UC1611J883B [TI]
QUAD SCHOTTKY DIODE ARRAY; QUAD肖特基二极管阵列型号: | UC1611J883B |
厂家: | TEXAS INSTRUMENTS |
描述: | QUAD SCHOTTKY DIODE ARRAY |
文件: | 总7页 (文件大小:179K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SLUS338A – JUNE 1993 – REVISED MAY 2001
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FEATURES
DESCRIPTION
D
D
D
D
D
D
D
Matched, Four-Diode Monolithic Array
High Peak Current
This four-diode array is designed for general
purpose use as individual diodes or as a
high-speed, high-current bridge. It is particularly
useful on the outputs of high-speed power
MOSFET drivers where Schottky diodes are
needed to clamp any negative excursions caused
by ringing on the driven line.These diodes are also
ideally suited for use as voltage clamps when
driving inductive loads such as relays and
solenoids, and to provide a path for current
free-wheeling in motor drive applications.The use
of Schottky diode technology features high
efficiency through lowered forward voltage drop
and decreased reverse recovery time.This single
monolithic chip is fabricated in both hermetic
CERDIP and copper-eaded plastic packages.
The UC1611 in ceramic is designed for –55°C to
125°C environments but with reduced peak
current capability: while the UC3611 in plastic has
higher current rating over a 0°C to 70°C ambient
temperature range.
Low-Cost MINIDIP Package
Low-Forward Voltage
Parallelable for Lower V or Higher I
F
F
Fast Recovery Time
Military Temperature Range Available
AVAILABLE OPTIONS
Packaged Devices
T
= T
J
A
SOIC Wide (DW)
UC1611DW
DIL (J)
UC1611J
UC3611J
DIL (N)
UC1611N
UC3611N
–55°C to 125°C
0°C to 70°C
UC3611DW
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Copyright 2001, Texas Instruments Incorporated
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ꢚ ꢞ ꢛ ꢚꢓ ꢔꢨ ꢖꢕ ꢙ ꢡꢡ ꢟꢙ ꢗ ꢙ ꢘ ꢞ ꢚ ꢞ ꢗ ꢛ ꢣ
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1
www.ti.com
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SLUS338A – JUNE 1993 – REVISED MAY 2001
DW PACKAGE
(TOP VIEW)
J OR N PACKAGE
(TOP VIEW)
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V
Diode-to-diode voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 V
Peak forward current
UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A
UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A
Power dissipation at T = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W
A
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
†
‡
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Please consult packaging section of data book for thermal limitations and considerations of package.
electrical characteristics, all specifications apply to each individual diode, T = 25°C, T = T ,
J
A
J
(except as noted)
PARAMETER
TEST CONDITIONS
MIN
0.3
TYP
0.4
MAX UNITS
I
I
= 100 mA
= 1 A
0.7
1.2
0.1
1.0
V
V
F
Forward voltage drop
Leakage current
0.9
0.01
0.1
20
F
V
V
= 40 V
= 40 V,
mA
mA
ns
ns
pF
R
T
J
= 100°C
R
Reverse recovery
Forward recovery
Junction capacitance
0.5 A forward to 0.5 A reverse
1 A forward to 1.1 V recovery
40
V
= 5V
100
R
NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes.
2
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SLUS338A – JUNE 1993 – REVISED MAY 2001
APPLICATION INFORMATION
REVERSE CURRENT
FORWARD CURRENT
vs
vs
VOLTAGE
VOLTAGE
5.0
1000
500
3.0
2.0
300
200
1.0
0.5
T
= 125 °C
100
50
J
0.3
0.2
°C
T
= –55
°C
0.1
J
30
20
0.05
0.03
0.02
T
= 25
J
10
5
0.01
T
= 25
°C
J
T
= 75 °C
J
0.005
3
2
°C
T
= 125
0.003
0.002
J
0.001
1
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Forward Voltage – V
0
10
20
30
40
50
Reverse Voltage – V
Figure 1
Figure 2
Figure 3. Clamp Diodes – PWMs and Drivers
3
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SLUS338A – JUNE 1993 – REVISED MAY 2001
APPLICATION INFORMATION
Figure 4. Transformer Coupled Drive Circuits
Figure 5. Linear Regulations
4
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-90538012A
5962-9053801PA
5962-9053801V2A
5962-9053801VPA
UC1611J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
LCCC
CDIP
LCCC
CDIP
CDIP
CDIP
LCCC
SOIC
FK
JG
FK
JG
JG
JG
FK
DW
20
8
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
20
8
1
POST-PLATE N / A for Pkg Type
1
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
8
1
UC1611J883B
UC1611L883B
UC3611DW
8
1
20
16
1
POST-PLATE N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
40
Green (RoHS
& no Sb/Br)
UC3611DWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3611J
UC3611N
ACTIVE
ACTIVE
CDIP
PDIP
JG
P
8
8
1
TBD
A42
N / A for Pkg Type
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3611NG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3611Q
OBSOLETE
OBSOLETE
PLCC
PLCC
FN
FN
20
20
TBD
TBD
Call TI
Call TI
Call TI
Call TI
UC3611QTR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1611, UC1611-SP, UC3611, UC3611M :
Catalog: UC3611, UC1611, UC3611M, UC3611
•
Military: UC1611
•
Space: UC1611-SP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
•
Addendum-Page 2
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