steady-State: VOUT_TRANSITION_RATE command  
TOFF_DELAY: VOUT_TRANSITION_RATE command  
Soft-Stop: TOFF_FALL command  
COMMAND  
STEP_VREF_MARGIN_LOW  
Linear, two's complement binary  
Format  
Bit Position  
Access  
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
r/w  
Function  
High Byte  
Low Byte  
High Byte:  
default: 1111 1111 (binary) (MSB is sign bit, sign extended)  
Low Byte:  
Minimum: 1100 0000 (binary) –64 (decimal) (–125 mV)  
Maximum: 1111 1111 (binary) –1 (decimal) (–2 mV)  
The read-writeable bits in this register do NOT have direct EEPROM backup; however, the register does restore  
to one of two configurable values as determined by RSMLO_VAL in (E5h) MFR_SPECIFIC_21 (OPTIONS).  
RSMLO_VAL = 0: STEP_VREF_MARGIN_LOW will restore to fff7h (–9 decimal or –17.6 mV)  
RSMLO_VAL = 1: STEP_VREF_MARGIN_LOW will restore to fff1h (–15 decimal or –29.3 mV)  
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7.5.52 PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h)  
The PCT_OV_UV_WRN_FLT_LIMITS command is used to set the PGOOD, VOUT_UNDER_VOLTAGE (UV)  
and VOUT_OVER_VOLTAGE (OV) limits as a percentage of nominal.  
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An  
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and  
triggering of SMB_ALERT.  
The PCT_OV_UV_WRN_FLT_LIMITS takes a one byte data formatted as shown below:  
COMMAND  
PCT_OV_UV_WRN_FLT_LIMITS  
Format  
Unsigned binary  
Bit Position  
Access  
7
r
6
r
5
r
4
r
3
r
2
r
1
r/wE  
0
r/wE  
Function  
X
0
X
0
X
0
X
0
X
0
X
0
PCT_MSB  
0
PCT_LSB  
0
Default Value  
The PGOOD, VOUT_UNDER_VOLTAGE (UV) and VOUT_OVER_VOLTAGE (OV) settings are shown in  
Table 16, as a percentage of nominal reference voltage on the FB pin.  
Table 16. OV/UV Protection Settings (Typical Values)  
PCT_MSB  
PCT_LSB  
UV FAULT  
–83%  
UV WARN  
–88%  
OV WARN  
112%  
OV FAULT  
117%  
UNIT  
0
0
1
1
0
1
0
1
EA_REF  
EA_REF  
EA_REF  
EA_REF  
–88%  
–90%  
110%  
112%  
–72%  
–78%  
112%  
117%  
–58%  
–64%  
112%  
117%  
The PGOOD pin may trip if the output voltage is too high (using OV WARN) or too low (using UV WARN).  
Additionally, the PGOOD pin has hysteresis. When the OV WARN output voltage OV WARN is tripped, the FB  
voltage must lower below the 105% of EA_REF, before PGOOD is reset. Likewise, when output voltage UV  
WARN is tripped, the FB voltage must rise above 95% of EA_REF, before PGOOD is reset.  
7.5.53 OPTIONS (MFR_SPECIFIC_21) (E5h)  
The OPTIONS register can be used for setting user selectable options, as shown below. The contents of this  
register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
OPTIONS  
Unsigned binary  
0
Bit Position  
7
r
6
5
4
3
2
1
7
6
5
4
3
2
1
0
r/w r/w  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Access  
r/w  
r/w  
r/w  
E
E
RST_VOUT  
_
AVG_  
PROG[1:  
0]  
RSMHI_ RSMLO_  
READ_VOUT_ EN_AUTO_  
EN_ADC_ EN_RESET_  
DIS_  
NEGILIM  
Function  
X
0
x
x
DLO VSM  
VAL  
VAL  
RANGE[1:0]  
ARA  
CNTL  
B
oSD  
Default  
Value  
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
7.5.53.1 DIS_NEGILIM Bit  
When set, this bit disables the negative current limit protection on the LFET.  
7.5.53.2 EN_RESET_B Bit  
When set, this bit enables the RESET_B functionality of the RESET/PGD pin.  
BIT VALUE  
ACTION  
0
1
RESET/PGD pin = PGOOD  
RESET/PGD pin = RESET_B  
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7.5.53.3 EN_ADC_CNTL Bit  
This bit enables ADC operation used for voltage, current and temperature monitoring.  
BIT VALUE  
ACTION  
0
1
Disable ADC operation  
Enable ADC operation  
NOTE  
The EN_ADC_CNTL bit must be set to enable output voltage, current and temperature  
telemetry. When the EN_ADC_CNTL bit is zero, the READ_VOUT, READ_IOUT and  
READ_TEMPERATURE_2 registers do not update continuously, and retain the previous  
values from the last time EN_ADC_CNTL was set.  
7.5.53.4 VSM Bit  
This bit configures the measurement system for fast, VOUT-only measurement mode. Setting this bit disables  
READ_IOUT, and READ_TEMPERATURE_1, and instead allows the device to update READ_VOUT more  
frequently. This bit does not have EEPROM backup.  
BIT VALUE  
ACTION  
0
1
Measure VOUT, temperature, and IOUT  
Measure only VOUT  
NOTE  
For READ_VOUT, multiple samples (defined by AVG_PROG[1:0] Bits) are obtained and  
averaged. When entering and exiting VSM mode, the first calculated result could lose one  
sample, for example, 7 sampled value but averaged by 8, resulting the first updated  
READ_VOUT data point have worst case error about 1/8 of the nominal value.  
7.5.53.5 DLO Bit  
This bit allows bypassing the normal valid data checks on register writes. This feature is included for flexibility  
during debug to quickly generate fault conditions and/or possibly work around any data limit protection  
mechanisms prohibiting output voltage programming. This bit does not have EEPROM backup.  
BIT VALUE  
ACTION  
0
Normal PMBus data write restrictions  
Data write restrictions are overridden for the following registers: SMBALERT_MASK,  
VOUT_COMMAND, VOUT_SCALE_LOOP, VREF_TRIM,  
1
STEP_VREF_MARGIN_HIGH, STEP_VREF_MARGIN_LOW,  
IOUT_OC_FAULT_LIMIT, IOUT_OC_WARN_LIMIT, OT_FAULT_LIMIT,  
OT_WARN_LIMIT, VOUT_MIN, VOUT_MAX, VIN_ON, VIN_OFF, and OPERATION.  
NOTE  
CAUTION: Users should use this bit with extreme caution. Setting this bit allows invalid  
data conditions to be programmed into the device which can lead to damage. Invalid data  
written into any register when DLO is enabled does NOT set the IVD bit; nor trigger  
SMBALERT. The invalid data is simply allowed to be programmed. Furthermore, invalid  
data programmed into a command/status register while DLO is enabled, does not trigger  
SMBALERT upon deassertion of DLO. So, it is possible to exit DLO mode with invalid  
data in command/status registers. Use with extreme caution.  
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7.5.53.6 AVG_PROG[1:0] Bits  
These bits configure programmable digital measurement averaging. Bits provide programmable averaging for  
current (READ_IOUT), temperature (READ_TEMPERATURE_1), and voltage (READ_VOUT). The default (00b)  
yields 16x averaging for all three parameters; however, this default can be changed and stored in EEPROM, if  
necessary. The programming options are as follows:  
BIT VALUE  
ACTION  
00  
Accumulating Averaging = 16x  
Accumulating Averaging = 0x. Use this setting to bypass the averagers. Every sample  
from measurement system updates corresponding READ_XXX CSR.  
01  
10  
11  
Accumulating Averaging = 8x  
Accumulating Averaging = 32x  
7.5.53.7 EN_AUTO_ARA Bit  
This bit enables auto-alert response address response. When this feature is enabled, and after the device has  
successfully responded to an ARA transaction, the hardware automatically masks any fault source currently set  
from reasserting SMBALERT. This prevents PMBus bus hogging in the case of a persistent fault in a device that  
consistently wins ARA arbitration because of the device address. In contrast, when this bit is cleared, immediate  
reassertion of SMBALERT is allowed in the event of a persistent fault and the responsibility is upon the host to  
mask each source individually.  
7.5.53.8 READ_VOUT_RANGE[1:0] Bits  
The ADC input voltage range is limited to 0.9 V. For READ_VOUT, the output voltage is divided down before  
input to ADC. Large signal amplitude gives better signal-to-noise ratio. The READ_VOUT_RANGE[1:0] bits are  
used to force the input voltage divider of the internal ADC for output voltage measurement to one of the 3  
possible values.  
VOUT_SCALE_LOOP  
READ_VOUT_RANGE[1:0]  
OUT  
1
x
00b  
11b  
00b  
10b  
00b  
01b  
1/2 IN  
0.5  
x
1/4 IN  
1/8 IN  
0.25  
x
7.5.53.9 RST_VOUT_oSD Bit  
When set high, this bit is used to force VOUT_COMMAND to the default value upon any shutdown or fault  
condition:  
FAULT with programmed shutdown response  
FAULT with programmed restart response  
Normal, controlled shutdown (e.g. CNTL pin)  
LOW_VIN  
7.5.53.10 RSMLO_VAL Bit  
The restore step-margin low-value (RSMLO_VAL) bit is used to configure the default restore value for (D6h)  
MFR_SPECIFIC_06 (STEP_VREF_MARGIN_LOW).  
BIT VALUE  
ACTION  
0
1
STEP_VREF_MARGIN_LOW will restore to fff7h (–9 decimal or –17.6 mV)  
STEP_VREF_MARGIN_LOW will restore to fff1h (–15 decimal or –29.3 mV)  
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7.5.53.11 RSMHI_VAL Bit  
This restore step margin high value (RSMHI_VAL) bit is used to configure the default restore value for (D5h)  
MFR_SPECIFIC_05 (STEP_VREF_MARGIN_HIGH).  
BIT VALUE  
ACTION  
0
1
STEP_VREF_MARGIN_HIGH will restore to 0009h (9 decimal or 17.6 mV)  
STEP_VREF_MARGIN_HIGH will restore to 000fh (15 decimal or 29.3 mV)  
7.5.54 MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h)  
This user-accessible register is used for miscellaneous options, as shown below. The contents of this register  
can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.  
COMMAND  
Format  
MISC_CONFIG_OPTIONS  
Unsigned binary  
Bit Position  
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
7
6
5
r
4
3
r
2
1
0
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
r/wE  
Access  
FORCE_SYNC_  
IN  
Function  
X
0
X
0
X
0
X
0
X
0
X
0
X
0
SYNC_FAULT_DIS  
1
FORCE_SYNC_OUT  
0
X
0
EN_AVS_USER  
1
X
0
HSOC_USER_TRIM[1:0]  
OV_RESP_SEL  
1
Default  
Value  
1
0
1
7.5.54.1 OV_RESP_SEL Bit  
This bit selects between two options for low-side FET behavior after an output overvoltage fault condition.  
Regardless of the setting of this bit, the low-side FET latches on when an output OV fault is detected (if the  
OV_FAULT_RESPONSE is not programmed to ignore).  
BIT VALUE  
ACTION  
The low-side FET remains on until either the part initiates a new startup of the output  
voltage or the CLEAR_FAULTS command is given while the part is in the DISABLE  
operational state  
0
1
The low-side FET turns off as soon as the sensed output (at FB pin) drops below 0.2 V.  
7.5.54.2 HSOC_USER_TRIM[1:0] Bits  
These trim bits are provided so the user can adjust the HSOC threshold to account for the application-specific  
requirements for input-voltage sensing parasitics and component-current handling. The bit settings are defined  
as follows:  
BIT VALUE  
ACTION  
00  
01  
10  
11  
HSOC change from default = 0  
HSOC change from default = 12.5%  
HSOC change from default = –25%  
HSOC change from default = –12.5%  
7.5.54.3 EN_AVS_USER Bit  
Setting this bit high is required enabling the COMP-level shifter that eliminates overshoot and undershoot of VOUT  
when the reference is ramped. The value of this bit is latched when the driver is enabled to switch which  
prevents the user from enabling or disabling the level shifter while the output is switching.  
7.5.54.4 FORCE_SYNC_OUT Bit  
This bit forces the device to output the free-running clock on the SYNC pin.  
7.5.54.5 FORCE_SYNC_IN Bit  
This bit forces the device to be synchronized to an external PWM clock applied on the SYNC pin.  
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7.5.54.6 SYNC_FAULT_DIS Bit  
When set, this bit disables any reporting (digital status) and response (analog and digital) to SYNC_FAULT.  
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8 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Typical Application  
The TPSM846C23 is a highly integrated, synchronous step-down DC-DC power module that supports PMBus  
commands. The TPSM846C23 converts a higher DC-input voltage to a lower DC-output voltage, with a  
maximum output current of 35 A. Use the following design procedure to select key component values and set the  
appropriate behavioral options through the PMBus.  
TPSM846C23MOL  
4
VS+  
37  
38  
39  
40  
41  
55  
44  
45  
46  
53  
VIN  
VIN  
VIN  
VIN  
VOUT  
VOUT  
VOUT  
VOUT  
VOUT  
VOUT  
VIN  
VOUT  
49  
BP6  
C1  
C2  
C3  
C4  
C5  
C10  
C11  
C12  
C13  
C14  
C15  
+
+
C6  
+
32  
33  
34  
35  
36  
56  
57  
58  
4.7 F  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
22 F  
22 F  
22 F  
22 F  
47 F  
47 F  
47 F  
47 F  
330 F  
48  
470 F  
470 F  
BP6_RTN  
42  
43  
54  
59  
PGND  
PGND  
PGND  
PGND  
PGND  
PGND  
50  
51  
47  
VINBP  
BP_RTN  
BP3  
C7  
C8  
5
VS-  
1 F  
10 nF  
22  
23  
24  
25  
26  
27  
28  
29  
PH  
PH  
PH  
PH  
PH  
PH  
PH  
PH  
C9  
2.2 F  
8
21  
30  
31  
DNC  
DNC  
DNC  
DNC  
6
DIFFO  
R1  
10 kꢁ  
R2  
10 kꢁ  
3
2
VSHARE  
ISHARE  
R
COMP  
C
COMP  
52  
11  
18  
19  
20  
12  
16  
17  
PGOOD  
PGOOD  
7
FB  
COMP  
RT  
SYNC  
DATA  
9
PMBus DATA  
R
SET  
13  
14  
CLK  
PMBus CLK  
RT_SEL  
ALERT  
CNTL  
PMBus ALERT  
10  
15  
1
AGND  
NC  
CNTL  
ADDR1  
ADDR0  
NC  
U1  
R3  
R4  
Copyright © 2017, Texas Instruments Incorporated  
19. Typical Application Schematic  
72  
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Typical Application (接下页)  
8.1.1 Design Requirements  
For this design example, use the parameters listed in 17 and follow the Detailed Design Procedure.  
17. Design Parameters  
DESIGN PARAMETER  
Input voltage VIN  
VALUE  
12 V typical  
Output voltage VOUT  
Output current rating  
Key care-abouts  
1.2 V  
35 A  
PMBus control, small footprint, high efficiency, PGOOD signal  
8.1.2 Detailed Design Procedure  
8.1.2.1 Custom Design With WEBENCH® Tools  
Click here to create a custom design using the TPSM846C23 device with the WEBENCH® Power Designer.  
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.  
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.  
3. Compare the generated design with other possible solutions from Texas Instruments.  
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time  
pricing and component availability.  
In most cases, these actions are available:  
Run electrical simulations to see important waveforms and circuit performance  
Run thermal simulations to understand board thermal performance  
Export customized schematic and layout into popular CAD formats  
Print PDF reports for the design, and share the design with colleagues  
Get more information about WEBENCH tools at www.ti.com/WEBENCH.  
8.1.2.2 Setting the Output Voltage  
The output voltage of the TPSM846C23 is designed to be set via the PMBus using the VOUT_COMMAND (21h).  
VOUT_COMMAND value = (desired VOUT × 512)  
(15)  
To set the output voltage to 1.2 V, using 公式 15, the calculated VOUT_COMMAND value is 614, which  
converted to hex is 266h. This value can be written to RAM using the VOUT_COMMAND and saved as the new  
default value to non-volatile memory using the STORE_DEFAULT_ALL command.  
The actual output voltage is also dependant on the value of VOUT_SCALE_LOOP (29h) and the presence of a  
resistor, RSET. Because the desired output voltage is between 0.35 V and 1.65 V (VOUT_SCALE_LOOP = 1), the  
RSET resistor must be left open.  
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8.1.2.3 Input and Output Capacitance  
The minimum required input capacitance network consists of four 22-µF (or two 47-µF) ceramic capacitors plus a  
330-µF bulk capacitor. The minimum required output capacitance network consists of four 47-µF (or two 100-µF)  
ceramic capacitors plus two 470-µF, low ESR polymer capacitors. The combined ESR of the polymer capacitors  
must not be greater than 5 mΩ. Additional input and output capacitors can be added to improve ripple or  
transient response.  
In this design example, the minimum required input and output capacitance is used.  
8.1.2.4 Selecting the Compensation Components  
The TPSM846C23 requires an external series resistor and capacitor compensation network to be connected  
between the DIFFO pin (pin 6) and the FB pin (pin 7). The value of these components is determined by the total  
amount of output capacitance.  
In this design example, the value of RCOMP and CCOMP is selected from 3 based on the total amount of output  
capacitance of 1120 µF. RCOMP = 1.0 kΩ and CCOMP = 1000 pF.  
8.1.2.5 Setting the Switching Frequency  
The TPSM846C23 is set to a default switching frequency of 500 kHz. To operate the TPSM846C23 at the default  
switching frequency, connect the RT_SEL pin (pin 14) to AGND and the RT pin (pin 13) must be left open.  
In this design example, the switching frequency is selected to operate at the default switching frequency of  
500 kHz by connecting RT_SEL pin to AGND, and the RRT resistor is left open.  
8.1.2.6 Power Good (PGOOD)  
Applications requiring voltage rail sequencing can benefit from the PGOOD signal present with the  
TPSM846C23. The PGOOD pin is an open-drain output. When the output voltage is typically between 95% and  
105% of the setpoint, the PGOOD pin pulldown is released, and the pin floats, requiring an external pullup  
resistor for a high signal. A 10-kΩ pullup resistor is placed between the PGOOD pin and the BP3 rail.  
8.1.2.7 ON/OFF Control (CNTL)  
The CNTL signal is an input signal on the PMBus. It is used to turn the power conversion function of the module  
on and off in conjunction with commands received over the bus. It can be configured as an active high or active  
low signal through the ON_OFF_CONFIG command. The CNTL signal is programmed at the factory to be an  
active high signal; that is, the CNTL pin must be pulled high for power conversion to occur. The CNTL pin  
requires an external pullup resistor for a high signal. A 10-kΩ pullup resistor is placed between the CNTL pin and  
the BP3 rail.  
74  
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8.1.3 Application Curves  
VIN = 12 V  
VOUT = 1.2 V  
20. Start-up Waveforms  
IOUT = 10 A  
VIN = 12 V  
VOUT = 1.2 V  
IOUT = 10 A  
21. Shutdown Waveform  
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9 Power Supply Recommendations  
The TPSM846C23 device is designed to operate from an input voltage supply between 4.5 V and 15 V. This  
supply must be well regulated. These devices are not designed for split-rail operation. Proper bypassing of input  
supplies and internal regulators is also critical for noise performance, as is PCB layout and grounding scheme.  
See the recommendations in Layout.  
76  
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10 Layout  
10.1 Layout Guidelines  
Layout is critical for good power-supply design. 22 and 23 show top-side and bottom-side PCB-layout  
configuration for recommended component placement. Additional power, ground and signal layers are present in  
any PCB design. A list of PCB layout considerations using these devices is listed as follows:  
Place the input bypass capacitors as close as physically possible to the VIN and PGND pins. Additionally, a  
high-frequency bypass capacitor on the VIN pins can help reduce switching spikes. Place this capacitor on  
the bottom side of the PCB directly underneath the device to keep a minimum loop.  
The BP6 bypass capacitor carries a large switching current for the gate driver. Bypassing the BP6 pin to  
BP6_RTN with a low-impedance path is very critical to the stable operation of the TPSM846C23 device.  
Place the BP6 high-frequency bypass capacitor as close as possible to the device pins 48 and 49.  
The VINBP and BP3 pins also require good local bypassing. Place bypass capacitors as close as possible to  
the device pins and BP_RTN. Poor bypassing on the VINBP and BP3 pins can degrade the performance of  
the device.  
Place signal components as close as possible to the pins to which they are connected. These components  
include the feedback resistors and the RT resistor. Keep these components from fast switching voltage and  
current paths. Terminate these components to AGND with a minimum return loop.  
Route the VS+ and VS– lines from the output capacitor bank at the load back to the device pins as a tightly  
coupled differential pair. These traces must be kept away from switching or noisy areas which can add  
differential-mode noise.  
Use caution when routing of the SYNC, VSHARE and ISHARE traces for parallel configurations. The SYNC  
trace carries a rail-to-rail signal and must be routed away from sensitive analog signals, including the  
VSHARE, ISHARE, RT, and FB signals. The VSHARE and ISHARE traces must also be kept away from fast  
switching voltages or currents formed by the VIN, PH, and BP6 pins.  
10.2 Layout Example  
22. PCB Top-side Layout Recommendation  
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Layout Example (接下页)  
23. PCB Bottom-side Layout Recommendation  
78  
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10.3 Package Specifications  
TPSM846C23  
VALUE  
UNIT  
Weight  
3.92  
grams  
Flammability  
Meets UL 94 V-O  
MTBF Calculated Reliability  
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign  
26.6  
MHrs  
10.4 EMI  
The TPSM846C23 is compliant with EN55022 Class A radiated emissions. 24 to 27 show typical examples  
of radiated emissions plots for the TPSM846C23. The EMI plots were taken using the TPSM846C23 EVM with a  
resistive load and input power was provided using a lead acid battery. All graphs show plots of the antenna in the  
horizontal and vertical positions.  
24. Radiated Emissions 12-V Input, 1.2-V Output,  
35-A Load Vertical Antenna  
25. Radiated Emissions 12-V Input, 1.2-V Output,  
35-A Load Horizontal Antenna  
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EMI (接下页)  
26. Radiated Emissions 5-V Input, 1.2-V Output,  
35-A Load Vertical Antenna  
27. Radiated Emissions 5-V Input, 1.2-V Output,  
35-A Load Horizontal Antenna  
80  
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10.5 Mounting and Thermal Profile Recommendation  
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the  
reflow process can affect electrical performance. 28 shows the recommended reflow-oven thermal profile.  
Proper post-assembly cleaning is also critical to device performance. Refer to Power Module MSL Ratings and  
Reflow Ratings for more information.  
tP  
TP  
TL  
TS(max)  
TS(min)  
tL  
rRAMP(up)  
rRAMP(down)  
tS  
t25P  
Time (s)  
25  
28. Recommended Reflow-Oven Thermal Profile  
18. Recommended Thermal Profile Parameters  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
RAMP UP AND RAMP DOWN  
rRAMP(up)  
Average ramp-up rate, TS(max) to TP  
Average ramp-down rate, TP to TS(max)  
3
6
°C/s  
°C/s  
rRAMP(down)  
PRE-HEAT  
TS  
Preheat temperature  
150  
60  
200  
120  
°C  
s
tS  
Preheat time, TS(min) to TS(max)  
REFLOW  
TL  
TP  
tL  
Liquidous temperature  
217  
°C  
°C  
s
Peak temperature  
260  
150  
30  
Time maintained above liquidous temperature, TL  
Time maintained within 5°C of peak temperature, TP  
Total time from 25°C to peak temperature, TP  
60  
20  
tP  
s
t25P  
480  
s
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11 器件和文档支持  
11.1 器件支持  
11.1.1 开发支持  
11.1.1.1 使用 WEBENCH® 工具创建定制设计  
请单击此处,借助 WEBENCH® Power Designer 并使用 TPSM846C23 器件创建定制设计方案。  
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。  
2. 使用优化器拨盘优化该设计的关键参数,如效率、尺寸和成本。  
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。  
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。  
在多数情况下,可执行以下操作:  
运行电气仿真,观察重要波形以及电路性能  
运行热性能仿真,了解电路板热性能  
将定制原理图和布局方案以常用 CAD 格式导出  
打印设计方案的 PDF 报告并与同事共享  
有关 WEBENCH 工具的详细信息,请访问 www.ti.com.cn/WEBENCH。  
11.2 文档支持  
11.2.1 相关文档  
请参阅如下相关文档:  
PMB 电源管理协议规范》第 1 部分,修订版 1.3 http://pmbus.org 上可以找到  
TI 用户指南TPSM846C23 并联工作》  
11.3 接收文档更新通知  
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产  
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。  
11.4 社区资源  
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商按照原样提供。这些内容并不构成 TI 技术规范,  
并且不一定反映 TI 的观点;请参阅 TI 《使用条款》。  
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在  
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。  
设计支持  
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。  
11.5 商标  
E2E is a trademark of Texas Instruments.  
WEBENCH is a registered trademark of Texas Instruments.  
PMBus is a trademark of SMIF, Inc..  
All other trademarks are the property of their respective owners.  
11.6 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
11.7 术语表  
SLYZ022 TI 术语表。  
这份术语表列出并解释术语、缩写和定义。  
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12 机械、封装和可订购信息  
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且  
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。  
12.1 Tape and Reel Information  
REEL DIMENSIONS  
TAPE DIMENSIONS  
K0  
P1  
W
B0  
Reel  
Diameter  
Cavity  
A0  
A0 Dimension designed to accommodate the component width  
B0 Dimension designed to accommodate the component length  
K0 Dimension designed to accommodate the component thickness  
Overall width of the carrier tape  
W
P1 Pitch between successive cavity centers  
Reel Width (W1)  
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE  
Sprocket Holes  
Q1 Q2  
Q3 Q4  
Q1 Q2  
Q3 Q4  
User Direction of Feed  
Pocket Quadrants  
Reel  
Diameter  
(mm)  
Reel  
Width W1  
(mm)  
Package  
Type  
Package  
Drawing  
A0  
(mm)  
B0  
(mm)  
K0  
(mm)  
P1  
(mm)  
W
(mm)  
Pin1  
Quadrant  
Device  
Pins  
SPQ  
TPSM846C23MOLR  
QFM  
MOL  
59  
350  
330.0  
32.4  
15.35  
16.35  
6.1  
24.0  
32.0  
Q1  
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TAPE AND REEL BOX DIMENSIONS  
Width (mm)  
H
W
L
Device  
Package Type  
Package Drawing Pins  
MOL 59  
SPQ  
Length (mm) Width (mm)  
383.0 353.0  
Height (mm)  
TPSM846C23MOLR  
QFM  
350  
58.0  
84  
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重要声明和免责声明  
TI 均以原样提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资  
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担保。  
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验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用  
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Copyright © 2019 德州仪器半导体技术(上海)有限公司  
PACKAGE OPTION ADDENDUM  
www.ti.com  
22-May-2019  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
TPSM846C23MOLR  
ACTIVE  
QFM  
MOL  
59  
350  
RoHS Exempt  
& Green  
NIAU  
Level-3-260C-168 HR  
-40 to 105  
TPSM846C23  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
10-Mar-2021  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPSM846C23MOLR  
QFM  
MOL  
59  
350  
330.0  
32.4  
15.35 16.35  
6.1  
24.0  
32.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
10-Mar-2021  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
QFM MOL 59  
SPQ  
Length (mm) Width (mm) Height (mm)  
383.0 353.0 58.0  
TPSM846C23MOLR  
350  
Pack Materials-Page 2  
PACKAGE OUTLINE  
MOL0059A  
QFM - 6.4 mm max height  
S
C
A
L
E
0
.
8
0
0
PLASTIC QUAD FLAT MODULE  
15.1  
14.9  
A
B
PIN 1 INDEX AREA  
16.1  
15.9  
6.4 MAX  
C
SEATING PLANE  
0.08 C  
4X 2.85 0.05  
2X 8  
20X 0.8  
4X  
2.2  
PKG  
15  
27  
PKG  
59  
58  
57  
56  
55  
4X 3.2  
4X 2.55 0.05  
24X 0.8  
14  
28  
2.6  
53  
4.27  
54  
3.3  
59  
58  
57  
56  
2X 9.6  
0.000  
PKG  
2
1.24  
53  
1.1  
55  
54  
3.7  
THERMAL PAD DETAIL  
5.1  
2
1
5.45  
TOLERANCE 0.05  
0.5  
0.3  
48X  
0.1  
C A B  
52  
41  
0.6  
0.4  
0.05  
48X  
(0.05) TYP  
4223441/C 08/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
MOL0059A  
QFM - 6.4 mm max height  
PLASTIC QUAD FLAT MODULE  
(1.24)  
(1.1)  
4X (2.85)  
(2)  
48X (0.5)  
46  
52  
(7.7)  
4X (2.55)  
(6.4)  
(5.45)  
1
2
(3.3)  
(5.1)  
(4.9)  
(4.775)  
(4.27)  
(3.7)  
(2.6)  
55  
54  
48X (0.4)  
53  
4X (2.2)  
SOLDER MASK  
OPENING  
TYP  
59  
58  
57  
56  
COPPER  
KEEP-OUT AREA  
4X 0.5 X 0.85  
4X (3.2)  
0.000 PKG  
32  
2X  
(0.35)  
(0.45)  
(0.8) TYP  
METAL UNDER  
SOLDER MASK  
TYP  
(R0.05) TYP  
14  
15  
28  
27  
4X (6.675)  
(7.7)  
26  
16  
LAND PATTERN EXAMPLE  
SEE NEXT PAGE FOR VIA DIMENSIONS  
SCALE: 6X  
0.07 MIN  
ALL AROUND  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
SOLDER MASK DETAILS  
SOLDER MASK DEFINED PADS  
4223441/C 08/2017  
NOTES: (continued)  
4. This package is designed to be soldered to the thermal pads on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
MOL0059A  
QFM - 6.4 mm max height  
PLASTIC QUAD FLAT MODULE  
2X (1.088)  
2X (0.938)  
(7.3)  
41  
SOLDER MASK OPENING  
TYP  
(6.675)  
(
0.2) TYP  
VIA  
(5.45)  
4X (5.2)  
54  
(5.1)  
53  
55  
4X (1)  
(3.7)  
(3.3)  
(0.59) TYP  
2X (0.75)  
SOLDER MASK  
OPENING  
TYP  
(1.7) TYP  
57  
56  
59  
58  
0.000 PKG  
(0.8) TYP  
(1.7) TYP  
(1.3) TYP  
(R0.05) TYP  
METAL UNDER  
SOLDER MASK  
TYP  
LAND PATTERN EXAMPLE  
VIA DETAIL  
SCALE: 10X  
4223441/C 08/2017  
www.ti.com  
EXAMPLE STENCIL DESIGN  
MOL0059A  
QFM - 6.4 mm max height  
PLASTIC QUAD FLAT MODULE  
2X (1.2)  
METAL UNDER  
SOLDER MASK  
TYP  
2X (1.04)  
SOLDER MASK  
OPENING  
TYP  
52  
(7.7)  
(6.224)  
41  
(6.075)  
1
2
2X (1.147)  
(4.677)  
2X (1.75) (4.125)  
(4.374)  
53  
54  
48X (0.4)  
48X (0.5)  
(3.027)  
2X (1.347)  
55  
59  
2X (1.744)  
(0.795)  
0.000  
PKG  
16X (1.39)  
16X (0.98)  
(0.795)  
(0.8) TYP  
58  
57  
56  
(R0.05) TYP  
16X (1.26)  
16X (1.14)  
28  
27  
14  
15  
8X (6.005)  
8X (7.345)  
(7.7)  
16  
26  
PKG  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE  
PADS 1,15,27 & 41: 76%  
PAD 53: 79%  
PADS 54 - 59: 77%  
SCALE: 8X  
4223441/C 08/2017  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
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