TUSB320LI [TI]

USB Type-C 配置通道逻辑和端口控制;
TUSB320LI
型号: TUSB320LI
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

USB Type-C 配置通道逻辑和端口控制

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中文:  中文翻译
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TUSB320HI, TUSB320LI  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
TUSB320LITUSB320HI USB Type-C 配置通道逻辑和端口控制  
1 特性  
3 说明  
1
USB Type-C™规范 1.1  
向后兼容 USB Type-C 规范 1.0  
支持高达 3A 的电流通告和检测  
模式配置  
TUSB320LI TUSB320HI 器件(除非另外注明,否  
则本文档后续部分将统称为 TUSB320)可在 USB  
Type-C 端口上实现 Type-C 生态系统所需的配置通道  
(CC) 逻辑。TUSB320 器件使用 CC 引脚来确定端口  
的连接状态和电缆方向,以及进行角色检测和 Type-C  
电流模式控制。TUSB320 器件可配置为下行端口  
(DFP)、上行端口 (UFP) 或双角色端口 (DRP),因此  
成为任何应用的理想选择。  
仅主机 - 下行端口 (DFP)(供电设备)  
仅设备 上行端口 (UFP)(受电设备)  
双角色端口 – DRP  
支持 Try.SRC Try.SNK  
通道配置 (CC)  
根据 Type-C 规范,TUSB320 会交替配置为 DFP 或  
UFPCC 逻辑块通过监视 CC1 CC2 引脚上的上拉  
或下拉电阻,以确定何时连接了 USB 端口、电缆的方  
向以及检测到的角色。CC 逻辑根据检测到的角色来确  
Type-C 电流模式为默认、中等还是高。该逻辑通过  
实施 VBUS 检测来确定端口在 UFP DRP 模式下是  
否连接成功。  
V
USB 端口连接检测  
电缆方向检测  
角色检测  
Type-C 电流模式(默认、中等和高)  
BUS 检测  
I2C GPIO 控制  
通过 I2C 实现角色配置控制  
电源电压:2.7V 5V  
低电流消耗  
该系列器件能够在宽电源范围内工作,并且具有较低功  
耗。TUSB320 提供两种使能版本:低电平有效使能,  
称为 TUSB320LI;高电平有效使能,称为  
TUSB320HITUSB320 系列器件适用于工业级温度范  
围。  
工业温度范围:–40°C 85°C  
2 应用  
器件信息(1)  
主机、设备、双角色端口 应用  
移动电话  
器件型号  
TUSB320HI  
TUSB320LI  
封装  
X2QFN (12)  
X2QFN (12)  
封装尺寸(标称值)  
1.60mm x 1.60mm  
1.60mm x 1.60mm  
平板电脑和笔记本电脑  
USB 外设  
(1) 要了解所有可用封装,请参见数据表末尾的可订购产品附录。  
简化电路原理图  
示例 应用  
VBUS  
Detection  
VBUS  
CC Logic  
For Mode  
Configuration and  
Detection  
CC1  
CC2  
I2C  
GPIO  
Controller  
GPIOs  
Copyright © 2016, Texas Instruments Incorporated  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLLSEP2  
 
 
 
TUSB320HI, TUSB320LI  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
www.ti.com.cn  
目录  
7.5 Register Maps......................................................... 16  
Application and Implementation ........................ 21  
8.1 Application Information............................................ 21  
8.2 Typical Application .................................................. 21  
8.3 Initialization Set Up ................................................ 28  
Power Supply Recommendations...................... 28  
1
2
3
4
5
6
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 ESD Ratings.............................................................. 4  
6.3 Recommended Operating Conditions....................... 4  
6.4 Thermal Information.................................................. 4  
6.5 Electrical Characteristics........................................... 5  
6.6 Timing Requirements................................................ 6  
6.7 Switching Characteristics.......................................... 6  
Detailed Description .............................................. 8  
7.1 Overview ................................................................... 8  
7.2 Feature Description................................................... 9  
7.3 Device Functional Modes........................................ 13  
7.4 Programming........................................................... 15  
8
9
10 Layout................................................................... 29  
10.1 Layout Guidelines ................................................. 29  
10.2 Layout Example .................................................... 29  
11 器件和文档支持 ..................................................... 30  
11.1 相关链接................................................................ 30  
11.2 接收文档更新通知 ................................................. 30  
11.3 社区资源................................................................ 30  
11.4 ....................................................................... 30  
11.5 静电放电警告......................................................... 30  
11.6 Glossary................................................................ 30  
12 机械、封装和可订购信息....................................... 30  
7
4 修订历史记录  
Changes from Revision C (October 2016) to Revision D  
Page  
Changed RVBUS values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 6  
Changes from Revision B (September 2016) to Revision C  
Page  
Changed text for Pin 7 in the Pin Functions table From: "default current mode detected (H); medium or high current  
mode detected (L)." To: "Refer to Table 3 for more details." ................................................................................................. 3  
Changed text for Pin 8 in the Pin Functions table From: "default or medium current mode detected (H); high current  
mode detected (L)." To: "Refer to Table 3 for more details." ................................................................................................. 3  
Changes from Revision A (February 2016) to Revision B  
Page  
Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = VDD + 0.3 To: MIN –0.3 MAX = 6 in the Absolute  
Maximum Ratings................................................................................................................................................................... 4  
Changes from Original (August 2015) to Revision A  
Page  
Added Note 1 and 2 to the Pin Functions table...................................................................................................................... 3  
Changed the DESCRIPTION of pin EN_N pin in the Pin Functions table ............................................................................. 4  
Changed the DESCRIPTION of pin EN pin in the Pin Functions table.................................................................................. 4  
Changed the DESCRIPTION of pin VDD in the Pin Functions table ....................................................................................... 4  
Added Note 2 to the Electrical Characteristics table ............................................................................................................. 5  
Added Test Condition "See Figure 1" to VBUS_THR in the Electrical Characteristics ......................................................... 6  
Replaced the Timing Requirements table ............................................................................................................................. 6  
Added Note: "SW must make sure..." to the Description of INTERRUPT_STATUS in Table 9 ......................................... 18  
Added text to list item 2 in the TUSB320L Initialization Procedure section ......................................................................... 28  
Added text to list item 2 in the TUSB320H Initialization Procedure section......................................................................... 28  
2
Copyright © 2015–2017, Texas Instruments Incorporated  
 
TUSB320HI, TUSB320LI  
www.ti.com.cn  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
5 Pin Configuration and Functions  
RWB Package  
12-Pin X2QFN  
TUSB320L Top View  
RWB Package  
12-Pin X2QFN  
TUSB320H Top View  
2
1
2
1
PORT  
VBUS_DET  
ADDR  
3
4
5
6
12  
11  
10  
9
VDD  
PORT  
VBUS_DET  
ADDR  
3
4
5
6
12  
11  
10  
9
VDD  
EN_N  
EN  
GND  
ID  
GND  
INT_N/OUT3  
INT_N/OUT3  
ID  
7
8
7
8
Pin Functions  
PIN  
NO.  
TYPE  
DESCRIPTION  
NAME  
TUSB320L  
TUSB320H  
CC1  
CC2  
1
2
1
2
I/O  
I/O  
Type-C configuration channel signal 1  
Type-C configuration channel signal 2  
Tri-level input pin to indicate port mode. The state of this pin is sampled when TUSB320L's  
EN_N is asserted low, TUSB320H's EN is asserted high, and VDD is active. This pin is also  
sampled following a I2C_SOFT_RESET.  
PORT(1)  
3
3
I
H - DFP (Pull-up to VDD if DFP mode is desired)  
NC - DRP (Leave unconnected if DRP mode is desired)  
L - UFP (Pull-down or tie to GND if UFP mode is desired)  
5- to 28-V VBUS input voltage. VBUS detection determines UFP attachment. One 900-kΩ  
external resistor required between system VBUS and VBUS_DET pin.  
VBUS_DET(1)  
ADDR(1)  
4
5
4
5
I
I
Tri-level input pin to indicate I2C address or GPIO mode:  
H - I2C is enabled and I2C 7-bit address is 0x67.  
NC - GPIO mode (I2C is disabled)  
L - I2C is enabled and I2C 7-bit address is 0x47.  
ADDR pin should be pulled up to VDD if high configuration is desired  
The INT_N/OUT3 is a dual-function pin. When used as the INT_N, the pin is an open drain  
output in I2C control mode and is an active low interrupt signal for indicating changes in I2C  
registers. When used as OUT3, the pin is in audio accessory detect in GPIO mode: no  
detection (H), audio accessory connection detected (L).  
INT_N/OUT3(1)  
SDA/OUT1(1)(2)  
SCL/OUT2(1)(2)  
6
7
8
6
7
8
O
The SDA/OUT1 is a dual-function pin. When I2C is enabled (ADDR pin is high or low), this pin  
is the I2C communication data signal. When in GPIO mode (ADDR pin is NC), this pin is an  
open drain output for communicating Type-C current mode detect when the device is in UFP  
mode: Refer to Table 3 for more details.  
I/O  
I/O  
The SCL/OUT2 is a dual function pin. When I2C is enabled (ADDR pin is high or low), this pin  
is the I2C communication clock signal. When in GPIO mode (ADDR pin is NC), this pin is an  
open drain output for communicating Type-C current mode detect when the device is in UFP  
mode: Refer to Table 3 for more details.  
Open drain output; asserted low when the CC pins detect device attachment when port is a  
source (DFP), or dual-role (DRP) acting as source (DFP).  
ID(1)  
9
9
O
G
GND  
10  
10  
Ground  
(1) When VDD is off, the TUSB320 non-failsafe pins (VBUS_DET, ADDR, PORT, ID, OUT[3:1] pins) could back-drive the TUSB320 device if  
not handled properly. When necessary to pull these pins up, it is recommended to pullup PORT, ADDR, INT_N/OUT3, and ID to the  
device VDD supply. The VBUS_DET must be pulled up to VBUS through a 900-kΩ resistor.  
(2) When using the 3.3 V supply for I2C, the end user must ensure that the VDD is 3 V and above. Otherwise the I2C may back power the  
device.  
Copyright © 2015–2017, Texas Instruments Incorporated  
3
TUSB320HI, TUSB320LI  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
www.ti.com.cn  
Pin Functions (continued)  
PIN  
NO.  
TYPE  
DESCRIPTION  
NAME  
TUSB320L  
TUSB320H  
Enable signal; active low. Pulled up to VDD internally to disable the TUSB320L device. If  
controlled externally, must be held low at least for 50 ms after VDD has reached its valid  
voltage level.  
EN_N  
11  
I
Enable signal; active high. Pulled down to GND internally to disable the TUSB320H device. If  
controlled externally, must be held low at least for 50 ms after VDD has reached its valid  
voltage level.  
EN  
11  
12  
I
VDD  
12  
P
Positive supply voltage. VDD must ramp within 25 ms or less  
6 Specifications  
6.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–65  
MAX  
UNIT  
Supply voltage  
Control pins  
VDD  
6.0  
V
CC1, CC2, PORT, ADDR, ID, EN_N, INT_N/OUT3  
CC1, CC2  
VDD + 0.3  
6
VDD + 0.3  
4
V
SDA/OUT1, SCL/OUT2  
VBUS_DET , EN  
Storage temperature, Tstg  
150  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
6.2 ESD Ratings  
VALUE  
UNIT  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
±5000  
V(ESD)  
Electrostatic discharge  
V
Charged-device model (CDM), per JEDEC specification JESD22-  
C101(2)  
±1500  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2.7  
4
NOM  
MAX  
5
UNIT  
V
VDD  
VBUS  
TA  
Supply voltage range  
System VBUS voltage  
5
28  
V
TUSB320HI and TUSB320LI Operating free air temperature range  
–40  
25  
85  
°C  
6.4 Thermal Information  
TUSB320  
THERMAL METRIC(1)  
RWB (X2QFN)  
12 PINS  
169.3  
68.1  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RθJC(top)  
RθJB  
Junction-to-board thermal resistance  
83.4  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
2.2  
ψJB  
83.4  
RθJC(bot)  
N/A  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application  
report, SPRA953.  
4
Copyright © 2015–2017, Texas Instruments Incorporated  
TUSB320HI, TUSB320LI  
www.ti.com.cn  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
6.5 Electrical Characteristics  
over operating free-air temperature range (unless otherwise noted)  
TEST  
CONDITIONS  
PARAMETER  
MIN  
TYP  
MAX  
UNIT  
Power Consumption  
Current consumption in unattached mode when port is  
unconnected and waiting for connection. [VDD = 4.5 V,  
EN_N (TUSB320L) = L, EN (TUSB320H) = H, ADDR = NC,  
IUNATTACHED_UFP  
100  
µA  
PORT = L]  
Current consumption in active mode. (VDD = 4.5 V, EN_N  
IACTIVE_UFP  
(TUSB320L) = L, EN (TUSB320H) = H, ADDR = NC,  
PORT = L)  
100  
µA  
µA  
Leakage current when VDD is supplied, but the TUSB320  
device is not enabled. (VDD = 4.5 V, EN_N (TUSB320L) =  
H, EN (TUSB320H) = L)  
ISHUTDOWN  
0.040  
CC1 and CC2 Pins  
RCC_DB  
Pulldown resistor when in dead-battery mode.  
Pulldown resistor when in UFP or DRP mode.  
4.1  
4.6  
5.1  
5.1  
6.1  
5.6  
kΩ  
kΩ  
RCC_D  
Voltage threshold for detecting a DFP attach when  
configured as a UFP and DFP is advertising default current  
source capability.  
VTH_UFP_CC_USB  
VTH_UFP_CC_MED  
VTH_UFP_CC_HIGH  
VTH_DFP_CC_USB  
VTH_DFP_CC_MED  
VTH_DFP_CC_HIGH  
0.15  
0.61  
1.169  
1.51  
1.51  
2.46  
0.2  
0.66  
1.23  
1.6  
0.25  
0.7  
V
V
V
V
V
V
Voltage threshold for detecting a DFP attach when  
configured as a UFP and DFP is advertising medium (1.5  
A) current source capability.  
Voltage threshold for detecting a DFP attach when  
configured as a UFP and DFP is advertising high (3 A)  
current source capability.  
1.29  
1.64  
1.64  
2.74  
Voltage threshold for detecting a UFP attach when  
configured as a DFP and advertising default current source  
capability.  
Voltage threshold for detecting a UFP attach when  
configured as a DFP and advertising medium current (1.5  
A) source capability.  
1.6  
Voltage threshold for detecting a UFP attach when  
configured as a DFP and advertising high current (3.0 A)  
source capability.  
2.6  
Default mode pullup current source when operating in DFP  
or DRP mode.  
ICC_DEFAULT_P  
ICC_MED_P  
64  
166  
304  
80  
180  
330  
96  
194  
356  
µA  
µA  
µA  
Medium (1.5 A) mode pullup current source when  
operating in DFP or DRP mode.  
High (3 A) mode pullup current source when operating in  
DFP or DRP mode.(1)  
ICC_HIGH_P  
Control Pins: PORT, ADDR, INT/OUT3, EN_N, EN, ID  
Low-level control signal input voltage (PORT, ADDR,  
EN_N, EN)  
VIL  
VIM  
VIH  
0.4  
0.56 × VDD  
VDD  
V
V
V
Mid-level control signal input voltage (PORT, ADDR)  
0.28 × VDD  
VDD - 0.3  
High-level control signal input voltage (PORT, ADDR,  
EN_N)  
High-Level control signal input voltage for EN for  
TUSB320H  
VIH_EN  
1.05  
3.65  
V
IIH  
High-level input current  
–20  
–10  
20  
10  
µA  
µA  
IIL  
Low-level input current  
REN_N  
Internal pullup resistance for EN_N for TUSB320L  
Internal pulldown resistance for EN for TUSB320H  
Internal pullup resistance (PORT, ADDR)  
Internal pulldown resistance (PORT, ADDR)  
1.1  
500  
588  
1.1  
MΩ  
kΩ  
REN  
(2)  
Rpu  
kΩ  
(2)  
Rpd  
MΩ  
Low-level signal output voltage (open-drain) (INT_N/OUT3,  
ID)  
VOL  
IOL = –1.6 mA  
0.4  
V
External pullup resistor on open drain IOs (INT_N/OUT3,  
ID)  
Rp_ODext  
Rp_TLext  
200  
4.7  
kΩ  
kΩ  
Tri-level input external pullup resistor (PORT, ADDR)  
(1) VDD must be 3.5 V or greater to advertise 3 A current.  
(2) Internal pullup and pulldown for PORT and ADDR are removed after the device has sampled EN = high or EN_N = low.  
Copyright © 2015–2017, Texas Instruments Incorporated  
5
TUSB320HI, TUSB320LI  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
www.ti.com.cn  
Electrical Characteristics (continued)  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
I2C - SDA/OUT1, SCL/OUT2 can operate from 1.8 or 3.3 V (±10%)(3)  
Supply range for I2C (SDA/OUT1, SCL/OUT2)  
VDD_I2C  
1.65  
1.05  
1.8  
3.6  
3.6  
0.4  
0.4  
V
V
V
V
VIH  
VIL  
High-level signal voltage  
Low-level signal voltage  
VOL  
Low-level signal output voltage (open drain)  
IOL = –1.6 mA  
See Figure 1  
VBUS_DET IO Pins (Connected to System VBUS signal)  
VBUS_THR  
RVBUS  
VBUS threshold range  
2.95  
855  
3.30  
887  
95  
3.80  
920  
V
External resistor between VBUS and VBUS_DET pin  
Internal pulldown resistance for VBUS_DET  
KΩ  
KΩ  
RVBUS_PD  
(3) When using 3.3 V for I2C, customer must ensure VDD is above 3 V at all times.  
6.6 Timing Requirements  
MIN  
NOM  
MAX  
UNIT  
I2C (SDA, SCL)  
tSU:DAT  
tHD;DAT  
tSU:STA  
tHD:STA  
tSU:STO  
tBUF  
Data setup time  
100  
10  
ns  
ns  
µs  
µs  
µs  
µs  
µs  
µs  
kHz  
ns  
ns  
pF  
pF  
Data hold time  
Set-up time, SCL to start condition  
Hold time (repeated), start condition to SCL  
Set up time for stop condition  
0.6  
0.6  
0.6  
1.3  
Bus free time between a stop and start condition  
Data valid time  
tVD;DAT  
tVD;ACK  
fSCL  
0.9  
0.9  
Data valid acknowledge time  
SCL clock frequency; I2C mode for local I2C control  
Rise time of both SDA and SCL signals  
Fall time of both SDA and SCL signals  
400  
300  
300  
400  
100  
tr  
tf  
CBUS_100KHZ Total capacitive load for each bus line when operating at 100 kHz  
CBUS_400KHz Total capacitive load for each bus line when operating at 400 kHz  
6.7 Switching Characteristics  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN TYP MAX  
UNIT  
ms  
Power on default of CC1 and CC2 voltage debounce  
time  
tCCCB_DEFAULT  
tVBUS_DB  
DEBOUCE register = 2'b00  
168  
2
Debounce of VBUS_DET pin after valid VBUS_THR  
ms  
tDRP_DUTY_CY Power-on default of percentage of time DRP advertises DRP_DUTY_CYCLE register  
30%  
DFP during a TDRP  
= 2'b00  
CLE  
The period during which the TUSB320 in DFP mode  
completes a DFP to UFP and back advertisement.  
tDRP  
50  
26  
75  
100  
ms  
Time from TUSB320L's EN_N low or TUSB320H's EN  
high and VDD active to I2C access available  
tI2C_EN  
100  
95  
ms  
ms  
tSOFT_RESET  
Soft reset duration  
49  
6
Copyright © 2015–2017, Texas Instruments Incorporated  
TUSB320HI, TUSB320LI  
www.ti.com.cn  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
VBUS  
VBUS_THR  
TVBUS_DB  
0 V  
Figure 1. VBUS Detect and Debounce  
Copyright © 2015–2017, Texas Instruments Incorporated  
7
TUSB320HI, TUSB320LI  
ZHCSE04D AUGUST 2015REVISED MAY 2017  
www.ti.com.cn  
7 Detailed Description  
7.1 Overview  
The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and  
reversible. Because of the nature of the connector, a scheme is needed to determine the connector orientation.  
Additional schemes are needed to determine when a USB port is attached and the acting role of the USB port  
(DFP, UFP, DRP), as well as to communicate Type-C current capabilities. These schemes are implemented over  
the CC pins according to the USB Type-C specifications. The TUSB320 devices provide Configuration Channel  
(CC) logic for determining USB port attach and detach, role detection, cable orientation, and Type-C current  
mode. The TUSB320 devices also contains several features such as mode configuration and low standby current  
which make these devices ideal for source or sinks in USB2.0 applications.  
ADDR  
3-State Buffer  
PORT  
CC±  
Connection and  
cable detection  
Digital Controller  
CC2  
SDA/OUT±  
I2C  
CSR  
SCL/OUT2  
Open Drain  
Output  
CTRL_EN  
VBUS Detection  
EN_N  
EN_N Logic  
SYS_VBUS  
900 K ±±1  
Copyright © 20±6, Texas Instruments Incorporated  
Figure 2. Functional Block Diagram of TUSB320  
7.1.1 Cables, Adapters, and Direct Connect Devices  
Type-C Specification 1.1 defines several cables, plugs and receptacles to be used to attach ports. The TUSB320  
device supports all cables, receptacles, and plugs. The TUSB320 device does not support e-marking.  
7.1.1.1 USB Type-C Receptacles and Plugs  
Below is list of Type-C receptacles and plugs supported by the TUSB320 device:  
USB Type-C receptacle for USB2.0 platforms and devices  
USB full-featured Type-C plug  
USB2.0 Type-C plug  
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Overview (continued)  
7.1.1.2 USB Type-C Cables  
Below is a list of Type-C cables types supported by the TUSB320 device:  
USB full-featured Type-C cable  
USB2.0 Type-C cable with USB2.0 plug  
Captive cable on remote device with either a USB full-featured plug or USB2.0 plug  
7.1.1.3 Legacy Cables and Adapters  
The TUSB320 device supports legacy cable adapters as defined by the Type-C Specification. The cable adapter  
must correspond to the mode configuration of the TUSB320 device.  
To System VBUS detection  
VBUS  
900 kΩ 1%  
Rp (56k 5%)  
VBUS_DET  
TUSB320  
CC  
CC  
Rd (5.1k 10%)  
Legacy Host Adapter  
Copyright © 2016, Texas Instruments Incorporated  
Figure 3. Legacy Adapter Implementation Circuit  
7.1.1.4 Direct Connect Devices  
The TUSB320 device supports the attaching and detaching of a direct-connect device.  
7.1.1.5 Audio Adapters  
Additionally, the TUSB320 device supports audio adapters for audio accessory mode, including:  
Passive Audio Adapter  
Charge Through Audio Adapter  
7.2 Feature Description  
7.2.1 Port Role Configuration  
The TUSB320 device can be configured as a downstream facing port (DFP), upstream facing port (UFP), or  
dualrole port (DRP) using the tri-level PORT pin. The PORT pin should be pulled high to VDD using a pullup  
resistance, low to GND or left as floated on the PCB to achieve the desired mode. This flexibility allows the  
TUSB320 device to be used in a variety of applications. The TUSB320 device samples the PORT pin after reset  
and maintains the desired mode until the TUSB320 device is reset again. The port role can also be selected  
through I2C registers. Table 1 lists the supported features in each mode:  
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Feature Description (continued)  
Table 1. Supported Features for the TUSB320 Device by Mode  
PORT PIN  
HIGH  
(DFP ONLY)  
LOW  
(UFP ONLY)  
NC  
(DRP)  
SUPPORTED  
FEATURES  
Port attach and  
detach  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Cable orientation  
(through I2C)  
Current advertisement  
Current detection  
Yes  
-
-
Yes (DFP)  
Yes (UFP)  
Yes  
Accessory modes  
(audio and debug)  
Yes  
Yes  
Yes  
Try.SRC  
Try.SNK  
-
-
Yes  
Yes  
-
-
Active cable detection  
I2C / GPIO  
Yes  
Yes  
Yes  
-
-
Yes (DFP)  
Yes  
Yes  
Yes  
Yes  
Legacy cables  
VBUS detection  
Yes  
Yes (UFP)  
7.2.1.1 Downstream Facing Port (DFP) - Source  
The TUSB320 device can be configured as a DFP only by pulling the PORT pin high through a resistance to  
VDD. In DFP mode, the TUSB320 device constantly presents Rps on both CC. In DFP mode, the TUSB320  
device initially advertises default USB Type-C current. The Type-C current can be adjusted through I2C if the  
system needs to increase the amount advertised. The TUSB320 device adjusts the Rps to match the desired  
Type-C current advertisement. In GPIO mode, the TUSB320 device only advertises default Type-C current.  
When configured as a DFP, the TUSB320 can operate with older USB Type-C 1.0 devices except for a USB  
Type-C 1.0 DRP device. A USB Type-C 1.1 compliant DFP can not connect to a Type-C 1.0 DRP. Because the  
TUSB320 is compliant to Type-C 1.1, the TUSB320 can not operate with a USB Type-C 1.0 DRP device. This  
limitation is a result of a backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C 1.0  
DRP.  
7.2.1.2 Upstream Facing Port (UFP) - Sink  
The TUSB320 device can be configured as a UFP only by pulling the PORT pin low to GND. In UFP mode, the  
TUSB320 device constantly presents pulldown resistors (Rd) on both CC pins. The TUSB320 device monitors  
the CC pins for the voltage level corresponding to the Type-C mode current advertisement by the connected  
DFP. The TUSB320 device debounces the CC pins and wait for VBUS detection before successfully attaching. As  
a UFP, the TUSB320 device detects and communicates the advertised current level of the DFP to the system  
through the OUT1 and OUT2 GPIOs (if in GPIO mode) or through the I2C CURRENT_MODE_DETECT register  
one time in the Attached.SNK state.  
7.2.1.3 Dual Role Port (DRP)  
The TUSB320 device can be configured to operate as a DRP when the PORT pin is left floated on the PCB. In  
DRP mode, the TUSB320 device toggles between operating as a DFP and a UFP. When functioning as a DFP in  
DRP mode, the TUSB320 device complies with all operations as defined for a DFP according to the Type-C  
Specification. When presenting as a UFP in DRP mode, the TUSB320 device operates as defined for a UFP  
according to the Type-C Specification.  
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The TUSB320 supports two optional Type-C DRP features called Try.SRC and Try.SNK. Products supporting  
dual-role functionality may have a need to be a source (DFP) or a sink (UFP) when connected to another dual-  
role capable product. For example, a dual-role capable notebook may desire to be a source when connected to a  
tablet, or a cell phone would prefer to be a sink when connected to a notebook or tablet. When standard DRP  
products (products which don’t support either Try.SRC or Try.SNK) are connected together, the role (UFP or  
DFP) outcome is not predetermined. These two optional DRP features provide a means for dual-role capable  
products to connect to another dual-role capable product in the role desired. Try.SRC and Try.SNK are only  
available when TUSB320 is configured in I2C mode. When operating in GPIO mode, the TUSB320 will always  
operate as a standard DRP.  
The TUSB320’s Try.SRC feature provides a means for a DRP product to connect as a DFP when connected to  
another DRP product that doesn’t implement Try.SRC. When two products which implement Try.SRC are  
connected together, the role outcome of either UFP or DFP is the same as a standard DRP. Try.SRC is enabled  
by changing I2C register SOURCE_PREF to 2’b11. Once this register is changed to 2’b11, the TUSB320 will  
always attempt to connect as a DFP when attached to another DRP capable device.  
The TUSB320’s Try.SNK feature provides a method for a DRP product to connect as a UFP when connected to  
another DRP product that doesn’t implement Try.SNK. When two products which implement Try.SNK are  
connected together, the role outcome of either UFP or DFP is the same as a standard DRP. Try.SNK is enabled  
by changing I2C register SOURCE_PREF to 2’b01. Once this register is changed to 2’b01, the TUSB320 will  
always attempt to connect as a UFP when attached to another DRP capable device.  
7.2.2 Type-C Current Mode  
When a valid cable detection and attach have been completed, the DFP has the option to advertise the level of  
Type-C current a UFP can sink. The default current advertisement for the TUSB320 device is max of 500 mA (for  
USB2.0) or max of 900 mA (for USB3.1). If a higher level of current is available, the I2C registers can be written  
to provide medium current at 1.5 A or high current at 3 A. When the CURRENT_MODE_ADVERTISE register  
has been written to advertise higher than default current, the DFP adjusts the Rps for the specified current level.  
If a DFP advertises 3 A, system designer must ensure that the VDD of the TUSB320 device is 3.5 V or greater.  
Table 2 lists the Type-C current advertisements in GPIO an I2C modes.  
Table 2. Type-C Current Advertisement for GPIO and I2C Modes  
GPIO MODE (ADDR PIN IN NC)  
I2C MODE (ADDR PIN H, L)  
TYPE-C CURRENT  
UFP (PORT PIN L)  
DFP (PORT PIN H)  
UFP  
DFP  
max of 500  
mA (USB2.0)  
max of 900  
mA (USB3.1)  
I2C register default is 500  
or 900 mA (max)  
Default  
Only advertisement  
N/A  
Current mode detected  
and output through OUT1  
/ OUT2  
Current mode detected  
and read through I2C  
register  
Medium - 1.5 A (max)  
Advertisement selected  
through writing I2C  
register  
High - 3 A (max)  
7.2.3 Accessory Support  
The TUSB320 device supports audio and debug accessories in UFP, DFP mode and DRP mode. Audio and  
debug accessory support is provided through reading of I2C registers. Audio accessory is also supported through  
GPIO mode with INT_N/OUT3 pin (audio accessory is detected when INT_N/OUT3 pin is low).  
7.2.3.1 Audio Accessory  
Audio accessory mode is supported through two types of adapters. First, the passive audio adapter can be used  
to convert the Type-C connector into an audio port. In order to effectively detect the passive audio adapter, the  
TUSB320 device must detect a resistance < Ra on both of the CC pins.  
Secondly, a charge through audio adapter may be used. The primary difference between a passive and charge  
through adapter is that the charge through adapter supplies 500 mA of current over VBUS. The charge through  
adapter contains a receptacle and a plug. The plug acts as a DFP and supply VBUS when the plug detects a  
connection.  
When the TUSB320 device is configured in GPIO mode, OUT3 pin determines if an audio accessory is  
connected. When an audio accessory is detected, the OUT3 pin is pulled low.  
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7.2.3.2 Debug Accessory  
Debug is an additional state supported by USB Type-C. The specification does not define a specific user  
scenario for this state, but it is important because the end user could use debug accessory mode to enter a test  
state for production specific to the application. Charge through debug accessory is not supported by TUSB320  
when in DRP or UFP mode.  
7.2.4 I2C and GPIO Control  
The TUSB320 device can be configured for I2C communication or GPIO outputs using the ADDR pin. The ADDR  
pin is a tri-level control pin. When the ADDR pin is left floating (NC), the TUSB320 device is in GPIO output  
mode. When the ADDR pin is pulled high or pulled low, the TUSB320 device is in I2C mode.  
All outputs for the TUSB320 device are open drain configuration.  
The OUT1 and OUT2 pins are used to output the Type-C current mode when in GPIO mode. Additionally, the  
OUT3 pin is used to communicate the audio accessory mode in GPIO mode. Table 3 lists the output pin settings.  
See for more information.  
Table 3. Simplified Operation for OUT1 and OUT2  
OUT1  
OUT2  
ADVERTISEMENT  
H
H
L
H
L
Default Current in Unattached State  
Default Current in Attached State  
Medium Current (1.5 A) in Attached State  
High Current (3.0 A) in Attached State  
H
L
L
When operating in I2C mode, the TUSB320 device uses the SCL and SDA lines for clock and data and the  
INT_N pin to communicate a change in I2C registers, or an interrupt, to the system. The INT_N pin is pulled low  
when the TUSB320 device updates the registers with new information. The INT_N pin is open drain. The  
INTERRUPT_STATUS register will be set when the INT_N pin is pulled low. To clear the INTERRUPT_STATUS  
register, the end user writes to I2C.  
When operating in GPIO mode, the OUT3 pin is used in place of the INT_N pin to determine if an audio  
accessory is detected and attached. The OUT3 pin is pulled low when an audio accessory is detected.  
NOTE  
When using the 3.3 V supply for I2C, the end user must ensure that the VDD is 3 V and  
above. Otherwise the I2C may back power the device.  
7.2.5 VBUS Detection  
The TUSB320 device supports VBUS detection according to the Type-C Specification. VBUS detection is used to  
determine the attachment and detachment of a UFP and to determine the entering and exiting of accessary  
modes. VBUS detection is also used to successfully resolve the role in DRP mode.  
The system VBUS voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin on the TUSB320  
device if the PORT pin is configured as a DRP or a UFP. If the TUSB320 device is configured as a DFP and only  
ever used in DFP mode, the VBUS_DET pin can be left unconnected.  
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7.3 Device Functional Modes  
The TUSB320 device has four functional modes. Table 4 lists these modes:  
Table 4. USB Type-C States According to TUSB320 Functional Modes  
MODES  
GENERAL BEHAVIOR  
PORT PIN  
STATES(1)  
Unattached.SNK  
UFP  
AttachWait.SNK  
USB port unattached. ID, PORT  
operational. I2C on. CC pins  
configure according to PORT pin.  
Toggle Unattached.SNK Unattached.SRC  
AttachedWait.SRC or AttachedWait.SNK  
Unattached.SRC  
Unattached  
DRP  
DFP  
AttachWait.SRC  
Attached.SNK  
UFP  
DRP  
DFP  
Audio accessory  
Debug accessory  
Attached.SNK  
Attached.SRC  
USB port attached. All GPIOs  
operational. I2C on.  
Active  
Audio accessory  
Debug accessory  
Attached.SRC  
Audio accessory  
Debug accessory  
No operation.  
VDD not available.  
Dead battery  
Shutdown  
UFP/DRP/DFP  
UFP/DRP/DFP  
Default device state to UFP/SNK with Rd.  
VDD available.  
TUSB320L's EN_N pin high.  
TUSB320H's EN pin low.  
Default device state to UFP/SNK with Rd.  
(1) Required; not in sequential order.  
7.3.1 Unattached Mode  
Unattached mode is the primary mode of operation for the TUSB320 device, because a USB port can be  
unattached for a lengthy period of time. In unattached mode, VDD is available, and all IOs and I2C are  
operational. After the TUSB320 device is powered up, the part enters unattached mode until a successful attach  
has been determined. Initially, right after power up, the TUSB320 device comes up as an Unattached.SNK. The  
TUSB320 device checks the PORT pin and operates according to the mode configuration. The TUSB320 device  
toggles between the UFP and the DFP if configured as a DRP. In unattached mode, I2C can be used to change  
the mode configuration or port role if the board configuration of the PORT pin is not the desired mode. Writing to  
the I2C MODE_SELECT register can override the PORT pin in unattached mode. The PORT pin is only sampled  
at reset (TUSB320L's EN_N high to low transition or TUSB320H's EN low to high transition), after  
I2C_SOFT_RESET, or power up. I2C must be used after reset to change the device mode configuration.  
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7.3.2 Active Mode  
Active mode is defined as the port being attached. In active mode, all GPIOs are operational, and I2C is read /  
write (R/W). When in active mode, the TUSB320 device communicates to the AP that the USB port is attached.  
This happens through the ID pin if TUSB320 is configured as a DFP or DRP connect as source. If TUSB320 is  
configured as a UFP or a DRP connected as a sink, the OUT1/OUT2 and INT_N/OUT3 pins are used. The  
TUSB320 device exits active mode under the following conditions:  
Cable unplug  
VBUS removal if attached as a UFP  
Dead battery; system battery or supply is removed  
TUSB320L EN_N pin floated or pulled high  
TUSB320H EN pin floated or pulled low.  
During active mode, I2C be used to change the mode configuration. This can be done by following the sequence  
below. This same sequence is valid when TUSB320 is in unattached mode.  
Set DISABLE_TERM register (address 0x0A bit 0) to a 1'b1.  
Change MODE_SELECT register (address 0x0A bits 5:4) to desired mode of operation.  
Wait 5 ms.  
Clear DISABLE_TERM register (address 0x0A bit 0) to 1'b0.  
7.3.3 Dead Battery Mode  
During dead battery mode, VDD is not available. CC pins always default to pulldown resistors in dead battery  
mode. Dead battery mode means:  
TUSB320 in UFP with 5.1-kΩ ± 20% Rd; cable connected and providing charge  
TUSB320 in UFP with 5.1-kΩ ± 20% Rd; nothing connected (application could be off or have a discharged  
battery)  
NOTE  
When VDD is off, the TUSB320 non-failsafe pins (VBUS_DET, ADDR, PORT, ID, OUT[3:1]  
pins) could back-drive the TUSB320 device if not handled properly. When necessary to  
pull these pins up, it is recommended to pullup PORT, ADDR, INT_N/OUT3, and ID to the  
device’s VDD supply. The VBUS_DET must be pulled up to VBUS through a 900-kΩ  
resistor.  
7.3.4 Shutdown Mode  
Shutdown mode for TUSB320L device is defined as follows:  
Supply voltage available and EN_N pin is pulled high or floating.  
EN_N pin has internal pullup resistor.  
The TUSB320L device is off, but still maintains the Rd on the CC pins  
Shutdown mode for TUSB320H device is defined as follows:  
Supply voltage available and EN pin is pulled low or floating.  
EN pin has internal pulldown resistor.  
The TUSB320H device is off, but still maintains the Rd on the CC pins  
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7.4 Programming  
For further programmability, the TUSB320 device can be controlled using I2C. The TUSB320 device local I2C  
interface is available for reading/writing after TI2C_EN when the device is powered up. The SCL and SDA terminals  
are used for I2C clock and I2C data respectively. If I2C is the preferred method of control, the ADDR pin must be  
set accordingly.  
Table 5. TUSB320 I2C Addresses  
TUSB320 I2C Target Address  
ADDR pin  
Bit 7 (MSB)  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0 (W/R)  
H
L
1
1
1
0
0
0
0
0
1
1
1
1
1
1
0/1  
0/1  
The following procedure should be followed to write to TUSB320 I2C registers:  
1. The master initiates a write operation by generating a start condition (S), followed by the TUSB320 7-bit  
address and a zero-value R/W bit to indicate a write cycle  
2. The TUSB320 device acknowledges the address cycle  
3. The master presents the sub-address (I2C register within the TUSB320 device) to be written, consisting of  
one byte of data, MSB-first  
4. The TUSB320 device acknowledges the sub-address cycle  
5. The master presents the first byte of data to be written to the I2C register  
6. The TUSB320 device acknowledges the byte transfer  
7. The master may continue presenting additional bytes of data to be written, with each byte transfer completing  
with an acknowledge from the TUSB320 device  
8. The master terminates the write operation by generating a stop condition (P)  
The following procedure should be followed to read the TUSB320 I2C registers:  
1. The master initiates a read operation by generating a start condition (S), followed by the TUSB320 7-bit  
address and a one-value R/W bit to indicate a read cycle  
2. The TUSB320 device acknowledges the address cycle  
3. The TUSB320 device transmits the contents of the memory registers MSB-first starting at register 00h or last  
read sub-address+1. If a write to the T I2C register occurred prior to the read, then the TUSB320 device  
starts at the sub-address specified in the write.  
4. The TUSB320 device waits for either an acknowledge (ACK) or a not-acknowledge (NACK) from the master  
after each byte transfer; the I2C master acknowledges reception of each data byte transfer  
5. If an ACK is received, the TUSB320 device transmits the next byte of data  
6. The master terminates the read operation by generating a stop condition (P)  
The following procedure should be followed for setting a starting sub-address for I2C reads:  
1. The master initiates a write operation by generating a start condition (S), followed by the TUSB320 7-bit  
address and a zero-value R/W bit to indicate a read cycle  
2. The TUSB320 device acknowledges the address cycle  
3. The master presents the sub-address (I2C register within the TUSB320 device) to be read, consisting of one  
byte of data, MSB-first  
4. The TUSB320 device acknowledges the sub-address cycle  
5. The master terminates the read operation by generating a stop condition (P)  
NOTE  
If no sub-addressing is included for the read procedure, then the reads start at register  
offset 00h and continue byte-by-byte through the registers until the I2C master terminates  
the read operation. If a I2C address write occurred prior to the read, then the reads start at  
the sub-address specified by the address write.  
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7.5 Register Maps  
Table 6. CSR Registers  
ACCESS  
NAME  
TAG  
MEANING  
R
W
S
Read  
Write  
The field may be read by software.  
The field may be written by software.  
Set  
The field may be set by a write of one. Writes of zeros to the field have no effect.  
C
Clear  
The field may be cleared by a write of one. Writes of zeros to the field have no effect.  
Hardware may autonomously update this field.  
U
Update  
No Access  
NA  
Not accessible or not applicable.  
7.5.1 CSR Registers (address = 0x00 – 0x07)  
Figure 4. CSR Registers (address = 0x00 – 0x07)  
7
6
5
4
3
2
1
0
DEVICE_ID  
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 7. CSR Registers (address = 0x00 – 0x07)  
Bit  
Field  
Type  
Reset  
Description  
For the TUSB320 device these fields return a string of ASCII  
characters returning TUSB320  
Addresses 0x07 - 0x00 = {0x00 0x54 0x55 0x53 0x42 0x33 0x32  
0x30}  
7:0  
DEVICE_ID  
R
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7.5.2 CSR Registers (address = 0x08)  
Figure 5. CSR Registers (address = 0x08)  
7
6
5
4
3
2
1
0
ACTIVE_CABLE_  
DETECTION  
CURRENT_MODE_ADVERTISE  
RW  
CURRENT_MODE_DETECT  
RU  
ACCESSORY_CONNECTED  
RU  
RU  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 8. CSR Registers (address = 0x08)  
Bit  
Field  
Type  
Reset  
Description  
These bits are programmed by the application to raise the  
current advertisement from default.  
00 – Default (500 mA / 900 mA) initial value at startup  
7:6  
CURRENT_MODE_ADVERTISE  
00  
RW  
01 – Mid (1.5 A)  
10 – High (3 A)  
11 – Reserved  
These bits are set when a UFP determines the Type-C Current  
mode.  
00 – Default (value at start up)  
01 – Medium  
5:4  
CURRENT_MODE_DETECT  
00  
RU  
10 – Charge through accessory – 500 mA  
11 – High  
These bits are read by the application to determine if an  
accessory was attached.  
000 – No accessory attached (default)  
001 – Reserved  
010 – Reserved  
3:1  
ACCESSORY_CONNECTED  
ACTIVE_CABLE_DETECTION  
000  
RU  
RU  
011 – Reserved  
100 – Audio accessory  
101 – Audio charged thru accessory  
110 – Debug accessory when TUSB320 is connected as a DFP.  
111 – Debug accessory when TUSB320 is connected as a UFP.  
This flag indicates that an active cable has been plugged into  
the Type-C connector. When this field is set, an active cable is  
detected.  
0
0
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7.5.3 CSR Registers (address = 0x09)  
Figure 6. CSR Registers (address = 0x09)  
7
6
5
4
3
R
2
1
0
DISABLE_UFP_  
ACCESSORY  
ATTACHED_STATE  
RU  
CABLE_DIR INTERRUPT_STATUS  
RU RCU  
DRP_DUTY_CYCLE  
RW  
RW  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 9. CSR Registers (address = 0x09)  
Bit  
Field  
Type  
Reset  
Description  
This is an additional method to communicate attach other than  
the ID pin. These bits can be read by the application to  
determine what was attached.  
00 – Not attached (default)  
01 – Attached.SRC (DFP)  
10 – Attached.SNK (UFP)  
11 – Attached to an accessory  
7:6  
ATTACHED_STATE  
00  
RU  
Cable orientation. The application can read these bits for cable  
orientation information.  
5
4
CABLE_DIR  
1
0
RU  
0 – CC1  
1 – CC2 (default)  
The INT pin is pulled low whenever a CSR with RU in Access  
field changes. When a CSR change has occurred this bit should  
be held at 1 until the application clears it. A write of 1'b1 is  
required to clear this field.  
0 – Clear  
INTERRUPT_STATUS  
RCU  
1 – Interrupt (When INT_N is pulled low, this bit will be 1. )  
Note: SW must make sure the INTERRUPT_STATUS has been  
cleared to zero. Rewrites to this register are needed for the  
INT_N to be correctly asserted for all interrupt events.  
3
Reserved  
R
0
Reserved  
Percentage of time that a DRP advertises DFP during tDRP  
00 – 30% (default)  
2:1  
DRP_DUTY_CYCLE  
00  
01 – 40%  
RW  
10 – 50%  
11 – 60%  
Settings this field will disable UFP accessory support.  
0 – UFP accessory support enabled (Default)  
1 – UFP accessory support disabled  
0
DISABLE_UFP_ACCESSORY  
RW  
0
18  
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7.5.4 CSR Registers (address = 0x0A)  
Figure 7. CSR Registers (address = 0x0A)  
7
6
5
4
3
2
1
0
DISABLE_TERM  
RW  
DEBOUNCE  
RW  
MODE_SELECT  
RW  
I2C_SOFT_RESET  
SOURCE_PREF  
RW  
RSU  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 10. CSR Registers (address = 0x0A)  
Bit  
Field  
Type  
Reset  
Description  
The nominal amount of time the TUSB320 device debounces  
the voltages on the CC pins.  
00 – 168ms (default)  
01 – 118ms  
7:6  
DEBOUNCE  
00  
RW  
10 – 134ms  
11 – 152ms  
This register can be written to set the TUSB320 device mode  
operation. The ADDR pin must be set to I2C mode. If the default  
is maintained, the TUSB320 device operates according to the  
PORT pin levels and modes.  
5:4  
MODE_SELECT  
00  
RW  
00 – Maintain mode according to PORT pin selection (default)  
01 – UFP mode (unattached.SNK)  
10 – DFP mode(unattached.SRC)  
11 – DRP mode(start from unattached.SNK)  
This resets the digital logic. The bit is self-clearing. A write of 1  
starts the reset. The following registers maybe affected after  
setting this bit:  
CURRENT_MODE_DETECT  
ACTIVE_CABLE_DETECTION  
ACCESSORY_CONNECTED  
ATTACHED_STATE  
3
I2C_SOFT_RESET  
RSU  
0
CABLE_DIR  
This field controls the TUSB320 behavior when configured as a  
DRP.  
00 – Standard DRP (default)  
01 – DRP will perform Try.SNK.  
10 – Reserved.  
2:1  
SOURCE_PREF  
DISABLE_TERM  
RW  
RW  
00  
11 – DRP will perform Try.SRC.  
This field will disable the termination on the CC pins and  
transition the TUSB320's CC state machine to the Disable State.  
0
0
0 – Termination enabled according to Port (Default)  
1 – Termination disabled and state machine held in Disabled  
state.  
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7.5.5 CSR Registers (address = 0x45)  
Figure 8. CSR Registers (address = 0x45)  
7
6
5
R
4
3
2
DISABLE_RD_RP  
RW  
1
0
RW  
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 11. CSR Registers (address = 0x45)  
Bit  
Field  
Type  
Reset  
Description  
7:3  
Reserved  
R
00000  
Reserved  
When this field is set, Rd and Rp are disabled.  
0 – Normal operation (default)  
2
DISABLE_RD_RP  
Reserved  
RW  
RW  
0
1 – Disable Rd and Rp  
1:0  
00  
For TI internal use only. Do not change default value.  
7.5.6 CSR Registers (address = 0xA0)  
Figure 9. CSR Registers (address = 0xA0)  
7
6
5
4
3
2
1
0
REVISION  
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset  
Table 12. CSR Registers (address = 0xA0)  
Bit  
Field  
Type  
Reset  
Description  
Revision of TUSB320. Defaults to 0x01.  
7:0  
REVISION  
R
0x01  
20  
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8 Application and Implementation  
NOTE  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The TUSB320 device is a Type-C configuration channel logic and port controller. The TUSB320 device can  
detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and power  
capabilities (both detection and broadcast). The TUSB320 device can be used in a source application (DFP), in a  
sink application (UFP), or a combination source/sink application (DRP).  
8.2 Typical Application  
8.2.1 DRP in I2C Mode  
Figure 10 and Figure 11 show a Type-C configuration for the DRP mode.  
5 V  
Legacy TypeA  
Switch  
VBUS  
VBUS  
PMIC  
VPH  
PORT  
ID  
VBUS  
VBUS  
2.7 - 5 V VDD  
PORT  
CC1  
CC2  
VDD  
ID  
CC1  
CC2  
CC/Mode  
Controller  
CC/Mode  
Controller  
DP  
DM  
DP  
DM  
GPIOs  
I2C  
GPIOs  
I2C  
Processor  
Processor  
TUSB320  
TUSB320  
Copyright © 2016, Texas Instruments Incorporated  
Copyright © 2016, Texas Instruments Incorporated  
Figure 10. TUSB320 in DRP Mode Supporting Default  
Implementation  
Figure 11. TUSB320 in DRP Mode Supporting Advanced  
Power Delivery  
Figure 12 shows the TUSB320 device configured as a DRP in I2C mode.  
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Typical Application (continued)  
USB VBUS Switch  
(optional BC 1.2 support for legacy)  
SCL  
SDA  
DM  
DP  
DM_OUT  
DP_OUT  
DM_IN  
DP_IN  
VOUT  
System VBUS  
VIN  
PS_EN  
EN  
FAULT#  
PS_FAULT#  
VBUS  
I2C I/O  
1.8V or 3.3V  
VBAT  
USB2  
OTG  
and  
DM  
DP  
150uF  
100nF  
VBUS  
PMIC  
A1  
A2  
A3  
A4  
B12  
900K  
4.7K 4.7K  
200K 200K  
VBUS_DET  
B11  
B10  
B9  
PORT  
INT_N/OUT3  
CC1  
CC2  
INT#  
CC1  
CC2  
A5  
A6  
B8  
B7  
B6  
TUSB320L  
ID  
SCL  
SDA  
ID  
A7  
A8  
B5  
B4  
B3  
SCL/OUT2  
SDA/OUT1  
A9  
A10  
A11  
B2  
B1  
1uF  
A12  
Copyright © 2016, Texas Instruments Incorporated  
Figure 12. DRP in I2C Mode Schematic  
8.2.1.1 Design Requirements  
For this design example, use the parameters listed in Table 13:  
Table 13. Design Requirements for DRP in I2C Mode  
DESIGN PARAMETER  
VALUE  
VDD (2.75 V to 5 V)  
VBAT (less than 5 V)  
Mode (I2C or GPIO)  
I2C: ADDR pin must be pulled down or pulled up  
0x47: ADDR pin must be pulled low or tied to GND  
DRP: PORT pin is NC  
I2C address (0x67 or 0x47)  
Type-C port type (UFP, DFP, or DRP)  
Shutdown support  
No  
8.2.1.2 Detailed Design Procedure  
The TUSB320 device supports a VDD in the range of 2.75 V to 5 V. In this particular use case, VBAT which must  
be in the required VDD range is connected to the VDD pin. A 100-nF capacitor is placed near VDD  
.
The TUSB320 device is placed into I2C mode by either pulling the ADDR pin high or low. In this case, the ADDR  
pin is tied to GND which results in a I2C address of 0x47. The SDA and SCL must be pulled up to either 1.8 V or  
3.3 V. When pulled up to 3.3 V, the VDD supply must be at least 3 V to keep from back-driving the I2C interface.  
The TUSB320L device can enter shutdown mode by pulling the EN_N pin high, which puts the TUSB320L device  
into a low power state. In this case, external control of the EN_N pin is not implemented and therefore the EN_N  
pin is tied to GND. The TUSB320H device can enter shutdown mode by pulling the EN pin low, which puts the  
TUSB320H device into a low power state. In this case, external control of the EN pin is not implemented and  
therefore the EN pin is tied to 1.8V or 3.3V.  
The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB320 I2C registers occurs. This pin is  
an open drain output and requires an external pullup resistor. The pin should be pulled up to VDD using a 200-kΩ  
resistor.  
22  
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The ID pin is used to indicate when a connection has occurred if the TUSB320 device is a DFP while configured  
for DRP. An OTG USB controller can use this pin to determine when to operate as a USB Host or USB Device.  
When this pin is driven low, the OTG USB controller functions as a host and then enables VBUS. The Type-C  
standard requires that a DFP not enable VBUS until it is in the Attached.SRC state. If the ID pin is not low but  
VBUS is detected, then OTG USB controller functions as a device. The ID pin is open drain output and requires  
an external pullup resistor. It should be pulled up to VDD using a 200-kΩ resistor.  
The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is not connected, the  
TUSB320 device is in DRP mode. The Type-C port mode can also be controlled by the MODE_SELECT register  
through the I2C interface.  
The VBUS_DET pin must be connected through a 900-kΩ resistor to VBUS on the Type-C that is connected. This  
large resistor is required to protect the TUSB320 device from large VBUS voltage that is possible in present day  
systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB320 device in the  
recommended range.  
The USB2 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the  
TUSB320 device in a DRP mode, it alternates between UFP and DFP. If the TUSB320 device connects as a  
UFP, the large bulk capacitance must be removed.  
Table 14. USB2 Bulk Capacitance Requirements  
PORT CONFIGURATION  
Downstream facing port (DFP)  
Upstream facing port (UFP)  
MIN  
120  
1
MAX  
UNIT  
µF  
10  
µF  
8.2.1.3 Application Curves  
Figure 13. Application Curve for DRP in I2C Mode  
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8.2.2 DFP in I2C Mode  
Figure 14 and Figure 15 show a Type-C configuration for the DFP mode.  
Legacy TypeA  
Switch  
5 V  
VBUS  
VBUS  
PMIC  
VDD  
PORT  
VPH  
ID  
VBUS  
VDD  
VBUS  
2.7 - 5 V VDD  
PORT  
CC1  
CC2  
VDD  
ID  
CC1  
CC2  
CC/Mode  
Controller  
CC/Mode  
Controller  
DP  
DM  
GPIOs  
I2C  
DP  
DM  
GPIOs  
I2C  
Processor  
Processor  
TUSB320  
TUSB320  
Copyright © 2016, Texas Instruments Incorporated  
Copyright © 2016, Texas Instruments Incorporated  
Figure 14. TUSB320 in DFP Mode Supporting Default  
Implementation  
Figure 15. TUSB320 in DFP Mode Supporting Advanced  
Power Delivery  
Figure 16 shows the TUSB320 device configured as a DFP in I2C mode.  
USB VBUS Switch  
(optional BC 1.2 support for legacy)  
SCL  
SDA  
DM  
DP  
DM_OUT  
DP_OUT  
DM_IN  
DP_IN  
VOUT  
System VBUS  
VIN  
PS_EN  
EN  
FAULT#  
PS_FAULT#  
VBUS  
I2C I/O  
1.8V or  
3.3V  
VDD_5V  
USB2  
OTG  
and  
DM  
DP  
150uF  
100nF  
VBUS  
PMIC  
B12  
A1  
A2  
A3  
A4  
900K  
200K  
4.7K 4.7K  
200K  
200K  
VBUS_DET  
B11  
B10  
B9  
PORT  
INT_N/OUT3  
CC1  
CC2  
INT#  
A5  
A6  
B8  
B7  
B6  
CC1  
CC2  
TUSB320L  
ID  
SCL  
SDA  
ID  
A7  
A8  
B5  
B4  
B3  
SCL/OUT2  
SDA/OUT1  
A9  
A10  
A11  
B2  
B1  
A12  
Copyright © 2016, Texas Instruments Incorporated  
Figure 16. DFP in I2C Mode Schematic  
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8.2.2.1 Design Requirements  
For this design example, use the parameters listed in Table 15:  
Table 15. Design Requirements for DFP in I2C Mode  
DESIGN PARAMETER  
VDD (2.75 V to 5 V)  
VALUE  
5 V  
Mode (I2C or GPIO)  
I2C: ADDR pin must be pulled down or pulled up  
0x47: ADDR pin must be pulled low or tied to GND  
DFP: PORT pin is pulled up  
I2C address (0x67 or 0x47)  
Type-C port type (UFP, DFP, or DRP)  
Shutdown support  
No  
8.2.2.2 Detailed Design Procedure  
The TUSB320 device supports a VDD in the range of 2.75 V to 5 V. In this particular case, VDD is set to 5 V. A  
100-nF capacitor is placed near VDD  
.
The TUSB320 device is placed into I2C mode by either pulling the ADDR pin high or low. In this particular case,  
the ADDR pin is tied to GND which results in a I2C address of 0x47. The SDA and SCL must be pulled up to  
either 1.8 V or 3.3 V. When pulled up to 3.3 V, the VDD supply must be at least 3 V to keep from back-driving the  
I2C interface.  
The TUSB320L device can enter shutdown mode by pulling the EN_N pin high, which puts the TUSB320L device  
into a low power state. In this case, external control of the EN_N pin is not implemented and therefore the EN_N  
pin is tied to GND. The TUSB320H device can enter shutdown mode by pulling the EN pin low, which puts the  
TUSB320H device into a low power state. In this case, external control of the EN pin is not implemented and  
therefore the EN pin is tied to 1.8V or 3.3V.  
The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB320 I2C registers occurs. This pin is  
an open drain output and requires an external pullup resistor. The pin should be pulled up to VDD using a 200-kΩ  
resistor.  
The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is pulled high, the  
TUSB320 device is in DFP mode. The Type-C port mode can also be controlled by the MODE_SELECT register  
through the I2C interface.  
The VBUS_DET pin must be connected through a 900-kΩ resistor to VBUS on the Type-C that is connected. This  
large resistor is required to protect the TUSB320 device from large VBUS voltage that is possible in present day  
systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB320 device in the  
recommended range.  
The USB2 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the  
TUSB320 device in a DFP mode, a bulk capacitance of at least 120µF is required. In this particular case, a 150-  
µF capacitor was chosen.  
8.2.2.3 Application Curves  
Figure 17. Application Curve for DFP in I2C Mode  
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8.2.3 UFP in I2C Mode  
Figure 18 and Figure 19 show a Type-C configuration for the UFP mode.  
5 V  
VBUS  
VBUS  
PMIC  
VPH  
PORT  
ID  
VBUS  
VBUS  
2.7 - 5 V  
VDD  
CC1  
CC2  
VDD  
ID  
CC1  
CC2  
PORT  
CC/Mode  
Controller  
CC/Mode  
Controller  
DP  
DM  
GPIOs  
I2C  
DP  
DM  
Processor  
GPIOs  
I2C  
Processor  
TUSB320  
GND  
TUSB320  
Copyright © 2016, Texas Instruments Incorporated  
Copyright © 2016, Texas Instruments Incorporated  
Figure 18. TUSB320 in UFP Mode Supporting Default  
Implementation  
Figure 19. TUSB320 in UFP Mode Supporting Advanced  
Power Delivery  
Figure 20 shows the TUSB320 device configured as a UFP in I2C mode.  
Optional power  
TUSB320 with VBUS  
less than 5.5V  
DM  
DP  
VBUS  
D1  
I2C I/O  
1.8V or 3.3V  
VDD_5V  
USB2  
Device  
DM  
DP  
and  
100nF  
VBUS  
PMIC  
B12  
A1  
A2  
A3  
A4  
900K  
4.7K 4.7K  
200K 200K  
VBUS_DET  
B11  
B10  
B9  
PORT  
CC1  
CC2  
INT#  
INT_N/OUT3  
A5  
A6  
B8  
B7  
B6  
CC1  
CC2  
TUSB320L  
ID  
A7  
A8  
B5  
B4  
B3  
SCL  
SDA  
SCL/OUT2  
SDA/OUT1  
A9  
A10  
A11  
1uF  
B2  
B1  
A12  
4.7K  
Copyright © 2016, Texas Instruments Incorporated  
Figure 20. UFP in I2C Mode Schematic  
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8.2.3.1 Design Requirements  
For this design example, use the parameters listed in Table 16:  
Table 16. Design Requirements for UFP in I2C Mode  
DESIGN PARAMETER  
VDD (2.75 V to 5 V)  
VALUE  
5 V  
Mode (I2C or GPIO)  
I2C: ADDR pin must be pulled down or pulled up  
0x47: ADDR pin must be pulled low or tied to GND  
UFP: PORT pin is pulled down  
No  
I2C address (0x67 or 0x47)  
Type-C port type (UFP, DFP, or DRP)  
Shutdown support  
8.2.3.2 Detailed Design Procedure  
The TUSB320 device supports a VDD in the range of 2.75 V to 5 V. In this particular case, VDD is set to 5 V. A  
100-nF capacitor is placed near VDD. If VBUS is guaranteed to be less than 5.5 V, powering the TUSB320 device  
through a diode can be implemented.  
The TUSB320 device is placed into I2C mode by either pulling the ADDR pin high or low. In this case, the ADDR  
pin is tied to GND which results in a I2C address of 0x47. The SDA and SCL must be pulled up to either 1.8 V or  
3.3 V. When pulled up to 3.3 V, the VDD supply must be at least 3 V to keep from back-driving the I2C interface.  
The TUSB320L device can enter shutdown mode by pulling the EN_N pin high, which puts the TUSB320L device  
into a low power state. In this case, external control of the EN_N pin is not implemented and therefore the EN_N  
pin is tied to GND. The TUSB320H device can enter shutdown mode by pulling the EN pin low, which puts the  
TUSB320H device into a low power state. In this case, external control of the EN pin is not implemented and  
therefore the EN pin is tied to 1.8V or 3.3V.  
The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB320 I2C registers occurs. This pin is  
an open drain output and requires an external pullup resistor. The pin should be pulled up to VDD using a 200-kΩ  
resistor.  
The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is pulled low, the  
TUSB320 device is in UFP mode. The Type-C port mode can also be controlled by the MODE_SELECT register  
through the I2C interface.  
The VBUS_DET pin must be connected through a 900-kΩ resistor to VBUS on the Type-C that is connected. This  
large resistor is required to protect the TUSB320 device from large VBUS voltage that is possible in present day  
systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB320 device in the  
recommended range.  
The USB2 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the  
TUSB320 device in a UFP mode, a bulk capacitance between 1 to 10µF is required. In this particular case, a 1-  
µF capacitor was chosen.  
8.2.3.3 Application Curves  
Figure 21. Application Curve for UFP in I2C Mode  
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8.3 Initialization Set Up  
8.3.1 TUSB320L Initialization Procedure  
The general power-up sequence for the TUSB320L device (EN_N tied to ground) is as follows:  
1. System is powered off (device has no VDD). The TUSB320L device is configured internally in UFP mode with  
Rds on CC pins (dead battery).  
2. VDD ramps – POR circuit. VDD must ramp within 25 ms or less. IO pull-up power rail (i.e. pull up on ID, INT,  
SCL, SDA, ADDR, PORT) must ramp with VDD or lag after VDD  
3. I2C supply ramps up.  
.
4. The TUSB320L device enters unattached mode and determines the voltage level from the PORT pin. This  
determines the mode in which the TUSB320L device operates (DFP, UFP, DRP).  
5. The TUSB320L device monitors the CC pins as a DFP and VBUS for attach as a UFP.  
6. The TUSB320L device enters active mode when attach has been successfully detected.  
8.3.2 TUSB320H Initialization Procedure  
The general power-up sequence for the TUSB320H device (EN tied to 1.8V or 3.3V) is as follows:  
1. System is powered off (device has no VDD). The TUSB320H device is configured internally in UFP mode with  
Rds on CC pins (dead battery).  
2. VDD ramps – POR circuit. VDD must ramp within 25 ms or less. IO pull-up power rail (i.e. pull up on ID, INT,  
SCL, SDA, ADDR, PORT) must ramp with VDD or lag after VDD  
3. I2C supply ramps up.  
.
4. The TUSB320H device enters unattached mode and determines the voltage level from the PORT pin. This  
determines the mode in which the TUSB320H device operates (DFP, UFP, DRP).  
5. The TUSB320H device monitors the CC pins as a DFP and VBUS for attach as a UFP.  
6. The TUSB320H device enters active mode when attach has been successfully detected.  
9 Power Supply Recommendations  
The TUSB320 device has a wide power supply range from 2.7 to 5 V. The TUSB320 device can be run off of a  
system power such as a battery.  
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10 Layout  
10.1 Layout Guidelines  
1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6  
to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:  
A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.  
A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.  
2. A 100-nF capacitor should be placed as close as possible to the TUSB320 VDD pin.  
10.2 Layout Example  
SCL/OUT2  
Figure 22. TUSB320 Layout  
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11 器件和文档支持  
11.1 相关链接  
下面的表格列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件,以及申请样片或购买产品的  
快速链接。  
17. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
样片与购买  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
工具和软件  
请单击此处  
请单击此处  
支持和社区  
请单击此处  
请单击此处  
TUSB320HI  
TUSB320LI  
11.2 接收文档更新通知  
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。请单击右上角的通知我 进行注册,即可收到任意产  
品信息更改每周摘要。有关更改的详细信息,请查看任意已修订文档中包含的修订历史记录。  
11.3 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.4 商标  
E2E is a trademark of Texas Instruments.  
USB Type-C is a trademark of USB Implementers Forum.  
All other trademarks are the property of their respective owners.  
11.5 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
11.6 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 机械、封装和可订购信息  
以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时,我们可能不  
会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本,请参见左侧的导航栏。  
30  
版权 © 2015–2017, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TUSB320HIRWBR  
TUSB320LIRWBR  
ACTIVE  
ACTIVE  
X2QFN  
X2QFN  
RWB  
RWB  
12  
12  
3000 RoHS & Green  
3000 RoHS & Green  
NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
-40 to 85  
-40 to 85  
5H  
5L  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Jan-2021  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TUSB320HIRWBR  
TUSB320LIRWBR  
X2QFN  
X2QFN  
RWB  
RWB  
12  
12  
3000  
3000  
180.0  
180.0  
8.4  
8.4  
1.8  
1.8  
1.8  
1.8  
0.61  
0.61  
4.0  
4.0  
8.0  
8.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
8-Jan-2021  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TUSB320HIRWBR  
TUSB320LIRWBR  
X2QFN  
X2QFN  
RWB  
RWB  
12  
12  
3000  
3000  
213.0  
213.0  
191.0  
191.0  
35.0  
35.0  
Pack Materials-Page 2  
PACKAGE OUTLINE  
RWB0012A  
X2QFN - 0.4 mm max height  
SCALE 6.500  
PLASTIC QUAD FLATPACK - NO LEAD  
1.65  
1.55  
B
A
PIN 1 INDEX AREA  
1.65  
1.55  
C
0.4 MAX  
SEATING PLANE  
0.05 C  
2X 1.2  
SYMM  
(0.13)  
TYP  
0.05  
0.00  
6X 0.4  
3
6
2
1
7
8
SYMM  
2X  
0.4  
0.4  
8X  
0.2  
12  
9
0.25  
0.15  
12X  
0.6  
4X  
0.4  
0.07  
0.05  
C B A  
C
4221631/B 07/2017  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
RWB0012A  
X2QFN - 0.4 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(1.3)  
6X (0.4)  
9
12  
4X (0.7)  
2X (0.4)  
1
8
SYMM  
(1.5)  
7
2
8X (0.5)  
3
6
SYMM  
(R0.05) TYP  
12X (0.2)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:30X  
0.05 MAX  
ALL AROUND  
0.05 MIN  
ALL AROUND  
METAL  
SOLDER MASK  
OPENING  
EXPOSED METAL  
EXPOSED METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4221631/B 07/2017  
NOTES: (continued)  
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).  
www.ti.com  
EXAMPLE STENCIL DESIGN  
RWB0012A  
X2QFN - 0.4 mm max height  
PLASTIC QUAD FLATPACK - NO LEAD  
(1.3)  
6X (0.4)  
12  
9
4X (0.67)  
2X (0.4)  
1
2
8
SYMM  
(1.5)  
7
8X  
METAL  
8X (0.5)  
3
6
(R0.05) TYP  
SYMM  
12X (0.2)  
SOLDER PASTE EXAMPLE  
BASED ON 0.1 mm THICK STENCIL  
PADS 1,2,7 & 8  
96% PRINTED SOLDER COVERAGE BY AREA  
SCALE:50X  
4221631/B 07/2017  
NOTES: (continued)  
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没  
有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更,恕不另行通知。TI 授权您仅可  
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知  
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