TS5V330CRGYR [TI]
QUAD SPDT WIDE BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE; 具有低导通电阻四路SPDT高带宽视频开关
| 型号： | TS5V330CRGYR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUAD SPDT WIDE BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE |
| 文件： | 总22页 (文件大小：847K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS5V330C
www.ti.com
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
QUAD SPDT WIDE BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE
Check for Samples: TS5V330C
1
FEATURES
D, DB, DBQ, OR PW PACKAGE
•
Low Differential Gain and Phase
(TOP VIEW)
(Typical DG = 0.24%, Typical DP = 0.039°)
V
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IN
1A
2A
•
•
•
Wide Bandwidth (Typical BW > 288 MHz)
Low Cross-Talk (Typical XTALK = –87 dB)
CC
S
S
EN
S
1D
Low Power Consumption
(Maximum ICC = 3 μA)
D
S
2D
A
1B
2B
S
S
D
D
•
Bidirectional Data Flow, With Near-Zero
Propagation Delay
S
1C
D
S2
C
B
•
•
•
Low ON-State Resistance (Typical rON = 3 Ω)
D
GND
C
VCC Operating Range From 4.5 V to 5.5 V
Ioff Supports Partial-Power-Down Mode
Operation
RGY PACKAGE
(TOP VIEW)
•
•
•
•
Data and Control Inputs Provide Undershoot
Clamp Diode
Control Inputs Can be Driven by TTL or
5-V/3.3-V CMOS Outputs
1
16
S
S
2
3
4
5
6
7
15
14
13
12
11
10
EN
S
1A
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2A
1D
D
S
2D
A
1B
2B
ESD Performance Tested Per JESD 22
S
S
D
D
–
2000-V Human-Body Model
(A114-B, Class II)
S
1C
D
S2
C
B
–
1000-V Charged-Device Model (C101)
8
9
•
Suitable for Both RGB and Composite Video
Switching
DESCRIPTION/ORDERING INFORMATION
The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input.
The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is
enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance
state exists between the D and S ports.
Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth
and low cross talk which makes it suitable for high frequency video applications. The device can be used for
RGB and composite video switching applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging
current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5V330C
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
www.ti.com
ORDERING INFORMATION
TA
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
QFN – RGY
SOIC – D
Tape and reel
Tube
TS5V330CRGYR
TS5V330CD
TE330C
TS5V330C
Tape and reel
Tape and reel
Tape and reel
Tube
TS5V330CDR
TS5V330CDBR
TS5V330CDBQR
TS5V330CPW
TS5V330CPWR
–40°C to 85°C
SSOP – DB
TE330C
TE330C
SSOP (QSOP) – DBQ
TSSOP – PW
TE330C
Tape and reel
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Table 1. FUNCTION TABLE
INPUTS
INPUT/OUTPUT
A
FUNCTION
EN
IN
L
L
L
S1
S2
Z
D port = S1 port
D port = S2 port
Disconnect
H
X
H
Table 2. PIN DESCRIPTIONS
PIN NAME
DESCRIPTION
Analog video I/Os
Analog video I/Os
Select input
S1, S2
D
IN
EN
Switch-enable input
2
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Product Folder Link(s): TS5V330C
TS5V330C
www.ti.com
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
PARAMETER DEFINITIONS
PARAMETER
DESCRIPTION
rON
IOZ
IOS
VIN
VEN
CIN
COFF
CON
VIH
VIL
VH
VIK
VI
Resistance between the D and S ports with the switch in the ON-state
Output leakage current measured at the D and S ports with the switch in the OFF-state
Short circuit current measured at the I/O pins.
Voltage at the IN pin
Voltage at the EN pin
Capacitance at the control inputs (EN, IN)
Capacitance at the analog I/O port when the switch is OFF
Capacitance at the analog I/O port when the switch is ON
Minimum input voltage for logic high for the control inputs (EN, IN)
Minimum input voltage for logic low for the control inputs (EN, IN)
Hysteresis voltage at the control inputs (EN, IN)
I/O and control inputs diode clamp voltage (EN, IN)
Voltage applied to the D or S pins when D or S is the switch input.
Voltage applied to the D or S pins when D or S is the switch output.
Input high leakage current of the control inputs (EN, IN)
Input low leakage current of the control inputs (EN, IN)
Current into the D or S pins when D or S is the switch input.
Current into the D or S pins when D or S is the switch output.
Output leakage current measured at the D and S ports with VCC = 0
VO
IIH
IIL
II
IO
Ioff
Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned
ON.
tON
Propagation delay measured between 50% of the digital input to 90% of the analog output when switch is turned
OFF.
tOFF
BW
Frequency response of the switch in the ON-state measured at –3 dB
Unwanted signal coupled from channel to channel. Measured in –dB. XTALK = 20 LOG VOUT/VIN. This is a
non-adjacent crosstalk.
XTALK
OIRR
Off-isolation is the resistance (measured in –dB) between the input and output with the switch OFF.
Magnitude variation between analog input and output pins when the switch is ON and the DC offset of composite
video signal varies at the analog input pin. In NTSC standard the frequency of the video signal is 3.58 MHz and
DC offset is from 0 to 0.714 V.
DG
DP
Phase variation between analog input and output pins when the switch is ON and the DC offset of composite
video signal varies at the analog input pin. In NTSC standard the frequency of the video signal is 3.58 MHz and
DC offset is from 0 to 0.714 V.
ICC
Static power supply current
ICCD
Variation of ICC for a change in frequency in the control inputs (EN, IN)
This is the increase in supply current for each control input that is at the specified voltage level, rather than VCC or
GND.
ΔICC
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TS5V330C
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
www.ti.com
LOGIC DIAGRAM (POSITIVE LOGIC)
4
2
3
5
6
D
D
D
D
S
S
S
S
S
A
B
C
D
1A
2A
1B
2B
1C
7
9
11
10
S2
C
12
14
13
S
1D
2D
S
1
IN
15
EN
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
7
UNIT
V
VCC
VIN
VI/O
IIK
Supply voltage range
Control input voltage range(2) (3)
Output voltage range(2) (3) (4)
Control input clamp current
I/O port clamp current
ON-state switch current(5)
Continuous current through VCCor GND
Storage temperature range
7
V
7
V
VIN < 0
VI/O < 0
–50
–50
±128
±100
150
mA
mA
mA
mA
°C
II/OK
II/O
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
.
(5) II and IO are used to denote specific conditions for II/O
.
4
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Product Folder Link(s): TS5V330C
TS5V330C
www.ti.com
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
PACKAGE THERMAL IMPEDANCE
over operating free-air temperature range (unless otherwise noted)
UNIT
D package(1)
73
82
DB package(1)
DBQ package(1)
PW package(1)
RGY package(2)
θJA
Package thermal impedance
90
108
39
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
4
MAX
5.5
5.5
0.8
Vcc
85
UNIT
V
VCC
VIH
Supply voltage
High-level control input voltage (EN, IN)
Low-level control input voltage (EN, IN)
Analog input/output voltage
2
V
VIL
0
V
VANALOG
TA
0
V
Operating free-air temperature
–40
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2009, Texas Instruments Incorporated
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TS5V330C
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
www.ti.com
MAX UNIT
ELECTRICAL CHARACTERISTICS(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
EN, IN
TEST CONDITIONS
IIN = –18 mA
MIN TYP(2)
VIK
VH
IIH
IIL
VCC = 4.5 V,
–1.8
400
±1
V
EN, IN
EN, IN
EN, IN
mV
μA
μA
VCC = 5.5 V,
VCC = 5.5 V,
VIN and VEN = VCC
VIN and VEN = GND
±1
VO = 0 to 5.5 V,
VI = 0,
(3)
IOZ
IOS
VCC = 5.5 V,
VCC = 5.5 V,
Switch OFF
Switch ON
±10
μA
VO = 0 to 5.5 V,
VI = 0,
±110
mA
Ioff
VCC = 0,
VO = 0 to 5.5 V,
II/O = 0,
VI = 0
±1
3
μA
μA
ICC
VCC = 5.5 V,
VCC = 5.5 V,
Switch ON or OFF
Other inputs at VCC or GND
ΔICC
ICCD
Cin
EN, IN
One input at 3.4 V,
2.5
mA
VCC = 5.5 V,
VEN = GND,
mA/
MHz
D and S ports are open, VIN switching 50% duty cycle
f = 1 MHz
0.25
EN, IN
D port
S port
VIN or VEN = 0
VI/O = 3 V or 0,
VI = 0,
3.5
8.5
5.5
16.5
3
pF
pF
pF
Ω
Switch OFF,
COFF
CON
VIN = VCC or GND
Switch ON,
f = 1 MHz, outputs open, Switch ON
VI = 1 V,
VI = 2 V,
IO = 13 mA, RL = 75 Ω
IO = 26 mA, RL = 75 Ω
7
(4)
rON
VCC = 4.5 V
3
10
(1) VI , VO, II, and IO refer to the I/O pins.
(2) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) Measured by the voltage drop between the D and S terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (S or D) terminals.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ±10%, RL = 75 Ω, CL = 20 pF (unless otherwise noted)
(see Figure 5)
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
TYP
MAX
UNIT
tON
S
S
D
D
1.5
1.5
6.0
5.9
ns
ns
tOFF
DYNAMIC CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 5 V ±10% (unless otherwise noted)
PARAMETER
TEST CONDITIONS
RL = 150 Ω, f = 3.58 MHz, see Figure 6
RL = 150 Ω, f = 3.58 MHz, see Figure 6
RL = 150 Ω, see Figure 7
MIN
TYP(1)
0.24
0.039
250
MAX UNIT
DG
DP
%
°
BW
MHz
dB
dB
XTALK
OIRR
RIN = 10 Ω, RL = 150 Ω, f = 10 MHz, see Figure 7
RL = 150 Ω, f = 10 MHz, see Figure 7
–87
–54
(1) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
6
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TS5V330C
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SCDS276B –APRIL 2009–REVISED DECEMBER 2009
TYPICAL PERFORMANCE
0
-1
-2
-3
-4
-5
-6
-7
0
-10
-20
-30
-40
-50
-60
-70
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
-0.35
-0.40
-0.405
-0.410
-0.415
-0.420
-0.425
-0.430
-0.435
-0.440
-0.445
Differential phase at 0.714 V, 0.427°
-0.450
Differential gain at 0.714 V, 0.24%
Phase at = –3 dB, –35°
Gain at -3 dB , 288 MHz
-0.455
1.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
-8
1
V
(V)
BIAS
10
100
1000
Frequency (MHz)
Figure 1. Frequency Response
Figure 2. Differential Gain/Phase vs VBIAS
0
-10
-20
-30
-40
-50
-60
-70
-80
160
140
120
100
80
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
250
200
150
100
50
Phase at 10 MHz, –92.25°
Crosstalk at -10 MHz, –46.99 dB
60
40
Off Isolation at 10 MHz, –54.66 dB
Phase at 10 MHz, 94.7°
20
-90
1
0
1000
0
1000
10
100
1
10
100
Frequency (MHz)
Frequency (MHz)
Figure 3. OFF-Isolation vs Frequency
Figure 4. Crosstalk vs Frequency
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TS5V330C
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION
V
CC
Input Generator
V
IN
IN
50 Ω
50 Ω
V
G1
DUT
EN
S1
S2
TEST CIRCUIT
V
S1
V
O
D
V
C
L
(see Note A)
R
L
S2
R
V
V
C
L
V
CC
TEST
S1
S2
L
20 pF
20 pF
5 V 0.5 V
5 V 0.5 V
75 Ω
75 Ω
GND
3 V
3 V
t
ON
GND
20 pF
20 pF
5 V 0.5 V
5 V 0.5 V
75 Ω
75 Ω
GND
3 V
3 V
t
OFF
GND
Output
Control
(V
3 V
50%
50%
)
IN
0 V
t
t
OFF
ON
3 V
0 V
90%
90%
Analog Output
Waveform
(V )
O
VOLTAGE WAVEFORMS
and t TIMES
t
ON
OFF
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
tr ≤ 2.5 ns, tf ≤2.5 ns.
C. The outputs are measured one at a time with one transition per measurement.
Figure 5. Test Circuit and Voltage Waveforms
8
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SCDS276B –APRIL 2009–REVISED DECEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
Ω
For additional information, refer to the TI application report, Measuring Differential Gain and Phase, literature number
SLOA040.
Figure 6. Test Circuit for Differential Gain/Phase Measurement
The differential gain and phase is measured at the output of the ON channel. For example, when VIN = 0, VEN
0, and DA is the input, the output is measured at S1A.
=
HP8753ES Setup
Average = 20
RBW = 300 Hz
Smoothing = 2%
VBIAS = 0 to 1 V
ST = 1.381 s.
P1 = –7 dBM
CW frequency = 3.58 MHz
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TS5V330C
SCDS276B –APRIL 2009–REVISED DECEMBER 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION (continued)
Ω
Figure 7. Test Circuit for Frequency Response, Crosstalk, and OFF-Isolation
The frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and
DA is the input, the output is measured at S1A. All unused analog I/O ports are held at VCC or GND.
The crosstalk is measured at the output of the non-adjacent ON channel. For example, when VIN = 0, VEN = 0,
and DA is the input, the output is measured at S1B. All unused analog I/O ports are held at VCC or GND.
The off-isolation is measured at the output of the OFF channel. For example, when VIN = 0, VEN = VCC, and DA is
the input, the output is measured at S1A. All unused analog I/O ports are held at VCC or GND.
HP8753ES Setup
Average = 4
RBW = 3 kHz
Smoothing = 0%
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
10
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PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TS5V330CD
PREVIEW
ACTIVE
SOIC
D
16
16
40
TBD
Call TI
Call TI
TS5V330CDBQR
SSOP
DBQ
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TS5V330CDBR
TS5V330CDR
PREVIEW
ACTIVE
SSOP
SOIC
DB
D
16
16
2000
2500
TBD
Call TI
Call TI
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS5V330CPW
PREVIEW
ACTIVE
TSSOP
TSSOP
PW
PW
16
16
90
TBD
Call TI
Call TI
TS5V330CPWR
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TS5V330CRGYR
PREVIEW
VQFN
RGY
16
3000
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2012
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS5V330CDR
SOIC
D
16
16
2500
2000
330.0
330.0
16.4
12.4
6.5
6.9
10.3
5.6
2.1
1.6
8.0
8.0
16.0
12.0
Q1
Q1
TS5V330CPWR
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS5V330CDR
SOIC
D
16
16
2500
2000
333.2
367.0
345.9
367.0
28.6
35.0
TS5V330CPWR
TSSOP
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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