TUSB321 [TI]
支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制;
| 型号： | TUSB321 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 |
| 文件： | 总26页 (文件大小：1549K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
具有 VCONN 的 TUSB321 USB Type-C™ 配置通道逻辑和端口控件
1 特性
3 说明
1
•
USB Type-C™规范 1.1
TUSB321 器件可在 USB Type-C 端口上实现 Type-C
生态系统所需的配置通道 (CC) 逻辑。TUSB321 器件
使用 CC 引脚来确定端口连接和分离、电缆方向、角
色检测以及对 Type-C 电流模式的端口控制。
TUSB321 器件可配置为下行端口 (DFP)、上行端口
(UFP) 或双角色端口 (DRP)，是各种应用的理想之
选。
•
•
•
向后兼容 USB Type-C 规范 1.0
通过专用电流模式引脚支持高达 3A 的电流通告
模式配置
–
–
–
仅主机 - 下行端口 (DFP)（供电设备）
仅设备 – 上行端口 (UFP)（受电设备）
双角色端口 – DRP
•
通道配置 (CC)
根据 Type-C 规范，TUSB321 器件在配置为 DRP
时，会交替配置为 DFP 或 UFP。CC 逻辑块通过监视
CC1 和 CC2 引脚上的上拉或下拉电阻，以确定何时连
接了 USB 端口、电缆的方向以及检测到的角色。CC
逻辑根据检测到的角色来确定 Type-C 电流模式为默
认、中等还是高。该逻辑通过实施 VBUS 检测来确定端
口在 UFP 和 DRP 模式下是否连接成功。
–
–
–
–
USB 端口连接检测
电缆方向检测
角色检测
Type-C 电流模式通告和检测（默认、中等和
高）
•
•
•
VBUS 检测
针对有源电缆提供 VCONN 支持
该器件能够在宽电源范围内工作，并且具有较低功耗。
器件信息(1)
外部开关电缆检测与
方向控制
•
•
电源电压：4.5V 至 5.5V
器件型号
TUSB321
封装
封装尺寸（标称值）
低电流消耗
X2QFN (12)
1.60mm x 1.60mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
2 应用
•
•
•
•
主机、设备、双角色端口 应用
移动电话
平板电脑和笔记本电脑
USB 外设
空白
简化原理图
示例 应用
VDD
ID
VCONN
Power Rail
VBUS
Detection
CC Logic
for Mode
Configuration
and Detection
VBUS_DET
CC1
CC2
CURRENT_MODE
VCONN_FAULT
OUT1
Controller
DIR
OUT2
PORT
GND
Copyright © 2016, Texas Instruments Incorporated
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLLSEO6
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
目录
7.4 Device Functional Modes........................................ 11
Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application .................................................. 13
8.3 Initialization Set Up ................................................ 17
Power Supply Recommendations...................... 17
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
8
9
10 Layout................................................................... 17
10.1 Layout Guidelines ................................................. 17
10.2 Layout Example .................................................... 17
11 器件和文档支持 ..................................................... 18
11.1 接收文档更新通知 ................................................. 18
11.2 社区资源................................................................ 18
11.3 商标....................................................................... 18
11.4 静电放电警告......................................................... 18
11.5 术语表 ................................................................... 18
12 机械、封装和可订购信息....................................... 18
7
4 修订历史记录
Changes from Revision B (September 2016) to Revision C
Page
•
•
•
•
•
•
•
删除了特性“-40°C 至 85°C 的工业温度范围” .......................................................................................................................... 1
删除了说明 中的“TUSB321 器件适用于工业和商业级温度范围。”文本.................................................................................. 1
Changed pin VBUS_DET description From: 900-kΩ To: RVBUS in Pin Functions table. ........................................................ 3
Changed RVBUS values From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 6
Changed resister value From: 900 kΩ To: To: RVBUS in Figure 3........................................................................................... 8
Changed resister value From: 900 kΩ To: To: RVBUS in Functional Block Diagram............................................................... 9
Changed From: The system VBUS voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin .. To: The
system VBUS voltage must be routed through a RVBUS resistor to the VBUS_DET pin .. in the VBUS Detection................... 11
•
•
•
Added resister RVBUS in Figure 4 .......................................................................................................................................... 14
Added row for RVBUS to Table 4 ........................................................................................................................................... 15
Changed From: must be connected through a 900-kΩ resistor to VBUS on the Type-C... To: must be connected
through a RVBUS resistor to VBUS on the Type-C .. in the Detailed Design Procedure.......................................................... 15
Changes from Revision A (June 2015) to Revision B
Page
•
Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = VDD + 0.3 To: MIN –0.3 MAX = 6 in the Absolute
Maximum Ratings................................................................................................................................................................... 4
Changes from Original (June 2015) to Revision A
Page
•
已更改 器件状态从 产品预览 更改为 量产数据 ....................................................................................................................... 1
2
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
5 Pin Configuration and Functions
RWB Package
12-Pin X2QFN
Top View
CC2 CC1
2 1
3
4
5
6
12
11
10
9
CURRENT_MODE
PORT
VDD
DIR
VBUS_DET
GND
ID
VCONN_FAULT
7
8
OUT1 OUT2
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
CC1
NO.
1
I/O
I/O
Type-C configuration channel signal 1
Type-C configuration channel signal 2
CC2
2
Advertise VBUS current. This 3-level input is used to control current advertisement in DFP
mode or DRP mode connected as source. (See Table 2.)
L - Default Current. Pull-down to GND or leave unconnected.
M - Medium (1.5A) current. Pull-up to VDD with 500-kΩ resistor.
H - High (3.0A) current. Pull-up to VDD with 10-kΩ resistor.
CURRENT_MODE
3
4
I
I
Tri-level input pin to indicate port mode. The state of this pin is sampled when VDD is active.
H - DFP (Pull-up to VDD if DFP mode is desired)
PORT
NC - DRP (Leave unconnected if DRP mode is desired)
L - UFP (Pull-down or tie to GND if UFP mode is desired)
5- to 28-V VBUS input voltage. VBUS detection determines UFP attachment. One RVBUS
external resistor required between system VBUS and VBUS_DET pin.
VBUS_DET
5
6
I
Open-drain output and is asserted low for tFAULT when VCONN over-current fault is detected.
(See Figure 2.)
VCONN_FAULT
O
This pin is an open drain output for communicating Type-C current mode detect when the
device is in UFP mode. Default current mode detected (H); medium or high current mode
detected (L). (See Table 2.)
OUT1
OUT2
7
8
I/O
I/O
This pin is an open drain output for communicating Type-C current mode detect when the
device is in UFP mode: default or medium current mode detected (H); high current mode
detected (L). (See Table 2.)
Open drain output; asserted low when the CC pins detect device attachment when port is a
source (DFP), or dual-role (DRP) acting as source (DFP).
ID
9
O
G
O
P
GND
DIR
VDD
10
11
12
Ground
DIR of plug. This open drain output indicates the detected plug orientation: Type-C plug
position 2 (H); Type-C plug position 1 (L).
Positive supply voltage
Copyright © 2015–2018, Texas Instruments Incorporated
3
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–65
MAX
UNIT
Supply voltage
Control pins
VDD
6
V
PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT
VDD + 0.3
CC1, CC2
6
VDD + 0.3
4
V
OUT1, OUT2
VBUS_DET
Storage temperature, Tstg
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±7000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5
4
NOM
MAX
5.5
28
UNIT
V
VDD
Supply voltage range
VBUS
System VBUS voltage
5
V
VBUS_DET
VCONN
TA
VBUS_DET threshold voltage on the pin
Supply for active cable (With VDD at 5 V)
Operating free air temperature range
4
V
4.75
0
5.5
70
V
25
°C
6.4 Thermal Information
RWB (X2QFN)
12 PINS
169.3
68.1
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
—
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
83.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.2
ψJB
83.4
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application
report.
4
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Power Consumption
Current consumption in unattached mode when port is
IUNATTACHED_UFP
unconnected and waiting for connection. (VDD = 5 V, PORT
= L)
100
100
µA
µA
Current consumption in active mode. (VDD = 5 V, PORT =
L)
IACTIVE_UFP
CC1 and CC2 Pins
RCC_D
Pulldown resistor when in UFP or DRP mode.
4.6
5.1
0.2
5.6
kΩ
Voltage threshold for detecting a DFP attach when
configured as a UFP and DFP is advertising default current
source capability.
VTH_UFP_CC_USB
VTH_UFP_CC_MED
VTH_UFP_CC_HIGH
VTH_DFP_CC_USB
VTH_DFP_CC_MED
VTH_DFP_CC_HIGH
VTH_AC_CC_USB
VTH_AC_CC_MED
VTH_AC_CC_HIGH
0.15
0.25
V
Voltage threshold for detecting a DFP attach when
configured as a UFP and DFP is advertising medium (1.5
A) current source capability.
0.61
1.169
1.51
1.51
2.46
0.15
0.35
0.76
0.66
1.23
1.6
0.7
1.29
1.64
1.64
2.74
0.25
0.45
0.84
V
V
V
V
V
V
V
V
Voltage threshold for detecting a DFP attach when
configured as a UFP and DFP is advertising high (3 A)
current source capability.
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising default current source
capability.
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising medium current (1.5
A) source capability.
1.6
Voltage threshold for detecting a UFP attach when
configured as a DFP and advertising high current (3.0 A)
source capability.
2.6
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising default current
source.
0.20
0.40
0.80
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising medium current (1.5
A) source.
Voltage threshold for detecting a active cable attach when
configured as a DFP and advertising high current (3.0 A)
source.
Default mode pullup current source when operating in DFP
or DRP mode.
ICC_DEFAULT_P
ICC_MED_P
64
166
304
80
180
330
96
194
356
µA
µA
µA
Medium (1.5 A) mode pullup current source when
operating in DFP or DRP mode.
High (3 A) mode pullup current source when operating in
DFP or DRP mode.(1)
ICC_HIGH_P
Control Pins: PORT, CURRENT_MODE, VCONN_FAULT, DIR, ID, OUT1, OUT2
Low-level control signal input voltage, (PORT,
CURRENT_MODE)
VIL
0.4
V
V
V
Mid-level control signal input voltage (PORT,
CURRENT_MODE)
VIM
0.28 × VDD
VDD - 0.3
0.56 × VDD
High-level control signal input voltage (PORT,
CURRENT_MODE)
VIH
IIH
High-level input current
–20
–10
20
10
µA
µA
kΩ
MΩ
kΩ
IIL
Low-level input current
Rpu
Internal pullup resistance (PORT)
Internal pulldown resistance (PORT)
Internal pulldown resistance for CURRENT_MODE pin
588
1.1
Rpd
RPD_CUR
275
Low-level signal output voltage (open-drain)
(VCONN_FAULT, ID, OUT1, OUT2)
VOL
IOL = –1.6 mA
0.4
V
External pullup resistor on open drain IOs
(VCONN_FAULT, ID, OUT1, OUT2)
Rp_ODext
Rp_TLext
200
4.7
kΩ
kΩ
Tri-level input external pull-up resistor (PORT)
(1) VDD must be 3.5 V or greater to advertise 3 A current.
Copyright © 2015–2018, Texas Instruments Incorporated
5
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
500
10
MAX
UNIT
kΩ
External pull-up resistor on CURRENT_MODE pin to
advertise 1.5-A current
Rp_cm_med
External pull-up resistor on CURRENT_MODE pin to
advertise 3.0-A current
Rp_cm_high
kΩ
VBUS_DET IO Pins (Connected to System VBUS signal through external resistor)
VBUS_THR
RVBUS
VBUS threshold range
2.95
855
3.30
887
95
3.80
920
V
External resistor between VBUS and VBUS_DET pin
Internal pulldown resistance for VBUS_DET
KΩ
KΩ
RVBUS_PD
DIR pin (Open Drain IO)
VOL
Low-level signal output voltage
IOL = –1.6 mA
0.4
V
VCONN
RON
On resistance of the VCONN power FET
Voltage tolerance on VCONN power FET
Voltage to pass through VCONN power FET
1.25
5.5
Ω
V
V
VTOL
VPASS
5.5
VCONN current limit; VCONN is disconnected above this
value
IVCONN
CBULK
200
10
mA
µF
Bulk capacitance on VCONN; placed on VDD supply
200
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
133
2
MAX
UNIT
ms
tCCCB_DEFAULT
tVBUS_DB
Power on default of CC1 and CC2 voltage debounce time
Debounce of VBUS_DET pin after valid VBUS_THR (See Figure 1.)
Power-on default of percentage of time DRP advertises DFP during a TDRP
ms
tDRP_DUTY_CYCLE
30%
The period TUSB321 in DFP mode completes a DFP to UFP and back
advertisement.
tDRP
50
7
75
10
100
13
ms
µs
VCONN_FAULT asserted low time after VCONN over-current condition is
detected. (See Figure 2.)
tFAULT
6
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
V
VBUS
V
BUS_THR
t
VBUS_DB
0 V
Time
Figure 1. VBUS Detect and Debounce
t
FAULT
V
PULL-UP
V
VCONN_FAULT
0 V
Time
Figure 2. VCONN_FAULT Assertion Pulse Timing
Copyright © 2015–2018, Texas Instruments Incorporated
7
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
7 Detailed Description
7.1 Overview
The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and
reversible. Because of the nature of the connector, a scheme is needed to determine the connector orientation.
Additional schemes are needed to determine when a USB port is attached and the acting role of the USB port
(DFP, UFP, DRP), as well as to communicate Type-C current capabilities. These schemes are implemented over
the CC pins according to the USB Type-C specifications. The TUSB321 device provides Configuration Channel
(CC) logic for determining USB port attach and detach, role detection, cable orientation, and Type-C current
mode. The TUSB321 device also contains several features such as VCONN sourcing, USB3.1 MUX direction
control, mode configuration and low standby current which make this device ideal for source or sinks in USB2.0
or USB3.1 applications.
7.1.1 Cables, Adapters, and Direct Connect Devices
Type-C Specification 1.1 defines several cables, plugs and receptacles to be used to attach ports. The TUSB321
device supports all cables, receptacles, and plugs. The TUSB321 device does not support e-marking.
7.1.1.1 USB Type-C Receptacles and Plugs
Below is list of Type-C receptacles and plugs supported by the TUSB321 device:
•
•
•
USB Type-C receptacle for USB2.0 and USB3.1 and full-featured platforms and devices
USB full-featured Type-C plug
USB2.0 Type-C plug
7.1.1.2 USB Type-C Cables
Below is a list of Type-C cables types supported by the TUSB321 device:
•
•
•
USB full-featured Type-C cable with USB3.1 full-featured plug
USB2.0 Type-C cable with USB2.0 plug
Captive cable with either a USB full-featured plug or USB2.0 plug
7.1.1.3 Legacy Cables and Adapters
The TUSB321 device supports legacy cable adapters as defined by the Type-C Specification. The cable adapter
must correspond to the mode configuration of the TUSB321 device.
To system VBUS detection
Legacy Host
Adapter
TUSB321
VBUS_DET
R
VBUS
RP
56 kW ±5%
CC
CC
RD
5.1 kW ±10%
Figure 3. Legacy Adapter Implementation Circuit
7.1.1.4 Direct Connect Devices
The TUSB321 device supports the attaching and detaching of a direct-connect device.
8
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
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ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
7.2 Functional Block Diagram
VDD
DIR
DIR_CTRL
DIR
Logic
CTRL
CURRENT_MODE
PORT
Tri-State
Buffer
CC1
Connection
Digital
Controller
and
Cable
Detection
VBUS_ON
CRTL_INT
CRTL_ID
CC2
CRTL_ID
CRTL_EN_N
CRTL_EN_N
VBUS_ON
CTRL
VBUS
Detection
Open Drain Output
VBUS_DET
OUT1 OUT2 ID
VCONN_FAULT
GND
R
VBUS
SYS_VBUS
7.3 Feature Description
7.3.1 Port Role Configuration
The TUSB321 device can be configured as a downstream facing port (DFP), upstream facing port (UFP), or
dualrole port (DRP) using the tri-level PORT pin. The PORT pin should be pulled high to VDD using a pullup
resistance, low to GND or left as floated on the PCB to achieve the desired mode. This flexibility allows the
TUSB321 device to be used in a variety of applications. The TUSB321 device samples the PORT pin after reset
and maintains the desired mode until the TUSB321 device is reset again. Table 1 lists the supported features in
each mode:
Copyright © 2015–2018, Texas Instruments Incorporated
9
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
Feature Description (continued)
Table 1. Supported Features for the v Device by Mode
PORT PIN
HIGH
(DFP ONLY)
LOW
(UFP ONLY)
NC
(DRP)
SUPPORTED
FEATURES
Port attach and
detach
Yes
Yes
Yes
Cable orientation
Current advertisement
Current detection
Active cable detection
VCONN
Yes
Yes
-
Yes
-
Yes
Yes (DFP)
Yes (UFP)
Yes (DFP)
Yes (DFP)
Yes
Yes
-
Yes
Yes
Yes
-
-
Legacy cables
Yes
Yes
VBUS detection
Yes (UFP)
7.3.1.1 Downstream Facing Port (DFP) - Source
The TUSB321 device can be configured as a DFP only by pulling the PORT pin high through a resistance to
VDD. In DFP mode, the TUSB321 device constantly presents Rps on both CC. In DFP mode, the TUSB321
device advertises USB Type-C current based on the state of the CURRENT_MODE pin.
When configured as a DFP, the TUSB321 can operate with older USB Type-C 1.0 devices except for a USB
Type-C 1.0 DRP device. The TUSB321 can not operate with a USB Type-C 1.0 DRP device. This limitation is a
result of backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C 1.0 DRP.
7.3.1.2 Upstream Facing Port (UFP) - Sink
The TUSB321 device can be configured as a UFP only by pulling the PORT pin low to GND. In UFP mode, the
TUSB321 device constantly presents pulldown resistors (Rd) on both CC pins. The TUSB321 device monitors
the CC pins for the voltage level corresponding to the Type-C mode current advertisement by the connected
DFP. The TUSB321 device debounces the CC pins and wait for VBUS detection before successfully attaching. As
a UFP, the TUSB321 device detects and communicates the advertised current level of the DFP to the system
through the OUT1 and OUT2 pins.
7.3.1.3 Dual Role Port (DRP)
The TUSB321 device can be configured to operate as a DRP when the PORT pin is left floated on the PCB. In
DRP mode, the TUSB321 device toggles between operating as a DFP and a UFP. When functioning as a DFP in
DRP mode, the TUSB321 device complies with all operations as defined for a DFP according to the Type-C
Specification. When presenting as a UFP in DRP mode, the TUSB321 device operates as defined for a UFP
according to the Type-C Specification.
7.3.2 Type-C Current Mode
The TUSB321 device supports both advertising and detection of Type-C current. When TUSB321 is a UFP or a
DRP connected as a sink, the OUT1 and OUT2 pins are used to inform the system the detected USB Type-C
current being broadcasted by the attached DFP. When TUSB321 device is a DFP or a DRP connected as a
source, the CURRENT_MODE pin is used to advertise the USB Type-C current. The current advertisement for
the TUSB321 device is 500 mA (for USB2.0) or 900 mA (for USB3.1) if CURRENT_MODE pin is left
unconnected or pulled to GND. If a higher level of current is required, the CURRENT_MODE can be pulled up to
VDD through a 500-kΩ resistor to advertise medium current at 1.5 A or pulled up to VDD through a 10-kΩ
resistor to advertise high current at 3 A. Table 2 lists the Type-C current advertisements and detection.
10
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
Table 2. Type-C Current Advertisement and Detection
UFP or DRP acting as UFP
Current Detection
DFP or DRP acting as DFP
Current Advertisement
TYPE-C CURRENT
500 mA (USB2.0)
900 mA (USB3.1)
OUT1 = High
OUT2 = High (unattached) or Low (attached)
Default
CURRENT_MODE = L
CURRENT_MODE = M
CURRENT_MODE = H
OUT1 = Low
OUT2 = High
Medium - 1.5 A
High - 3 A
OUT1 = Low
OUT2 = Low
7.3.3 VBUS Detection
The TUSB321 device supports VBUS detection according to the Type-C Specification. VBUS detection is used to
determine the attachment and detachment of a UFP. VBUS detection is also used to successfully resolve the role
in DRP mode.
The system VBUS voltage must be routed through a RVBUS resistor to the VBUS_DET pin on the TUSB321 device
if the PORT pin is configured as a DRP or a UFP. If the TUSB321 device is configured as a DFP and only ever
used in DFP mode, the VBUS_DET pin can be left unconnected.
7.3.4 Cable Orientation and External MUX Control
The TUSB321 device has the ability to control an external/discrete MUX using the DIR pin. The TUSB321
detects the cable orientation by monitoring the voltage on the CC pins. When a voltage level within the proper
threshold is detected on CC1, the DIR pin is pulled low. When a voltage level within the proper threshold is
detected on CC2, the DIR is pulled high. If the direction polarity of the external MUX is opposite of the TUSB321,
the TUSB321 CC1/CC2 connection to USB Type-C receptacle can be reversed. The DIR pin is an open drain
output.
7.3.5 VCONN Support for Active Cables
The TUSB321 device supplies VCONN to active cables when configured in DFP mode or in DRP acting as a
DFP mode. VCONN is provided only when the unconnected CC pin is terminated to a resistance, Ra, and after a
UFP is detected and the Attached.SRC state is entered. When in DFP mode or in DRP acting as a DFP mode, a
5-V source must be connected to the VDD pin of the TUSB321 device after Attached.SRC. VCONN is supplied
from VDD through a low resistance power FET out to the unconnected CC pin. VCONN is removed when a
detach event is detected and the active cable is removed.
7.4 Device Functional Modes
The TUSB321 device has two functional modes. Table 3 lists these modes:
Table 3. USB Type-C States According to TUSB321 Functional Modes
MODES
GENERAL BEHAVIOR
PORT PIN
STATES(1)
Unattached.SNK
UFP
AttachWait.SNK
USB port unattached. ID, PORT
operational. CC pins configure
according to PORT pin.
Toggle Unattached.SNK → Unattached.SRC
AttachedWait.SRC or AttachedWait.SNK
Unattached.SRC
Unattached
DRP
DFP
UFP
DRP
DFP
AttachWait.SRC
Attached.SNK
Attached.SNK
USB port attached. All GPIOs
operational.
Active
Attached.SRC
Attached.SRC
(1) Required; not in sequential order.
Copyright © 2015–2018, Texas Instruments Incorporated
11
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
7.4.1 Unattached Mode
Unattached mode is the primary mode of operation for the TUSB321 device, because a USB port can be
unattached for a lengthy period of time. In unattached mode, VDD is available, and all IOs are operational. After
the TUSB321 device is powered up, the part enters unattached mode until a successful attach has been
determined. Initially, right after power up, the TUSB321 device comes up as an Unattached.SNK. The TUSB321
device checks the PORT pin and operates according to the mode configuration. The TUSB321 device toggles
between the UFP and the DFP if configured as a DRP. The PORT pin is only sampled at reset or power up.
7.4.2 Active Mode
Active mode is defined as the port being attached. In active mode, all GPIOs are operational. When in active
mode, the TUSB321 device communicates to the AP that the USB port is attached. This happens through the ID
pin if TUSB321 is configured as a DFP or DRP connect as source. If TUSB321 is configured as a UFP or a DRP
connected as a sink, the OUT1 and OUT2 pins are used. The TUSB321 device exits active mode under the
following conditions:
•
•
Cable unplug
VBUS removal if attached as a UFP
12
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TUSB321 device is a Type-C configuration channel logic and port controller. The TUSB321 device can
detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and power
capabilities (both detection and broadcast). The TUSB321 device can be used in a source application (DFP) or in
a sink application (UFP).
8.2 Typical Application
8.2.1 DFP Mode
Figure 4 shows the TUSB321 device configured as a DFP.
Copyright © 2015–2018, Texas Instruments Incorporated
13
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
Typical Application (continued)
DM
DP
USB VBUS Switch
System VBUS
PS_EN
VIN
EN
VOUT
PS_FAULT
FAULT
VDD_5V
VCC_3.3V
150 µF
100 nF
DM
DP
100 µF
VBUS
RVBUS
A12 B1
200 kW 200 kW
10 kW
4.7 kW
RXP2
RXN2
TXP2
TXN2
VBUS_DET
B2
A10 B3
A11
PORT
CURRENT_MODE
USB3 Host
and
PMIC
B4
B5
A9
A8
A7
CC1
CC2
CC2
CC1
B6
TUSB321
ID
ID
A6 B7
A5 B8
VCONN_FAULT
FAULT
A4
A3 B10
B9
100 nF
TXN1
TXP1
RXN1
RXP1
A2
A1
B11
B12
VCC_3.3V
VCC_3.3V
10 kW
100 nF
SEL
TXP2
TXN2
B0P
B0N
RXP2
RXN2
100 nF
B1P
B1N
SSTXP
SSTXN
A0P
A0N
100 nF
TXN1
TXP1
SSRXP
SSRXN
A1P
A1N
C0P
C0N
RXN1
RXP1
C1P
C1N
OEN
Figure 4. DFP Mode Schematic
14
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
Typical Application (continued)
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 4:
Table 4. Design Requirements for DFP Mode
DESIGN PARAMETER
VALUE
VDD (4.5 V to 5.5 V)
5 V
DFP
Type-C port type (UFP, DFP, or DRP)
PORT pin is pulled up
Advertised Type-C Current (Default, 1.5 A, 3.0 A)
RVBUS (855-kΩ to 920-kΩ)
3.0 A
900-kΩ
Yes
VCONN Support
8.2.1.2 Detailed Design Procedure
The TUSB321 device supports a VDD in the range of 4.5 to 5.5 V. In this particular case, VDD is set to 5 V. A 100-
nF capacitor is placed near VDD. Also, a 100 µF is used to meet the USB Type-C bulk capacitance requirement
of 10 µF to 220 µF.
The TUSB321 current advertisement is determined by the state of the CURRENT_MODE pin. In this particular
example, 3.0 A advertisement is desired so the CURRENT_MODE pin is pulled high to VDD through 10-kΩ
resistor.
The DIR pin is used to control the MUX for connecting the USB3 SS signals to the appropriate pins on the USB
Type-C receptacle. In this particular case, a HD3SS3212 is used as the MUX. In order to minimize crossing in
routing the USB3 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the TUSB321 is
swapped.
The Type-C port mode is determined by the state of the PORT pin. When the PORT pin is pulled high, the
TUSB321 device is in DFP mode.
The VBUS_DET pin must be connected through a RVBUS resistor to VBUS on the Type-C that is connected. This
large resistor is required to protect the TUSB321 device from large VBUS voltage that is possible in present day
systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB321 device in the
recommended range.
The USB2 specification requires the bulk capacitance on VBUS based on UFP or DFP. When operating the
TUSB321 device in a DFP mode, a bulk capacitance of at least 120 µF is required. In this particular case, a 150-
µF capacitor was chosen.
Copyright © 2015–2018, Texas Instruments Incorporated
15
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
8.2.1.3 Application Curve
Figure 5. Application Curve for DFP Mode
16
Copyright © 2015–2018, Texas Instruments Incorporated
TUSB321
www.ti.com.cn
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
8.3 Initialization Set Up
The general power-up sequence for the TUSB321 device is as follows:
1. System is powered off (device has no VDD). The TUSB321 device is configured internally in UFP mode with
Rds on CC pins.
2. VDD ramps – POR circuit.
3. The TUSB321 device enters unattached mode and determines the voltage level from the PORT pin. This
determines the mode in which the TUSB321 device operates (DFP, UFP, DRP).
4. The TUSB321 device monitors the CC pins as a DFP and VBUS for attach as a UFP.
5. The TUSB321 device enters active mode when attach has been successfully detected.
9 Power Supply Recommendations
The TUSB321 device has a wide power supply range from 4.5 to 5.5 V. The TUSB321 device can be run off of a
system power such as a battery.
10 Layout
10.1 Layout Guidelines
1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6
to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:
–
–
A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.
A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.
2. A 100-nF capacitor should be placed as close as possible to the TUSB321 VDD pin.
10.2 Layout Example
Figure 6. TUSB321 Layout
版权 © 2015–2018, Texas Instruments Incorporated
17
TUSB321
ZHCSDT2C –JUNE 2015–REVISED AUGUST 2018
www.ti.com.cn
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.2 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.3 商标
E2E is a trademark of Texas Instruments.
USB Type-C is a trademark of USB Implementers Forum.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
11.5 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
18
版权 © 2015–2018, Texas Instruments Incorporated
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
许可。如因使用所述资源而产生任何索赔、赔偿、成本、损失及债务等，TI对此概不负责，并且您须赔偿由此对TI 及其代表造成的损害。
TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2018 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB321RWBR
ACTIVE
X2QFN
RWB
12
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
0 to 70
21
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jan-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TUSB321RWBR
X2QFN
RWB
12
3000
180.0
8.4
1.8
1.8
0.61
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Jan-2021
*All dimensions are nominal
Device
Package Type Package Drawing Pins
X2QFN RWB 12
SPQ
Length (mm) Width (mm) Height (mm)
213.0 191.0 35.0
TUSB321RWBR
3000
Pack Materials-Page 2
PACKAGE OUTLINE
RWB0012A
X2QFN - 0.4 mm max height
SCALE 6.500
PLASTIC QUAD FLATPACK - NO LEAD
1.65
1.55
B
A
PIN 1 INDEX AREA
1.65
1.55
C
0.4 MAX
SEATING PLANE
0.05 C
2X 1.2
SYMM
(0.13)
TYP
0.05
0.00
6X 0.4
3
6
2
1
7
8
SYMM
2X
0.4
0.4
8X
0.2
12
9
0.25
0.15
12X
0.6
4X
0.4
0.07
0.05
C B A
C
4221631/B 07/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
9
12
4X (0.7)
2X (0.4)
1
8
SYMM
(1.5)
7
2
8X (0.5)
3
6
SYMM
(R0.05) TYP
12X (0.2)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221631/B 07/2017
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RWB0012A
X2QFN - 0.4 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.3)
6X (0.4)
12
9
4X (0.67)
2X (0.4)
1
2
8
SYMM
(1.5)
7
8X
METAL
8X (0.5)
3
6
(R0.05) TYP
SYMM
12X (0.2)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PADS 1,2,7 & 8
96% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4221631/B 07/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款
的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE
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