TRSF3221E_V01 [TI]
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION;
| 型号： | TRSF3221E_V01 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER WITH ±15-kV IEC ESD PROTECTION 驱动 |
| 文件： | 总21页 (文件大小：893K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
FEATURES
DB OR PW PACKAGE
•
ESD Protection for RS-232 Pins
(TOP VIEW)
–
–
–
±15-kV Human-Body Model (HBM)
EN
C1+
V+
FORCEOFF
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
±8-kV IEC 61000-4-2 Contact Discharge
±15-kV IEC 61000-4-2 Air-Gap Discharge
V
CC
GND
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 1 Mbit/s
C1−
C2+
C2−
V−
DOUT
FORCEON
DIN
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
INVALID
ROUT
RIN
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using HBM
•
Auto-Powerdown Feature Automatically
Disables Drivers for Power Savings
APPLICATIONS
•
Battery-Powered, Hand-Held, and Portable
Equipment
•
•
•
•
PDAs and Palmtop PCs
Notebooks, Sub-Notebooks, and Laptops
Digital Cameras
Mobile Phones and Wireless Devices
DESCRIPTION/ORDERING INFORMATION
The TRSF3221E consists of one line driver, one line receiver, and a dual charge-pump circuit with ±15-kV IEC
ESD protection pin to pin (serial-port connection pins, including GND). The TRSF3221E provides the electrical
interface between an asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3221E operates
at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/μs to 150 V/μs.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the TRSF3221E does not sense a valid RS-232 signal on the receiver input, the driver output is
disabled. If FORCEOFF is set low and the enable (EN) input is high, both the driver and receiver are shut off,
and the supply current is reduced to 1 μA. Disconnecting the serial port or turning off the peripheral drivers
causes the auto-powerdown condition to occur. Auto-powerdown can be disabled when FORCEON and
FORCEOFF are high. With auto-powerdown enabled, the device is activated automatically when a valid signal is
applied to the receiver input. The INVALID output notifies the user if an RS-232 signal is present at the receiver
input. INVALID is high (valid data) if the receiver input voltage is greater than 2.7 V or less than –2.7 V, or has
been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid data) if the receiver input voltage is
between –0.3 V and 0.3 V for more than 30 μs. See Figure 5 for receiver input levels.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRSF3221ECDBR
TRSF3221ECPW
TOP-SIDE MARKING
SSOP – DB
TSSOP – PW
SSOP – DB
TSSOP – PW
Reel of 2000
RT21EC
0°C to 70°C
Tube of 90
RT21EC
RT21EI
RT21EI
Reel of 2000
Reel of 2000
Tube of 90
TRSF3221ECPWR
TRSF3221EIDBR
–40°C to 85°C
TRSF3221EIPW
Reel of 2000
TRSF3221EIPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
abc
Each Driver(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
VALID RIN
RS-232 LEVEL
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
abc
Each Receiver(1)
INPUTS
OUTPUT
ROUT
VALID RIN
RS-232 LEVEL
RIN
EN
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
(off), Open = disconnected input or connected driver off
2
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
11
13
10
DIN
DOUT
16
12
FORCEOFF
FORCEON
INVALID
Auto-powerdown
9
8
1
ROUT
RIN
EN
3
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
Table 1. 1-Mbit/s RS-232 Parts
SUPPLY
VCC
(V)
PART
NO.
TEMPERATURE DRIVER RECEIVER
ESD
FEATURE
Auto-powerdown
Low pin count
PIN/PACKAGE
RANGE
NO.
NO.
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
TRSF3221E
TRSF3232E
TRS3227
1
1
3.3 or 5
3.3 or 5
3.3 or 5
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
2
1
2
1
±8-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
Auto-powerdown plus,
ready signal
16-pin SSOP
16-pin SOIC,
SSOP, TSSOP
TRSF3221
TRSF3223
TRSF3222
TRSF3232
TRSF3238
TRSF3243
1
2
2
2
5
3
1
2
2
2
3
5
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
3.3 or 5
3.5 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
Auto-powerdown
0°C to 70°C
Auto-powerdown,
enable signal
20-pin SOIC,
SSOP, TSSOP
Enable,
powerdown signal
20-pin SOIC,
SSOP, TSSOP
16-pin SOIC,
SSOP, TSSOP
Low pin count
Auto-powerdown plus
Auto-powerdown
28-pin SOIC,
SSOP, TSSOP
28-pin SOIC,
SSOP, TSSOP
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
TRSF3221E
TRSF3232E
TRS3227
1
2
1
1
2
1
3.3 or 5
3.3 or 5
3.3 or 5
Auto-powerdown
Low pin count
±15-kV Air-Gap,
±8-kV Contact,
±15-kV HBM
16-pin SOIC,
SSOP, TSSOP
±8-kV Air-Gap,
±8-k V Contact,
±15-kV HBM
Auto-powerdown plus,
ready signal
16-pin SSOP
16-pin SOIC,
SSOP, TSSOP
TRSF3221
TRSF3223
TRSF3222
TRSF3232
TRSF3238
TRSF3243
1
2
2
2
5
3
1
2
2
2
3
5
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
Auto-powerdown
–40°C to 85°C
Auto-powerdown,
enable signal
20-pin SOIC,
SSOP, TSSOP
Enable,
powerdown signal
20-pin SOIC,
SSOP, TSSOP
16-pin SOIC,
SSOP, TSSOP
Low pin count
Auto-powerdown plus
Auto-powerdown
28-pin SOIC,
SSOP, TSSOP
28-pin SOIC,
SSOP, TSSOP
4
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive output supply voltage range(2)
Negative output supply voltage range(2)
6
V
V
V
V
7
V–
–7
V+ – V– Supply voltage difference(2)
13
Driver (FORCEOFF, FORCEON, EN)
Receiver
–0.3
–25
6
25
VI
Input voltage range
V
V
Driver
–13.2
–0.3
13.2
VO
θJA
Output voltage range
Receiver (INVALID)
DB package
VCC + 0.3
82
Package thermal impedance(3)(4)
°C/W
PW package
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 6
MIN NOM
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
V
Supply voltage
5.5
Driver and control
high-level input voltage
VIH
VIL
DIN, FORCEOFF, FORCEON, EN
V
2.4
Driver and control
low-level input voltage
DIN, FORCEOFF, FORCEON, EN
DIN, FORCEOFF, FORCEON
0.8
V
VI
VI
Driver and control input voltage
Receiver input voltage
0
–25
–40
0
5.5
25
85
70
V
V
TRSF3221EI
TRSF3221EC
TA
Operating free-air temperature
°C
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX UNIT
II
Input leakage current FORCEOFF, FORCEON, EN
±0.01
±1
μA
No load,
Auto-powerdown disabled
0.3
1
1
mA
FORCEOFF and FORCEON at VCC
Supply current
(TA = 25°C)
Powered off
No load, FORCEOFF at GND
10
ICC
No load, FORCEOFF at VCC
FORCEON at GND,
,
μA
Auto-powerdown enabled
1
10
All RIN are open or grounded
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
5
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
DRIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
5
TYP(2) MAX UNIT
VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND
5.4
–5.4
V
V
VOL Low-level output voltage
DOUT at RL = 3 kΩ to GND, DIN = VCC
–5
IIH
IIL
High-level input current
Low-level input current
VI = VCC
±0.01
±0.01
±1
±1
μA
μA
VI at GND
VCC = 3.6 V,
VO = 0 V
±35 ±60
±35 ±90
10M
Short-circuit output
current(3)
IOS
ro
mA
Ω
VCC = 5.5 V,
VO = 0 V
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
VO = ±12 V,
VO = ±10 V,
300
VCC = 3 V to 3.6 V
±25
Ioff
Output leakage current
FORCEOFF = GND
μA
VCC = 4.5 V to 5.5 V
±25
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
CL = 1000 pF
MIN
250
TYP(2)
MAX UNIT
Maximum data rate
(see Figure 1)
RL = 3 kΩ
CL = 250 pF,
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
See Figure 2
1000
1000
kbit/s
CL = 1000 pF,
tsk(p)
Pulse skew(3)
Slew rate,
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
100
ns
SR(tr) transition region
(see Figure 1)
VCC = 3.3 V, RL = 3 kΩ to 7 kΩ,
CL = 150 pF to 1000 pF
18
150 V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME
NO.
HBM
±15
DOUT
13
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
±8
kV
±15
6
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
RECEIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6 V
VCC – 0.1 V
V
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.6
1.9
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.1
VIT–
V
1.4
Vhys
Ioff
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.5
V
FORCEOFF = 0 V
±0.05
5
±10
μA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2)
150
150
200
200
50
UNIT
ns
tPLH
tPHL
ten
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ns
ns
tdis
Output disable time
Pulse skew(3)
ns
tsk(p)
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME
NO.
HBM
±15
RIN
8
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
±8
kV
±15
7
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
AUTO-POWERDOWN SECTION
abc
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX UNIT
Receiver input threshold
for INVALID high-level output voltage
VT+(valid)
VT–(valid)
VT(invalid)
VOH
FORCEON = GND,
FORCEOFF = VCC
FORCEOFF = VCC
FORCEOFF = VCC
2.7
0.3
0.4
V
V
V
V
V
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
–2.7
–0.3
Receiver input threshold
for INVALID low-level output voltage
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Propagation delay time, low- to high-level output
TYP(1)
1
UNIT
μs
tvalid
tinvalid
ten
Propagation delay time, high- to low-level output
Supply enable time
30
μs
100
μs
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
8
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
PARAMETER MEASUREMENT INFORMATION
FORCEON
3 V
0 V
3 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
3 V
−3 V
−3 V
VOLTAGE WAVEFORMS
3 V
FORCEOFF
Output
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
FORCEON
3 V
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
VOLTAGE WAVEFORMS
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
EN = V
CC
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
9
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
Input
1.5 V
1.5 V
V
CC
GND
0 V
(S1 at GND)
S1
t
t
PZH
PHZ
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
EN
t
t
PZL
PLZ
(S1 at V
)
(S1 at V )
CC
CC
Generator
(see Note B)
50 Ω
0.3 V
Output
50%
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 4. Receiver Enable and Disable Times
10
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
2.7 V
2.7 V
0 V
0 V
EN = GND
Receiver
Input
ROUT
−2.7 V
−2.7 V
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
50% V
t
50% V
CC
CC
INVALID
Output
0 V
Auto-
powerdown
INVALID
en
C = 30 pF
L
(see Note A)
≈V+
V+
0.3 V
V
CC
Supply
FORCEOFF
FORCEON
0 V
0.3 V
Voltages
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
Indeterminate
2.7 V
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdowndisables drivers and reduces supply
current to 1 µA.
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time
11
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TRSF3221E
3-V TO 5.5-V SINGLE-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS822–JULY 2007
APPLICATION INFORMATION
1
2
16
15
FORCEOFF
EN
V
CC
C1+
V+
+
C
= 0.1 µF
BYPASS
3
−
14
Auto-
powerdown
+
−
+
−
(1)
GND
C1
C3
4
5
C1−
C2+
13
DOUT
+
−
12
11
10
FORCEON
DIN
C2
C4
6
7
C2−
V−
−
+
INVALID
8
9
RIN
ROUT
5 kΩ
(1) C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected
as shown.
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
12
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TRSF3221ECDB
TRSF3221ECDBG4
TRSF3221ECDBR
TRSF3221ECDBRG4
TRSF3221ECPW
TRSF3221ECPWR
TRSF3221EIDBR
TRSF3221EIPW
ACTIVE
SSOP
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
80
Green (RoHS
& no Sb/Br)
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
0 to 70
0 to 70
RT21EC
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
DB
80
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Call TI
RT21EC
RT21EC
RT21EC
RT21EC
RT21EC
RT21EI
RT21EI
RT21EI
RT21EI
SSOP
DB
2000
2000
90
Green (RoHS
& no Sb/Br)
0 to 70
SSOP
DB
Green (RoHS
& no Sb/Br)
0 to 70
TSSOP
TSSOP
SSOP
PW
PW
DB
Green (RoHS
& no Sb/Br)
0 to 70
2000
2000
90
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
TSSOP
TSSOP
TSSOP
VQFN
PW
PW
PW
RGT
Green (RoHS
& no Sb/Br)
TRSF3221EIPWR
TRSF3221EIPWRG4
TRSF3221EIRGTR
2000
2000
3000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Nov-2020
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TRSF3221ECPWR
TRSF3221EIPWR
TSSOP
TSSOP
PW
PW
16
16
2000
2000
330.0
330.0
12.4
12.4
6.9
6.9
5.6
5.6
1.6
1.6
8.0
8.0
12.0
12.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRSF3221ECPWR
TRSF3221EIPWR
TSSOP
TSSOP
PW
PW
16
16
2000
2000
367.0
367.0
367.0
367.0
35.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
5
0
0
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
4.55
NOTE 3
8
9
0.30
16X
4.5
4.3
NOTE 4
1.2 MAX
0.19
B
0.1
C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
A
20
0 -8
DETAIL A
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
(PREFERRED)
SOLDER MASK DETAILS
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
16
1
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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Copyright © 2020, Texas Instruments Incorporated
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