TPSM846C23MOLR [TI]
4.5V 至 15V 输入、0.35V 至 2.0V 输出、35A PMBus 电源模块 | MOL | 59 | -40 to 105;型号: | TPSM846C23MOLR |
厂家: | TEXAS INSTRUMENTS |
描述: | 4.5V 至 15V 输入、0.35V 至 2.0V 输出、35A PMBus 电源模块 | MOL | 59 | -40 to 105 电源电路 |
文件: | 总93页 (文件大小:2039K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
TPSM846C23 4.5V 至 15V 输入、0.35V 至 2V 输出、35A PMBus™电源
模块
1 特性
3 说明
1
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
完全集成 PMBus™电源解决方案
TPSM846C23 是一款 35A 固定频率降压电源模块,兼
容 PMBus 并支持 PMBus 命令,可实现对电源稳压器
主要功能的配置、控制和监控。该模块包含控制器、电
源 MOSFET、电感器和相关组件,采用坚固耐用的耐
热增强型表面贴装式封装。用户提供输入和输出电容器
及少量其他无源组件即可设置该模块的运行参数。这两
个模块可配置为并联工作,以提供最高可达 70A 的两
相电源解决方案。
与 TPSM846C24 引脚兼容(非 PMBus)
可堆叠,最高可达 70A,具有电流共享
输出电压范围:0.35V 至 2V
输出电压准确度高达 0.5%
15mm × 16mm 尺寸(最大高度 6.4mm)
300kHz 至 1MHz 开关频率
可与外部时钟保持同步
差动遥感
PMBus 接口提供输出电压、UVLO、软启动、软停
止、过电流和热关断等参数的转换器配置。该接口还具
有遥测支持功能,可报告实际输出电压、输出电流和器
件温度。此外还支持标准 PMBus 警告和故障功能。该
器件支持 PMBus 通信,速度最高可达 400kHz,并在
PMBus 1.3 规范下支持一小组命令。
电源正常输出
预偏置输出单调启动
PMBus 遥测:电流、电压、温度
可编程保护和故障响应
可编程 UVLO、软启动/停止、延迟
工作 IC 结温范围:-40°C 至 +125°C
工作环境温度范围:-40°C 至 +105°C
增强的热性能:8.7°C/W
该器件采用 15mm × 16mm 组件尺寸,可轻松焊接到
印刷电路板上,并可实现紧凑的负载点设计。
器件信息(1)
符合 EN55022 A 类辐射发射标准
使用 TPSM846C23 并借助 WEBENCH® 电源设计
器创建定制设计方案
器件型号
封装
封装尺寸(标称值)
TPSM846C23
MOL (59)
15.00mm × 16.00mm
(1) 如需了解所有可用封装,请参阅产品说明书末尾的可订购产品
附录。
2 应用
•
•
•
•
紧凑型 PCI/PCI 快速接口/PXI 快速接口
空白
空白
宽带和通信基础设施
自动化测试和医疗设备
DSP 和 FPGA 负载点 应用
简化电路原理图
效率与输出电流间的关系
VIN
VIN
VS+
100
95
90
85
80
75
70
VOUT
VOUT
PGND
PGND
VS-
TPSM846C23
DATA
CLK
PMBUS
INTERFACE
ALERT
CNTL
DIFFO
FB
ADDR1
ADDR0
65
PGND AGND
VOUT = 1.8 V
VIN = 5 V
VIN = 12 V
60
55
0
5
10
15
20
25
30
35
Copyright © 2018, Texas Instruments Incorporated
Output Current (A)
Eff1
1
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。 有关适用的官方英文版本的最新信息,请访问 www.ti.com,其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLVSDF3
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
目录
7.5 Register Maps......................................................... 31
Application and Implementation ........................ 72
8.1 Typical Application .................................................. 72
Power Supply Recommendations...................... 76
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information ................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics.......................................... 8
6.7 Programmable Characteristics.................................. 8
6.8 Typical Characteristics (VIN = 12 V)........................ 10
6.9 Typical Characteristics (VIN = 5 V).......................... 11
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 31
8
9
10 Layout................................................................... 77
10.1 Layout Guidelines ................................................. 77
10.2 Layout Example .................................................... 77
10.3 Package Specifications......................................... 79
10.4 EMI........................................................................ 79
10.5 Mounting and Thermal Profile Recommendation.. 81
11 器件和文档支持 ..................................................... 82
11.1 器件支持................................................................ 82
11.2 文档支持................................................................ 82
11.3 接收文档更新通知 ................................................. 82
11.4 社区资源................................................................ 82
11.5 商标....................................................................... 82
11.6 静电放电警告......................................................... 82
11.7 术语表 ................................................................... 82
12 机械、封装和可订购信息....................................... 83
12.1 Tape and Reel Information ................................... 83
7
4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision E (September 2018) to Revision F
Page
•
Changed HBM ESD from 500 V to 1000 V ........................................................................................................................... 5
Changes from Revision D (January 2018) to Revision E
Page
•
Updated PCB Top-side Layout Recommendation figure ..................................................................................................... 77
Changes from Revision C (August 2017) to Revision D
Page
•
首次发布生产数据产品说明书 ................................................................................................................................................ 1
Changes from Revision B (March 2017) to Revision C
Page
•
•
•
•
产品说明书标记为“预告信息”- 可提供原型样片 ...................................................................................................................... 1
将器件的最大高度更改为 6.4mm ............................................................................................................................................ 1
Added link to the parallel EVM and user's guide ................................................................................................................. 27
Added the EMI section ........................................................................................................................................................ 79
Changes from Revision A (March 2017) to Revision B
Page
•
在 特性 中添加了器件高度 ...................................................................................................................................................... 1
Changes from Original (March 2017) to Revision A
Page
•
Corrected 3 pin names on the 图 19 .................................................................................................................................... 72
2
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
5 Pin Configuration and Functions
MOL Package
59-Pin BQFN
Top View
40 39 38 37 36 35 34 33 32 31 30 29 28
41
27
VOUT
PH
55
56
VOUT
PGND
PGND
PGND
VIN
PH
42
43
44
45
46
47
48
49
50
51
52
26
25
24
23
22
21
20
19
18
17
16
54
PH
57
PGND
PH
PGND
VIN
PH
53
VIN
PH
58
PGND
VIN
DNC
ALERT
CLK
BP3
BP6_RTN
BP6
59
PGND
DATA
ADDR0
ADDR1
VINBP
BP_RTN
PGOOD
NC
1
15
NC
2
3
4
5
6
7
8
9
10 11 12 13 14
Copyright © 2017–2019, Texas Instruments Incorporated
3
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Connect a resistor from this pin to AGND to set the low-order 3 bits of the desired PMBus address.
Do not leave this pin floating. See PMBus Address.
ADDR0
17
I
I
Connect a resistor from this pin to AGND to set the high-order 3 bits of the desired PMBus address.
Do not leave this pin floating. See PMBus Address.
ADDR1
16
AGND
10
20
51
G
O
G
Analog ground for the controller circuitry. This pin is internally connected to PGND.
PMBus ALERT pin. See PMBus specification.
ALERT
BP_RTN
Return path for VINBP and BP3. This pin is internally connected to PGND, pad 59.
Output of the internal 3.3-V regulator. Bypass this pin with a minimum of 2.2-µF to BP_RTN. Can be
used as a pullup termination voltage for PGOOD and PMBus signals.
BP3
BP6
47
49
O
O
Output of the internal 6.5-V regulator that powers the driver stage of the device. Bypass this pin with
a minimum of 2.2-µF to BP6_RTN.
BP6_RTN
CLK
48
19
12
9
G
I
Power ground return path for BP6 bypass capacitor.
PMBus CLK pin. See PMBus specification.
PMBus CNTL pin. See PMBus specification.
Output of the error amplifier.
CNTL
I
COMP
DATA
O
I/O
18
PMBus DATA pin. See PMBus specification.
Output of the remote sense differential amplifier. This provides remote sensing for output voltage
reporting and the voltage control loop.
DIFFO
DNC
6
O
–
Do Not Connect. Do not connect these pins to AGND, PGND, to another DNC pin, or to any other
voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad.
8, 21, 30, 31
FB
7
2
I
I
Feedback pin for the control loop.
ISHARE
Current sharing signal for parallel operation.
Not Connected. These pins are internally isolated from any signal and all other pins. Each pin must
be soldered to a pad on the PCB. These pins can be left isolated or connected to AGND or PGND.
NC
1, 15
–
32, 33, 34,
35,
36,42, 43, 54,
56, 57, 58, 59
Power ground of the device. This is the return current path for the power stage of the device.
Connect these pins to the bypass capacitors associated with VIN and VOUT. Connect pads 56, 57,
58, and 59 to the PCB ground planes using multiple vias for optimal thermal performance. All pins
should be connected together externally with a copper plane or pour directly under the device.
PGND
G
Power good indicator. This pin is an open-drain output and will assert low during any fault/warn
conditions. See Power Good Indicator section for details. Requires a pullup resistor.
PGOOD
PH
52
O
O
22, 23, 24,
25, 26, 27,
28, 29
Phase switch node. Do not connect any external components to these pins or tie them to a pin of
another function.
Frequency-setting resistor. To operate the device at its default switching frequency, do not connect to
this pin. To operate at a different switching frequency, connect a resistor from this pin to AGND.
RT
13
14
I
I
RT resistor select. To operate the device at its default switching frequency, connect this pin to
AGND. To operate at a different switching frequency, let this pin float.
RT_SEL
Frequency synchronization pin. In a stand-alone application or as the Master device in a parallel
configuration, the SYNC pin is configured as a SYNC-IN pin and power conversion is synchronized
to the rising edge of a 50% duty cycle external clock applied to this pin.
SYNC
11
I/O
For a Slave device in a parallel configuration, power conversion is synchronized to the falling edge of
the incoming clock.
44, 45,
46, 53
VIN
I
I
Input switching voltage pins. These pins supply voltage to the power switches of the converter.
Input power to the controller circuitry. Bypass this pin with a minimum of 1 µF to BP_RTN. This pin is
internally connected to VIN.
VINBP
VOUT
VS+
50
37, 38, 39,
40, 41, 55
Output voltage. These pins are connected to the internal output inductor. Connect these pins to the
output load and connect external bypass capacitors between these pins and PGND.
O
I
Positive input of the remote amplifier. Connect this pin to VOUT at the load for best voltage
regulation. Do not let this pin float.
4
Negative input of the remote amplifier. Connect this pin to ground at the load for best voltage
regulation. Do not let this pin float.
VS–
5
3
I
VSHARE
I/O
Voltage sharing signal for parallel operation.
4
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
6 Specifications
6.1 Absolute Maximum Ratings
Over operating ambient temperature range (unless otherwise noted)(1)
PARAMETER
MIN
MAX
18
UNIT
VIN
–0.3
VIN < 2-ms transient
VIN–PH (VIN TO PH differentially)
19
–0.3
–0.3
–0.3
–0.3
–0.3
–1
25
Input voltage
ADDR0, ADDR1, FB
3.6
5.5
7
V
CLK, DATA
VS+, VS–, RT, CNTL, SYNC, PGOOD, ISHARE, RT_SEL
BP6_RTN, BP_RTN, AGND
0.3
25
PH
PH < 100-ns transient
–5
25
Output voltage
BP6, COMP, DIFFO, VSHARE
–0.3
–0.3
–0.3
–40
–40
–55
7
V
ALERT
BP3
5.5
3.6
125
105
150
500
10
Operating IC junction temperature, TJ
Operating ambient temperature, TA
Storage temperature, Tstg
Mechanical shock
°C
°C
G
Mechanical vibration
G
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±1000
±1500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating ambient temperature range (unless otherwise noted)
PARAMETER
MIN
NOM
12
MAX
15
UNIT
VIN
4.5
Input voltage
SYNC
3.3
6.5
V
PGOOD pull-up voltage
3.3
5.5
Output voltage
Output current
Frequency
VOUT
IOUT
0.35
0
2.0
V
A
35
300
–40
–40
500
1000
105
125
kHz
°C
°C
Operating ambient temperature
Operating IC junction temperature
Temperature
Copyright © 2017–2019, Texas Instruments Incorporated
5
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
6.4 Thermal Information
TPSM846C23
MOL (QFN)
59 PINS
8.7
THERMAL METRIC(1)
UNIT
RθJA
ψJT
Junction-to-ambient thermal resistance(2)
Junction-to-top characterization parameter(3)
Junction-to-board characterization parameter(4)
°C/W
°C/W
°C/W
0.9
ψJB
4.3
(1) For more information about thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 100 mm × 100 mm, 6-layer PCB with 2 oz.
copper and natural convection cooling. Additional airflow reduces RθJA
.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
6.5 Electrical Characteristics
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT(max), ƒSW = 500 kHz,
CIN1 = 4 × 22 µF, 25 V, 1210 ceramic, CIN2 = 2 × 330 µF electrolytic bulk, COUT1 = 4 × 47 µF, 6.3 V, 1210 ceramic,
COUT2 = 2 × 470 µF, 6.3-V polymer bulk (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT VOLTAGE (VIN
)
VIN
IVIN
Input voltage
Over IOUT range
4.5
15
12
V
Input operating current
Non-switching supply current
7.7
mA
OUTPUT VOLTAGE (VOUT
)
RSET = Not loaded, VOUT_SCALE_LOOP = 1
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5
RSET = Not loaded, VOUT_SCALE_LOOP = 1.0
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5
RSET = Not loaded, VOUT_SCALE_LOOP = 1
RSET = 10 kΩ, 1%, VOUT_SCALE_LOOP = 0.5
RSET = Not loaded, TJ = 25°C, IOUT = 0 A
RSET = 10 kΩ, 1%, TJ = 25°C, IOUT = 0 A(4)
0°C < TJ < 85°C, IOUT = 0 A(2)
500
1
mV
V
Factory default setting
0.35
0.7
1.65
2(3)
V
VOUT programmable range(1)(2)
VOUT programmable step size
Setpoint voltage tolerance
Temperature variation
V
1.953
3.906
mV
mV
VOUT
–1%
–1.5%
–0.5%
–1%
1%
1.5%
0.5%
1%
–40°C < TJ < 125°C, IOUT = 0 A(2)
Line regulation
4.5 V < VIN < 15 V, IOUT = 0 A
±0.05%
±0.2%
13
Load regulation
Output voltage ripple
Over IOUT range, using remote sense
20-MHz bandwidth
mV
OUTPUT CURRENT
IOUT Output current
Natural Convection. See SOA graph for derating.
Factory default setting
0
5
35
52
A
A
42
37
IOCF
Overcurrent fault threshold
Programmable range
Factory default setting
IOCWF
Overcurrent warning threshold
Overcurrent fault accuracy
Output current share accuracy
A
Programmable range
4
–15%
–15%
–3%
50
15%
15%
3%
IOCF(acc)
ISH(acc)
IOUT ≥ 20 A
(IOUT1 – IOUT2) ÷ ITOTAL, IOUT ≥ 20 A per module(5)
(IOUTx – ITOTAL) ÷ 2, IOUT < 20 A per module(5)
(1) Output voltage is set by the VOUT_COMMAND PMBus command.
(2) Specified by design. Not production tested.
(3) While the PMBus permits setting the output voltage higher than 2 V, this product is not designed to be operated beyond this limit.
(4) The stated limit of the set-point tolerance includes the tolernace of both the internal voltage reference and the internal adjustment
resistor. The overall output voltage tolerance will be affected by the tolerance of the external RSET resistor.
(5) Specified by correlation. Not production tested.
6
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Electrical Characteristics (continued)
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT(max), ƒSW = 500 kHz,
CIN1 = 4 × 22 µF, 25 V, 1210 ceramic, CIN2 = 2 × 330 µF electrolytic bulk, COUT1 = 4 × 47 µF, 6.3 V, 1210 ceramic,
COUT2 = 2 × 470 µF, 6.3-V polymer bulk (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER GOOD (PGOOD) AND OVERVOLTAGE / UNDERVOLTAGE THRESHOLD
VIN = 4 V, VOUT = 0 V, IPGOOD = 5 mA
0.3
0.8
VPG(OL)
PGOOD output low voltage
V
VIN = 0 V, IPGOOD = 80 µA
VPG(rise)
PGOOD threshold VOUT rising
PGOOD threshold VOUT falling
Overvoltage warning threshold
Overvoltage fault threshold
Undervoltage warning threshold
Undervoltage fault threshold
95
105
112
117
88
%VO
%VO
%VO
%VO
%VO
%VO
VPG(fall)
VOVWARN
VOVFAULT
VUVWARN
VUVFAULT
VOUT setting = 1.2 V
83
PERFORMANCE
VOUT = 0.8 V
VOUT = 1.2 V
VOUT = 1.8 V
VOUT = 0.8 V
VOUT = 1.2 V
VOUT = 1.8 V
VOUT over/undershoot
83%
87%
90%
84%
88%
91%
60
VIN = 12 V, IOUT = 25 A
(6)
Efficiency
VIN = 5 V, IOUT = 25 A
10 A / µs load step from
25% to 75% of IOUT(max)
COUT = 1000 µF,
RC = 1 kΩ, CC = 1 nF
mV
µs
,
Recovery time
60
40
60
27
60
10 A / µs load step from
25% to 75% of IOUT(max)
COUT = 2000 µF,
RC = 665 Ω, CC = 1.5 nF
VOUT over/undershoot
Recovery time
mV
µs
,
(6)
Transient response
10 A / µs load step from
25% to 75% of IOUT(max)
COUT = 4000 µF,
VOUT over/undershoot
Recovery time
mV
µs
,
RC = 499 Ω, CC = 2.2 nF
INTERNAL LOAD (BP6, BP3)
VBP6
BP6 regulator output voltage
7.5V ≤ VIN ≤ 15 V, switching
(VVIN – VBP6), VIN = 4.5 V, switching
VIN ≥ 4.5 V
5.85
3
6.4
3.2
6.95
400
3.4
V
mV
V
VBP6(DO)
VBP3
Dropout voltage
BP3 regulator output voltage
CAPACITANCE
ceramic
88
µF
µF
µF
µF
mΩ
CIN
External input capacitance
non-ceramic
ceramic(7)
660
188
940
COUT
External output capacitance
4000(8)
5
non-ceramic(7)
ESR(9)
(6) Specified by design. Not production tested.
(7) The minimum required output capacitance consists of 4 × 47-µF ceramic capacitors and 2 × 470-µF, 10-mΩ ESR (5 mΩ equivalent).
(8) The proper frequency compensation network values are determined by the total amount of output capacitance. (See the Setting the
Compensation Network section.)
(9) The maximum ESR refers to the combined equivalent ESR of all non-ceramic output capacitors. For example, two 10-mΩ ESR
capacitors have a combined equivalent ESR of 5 mΩ.
Copyright © 2017–2019, Texas Instruments Incorporated
7
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
6.6 Switching Characteristics
Over –40°C to 105°C free-air temperature range, VIN = 12 V, VOUT = 1.2 V, IOUT = IOUT max, ƒSW = 500 kHz, CIN1 = 4 × 22-µF
25-V 1210 ceramic, CIN2 = 2 × 330-µF electrolytic bulk, COUT1 = 4 × 47-µF, 6.3-V 1210 ceramic, COUT2 = 2 × 470-µF, 6.3-V
polymer bulk (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OSCILLATOR
Factory default setting. RT_SEL
grounded, No RT resistor
425
500
575
RT = 68.1 kΩ, 1% RT_SEL open
RT = 20.0 kΩ, 1% RT_SEL open
Adjustment range
255
850
300
300
345
1150
1000
ƒSW
Switching frequency
kHz
1000
PWM
tON-MIN
tOFF-MIN
Minimum on time(1)
Minimum off time(1)
50
100
560
ns
ns
fSW = 1MHz
515
SYNCHRONIZATION
VIH(sync)
VIL(sync)
DSYNC
ƒSYNC
High-level input voltage
2.2
V
V
Low-level input voltage
Sync input duty cycle
Sync frequency range
0.8
ƒSW = 300 kHz to 1 MHz
50%
300
1000
kHz
(1) Specified by design. Not production tested.
6.7 Programmable Characteristics
Over operating free-air temperature range, VIN = 12 V, ƒSW = 500 kHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SOFT START (PMBus Programmable)
Factory default setting
3
ms
ms
TON_RISE
Soft-start time
Programmable range, 16 discrete settings(1)(2)
Accuracy, TON_RISE = 3 ms
Factory default setting(3)
Programmable range, 16 discrete settings(1)(3)
Accuracy(1)
0
100
–10%
10%
0
0
ms
ms
TON_MAX_
FAULT_LIMIT
Upper limit in time to power up
the output
0
100
–10%
10%
Factory default setting
ms
ms
(1)
TON_DELAY
Turnon delay
Programmable range, 16 discrete settings
0
100
Accuracy(1)
–10%
10%
SOFT STOP (PMBus Programmable)
Factory default setting
3
0
ms
ms
(1)(2)
TOFF_FALL
Soft-start time
Turnon delay
Programmable range, 16 discrete settings
0
100
Accuracy, TOFF_FALL= 1 ms
Factory default setting(2)
Programmable range, 16 discrete settings(1)
Accuracy(1)
–10%
10%
ms
ms
TOFF_DELAY
0
100
–10%
10%
UNDERVOLTAGE LOCKOUT (UVLO) (PMBus Programmable)
Factory default setting
4.5
4
V
V
(1)
VIN_ON
Input turnon voltage
Programmable range, 15 discrete settings
Accuracy
4.25
–5%
7.75
5%
Factory default setting
V
V
VIN_OFF
Input turnoff voltage
Programmable range, 15 discrete settings(1)
Accuracy(1)
4
7.5
–10%
10%
TEMPERATURE SENSE AND THERMAL SHUTDOWN
(1) Specified by design. Not production tested.
(2) Setting TON_RISE or TOFF_FALL to 0 ms programs the device to bring its output voltage up to the programmed regulation value or
down to 0 V as quickly as possible, resulting in an effective TON_RISE and TOFF_FALL time of 1 ms.
(3) Setting TON_MAX_FAULT_LIMIT to 0 disables the TON_MAX_FAULT response.
8
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Programmable Characteristics (continued)
Over operating free-air temperature range, VIN = 12 V, ƒSW = 500 kHz (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Junction thermal shutdown
temperature(1)
TSD
145
160
°C
THYST
Thermal shutdown hysteresis(1)
25
°C
°C
°C
°C
°C
Factory default setting
145
OT_FAULT
_LIMIT
Overtemperature fault limit
Programmable range(1)
Factory default setting
Programmable range(1)
120
165
120
20
OT_WARN
_LIMIT
Overtemperature warning limit
100
15
140
25
Overtemperature fault warning
hysteresis(1)
TOT(hys)
°C
MEASUREMENT SYSTEM
Output voltage measurement
MVOUT(rng)
MVOUT(acc)
MVOUT(lsb)
MIOUT(mg)
0
5.8
2%
V
range(1)
Output voltage measurement
accuracy(1)
VOUT = 1.2 V
–2%
Output voltage measurement bit
resolution(1)
2 – 9
V
A
Output current measurement
range(1)
0
52
I
OUT ≥ 20 A
–15%
–3
15%
3
Output current measurement
accuracy
MIOUT(acc)
3 A ≤ IOUT ≤ 20 A
A
Output current measurement bit
resolution(1)
MIOUT(lsb)
MTSNS(mg)
MTSNS(acc)
MTSNS(lsb)
62.5
mA
Internal temperature sense
range(1)
–40
–5
165
5
°C
°C
°C
Internal temperature sense
accuracy(1)
–40°C ≤ TJ ≤ 165°C
Internal temperature sense bit
resolution(1)
1
PMBus INTERFACE
Logic-high voltage on CLK,
DATA, CNTL
VIH(PMBUS)
1.35
–10
V
Logic-low voltage on CLK,
DATA, CNTL
VIL(PMBUS)
VhysCNTL
IIH(PMBUS)
0.8
10
V
Hysteresis on CNTL
170
mV
µA
Input high-level current into CLK,
DATA
Input low-level current into CLK,
DATA
IIL(PMBUS)
ICNTL
–10
5
10
10
µA
µA
V
CNTL pin pullup current
Output low-level voltage on
DATA, ALERT
VOL(PMBUS)
VIN > 4.5 V, IOL(PMBUS) = 4 mA
0.4
Output high-level leakage current
into DATA, ALERT
IOH(PMBUS)
Voltage on DATA, ALERT = 5.5 V
10
µA
Output low-level sinking current
into DATA, ALERT
IOL(PMBUS)
ƒPMBUS
Voltage on DATA, ALERT< 0.4 V
Slave mode
4
mA
PMBus operating frequency
10
400
kHz
版权 © 2017–2019, Texas Instruments Incorporated
9
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
6.8 Typical Characteristics (VIN = 12 V)
VIN = 12 V, TA = 25°C, fSW = 500 kHz (unless otherwise specified). Safe operating area curves were measured using a Texas
Instruments evaluation module (EVM).
100
95
90
85
80
75
70
65
60
55
10
8
1.8 V
1.2 V
0.8 V
6
4
2
1.8 V
1.2 V
0.8 V
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D001
D002
VIN = 12 V
fSW = 500 kHz
VIN = 12 V
fSW = 500 kHz
图 1. Efficiency vs Output Current
图 2. Power Dissipation vs Output Current
115
105
95
20
18
16
14
12
10
8
1.8 V
1.2 V
0.8 V
85
75
65
55
400LFM
200LFM
100LFM
Nat conv
45
35
6
25
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D003
D007
VIN = 12 V
fSW = 500 kHz
VIN = 12 V
VOUT = 0.8 V
图 4. Safe Operating Area
fSW = 500 kHz
图 3. Voltage Ripple vs Output Current
115
105
95
85
75
65
55
45
35
25
115
105
95
85
75
65
55
400LFM
400LFM
200LFM
100LFM
Nat conv
45
200LFM
100LFM
Nat conv
35
25
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D009
D008
VIN = 12 V
VOUT = 1.8 V
图 6. Safe Operating Area
fSW = 500 kHz
VIN = 12 V
VOUT = 1.2 V
图 5. Safe Operating Area
fSW = 500 kHz
10
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
6.9 Typical Characteristics (VIN = 5 V)
VIN = 5 V, TA = 25°C, fSW = 500 kHz (unless otherwise specified). Safe operating area curves were measured using a Texas
Instruments evaluation module (EVM).
100
95
90
85
80
75
70
65
60
55
10
8
1.8 V
1.2 V
0.8 V
6
4
2
1.8 V
1.2 V
0.8 V
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D004
D005
VIN = 5 V
fSW = 500 kHz
VIN = 5 V
fSW = 500 kHz
图 7. Efficiency vs Output Current
图 8. Power Dissipation vs Output Current
20
18
16
14
12
10
8
115
105
95
1.8 V
1.2 V
0.8 V
85
75
65
55
400LFM
200LFM
100LFM
Nat conv
45
35
6
25
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D006
D010
VIN = 5 V
fSW = 500 kHz
VIN = 5 V
VOUT = 0.8 V
图 10. Safe Operating Area
fSW = 500 kHz
图 9. Voltage Ripple vs Output Current
115
105
95
115
105
95
85
85
75
75
65
65
55
55
400LFM
200LFM
100LFM
Nat conv
400LFM
200LFM
100LFM
45
45
35
35
Nat conv
25
25
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Output Current (A)
Output Current (A)
D011
D012
VIN = 5 V
VOUT = 1.2 V
fSW = 500 kHz
VIN = 5 V
VOUT = 1.8 V
fSW = 500 kHz
图 11. Safe Operating Area
图 12. Safe Operating Area
版权 © 2017–2019, Texas Instruments Incorporated
11
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TPSM846C23 device is a PMBus-1.3-compliant, 35-A, high-performance, synchronous buck-power module,
enabling high-power density and minimal PCB area. This device implement the industry-standard fixed switching
frequency, voltage-mode control with input feed-forward topology that responds instantly to input voltage change.
This device can be synchronized to the external clock to eliminate beat noise and reduce EMI and EMC.
Monotonic prebias capability eliminates concerns about damaging sensitive loads. Two TPSM846C23 devices
can be paralleled together to provide up to 70-A load. Current sensing for overcurrent protection, current
reporting, and current sharing between two devices are implemented by sampling a small portion of the power-
stage current, which provides accurate information independent of the device temperature. The integrated
PMBus interface capability provides precise current monitoring, voltage monitoring, and internal die-temperature
monitoring, as well as many user-programmable configuration options including adaptive voltage scaling (AVS)
function through standard VOUT_COMMAND on the PMBus.
7.2 Functional Block Diagram
RT_SEL
RT
SYNC
BP6
BP3
VINBP
TPSM846C23
40.2 kO
Linear
Regulators
Oscillator
VS+
VS-
Remote
Sense
Amplifier
VIN
DIFFO
10 kO
Power
Stage
and
Comp
PH
FB
Driver
Control
VOUT
VREF
+
COMP
VSHARE
ISHARE
Current
Share
PGND
Temp
Sensing
VREF
BP6_RTN
AGND
Analog
Inputs and
ADC
CLK
PMBus 1.3
Interface
and
DATA
BP_RTN
IC
Interface
ALRT
CNTL
Commands
EEPROM
ADDR0 ADDR1
PGOOD
Copyright © 2018, Texas Instruments Incorporated
12
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3 Feature Description
7.3.1 PMBus
7.3.1.1 PMBus General Description
Timing and electrical characteristics of the PMBus interface specification can be found in the PMB Power
Management Protocol Specification, Part 1, revision 1.3 available at http://pmbus.org. The TPSM846C23 device
supports both the 100-kHz and 400-kHz bus timing requirements. The devices do not stretch pulses when
communicating with the master device.
Communication over the PMBus interface can support the packet error checking (PEC) scheme if desired. If the
master supplies clock (CLK pin) pulses for the PEC byte, PEC is used. If the CLK pulses are not present before
a STOP, the PEC is not used.
The devices support a subset of the commands in the PMBus 1.3 Power Management Protocol Specification.
See Supported PMBus Commands for more information
The devices contain nonvolatile memory that stores configuration settings and scale factors. However, the device
does not automatically save the settings programmed into this nonvolatile memory. The STORE_DEFAULT_ALL
(11h) or STORE_USER_ALL (15h) command must be used to commit the current settings to nonvolatile memory
as device defaults. The settings that are capable of being stored in nonvolatile memory are noted in the detailed
command descriptions.
7.3.1.2 PMBus Address
The PMBus specification requires that each device connected to the PMBus have a unique address on the bus.
The TPSM846C23 device has 64 possible addresses (0 through 63 in decimal) that can be assigned by
connecting resistors from the ADDR0 and ADDR1 pins to AGND. The address is set in the form of two octal
digits (0 to 7), one digit for each pin. ADDR1 is the high order digit, and ADDR0 is the low-order digit. These
address selection resistors must be 1% tolerance or better. Using resistors other than the recommended values
can result in devices responding to adjacent addresses. The PMBus address, in decimal, is given by the
following expression:
PMBus Address = 8 × ADDR1(level) + ADDR0(level)
The E96 series resistors with no worse than 1% tolerance suggested for each digit value are shown in 表 1.
表 1. Required Address Resistors
LEVEL
RESISTOR VALUE (kΩ)
0
1
2
3
4
5
6
7
7.15
14
22.6
34.8
51.1
78.7
121
187
The TPSM846C23 device also detects values that are out of range on the ADDR0 and ADDR1 pins. If the device
detects that either pin has an out-of-range resistance connected to it, the device continues to respond to PMBus
interface commands, but does so at address 127 decimal, which is outside of the possible programmed
addresses. It is possible, but not recommended, to use the device in this condition, especially if other devices are
present on the bus or if another device could possibly occupy the 127 decimal address.
Certain addresses in the I2C address space are reserved for special functions, and it is possible to set the
address of the devices to respond to these addresses. The user is responsible for knowing which of these
reserved addresses are in use in a system and for setting the address of the devices accordingly so as not to
interfere with other system operations. The devices can be set to respond to the global call address or 0. TI
recommends not setting the devices to this address unless the user is certain that no other devices respond to
this address and that the overall bus is not affected by having such an address present.
版权 © 2017–2019, Texas Instruments Incorporated
13
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.1.3 PMBus Connections
The PMBus interface implemented in the TPSM846C23 device consists of four signal lines: CLK, DATA, ALERT,
and CNTL. The electrical specifications for the hardware interface follow the specifications given in System
Management Bus (SMBus) specification V2.0. The module supports both the 100-kHz and 400-kHz bus speeds.
For 400-kHz operation, observe the high-power DC specifications found in section 3.1.3 of the SMBus
specification.
Communication over the PMBus using packet error checking (PEC) is supported but is optional. If the master
supplies CLK pulses for the PEC byte, the PEC is used. If CLK pulses are not present before a STOP, the PEC
is not used. When data is transmitted over the bus, the lowest order byte is sent first, and the highest order byte
is sent last. Within any byte, the most significant bit (MSB) is sent first, and the least significant bit (LSB) is sent
last.
The TPSM846C23 supports the SMBALERT response protocol. This protocol is a mechanism by which a slave
(the TPSM846C23) can alert the bus master, via the ALERT pin, that it must communicate. The master
processes this event and simultaneously accesses all slaves on the bus (that support the protocol) through the
alert response address. Only the slave that caused the alert acknowledges this request. The host performs a
modified receive byte operation to get the slave address. At this point, the master can use the PMBus status
commands to query the slave that caused the alert. For more information on the SMBus alert protocol, see the
SMBus specification.
The CNTL signal is an input signal on the PMBus. It can be used to turn the power-conversion function of the
module on and off in conjunction with commands received over the bus. It can be configured as an active high or
active low signal through the ON_OFF_CONFIG command. The CNTL signal is programmed at the factory to be
an active high signal; that is, the CNTL pin must be pulled high for power conversion to occur. The customer can
change this configuration if desired.
For more information, see the PMBus Interface section of the Programmable Characteristics table.
7.3.1.4 Supported PMBus Commands
The commands listed in 表 2 are implemented as described to conform to the PMBus 1.3 specification. 表 2 also
lists the default for the bit behavior and register values.
表 2. Supported PMBus Commands and Default Values
DEFAULT
REGISTER
VALUE
CMD
CODE
PMBus 1.3
COMMAND NAME
PMBus COMMAND DESCRIPTION
DEFAULT BEHAVIOR
NVM
Can be configured through ON_OFF_CONFIG
to be used to turn the output on and off with or
without input from the CTRL pin.
OPERATION is not used to
enable regulation
01h
02h
OPERATION
00h
16h
No
Configures the combination of CNTL pin input
and OPERATION command for turning output
on and off.
ON_OFF_CONFIG
CNTL only. Active High
Yes
Clears all fault status registers to 0x00 and
releases SMBALERT.
03h
10h
11h
12h
15h
16h
CLEAR_FAULTS
Write-only
n/a
00h
n/a
n/a
n/a
n/a
No
Yes
No
No
No
No
Used to control writing to the volatile operating
memory (PMBus and restore from EEPROM).
WRITE_PROTECT
Allow writes to all registers
Write-only
Stores all current storable register settings into
EEPROM as new defaults.
STORE_DEFAULT_ALL
RESTORE_DEFAULT_ALL
STORE_USER_ALL
RESTORE_USER_ALL
Restores all storable register settings from
EEPROM.
Write-only
Stores all current storable register settings into
EEPROM as new defaults.
Write-only
Restores all storable register settings from
EEPROM.
Write-only
Read-only. PMBus v1.3, 400
kHz, PEC and SMBus Alert
Response Protocol supported
Provides a way for a host system to determine
key PMBus capabilities of the device.
19h
CAPABILITY
B0h
No
1Bh
20h
21h
SMBALERT_MASK
VOUT_MODE
Mask Warn or Fault status bits
Read-only output mode indicator.
Default regulation setpoint
Mask PGOOD only
Fixed at 2–9 (1.953 mV/count)
500 mV
n/a
17h
Yes
No
VOUT_COMMAND
0100h
Yes
14
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
表 2. Supported PMBus Commands and Default Values (接下页)
DEFAULT
REGISTER
VALUE
CMD
CODE
PMBus 1.3
COMMAND NAME
PMBus COMMAND DESCRIPTION
DEFAULT BEHAVIOR
NVM
If VOUT_SCALE_LOOP = 1:
VOUT_MAX restores to 1.65 V
034Dh
069Ah
0C00h
D03Ch
F004h
00B3h
0166h
02CCh
F012h
F010h
E000h
Sets the maximum output voltage. VOUT_MAX
imposes a higher bound to any attempted VOUT
setting.
If VOUT_SCALE_LOOP = 0.5:
VOUT_MAX restores to 3.3 V
24h
VOUT_MAX
No
If VOUT_SCALE_LOOP = 0.25:
VOUT_MAX restores to 6 V
Sets the rate at which the output should change
voltage.
27h
29h
VOUT_TRANSITION_RATE
VOUT_SCALE_LOOP
1 mV/us
1
No
Sets output sense scaling ratio for main control
loop.
Yes
If VOUT_SCALE_LOOP = 1:
VOUT_MIN restores to 0.35 V
Sets the minimum output voltage. VOUT_MIN
imposes a lower bound to any attempted VOUT
setting.
If VOUT_SCALE_LOOP = 0.5:
VOUT_MIN restores to 0.7 V
2Bh
VOUT_MIN
No
If VOUT_SCALE_LOOP = 0.25:
VOUT_MIN restores to 1.4 V
Sets value of input voltage at which the device
must start power conversion.
35h
36h
39h
VIN_ON
4.5 V
Yes
Yes
Yes
Sets value of input voltage at which the device
must stop power conversion.
VIN_OFF
4 V
Can be set to null out offsets in the current
sensing circuit.
IOUT_CAL_OFFSET
0.0000 A
41h
45h
VOUT_OV_FAULT_RESPONSE
VOUT_UV_FAULT_RESPONSE
Sets output overvoltage fault response.
Sets output undervoltage fault response.
Restart
Ignore
BFh
3Fh
Yes
Yes
Sets the limit value of the output current that
causes an overcurrent fault condition.
46h
47h
4Ah
4Fh
50h
IOUT_OC_FAULT_LIMIT
IOUT_OC_FAULT_RESPONSE
IOUT_OC_WARN_LIMIT
OT_FAULT_LIMIT
42 A
F854h
FFh
Yes
Yes
No
Sets response to output overcurrent faults to
latch-off, hiccup mode or ignore.
Hiccup/Restart
37 A (87.5% of OCF)
145°C
Sets the limit value of the output current that
causes an overcurrent warning condition.
F84Ah
0091h
BFh
Sets the limit value of the sensed temperature
that causes an overtemperature fault condition.
Yes
Yes
Sets response to over temperature faults to
latch-off, hiccup mode or ignore.
OT_FAULT_RESPONSE
Hiccup/Restart
Sets the limit value of the sensed temperature
that causes an overtemperature warning
condition.
51h
60h
61h
OT_WARN_LIMIT
TON_DELAY
TON_RISE
120°C (OTF – 25°C)
0078h
0000h
0003h
No
Sets the turnon delay.
0 ms
3 ms
Yes
Yes
Sets the time from when the output starts to rise
until the voltage has entered the regulation
band.
Sets an UPPER limit, in milliseconds, that the
unit can attempt to power up the output without
62h
TON_MAX_FAULT_LIMIT
reaching the output undervoltage fault limit. The Disabled
time begins counting as the device enters the
soft-start period.
0000h
No
63h
64h
65h
TON_MAX_FAULT_RESPONSE
TOFF_DELAY
Sets the soft-start timeout fault response.
Sets the turnoff delay.
Restart
0 ms
BFh
Yes
Yes
Yes
0000h
0003h
TOFF_FALL
Sets the soft stop fall time.
3 ms
Returns one byte summarizing the most critical
faults.
78h
79h
7Ah
7Bh
7Ch
STATUS_BYTE
STATUS_WORD
STATUS_VOUT
STATUS_IOUT
STATUS_INPUT
Current status
Current status
Current status
Current status
Current status
No
No
No
No
No
Returns two bytes summarizing fault and
warning conditions.
Returns one byte detailing if an output fault or
warning has occurred.
Returns one byte detailing if an overcurrent fault
or warning has occurred.
Returns one byte of information relating to the
status of the converter's input related faults.
版权 © 2017–2019, Texas Instruments Incorporated
15
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
表 2. Supported PMBus Commands and Default Values (接下页)
DEFAULT
REGISTER
VALUE
CMD
CODE
PMBus 1.3
COMMAND NAME
PMBus COMMAND DESCRIPTION
DEFAULT BEHAVIOR
NVM
Returns one byte detailing if a sensed
temperature fault or warning has occurred.
7Dh
7Eh
STATUS_TEMPERATURE
STATUS_CML
Current status
Current status
No
No
Returns one byte containing PMBus serial
communication faults.
Returns one byte detailing if internal
overtemperature or address detection fault has
occurred.
80h
STATUS_MFR_SPECIFIC
Current status
No
8Bh
8Ch
READ_VOUT
READ_IOUT
Returns the output voltage in volts.
Returns the output current in amps.
Read only
Current status
Current status
No
No
Read only
Read-only
Returns the sensed die temperature in degrees
Celsius.
8Dh
98h
READ_TEMPERATURE_1
PMBUS_REVISION
Current status
33h
No
No
Returns PMBus revision to which the device is
compliant.
PMBus 1.3
This read-only block read command returns a
single word (16 bits) with the unique device
code identifier for each device for which this
device can be configured. The BYTE_COUNT
field in the block read command is 2 (indicating
2 bytes follow): low byte first, then high byte.
ADh
AEh
IC_DEVICE_ID
TPS546C23
4623h
0001h
No
No
This read-only block read command returns a
single word (16 bits) with the unique device
revision identifier. The BYTE_COUNT field in
the block read command is 2 (indicating 2 bytes
follow): low byte first, then high byte.
IC_DEVICE_REV
Read only
D0h
D4h
MFR_SPECIFIC_00
User scratch pad.
0000h
0000h
Yes
Yes
VREF_TRIM (MFR_SPECIFIC_04)
(D4h)
Applies a fixed offset voltage to the error
amplifier reference voltage (EA_REF).
Fixed offset of 0 mV
If RSMHI_VAL = 0:
STEP_VREF_MARGIN_HIGH
will restore to 17.6 mV
0009h
000Fh
FFF7h
FFF1h
STEP_VREF_MARGIN_HIGH
(MFR_SPECIFIC_05) (D5h)
Increases the value of the reference voltage by
shifting the reference higher.
D5h
No
If RSMHI_VAL = 1:
STEP_VREF_MARGIN_HIGH
will restore to 29.3 mV
If RSMLO_VAL = 0:
STEP_VREF_MARGIN_LOW will
restore to –17.6 mV
STEP_VREF_MARGIN_LOW
(MFR_SPECIFIC_06) (D6h)
Decreases the value of the reference voltage by
shifting the reference lower.
D6h
D7h
No
If RSMLO_VAL = 1:
STEP_VREF_MARGIN_LOW will
restore to –29.3 mV
–17% for UV Fault,
–12% for UV Warning,
+12% for OV Warning,
+17% for OV Fault
Sets the PGOOD, VOUT_UNDER_VOLTAGE
(UV) and VOUT_OVER_VOLTAGE (OV) Limits
as a percentage of nominal.
PCT_OV_UV_WRN_FLT_LIMITS
(MFR_SPECIFIC_07) (D7h)
00h
Yes
See detailed command
description
E5h
F0h
OPTIONS (MFR_SPECIFIC_21)
Sets user-selectable options.
1084h
0193h
Yes
Yes
MISC_CONFIG_OPTIONS
(MFR_SPECIFIC_32)
See detailed command
description
Sets miscellaneous user-selectable options.
16
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.2 Minimum Capacitance Requirements
For proper operation, the minimum required input capacitance network consists of four 22-µF (or two 47-µF)
ceramic capacitors plus a 330-µF bulk capacitor. See capacitors C1 thru C5 in 图 13. Place the ceramic
capacitors as close as possible to the VIN pins. Connect the ground return path of the capacitors to PGND pins
42, 43, 54, and 59 of the TPSM846C23.
The minimum required output capacitance network consists of four 47-µF (or two 100µF) ceramic capacitors plus
two 470-µF, low-ESR polymer capacitors. See capacitors C10 thru C15 in 图 13. The combined ESR of the
polymer capacitors must not be greater than 5 mΩ. Place the ceramic capacitors as close as possible to the
VOUT and PGND pins of the module. This minimum network insures good transient response and minimal ripple
amplitude. The total amount of output capacitance determines the values of the frequency compensation
network. For more details see Setting the Compensation Network.
Additionally, the analog power path (VINBP) requires its own bypass network consisting of a 10-nF ceramic
capacitor (C8 in 图 13) and 1-µF ceramic capacitor (C7 in 图 13) connected directly across pins 50 and 51 of the
module. For proper operation, the two internal power supply rails of the module must also be bypassed. The 6.5-
V rail (BP6) requires a 4.7-µF ceramic capacitor (C6 in 图 13) placed across pins 48 and 49 of the module with
short, direct traces. The 3.3-V rail (BP3) requires a 2.2-µF ceramic capacitor (C9 in 图 13) placed very close to
pins 47 and 51.
TPSM846C23
4
VS+
44
45
46
53
37
38
39
40
41
55
VIN
VIN
VIN
VIN
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VIN
VOUT
49
BP6
C1
C2
C3
C4
C5
C10
C11
C12
C13
C14
C15
+
+
C6
+
32
33
34
35
36
56
57
58
4.7 ꢀF
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
22 ꢀF
22 ꢀF
22 ꢀF
22 ꢀF
47 ꢀF
47 ꢀF
47 ꢀF
47 ꢀF
330 ꢀF
48
470 ꢀF
470 ꢀF
BP6_RTN
42
43
54
59
PGND
PGND
PGND
PGND
PGND
PGND
50
51
47
VINBP
BP_RTN
BP3
C7
C8
5
VS-
1 ꢀF
10 nF
C9
2.2 ꢀF
Copyright © 2017, Texas Instruments Incorporated
图 13. Required Capacitor Schematic
版权 © 2017–2019, Texas Instruments Incorporated
17
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.3 Setting the Compensation Network
The TPSM846C23 requires an external series resistor and capacitor compensation network to be connected
between the DIFFO pin (pin 6) and the FB pin (pin 7). These are RCOMP and CCOMP in 图 14. The value of these
components is determined by the total amount of output capacitance and the switching frequency. Only ceramic
and low-ESR, polymer-type capacitors are recommended. These parts should be placed as close as possible to
the module and away from noisy signal traces. Suggested values for RCOMP and CCOMP for some typical values of
output capacitance are given in 表 3. Determine final values by testing system stability using standard power
supply evaluation techniques.
TPSM846C23
6
DIFFO
R
COMP
C
COMP
7
FB
Copyright © 2017, Texas Instruments Incorporated
图 14. Compensation Components
表 3. Recommended Compensation Components
SWITCHING FREQUENCY
TOTAL COUT (µF)
TYPICAL COUT
300 - 400 kHz
400 - 600 kHz
600 - 1000 kHz
MIN
1000
1500
3000
MAX
1500
3000
5000
RCOMP
CCOMP
1000 pF
1500 pF
2200 pF
RCOMP
CCOMP
1500 pF
2200 pF
4700 pF
RCOMP
CCOMP
2200 pF
4700 pF
6800 pF
Ceramic
Polymer
2 x 470 µF
4 x 470 µF
4 x 1000 µF
1.0 kΩ
665 Ω
499 Ω
665 Ω
499 Ω
249 Ω
499 Ω
249 Ω
124 Ω
4 x 47 µF
4 x 47 µF
4 x 47 µF
18
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.4 Transient Response
The TPSM846C23 is designed to have an exceptional output voltage transient response to output current load
steps. 表 4 shows the voltage deviation for several transient conditions.
表 4. Output Voltage Transient Response
CIN = 4 × 22-µF Ceramic, 2 × 330-µF Electrolytic
(1)
COUT
NON-CERAMIC
VOLTAGE
VOUT (V)
VIN (V)
fSW (kHz)
RCOMP
CCOMP
(2)
DEVIATION (mV)
Ceramic
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
4× 47 µF
500
500
500
750
500
750
500
500
500
500
500
500
500
750
500
750
500
500
300
500
300
500
499 Ω
249 Ω
249 Ω
124 Ω
499 Ω
124 Ω
499 Ω
249 Ω
665 Ω
499 Ω
249 Ω
665 Ω
499 Ω
499 Ω
665 Ω
499 Ω
665 Ω
499 Ω
1.0 kΩ
665 Ω
1.0 kΩ
665 Ω
2200 pF
4700 pF
4700 pF
6800 pF
2200 pF
6800 pF
2200 pF
4700 pF
1500 pF
2200 pF
4700 pF
1500 pF
2200 pF
2200 pF
1500 pF
2200 pF
1500 pF
2200 pF
1000 pF
1500 pF
1000 pF
1500 pF
4× 470 µF
4× 1000 µF
4× 470 µF
4× 1000 µF
4× 470 µF
4× 1000 µF
4× 470 µF
4× 1000 µF
2× 470 µF
4× 470 µF
4× 1000 µF
2× 470 µF
4× 470 µF
2× 470 µF
2× 470 µF
2× 470 µF
2× 470 µF
4× 470 µF
2× 470 µF
2× 470 µF
2× 470 µF
2× 470 µF
33
22
24
18
37
19
33
20
48
38
26
41
32
26
38
34
39
35
50
38
57
42
5
12
5
0.6
0.8
1.0
12
5
12
5
12
5
1.2
2.0
12
(1) 50% load step at 2.5 A/µs.
(2) The combined equivalent ESR of all non-ceramic output capacitance must be ≤ 5 mΩ.
版权 © 2017–2019, Texas Instruments Incorporated
19
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.5 Setting the Output Voltage via PMBus
The output voltage of the TPSM846C23 is designed to be set via the PMBus using the VOUT_COMMAND (21h).
The output voltage is also dependant on the value of VOUT_SCALE_LOOP (29h) and the presence of a resistor,
RSET, from the FB pin (pin 7) to AGND. 表 5 illustrates the possible combinations. The module is programmed at
the factory for a VOUT_SCALE_LOOP value of 1 and a VOUT_COMMAND value of 256 (100h), which produces
an output voltage of 0.500 V.
表 5. VOUT_SCALE_LOOP and Output Voltage Range
OUTPUT VOLTAGE
RANGE (V)
VOUT_COMMAND
DATA VALID RANGE
VOUT_SCALE_LOOP
RSET VALUE
MIN
0.35
0.7
MAX
MIN (Hex) MAX (Hex)
179 (0B3h) 845 (34Dh)
358 (166h) 1024 (400h)
1
Not required
1.65
2(1)
0.5
10 kΩ, 1%
(1) The TPSM846C23 is designed to be operated with output voltages no higher than 2 V.
The output voltage is set by writing a value with the PMBus VOUT_COMMAND (21h). The VOUT_COMMAND
value can be calculated using 公式 1, (round to the nearest integer value), and then converted to a 16 bit
hexadecimal value. Using the Write Word protocol, write the hexadecimal word to the device using the
VOUT_COMMAND.
VOUT_COMMAND value = (desired VOUT × 512)
(1)
The value written using the VOUT_COMMAND is held in RAM and remains until it is re-written with a new value
or if power is removed. If power is removed and then reapplied, the output voltage and the value in the
VOUT_COMMAND register are restored to the value stored in the non-volatile memory of the device. To save
the VOUT_COMMAND value to non-volatile memory and make it the new default value, issue the
STORE_DEFAULT_ALL command.
For output voltages ≤ 1.65 V, RSET is not required. If an output voltage greater than 1.65 V is required, a 10-kΩ
RSET resistor must be populated. See 图 15 for the proper connection of RSET
.
This device is electrically and thermally characterized up to a maximum of 2-V output, and a maximum of 70-W
output power. Operation at higher output voltages may be possible, provided the maximum output power and
other internal parameters are not exceeded. Higher output voltages require derating to the output current and
may require higher switching frequencies. Consult the TI factory applications engineers for support.
TPSM846C23
6
DIFFO
R
COMP
C
COMP
7
FB
R
SET
10
AGND
Copyright © 2017, Texas Instruments Incorporated
图 15. RSET Resistor
7.3.6 Setting the Output Voltage Without PMBus
It is possible to operate the module without the need for a PMBus interface. To set the output voltage, the
adjustment method requires a resistor, RSET, connected between the FB pin and AGND as shown in 图 15. To
calculate the correct RSET value, the default value of VOUT_COMMAND must be known. The factory default
value of VOUT_COMMAND is 256 (100h), which produces an output voltage of 0.500 V if the RSET resistor is not
populated. 公式 2 can be used to calculate the RSET value for a given output voltage, VOUT. Additionally, the RSET
value can be selected from 表 6.
Do not set the output voltage higher than 2 V.
20
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
10
RSET
=
kW
(
)
≈ V
ì512
’
(
)
OUT
-1
∆
«
÷
◊
256
(2)
表 6. Standard RSET Resistor Values
VOUT (V)
0.5
RSET (kΩ)
open
49.9
VOUT (V)
1.3
RSET (kΩ)
6.19
0.6
1.4
5.49
0.7
24.9
1.5
4.99
0.8
16.5
1.6
4.53
0.9
12.4
1.7
4.12
1
10
1.8
3.83
1.1
8.25
1.9
3.57
1.2
7.15
2
3.32
7.3.7 Differential Remote Sense
The TPSM846C23 device implements a differential remote-sense amplifier to provide excellent load regulation by
cancelling IR-drop in high-current applications. The VS+ and VS– pins must be Kelvin-connected to the output
capacitor bank directly at the load and routed back to the device as a tightly coupled differential pair. Ensure that
these traces are isolated from fast switching signals and high current paths on the final PCB layout, as these can
add differential-mode noise.
7.3.8 Voltage Reference
A reference digital-to-analog converter (DAC) with a 350-mV to 1650-mV range and 2–9-V (1.953 mV) resolution
connects to the noninverting input of the error amplifier. The tight tolerance on the reference voltage allows the
user to design power supply with very-high DC accuracy.
7.3.9 Switching Frequency and Synchronization
7.3.9.1 Setting the Switching Frequency
The TPSM846C23 is set to a default switching frequency of 500 kHz. To operate the TPSM846C23 at the default
switching frequency, connect the RT_SEL pin (pin 14) to AGND, and leave the RT pin (pin 13) open. To change
the switching frequency, leave the RT_SEL pin open and connect a resistor from the RT pin (RRT) to AGND. Use
公式 3 to calculate the RRT resistor value.
18290 + 120 ì V
(
)
kW
IN
RRT
=
(
)
fSW kHZ
(3)
The TPSM846C23 devices are designed to operate from 300 kHz to 1 MHz.
7.3.9.2 Synchronization
The TPSM846C23 device can synchronize to an external clock that is ±20% of the free-running frequency set by
RRT. It is required that the external clock waveform is a square wave with a duty cycle of 50%.
7.3.9.2.1 Stand-Alone Device
The SYNC pin is factory-configured as an input pin. When power is applied, if no external clocking signal is
present on the SYNC pin, the device operates at the switching frequency set by the internal or an external timing
resistor. If an external clock signal that meets the specification of the Synchronization section of Switching
Characteristics is applied to the SYNC pin, the device synchronizes to the leading edge of the applied waveform.
The rising edge of the PH node lags the rising edge of the clocking waveform by approximately 500 ns. The
external clock must be a 50% duty-cycle square wave. The external-clock frequency must be with ±20% of the
free-running frequency set by the RRT resistor. It is permissible for the SYNC signal to become active after the
module has powered up. If this is done, there is a small disturbance in the output voltage while the module locks
to the SYNC clock. If the SYNC signal is lost during operation, the module quickly detects the loss and reverts to
switching at the frequency set by the RRT resistor. A disturbance occurs in the output voltage upon loss of SYNC.
版权 © 2017–2019, Texas Instruments Incorporated
21
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.9.2.2 Paralleled Devices
When two TPSM846C23 devices are paralleled, the SYNC pins of the master and the slave must be supplied
with a 50% duty-cycle clock signal at the desired switching frequency. The master device locks to the rising edge
of the clock; the slave locks to the falling edge. The 50% duty cycle requirement insures the modules operate
180° out of phase to minimize ripple. Both the master and slave module must have an RRT resistor present
whose value sets a switching frequency within ±20% of the SYNC clock frequency. See Parallel Application for
more information when paralleling devices.
7.3.10 Input Undervoltage Lockout (UVLO)
The TPSM846C23 device provides flexible user adjustment of the undervoltage lockout (UVLO) threshold and
hysteresis. The minimum VIN voltage required for power conversion is set by the stored VIN_ON (35h) value. The
factory default value is 4.5 V. The turnon value can be set from 4.25 V to 7.75 V in 250-mV steps. The turnoff
threshold voltage is stored in the VIN_OFF (36h) value. The factory default is 4 V. The value can be set from 4 V
to 7.5 V in 250-mV steps. For more information, see 表 2.
7.3.11 Turnon and Turnoff Delay and Sequencing
The TPSM846C23 device provides many sequencing options. Using the ON_OFF_CONFIG command, the
device can be configured to start up whenever the input voltage is above the UVLO threshold, to require an
additional signal on the CNTL pin, to receive an update to the OPERATION command through the PMBus
interface, or
a combination of these configurations. When the gating signal as specified by the
ON_OFF_CONFIG command is asserted, a programmable turnon delay can be set with the TON_DELAY
command to delay the start of power conversion. Similarly, a programmable turnoff delay can be set with the
TOFF_DELAY command to delay the stop of power delivery once the gating signal is deasserted. Delay times
are specified in milliseconds (ms), from 0 to 100 ms.
The TPSM846C23, as supplied by the factory, is programmed for zero TOFF_DELAY and 3-ms TOFF_FALL
parameters. The power stage discharges the output capacitors when CNTL is de-asserted or under a fault
condition. Note that the power stage sinks current as it ramps the output voltage to zero. Once the output voltage
is ramped to approximately 200 mV, the power stage will tri-state. This default behavior is set by the
ON_OFF_CONFIG command register. The user can set the cpa bit if a controlled soft-stop discharge of the
output capacitors is not desired. If this bit is set, the power stage is immediately tri-stated when CNTL is de-
asserted or when a fault occurs. The load on the regulator output provides the only means of discharging the
output capacitors.
图 16 shows control of the start-up and shutdown operations of the device when the device is configured to
respond to both the CNTL signal and the OPERATION command. The device can also be configured to
independently use either the CNTL signal or the OPERATION command or to convert power when a sufficient
input voltage is available.
TON_DELAY
TOFF_DELAY
TON_RISE
TOFF_FALL
VIN
OFF
ON
OFF
OPERATION[7]
CNTL
V
OUT
Time
图 16. Turnon Controlled by Both Operation(1) and Control
(1)
(1) Bit 7 of OPERATION is used to control power conversion.
22
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.12 Soft-Start Time and TON_RISE Command
To control the inrush current required to charge the output capacitor bank during start up, the TPSM846C23
device implements a soft-start time. When the device is enabled, the feedback reference voltage, VREF, ramps
from 0 V to the final level at a slew rate defined by the TON_RISE command. The specified rise times are
defined by the slew rate required to ramp the reference voltage from 0 V to the final value at each given rise
time.
The TPSM846C23 devices support several soft-start times from 1 ms to 100 ms, which are selected by the
TON_RISE command.
7.3.13 Soft-Stop Time and TOFF_FALL Command
The TPSM846C23 device implements the TOFF_FALL command to define the time for the output voltage to drop
from regulation to 0 as shown in 图 16. Negative current in the TPSM846C23 device can occur during the
TOFF_FALL time to discharge the output voltage. The setting of the TOFF_FALL command to 0 ms causes the
TPSM846C23 to bring the output voltage down to 0 as quickly as possible, which results in an effective
TOFF_FALL time of 1 ms (fastest time supported). The time is factory-set to 3 ms. This feature can be disabled
in the ON_OFF_CONFIG command for the turnoff controlled by the CNTL pin or bit 6 of the OPERATION
register if the regulator is turned off by the OPERATION command. If the regulator is turned off by the
OPERATION command, both the high-side and low-side FET drivers are turned off immediately, and the output
voltage is discharged only by the load.
7.3.14 Prebiased Output Start-Up
The TPSM846C23 device prevents current from being discharged from the output during start-up when a
prebiased output condition exists. If the output is prebiased, no PH pulses occur until the internal soft-start
voltage rises above the error-amplifier input voltage (FB pin). As soon as the soft-start voltage exceeds the error-
amplifier input, and PH pulses start. The device limits synchronous rectification after each PH pulse with a
narrow on-time. The on-time of the low-side MOSFET slowly increases on a cycle-by-cycle basis until 128 pulses
have been generated and the synchronous rectifier runs fully complementary to the high-side MOSFET. This
approach prevents the sinking of current from a prebiased output and ensures the output-voltage start-up and
ramp-to-regulation sequences are smooth and monotonic.
If the prebias voltage is close to, or exceeds, the VOUT setpoint voltage, the mandatory 128 switching cycles, as
previously described, may induce a non-monotonic dip in the output voltage. The output voltage quickly recovers
to the setpoint value once the 128 cycle interval is completed.
The output overvoltage warn is tripped when the FB pin is prebiased to higher than 5% above the regulation
level. These devices respond to a prebiased output overvoltage condition immediately upon VIN powered up and
when the BP6 regulator voltage is above the BP6 UVLO of 3.73 V (typical).
版权 © 2017–2019, Texas Instruments Incorporated
23
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.15 Power Good (PGOOD) Indicator
PGOOD is an open-drain digital active-high output signal that indicates if the output voltage is within regulation
limits. A pullup resistor value between 10 kΩ and 100 kΩ to a voltage source of 5.5 V or less is required. The
PGOOD window is defined by OV warning limit and UV warning limit in PCT_OV_UV_WRN_FLT_LIMITS
(MFR_SPECIFIC_07) (D7h), which can be programmed through the PMBus interface, as shown in 图 17. The
PGOOD pin pulls low upon any fault condition by default. See 表 7 for the possible sources to pull down the
PGOOD pin.
The PGOOD signal can be connected to the CNTL pin of another device to provide additional controlled turnon
and turnoff sequencing.
The OVW or PGOOD signal trips when the FB pin is prebiased to higher than 5% above the regulation level.
This level of prebias is unusual, and it is beneficial to flag a warning in this situation.
OV Fault
OV Warn
OVW
Hysteresis
VOUT_COMMAND
UV Warn
UVW
Hysteresis
FB
UV Fault
PGOOD
(non-latch)
Time
图 17. PGOOD Threshold and Hysteresis
注
The presence of a pullup voltage at the PGOOD pin high before the TPSM846C23 device
receives input power causes the PGOOD pin to be pulled above a logic-low-voltage level
due to the limited pulldown capability in an un-powered condition. If this is not desired,
increase the pullup resistance or reduce the external pullup-supply voltage.
7.3.16 Linear Regulators BP3 and BP6
The TPSM846C23 device has two onboard linear regulators to provide suitable power for the internal circuitry of
the device. Bypass the BP3 and BP6 pins externally for the converter to function properly. The BP3 pin requires
a minimum of 2.2 µF of capacitance connected to BP_RTN. The BP6 pin requires a minimum 4.7µF of
capacitance connected to BP6_RTN.
The use of the internal regulators to power other circuits is not recommended because the loads placed on the
regulators might adversely affect operation of the controller.
注
Place bypass capacitors as close as possible to the device pins, with a minimum return
loop back to ground and the return loop should be kept away from fast switching voltage
and main current path. For more information, see the Layout section. Poor bypassing can
degrade the performance of the regulator.
24
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.17 VREF_TRIM
The nominal output voltage of the converter can also be adjusted by changing the feedback voltage, VFB, using
the VREF_TRIM command. The adjustment range is from –64 × 1.953 mV to +63 × 1.953 mV from the nominal
FB voltage. This command adjusts the final output voltage of the converter to a high degree of accuracy without
relying on high-precision feedback resistors. The resolution of the adjustment is approximately 1.953 mV. The
trim value can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
7.3.18 MARGIN
The TPSM846C23 device also allows simple testing of the output-voltage margin, by applying a either a positive
or negative offset to the feedback voltage. The STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h) and
STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h) commands control the size of the applied high offset
or low offset (respectively). The adjustment range is from –64 × 1.953 mV to 31 × 1.953 mV from the nominal
feedback voltage. The OPERATION command toggles the converter between the following three states:
•
•
•
Margin none (no output margining)
Margin high
Margin low
Use 公式 4 to calculate the resulted internal-reference voltage.
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4])] × 1.953 mV
(4)
The total adjustable range of the output voltage, including VOUT_COMMAND, MARGIN, and VREF_TRIM, is
limited by the internal reference DAC range of 0.35 V – 1.65 V. For more information on the implementation, see
the Supported PMBus Commands section.
注
•
•
The VOUT_SCALE_LOOP is limited to only 2 possible options: 1 (default, no bottom
resistor required for the divider), or 0.5 (RSET= 10 kΩ).
When VOUT_SCALE_LOOP is set to 1 (default), no bottom RSET resistor is required.
The reference voltage is equal to the output voltage, which allows tighter system DC
accuracy by removing the resistor divider tolerance.
•
If the divider ratio, RSET / (RSET + R1), does not match the programed
VOUT_SCALE_LOOP, the user should be aware that the actual output voltage
determined by 公式 2 and 公式 4 may not match the programed VOUT_COMMAND.
版权 © 2017–2019, Texas Instruments Incorporated
25
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.3.19 Parallel Application
Two TPSM846C23 devices can be paralleled for increased output current up to 70 A. Multiple connections must
be made between the paralleled devices and the component selection is slightly different than for a stand-alone
TPSM846C23 device. 图 18 shows a typical schematic for two TPSM846C23 devices in parallel. Parallel
operation can be evaluated using the TPSM846C23DEVM-807 evaluation board.
VIN
VIN
BP3
VS+
VOUT
VOUT
PGND
PGND
VS-
DATA
TPSM846C23
MASTER
CLK
PMBUS
INTERFACE
ALERT
CNTL
DIFFO
FB
VSHARE
ISHARE
SYNC
ADDR1
ADDR0
RT_SEL
PGND AGND
VIN
BP3
VS+
VOUT
PGND
PGND
VS-
DATA
TPSM846C23
SLAVE
CLK
ALERT
CNTL
DIFFO
FB
VSHARE
ISHARE
SYNC
ADDR1
ADDR0
RT_SEL
500 kHz CLOCK
50% Duty
PGND AGND
Copyright © 2018, Texas Instruments Incorporated
图 18. TPSM846C23 Parallel
26
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.20 Parallel Operation
To operate two TPSM846C23 devices in parallel, one of the devices must act as the master and the other act as
a slave. To configure one of the devices as the slave device, connect a 1-kΩ resistor between the device FB pin
and BP3 pin. Additionally, the SYNC, VSHARE, and ISHARE pins of both devices must be connected as shown
in 图 18. Both devices share the same VSHARE voltage. Essentially, the internal COMP voltage is shared
between the two devices by connecting the VSHARE pin of each device together. By connecting the ISHARE pin
of each device, the sensed current in each phase is compared, then the error current is added into the internal
COMP. The resulting voltage is compared with the PWM ramp to generate the PWM pulse. This current sharing
loop maintains the current balance between devices.
In addition to sharing the same internal COMP voltage, the VSHARE pin is also used for fault communication
between the loop master and slave devices. The VSHARE pin voltage is pulled low if any device encounters any
fault conditions so that the other device sharing VSHARE pin is alerted and stops switching accordingly.
The master and slave devices must be set to two different PMBus addresses. The telemetry data from the
master and slave devices must be retrieved seperately.
When configured for parallel operation, the SYNC pins of the master and the slave must be supplied with a 50%
duty cycle clock signal at the desired switching frequency. The master device locks to the rising edge of the
clock; the slave locks to the falling edge. The 50% duty cycle requirement insures the modules operate 180° out
of phase to minimize ripple. Both the master and slave module must have an RRT resistor present whose value
sets a switching frequency within ±20% of the SYNC clock frequency.
An optional high-frequency capacitor can be added between the VSHARE pin and ground in noisy systems, but
the capacitance must not exceed 10 pF.
If operating conditions result in an on-time pulse width of ≤ 150 ns, jitter may be observed on the master and
slave PH pins. The addition of a 10-kΩ resistor in series with the ISHARE connection between the devices helps
to reduce, but may not eliminate the jitter.
To evaluate the TPSM846C23 in parallel configuration, an evaluation board is available. Also refer to the
Operating TPSM846C23 in Parallel user's guide for operation instructions and layout recommendations.
7.3.21 Telemetry
7.3.21.1 Output Current Telemetry
The TPSM846C23 device senses the average output current using an internal sense FET. A sense FET
conducts a scaled-down version of the power-stage current. Sampling this current in the middle of the low-side
drive signal determines the average output current. This architecture achieves excellent current monitoring and
better overcurrent threshold accuracy than the current sensing of a DC-resistance (DCR) inductor with minimal
temperature variation and no dependence on power loss in a higher DCR inductor. Use the IOUT_CAL_OFFSET
command to improve current sensing and overcurrent accuracy by removing systematic errors related to board
layout after assembly. The device continually digitizes the sensed output current, and averages it to reduce
measurement noise. The device then places the current value in the read-only register, READ_IOUT, which
enables output-current telemetry.
This device cannot report negative (sinking) current. Any negative current is reported as zero amps.
7.3.21.2 Output Voltage Telemetry
The output voltage is sensed at the remote sense amplifier output pin, and the device continually digitizes the
sensed output voltage, and averages it to reduce measurement noise. The device then stores the average value
in the read-only register, READ_VOUT, which enables output voltage telemetry. Refer to OPTIONS
(MFR_SPECIFIC_21) for details of programming output voltage telemetry signal range, averaging and update
rate.
7.3.21.3 Junction Temperature Telemetry
The TPSM846C23 device also provides temperature telemetry and programmable internal overtemperature fault
or warning thresholds using measurements from an internal temperature sensor. The temperature-sensor circuit
applies two bias currents to an internal diode-connected NPN transistor and measures ΔVBE to infer the junction
temperature of the sensor. The device then digitizes the result and compares it to the user-configured
overtemperature fault and warning thresholds. When an internal overtemperature fault (OTF) is detected, power
版权 © 2017–2019, Texas Instruments Incorporated
27
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
conversion stops until the sensed temperature decreases by 20°C. The READ_TEMPERATURE_1 (8Dh)
register is continually updated with the digitized temperature measurement, enabling temperature telemetry. The
OT_FAULT_LIMIT (4Fh) and OT_WARN_LIMIT (51h) commands set the overtemperature fault and warning
thresholds through the PMBus interface. When an overtemperature event is detected, the device sets the
appropriate flags in STATUS_TEMPERATURE (7Dh) command and triggers the SMBALERT signal if it is not
masked.
7.3.22 Overtemperature Protection
An internal temperature sensor based off the bandgap reference protects the TPSM846C23 device from thermal
runaway. The internal thermal shutdown threshold, TSD, is fixed at 145°C (typical), which is different from the
user programmable OT_FAULT_LIMIT. When the device senses a temperature above TSD, an otf_bg bit in the
STATUS_MFR_SPECIFIC command is flagged, and power conversion stops until the sensed junction
temperature decreases by the amount of the thermal shutdown hysteresis, THYST (20°C typical). The SMBALERT
signal is triggered if the signal is not masked.
The device response to an OT_FAULT_LIMIT event can be set to Latch-off, Restart and Ignore in
OT_FAULT_RESPONSE. The default response to an over temperature fault is to shut down and then restart.
Fixed band gap-detected overtemperature (OT) faults are never ignored. The band gap OT faults always
respond in a shutdown and attempted restart once the device cools. 表 7 summarizes the fault-response
scheme.
7.3.23 Overcurrent Protection
Both low-side overcurrent and high-side short-circuit protection are implemented. The low-side overcurrent fault
and warning thresholds are programmed via PMBus. The low-side MOSFET average current is compared to the
set fault threshold. High-side pulses are terminated on a cycle-by-cycle basis whenever the current through the
high-side MOSFET exceeds the fixed short circuit threshold.
When either a low-side overcurrent or high-side short-circuit threshold is exceeded in a switching cycle, a counter
is incremented. If no overcurrent condition is detected in a switching cycle, the counter is decremented. When
the counter counts to three, an overcurrent fault condition is declared, and the output shuts down and restarts
after 7 × TON_RISE time or is latched off until re-enabled, or ignored depending on the fault response setting.
The behavior of the power stage during the various fault scenarios is shown in 表 7.
7.3.24 Output Overvoltage and Undervoltage Protection
The TPSM846C23 device includes both output overvoltage protection and output undervoltage protection
capability by comparing the FB pin voltage to internal selectable pre-set voltages, as defined by the
PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h) command.
If the FB pin voltage rises above the output overvoltage-protection threshold, the device terminates normal
switching and turns on the low-side MOSFET to discharge the output capacitor and prevent further increases in
the output voltage. The device also declares an OV fault, flagging the appropriate status registers, triggering
SMBALERT if it is not masked. Then the device enters continuous-restart-hiccup mode or latches off according
to the VOUT_OV_FAULT_RESPONSE command. The TPSM846C23 device responds to the output overvoltage
condition immediately upon VIN power up and BP6 regulator voltage above its own UVLO of 3.73 V (typical).
The VOUT_OV_FAULT_RESPONSE can also be set to ignore the output overvoltage fault and continue without
interruption. Under this configuration, the control loop continues to respond and adjust PWM duty cycle to keep
output voltage within regulation.
If the FB pin voltage falls below the undervoltage protection level after soft start has completed, the device
terminates normal switching and forces both the high-side and low-side MOSFETs off and awaits an external
reset or begins
a
hiccup time-out delay prior to restart, depending on the value of the
VOUT_UV_FAULT_RESPONSE command. The device also declares a UV fault by flagging the appropriate
status registers and triggering SMBALERT if it is not masked. The VOUT_UV_FAULT_RESPONSE can also be
set to ignore the output undervoltage fault and continue without interruption for debug purpose.
表 7 summarizes the fault-response scheme.
28
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.3.25 Fault Protection Responses
表 7 summarizes the various fault protections and associated responses.
注
When configured as parallel operation, the best practice is to have the fault response of the loop master and slave device set as
the same to avoid unexpected behavior.
表 7. Fault Protection Summary
FAULT
RESPONSE
SETTING
ACTIVE DURING
TON_RISE
SOURCE OF
SMBALERT
SMBALERT
MASKABLE
FAULT or WARN
PROGRAMMING
FET BEHAVIOR
PGOOD
Latch-off
Restart
Ignore
Both FETs off
Both FETs off, then restart after cooling down(1)
Low
Low
High
Internal Overtemperature
Fault
OT_FAULT_LIMIT (4Fh)
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
FETs still controlled by PWM
Latch-off or restart
on fault
Low
Internal Overtemperature
Warn
OT_WARN_LIMIT (51h)
Threshold fixed internally
PWM maintains control of FETs
Ignore fault
Latch-off
Restart
High
Both FETs off
Bandgap Overtemperature
Fault
Both FETs off, then restart after cooling down(1)
Both FETs off, then restart after cooling down(2)
3 PWM counts, then both FETs off
Low
Ignore
Latch-off
Low
Low
High
Low
IOUT_OC_FAULT_LIMIT
(46h)
3 PWM counts, then both FETs off, restart after 7×
TON_RISE
Low-Side OC Fault
Low-Side OC Warn
High-Side OC Fault
Restart
Ignore
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
FETs still controlled by PWM
PWM maintains control of FETs
3 PWM counts, then both FETs off
Latch-off or Restart
on Fault
IOUT_OC_WARN_LIMIT
Ignore Fault
Latch-off
High
Low
3 PWM counts, then both FETs off, restart after 7 ×
TON_RISE
Restart
Ignore
Low
Cycle-by-cycle peak current limit
High
High-side FET OFF, low-side FET response configured
byOV_RESP_SEL Bit: latch ON or turn on till FB drops
below 0.2 V
Latch-off
PCT_OV_UV_WRN_FLT_LIMI
TS (MFR_SPECIFIC_07)
(D7h)
VOUT OV Fault
High-side FET OFF, low-side FET response configured
byOV_RESP_SEL Bit: latch ON or turn on till FB drops
below 0.2 V. Then restart after 7 × TON_RISE
Yes
Yes
Yes
Low
Restart
Ignore
PWM maintains control of FETs
(1) When the overtemperature fault is tripped, the device shuts off both FETs and restarts until the sensed temperature decreases 20°C from the tripping threshold.
(2) The bandgap-overtemperature fault cannot be ignored, the device shuts off both FETs and restarts after the internal die temperature drops below the threshold.
版权 © 2017–2019, Texas Instruments Incorporated
29
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
表 7. Fault Protection Summary (接下页)
FAULT
RESPONSE
SETTING
ACTIVE DURING
TON_RISE
SOURCE OF
SMBALERT
SMBALERT
MASKABLE
FAULT or WARN
PROGRAMMING
FET BEHAVIOR
PGOOD
Latch-off or restart
on fault
PCT_OV_UV_WRN_FLT_LIMI
TS (MFR_SPECIFIC_07)
(D7h)
VOUT OV Warn
PWM maintains control of FETs
Yes
No
Yes
Yes
Yes
Yes
Yes
Yes
Low
Ignore Fault
Latch-off
Restart
Both FETs off
PCT_OV_UV_WRN_FLT_LIMI
TS (MFR_SPECIFIC_07)
(D7h)
VOUT UV Fault
VOUT UV Warn
Both FETs off, then restart after 7 × TON_RISE
PWM maintains control of FETs
Low
Low
Ignore
Latch-off or restart
on fault
PCT_OV_UV_WRN_FLT_LIMI
TS (MFR_SPECIFIC_07)
(D7h)
PWM maintains control of FETs
No
Ignore fault
Latch-off
Restart
Both FETs off
Both FETs off, then restart after 7 × TON_RISE
PWM maintains control of FETs
Both FETs off
TON Max Fault
VIN UVLO
TON_MAX_FAULT_LIMIT
VIN_ON, VIN_OFF
No
Yes
Yes
Yes
Yes
Low
Low
Ignore
Shutdown
Yes
30
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.4 Device Functional Modes
7.4.1 Continuous Conduction Mode
The TPSM846C23 device operates in continuous conduction mode (CCM) at a fixed frequency, regardless of the
output current. For the first 128 switching cycles, the low-side MOSFET on-time is slowly increased to prevent
excessive current sinking in the event the device is started with a prebiased output. Following the first 128 clock
cycles, the low-side MOSFET and the high-side MOSFET on-times are fully complementary.
7.4.2 Operation With CNTL Signal Control
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to use
the CNTL pin to enable or disable regulation, regardless of the state of the OPERATION command. The CNTL
pin can be configured as either active high or active low (inverted) logic. The TPSM846C23 is factory-
programmed to use the CNTL pin only using active high logic.
7.4.3 Operation With OPERATION Control
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to use
the OPERATION command to enable or disable regulation, regardless of the state of the CNTL signal.
7.4.4 Operation With CNTL and OPERATION Control
According to the value in the ON_OFF_CONFIG register, the TPSM846C23 device can be commanded to
require both a signal on the CNTL pin, and the OPERATION command to enable or disable regulation.
7.5 Register Maps
This family of devices supports the following commands from the PMBus 1.3 specification.
Table 8. Legend for Register Access Type
Access Type
Read Type
R
Code
Description
r
Read
Write Type
W
w
Write
Other
E
superscript E
r/wE
Bit is backed up with nonvolatile EEPROM
7.5.1 OPERATION (01h)
The OPERATION command turns the device output on or off in conjunction with input from the CNTL signal. It is
also used to set the output voltage to the upper or lower margin voltages. The unit stays in the commanded
operating mode until a subsequent OPERATION command or a change in the state of the CNTL pin instructs the
device to change to another mode.
For PWM loop slave device, which is recognized during power-up calibration, this command cannot be accessed.
Any writes to this command will be ignored. An attempt to read or write this command will result in a NACK’d
command, the reporting of an IVC fault, and triggering of SMB_ALERT.
COMMAND
OPERATION
Format
Unsigned binary
Bit Position
Access
7
r/w
ON
0
6
r/w
OFF
0
5
4
3
2
1
r
0
r
r/w
r/w
r/w
r/w
Function
MARGIN
X
X
X
X
Default Value
0
0
0
0
Copyright © 2017–2019, Texas Instruments Incorporated
31
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.1.1 On Bit
This bit is an enable command to the converter.
•
•
0: output switching is disabled. Both drivers placed in an off or low state.
1: output switching is enabled if the input voltage is above undervoltage lockout, OPERATION is configured
as a gating signal in ON_OFF_CONFIG, and no fault conditions exist.
7.5.1.2 Off Bit
This bit sets the turnoff behavior when commanding the unit to turn off through OPERATION[7] ( the On bit).
•
0: Immediately turn off the output (not honoring the programmed turnoff delay (TOFF_DELAY) and ramp
down (TOFF_FALL)) when commanded off through OPERATION[7] ( the On bit).
•
1: Use the programmed turnoff delay (TOFF_DELAY) and ramp down (TOFF_FALL) when commanded off
through OPERATION[7] (also called soft off).
NOTE
The device ignores any values written to read-only bits. Additionally, both the on and off
bits being set at the same time is not allowed and considered invalid data per section 12.1
of the PMBus Specification Part II; any attempt to do so causes the device to set the cml
bit in the STATUS_BYTE and the ivd bit in the STATUS_CML registers, and triggers
SMBALERT signal.
7.5.1.3 Margin Bit
If Margin Low is enabled, load the value from the STEP_VREF_MARGIN_LOW command. If Margin High is
enabled, load the value from the STEP_VREF_MARGIN_HIGH command.
•
•
0001: Margin Off. Output voltage source is VOUT_COMMAND. OV and UV faults are ignored.
0000, 0010, 0011: Margin Off. Output voltage source is VOUT_COMMAND. OV/UV faults behave normally as
programmed in their respective fault response registers.
•
•
•
•
•
0101: Margin Low (Ignore Fault). Output voltage defined directly below.
0110: Margin Low (Act On Fault). Output voltage defined directly below.
1001: Margin High (Ignore Fault). Output voltage defined directly below.
1010: Margin High (Act On Fault). Output voltage defined directly below.
11XX, 0100, 0111, 1000, 1011: Shall be invalid and shall declare an Invalid Data Fault (Part II Rev 1.3
Section 10.9.3, Page 52)
VOUT_MARGIN_LOW data shall be equal to:
VOUT_COMMAND + (VREF_TRIM – STEP_VREF_MARGIN_LOW) / VOUT_SCALE_LOOP
VOUT_MARGIN_HIGH data shall be equal to:
VOUT_COMMAND + (VREF_TRIM + STEP_VREF_MARGIN_HIGH) / VOUT_SCALE_LOOP
For the Margin Low, Ignore Fault configuration (essentially [5:2] = 4’b0101), any incoming UV faults shall trigger
the normal UVF status, and trigger SMB_ALERT (albeit the state machine response will be to ignore and not
respond). If the desired response is to have the device to not trigger SMB_ALERT for UVF events when
margining, they must set the UVF SMBALERT_MASK bit. For the Margin High, Ignore Fault configuration
(essentially [5:2] = 4’b1001), any incoming OV faults shall trigger the normal OVF status, and trigger
SMB_ALERT (albeit the state machine response will be to ignore and not respond). If the desired response is to
have the device to not trigger SMB_ALERT for UVF events when margining, they must set the UVF
SMBALERT_MASK bit. OVF and UVF can also be ignored when VOUT_COMMAND is the VOUT source by
programming [5:2] to a value of 4’b0001. OVF and UVF events will still set status and trigger SMB_ALERT.
7.5.2 ON_OFF_CONFIG (02h)
The ON_OFF_CONFIG command configures the combination of CNTL pin input and serial bus commands
needed to turn the unit on and off. The contents of this register can be stored to nonvolatile memory using the
STORE_DEFAULT_ALL (11h) command. The default value in ON_OFF_CONFIG register is to have the device
power up by CNTL pin only with the active high polarity and use the programmed turnoff delay (TOFF_DELAY)
and ramp down (TOFF_FALL) for powering off the converter.
32
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
For PWM loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
COMMAND
ON_OFF_CONFIG
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r/wE
pu
1
3
2
r/wE
cpr
1
1
r/wE
pol
1
0
r/wE
cpa
0
r/wE
cmd
0
Function
X
X
X
X
X
X
Default Value
7.5.2.1 pu Bit
The pu bit sets the default to either operate any time power is present or for power conversion to be controlled by
CNTL pin and PMBus OPERATION command. This bit is used in conjunction with the cpr, cmd, and on bits to
determine start up.
BIT VALUE
ACTION
0
Device powers up any time power is present regardless of state of the CNTL pin.
Device does not power up until commanded by the CNTL pin and/or OPERATION
command as programmed in bits [3:0] of the ON_OFF_CONFIG register.
1
7.5.2.2 cmd Bit
The cmd bit controls how the device responds to the OPERATION command. This bit is used in conjunction with
the cpr, pu, and on bits to determine start up.
BIT VALUE
ACTION
0
1
Device ignores the “on” bit in the OPERATION command.
Device responds to the “on” bit in the OPERATION command.
7.5.2.3 cpr Bit
The cpr bit sets the CNTL pin response. This bit is used in conjunction with the cmd, pu, and on bits to determine
start up.
BIT VALUE
ACTION
Device ignores the CNTL pin. Power conversion is controlled only by the OPERATION
command.
0
1
Device requires the CNTL pin to be asserted to start the unit.
7.5.2.4 pol Bit
The pol bit controls the polarity of the CNTL pin. For a change to become effective, the contents of the
ON_OFF_CONFIG register must be stored to nonvolatile memory using the STORE_DEFAULT_ALL command
and the device power cycled. Simply writing a new value to this bit does not change the polarity of the CNTL pin.
BIT VALUE
ACTION
0
1
CNTL pin is active low.
CNTL pin is active high.
7.5.2.5 cpa Bit
The cpa bit sets the CNTL pin action when turning the converter off.
BIT VALUE
ACTION
0
Use the programmed turnoff delay (TOFF_DELAY) and ramp down (TOFF_FALL).
Immediately turn off the output (not honoring the programmed turnoff delay
(TOFF_DELAY) and ramp down (TOFF_FALL)).
1
Copyright © 2017–2019, Texas Instruments Incorporated
33
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.3 CLEAR_FAULTS (03h)
The CLEAR_FAULTS command is used to clear any fault bits that have been set. This command clears all bits
in all status registers simultaneously. At the same time, the device negates (clears, releases) its SMBALERT
signal output if the device is asserting the SMBALERT signal. The CLEAR_FAULTS command does not cause a
unit that has latched off for a fault condition to restart. If the fault is still present when the bit is cleared, the fault
bit is immediately reset and the host notified by the usual means.
NOTE
•
•
To get a reliable clear fault result, the clear_fault command should be issued (8 ×
TON_RISE + TON_DELAY) after the switcher shuts down.
In the case of OV fault with a latch off response, the LS FET latches on when the fault
is detected. If the OV_RESP_SEL Bit in (F0h) MFR_SPECIFIC_32 is set to 1, then the
LS FET releases when the FB pin voltage falls below 0.2 V. Otherwise, it remains on
until the CLEAR_FAULTS command is issued. The CLEAR FAULTS command causes
the LS FET to turn off.
•
CNTL pin toggling can also clear fault, but the logic low duration should be higher than
100 ns for the internal circuit to recognize.
7.5.4 WRITE_PROTECT (10h)
The WRITE_PROTECT command is used to control writing to the PMBus device. The intent of this command is
to provide protection against accidental changes. This command is not intended to provide protection against
deliberate or malicious changes to the device configuration or operation. All supported command parameters
may have their parameters read, regardless of the WRITE_PROTECT settings. Write protection also prevents
protected registers from being updated in the event of a RESTORE_DEFAULT_ALL. The contents of this register
can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
COMMAND
WRITE_PROTECT
Format
Unsigned binary
Bit Position
Access
7
r/wE
bit7
0
6
r/wE
bit6
0
5
r/wE
bit5
0
4
X
X
X
3
X
X
X
2
X
X
X
1
X
X
X
0
X
X
X
Function
Default Value
7.5.4.1 bit5
7.5.4.2 bit6
7.5.4.3 bit7
BIT VALUE
ACTION
0
Enable all writes as permitted in bit6 or bit7
Disable all writes except the WRITE_PROTECT, OPERATION, ON_OFF_CONFIG,
and VOUT_COMMAND. (bit6 and bit7 must be 0 to be valid data)
1
BIT VALUE
ACTION
0
Enable all writes as permitted in bit5 or bit7
Disable all writes except for the WRITE_PROTECT, and OPERATION commands. (bit5
and bit7 must be 0 to be valid data)
1
BIT VALUE
ACTION
0
Enable all writes as permitted in bit5 or bit6
Disable all writes except for the WRITE_PROTECT command. (bit5 and bit6 must be 0
to be valid data)
1
34
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
In any case, only one of the three bits may be set at any one time. Attempting to set more than one bit results in
an alert being generated and the cml bit is STATUS_WORD being set. An invalid setting of the
WRITE_PROTECT command results in no write protection.
Data Byte
ACTION
Value
1000 0000
0100 0000
Disables all WRITES except to the WRITE_PROTECT command.
Disables all WRITES except to the WRITE_PROTECT, and OPERATION commands.
Disables all WRITES except to the WRITE_PROTECT, OPERATION,
ON_OFF_CONFIG, and VOUT_COMMAND commands.
0010 0000
7.5.5 STORE_DEFAULT_ALL (11h)
The STORE_DEFAULT_ALL command stores all of the current storable register settings in the EEPROM
memory as the new defaults on power up.
It is permissible to use this command while the device is switching. Note however that the device continues to
switch but ignores all fault conditions until the internal store process has completed. Issuing
STORE_DEFAULT_ALL also causes the device to be unresponsive through PMBus for a period of
approximately 100 ms.
EEPROM programming faults cause the device to NACK and set the cml bit in the STATUS_BYTE and the mem
bit in the STATUS_CML registers.
7.5.6 RESTORE_DEFAULT_ALL (12h)
The RESTORE_DEFAULT_ALL command restores all of the storable register settings from EEPROM memory to
those registers which are unprotected according to current setting of WRITE_PROTECT. Issuing
RESTORE_DEFAULT_ALL also causes the device to be unresponsive through PMBus for a period of
approximately 100 ms.
NOTE
Do not use this command while the device is actively switching, this causes the device to
stop switching and the output voltage to fall during the restore event. Depending on
loading conditions, the output voltage could reach an undervoltage level and trigger an
undervoltage fault response if programmed to do so. The command can be used while the
device is switching, but this usage is not recommended as it results in a restart that could
disrupt power sequencing requirements in more complex systems. TI strongly
recommends stopping the device before issuing this command.
7.5.7 STORE_USER_ALL (15h)
The STORE_USER_ALL command stores all of the current storable register settings in the EEPROM memory as
the new defaults on power up.
It is permissible to use this command while the device is switching. Note however that the device continues to
switch but ignores all fault conditions until the internal store process has completed. Issuing STORE_USER_ALL
also causes the device to be unresponsive through PMBus for a period of approximately 100 ms.
EEPROM programming faults cause the device to NACK and set the cml bit in the STATUS_BYTE and the mem
bit in the STATUS_CML registers.
This command is equivalent to STORE_DEFAULT_ALL.
7.5.8 RESTORE_USER_ALL (16h)
The RESTORE_USER_ALL command restores all of the storable register settings from EEPROM memory to
those registers which are unprotected according to current setting of WRITE_PROTECT. Issuing
RESTORE_USER_ALL also causes the device to be unresponsive through PMBus for a period of approximately
100 ms.
This command is equivalent to RESTORE_DEFAULT_ALL.
Copyright © 2017–2019, Texas Instruments Incorporated
35
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
NOTE
Do not use this command while the device is actively switching, this causes the device to
stop switching and the output voltage to fall during the restore event. Depending on
loading conditions, the output voltage could reach an undervoltage level and trigger an
undervoltage fault response if programmed to do so. The command can be used while the
device is switching, but this usage is not recommended as it results in a restart that could
disrupt power sequencing requirements in more complex systems. TI strongly
recommends stopping the device before issuing this command.
7.5.9 CAPABILITY (19h)
The CAPABILITY command provides a way for a host system to determine some key capabilities of this PMBus
device.
COMMAND
CAPABILITY
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
3
r
2
r
1
r
0
r
r
ALRT
1
Function
PEC
1
SPD
Reserved
Default Value
0
1
0
0
0
0
The default values indicate that the device supports packet-error checking (PEC), a maximum bus speed of
400 kHz (SPD) and the SMBus alert-response protocol using SMBALERT.
7.5.10 SMBALERT_MASK (1Bh)
The SMBALERT_MASK command can be used to prevent a warning or fault condition from asserting the
SMBALERT signal.
NOTE
The command uses the SMBus Write Word command protocol to overlay a “mask byte”
with an associated/designated status register. It uses the SMBus Block Write/Block Read
protocol – with a block size = 1, to read the mask settings for any given status register. If
the host in the Block_Count field of the Block Write portion sends a block size unequal to
1 the device returns a NACK. The device always returns a Block Count of 1 upon reads of
SMBALERT_MASK.
The bits in the mask byte align with the bits in the corresponding status register. For example, if the
STATUS_TEMPERATURE command were sent with the mask byte 01000000b, then an Overtemperature
Warning condition would be blocked from asserting SMBALERT. Please refer to the PMBus v1.3 specification -
section 15.38 (SMBALERT_MASK Command) and the SMBus specification Block Write/Block Read protocol for
further details.
There are 19 maskable SMBALERT sources in the TPSM846C23. Each of these 19 status conditions has an
associated EEPROM backed mask bit. These sources are represnted and identified in the status register
command descriptions by a particular status bit denoted as having EEPROM backup (for example a bit access of
r/wE). Writes and reads to SMBALERT_MASK command code accepts only the following as valid STATUS_x
command codes:
•
•
•
•
•
•
•
STATUS_WORD
STATUS_VOUT
STATUS_IOUT
STATUS_INPUT
STATUS_TEMPERATURE
STATUS_CML
STATUS_MFR_SPECIFIC
36
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Attempting to write a mask byte for any STATUS_X command code other than this list causes the device to set
the cml bit in the STATUS_BYTE and the ivd bit in the STATUS_CML registers, and triggers SMBALERT.
Attempting to read a mask byte for any STATUS_x command code other than this list returns 00h for the mask
byte. Refer to these individual command descriptions for further details on their specific SMBALERT masking
capabilities.
There is one unique status bit in the that warrants special clarification: PGOOD_Z (STATUS_WORD[10]) is
maskable as an SMBALERT source through SMBALERT_MASK commands to STATUS_WORD. If the user
wants to write, or read, the mask bit for PGOOD_Z, the user must put 79h in the STATUS_x COMMAND_CODE
field of the SMBALERT_MASK command. PGOOD_Z SMBALERT_MASK bit default to 1.
7.5.11 VOUT_MODE (20h)
The PMBus specification dictates that the data word for the VOUT_MODE command is one byte that consists of
a 3-bit mode and 5-bit exponent parameter, as shown below. The 3-bit mode sets whether the device uses the
Linear or Direct modes for output voltage related commands. The 5-bit parameter sets the exponent value for the
linear data mode. The mode and exponent parameters are fixed and do not permit the user to change the
values.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
COMMAND
Bit Position
VOUT_MODE
7
r
6
5
r
4
r
3
r
2
1
r
0
r
Access
r
Mode
0
r
Exponent
1
Function
Default Value
0
0
1
0
1
1
7.5.11.1 Mode Bit
Value fixed at 000, linear mode.
7.5.11.2 Exponent Bit
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent to 1.953 mV/count).
7.5.12 VOUT_COMMAND (21h)
The VOUT_COMMAND command sets the output voltage in volts. The contents of this register can be stored to
nonvolatile memory using the STORE_DEFAULT_ALL command. The exponent is set be VOUT_MODE at –9
(equivalent of 1.953 mV/count). The programmed internal reference voltage is computed as:
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4] )] × 2–9 (V)
(5)
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The range of valid VOUT_COMMAND values is dependent upon the configured VOUT_SCALE_LOOP (29h) as
follows:
VOUT_SCALE_LOOP
Vout Range (volts)
VOUT_COMMAND data valid range
179 to 845
1
0.35 to 1.65
(1)
0.5
0.7 to 2.0
358 to 1024
(1) The TPSM846C23 is designed to be operated with output voltages no higher than 2.0V.
Copyright © 2017–2019, Texas Instruments Incorporated
37
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
Any VOUT_COMMAND > 2816 (5.5-V maximum VOUT equivalent) is treated as invalid data:
•
•
•
•
NACK the data byte
Do not update VOUT_COMMAND
Set CML bit in STATUS_BYTE
Set IVD bit in STATUS_CML
If the value programmed to VOUT_COMMAND exceeds the value stored in either VOUT_MIN or VOUT_MAX. In
this case, VOUT_COMMAND will be set to the appropriate VOUT_MIN or VOUT_MAX value (which ever was
violated). See the command descriptions for (28h) VOUT_MIN or (24h) VOUT_MAX for the specific status bits
set in either case.
COMMAND
Format
VOUT_COMMAND
Linear, unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
Mantissa
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
Function
Default Value
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
7.5.12.1 Exponent
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent to 1.953 mV/count, specified in
VOUT_MODE command).
7.5.12.2 Mantissa
This is the Mantissa for the linear format. The default for this bit value is: 0000 0001 0000 0000 (binary) 256
(decimal) (equivalent Vout default = 0.5 V).
7.5.13 VOUT_MAX (24h)
The VOUT_MAX command sets the maximum output voltage. The purpose is to protect the devices on the
output rail supplied by this device from a higher than acceptable output voltage. VOUT_MAX imposes an upper
bound to any attempt to program the output voltage to a VOUT_EQUIV setting by changing any of the following
registers:
•
•
•
•
•
•
•
•
•
VOUT_COMMAND
VOUT_MAX
VOUT_MIN
OPERATION[5]
OPERATION[4]
VREF_TRIM
STEP_VREF_MARGIN_HIGH
STEP_VREF_MARGIN_LOW
VOUT_SCALE_LOOP
The exponent is set be VOUT_MODE at –9 (equivalent to 1.953 mV/count). Use Equation 6 to calculate the
programmed output voltage.
MAXIMUM VOUT allowed = VOUT_MAX × VOUT_MODE (V) = VOUT_MAX × 2–9 (V)
(6)
The range of valid VOUT_MAX values is dependent upon the configured (29h) VOUT_SCALE_LOOP as shown
in Equation 7.
MAXIMUM VOUT Reference allowed = VOUT_MAX × VOUT_SCALE_LOOP x VOUT_MODE (V) = VOUT_MAX ×
VOUT_SCALE_LOOP × 2–9 (V)
(7)
If the output voltage is turned on and any attempt is made to program any one of the following: (1) VOUT_EQUIV
to be greater than VOUT_MAX; (2) VOUT_MAX to be less than, or equal to, VOUT_MIN, or; (3) VOUT_MIN to
be greater than, or equal to, VOUT_MAX, – the TPSM846C23 will:
•
Clamp the internal reference voltage to VOUT_MAX × VOUT_SCALE_LOOP × VOUT_MODE value. In the
event VOUT_MAX < VOUT_MIN, VOUT_MAX shall dominate.
•
Sets the OTH (other) bit in the STATUS_BYTE
38
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
•
•
•
Sets the VFW bit in the STATUS_WORD
Sets the VOUT_MAX_MIN_Warning bit in the STATUS_VOUTregister
Notifies the host through the SMBALERT pin
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
COMMAND
Format
VOUT_MAX
Linear, unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
Mantissa
7.5.13.1 Exponent
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95 mV/count, specified in
VOUT_MODE command).
7.5.13.2 Mantissa
The range of valid VOUT_MAX values is dependent upon the configured (29h) VOUT_SCALE_LOOP as follows.
If VOUT_SCALE_LOOP = 1:
•
•
•
default: 0000 0011 0100 1101 (binary) 845 (decimal) (equivalent VOUT_MAX = 1.65 V)
Minimum: 0000 0001 0001 1010 (binary) 282 (decimal) (equivalent VOUT_MAX = 0.55 V)
Maximum: 0000 0011 0100 1101 (binary) 845 (decimal) (equivalent VOUT_MAX = 1.65 V)
If VOUT_SCALE_LOOP = 0.5:
•
•
•
default: 0000 0110 1001 1010 (binary) 1690 (decimal) (equivalent VOUT_MAX = 3.3 V)
Minimum: 0000 0010 0011 0100 (binary) 564 (decimal) (equivalent VOUT_MAX = 1.1 V)
Maximum: 0000 0110 1001 1010 (binary) 1690 (decimal) (equivalent VOUT_MAX = 3.3 V)
7.5.14 VOUT_TRANSITION_RATE (27h)
The VOUT_TRANSITION_RATE command sets the rate of change in mV/µs of any output voltage change
during normal operation (also includes output voltage changes in TOFF_DELAY state. In contrast, the soft-start
transition rate is controlled by TON_RISE and the TOFF_FALL transition rate is controlled by TOFF_FALL
command).
For PWM loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
Only 8 fixed output voltage transition rates are available in the device. As such, the range of programmed VOUT
-
transition rates are sub-divided into 8 buckets that then selects one of the 8 fixed VOUT-transition rates.
Programmed values are rounded to the nearest bucket/transition rate as outlined below:
COMMAND
Format
VOUT_TRANSITION_RATE
Linear, two’s complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
r/w
4
3
2
1
0
r
Exponent
0
r/w
r/w
r/w
r/w
r/w
r/w
Function
Mantissa
1
Default Value
1
1
1
0
0
0
0
0
0
1
1
1
0
0
Copyright © 2017–2019, Texas Instruments Incorporated
39
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.14.1 Exponent
default: 11010 (binary) –6 (decimal) (0.015625)
These default settings are not programmable.
7.5.14.2 Mantissa
default: 000 0011 1100 (binary) 60 (decimal) (equivalent VOUT_TRANSITION_RATE = 1 mV/µs)
NOTE
Using VOUT_TRANSITION_RATE to slew Vref faster than the voltage loop can track is
possible, but may result in a overshoot/undershoot on the output voltage.
VOUT_TRANSITION Mantissa (d)
VOUT_TRANSITION
rate (mV/µs)
Greater than
Less than or equal to
0.067
0.1
—
5
5
7
0.143
0.222
0.333
0.5
7
12
17
25
47
79
—
12
17
25
47
79
1
1.5
7.5.15 VOUT_SCALE_LOOP (29h)
The VOUT_SCALE_LOOP command is is limited to only 2 possible options/ratios: 1 (default, no RSET needed),
0.5 (RSET= 10 kΩ). Attempting to write a value unequal to one of these options cause the device to set the cml bit
in the STATUS_BYTE, and the ivd bit in the STATUS_CML registers. Additionally, SMBALERT is asserted and
the value of VOUT_SCALE_LOOP remains unchanged. The contents of this register can be stored to nonvolatile
memory using the STORE_DEFAULT_ALL command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
NOTE
Construct the feedback resistor ratio appropriately (see 表 5). If the
VOUT_SCALE_LOOP does not match the external feedback resistor ratio, the converter
will regulate the output with the reference voltage as outlined in 公式 2. Program the
VOUT_SCALE_LOOP setting before the output is turned on.
For the range checking to work properly and to avoid invalid data scenarios:
•
•
•
VOUT_SCALE_LOOP should be changed first, if needed.
VOUT_MIN and VOUT_MAX should be changed after VOUT_SCALE_LOOP, if needed.
Additionally, it is assumed that VOUT_SCALE_LOOP will be programmed before the output is turned on; but,
the hardware will not do anything to prohibit changing VOUT_SCALE_LOOP in any state.
COMMAND
Format
VOUT_SCALE_LOOP
Linear, two’s complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
1
0
r/wE
r/wE
r/wE
r
Exponent
1
r
Mantissa
0
Function
Default Value
1
1
1
0
0
0
0
0
0
0
0
1
0
0
40
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.15.1 Exponent
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25)
These default settings are not programmable.
7.5.15.2 Mantissa
default: 000 0000 0100 (binary) 4 (decimal) (equivalent VOUT_SCALE_LOOP voltage = 1)
For VOUT_SCALE_LOOP = 1, mantissa = 004h. (4 × 2–2 = 1)
For VOUT_SCALE_LOOP = 0.5, mantissa = 002h. (2 × 2–2 = 0.5)
7.5.16 VOUT_MIN (2Bh)
The VOUT_MIN command sets the minimum output voltage. The purpose is to protect the devices on the output
rail supplied by this device from a lower than acceptable output voltage. VOUT_MIN imposes a lower bound to
any attempt to program the output voltage to a VOUT_EQUIV setting by changing any of the following registers:
•
•
•
•
•
•
•
•
•
VOUT_COMMAND
VOUT_MAX
VOUT_MIN
OPERATION[5]
OPERATION[4]
VREF_TRIM
STEP_VREF_MARGIN_HIGH
STEP_VREF_MARGIN_LOW
VOUT_SCALE_LOOP
The exponent is set be VOUT_MODE at –9 (equivalent of 1.953 mV/count). Use Equation 8 to calculate the
programmed output voltage.
MINIMUM VOUT allowed = VOUT_MIN × VOUT_MODE (V) = VOUT_MIN × 2–9 (V)
(8)
The range of valid VOUT_MIN values is dependent upon the configured (29h) VOUT_SCALE_LOOP as shown
in Equation 9.
MINIMUM VOUT allowed = VOUT_MIN × VOUT_SCALE_LOOP × VOUT_MODE (V) = VOUT_MIN ×
VOUT_SCALE_LOOP × 2–9 (V)
(9)
If, while the output voltage is turned on, any attempt is made to program: (1) VOUT_EQUIV to be less than
VOUT_MIN, the device will:
•
Clamp the internal reference voltage to VOUT_MIN × VOUT_SCALE_LOOP × VOUT_MODE value. In the
event VOUT_MAX < VOUT_MIN, VOUT_MAX shall dominate.
•
•
•
•
Sets the OTH (other) bit in the STATUS_BYTE
Sets the VFW bit in the STATUS_WORD
Sets the VOUT_MAX_MIN_Warning bit in the STATUS_VOUTregister
Notifies the host through the SMBALERT pin
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
COMMAND
Format
VOUT_MIN
Linear, unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
2
1
0
7
6
5
4
3
2
1
0
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
Mantissa
Copyright © 2017–2019, Texas Instruments Incorporated
41
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.16.1 Exponent
Value fixed at 10111, Exponent for Linear mode values is –9 (equivalent of 1.95 mV/count, specified in
VOUT_MODE command).
7.5.16.2 Mantissa
The range of valid VOUT_MIN values is dependent upon the configured (29h) VOUT_SCALE_LOOP as follows.
If VOUT_SCALE_LOOP = 1:
•
•
•
default: 0000 0000 1011 0011 (binary) 179 (decimal) (equivalent VOUT_MIN = 0.35 V)
Minimum: 0000 0000 1011 0011 (binary) 179 (decimal) (equivalent VOUT_MIN = 0.35 V)
Maximum: 0000 0011 0000 0000 (binary) 768 (decimal) (equivalent VOUT_MIN = 1.5 V)
If VOUT_SCALE_LOOP = 0.5:
•
•
•
default: 0000 0001 0110 0110 (binary) 358 (decimal) (equivalent VOUT_MIN = 0.7 V)
Minimum: 0000 0001 0110 0110 (binary) 358 (decimal) (equivalent VOUT_MIN = 0.7 V)
Maximum: 0000 0110 0000 0000 (binary) 1536 (decimal) (equivalent VOUT_MIN = 3 V)
7.5.17 VIN_ON (35h)
The VIN_ON command sets the value of the input voltage at which the unit should start operation assuming all
other required startup conditions are met. Values are mapped to the nearest supported increment. Values
outside the supported range are treated as invalid data and cause the device set the CML bit in the
STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML registers, and trigger SMBALERT signal. The
value of VIN_ON remains unchanged on an out-of-range write attempt. The contents of this register can be
stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The supported VIN_ON values are shown in Table 9:
Table 9. Supported VIN_ON Values
VIN_ON Values (V)
4.25
5.5
4.5 (default)
4.75
6
5
5.25
6.5
5.75
7
6.25
7.5
6.75
7.25
7.75
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF
higher than VIN_ON results in the new value being rejected, SMBALERT signal being asserted along with the
CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
The data word that accompanies this command is divided into a fixed 5-bit exponent and an 11-bit mantissa. The
four most significant bits of the mantissa are fixed, while the lower 4 bits may be altered.
COMMAND
Format
VIN_ON
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r
Exponent
1
r
Mantissa
0
Function
Default Value
1
1
1
0
0
0
0
0
0
1
0
0
1
0
7.5.17.1 Exponent
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25 V)
These default settings are not programmable.
7.5.17.2 Mantissa
default: 000 0001 0010 (binary) 18 (decimal) (equivalent VIN_ON voltage = 4.5 V)
Minimum: 000 0001 0001 (binary) 17 (decimal) (equivalent VIN_ON voltage = 4.25 V)
42
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Maximum: 000 0001 1111 (binary) 31 (decimal) (equivalent VIN_ON voltage = 7.75 V)
7.5.18 VIN_OFF (36h)
The VIN_OFF command sets the value of the input voltage at which the unit should stop operation. Values are
mapped to the nearest supported increment. Values outside the supported range is treated as invalid data and
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML
registers, and trigger SMBALERT signal. The value of VIN_OFF remains unchanged during an out-of-range write
attempt. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL
command.
The supported VIN_OFF values are shown in Table 10:
Table 10. Supported VIN_OFF Values
VIN_OFF Values (V)
4 (default)
5.25
4.25
5.5
4.5
5.75
7
4.75
6
5
6.25
7.5
6.5
6.75
7.25
VIN_ON must be set higher than VIN_OFF. Attempting to write either VIN_ON lower than VIN_OFF or VIN_OFF
higher than VIN_ON results in the new value being rejected, SMBALERT being asserted along with the cml bit in
STATUS_BYTE and the invalid data bit in STATUS_CML.
The data word that accompanies this command is divided into a fixed 5 bit exponent and an 11 bit mantissa. The
4 most significant bits of the mantissa are fixed, while the lower 7 bits may be altered.
COMMAND
Format
VIN_OFF
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r
Exponent
1
r
Mantissa
0
Function
Default Value
1
1
1
0
0
0
0
0
0
1
0
0
0
0
7.5.18.1 Exponent
default: 11110 (binary) –2 (decimal) (equivalent LSB = 0.25 V)
These default settings are not programmable.
7.5.18.2 Mantissa
default: 000 0001 0000 (binary) 16 (decimal) (equivalent VIN_OFF voltage = 4 V)
Minimum: 000 0001 0000 (binary) 16 (decimal) (equivalent VIN_OFF voltage = 4 V)
Maximum: 000 0001 1110 (binary) 30 (decimal) (equivalent VIN_OFF voltage = 7.5 V)
7.5.19 IOUT_CAL_OFFSET (39h)
The IOUT_CAL_OFFSET command is used to compensate for offset errors in the READ_IOUT results and the
IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT thresholds. The units are amperes. The default setting is
0 A. The resolution of the argument for this command is 62.5 mA and the range is +3.9375 A to –4 A. Values
written outside of this range alias into the supported range. This occurs because the read-only bits are fixed. The
exponent is always –4 and the 5 MSB bits of the Mantissa are always equal to the sign bit. The contents of this
register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
COMMAND
Format
IOUT_CAL_OFFSET
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Function
Exponent
Mantissa
Copyright © 2017–2019, Texas Instruments Incorporated
43
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
COMMAND
IOUT_CAL_OFFSET
Default Value
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.19.1 Exponent
default: 11100 (binary) –4 (decimal) (LSB = 62.5 mA)
These default settings are not programmable.
7.5.19.2 Mantissa
MSB is programmable with sign, next 4 bits are sign extend only.
Lower six bits are programmable with a default value of 0 (decimal).
7.5.20 VOUT_OV_FAULT_RESPONSE (41h)
The VOUT_OV_FAULT_RESPONSE command instructs the device on what action to take in response to an
Output Over Voltage Fault based on MFR_SPECIFIC_07 (PCT_OV_UV_WRN_FLT_LIMITS). The device also:
•
•
•
•
Sets the OVF bit in the STATUS_BYTE
Sets the VFW bit in the STATUS_WORD
Sets the OVF bit in the STATUS_VOUT register, and
Notifies the host by asserting SMBALERT
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The default response to a output overvoltage fault is to shut down and restart with 7 × TON_RISE time delay.
COMMAND
VOUT_OV_FAULT_RESPONSE
Format
Unsigned binary
Bit Position
Access
7
r/wE
RSP[1]
1
6
r
5
r/wE
RS[2]
1
4
r/w
3
r/w
2
1
0
r
TD[2]
1
r
TD[1]
1
r
TD[0]
1
Function
0
0
RS[1]
1
RS[0]
1
Default Value
7.5.20.1 RSP[1] Bit
This bit sets the output voltage overvoltage response to either ignore or not. The default for this bit is 1.
BIT VALUE
ACTION
The PMBus device continues operation without interruption. Note: In this ignore fault
response mode, the associated fault status bits is set. Additionally, SMBALERT
remains triggered if it is not masked.
0
1
The PMBus device shuts down and restarts according to RS[2:0].
7.5.20.2 RS[2:0] Bits
These bits are output voltage overvoltage retry setting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry setting means that the unit does not attempt to restart. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry setting means that the unit goes through a normal startup (Soft
start) continuously, without limitation, until it is commanded off or bias power is
removed or another fault condition causes the unit to shutdown.
111
44
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
Note: because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.
7.5.20.3 TD[2:0] Bits
These bits are output voltage overvoltage retry time delay retting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry time delay setting means that the unit does not attempt to
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry time delay setting means that the unit waits 7 TON_RISE
times before it goes through a normal startup (Soft start). This is only supported when
Restart is enabled by RS[2:0] = 111.
111
These bits are direct reflections of the RS[2] (bit 5) value in this register.
7.5.21 VOUT_UV_FAULT_RESPONSE (45h)
The VOUT_UV_FAULT_RESPONSE command instructs the device on what action to take in response to an
Output Under Voltage Fault based on MFR_SPECIFIC_07 (PCT_OV_UV_WRN_FLT_LIMITS). The device also:
•
•
•
•
Sets the oth bit in the STATUS_BYTE
Sets the VFW bit in the STATUS_WORD
Sets the UVF bit in the STATUS_VOUT register, and
Notifies the host by asserting SMBALERT
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The default response to a output undervoltage fault is to shut down and restart with 7 × TON_RISE time delay.
COMMAND
VOUT_UV_FAULT_RESPONSE
Format
Unsigned binary
Bit Position
Access
7
r/wE
RSP[1]
1
6
r
5
r/wE
RS[2]
1
4
r/w
3
r/w
2
1
0
r
TD[2]
1
r
TD[1]
1
r
TD[0]
1
Function
0
0
RS[1]
1
RS[0]
1
Default Value
Copyright © 2017–2019, Texas Instruments Incorporated
45
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.21.1 RSP[1] Bit
This bit sets the output voltage undervoltage response to either ignore or not. The default for this bit is 1.
BIT VALUE
ACTION
The PMBus device continues operation without interruption. Note: In this ignore fault
response mode, the associated fault status bits are set. Additionally, SMBALERT
continues to be triggered if it is not masked.
0
1
The PMBus device shuts down and restarts according to RS[2:0].
7.5.21.2 RS[2:0] Bits
These bits are output voltage undervoltage retry setting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry setting means that the unit does not attempt to restart. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry setting means that the unit goes through a normal startup (soft
start) continuously, without limitation, until it is commanded off or bias power is
removed or another fault condition causes the unit to shutdown.
111
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.
7.5.21.3 TD[2:0] Bits
These bits are output voltage undervoltage retry time delay retting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry time delay setting means that the unit does not attempt to
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry time delay setting means that the unit waits 7 TON_RISE
times before it goes through a normal startup (Soft start). This is only supported when
Restart is enabled by RS[2:0] = 111.
111
These bits are direct reflections of the RS[2] (bit 5) value in this register.
7.5.22 IOUT_OC_FAULT_LIMIT (46h)
The IOUT_OC_FAULT_LIMIT command sets the value of the output current, in amperes, that causes the
overcurrent detector to indicate an overcurrent fault condition. The IOUT_OC_FAULT_LIMIT should be set equal
to or greater than the IOUT_OC_WARN_LIMIT. Writing a value to IOUT_OC_FAULT_LIMIT less than
IOUT_OC_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd)
bit in the STATUS_CML registers as well as assert the SMBALERT signal. The contents of this register can be
stored to nonvolatile memory using the STORE_DEFAULT_ALL command. Since 2-LSBs are not stored in
EEPROM, on STORE, always round up. If IOUT_OC_FAULT_LIMIT [1:0] > 0, add 1 to IOUT_OC_FAULT_LIMIT
[6:2]
The IOUT_OC_FAULT_LIMIT takes a two-byte data word formatted as shown below:
COMMAND
Format
IOUT_OC_FAULT_LIMIT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r
r/w
r/w
Function
Exponent
Mantissa
Default Value
See Below
46
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.22.1 Exponent
default: 11111 (binary) –1 (decimal) (0.5 A)
These default settings are not programmable.
7.5.22.2 Mantissa
The upper four bits are fixed at 0.
The lower seven bits are programmable.
Use Equation 10 to calculate the actual output current for a given mantissa and exponent.
Mantissa
=
IOUT(oc) = Mantissa´ 2Exponent
2
(10)
The default values and allowable ranges for each device are summarized below:
OC_FAULT_LIMIT
DEFAULT
42
DEVICE
UNIT
MIN
MAX
TPSM846C23
5
52
A
7.5.23 IOUT_OC_FAULT_RESPONSE (47h)
The IOUT_OC_FAULT_RESPONSE command instructs the device on what action to take in response to an
IOUT_OC_FAULT_LIMIT. The device also:
•
•
•
•
Sets the OCF bit in the STATUS_BYTE
Sets the OCFW bit in the STATUS_WORD
Sets the OCF bit in the STATUS_IOUT register, and
Notifies the host by asserting SMBALERT
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The default response to an overcurrent fault is to shut down and restart with 7 × TON_RISE time delay.
COMMAND
IOUT_OC_FAULT_RESPONSE
Format
Unsigned binary
Bit Position
Access
7
r/wE
RSP[1]
1
6
r/w
5
r/wE
RS[2]
1
4
r/w
3
r/w
2
1
0
r
TD[2]
1
r
TD[1]
1
r
TD[0]
1
Function
RSP[0]
1
RS[1]
1
RS[0]
1
Default Value
7.5.23.1 RSP[1:0] Bits
These bits set the overcurrent fault response to either ignore or not. The default for this bit is 11b. Any value
other than 00b or 11b will not be accepted, such and attempt will cause the ’cml’ bit in the STATUS_BYTE
register and the ivd bit in the STATUS_CML register to be set, and assert SMBALERT. Because both bits must
be the same, only one (bit 7) is stored in EEPROM. The default for this bit is 11b.
BIT VALUE
ACTION
The PMBus device continues operation without interruption. Note: In this “ignore” fault
response mode, the associated fault status bits are set. Additionally, SMBALERT
continues to be triggered if it is not masked.
00
11
The PMBus device shuts down and restarts according to RS[2:0].
Copyright © 2017–2019, Texas Instruments Incorporated
47
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.23.2 RS[2:0] Bits
These bits are overcurrent fault retry setting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry setting means that the unit does not attempt to restart. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry setting means that the unit goes through a normal startup
(soft-start) continuously, without limitation, until it is commanded off or bias power is
removed or another fault condition causes the unit to shutdown.
111
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.
7.5.23.3 TD[2:0] Bits
These bits are over current retry time delay retting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry time delay setting means that the unit does not attempt to
delay a restart. This is only supported when Restart is disabled by RS[2:0] = 000. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry time delay setting means that the unit waits 7 TON_RISE
times before it goes through a normal startup (Soft start). This is only supported when
Restart is enabled by RS[2:0] = 111.
111
These bits are direct reflections of the RS[2] (bit 5) value in this register.
7.5.24 IOUT_OC_WARN_LIMIT (4Ah)
The IOUT_OC_WARN_LIMIT command sets the value of the output current, in amperes, that causes the
overcurrent detector to indicate an overcurrent warning. When this current level is exceeded the device:
•
•
•
•
Sets the oth bit in the STATUS_BYTE
Sets the OCFW bit in the STATUS_WORD
Sets the OCW bit in the STATUS_IOUT register, and
Notifies the host by asserting SMBALERT
The IOUT_OC_WARN_LIMIT threshold should always be set to less than or equal to the
IOUT_OC_FAULT_LIMIT. Writing a value to IOUT_OC_WARN_LIMIT greater than IOUT_OC_FAULT_LIMIT
causes the device to set the CML bit in the STATUS_BYTE and the invalid data (ivd) bit in the STATUS_CML
registers as well as assert the SMBALERT signal. In such case, the register content will remain unchanged. This
behavior can be overridden by the user setting Data Limit Override (DLO) in MFR_SPECIFIC_21[4].
The default IOUT_OC_WARN_LIMIT is always set to 87.5% of the OCF value. Because the
IOUT_OC_WARN_LIMIT is not stored in EEPROM, the IOUT_OC_WARN_LIMIT register is set to 12.5% less
than the stored OCF threshold upon any RESTORE from EEPROM (reset_restore, or
RESTORE_DEFAULT_ALL command). The digital math to achieve this is: OCW_default = (OCF – OCF/8).
The IOUT_OC_WARN_LIMIT takes a two byte data word formatted as shown below:
COMMAND
Format
IOUT_OC_WARN_LIMIT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
Exponent
Mantissa
Default Value
See Below
48
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.24.1 Exponent
default: 11111 (binary) –1 (decimal) (0.5 A)
These default settings are not programmable.
7.5.24.2 Mantissa
The upper four bits are fixed at 0.
Lower seven bits are programmable.
The actual output warning current level for a given mantissa and exponent is:
Mantissa
IOUT (OCW ) = Mantissa × 2Exponent
=
2
(11)
The default values and allowable ranges for each device are summarized below:
OC_WARN_LIMIT
DEVICE
UNIT
MIN
DEFAULT
MAX
TPSM846C23
4
37
50
A
7.5.25 OT_FAULT_LIMIT (4Fh)
The OT_FAULT_LIMIT command sets the value of the temperature, in degrees Celsius, that causes an
overtemperature fault condition, when the sensed temperature from the internal sensor exceeds this limit.
The OT_FAULT_LIMIT must always be greater than the OT_WARN_LIMIT. Writing a value to OT_FAULT_LIMIT
less than or equal to OT_WARN_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the
invalid data (ivd) bit in the STATUS_CML registers as well as asserts the SMBALERT signal. The contents of
this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The OT_FAULT_LIMIT takes a two byte data word formatted as shown below.
COMMAND
Format
OT_FAULT_LIMIT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
6
5
r/wE
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Exponent
0
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
1
0
1
0
0
0
1
7.5.25.1 Exponent
default: 00000 (binary) 0 (decimal) (represents mantissa with steps of 1 degree Celcius)
These default settings are not programmable.
7.5.25.2 Mantissa
default: 000 1001 0001 (binary) 145 (decimal) (145°C)
Minimum: 000 0111 1000 (binary) (equivalent OTF = 120°C)
Maximum: 000 1010 0101 (binary) (equivalent OTF = 165°C)
7.5.26 OT_FAULT_RESPONSE (50h)
The OT_FAULT_RESPONSE command instructs the device on what action to take in response to an
OT_FAULT_LIMIT. The device also:
•
•
•
Sets the OTFW bit in the STATUS_BYTE
Sets the OTF bit in the STATUS_TEMPERATURE
Notifies the host by asserting SMBALERT
Copyright © 2017–2019, Texas Instruments Incorporated
49
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
When the overtemperature fault is tripped, the fault flag is latched until the internal sensed temperature
decreases 20°C from the OT_FAULT_LIMIT.
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The default response to an over temperature fault is to ignore. Fixed Bandgap Detected Overtemperature faults
are never ignored. The Bandgap OT faults always respond in a shutdown and attempted restart once the part
cools.
COMMAND
OT_FAULT_RESPONSE
Format
Unsigned binary
Bit Position
Access
7
r/wE
RSP[1]
0
6
r
5
r/wE
RS[2]
1
4
r/w
3
r/w
2
1
0
r
TD[2]
1
r
TD[1]
1
r
TD[0]
1
Function
0
0
RS[1]
1
RS[0]
1
Default Value
7.5.26.1 RSP[1] Bit
This bit sets the over temperature fault response to either ignore or not. The default for this bit is 0.
BIT VALUE
ACTION
The PMBus device continues operation without interruption. Note: In this “ignore” fault
response mode, the associated fault status bits are set. Additionally, SMBALERT
continues to be triggered if it is not masked.
0
1
The PMBus device shuts down and restarts according to RS[2:0].
7.5.26.2 RS[2:0] Bits
These bits are over temperature fault retry setting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the Retry Setting means that the unit does not attempt to restart. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the Retry Setting means that the unit goes through a normal startup (Soft
start) continuously, without limitation, until it is commanded off or bias power is removed
or another fault condition causes the unit to shutdown.
111
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.
NOTE
The programmed response here is also applied to the bandgap-detected overtemperture
(OT) faults with the one exception of the ignore response. The fixed Bandgap-detected
overtemperature faults are never ignored. The bandgap OT faults always respond in a
shutdown and attempted restart when the part cools.
7.5.26.3 TD[2:0] Bits
These bits are overtemperature fault retry time delay retting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry time delay setting means that the unit does not attempt to delay a
restart. This is only supported when restart is disabled by RS[2:0] = 000. The output
remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry time delay setting means that the unit waits 7 TON_RISE times
before it goes through a normal startup (soft start). This is only supported when restart is
enabled by RS[2:0] = 111.
111
50
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
These bits are direct reflections of the RS[2] (bit 5) value in this register.
7.5.27 OT_WARN_LIMIT (51h)
The OT_WARN_LIMIT command sets the value of the temperature, in degrees Celsius, that causes an
overtemperature warning condition, when the sensed temperature from the internal sensor exceeds this limit.
Upon triggering the overtemperature warning, the device takes the following actions:
•
•
•
Sets the TEMPERATURE bit in the STATUS_BYTE
Sets the OT Warning bit in the STATUS_TEMPERATURE
Notifies the host by asserting SMBALERT
Once the overtemperature warning is tripped, the warning flag is latched until the internal sensed temperature
decreases 20°C from the OT_WARN_LIMIT.
The OT_WARN_LIMIT must always be less than the OT_FAULT_LIMIT. Writing a value to OT_WARN_LIMIT
greater than or equal to OT_FAULT_LIMIT causes the device to set the CML bit in the STATUS_BYTE and the
invalid data (ivd) bit in the STATUS_CML registers as well as assert the SMBALERT signal. In such case, the
register content will remain unchanged. This behavior can be overridden by the user setting Data Limit Override
(DLO) in MFR_SPECIFIC_21[4].
The default OT_WARN_LIMIT is mathematically derived from the EEPROM backed OTF limit by subtracting 25
from (4Fh) OT_FAULT_LIMIT to reach the default OT_WARN_LIMIT. If the calculated OTW is less than 100°C,
then the default value is set to 100°C. OTW=max(OTF-25, 100)
The OT_WARN_LIMIT takes a two byte data word formatted as shown below:
COMMAND
Format
OT_WARN_LIMIT
Unsigned binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
6
5
r/w
4
3
2
1
0
r
Exponent
0
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
Mantissa
1
Default Value
0
0
0
0
0
0
0
0
1
1
1
0
0
0
7.5.27.1 Exponent
default: 00000 (binary) 0 (decimal) (represents mantissa with steps of 1 degree Celcius)
These default settings are not programmable.
7.5.27.2 Mantissa
default: 000 0111 1000 (binary) 120 (decimal) (120°C) 25°C less than default OTF
Minimum: 000 0110 0100 (binary) (equivalent OTF = 100°C)
Maximum: 000 1000 1100 (binary) (equivalent OTF = 140°C)
Copyright © 2017–2019, Texas Instruments Incorporated
51
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.28 TON_DELAY (60h)
The TON_DELAY command sets the time in milliseconds, from when a start condition is received to when the
output voltage starts to rise. The contents of this register can be stored to nonvolatile memory using the
STORE_DEFAULT_ALL command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The TON_DELAY command is formatted as a linear mode two’s complement binary integer.
COMMAND
Format
TON_DELAY
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Exponent
0
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.28.1 Exponent
default: 00000 (binary) 0 (decimal) (1 millisecond)
These default settings are not programmable.
7.5.28.2 Mantissa
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000
(binary) (0 ms).
Only 16 fixed TON_DELAY times are available in the device. As such, the range of programmed TON_DELAY
settings are sub-divided into 16 buckets that then selects one of the 16 supported times. Programmed values are
rounded to the nearest bucket/transition rate as outlined in the table Supported TON_DELAY Values:
Table 11. Supported TON_DELAY Values
EFFECTIVE
TON_DELAY
(ms)
PROGRAMMED TON_DELAY MANTISSA (decimal)
Greater than
Less than or equal to
0 (50 us)
—
0
0
1
1
2
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10
14
19
27
37
52
72
100
9
12
17
22
32
44
62
86
—
12
17
22
32
44
62
86
52
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.29 TON_RISE (61h)
The TON_RISE command sets the time in milliseconds, from when the reference starts to rise until the voltage
has entered the regulation band. The contents of this register can be stored to nonvolatile memory using the
STORE_DEFAULT_ALL command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
Programming a value of 0 instructs the unit to bring its output voltage to the programmed regulation value as
quickly as possible. For the device, this results in an effective TON_RISE time of 1ms (fastest time supported).
The TON_RISE command is formatted as a linear mode two’s complement binary integer.
COMMAND
Format
TON_RISE
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Exponent
0
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
1
1
7.5.29.1 Exponent
default: 00000 (binary) 0 (decimal) (1 millisecond)
These default settings are not programmable.
7.5.29.2 Mantissa
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0011
(binary) (3 ms). For PWM loop slave device, the effective TON_RISE time is locked at 100 ms.
The supported TON_RISE times over PMBus are shown in Table 12:
Table 12. Supported TON_RISE Values
Programmed TON_RISE Mantissa (d)
Effective
TON_RISE (ms)
Greater than
Less than or equal to
1
2
—
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10
14
19
27
37
52
72
100
9
12
17
22
32
44
62
86
—
12
17
22
32
44
62
86
Copyright © 2017–2019, Texas Instruments Incorporated
53
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.30 TON_MAX_FAULT_LIMIT (62h)
The TON_MAX_FAULT_LIMIT command sets an UPPER limt in milliseconds, on how long the unit can attempt
to power up the output without reaching the output undervoltage fault limit. The time begins counting as soon as
the device enters the soft-start state begins to ramp the output. In other words, the TON_MAX_FAULT_LIMIT
timer starts at the beginning of the TON_RISE state.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
When TON_MAX_FAULT_LIMIT is set to 0, the TON_MAX_FAULT timer is disabled, which means that there is
no limit and that the unit can attempt to bring up the output voltage indefinitely.
The device does not prohibit setting TON_MAX_FAULT_LIMIT < TON_RISE, however, in this configuration, the
device will trigger a TON_MAX_FAULT if the VOUT has not risen above the UVF threshold by 4 seconds after
the TON_DELAY and TON_RISE times expire.
The TON_MAX_FAULT_LIMIT command is formatted as a linear mode two’s complement binary integer.
COMMAND
Format
TON_MAX_FAULT_LIMIT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r
Exponent
0
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.30.1 Exponent
default: 00000 (binary) 0 (decimal) (Disable)
These default settings are not programmable.
7.5.30.2 Mantissa
The upper four bits are fixed at 0.
This register is not EEPROM backed,
a
RESTORE_DEFAULT_ALL command causes the
TON_MAX_FAULT_LIMIT to restore to the default 0 ms value.
The supported TON_MAX_FAULT_LIMIT times over PMBus are shown below:
Table 13. Supported TON_MAX_FAULT_LIMIT Values
Effective
TON_MAX_FAULT_LI
MIT (ms)
Programmed TON_MAX_FAULT_LIMIT Mantissa (d)
Greater than
Less than or equal to
No Limit (timer
disabled)
—
0
1
2
0
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10
14
19
27
37
52
9
12
17
22
32
44
62
12
17
22
32
44
54
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Table 13. Supported TON_MAX_FAULT_LIMIT Values (continued)
Effective
TON_MAX_FAULT_LI
MIT (ms)
Programmed TON_MAX_FAULT_LIMIT Mantissa (d)
Greater than
Less than or equal to
72
62
86
86
—
100
7.5.31 TON_MAX_FAULT_RESPONSE (63h)
The TON_MAX_FAULT_RESPONSE command instructs the device on what action to take in response to an
TON_MAX_FAULT_LIMIT.
The device also:
•
•
•
•
Sets the oth bit in the STATUS_BYTE
Sets the VFW bit in the STATUS_WORD
Sets the TONMAXF bit in the STATUS_VOUT register, and
Notifies the host by asserting SMBALERT
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
The default response to a TON_MAX_FAULT is to shut down and restart with 7 × TON_RISE time delay.
COMMAND
TON_MAX_FAULT_RESPONSE
Format
Unsigned binary
Bit Position
Access
7
r/wE
RSP[1]
1
6
r
5
r/wE
RS[2]
1
4
r/w
3
r/w
2
1
0
r
TD[2]
1
r
TD[1]
1
r
TD[0]
1
Function
0
0
RS[1]
1
RS[0]
1
Default Value
7.5.31.1 RSP[1] Bit
This bit sets the TON_MAX_FAULT response to either ignore or not. The default for this bit is 1.
BIT VALUE
ACTION
The PMBus device continues operation without interruption. Note: In this ignore fault
response mode, the associated fault status bits are set. Additionally, SMBALERT
continues to be triggered if it is not masked.
0
1
The PMBus device shuts down and restarts according to RS[2:0].
7.5.31.2 RS[2:0] Bits
These bits are TON_MAX_FAULT retry setting. The default for this bit is 111b.
BIT VALUE
ACTION
A zero value for the retry setting means that the unit does not attempt to restart. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
A one value for the retry setting means that the unit goes through a normal startup (soft
start) continuously, without limitation, until it is commanded off or bias power is
removed or another fault condition causes the unit to shutdown.
111
Any value other than 000 or 111 is not accepted. Attempting to write any other value is rejected, causing the
device to assert SMBALERT along with the CML bit in STATUS_BYTE and the invalid data bit in STATUS_CML.
Because all 3 bits must be the same, only one (bit 5) is stored in EEPROM.
7.5.31.3 TD[2:0] Bits
These bits are TON_MAX_FAULT retry time delay retting. The default for this bit is 111b.
Copyright © 2017–2019, Texas Instruments Incorporated
55
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
BIT VALUE
ACTION
A zero value for the retry time delay setting means that the unit does not attempt to
delay a restart. This is only supported when restart is disabled by RS[2:0] = 000. The
output remains disabled until the fault is cleared (Refer to section 10.7 of the PMBus
specification)
000
111
A one value for the retry time delay setting means that the unit waits 7 TON_RISE
times before it goes through a normal startup (soft start). This is only supported when
restart is enabled by RS[2:0] = 111.
These bits are direct reflections of the RS[2] (bit 5) value in this register.
7.5.32 TOFF_DELAY (64h)
The TOFF_DELAY command sets the time in milliseconds, from when a stop condition is received and when the
output voltage starts to fall. The contents of this register can be stored to nonvolatile memory using the
STORE_DEFAULT_ALL command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The TOFF_DELAY command is formatted as a linear mode two’s complement binary integer.
COMMAND
Format
TOFF_DELAY
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Exponent
0
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.32.1 Exponent
default: 00000 (binary) 0 (decimal) (1 millisecond)
These default settings are not programmable.
7.5.32.2 Mantissa
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0000
(binary) (0 ms).
Only 16 fixed TOFF_DELAY times are available in the device. As such, the range of programmed TOFF_DELAY
settings are sub-divided into 16 buckets that then selects one of the 16 supported times. Programmed values are
rounded to the nearest bucket/transition rate as outlined in the table Supported TOFF_DELAY Values:
Table 14. Supported TOFF_DELAY Values
EFFECTIVE
TOFF_DELAY
(ms)
PROGRAMMED TOFF_DELAY MANTISSA (decimal)
Greater than
Less than or equal to
0
1
—
0
0
1
2
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10
14
19
9
12
17
22
12
17
56
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Table 14. Supported TOFF_DELAY Values (continued)
EFFECTIVE
TOFF_DELAY
(ms)
PROGRAMMED TOFF_DELAY MANTISSA (decimal)
Greater than
Less than or equal to
27
37
22
32
44
62
86
32
44
62
86
—
52
72
100
7.5.33 TOFF_FALL (65h)
The TOFF_FALL command sets the time in milliseconds, from the end of the TOFF_DELAY time until the
voltage reaches 0 V. The contents of this register can be stored to nonvolatile memory using the
STORE_DEFAULT_ALL command.
Programming a value of 0 instructs the unit to bring its output voltage down to 0 as quickly as possible. For the
device, this results in actively ramping down the output voltage in 1 ms (the fastest supported ramp down).
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The TOFF_FALL command is formatted as a linear mode two’s complement binary integer.
COMMAND
Format
TOFF_FALL
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r
Exponent
0
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.33.1 Exponent
default: 00000 (binary) 0 (decimal) (1 millisecond)
These default settings are not programmable.
7.5.33.2 Mantissa
The upper four bits are fixed at 0. The lower seven bits are programmable with a default value of 000 0000 0011
(binary) (3 ms).
The supported TOFF_FALL times over PMBus are shown in Supported TOFF_FALL Values:
Table 15. Supported TOFF_FALL Values
Programmed TOFF_FALL Mantissa (d)
Greater than Less than or equal to
Effective
TOFF_FALL (ms)
1
2
—
1
1
2
3
2
3
4
3
4
5
4
5
6
5
6
7
6
9
10
14
19
9
12
17
22
12
17
Copyright © 2017–2019, Texas Instruments Incorporated
57
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
Table 15. Supported TOFF_FALL Values (continued)
Programmed TOFF_FALL Mantissa (d)
Greater than Less than or equal to
Effective
TOFF_FALL (ms)
27
37
22
32
44
62
86
32
44
62
86
—
52
72
100
7.5.34 STATUS_BYTE (78h)
The STATUS_BYTE command returns one byte of information with a summary of the most critical device faults.
COMMAND
STATUS_BYTE
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW
0
Function
X
0
OFF
X
OVF
0
OCF
0
X
0
CML
0
oth
1
Default Value
A 1 in any of these bit positions indicates that:
OFF
The device is not providing power to the output, regardless of the reason. In this family of devices,
this flag means that the converter is not enabled.
OVF
An output overvoltage fault has occurred. This bit directly reflects the state of STATUS_VOUT[7] –
OVF. If the user wants this fault source to be masked and not trigger SMBALERT, they must do it
by masking STATUS_VOUT[7]. Per the PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not
clearable through a PMBus write. In contrast, the bit is to be cleared by clearing the bits in
STATUS_VOUT that cause this bit to be set. For loop slave device, this bit is 0.
OCF
An output overcurrent fault has occurred. This bit directly reflect the state of STATUS_IOUT[7] –
OCF. If the user wants this fault sourced to be masked and not trigger SMBALERT, they must do it
by masking STATUS_IOUT[7]. Per the PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not
clearable through a PMBus write. In contrast, the bit is to be cleared by clearing the bits in
STATUS_IOUT that cause this bit to be set.
OTFW
A temperature fault or warning has occurred. Check STATUS_TEMPERATURE. Per the PMBus
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,
the bit is to be cleared by clearing the bits in STATUS_TEMPERATURE that cause this bit to be
set.
CML
oth
A communications, memory or logic fault has occurred. Check STATUS_CML. Per the PMBus v1.3
spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit
is to be cleared by clearing the bits in STATUS_CML that cause this bit to be set.
A fault or warning not listed through bits 1-7 has occurred, which include an undervoltage fault, over
current warning, overvotlge warning, undervoltage warning, TON_MAX_FAULT, LOW_VIN,
VOUT_MAX_MIN_Warning, OTF_BG, or IV_PPV1. Check other status registers. Per the PMBus
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,
the bit is to be cleared by clearing the bits in STATUS_VOUT, STATUS_IOUT, STATUS_IOUT
(7Bh), or STATUS_MFR_SPECIFIC (80h)that cause this bit to be set. The default for this bit is 1
because the default of STATUS_INPUT[3] LOW_Vin defaulting to 1.
7.5.35 STATUS_WORD (79h)
The STATUS_WORD command returns two bytes of information with a summary of the device fault and warning
conditions. The low byte is identical to the STATUS_BYTE above. The additional byte reports the warning
conditions for output overvoltage and overcurrent, as well as the power good status of the converter.
58
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
COMMAND
Format
STATUS_WORD (low byte) = STATUS_BYTE
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
1
r
0
r
r
OTFW
0
Function
X
0
OFF
X
OVF
0
OCF
0
x
0
CML
0
oth
1
Default Value
COMMAND
Format
STATUS_WORD (high byte)
Unsigned binary
Bit Position
Access
7
6
5
4
r
3
2
r
1
r
0
r
rE
PGOOD_Z
X
r
VFW
0
r
OCFW
0
r
INPUT
X
Function
MFR
X
0
X
0
X
0
Default Value
0
A 1 in any of the high byte bit positions indicates that:
VFW
An output voltage fault or warning has occurred (OVF or OVW or UVW or UVF or
VOUT_MAX_Warning or TONMAXF). Check STATUS_VOUT. Per the PMBus v1.3 spec sections
10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit is to be
cleared by clearing the bits in STATUS_VOUT that cause this bit to be set.
OCFW
INPUT
MFR
An output current warning or fault has occurred (OCF or OCW). Check STATUS_IOUT. Per the
PMBus v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In
contrast, the bit is to be cleared by clearing the bits in STATUS_IOUT that cause this bit to be set.
INPUT fault or warning in STATUS_INPUT is present. Check STATUS_INPUT. Per the PMBus
v1.3 spec sections 10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast,
the bit is to be cleared by clearing the bits in STATUS_INPUT that cause this bit to be set.
An manufacturer specific fault or warning condition has occurred (over temperature fault from
Bandgap or IV_PPV1). Check STATUS_MFR_SPECIFIC. Per the PMBus v1.3 spec sections
10.2.4 and 10.2.5, this bit is not clearable through a PMBus write. In contrast, the bit is to be
cleared by clearing the bits in STATUS_MFR_SPECIFIC that cause this bit to be set.
PGOOD_Z Power is not good, and the following condition is present: output over or under voltage warning or
fault, TON_MAX_FAULT, over temperature warning or fault, over current warning or fault,
insufficient input voltage. Please refer to the FAULT RESPONSE table for the possible sources to
trigger PGOOD_Z. The signal is unlatched and always represents the current state of the device.
The factory default setting for PGOOD_Z mask bit is 1, indicating that PGOOD_Z itself cannot
trigger SMBALERT by default. If unmask PGOOD_Z bit, the SMBALERT is set not to trigger before
Power Good going high the first time, which is to avoid the device holding up SMBALERT bus when
it is not commanded to start up and PGOOD stays low.
7.5.36 STATUS_VOUT (7Ah)
The STATUS_VOUT command returns one byte of information relating to the status of the output voltage related
faults.
COMMAND
STATUS_VOUT
Format
Unsigned binary
Bit Position
Access
7
6
5
4
3
2
1
r
0
r
r/wE
r/wE
r/wE
r/wE
UVF
0
r/wE
r/wE
VOUT_MAX
_MIN_Warni TONMAXF
ng
Function
OVF
0
OVW
0
UVW
0
X
0
X
0
Default Value
0
0
Copyright © 2017–2019, Texas Instruments Incorporated
59
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
A 1 in any of these bit positions indicates that:
OVF
OVW
UVW
UVF
The device has seen the output voltage rise above the output overvoltage fault threshold
VOUT_OV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. For loop slave device, this bit is forced to 0.
The device has seen the output voltage rise above the output overvoltage warn threshold
VOUT_OV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. For loop slave device, this bit is forced to 0.
The device has seen the output voltage fall below the output undervoltage warn threshold
VOUT_UV_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. For loop slave device, this bit is forced to 0.
The device has seen the output voltage fall below the output undervoltage fault threshold
VOUT_UV_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. For loop slave device, this bit is forced to 0.
VOUT_MAX_MIN_Warning An attempt is made to program the VOUT_COMMAND in excess of the value in
VOUT_MAX or under the value in VOUT_MIN. This bit is writeable to clear and the EEPROM bit is
for SMBALERT_MASK. For loop slave device, this bit is forced to 0.
TONMAXF A TON_MAX_FAULT has occurred. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. For loop slave device, this bit is forced to 0.
7.5.37 STATUS_IOUT (7Bh)
The STATUS_IOUT command returns one byte of information relating to the status of the output current related
faults.
COMMAND
STATUS_IOUT
Format
Unsigned binary
Bit Position
Access
7
r/wE
OCF
0
6
r
5
r/wE
OCW
0
4
r
3
r
2
r
1
r
0
r
Function
X
0
X
0
X
0
X
0
X
0
X
0
Default Value
A 1 in any of these bit positions indicates that:
OCF
The device has seen the output current rise above the level set by IOUT_OC_FAULT_LIMIT. This
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.
OCW
The device has seen the output current rise above the level set by IOUT_OC_WARN_LIMIT. This
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.
7.5.38 STATUS_INPUT (7Ch)
The STATUS_INPUT command returns one byte of information relating to the status of the input-related faults of
the converter.
COMMAND
STATUS_INPUT
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
2
r
1
r
0
r
r/wE
Function
X
0
X
0
X
0
X
0
LOW_Vin
1
X
0
X
0
X
0
Default Value
A 1 in any of these bit positions indicates that:
LOW_Vin
The unit is off because of insufficient input voltage. The bit sets when the unit powers up and stays
set until the first time VIN exceeds VIN_ON. During the initial power up, LOW_Vin is not latched
and does not trigger SMBALERT. Once VIN does exceed VIN_ON for the first time, any
subsequent VIN < VIN_OFF events are latched, trigger SMBALERT. This bit is writeable to clear
and the EEPROM bit is for SMBALERT_MASK.
60
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.39 STATUS_TEMPERATURE (7Dh)
The STATUS_TEMPERATURE command returns one byte of information relating to the status of the internal
temperature related faults.
COMMAND
STATUS_TEMPERATURE
Format
Unsigned binary
Bit Position
Access
7
r/wE
OTF
0
6
r/wE
OTW
0
5
r
4
r
3
r
2
r
1
r
0
r
Function
X
0
X
0
X
0
X
0
X
0
X
0
Default Value
A 1 in any of these bit positions indicates that:
OTF
The measured internal temperature value of READ_TEMPERATURE_1 is equal to or greater than
the level set by OT_FAULT_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in
READ_TEMPERATURE_1 has fallen 20°C from the OT_FAULT_LIMIT.
OTW
The measured internal temperature value of READ_TEMPERATURE_1 is equal to or greater than
the level set by OT_WARN_LIMIT. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK. However, once cleared, the bit is set again unless the value in
READ_TEMPERATURE_1 has fallen 20°C from the OT_WARN_LIMIT.
7.5.40 STATUS_CML (7Eh)
The STATUS_CML command returns one byte of information relating to the status of the communication-related
faults of the converter.
COMMAND
Format
STATUS_CML
Unsigned binary
Bit Position
Access
7
r/wE
ivc
0
6
r/wE
ivd
0
5
r/wE
pec
0
4
3
r
2
r
1
r/wE
oth
0
0
r
r/wE
mem
0
Function
X
0
X
0
X
0
Default Value
A 1 in any of these bit positions indicates that:
ivc
An invalid or unsupported command has been received. This bit is writeable to clear and the
EEPROM bit is for SMBALERT_MASK.
ivd
An invalid or unsupported data has been received. This bit is writeable to clear and the EEPROM
bit is for SMBALERT_MASK.
pec
mem
oth
A packet error check failed. This bit is writeable to clear and the EEPROM bit is for
SMBALERT_MASK.
A fault has been detected with the internal memory. This bit is writeable to clear and the EEPROM
bit is for SMBALERT_MASK.
Some other communication fault or error has occurred. This bit is writeable to clear and the
EEPROM bit is for SMBALERT_MASK.
7.5.41 STATUS_MFR_SPECIFIC (80h)
The STATUS_MFR_SPECIFIC command returns one byte of information relating to the status of manufacturer-
specific faults or warnings.
COMMAND
Format
STATUS_MFR_SPECIFIC
Unsigned binary
Bit Position
Access
7
6
r
5
4
3
2
r
1
0
r/wE
r/wE
r
r
r
r
Function
otf_bg
illzero
illmany1s
iv_ppv1
iv_ppv0
0
is_Slave
sync_flt
Copyright © 2017–2019, Texas Instruments Incorporated
61
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
COMMAND
STATUS_MFR_SPECIFIC
Default Value
0
0
0
0
0
0
0
0
A 1 in any of these bit positions indicates that:
otf_bg
The internal temperature from bandgap is above the thermal shutdown (TSD) fault threshold. This
bit is writeable to clear and the EEPROM bit is for SMBALERT_MASK.
illzero
The operation FSM has hit an illegal ZERO state. The FSM is a one-step implementation, so all
zeros in the state is illegal and should never occur. This event is informational only and would not
trigger SMBALERT.
illmany1s The operation FSM for has hit an illegal more than one hot state. The FSM is a one-hot
implementation, so a state where multiple state bits are HI is illegal and should never occur. This
event is informational only and would not trigger SMBALERT.
iv_ppv1
The ADDR1 detection fails to resolve 4 consecutive values. To avoid initial turnon events from
clearing this condition and the user not being aware why the default ADDR1 value was used, this
bit is only clearable through the CLEAR_FAULTS command or writing a logic 1 to this bit,
essentially off and on events do not clear it as with the other standard status bits. This condition will
trigger SMBALERT.
iv_ppv0
sync_flt
The ADDR0 detection fails.
A synchronization fault. This could be because (a) Clock slave: an expected external SYNC was
never present; or present, then lost, or (b) Clock master: an internal SYNC signal is not sensed on
the SYNC pin. This bit is a live (essentially, unlatched) indicator. This event is informational only
and would not trigger SMBALERT. This bit will always read 0 if the DIS_SYNC_FLT bit is set.
7.5.42 READ_VOUT (8Bh)
The READ_VOUT commands returns two bytes of data in the linear data format that represent the output voltage
of the converter. The output voltage is sensed at the remote sense amplifier output pin so voltage drop to the
load is not accounted for. The data format is as shown below:
COMMAND
Format
READ_VOUT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Function
Mantissa
0
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.42.1 Exponent
Value fixed at 10111, Exponent for linear mode values is –9 (equivalent of 1.95 mV/count, specified in the
VOUT_MODE command).
7.5.42.2 Mantissa
Use Equation 12 to calculate the output voltage.
Exponent
OUT
V
= Mantissa´ 2
(12)
7.5.43 READ_IOUT (8Ch)
The READ_IOUT commands returns two bytes of data in the linear data format that represent the output current
of the converter. The average output current is sensed according to the method described in Low-Side MOSFET
Current Sensing and Overcurrent Protection. The data format is as shown below:
COMMAND
Format
READ_IOUT
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
62
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
COMMAND
Function
READ_IOUT
Exponent
1
Mantissa
Default Value
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
The device scales the output current before it reaches the internal analog to digital converter so that resolution of
the output current read is 62.5 mA. The maximum value that can be reported is 40 A. The user must set the
IOUT_CAL_OFFSET parameter correctly to obtain accurate results. Use Equation 13 to calculate the output
current.
Exponent
I
= Mantissa´ 2
OUT
(13)
7.5.43.1 Exponent
default: 11100 (binary) -4 (decimal) (62.5 mA LSB)
These default settings are not programmable.
7.5.43.2 Mantissa
The lower 10 bits are the result of the ADC conversion of the average output current, as indicated by the output
of the internal current sense amplifier. The 11th bit is fixed at 0 because only positive numbers are considered
valid. Any computed negative current is reported as 0 A.
7.5.44 READ_TEMPERATURE_1 (8Dh)
The READ_TEMPERATURE_1 command returns the internal die temperature in degrees Celsius.
COMMAND
Format
READ_TEMPERATURE_1
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
r
3
r
2
r
1
r
0
r
r
r
Function
Exponent
Mantissa
7.5.44.1 Exponent
default: 00000 (binary) 0 (decimal)
These default settings are not programmable.
7.5.44.2 Mantissa
The lower 11 bits are the result of the ADC conversion of the external temperature.
7.5.45 PMBUS_REVISION (98h)
The PMBUS_REVISION command returns a single, unsigned binary byte that indicates that these devices are
compatible with the 1.3 revision of the PMBus specification (Part I and Part II).
COMMAND
PMBUS_REVISION
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
Default Value
0
0
1
1
0
0
1
1
7.5.46 IC_DEVICE_ID (ADh)
Th IC_DEVICE_ID command is a read-only block-read command that returns a single word (16 bits) with the
unique device-code identifier for each device for which this device can be configured. The BYTE_COUNT field in
the block read command is 2 (indicating 2 bytes follow): low byte first, high byte second.
COMMAND
Format
IC_DEVICE_ID
Linear, binary
Copyright © 2017–2019, Texas Instruments Incorporated
63
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
COMMAND
IC_DEVICE_ID
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
5
r
4
r
3
r
2
r
1
r
0
r
r
r
Default Value
See below
The default for the device identifier code is 4623h – Code Identifier for TPSM846C23.
7.5.47 IC_DEVICE_REV (AEh)
The IC_DEVICE_REV command is a read-only block-read command that returns a single word (16 bits) with the
unique Device revision identifier. The DEVICE_REV starts at 0 with the first silicon and is incremented with each
subsequent silicon revision. The BYTE_COUNT field in the Block Read command is 2 (indicating 2 bytes follow):
low byte first, high byte second.
COMMAND
Format
IC_DEVICE_REV
Linear, tbinary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
r
Default Value
See below
The default of the device identifier code is 0001b.
7.5.48 MFR_SPECIFIC_00 (D0h)
The MFR_SPECIFIC_00 command is dedicated as a user scratch pad. Only the lower 8 bits are writeable for
users. This is a read word command, with only the lower 8 bits accessible. This command is not a read byte
command. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL
command.
COMMAND
Format
MFR_SPECIFIC_00
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
6
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
Function
User scratch pad
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7.5.49 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
The VREF_TRIM command applies a fixed offset voltage to the Error Amplifier reference (EA_REF) voltage. It is
most typically used to trim the output voltage at the time the PMBus device is assembled into the end user’s
system. The contents of this register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL
command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The settings of the VOUT_MODE command determine the effect of VREF_TRIM command. In this device, the
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal).
EA_REF = [(VOUT_COMMAND × VOUT_SCALE_LOOP) + (VREF_TRIM + STEP_VREF_MARGIN_HIGH ×
OPERATION[5] + STEP_VREF_MARGIN_LOW × OPERATION[4])] × 1.953 mV
(14)
The maximum trim ranges between –64*1.953 mV to +63*1.953 mV in 1.953-mV steps.
If a value outside this range is given with this command, the device sets the reference voltage to the upper or
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE
and the invalid data bit in STATUS_CML.
The value of EA_REF including VREF_TRIM is also limited by the values of VOUT_MAX, VOUT_MIN,
VOUT_COMMAND, VOUT_SCALE_LOOP and STEP_VREF_MARGIN_HIGH/LOW. See VOUT_MAX and
VOUT_MIN for additional details.
The EA_REF voltage transition occurs at the rate determined by the current state:
64
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
•
•
•
•
Soft-Start: TON_RISE command
Steady-State: VOUT_TRANSITION_RATE command
TOFF_DELAY: VOUT_TRANSITION_RATE command
Soft-Stop: TOFF_FALL command
The VREF_TRIM has two data bytes formatted as two’s complement binary integer and can have positive and
negative values.
COMMAND
Format
VREF_TRIM
Linear, two’s complement binary
Bit Position
Access
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
Function
High Byte
Low Byte
Default Value
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
High Byte:
default: 0000 0000 (binary) 0 (decimal)
Minimum: 1111 1111 (binary) (sign extended)
Maximum: 0000 0000 (binary) (sign extended)
Low Byte:
default: 0000 0000 (binary) 0 (decimal)
Minimum: 1100 0000 (binary) –64 (decimal) (–125 mV) (sign extended, two's compliment)
Maximum: 0011 1111 (binary) 63 (decimal) (123 mV)
7.5.50 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
The STEP_VREF_MARGIN_HIGH command, specifing a positive offset voltage on EA_VREF, is used to
increase the reference voltage by shifting the reference higher. When the OPERATION command is set to
Margin High, the output will increase by the voltage indicated by this command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The effect of this command is determined by the settings of the VOUT_MODE command. In this device, the
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal). The actual reference voltage commanded by a
margin high command can be found in Equation 14.
The margin high range is between 0 and 31 × 1.953 mV in 1.953-mV steps.
If a value outside this range is given with this command, the device sets the reference voltage to the upper or
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE
and the invalid data bit in STATUS_CML.
The value of EA_REF including STEP_VREF_MARGIN_HIGH is also limited by the values of VOUT_MAX,
VOUT_MIN, VOUT_COMMAND, VOUT_SCALE_LOOP and VREF_TRIM. See VOUT_MAX and VOUT_MIN for
additional details.
The EA_REF voltage transition occurs at the rate determined by the current state:
•
•
•
•
Soft-Start: TON_RISE command
Steady-State: VOUT_TRANSITION_RATE command
TOFF_DELAY: VOUT_TRANSITION_RATE command
Soft-Stop: TOFF_FALL command
COMMAND
Format
STEP_VREF_MARGIN_HIGH
Linear, two's complement binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
r
4
3
2
1
0
r/w
r/w
r/w
r/w
r/w
Function
High Byte
Low Byte
Copyright © 2017–2019, Texas Instruments Incorporated
65
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
High Byte:
default: 0000 0000 (binary) 0 (decimal)
Low Byte:
Minimum: 0000 0000 (binary) 0 (decimal) (0 mV)
Maximum: 0001 1111 (binary) 31 (decimal) (60.5 mV)
The read-writeable bits in this register do NOT have direct EEPROM backup; however, the register does restore
to one of two configurable values as determined by RSMHI_VAL in (E5h) MFR_SPECIFIC_21 (OPTIONS).
•
•
RSMHI_VAL = 0: STEP_VREF_MARGIN_HIGH will restore to 0009h (9 decimal or 17.6 mV).
RSMHI_VAL = 1: STEP_VREF_MARGIN_HIGH will restore to 000fh (15 decimal or 29.3 mV).
7.5.51 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
The STEP_VREF_MARGIN_LOW command, specifying a negative offset voltage on EA_VREF, is used to
decrease the reference voltage by shifting the reference lower. When the OPERATION command is set to
Margin Low, the output will decrease by the voltage indicated by this command.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The effect of this command is determined by the settings of the VOUT_MODE command. In this device, the
VOUT_MODE is fixed to Linear with an exponent of –9 (decimal). The actual reference voltage commanded by a
margin low command can be found in Equation 14.
The margin low range is between -64*1.953 mV and -1*1.953 mV in 1.953-mV steps.
If a value outside this range is given with this command, the device sets the reference voltage to the upper or
lower limit depending on the direction of the setting, asserts SMBALERT and sets the CML bit in STATUS_BYTE
and the invalid data bit in STATUS_CML.
The value of EA_REF including STEP_VREF_MARGIN_LOW is also limited by the values of VOUT_MAX,
VOUT_MIN, VOUT_COMMAND, VOUT_SCALE_LOOP and VREF_TRIM. See VOUT_MAX and VOUT_MIN for
additional details.
The EA_REF voltage transition occurs at the rate determined by the current state:
•
•
•
•
Soft-Start: TON_RISE command
Steady-State: VOUT_TRANSITION_RATE command
TOFF_DELAY: VOUT_TRANSITION_RATE command
Soft-Stop: TOFF_FALL command
COMMAND
STEP_VREF_MARGIN_LOW
Linear, two's complement binary
Format
Bit Position
Access
7
6
r
5
r
4
r
3
r
2
r
1
r
0
r
7
r
6
r
5
4
3
2
1
0
r/w
r/w
r/w
r/w
r/w
r/w
r/w
Function
High Byte
Low Byte
High Byte:
default: 1111 1111 (binary) (MSB is sign bit, sign extended)
Low Byte:
Minimum: 1100 0000 (binary) –64 (decimal) (–125 mV)
Maximum: 1111 1111 (binary) –1 (decimal) (–2 mV)
The read-writeable bits in this register do NOT have direct EEPROM backup; however, the register does restore
to one of two configurable values as determined by RSMLO_VAL in (E5h) MFR_SPECIFIC_21 (OPTIONS).
•
•
RSMLO_VAL = 0: STEP_VREF_MARGIN_LOW will restore to fff7h (–9 decimal or –17.6 mV)
RSMLO_VAL = 1: STEP_VREF_MARGIN_LOW will restore to fff1h (–15 decimal or –29.3 mV)
66
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.52 PCT_OV_UV_WRN_FLT_LIMITS (MFR_SPECIFIC_07) (D7h)
The PCT_OV_UV_WRN_FLT_LIMITS command is used to set the PGOOD, VOUT_UNDER_VOLTAGE (UV)
and VOUT_OVER_VOLTAGE (OV) limits as a percentage of nominal.
For loop slave device, this command cannot be accessed. Any writes to this command will be ignored. An
attempt to read or write this command will result in a NACK’d command, the reporting of an IVC fault, and
triggering of SMB_ALERT.
The PCT_OV_UV_WRN_FLT_LIMITS takes a one byte data formatted as shown below:
COMMAND
PCT_OV_UV_WRN_FLT_LIMITS
Format
Unsigned binary
Bit Position
Access
7
r
6
r
5
r
4
r
3
r
2
r
1
r/wE
0
r/wE
Function
X
0
X
0
X
0
X
0
X
0
X
0
PCT_MSB
0
PCT_LSB
0
Default Value
The PGOOD, VOUT_UNDER_VOLTAGE (UV) and VOUT_OVER_VOLTAGE (OV) settings are shown in
Table 16, as a percentage of nominal reference voltage on the FB pin.
Table 16. OV/UV Protection Settings (Typical Values)
PCT_MSB
PCT_LSB
UV FAULT
–83%
UV WARN
–88%
OV WARN
112%
OV FAULT
117%
UNIT
0
0
1
1
0
1
0
1
EA_REF
EA_REF
EA_REF
EA_REF
–88%
–90%
110%
112%
–72%
–78%
112%
117%
–58%
–64%
112%
117%
The PGOOD pin may trip if the output voltage is too high (using OV WARN) or too low (using UV WARN).
Additionally, the PGOOD pin has hysteresis. When the OV WARN output voltage OV WARN is tripped, the FB
voltage must lower below the 105% of EA_REF, before PGOOD is reset. Likewise, when output voltage UV
WARN is tripped, the FB voltage must rise above 95% of EA_REF, before PGOOD is reset.
7.5.53 OPTIONS (MFR_SPECIFIC_21) (E5h)
The OPTIONS register can be used for setting user selectable options, as shown below. The contents of this
register can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
COMMAND
Format
OPTIONS
Unsigned binary
0
Bit Position
7
r
6
5
4
3
2
1
7
6
5
4
3
2
1
0
r/w r/w
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
Access
r/w
r/w
r/w
E
E
RST_VOUT
_
AVG_
PROG[1:
0]
RSMHI_ RSMLO_
READ_VOUT_ EN_AUTO_
EN_ADC_ EN_RESET_
DIS_
NEGILIM
Function
X
0
x
x
DLO VSM
VAL
VAL
RANGE[1:0]
ARA
CNTL
B
oSD
Default
Value
0
0
1
0
0
0
0
1
0
0
0
0
1
0
0
7.5.53.1 DIS_NEGILIM Bit
When set, this bit disables the negative current limit protection on the LFET.
7.5.53.2 EN_RESET_B Bit
When set, this bit enables the RESET_B functionality of the RESET/PGD pin.
BIT VALUE
ACTION
0
1
RESET/PGD pin = PGOOD
RESET/PGD pin = RESET_B
Copyright © 2017–2019, Texas Instruments Incorporated
67
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.53.3 EN_ADC_CNTL Bit
This bit enables ADC operation used for voltage, current and temperature monitoring.
BIT VALUE
ACTION
0
1
Disable ADC operation
Enable ADC operation
NOTE
The EN_ADC_CNTL bit must be set to enable output voltage, current and temperature
telemetry. When the EN_ADC_CNTL bit is zero, the READ_VOUT, READ_IOUT and
READ_TEMPERATURE_2 registers do not update continuously, and retain the previous
values from the last time EN_ADC_CNTL was set.
7.5.53.4 VSM Bit
This bit configures the measurement system for fast, VOUT-only measurement mode. Setting this bit disables
READ_IOUT, and READ_TEMPERATURE_1, and instead allows the device to update READ_VOUT more
frequently. This bit does not have EEPROM backup.
BIT VALUE
ACTION
0
1
Measure VOUT, temperature, and IOUT
Measure only VOUT
NOTE
For READ_VOUT, multiple samples (defined by AVG_PROG[1:0] Bits) are obtained and
averaged. When entering and exiting VSM mode, the first calculated result could lose one
sample, for example, 7 sampled value but averaged by 8, resulting the first updated
READ_VOUT data point have worst case error about 1/8 of the nominal value.
7.5.53.5 DLO Bit
This bit allows bypassing the normal valid data checks on register writes. This feature is included for flexibility
during debug to quickly generate fault conditions and/or possibly work around any data limit protection
mechanisms prohibiting output voltage programming. This bit does not have EEPROM backup.
BIT VALUE
ACTION
0
Normal PMBus data write restrictions
Data write restrictions are overridden for the following registers: SMBALERT_MASK,
VOUT_COMMAND, VOUT_SCALE_LOOP, VREF_TRIM,
1
STEP_VREF_MARGIN_HIGH, STEP_VREF_MARGIN_LOW,
IOUT_OC_FAULT_LIMIT, IOUT_OC_WARN_LIMIT, OT_FAULT_LIMIT,
OT_WARN_LIMIT, VOUT_MIN, VOUT_MAX, VIN_ON, VIN_OFF, and OPERATION.
NOTE
CAUTION: Users should use this bit with extreme caution. Setting this bit allows invalid
data conditions to be programmed into the device which can lead to damage. Invalid data
written into any register when DLO is enabled does NOT set the IVD bit; nor trigger
SMBALERT. The invalid data is simply allowed to be programmed. Furthermore, invalid
data programmed into a command/status register while DLO is enabled, does not trigger
SMBALERT upon deassertion of DLO. So, it is possible to exit DLO mode with invalid
data in command/status registers. Use with extreme caution.
68
Copyright © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.53.6 AVG_PROG[1:0] Bits
These bits configure programmable digital measurement averaging. Bits provide programmable averaging for
current (READ_IOUT), temperature (READ_TEMPERATURE_1), and voltage (READ_VOUT). The default (00b)
yields 16x averaging for all three parameters; however, this default can be changed and stored in EEPROM, if
necessary. The programming options are as follows:
BIT VALUE
ACTION
00
Accumulating Averaging = 16x
Accumulating Averaging = 0x. Use this setting to bypass the averagers. Every sample
from measurement system updates corresponding READ_XXX CSR.
01
10
11
Accumulating Averaging = 8x
Accumulating Averaging = 32x
7.5.53.7 EN_AUTO_ARA Bit
This bit enables auto-alert response address response. When this feature is enabled, and after the device has
successfully responded to an ARA transaction, the hardware automatically masks any fault source currently set
from reasserting SMBALERT. This prevents PMBus bus hogging in the case of a persistent fault in a device that
consistently wins ARA arbitration because of the device address. In contrast, when this bit is cleared, immediate
reassertion of SMBALERT is allowed in the event of a persistent fault and the responsibility is upon the host to
mask each source individually.
7.5.53.8 READ_VOUT_RANGE[1:0] Bits
The ADC input voltage range is limited to 0.9 V. For READ_VOUT, the output voltage is divided down before
input to ADC. Large signal amplitude gives better signal-to-noise ratio. The READ_VOUT_RANGE[1:0] bits are
used to force the input voltage divider of the internal ADC for output voltage measurement to one of the 3
possible values.
VOUT_SCALE_LOOP
READ_VOUT_RANGE[1:0]
OUT
1
x
00b
11b
00b
10b
00b
01b
1/2 IN
0.5
x
1/4 IN
1/8 IN
0.25
x
7.5.53.9 RST_VOUT_oSD Bit
When set high, this bit is used to force VOUT_COMMAND to the default value upon any shutdown or fault
condition:
•
•
•
•
FAULT with programmed shutdown response
FAULT with programmed restart response
Normal, controlled shutdown (e.g. CNTL pin)
LOW_VIN
7.5.53.10 RSMLO_VAL Bit
The restore step-margin low-value (RSMLO_VAL) bit is used to configure the default restore value for (D6h)
MFR_SPECIFIC_06 (STEP_VREF_MARGIN_LOW).
BIT VALUE
ACTION
0
1
STEP_VREF_MARGIN_LOW will restore to fff7h (–9 decimal or –17.6 mV)
STEP_VREF_MARGIN_LOW will restore to fff1h (–15 decimal or –29.3 mV)
Copyright © 2017–2019, Texas Instruments Incorporated
69
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
7.5.53.11 RSMHI_VAL Bit
This restore step margin high value (RSMHI_VAL) bit is used to configure the default restore value for (D5h)
MFR_SPECIFIC_05 (STEP_VREF_MARGIN_HIGH).
BIT VALUE
ACTION
0
1
STEP_VREF_MARGIN_HIGH will restore to 0009h (9 decimal or 17.6 mV)
STEP_VREF_MARGIN_HIGH will restore to 000fh (15 decimal or 29.3 mV)
7.5.54 MISC_CONFIG_OPTIONS (MFR_SPECIFIC_32) (F0h)
This user-accessible register is used for miscellaneous options, as shown below. The contents of this register
can be stored to nonvolatile memory using the STORE_DEFAULT_ALL command.
COMMAND
Format
MISC_CONFIG_OPTIONS
Unsigned binary
Bit Position
7
r
6
r
5
r
4
r
3
r
2
r
1
r
0
7
6
5
r
4
3
r
2
1
0
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
r/wE
Access
FORCE_SYNC_
IN
Function
X
0
X
0
X
0
X
0
X
0
X
0
X
0
SYNC_FAULT_DIS
1
FORCE_SYNC_OUT
0
X
0
EN_AVS_USER
1
X
0
HSOC_USER_TRIM[1:0]
OV_RESP_SEL
1
Default
Value
1
0
1
7.5.54.1 OV_RESP_SEL Bit
This bit selects between two options for low-side FET behavior after an output overvoltage fault condition.
Regardless of the setting of this bit, the low-side FET latches on when an output OV fault is detected (if the
OV_FAULT_RESPONSE is not programmed to ignore).
BIT VALUE
ACTION
The low-side FET remains on until either the part initiates a new startup of the output
voltage or the CLEAR_FAULTS command is given while the part is in the DISABLE
operational state
0
1
The low-side FET turns off as soon as the sensed output (at FB pin) drops below 0.2 V.
7.5.54.2 HSOC_USER_TRIM[1:0] Bits
These trim bits are provided so the user can adjust the HSOC threshold to account for the application-specific
requirements for input-voltage sensing parasitics and component-current handling. The bit settings are defined
as follows:
BIT VALUE
ACTION
00
01
10
11
HSOC change from default = 0
HSOC change from default = 12.5%
HSOC change from default = –25%
HSOC change from default = –12.5%
7.5.54.3 EN_AVS_USER Bit
Setting this bit high is required enabling the COMP-level shifter that eliminates overshoot and undershoot of VOUT
when the reference is ramped. The value of this bit is latched when the driver is enabled to switch which
prevents the user from enabling or disabling the level shifter while the output is switching.
7.5.54.4 FORCE_SYNC_OUT Bit
This bit forces the device to output the free-running clock on the SYNC pin.
7.5.54.5 FORCE_SYNC_IN Bit
This bit forces the device to be synchronized to an external PWM clock applied on the SYNC pin.
70
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
7.5.54.6 SYNC_FAULT_DIS Bit
When set, this bit disables any reporting (digital status) and response (analog and digital) to SYNC_FAULT.
版权 © 2017–2019, Texas Instruments Incorporated
71
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Typical Application
The TPSM846C23 is a highly integrated, synchronous step-down DC-DC power module that supports PMBus
commands. The TPSM846C23 converts a higher DC-input voltage to a lower DC-output voltage, with a
maximum output current of 35 A. Use the following design procedure to select key component values and set the
appropriate behavioral options through the PMBus.
TPSM846C23MOL
4
VS+
37
38
39
40
41
55
44
45
46
53
VIN
VIN
VIN
VIN
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VIN
VOUT
49
BP6
C1
C2
C3
C4
C5
C10
C11
C12
C13
C14
C15
+
+
C6
+
32
33
34
35
36
56
57
58
4.7 ꢀF
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
22 ꢀF
22 ꢀF
22 ꢀF
22 ꢀF
47 ꢀF
47 ꢀF
47 ꢀF
47 ꢀF
330 ꢀF
48
470 ꢀF
470 ꢀF
BP6_RTN
42
43
54
59
PGND
PGND
PGND
PGND
PGND
PGND
50
51
47
VINBP
BP_RTN
BP3
C7
C8
5
VS-
1 ꢀF
10 nF
22
23
24
25
26
27
28
29
PH
PH
PH
PH
PH
PH
PH
PH
C9
2.2 ꢀF
8
21
30
31
DNC
DNC
DNC
DNC
6
DIFFO
R1
10 kꢁ
R2
10 kꢁ
3
2
VSHARE
ISHARE
R
COMP
C
COMP
52
11
18
19
20
12
16
17
PGOOD
PGOOD
7
FB
COMP
RT
SYNC
DATA
9
PMBus DATA
R
SET
13
14
CLK
PMBus CLK
RT_SEL
ALERT
CNTL
PMBus ALERT
10
15
1
AGND
NC
CNTL
ADDR1
ADDR0
NC
U1
R3
R4
Copyright © 2017, Texas Instruments Incorporated
图 19. Typical Application Schematic
72
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
Typical Application (接下页)
8.1.1 Design Requirements
For this design example, use the parameters listed in 表 17 and follow the Detailed Design Procedure.
表 17. Design Parameters
DESIGN PARAMETER
Input voltage VIN
VALUE
12 V typical
Output voltage VOUT
Output current rating
Key care-abouts
1.2 V
35 A
PMBus control, small footprint, high efficiency, PGOOD signal
8.1.2 Detailed Design Procedure
8.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPSM846C23 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
8.1.2.2 Setting the Output Voltage
The output voltage of the TPSM846C23 is designed to be set via the PMBus using the VOUT_COMMAND (21h).
VOUT_COMMAND value = (desired VOUT × 512)
(15)
To set the output voltage to 1.2 V, using 公式 15, the calculated VOUT_COMMAND value is 614, which
converted to hex is 266h. This value can be written to RAM using the VOUT_COMMAND and saved as the new
default value to non-volatile memory using the STORE_DEFAULT_ALL command.
The actual output voltage is also dependant on the value of VOUT_SCALE_LOOP (29h) and the presence of a
resistor, RSET. Because the desired output voltage is between 0.35 V and 1.65 V (VOUT_SCALE_LOOP = 1), the
RSET resistor must be left open.
版权 © 2017–2019, Texas Instruments Incorporated
73
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
8.1.2.3 Input and Output Capacitance
The minimum required input capacitance network consists of four 22-µF (or two 47-µF) ceramic capacitors plus a
330-µF bulk capacitor. The minimum required output capacitance network consists of four 47-µF (or two 100-µF)
ceramic capacitors plus two 470-µF, low ESR polymer capacitors. The combined ESR of the polymer capacitors
must not be greater than 5 mΩ. Additional input and output capacitors can be added to improve ripple or
transient response.
In this design example, the minimum required input and output capacitance is used.
8.1.2.4 Selecting the Compensation Components
The TPSM846C23 requires an external series resistor and capacitor compensation network to be connected
between the DIFFO pin (pin 6) and the FB pin (pin 7). The value of these components is determined by the total
amount of output capacitance.
In this design example, the value of RCOMP and CCOMP is selected from 表 3 based on the total amount of output
capacitance of 1120 µF. RCOMP = 1.0 kΩ and CCOMP = 1000 pF.
8.1.2.5 Setting the Switching Frequency
The TPSM846C23 is set to a default switching frequency of 500 kHz. To operate the TPSM846C23 at the default
switching frequency, connect the RT_SEL pin (pin 14) to AGND and the RT pin (pin 13) must be left open.
In this design example, the switching frequency is selected to operate at the default switching frequency of
500 kHz by connecting RT_SEL pin to AGND, and the RRT resistor is left open.
8.1.2.6 Power Good (PGOOD)
Applications requiring voltage rail sequencing can benefit from the PGOOD signal present with the
TPSM846C23. The PGOOD pin is an open-drain output. When the output voltage is typically between 95% and
105% of the setpoint, the PGOOD pin pulldown is released, and the pin floats, requiring an external pullup
resistor for a high signal. A 10-kΩ pullup resistor is placed between the PGOOD pin and the BP3 rail.
8.1.2.7 ON/OFF Control (CNTL)
The CNTL signal is an input signal on the PMBus. It is used to turn the power conversion function of the module
on and off in conjunction with commands received over the bus. It can be configured as an active high or active
low signal through the ON_OFF_CONFIG command. The CNTL signal is programmed at the factory to be an
active high signal; that is, the CNTL pin must be pulled high for power conversion to occur. The CNTL pin
requires an external pullup resistor for a high signal. A 10-kΩ pullup resistor is placed between the CNTL pin and
the BP3 rail.
74
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
8.1.3 Application Curves
VIN = 12 V
VOUT = 1.2 V
图 20. Start-up Waveforms
IOUT = 10 A
VIN = 12 V
VOUT = 1.2 V
IOUT = 10 A
图 21. Shutdown Waveform
版权 © 2017–2019, Texas Instruments Incorporated
75
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
9 Power Supply Recommendations
The TPSM846C23 device is designed to operate from an input voltage supply between 4.5 V and 15 V. This
supply must be well regulated. These devices are not designed for split-rail operation. Proper bypassing of input
supplies and internal regulators is also critical for noise performance, as is PCB layout and grounding scheme.
See the recommendations in Layout.
76
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
10 Layout
10.1 Layout Guidelines
Layout is critical for good power-supply design. 图 22 and 图 23 show top-side and bottom-side PCB-layout
configuration for recommended component placement. Additional power, ground and signal layers are present in
any PCB design. A list of PCB layout considerations using these devices is listed as follows:
•
•
•
•
•
•
Place the input bypass capacitors as close as physically possible to the VIN and PGND pins. Additionally, a
high-frequency bypass capacitor on the VIN pins can help reduce switching spikes. Place this capacitor on
the bottom side of the PCB directly underneath the device to keep a minimum loop.
The BP6 bypass capacitor carries a large switching current for the gate driver. Bypassing the BP6 pin to
BP6_RTN with a low-impedance path is very critical to the stable operation of the TPSM846C23 device.
Place the BP6 high-frequency bypass capacitor as close as possible to the device pins 48 and 49.
The VINBP and BP3 pins also require good local bypassing. Place bypass capacitors as close as possible to
the device pins and BP_RTN. Poor bypassing on the VINBP and BP3 pins can degrade the performance of
the device.
Place signal components as close as possible to the pins to which they are connected. These components
include the feedback resistors and the RT resistor. Keep these components from fast switching voltage and
current paths. Terminate these components to AGND with a minimum return loop.
Route the VS+ and VS– lines from the output capacitor bank at the load back to the device pins as a tightly
coupled differential pair. These traces must be kept away from switching or noisy areas which can add
differential-mode noise.
Use caution when routing of the SYNC, VSHARE and ISHARE traces for parallel configurations. The SYNC
trace carries a rail-to-rail signal and must be routed away from sensitive analog signals, including the
VSHARE, ISHARE, RT, and FB signals. The VSHARE and ISHARE traces must also be kept away from fast
switching voltages or currents formed by the VIN, PH, and BP6 pins.
10.2 Layout Example
图 22. PCB Top-side Layout Recommendation
版权 © 2017–2019, Texas Instruments Incorporated
77
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
Layout Example (接下页)
图 23. PCB Bottom-side Layout Recommendation
78
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
10.3 Package Specifications
TPSM846C23
VALUE
UNIT
Weight
3.92
grams
Flammability
Meets UL 94 V-O
MTBF Calculated Reliability
Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign
26.6
MHrs
10.4 EMI
The TPSM846C23 is compliant with EN55022 Class A radiated emissions. 图 24 to 图 27 show typical examples
of radiated emissions plots for the TPSM846C23. The EMI plots were taken using the TPSM846C23 EVM with a
resistive load and input power was provided using a lead acid battery. All graphs show plots of the antenna in the
horizontal and vertical positions.
图 24. Radiated Emissions 12-V Input, 1.2-V Output,
35-A Load Vertical Antenna
图 25. Radiated Emissions 12-V Input, 1.2-V Output,
35-A Load Horizontal Antenna
版权 © 2017–2019, Texas Instruments Incorporated
79
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
EMI (接下页)
图 26. Radiated Emissions 5-V Input, 1.2-V Output,
35-A Load Vertical Antenna
图 27. Radiated Emissions 5-V Input, 1.2-V Output,
35-A Load Horizontal Antenna
80
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
10.5 Mounting and Thermal Profile Recommendation
Proper mounting technique adequately covers the exposed thermal pad with solder. Excessive heat during the
reflow process can affect electrical performance. 图 28 shows the recommended reflow-oven thermal profile.
Proper post-assembly cleaning is also critical to device performance. Refer to Power Module MSL Ratings and
Reflow Ratings for more information.
tP
TP
TL
TS(max)
TS(min)
tL
rRAMP(up)
rRAMP(down)
tS
t25P
Time (s)
25
图 28. Recommended Reflow-Oven Thermal Profile
表 18. Recommended Thermal Profile Parameters
PARAMETER
MIN
TYP
MAX
UNIT
RAMP UP AND RAMP DOWN
rRAMP(up)
Average ramp-up rate, TS(max) to TP
Average ramp-down rate, TP to TS(max)
3
6
°C/s
°C/s
rRAMP(down)
PRE-HEAT
TS
Preheat temperature
150
60
200
120
°C
s
tS
Preheat time, TS(min) to TS(max)
REFLOW
TL
TP
tL
Liquidous temperature
217
°C
°C
s
Peak temperature
260
150
30
Time maintained above liquidous temperature, TL
Time maintained within 5°C of peak temperature, TP
Total time from 25°C to peak temperature, TP
60
20
tP
s
t25P
480
s
版权 © 2017–2019, Texas Instruments Incorporated
81
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 使用 WEBENCH® 工具创建定制设计
请单击此处,借助 WEBENCH® Power Designer 并使用 TPSM846C23 器件创建定制设计方案。
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化该设计的关键参数,如效率、尺寸和成本。
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下,可执行以下操作:
•
•
•
•
运行电气仿真,观察重要波形以及电路性能
运行热性能仿真,了解电路板热性能
将定制原理图和布局方案以常用 CAD 格式导出
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息,请访问 www.ti.com.cn/WEBENCH。
11.2 文档支持
11.2.1 相关文档
请参阅如下相关文档:
•
•
《PMB 电源管理协议规范》第 1 部分,修订版 1.3 在 http://pmbus.org 上可以找到
TI 用户指南《TPSM846C23 并联工作》
11.3 接收文档更新通知
要接收文档更新通知,请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我进行注册,即可每周接收产
品信息更改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
11.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范,
并且不一定反映 TI 的观点;请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中,您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.5 商标
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
PMBus is a trademark of SMIF, Inc..
All other trademarks are the property of their respective owners.
11.6 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损
伤。
11.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
82
版权 © 2017–2019, Texas Instruments Incorporated
TPSM846C23
www.ti.com.cn
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更,恕不另行通知,且
不会对此文档进行修订。如需获取此数据表的浏览器版本,请查阅左侧的导航栏。
12.1 Tape and Reel Information
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
Reel
Diameter
(mm)
Reel
Width W1
(mm)
Package
Type
Package
Drawing
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Device
Pins
SPQ
TPSM846C23MOLR
QFM
MOL
59
350
330.0
32.4
15.35
16.35
6.1
24.0
32.0
Q1
版权 © 2017–2019, Texas Instruments Incorporated
83
TPSM846C23
ZHCSG68F –MARCH 2017–REVISED JANUARY 2019
www.ti.com.cn
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
Device
Package Type
Package Drawing Pins
MOL 59
SPQ
Length (mm) Width (mm)
383.0 353.0
Height (mm)
TPSM846C23MOLR
QFM
350
58.0
84
版权 © 2017–2019, Texas Instruments Incorporated
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等,TI对此概不负责,并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122
Copyright © 2019 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
22-May-2019
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
TPSM846C23MOLR
ACTIVE
QFM
MOL
59
350
RoHS Exempt
& Green
NIAU
Level-3-260C-168 HR
-40 to 105
TPSM846C23
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPSM846C23MOLR
QFM
MOL
59
350
330.0
32.4
15.35 16.35
6.1
24.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
QFM MOL 59
SPQ
Length (mm) Width (mm) Height (mm)
383.0 353.0 58.0
TPSM846C23MOLR
350
Pack Materials-Page 2
PACKAGE OUTLINE
MOL0059A
QFM - 6.4 mm max height
S
C
A
L
E
0
.
8
0
0
PLASTIC QUAD FLAT MODULE
15.1
14.9
A
B
PIN 1 INDEX AREA
16.1
15.9
6.4 MAX
C
SEATING PLANE
0.08 C
4X 2.85 0.05
2X 8
20X 0.8
4X
2.2
PKG
15
27
PKG
59
58
57
56
55
4X 3.2
4X 2.55 0.05
24X 0.8
14
28
2.6
53
4.27
54
3.3
59
58
57
56
2X 9.6
0.000
PKG
2
1.24
53
1.1
55
54
3.7
THERMAL PAD DETAIL
5.1
2
1
5.45
TOLERANCE 0.05
0.5
0.3
48X
0.1
C A B
52
41
0.6
0.4
0.05
48X
(0.05) TYP
4223441/C 08/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
MOL0059A
QFM - 6.4 mm max height
PLASTIC QUAD FLAT MODULE
(1.24)
(1.1)
4X (2.85)
(2)
48X (0.5)
46
52
(7.7)
4X (2.55)
(6.4)
(5.45)
1
2
(3.3)
(5.1)
(4.9)
(4.775)
(4.27)
(3.7)
(2.6)
55
54
48X (0.4)
53
4X (2.2)
SOLDER MASK
OPENING
TYP
59
58
57
56
COPPER
KEEP-OUT AREA
4X 0.5 X 0.85
4X (3.2)
0.000 PKG
32
2X
(0.35)
(0.45)
(0.8) TYP
METAL UNDER
SOLDER MASK
TYP
(R0.05) TYP
14
15
28
27
4X (6.675)
(7.7)
26
16
LAND PATTERN EXAMPLE
SEE NEXT PAGE FOR VIA DIMENSIONS
SCALE: 6X
0.07 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK DETAILS
SOLDER MASK DEFINED PADS
4223441/C 08/2017
NOTES: (continued)
4. This package is designed to be soldered to the thermal pads on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE BOARD LAYOUT
MOL0059A
QFM - 6.4 mm max height
PLASTIC QUAD FLAT MODULE
2X (1.088)
2X (0.938)
(7.3)
41
SOLDER MASK OPENING
TYP
(6.675)
(
0.2) TYP
VIA
(5.45)
4X (5.2)
54
(5.1)
53
55
4X (1)
(3.7)
(3.3)
(0.59) TYP
2X (0.75)
SOLDER MASK
OPENING
TYP
(1.7) TYP
57
56
59
58
0.000 PKG
(0.8) TYP
(1.7) TYP
(1.3) TYP
(R0.05) TYP
METAL UNDER
SOLDER MASK
TYP
LAND PATTERN EXAMPLE
VIA DETAIL
SCALE: 10X
4223441/C 08/2017
www.ti.com
EXAMPLE STENCIL DESIGN
MOL0059A
QFM - 6.4 mm max height
PLASTIC QUAD FLAT MODULE
2X (1.2)
METAL UNDER
SOLDER MASK
TYP
2X (1.04)
SOLDER MASK
OPENING
TYP
52
(7.7)
(6.224)
41
(6.075)
1
2
2X (1.147)
(4.677)
2X (1.75) (4.125)
(4.374)
53
54
48X (0.4)
48X (0.5)
(3.027)
2X (1.347)
55
59
2X (1.744)
(0.795)
0.000
PKG
16X (1.39)
16X (0.98)
(0.795)
(0.8) TYP
58
57
56
(R0.05) TYP
16X (1.26)
16X (1.14)
28
27
14
15
8X (6.005)
8X (7.345)
(7.7)
16
26
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
PADS 1,15,27 & 41: 76%
PAD 53: 79%
PADS 54 - 59: 77%
SCALE: 8X
4223441/C 08/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务,TI 对此概不负责。
TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款
的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122
Copyright © 2021 德州仪器半导体技术(上海)有限公司
相关型号:
©2020 ICPDF网 联系我们和版权申明