UCC21542DWKR_技术文档

UCC21540, UCC21540A, UCC21541, UCC21542

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SLUSDE1D – NOVEMBER 2018 – REVISED FEBRUARY 2021

UCC2154x Reinforced Isolation Dual-Channel Gate Driver

With 3.3-mm Channel-to-Channel Spacing Option

1 Features

3 Description

•

Wide body package options

The UCC2154x is an isolated dual channel gate driver

family designed with up to 4-A/6-A peak source/sink

current to drive power MOSFET, IGBT, and GaN

transistors. UCC2154x in DWK package also offers

3.3-mm minimum channel-to-channel spacing which

facilitates higher bus voltage.

– DW SOIC-16: pin-2-pin to UCC21520

– DWK SOIC-14: 3.3 mm Ch-2-Ch spacing

Up to 4-A peak source and 6-A peak sink output

Up to 18-V VDD output drive supply

– 5-V and 8-V VDD UVLO Options

CMTI greater than 100 V/ns

•

The UCC2154x family can be configured as two low-

side drivers, two high-side drivers, or a half-bridge

driver. The input side is isolated from the two output

drivers by a 5.7-kV_RMSisolation barrier, with a

minimum of 100-V/ns common-mode transient

immunity (CMTI).

•

Switching parameters:

– 40-ns maximum propagation delay

– 5-ns maximum delay matching

– 5.5-ns maximum pulse-width distortion

– 35-µs maximum VDD power-up delay

Resistor-programmable dead time

TTL and CMOS compatible inputs

Safety-related certifications:

– 8000-V_PKreinforced isolation per DIN V VDE V

0884-11:2017-01

– 5700-V_RMSisolation for 1 minute per UL 1577

– CQC certification per GB4943.1-2011

Protection features include: resistor programmable

dead time, disable feature to shut down both outputs

simultaneously, integrated de-glitch filter that rejects

input transients shorter than 5ns, and negative

voltage handling for up to –2V spikes for 200ns on

input and output pins. All supplies have UVLO

protection.

•

Device Information ⁽¹⁾

Rec. VDD

Supply Min.

2 Applications

PART NUMBER

I_PK

PACKAGE

•

Isolated AC-to-DC and DC-to-DC power supplies

Server, telecom, IT and industrial infrastructures

Motor drives and solar inverters

UCC21540DW

4.0-A/6.0-A

1.5-A/2.5-A

4.0-A/6.0-A

9.2-V

SOIC (16)

SOIC (14)

SOIC (16)

SOIC (14)

UCC21540ADWK

UCC21541DW

6.0-V

9.2-V

Industrial transportation

UCC21542DWK

UCC21542ADWK

9.2-V

6.0-V

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

VDD

VCC

R_BOOT

HV DC-Link

VCC

VDDA

R_OFF

INA

16

PWM-A

1

2

3

4

5

6

8

R_IN

R_ON

OUTA

VSSA

C_IN

INB

VCCI

GND

DIS

15

14

PWM-B

R_GS

C_BOOT

C_IN

ꢀC

C_VCC

SW

Functional

Isolation

VDD

DIS

VDDB

I/O

R_OFF

R_ON

11

10

9

R_DIS

C_DIS

DT

OUTB

VSSB

R_GS

VCCI

C_VDD

R_DT

C_DT

≥2.2nF

VSS

Typical Application

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION

DATA.

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Table of Contents

1 Features............................................................................1

2 Applications.....................................................................1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Comparison Table...............................................3

6 Pin Configuration and Functions...................................4

UCC21540, UCC21541 Pin Functions..............................4

UCC21542 Pin Functions................................................. 5

7 Specifications.................................................................. 6

7.1 Absolute Maximum Ratings........................................ 6

7.2 ESD Ratings............................................................... 6

7.3 Recommended Operating Conditions.........................6

7.4 Thermal Information....................................................7

7.5 Power Ratings.............................................................7

7.6 Insulation Specifications............................................. 7

7.7 Safety-Related Certifications...................................... 8

7.8 Safety-Limiting Values................................................ 8

7.9 Electrical Characteristics.............................................9

7.10 Switching Characteristics........................................10

7.11 Insulation Characteristics Curves............................11

7.12 Typical Characteristics............................................13

8 Parameter Measurement Information..........................18

8.1 Minimum Pulses........................................................18

8.2 Propagation Delay and Pulse Width Distortion.........18

8.3 Rising and Falling Time.............................................18

8.4 Input and Disable Response Time............................19

8.5 Programmable Dead Time........................................19

8.6 Power-up UVLO Delay to OUTPUT..........................20

8.7 CMTI Testing.............................................................21

9 Detailed Description......................................................22

9.1 Overview...................................................................22

9.2 Functional Block Diagram.........................................22

9.3 Feature Description...................................................23

9.4 Device Functional Modes..........................................26

10 Application and Implementation................................28

10.1 Application Information........................................... 28

10.2 Typical Application.................................................. 28

11 Power Supply Recommendations..............................38

12 Layout...........................................................................39

12.1 Layout Guidelines................................................... 39

12.2 Layout Example...................................................... 40

13 Device and Documentation Support..........................42

13.1 Documentation Support.......................................... 42

13.2 Receiving Notification of Documentation Updates..42

13.3 Support Resources................................................. 42

13.4 Trademarks.............................................................42

13.5 Electrostatic Discharge Caution..............................42

13.6 Glossary..................................................................42

14 Mechanical, Packaging, and Orderable

Information.................................................................... 42

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (September 2019) to Revision D (February 2020)

Page

•

Added initial release of the UCC21542 devices. ............................................................................................... 1

Added four additional device options .................................................................................................................3

Added CQC certificate number...........................................................................................................................8

Added initial release of the UCC21542 devices to electrical characteristics table ............................................ 9

Added initial release of the UCC21542 devices to switching characteristics table...........................................10

Updated Reinforced Isolation Capcitor Life Time Projection Figure ................................................................ 11

Added description of UCC21542 functionality to programmable deadtime table ............................................ 19

Added description of independent VDDx UVLO operation ..............................................................................23

Added UCC21542 I/O logic to table..................................................................................................................24

Changes from Revision B (March 2019) to Revision C (September 2019)

Page

•

Changed Features, Applications, and Description sections .............................................................................. 1

Added initial release of the UCC21540A device. ...............................................................................................1

Added UCC21540A UVLO thresholds ...............................................................................................................9

Changes from Revision A (December 2018) to Revision B (March 2019)

Page

•

Added the initial release of the SOIC (14) orderable..........................................................................................1

2

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Changes from Revision * (November 2018) to Revision A (December 2019)

Page

•

Changed marketing status from Advance Information to Initial release. ........................................................... 1

5 Device Comparison Table

DEADTIME

FUNCTION

DEVICE OPTIONS

UVLO

PEAK CURRENT

PACKAGE

UCC21540DW

UCC21540ADW

UCC21540DWK

UCC21540ADWK

UCC21541DW

8.0-V

5.0-V

8.0-V

5.0-V

8.0-V

5.0-V

4-A Source, 6-A Sink

Yes

SOIC-16

SOIC-14

SOIC-16

SOIC-14

1.5-A Source, 2.5-A Sink Yes

UCC21542DW

4-A Source, 6-A Sink

No

UCC21542DWK

UCC21542ADWK

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6 Pin Configuration and Functions

UCC21540, UCC21541 Pin Functions

INA

INB

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

VDDA

OUTA

VSSA

NC

INA

INB

1

2

3

4

5

6

7

8

16

15

14

VDDA

OUTA

VSSA

VCCI

GND

DIS

VCCI

GND

DIS

NC

DT

VDDB

OUTB

VSSB

DT

11

10

9

VDDB

OUTB

VSSB

NC

VCCI

Not to scale

Figure 6-1. DW Package 16-Pin SOIC Top View

Figure 6-2. DWK Package 14-Pin SOIC Top View

I/O ⁽¹⁾

Description

NAME

NO.

Disables both driver outputs if asserted high, enables if set low. It is recommended to tie this pin to

ground if not used to achieve better noise immunity. Bypass using a ≈ 1-nF low ESR/ESL capacitor

close to DIS pin when connecting to a µC with distance.

DIS

5

I

DT pin configuration:

•

Tying DT to VCCI disables the DT feature and allows the outputs to overlap.

Placing a resistor (R_DT) between DT and GND adjusts dead time according to the equation: DT (in

ns) = 10 × R_DT(in kΩ). TI recommends bypassing this pin with a ceramic capacitor, 2.2 nF or

greater, close to DT pin to achieve better noise immunity.

DT

6

GND

INA

4

1

P

I

Primary-side ground reference. All signals in the primary side are referenced to this ground.

Input signal for A channel. INA input has a TTL/CMOS compatible input threshold. This pin is pulled low

internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise

immunity.

Input signal for B channel. INB input has a TTL/CMOS compatible input threshold. This pin is pulled low

internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise

immunity.

INB

NC

2

I

-

7

No internal connection. This pin can be left floating, tied to VCCI, or tied to GND.

12

No internal connection. Recommended to leave floating for maximum creepage from driver A to driver B

as needed.

For SOIC-14 DWK Package, pin 12 and pin 13 are removed.

13

OUTA

OUTB

15

10

O

Output of driver A. Connect to the gate of the A channel FET or IGBT.

Output of driver B. Connect to the gate of the B channel FET or IGBT.

Primary-side supply voltage. Locally decoupled to GND using a low ESR/ESL capacitor located as close

to the device as possible.

VCCI

VDDA

VDDB

3

8

P

This pin is internally shorted to pin 3.

Preference should be given to bypassing pin 3-4 instead of pins 8-4.

Secondary-side power for driver A. Locally decoupled to VSSA using a low ESR/ESL capacitor located

as close to the device as possible.

16

11

Secondary-side power for driver B. Locally decoupled to VSSB using a low ESR/ESL capacitor located

as close to the device as possible.

VSSA

VSSB

14

9

P

Ground for secondary-side driver A. Ground reference for secondary side A channel.

Ground for secondary-side driver B. Ground reference for secondary side B channel.

(1) P = power, I = input, O = output

4

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UCC21542 Pin Functions

INA

INB

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

VDDA

OUTA

VSSA

NC

INA

INB

1

2

3

4

5

6

7

8

16

15

14

VDDA

OUTA

VSSA

VCCI

GND

DIS

VCCI

GND

DIS

NC

VDDB

OUTB

VSSB

NC

11

10

9

VDDB

OUTB

VSSB

NC

VCCI

Not to scale

Figure 6-3. DW Package 16-Pin SOIC Top View

Figure 6-4. DWK Package 14-Pin SOIC Top View

I/O ⁽¹⁾

Description

NAME

NO.

Disables both driver outputs if asserted high, enables if set low. It is recommended to tie this pin to

ground if not used to achieve better noise immunity. Bypass using a ≈ 1-nF low ESR/ESL capacitor

close to DIS pin when connecting to a µC with distance.

DIS

5

I

NC

6

4

I

No internal connection. This pin can be left floating, tied to VCCI, or tied to GND.

GND

P

Primary-side ground reference. All signals in the primary side are referenced to this ground.

Input signal for A channel. INA input has a TTL/CMOS compatible input threshold. This pin is pulled low

internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise

immunity.

INA

1

2

I

Input signal for B channel. INB input has a TTL/CMOS compatible input threshold. This pin is pulled low

internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise

immunity.

INB

NC

I

-

7

No internal connection. This pin can be left floating, tied to VCCI, or tied to GND.

12

No internal connection. Recommended to leave floating for maximum creepage from driver A to driver B

as needed.

For SOIC-14 DWK Package, pin 12 and pin 13 are removed.

13

OUTA

OUTB

15

10

O

Output of driver A. Connect to the gate of the A channel FET or IGBT.

Output of driver B. Connect to the gate of the B channel FET or IGBT.

Primary-side supply voltage. Locally decoupled to GND using a low ESR/ESL capacitor located as close

to the device as possible.

VCCI

VDDA

VDDB

3

8

P

This pin is internally shorted to pin 3.

Preference should be given to bypassing pin 3-4 instead of pins 8-4.

Secondary-side power for driver A. Locally decoupled to VSSA using a low ESR/ESL capacitor located

as close to the device as possible.

16

11

Secondary-side power for driver B. Locally decoupled to VSSB using a low ESR/ESL capacitor located

as close to the device as possible.

VSSA

VSSB

14

9

P

Ground for secondary-side driver A. Ground reference for secondary side A channel.

Ground for secondary-side driver B. Ground reference for secondary side B channel.

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7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.5

MAX

6

UNIT

V

Input bias pin supply voltage

Driver bias supply

VCCI to GND

VDDA-VSSA, VDDB-VSSB

20

V

V_VDDA+0.5,

V_VDDB+0.5

OUTA to VSSA, OUTB to VSSB

–0.5

–2

V

Output signal voltage

OUTA to VSSA, OUTB to VSSB, Transient for 200

ns

V_VDDA+0.5,

V_VDDB+0.5

INA, INB, DIS and DT to GND

INA, INB Transient to GND for 200ns

|VSSA-VSSB| in DW Package

|VSSA-VSSB| in DWK Package

–0.5

–2

V_VCCI+0.5

1500

V

Input signal voltage

Channel to channel isolation voltage

V

1850

(2)

Junction temperature, T_J

–40

–65

150

°C

Storage temperature, T_stg

150

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) To maintain the recommended operating conditions for T_J, see the Section 7.4.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

±4000

V_(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101⁽²⁾

±1500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN

3

MAX

UNIT

VCCI

VCCI Input supply voltage

Driver output bias supply

5.5

18

UCC21540A, UCC21542A – 5V UVLO Option

6.0

9.2

–40

V

VDDA,

VDDB

UCC21540, UCC21541, UCC21542 – 8V UVLO Option

18

T_J

Junction Temperature

Ambient Temperature

130

125

°C

T_A

6

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7.4 Thermal Information

UCC2154x

UNIT

DW/K (SOIC)

THERMAL METRIC⁽¹⁾

R_θJA

R_θJC(top)

R_θJB

ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

69.7

33.1

29.0

20.0

28.3

°C/W

Junction-to-board thermal resistance

Junction-to-top characterization parameter

Junction-to-board characterization parameter

ψ_JB

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.5 Power Ratings

VALUE

1775

15

UNIT

mW

P_D

Power dissipation

VCCI = 5.5 V, VDDA/B = 12 V, INA/B = 3.3 V,

5.1 MHz 50% duty cycle square wave 1.0-nF

load

P_DI

Power dissipation by transmitter side

Power dissipation by each driver side

P_DA, P_DB

880

7.6 Insulation Specifications

PARAMETER

TEST CONDITIONS

VALUE

> 8

UNIT

mm

CLR

CPG

External clearance⁽¹⁾

External creepage⁽¹⁾

Shortest pin-to-pin distance through air

Shortest pin-to-pin distance across the package surface

> 8

mm

Minimum internal gap (internal clearance) of the double

insulation (2 × 8.5 µm)

DTI

CTI

Distance through insulation

>17

µm

V

Comparative tracking index

Material group

DIN EN 60112 (VDE 0303-11); IEC 60112

According to IEC 60664-1

> 600

I

Rated mains voltage ≤ 600 V_RMS

Rated mains voltage ≤ 1000 V_RMS

I-IV

I-III

Overvoltage category per

IEC 60664-1

DIN V VDE V 0884-11 (VDE V 0884-11): 2017-01⁽²⁾

Maximum repetitive peak

isolation voltage

V_IORM

AC voltage (bipolar)

1414

V_PK

AC voltage (sine wave); time dependent dielectric breakdown

(TDDB), test (See Figure 7-1)

1000

1414

8000

V_RMS

V_DC

V_PK

Maximum working isolation

voltage

V_IOWM

DC voltage

Maximum transient isolation V_TEST= V_IOTM, t = 60 s (qualification)

V_IOTM

V_IOSM

voltage

V_TEST= 1.2 × V_IOTM, t = 1 s (100% production)

Maximum surge isolation

voltage⁽³⁾

Test method per IEC 62368-1, 1.2/50 µs waveform,

V_TEST= 1.6 × V_IOSM= 12800 V_PK(qualification)

8000

<5

V_PK

pC

pF

Method a, After I/O safety test subgroup 2/3.

V_ini= V_IOTM, t_ini= 60 s;

V_pd(m)= 1.2 X V_IORM= 1697 V_PK, t_m= 10 s

Method a, After environmental tests subgroup 1.

V_ini= V_IOTM, t_ini= 60 s;

V_pd(m)= 1.6 X V_IORM= 2262 V_PK, t_m= 10 s

<5

q_pd

Apparent charge⁽⁴⁾

Method b1; At routine test (100% production) and

preconditioning (type test)

V_ini= 1.2 × V_IOTM; t_ini= 1 s;

<5

V_pd(m)= 1.875 * V_IORM= 2651 V_PK, t_m= 1 s

Barrier capacitance, input to

output⁽⁵⁾

C_IO

V_IO= 0.4 sin (2πft), f =1 MHz

1.2

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UNIT

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PARAMETER

TEST CONDITIONS

V_IO= 500 V at T_A= 25°C

V_IO= 500 V at 100°C ≤ T_A≤ 125°C

VALUE

> 10¹²

> 10¹¹

> 10⁹

Isolation resistance, input to

output⁽⁵⁾

R_IO

Ω

V_IO= 500 V at T_S=150°C

Pollution degree

Climatic category

2

40/125/21

UL 1577

V_TEST= V_ISO= 5700 V_RMS, t = 60 sec. (qualification),

V_TEST= 1.2 × V_ISO= 6840V_RMS, t = 1 sec (100% production)

V_ISO

Withstand isolation voltage

5700

V_RMS

(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application.

Care should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the

isolator on the printed-circuit board do not reduce this distance. Creepage and clearance on a printed-circuit board become equal in

certain cases. Techniques such as inserting grooves, ribs, or both on a printed circuit board are used to help increase these

specifications..

(2) This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured

by means of suitable protective circuits.

(3) Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.

(4) Apparent charge is electrical discharge caused by a partial discharge (pd).

(5) All pins on each side of the barrier tied together creating a two-pin device.

7.7 Safety-Related Certifications

VDE

UL

CQC

Certified according to DIN V VDE V

0884-11:2017-01

Recognized under UL 1577 Component

Recognition Program

Certified according to GB 4943.1-2011

Reinforced Insulation Maximum Transient

Isolation Voltage, 8000 V_PK

Maximum Repetitive Peak Voltage, 1414

V_PK

Maximum Surge Isolation Voltage, 8000

V_PK

;

Reinforced Insulation,

Altitude ≤ 5000 m,

Tropical Climate

Single protection, 5700 V_RMS

File number: E181974

;

Certification number: 40040142

Certificate number: CQC19001226951

7.8 Safety-Limiting Values

Safety limiting intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry.

PARAMETER

TEST CONDITIONS

SIDE

MIN

TYP

MAX

UNIT

θ_JA= 69.7°C/W, V_VDDA/B= 12 V, T_J=

150°C, T_A= 25°C

See Figure 7-2

Safety output supply

current

DRIVER A,

DRIVER B

I_S

73

mA

INPUT

DRIVER A

DRIVER B

TOTAL

15

880

θ_JA= 69.7°C/W, V_VCCI= 5.5 V, T_J= 150°C,

T_A= 25°C

See Figure 7-3

P_S

T_S

Safety supply power

Safety temperature ⁽¹⁾

mW

°C

880

1775

150

(1) The maximum safety temperature, T_S, has the same value as the maximum junction temperature, T_J, specified for the device. The I_S

and P_Sparameters represent the safety current and safety power respectively. The maximum limits of I_Sand P_Sshould not be

exceeded. These limits vary with the ambient temperature, T_A.

The junction-to-air thermal resistance, R_θJA, in the Section 7.4 table is that of a device installed on a high-K test board for leaded

surface-mount packages. Use these equations to calculate the value for each parameter:

T_J= T_A+ R_θJA× P, where P is the power dissipated in the device.

T_J(max)= T_S= T_A+ R_θJA× P_S, where T_J(max)is the maximum allowed junction temperature.

P_S= I_S× V_I, where V_Iis the maximum input voltage.

8

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7.9 Electrical Characteristics

V_VCCI= 3.3 V or 5.0 V, 0.1-µF capacitor from VCCI to GND and 1-µF capacitor from VDDA/B to VSSA/B, V_VDDA= V_VDDB= 12

V, 1-µF capacitor from VDDA and VDDB to VSSA and VSSB, DT pin tied to VCCI, C_L= 0 pF, T_A= –40°C to +125°C unless

otherwise noted^{(1) (2)}

.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY CURRENTS

I_VCCI

VCCI quiescent current

V_INA= 0 V, V_INB= 0 V

1.5

1.0

2.0

1.8

mA

VDDA and VDDB quiescent

current

I_VDDA, I_VDDB

V_INA= 0 V, V_INB= 0 V

current per channel (f = 500-kHz,

50% duty cycle)

I_VCCI

VCCI operating current

2.5

mA

VDDA and VDDB operating current per channel (f = 500 kHz,

current 50% duty cycle), C_L= 100 pF

I_VDDA, I_VDDB

VCC SUPPLY VOLTAGE UNDERVOLTAGE THRESHOLDS

V_{VCCI_ON}

V_{VCCI_OFF}

V_{VCCI_HYS}

UVLO Rising threshold

UVLO Falling threshold

UVLO Threshold hysteresis

2.55

2.35

2.7

2.5

0.2

2.85

2.65

V

UCC21540A, UCC21542A VDD SUPPLY VOLTAGE UNDERVOLTAGE THRESHOLDS (5-V UVLO)

V_{VDDA_ON}, V_{VDDB_ON}

UVLO Rising threshold

5.0

4.7

5.5

5.2

0.3

5.9

5.6

V

V_{VDDA_OFF}, V_{VDDB_OFF}UVLO Falling threshold

V_{VDDA_HYS}, V_{VDDB_HYS}UVLO Threshold hysteresis

UCC21540, UCC21541, UCC21542 VDD SUPPLY VOLTAGE UNDERVOLTAGE THRESHOLDS (8-V UVLO)

V_{VDDA_ON}, V_{VDDB_ON}

UVLO Rising threshold

8

8.5

8

9

V

V_{VDDA_OFF}, V_{VDDB_OFF}UVLO Falling threshold

V_{VDDA_HYS}, V_{VDDB_HYS}UVLO Threshold hysteresis

INA, INB AND DISABLE

7.5

8.5

0.5

V_INAH, V_INBH, V_DISH

V_INAL, V_INBL, V_DISL

Input high threshold voltage

Input low threshold voltage

1.6

0.8

1.8

1

2

V

1.25

V_{INA_HYS}, V_{INB_HYS}

V_{DIS_HYS}

,

Input threshold hysteresis

0.8

V

OUTPUT

UCC21540/A, UCC21542/A

Peak output source current

2

1

4

1.5

6

I_OA+, I_OB+

A

UCC21541

Peak output source current

C_VDD= 10 µF, C_LOAD= 0.18 µF, f =

1 kHz, bench measurement

UCC21540/A, UCC21542/A

Peak output sink current

3

I_OA-, I_OB-

A

UCC21541

Peak output sink current

1.5

2.5

UCC21540/A, UCC21541, I_OUT= –10 mA, R_OHA, R_OHBdo not

UCC21542/A

Output resistance at high

state

represent drive pull-up

performance. See t_RISEin Section

7.10 and Section 9.3.4 for details.

R_OHA, R_OHB

5

10

Ω

UCC21540/A, UCC21542/A

Output resistance at low

state

0.55

1.1

2.6

R_OLA, R_OLB

I_OUT= 10 mA

Ω

V

UCC21541 Output

resistance at low state

1.3

V_VDDA, V_VDDB= 12 V, I_OUT= –10

mA

V_OHA, V_OHB

Output voltage at high state

11.9

11.95

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V_VCCI= 3.3 V or 5.0 V, 0.1-µF capacitor from VCCI to GND and 1-µF capacitor from VDDA/B to VSSA/B, V_VDDA= V_VDDB= 12

V, 1-µF capacitor from VDDA and VDDB to VSSA and VSSB, DT pin tied to VCCI, C_L= 0 pF, T_A= –40°C to +125°C unless

otherwise noted^{(1) (2)}

.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

UCC21540/A, UCC21542/A

Output voltage at low state

5.5

11

V_OLA, V_OLB

V_VDDA, V_VDDB= 12 V, I_OUT= 10 mA

mV

UCC21541 Output voltage

at low state

13

26

Driver output (V_OUTA

V_OUTB) active pull down

,

V_VDDAand V_VDDBunpowered,

I_OUTA, I_OUTB= 200 mA

V_OAPDA, V_OAPDB

1.75

2.1

V

DEAD TIME AND OVERLAP PROGRAMMING

UCC21542/A

DT circuit disabled internally

DT pin tied to VCCI

R_DT= 10 kΩ

Overlap determined by INA, INB

-

Dead time, DT

80

100

200

500

0

120

240

600

10

UCC21540/A, UCC21541

R_DT= 20 kΩ

160

ns

R_DT= 50 kΩ

400

R_DT= 10 kΩ

-

Dead time matching, |

UCC21540/A, UCC21541

R_DT= 20 kΩ

0

20

ns

DT_AB-DT_BA

|

R_DT= 50 kΩ

0

65

(1) Current direction in the testing conditions are defined to be positive into the pin and negative out of the specified terminal (unless

otherwise noted).

(2) Parameters with only a typical value are provided for reference only, and do not constitute part of TI's published device specifications

for purposes of TI's product warranty.

7.10 Switching Characteristics

V_VCCI= 3.3 V or 5.5 V, 0.1-µF capacitor from VCCI to GND, V_VDDA= V_VDDB= 12 V, 1-µF capacitor from VDDA and VDDB to

VSSA and VSSB, load capacitance C_OUT= 0 pF, T_A= –40°C to +125°C unless otherwise noted⁽¹⁾

.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

UCC21540/A, UCC21542/A Output

rise time, see Figure 8-4

5

16

ns

C_VDD= 10 µF, C_OUT= 1.8 nF,

V_VDDA, V_VDDB= 12 V, f = 1 kHz

t_RISE

UCC21541 Output rise time, see

Figure 8-4

8

6

20

12

15

20

UCC21540/A, UCC21542/A Output

fall time, see Figure 8-4

ns

C_VDD= 10 µF, C_OUT= 1.8 nF ,

V_VDDA, V_VDDB= 12 V, f = 1 kHz

t_FALL

UCC21541 Output fall time, see

Figure 8-4

9

t_PWmin

Minimum input pulse width that

passes to output,

see Figure 8-1 and Figure 8-2

10

Output does not change the state if

input signal less than t_PWmin

t_PDHL

t_PDLH

Propagation delay at falling edge,

see Figure 8-3

INx high threshold, V_INH, to 10% of

the output

28

40

ns

Propagation delay at rising edge,

see Figure 8-3

INx low threshold, V_INL, to 90% of

the output

UCC21540/A, UCC21542/A Pulse

width distortion

5.5

|t_PDLHA– t_PDHLA|, |t_PDLHB– t_PDHLB

see Figure 8-3

|

t_PWD

UCC21541 Pulse width distortion

6.5

5

ns

Propagation delays matching,

|t_PDLHA– t_PDLHB|, |t_PDHLA– t_PDHLB|,

see Figure 8-3

t_DM

f = 250kHz

t_{VCCI+ to}

VCCI Power-up Delay Time: UVLO

Rise to OUTA, OUTB,

See Figure 8-7

40

23

59

35

INA or INB tied to VCCI

OUT

µs

t_{VDD+ to OUT}VDDA, VDDB Power-up Delay Time:

UVLO Rise to OUTA, OUTB

See Figure 8-8

10

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V_VCCI= 3.3 V or 5.5 V, 0.1-µF capacitor from VCCI to GND, V_VDDA= V_VDDB= 12 V, 1-µF capacitor from VDDA and VDDB to

VSSA and VSSB, load capacitance C_OUT= 0 pF, T_A= –40°C to +125°C unless otherwise noted⁽¹⁾

.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Slew rate of GND vs. VSSA/B, INA

and INB both are tied to VCCI;

V_CM=1000 V;

High-level common-mode transient

immunity (See Section 8.7)

|CM_H|

|CM_L|

100

V/ns

Slew rate of GND vs. VSSA/B, INA

and INB both are tied to GND;

V_CM=1000 V;

Low-level common-mode transient

immunity (See Section 8.7)

100

(1) Parameters with only a typical value are provided for reference only, and do not constitute part of TI's published device specifications

for purposes of TI's product warranty.

7.11 Insulation Characteristics Curves

Figure 7-1. Reinforced Isolation Capacitor Life Time Projection

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100

2000

1600

1200

800

400

0

I_VDDA/Bfor VDD=12V

I_VDDA/Bfor VDD=18V

80

60

40

20

0

50

100

Ambient Temperature (°C)

150

200

0

50

100

Ambient Temperature (°C)

150

200

UDC0C021

Figure 7-3. Thermal Derating Curve for Limiting

Power Per VDE

Current in Each Channel with Both Channels Running

Simultaneously

Figure 7-2. Thermal Derating Curve for Limiting

Current Per VDE

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7.12 Typical Characteristics

VDDA = VDDB = 12 V, VCCI = 3.3 V or 5.0 V, DT pin tied to VCCI, T_A= 25°C, C_L= 0 pF unless otherwise noted.

1.6

1.5

1.4

1.3

1.2

2.68

2.64

2.6

VCCI = 3.3V

VCCI = 5.0V

2.56

2.52

2.48

2.44

2.4

VCCI = 3.3V, f_S=50kHz

VCCI = 3.3V, f_S=1.0MHz

VCCI = 5.0V, f_S=50kHz

VCCI = 5.0V, f_S=1.0MHz

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Both ChA and ChB are switching at 50% duty cycle

No Load

INA = INB = GND

Figure 7-5. VCCI Operating Current - I_VCCI

Figure 7-4. VCCI Quiescent Current

2.6

2.58

2.56

2.54

2.52

2.5

1.6

VCCI = 3.3V

VCCI = 5.0V

VDD = 12V

VDD = 18V

1.4

1.2

1

0.8

-40

0

100 200 300 400 500 600 700 800 900 1000

Frequency (kHz)

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Both ChA and ChB are switching at 50% duty cycle

INA = INB = GND No Load

Figure 7-6. VCCI Operating Current vs. Frequency

Figure 7-7. VDD Per Channel Quiescent Current

(I_VDDA, I_VDDB

)

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3

2.7

2.4

2.1

3

2.8

2.6

2.4

2.2

2

VDD = 12V, f_S=50kHz

VDD = 12V, f_S=1.0MHz

VDD = 15V, f_S=50kHz

VDD = 15V, f_S=1.0MHz

1.8

1.5

1.2

0.9

1.8

1.6

1.4

1.2

1

VDD = 12V

VDD = 15V

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

0

100 200 300 400 500 600 700 800 900 1000

Frequency (kHz)

D001

No Load

At 50% duty cycle

INA and INB both switching No Load with 50% duty cycle

Figure 7-8. VDD Per Channel Operating Current - Figure 7-9. Per Channel Operating Current (I_VDDA/B

)

I_VDDA/Bvs. Frequency

2.9

2.8

2.7

2.6

2.5

2.4

212

208

204

200

196

192

188

V_{VCCI_ON}

V_{VCCI_OFF}

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-11. VCCI UVLO Threshold Hysteresis

Voltage

Figure 7-10. VCCI UVLO Threshold Voltage

6

360

350

340

330

320

V_{VDD_ON}

V_{VDD_OFF}

5.8

5.6

5.4

5.2

5

-40

-20

0

20

40

60

80

100 120 140

-40

-20

0

20

40

60

80

100 120 140

Temperature (èC)

UDV0L0O1

Figure 7-13. 5-V VDD UVLO Threshold Hysteresis

Voltage

Figure 7-12. 5-V VDD UVLO Threshold Voltage

14

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9

540

530

520

510

500

V_{VDD_ON}

V_{VDD_OFF}

8.7

8.4

8.1

7.8

7.5

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-15. 8-V VDD UVLO Threshold Hysteresis

Voltage

Figure 7-14. 8-V VDD UVLO Threshold Voltage

2.5

875

850

825

800

775

750

IN/DIS High

IN/DIS Low

2

1.5

1

0.5

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-17. INA/INB/DIS High and Low Threshold

Hysteresis

Figure 7-16. INA/INB/DIS High and Low Threshold

Voltage

37.5

3

Rising Edge (t_PDLH

Falling Edge (t_PDHL

)

Rising Edge

Falling Edge

35

32.5

30

2

1

27.5

25

0

-1

22.5

20

-40

-2

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-18. Propagation Delay, Rising and Falling

Edge

Figure 7-19. Propagation Delay Matching, Rising

and Falling Edge

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3

2

60

56

52

48

44

40

36

32

DIS Low to High

DIS High to Low

1

0

-1

-2

-3

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-21. DISABLE Response Time

t_PDLH– t_PDHL

Figure 7-20. Pulse Width Distortion

2.5

2

10

9

VDD Open

VDD = 0V

8

1.5

1

7

6

0.5

5

0

4

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D001

Figure 7-22. OUTPUT Active Pulldown Voltage

Figure 7-23. Minimum Pulse that Changes Output

700

6

R_DT= 10kW

R_DT= 20kW

R_DT= 50kW

R_DT= 20kW

5

4

600

R_DT= 50kW

500

3

400

300

200

100

0

2

1

0

-1

-2

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

-40

-20

0

20

40 60

Temperature (°C)

80

100 120 140

D024

D025

Figure 7-24. Dead Time Temperature Drift

Figure 7-25. Dead Time Matching

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6

360

350

340

330

320

V_{VDD_ON}

V_{VDD_OFF}

5.8

5.6

5.4

5.2

5

-40

-20

0

20

40

60

80

100 120 140

-40

-20

0

20

40

60

80

100 120 140

Temperature (èC)

UDV0L0O1

Figure 7-27. 5-V VDD UVLO Hysteresis Voltage

Figure 7-26. 5-V VDD UVLO Threshold Voltage

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8 Parameter Measurement Information

8.1 Minimum Pulses

A typical 5-ns deglitch filter removes small input pulses introduced by ground bounce or switching transients. An

input pulse with duration longer than t_PWmin, typically 10 ns, must be asserted on INA or INB to guarantee an

output state change at OUTA or OUTB. See Figure 8-1 and Figure 8-2 for detailed information of the operation of

deglitch filter.

INx

V_INH

V_INL

V_INH

V_INL

INx

t_PWM< t_PWmin

OUTx

Figure 8-1. Deglitch Filter – Turn ON

Figure 8-2. Deglitch Filter – Turn OFF

8.2 Propagation Delay and Pulse Width Distortion

Figure 8-3 shows calculation of pulse width distortion (t_PWD) and delay matching (t_DM) from the propagation

delays of channels A and B. To measure delay matching, both inputs must be in phase, and the DT pin must be

shorted to VCCI to enable output overlap.

INA/B

tPDHLA

tPDLHA

tDM

OUTA

tPDLHB

tPDHLB

tPWDB = |tPDLHB t tPDHLB|

OUTB

Figure 8-3. Delay Matching and Pulse Width Distortion

8.3 Rising and Falling Time

Figure 8-4 shows the criteria for measuring rising (t_RISE) and falling (t_FALL) times. For more information on how

short rising and falling times are achieved see Section 9.3.4.

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90%

t_FALL

80%

t_RISE

20%

10%

Figure 8-4. Rising and Falling Time Criteria

8.4 Input and Disable Response Time

Figure 8-5 shows the response time of the disable function. For more information, see Section 9.4.1.

INx

DIS High

Response Time

DIS

DIS Low

Response Time

OUTx

t_PDLH

90%

t_PDHL

10%

Figure 8-5. Disable Pin Timing

8.5 Programmable Dead Time

UCC21542/A internally ties the deadtime circuit to VCCI, leaving pin 6 as not internally connected. This device

always allows both outputs to overlap.

For UCC21540/A and UCC21541, tying DT to VCCI disables DT feature and allows the outputs to overlap.

Placing a resistor (R_DT) between DT and GND adjusts dead time according to the equation: DT (in ns) = 10 ×

R_DT(in kΩ). TI recommends bypassing this pin with a ceramic capacitor, 2.2 nF or greater, close to DT pin to

achieve better noise immunity. For more details on dead time, refer to Section 9.4.2.

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INA

INB

90%

10%

OUTA

tPDHL

tPDLH

90%

10%

OUTB

tPDHL

Dead Time

(Determined by Input signals if

longer than DT set by RDT

(Set by RDT

)

Figure 8-6. Dead Time Switching Parameters for UCC21540/A, UCC21541

8.6 Power-up UVLO Delay to OUTPUT

Whenever the supply voltage VCCI crosses from below the falling threshold V_{VCCI_OFF}to above the rising

threshold V_{VCCI_ON}, and whenever the supply voltage VDDx crosses from below the falling threshold V_{VDDx_OFF}

to above the rising threshold V_{VDDx_ON}, there is a delay before the outputs begin responding to the inputs. For

VCCI UVLO this delay is defined as t_{VCCI+ to OUT}, and is typically 40 µs. For VDDx UVLO this delay is defined as

t_{VDD+ to OUT}, and is typically 23 µs. TI recommends allowing some margin before driving input signals, to ensure

the driver VCCI and VDD bias supplies are fully activated. Figure 8-7 and Figure 8-8 show the power-up UVLO

delay timing diagram for VCCI and VDD.

Whenever the supply voltage VCCI crosses below the falling threshold V_{VCCI_OFF}, or VDDx crosses below the

falling threshold V_{VDDx_OFF}, the outputs stop responding to the inputs and are held low within 1 µs. This

asymmetric delay is designed to ensure safe operation during VCCI or VDDx brownouts.

When VCCI goes away but VDDx is present, outputs are held low; when VDDx is gone, outputs are CLAMPED

low through the active pull down feature. For more detailed UVLO feature description, please check session

Section 9.3.1.

VCCI,

INx

VCCI,

INx

V_{VCCI_ON}

V_{VCCI_OFF}

VDDx

OUTx

t_{VCCI+ to OUT}

t_{VDD+ to OUT}

V_{VDD_ON}

V_{VDD_OFF}

OUTx

Figure 8-7. VCCI Power-up UVLO Delay

Figure 8-8. VDDA/B Power-up UVLO Delay

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8.7 CMTI Testing

Figure 8-9 is a simplified diagram of the CMTI testing configuration.

VCC

VDD

VDDA

16

INA

1

OUTA

15

INB

2

VCC

VSSA

14

VCCI

3

GND

Functional

Isolation

4

5

6

8

DIS

DT

VDDB

11

10

9

OUTB

GND

OUTB

VSSB

VCCI

VSS

Common Mode Surge

Generator

Figure 8-9. Simplified CMTI Testing Setup

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9 Detailed Description

9.1 Overview

In order to switch power transistors rapidly and reduce switching power losses, high-current gate drivers are

often placed between the output of control devices and the gates of power transistors. There are several

instances where controllers are not capable of delivering sufficient current to drive the gates of power transistors.

This is especially the case with digital controllers, since the input signal from the digital controller is often a 3.3-V

logic signal capable of only delivering a few mA.

The UCC2154x is a flexible dual gate driver which can be configured to fit a variety of power supply and motor

drive topologies, as well as drive several types of transistors. The UCC2154x has many features that allow it to

integrate well with control circuitry and protect the gates it drives such as: resistor-programmable dead time (DT)

control, disable pin, and under voltage lock out (UVLO) for both input and output supplies. The UCC2154x also

holds its outputs low when the inputs are left open or when the input pulse duration is too short. The driver inputs

are CMOS and TTL compatible for interfacing with digital and analog power controllers alike. Each channel is

controlled by its respective input pins (INA and INB), allowing full and independent control of each of the outputs.

9.2 Functional Block Diagram

22

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9.3 Feature Description

9.3.1 VDD, VCCI, and Under Voltage Lock Out (UVLO)

The UCC2154x has an internal under voltage lock out (UVLO) protection feature on each supply voltage

between the VDD and VSS pins for both outputs. When the VDD bias voltage is lower than V_{VDD_ON}at device

start-up or lower than V_{VDD_OFF}after start-up, the VDD UVLO feature holds the channel output low, regardless of

the status of the input pins. The VDDx UVLO feature operates independently between CHA and CHB, allowing

for bootstrapped systems where low-side output is required before high-side bias can be charged up.

When the output stages of the driver are in an unbiased or UVLO condition, the driver outputs are held low by an

active clamp circuit that limits the voltage rise on the driver outputs (illustrated in Figure 9-1). In this condition,

the upper PMOS is resistively held off by R_Hi-Zwhile the lower NMOS gate is tied to the driver output through

R_CLAMP. In this configuration, the output is effectively clamped to the threshold voltage of the lower NMOS

device, typically around 1.75V, regardless of whether bias power is available.

VDD

R_{HI_Z}

Output

Control

OUT

R_CLAMP

R_CLAMPis activated

during UVLO

VSS

Figure 9-1. Simplified Representation of Active Pull Down Feature

The VDD UVLO protection has a hysteresis feature (V_{VDD_HYS}). This hysteresis prevents chatter when there is

ground noise from the power supply. This also allows the device to accept small drops in bias voltage, which

commonly occurs when the device starts switching and operating current consumption increases suddenly.

The inputs of the UCC2154x also has an internal under voltage lock out (UVLO) protection feature. The inputs

cannot affect the outputs unless the supply voltage VCCI exceeds V_{VCCI_ON}on start-up. The outputs are held

low and cannot respond to inputs when the supply voltage VCCI drops below V_{VCCI_OFF}after start-up. Like the

UVLO for VDD, there is hystersis (V_{VCCI_HYS}) to ensure stable operation.

Table 9-1. VCCI UVLO Feature Logic ⁽¹⁾

CONDITION

INPUTS

OUTPUTS

INA

H

L

INB

L

OUTA

OUTB

VCCI-GND < V_{VCCI_ON}during device start up

VCCI-GND < V_{VCCI_OFF}after device start up

L

H

L

H

L

H

L

H

L

H

L

(1) VDDx > VDD_ON.

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Table 9-2. VDDx UVLO Feature Logic ⁽¹⁾

CONDITION

INPUTS

OUTPUTS

INA

H

L

INB

L

OUTA

OUTB

VDD-VSS < V_{VDD_ON}during device start up

VDD-VSS < V_{VDD_OFF}after device start up

L

H

L

H

L

H

L

H

L

H

L

(1) VCCI > VCCI_ON.

9.3.2 Input and Output Logic Table

Table 9-3. INPUT/OUTPUT Logic Table ^{(1) (2)}

Assume VCCI, VDDA, VDDB are powered up (see Section 9.3.1 for more information on UVLO operation modes). Table 9-3

shows the operation with INA, INB and DIS and the corresponding output state.

INPUTS

OUTPUTS

DIS

NOTE

INA

L

INB

L

OUTA

OUTB

L

H

L

UCC21540/A, UCC21541:

L

H

If the dead time function is used, output transitions occur after the dead

time expires. See Section 9.4.2.

H

L

H

UCC21540/A, UCC21541:

DT is programmed with R_DT

H

L

.

UCC21540/A, UCC21541:

DT pin pulled high to VCCI

H

UCC21542: Default operation

Left Open Left Open

L

Bypass using a ≥1-nF low ESR/ESL capacitor close to DIS pin when

connecting to a micro-controller with distance.

X

H

(1) "X" means L, H or left open.

(2) For improved noise immunity, TI recommends connecting INA, INB, and DIS to GND, and DT to VCCI, when these pins are not used.

9.3.3 Input Stage

The input pins (INA, INB, and DIS) of the UCC2154x is based on a TTL and CMOS compatible input-threshold

logic that is totally isolated from the VDD supply voltage of the output channels. The input pins are easy to drive

with logic-level control signals (such as those from 3.3-V microcontrollers), since the UCC2154x has a typical

high threshold (V_INAH) of 1.8 V and a typical low threshold of 1 V, which vary little with temperature (see and ). A

wide hysterisis (V_{INA_HYS}) of 0.8 V makes for good noise immunity and stable operation. If any of the inputs are

ever left open, internal pull-down resistors force the pin low. These resistors are typically 200 kΩ for INA/B and

50 kΩ for DIS (see Section 9.2). TI recommends grounding any unused inputs.

The amplitude of any signal applied to the inputs should not exceed the voltage at the VCCI pin. The UCC2154x

cannot be driven from an analog controller with an output voltage greater than the VCCI voltage.

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9.3.4 Output Stage

The UCC2154x output stage features a pull-up structure which delivers the highest peak-source current when it

is most needed: during the Miller plateau region of the power-switch turn on transition (when the power switch

drain or collector voltage experiences dV/dt). The output stage pull-up structure features a P-channel MOSFET

and an additional pull-up N-channel MOSFET in parallel. The function of the N-channel MOSFET is to provide a

boost in the peak-sourcing current, enabling fast turn on. This is accomplished by briefly turning on the N-

channel MOSFET during a narrow instant when the output is changing states from low to high. The on-

resistance of this N-channel MOSFET (R_NMOS) for UCC21540 is approximately 1.47-Ω when activated, and

R_NMOSis approximately 3.2-Ω for UCC21541.

The R_OHparameter is a DC measurement and it is representative of the on-resistance of the P-channel device

only. This is because the pull-up N-channel device is held in the off state in DC condition and is turned on only

for a brief instant when the output is changing states from low to high. Therefore the effective resistance of the

UCC2154x pull-up stage during this brief turn-on phase is much lower than what is represented by the R_OH

parameter.

The pull-down structure of the UCC2154x is composed of an N-channel MOSFET. The R_OLparameter, which is

also a DC measurement, is representative of the impedance of the pull-down state in the device. The output

voltage swings between VDD and VSS for rail-to-rail operation.

VDD

R_OH

Shoot-

R_NMOS

Input

Signal

Through

Prevention

Circuitry

OUT

VSS

R_OL

Pull Up

Figure 9-2. Output Stage

9.3.5 Diode Structure in the UCC2154x

Figure 9-3 illustrates the multiple diodes involved in the ESD protection components. This provides a pictorial

representation of the absolute maximum rating for the device.

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VCCI

3,8

VDDA

16

20 V

15 OUTA

14 VSSA

6 V 6 V

INA

INB

DIS

DT

1

2

5

6

11 VDDB

10 OUTB

20 V

4

9

GND

VSSB

Figure 9-3. ESD Structure

9.4 Device Functional Modes

9.4.1 Disable Pin

When the DIS pin is set high, both outputs are shut down simultaneously. When the DIS pin is set low, the

UCC2154x operates normally. Bypass using a ≈ 1-nF low ESR/ESL capacitor close to DIS pin when connecting

to a micro-controller with distance. The DIS circuit logic structure is similar compared to INA or INB, and the

propagation delay typical performance can be found in . The DIS pin is only functional (and necessary) when

VCCI stays above the UVLO threshold. It is recommended to tie this pin to GND if the DIS pin is not used to

achieve better noise immunity.

9.4.2 Programmable Dead Time (DT) Pin

The UCC21540/A and UCC21541 allows the user to adjust dead time (DT) in the following ways:

9.4.2.1 DT Pin Tied to VCCI

Outputs completely match inputs, so no minimum dead time is asserted. This allows the outputs to overlap. TI

recommends connecting this pin directly to VCCI if it is not used to achieve better noise immunity.

9.4.2.2 Connecting a Programming Resistor between DT and GND Pins

Program t_DTby placing a resistor, R_DT, between the DT pin and GND. TI recommends bypassing this pin with a

ceramic capacitor, 2.2 nF or greater, close to DT pin to achieve better noise immunity. The appropriate R_DTvalue

can be determined from:

t_DTö 10ìR_DT

where

(1)

•

t_DTis the programmed dead time, in nanoseconds.

R_DTis the value of resistance between DT pin and GND, in kilo-ohms.

The steady state voltage at the DT pin is about 0.8 V. R_DTprograms a small current at this pin, which sets the

dead time. As the value of R_DTincreases, the current sourced by the DT pin decreases. The DT pin current will

be less than 10 µA when R_DT= 100 kΩ. For larger values of R_DT, TI recommends placing R_DTand a ceramic

capacitor, 2.2 nF or greater, as close to the DT pin as possible to achieve greater noise immunity and better

dead time matching between both channels.

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The falling edge of an input signal initiates the programmed dead time for the other signal. The programmed

dead time is the minimum enforced duration in which both outputs are held low by the driver. The outputs may

also be held low for a duration greater than the programmed dead time, if the INA and INB signals include a

dead time duration greater than the programmed minimum. If both inputs are high simultaneously, both outputs

will immediately be set low. This feature is used to prevent shoot-through in half-bridge applications, and it does

not affect the programmed dead time setting for normal operation. Various driver dead time logic operating

conditions are illustrated and explained in Input and Output Logic Relationship with Input Signals.

INA

INB

DT

OUTA

OUTB

A

B

C

D

E

F

Figure 9-4. Input and Output Logic Relationship with Input Signals

Condition A: INB goes low, INA goes high. INB sets OUTB low immediately and assigns the programmed dead

time to OUTA. OUTA is allowed to go high after the programmed dead time.

Condition B: INB goes high, INA goes low. Now INA sets OUTA low immediately and assigns the programmed

dead time to OUTB. OUTB is allowed to go high after the programmed dead time.

Condition C: INB goes low, INA is still low. INB sets OUTB low immediately and assigns the programmed dead

time for OUTA. In this case, the input signal dead time is longer than the programmed dead time. When INA

goes high after the duration of the input signal dead time, it immediately sets OUTA high.

Condition D: INA goes low, INB is still low. INA sets OUTA low immediately and assigns the programmed dead

time to OUTB. In this case, the input signal dead time is longer than the programmed dead time. When INB goes

high after the duration of the input signal dead time, it immediately sets OUTB high.

Condition E: INA goes high, while INB and OUTB are still high. To avoid overshoot, OUTB is immediately pulled

low. After some time OUTB goes low and assigns the programmed dead time to OUTA. OUTB is already low.

After the programmed dead time, OUTA is allowed to go high.

Condition F: INB goes high, while INA and OUTA are still high. To avoid overshoot, OUTA is immediately pulled

low. After some time OUTA goes low and assigns the programmed dead time to OUTB. OUTA is already low.

After the programmed dead time, OUTB is allowed to go high.

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10 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

10.1 Application Information

The UCC2154x effectively combines both isolation and buffer-drive functions. The flexible, universal capability of

the UCC2154x (with up to 5.5-V VCCI and 18-V VDDA/VDDB) allows the device to be used as a low-side, high-

side, high-side/low-side or half-bridge driver for MOSFETs, IGBTs or GaN transistor. With integrated

components, advanced protection features (UVLO, dead time, and disable) and optimized switching

performance, the UCC2154x enables designers to build smaller, more robust designs for enterprise, telecom,

automotive, and industrial applications with a faster time to market.

10.2 Typical Application

The circuit in Figure 10-1 shows a reference design with the UCC2154x driving a typical half-bridge configuration

which could be used in several popular power converter topologies such as synchronous buck, synchronous

boost, half-bridge/full bridge isolated topologies, and 3-phase motor drive applications.

VDD

VCC

R_BOOT

HV DC-Link

C_IN

VCC

VDDA

INA

INB

R_OFF

R_ON

16

15

14

PWM-A

1

2

3

4

5

6

8

R_IN

OUTA

VSSA

PWM-B

R_GS

C_BOOT

VCCI

GND

DIS

C_IN

ꢀC

C_VCC

SW

Functional

Isolation

VDD

DIS

VDDB

I/O

R_OFF

R_ON

11

10

9

R_DIS

C_DIS

DT

OUTB

VSSB

R_GS

VCCI

C_VDD

R_DT

C_DT

≥2.2nF

VSS

Figure 10-1. Typical Application Schematic

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10.2.1 Design Requirements

Table 10-1 lists reference design parameters for the example application: UCC2154x driving 650-V MOSFETs in

a high side-low side configuration.

Table 10-1. UCC2154x Design Requirements

PARAMETER

Power transistor

VCC

VALUE

UNITS

650-V, 150-mΩ R_{DS_ON}with 12-V V_GS

-

V

5.0

12

VDD

V

Input signal amplitude

Switching frequency (f_s)

Dead Time

3.3

100

200

400

V

kHz

ns

V

DC link voltage

10.2.2 Detailed Design Procedure

10.2.2.1 Designing INA/INB Input Filter

It is recommended that users avoid shaping the signals to the gate driver in an attempt to slow down (or delay)

the signal at the output. However, a small input R_IN-C_INfilter can be used to filter out the ringing introduced by

non-ideal layout or long PCB traces.

Such a filter should use an R_INin the range of 0 Ω to 100 Ω and a C_INbetween 10 pF and 100 pF. In the

example, an R_IN= 51 Ω and a C_IN= 33 pF are selected, with a corner frequency of approximately 100 MHz.

When selecting these components, it is important to pay attention to the trade-off between good noise immunity

and propagation delay.

10.2.2.2 Select Dead Time Resistor and Capacitor

From Equation 1, a 20-kΩ resistor is selected to set the dead time to 200 ns. A 2.2-nF capacitor is placed in

parallel close to the DT pin to improve noise immunity.

10.2.2.3 Select External Bootstrap Diode and its Series Resistor

The bootstrap capacitor is charged by VDD through an external bootstrap diode every cycle when the low side

transistor turns on. Charging the capacitor involves high-peak currents, and therefore transient power dissipation

in the bootstrap diode may be significant. Conduction loss also depends on the diode’s forward voltage drop.

Both the diode conduction losses and reverse recovery losses contribute to the total losses in the gate driver

circuit.

When selecting external bootstrap diodes, TI recommends choosing high voltage, fast recovery diodes or SiC

Schottky diodes with a low forward voltage drop and low junction capacitance in order to minimize the loss

introduced by reverse recovery and related grounding noise bouncing. In the example, the DC-link voltage is 400

V_DC. The voltage rating of the bootstrap diode should be higher than the DC-link voltage with a good margin.

Therefore, a 600-V ultrafast diode, MURA160T3G, is chosen in this example.

A bootstrap resistor, R_BOOT, is used to reduce the inrush current in D_BOOTand limit the ramp up slew rate of

voltage of VDDA-VSSA during each switching cycle, especially when the VSSA(SW) pin has an excessive

negative transient voltage. The recommended value for R_BOOTis between 1 Ω and 20 Ω depending on the diode

used. In the example, a current limiting resistor of 2.7 Ω is selected to limit the inrush current of bootstrap diode.

The estimated worst case peak current through D_Bootis,

V_DD- V_BDF

R_Boot

12V -1.5V

2.7W

I_{DBoot pk}

=

ö 4A

(

)

(2)

where

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•

V_BDFis the estimated bootstrap diode forward voltage drop around 4 A.

Failure to limit the voltage to VDDx-VSSx to less than the Absolute Maximum Ratings of the FET and UCC2154x

may result in permanent damage to the device in certain cases.

10.2.2.4 Gate Driver Output Resistor

The external gate driver resistors, R_ON/R_OFF, are used to:

•

Limit ringing caused by parasitic inductances/capacitances.

Limit ringing caused by high voltage/current switching dv/dt, di/dt, and body-diode reverse recovery.

Fine-tune gate drive strength, i.e. peak sink and source current to optimize the switching loss.

Reduce electromagnetic interference (EMI).

As mentioned in Section 9.3.4, the UCC2154x has a pull-up structure with a P-channel MOSFET and an

additional pull-up N-channel MOSFET in parallel. The combined peak source current is 4 A. Therefore, the peak

source current can be predicted with:

≈

’

V_DD- V_BDF

R_NMOS||R_OH+ R_ON+ R_{GFET _Int}

I_OA+= min 4A,

∆

÷

◊

∆

«

(3)

(4)

≈

’

V_DD

I_OB+= min 4A,

∆

÷

◊

∆

«

R_NMOS||R_OH+ R_ON+ R_{GFET _Int}

where

•

R_ON: External turn-on resistance.

R_{GFET_INT}: Power transistor internal gate resistance, found in the power transistor datasheet.

I_O+= Peak source current – The minimum value between 4 A, the gate driver peak source current, and the

calculated value based on the gate drive loop resistance.

In this example:

V_DD- V_BDF

R_NMOS||R_OH+ R_ON+ R_{GFET _Int}1.47W || 5W + 2.2W +1.5W

12V - 0.8V

I_OA+

=

ö 2.3A

ö 2.5A

(5)

(6)

V_DD

R_NMOS||R_OH+ R_ON+ R_{GFET _Int}1.47W || 5W + 2.2W +1.5W

12V

I_OB+

=

Therefore, the high-side and low-side peak source current is 2.3 A and 2.5 A respectively. Similarly, the peak

sink current can be calculated with:

≈

’

V_DD- V_BDF- V_GDF

R_OL+R_OFF||R_ON+R_{GFET _Int}

I_OA-= min 6A,

∆

÷

◊

∆

«

(7)

(8)

≈

’

V_DD- V_GDF

R_OL+ R_OFF||R_ON+ R_{GFET _Int}

I_OB-= min 6A,

∆

÷

◊

∆

«

where

•

R_OFF: External turn-off resistance, R_OFF=0 in this example;

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•

V_GDF: The anti-parallel diode forward voltage drop which is in series with R_OFF. The diode in this example is

an MSS1P4.

I_O-: Peak sink current – the minimum value between 6 A, the gate driver peak sink current, and the calculated

value based on the gate drive loop resistance.

In this example,

V_DD- V_BDF- V_GDF

R_OL+R_OFF||R_ON+R_{GFET _Int}

12V - 0.8V -0.85V

0.55W + 0W +1.5W

I_OA-

=

ö 5.0A

(9)

V_DD- V_GDF

12V - 0.85V

I_OB-

=

ö 5.4A

R_OL+ R_OFF||R_ON+ R_{GFET _Int}0.55W + 0W +1.5W

(10)

Therefore, the high-side and low-side peak sink current is 5.0 A and 5.4A respectively.

Importantly, the estimated peak current is also influenced by PCB layout and load capacitance. Parasitic

inductance in the gate driver loop can slow down the peak gate drive current and introduce overshoot and

undershoot. Therefore, it is strongly recommended that the gate driver loop should be minimized. On the other

hand, the peak source/sink current is dominated by loop parasitics when the load capacitance (C_ISS) of the

power transistor is very small (typically less than 1 nF), because the rising and falling time is too small and close

to the parasitic ringing period.

Failure to control OUTx voltage to less than the Absolute Maximum Ratings in the datasheet (including

transients) may result in permanent damage to the device in certain cases. To reduce excessive gate ringing, it

is recommended to use a ferrite bead near the gate of the FET. External clamping diodes can also be added in

the case of extended overshoot/undershoot, in order to clamp the OUTx voltage to the VDDx and VSSx

voltages.

10.2.2.5 Gate to Source Resistor Selection

A gate to source resistor, RGS, is recommended to pull down the gate to the source voltage when the gate driver

output is unpowered and in an indeterminate state. This resistor also helps to mitigate the risk of dv/dt induced

turn-on due to Miller current before the gate driver is able to turn on and actively pull low. This resistor is typically

sized between 5.1kΩ and 20kΩ, depending on the Vth and ratio of CGD to CGS of the power device.

10.2.2.6 Estimating Gate Driver Power Loss

The total loss, P_G, in the gate driver subsystem includes the power losses of the UCC2154x (P_GD) and the power

losses in the peripheral circuitry, such as the external gate drive resistor. Bootstrap diode loss is not included in

P_Gand not discussed in this section.

P_GDis the key power loss which determines the thermal safety-related limits of the UCC2154x , and it can be

estimated by calculating losses from several components.

The first component is the static power loss, P_GDQ, which includes quiescent power loss on the driver as well as

driver self-power consumption when operating with a certain switching frequency. P_GDQis measured on the

bench with no load connected to OUTA and OUTB at a given VCCI, VDDA/VDDB, switching frequency and

ambient temperature. Figure 7-6 and Figure 7-9 show the operating current consumption vs. operating frequency

with no load. In this example, V_VCCI= 5 V and V_VDD= 12 V. The current on each power supply, with INA/INB

switching from 0 V to 3.3 V at 100 kHz is measured to be I_VCCI≈ 2.5 mA, and I_VDDA= I_VDDB≈ 1.5 mA. Therefore,

the P_GDQcan be calculated with

P_GDQ= V_VCCIìI_VCCI+ V_VDDAìI_DDA+ V_VDDBìI_DDB= 50mW

(11)

The second component is switching operation loss, P_GDO, with a given load capacitance which the driver

charges and discharges the load during each switching cycle. Total dynamic loss due to load switching, P_GSW

can be estimated with

,

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P_GSW= 2ì V_DDìQ_Gì f_SW

(12)

where

•

Q_Gis the gate charge of the power transistor.

If a split rail is used to turn on and turn off, then VDD is going to be equal to difference between the positive rail

to the negative rail.

So, for this example application:

P_GSW= 2ì12V ì100nCì100kHz = 240mW

(13)

Q_Grepresents the total gate charge of the power transistor switching 480 V at 14 A provided by the datasheet,

and is subject to change with different testing conditions. The UCC2154x gate driver loss on the output stage,

P_GDO, is part of P_GSW. P_GDOwill be equal to P_GSWif the external gate driver resistances are zero, and all the

gate driver loss is dissipated inside the UCC2154x. If there are external turn-on and turn-off resistances, the total

loss will be distributed between the gate driver pull-up/down resistances and external gate resistances.

Importantly, the pull-up/down resistance is a linear and fixed resistance if the source/sink current is not saturated

to 4 A/6 A, however, it will be non-linear if the source/sink current is saturated. Therefore, P_GDOis different in

these two scenarios.

Case 1 - Linear Pull-Up/Down Resistor:

≈

’

P_GSW

2

R_OH||R_NMOS

R_OL

P_GDO

=

ì

+

∆

«

÷

◊

R_OH||R_NMOS+R_ON+R_{GFET _Int}R_OL+R_OFF||R_ON+ R_{GFET _Int}

(14)

In this design example, all the predicted source/sink currents are less than 4 A/6 A, therefore, the UCC2154x

gate driver loss can be estimated with:

≈

∆

«

’

÷

◊

240mW

2

5W ||1.47W

0.55W

P_GDO

=

ì

+

ö 60mW

5W ||1.47W + 2.2W +1.5W 0.55W + 0W +1.5W

(15)

(16)

Case 2 - Nonlinear Pull-Up/Down Resistor:

T_{R _ Sys}

T_{F _ Sys}

»

ÿ

Ÿ

…

P_GDO= 2ì f_SWì 4A ì

V_DD- V_OUTA/B

t

dt + 6A ì

V_OUTA/Bt dt

( )

(

)

—

…

Ÿ

0

…

Ÿ

⁄

where

•

V_OUTA/B(t) is the gate driver OUTA and OUTB pin voltage during the turn on and off transient, and it can be

simplified that a constant current source (4 A at turn-on and 6 A at turn-off) is charging/discharging a load

capacitor. Then, the V_OUTA/B(t) waveform will be linear and the T_{R_Sys}and T_{F_Sys}can be easily predicted.

For some scenarios, if only one of the pull-up or pull-down circuits is saturated and another one is not, the P_GDO

will be a combination of Case 1 and Case 2, and the equations can be easily identified for the pull-up and pull-

down based on the above discussion. Therefore, total gate driver loss dissipated in the gate driver UCC2154x

P_GD, is:

P_GD= P_GDQ+ P_GDO

(17)

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which is equal to 127 mW in the design example.

10.2.2.7 Estimating Junction Temperature

The junction temperature of the UCC21540UCC2154x can be estimated with:

T_J= T_C+ Y_JTìP_GD

(18)

where

•

T_Jis the junction temperature.

T_Cis the UCC2154x case-top temperature measured with a thermocouple or some other instrument.

ψ_JTis the junction-to-top characterization parameter from the Section 7.4 table.

Using the junction-to-top characterization parameter (Ψ_JT) instead of the junction-to-case thermal resistance

(R_ΘJC) can greatly improve the accuracy of the junction temperature estimation. The majority of the thermal

energy of most ICs is released into the PCB through the package leads, whereas only a small percentage of the

total energy is released through the top of the case (where thermocouple measurements are usually conducted).

R_ΘJCcan only be used effectively when most of the thermal energy is released through the case, such as with

metal packages or when a heatsink is applied to an IC package. In all other cases, use of R_ΘJCwill inaccurately

estimate the true junction temperature. Ψ_JTis experimentally derived by assuming that the amount of energy

leaving through the top of the IC will be similar in both the testing environment and the application environment.

As long as the recommended layout guidelines are observed, junction temperature estimates can be made

accurately to within a few degrees Celsius. For more information, see the Section 12.1 and Semiconductor and

IC Package Thermal Metrics application report.

10.2.2.8 Selecting VCCI, VDDA/B Capacitor

Bypass capacitors for VCCI, VDDA, and VDDB are essential for achieving reliable performance. TI recommends

choosing low ESR and low ESL surface-mount multi-layer ceramic capacitors (MLCC) with sufficient voltage

ratings, temperature coefficients and capacitance tolerances. Importantly, DC bias on an MLCC will impact the

actual capacitance value. For example, a 25-V, 1-µF X7R capacitor is measured to be only 500 nF when a DC

bias of 15 V_DCis applied.

10.2.2.8.1 Selecting a VCCI Capacitor

A bypass capacitor connected to VCCI supports the transient current needed for the primary logic and the total

current consumption, which is only a few mA. Therefore, a 25-V MLCC with over 100 nF is recommended for this

application. If the bias power supply output is a relatively long distance from the VCCI pin, a tantalum or

electrolytic capacitor, with a value over 1 µF, should be placed in parallel with the MLCC.

10.2.2.8.2 Selecting a VDDA (Bootstrap) Capacitor

A VDDA capacitor, also referred to as a bootstrap capacitor in bootstrap power supply configurations, allows for

gate drive current transients up to 4-A, the source peak current, and needs to maintain a stable gate drive

voltage for the power transistor.

The total charge needed per switching cycle can be estimated with

I_VDD@100kHz No Load

(

f_SW

)

= 100nC +

1.5mA

Q_Total= Q_G+

= 115nC

100kHz

(19)

where

•

Q_Total: Total charge needed

Q_G: Gate charge of the power transistor.

I_VDD: The channel self-current consumption with no load at 100kHz.

f_SW: The switching frequency of the gate driver

Therefore, the absolute minimum C_Bootrequirement is:

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Q_Total

115nC

0.5V

C_Boot

=

= 230nF

DV_VDDA

(20)

where

ΔV_VDDAis the voltage ripple at VDDA, which is 0.5 V in this example.

•

In practice, the value of C_Bootis greater than the calculated value. This allows for the capacitance shift caused by

the DC bias voltage and for situations where the power stage would otherwise skip pulses due to load transients.

Therefore, it is recommended to include a margin in the C_Bootvalue and place it as close to the VDD and VSS

pins as possible. A 50-V 1-µF capacitor is chosen in this example.

C_Boot=1ꢀF

(21)

Care should be taken when selecting the bootstrap capacitor to ensure that the VDD to VSS voltage does not

drop below the recommended minimum operating level listed in section 6.3. The value of the bootstrap capacitor

should be sized such that it can supply the initial charge to switch the power device, and then continuously

supply the gate driver quiescent current for the duration of the high-side on-time.

If the high-side supply voltage drops below the UVLO falling threshold, the high-side gate driver output will turn

off and switch the power device off. Uncontrolled hard-switching of power devices can cause high di/dt and high

dv/dt transients on the output of the driver and may result in permanent damage to the device.

To further lower the AC impedance for a wide frequency range, it is recommended to have bypass capacitor

placed very close to VDDx - VSSx pins with a low ESL/ESR. In this example a 100 nF, X7R ceramic capacitor, is

placed in parallel with C_Bootto optimize the transient performance.

Note

Too large C_BOOTis not good. C_BOOTmay not be charged within the first few cycles and V_BOOTcould

stay below UVLO. As a result, the high-side FET does not follow input signal command. Also during

initial C_BOOTcharging cycles, the bootstrap diode has highest reverse recovery current and losses.

10.2.2.8.3 Select a VDDB Capacitor

Channel B has the same current requirements as channel A, therefore, a VDDB capacitor (shown as C_VDDin

Figure 10-1) is needed. In this example with a bootstrap configuration, the VDDB capacitor will also supply

current for VDDA through the bootstrap diode. A 50-V, 10-µF MLCC and a 50-V, 220-nF MLCC are chosen for

C_VDD. If the bias power supply output is a relatively long distance from the VDDB pin, a tantalum or electrolytic

capacitor with a value over 10 µF, should be used in parallel with C_VDD

.

10.2.2.9 Application Circuits with Output Stage Negative Bias

When parasitic inductances are introduced by non-ideal PCB layout and long package leads (e.g. TO-220 and

TO-247 type packages), there could be ringing in the gate-source drive voltage of the power transistor during

high di/dt and dv/dt switching. If the ringing is over the threshold voltage, there is the risk of unintended turn-on

and even shoot-through. Applying a negative bias on the gate drive is a popular way to keep such ringing below

the threshold. Below are a few examples of implementing negative gate drive bias.

Figure 10-2 shows the first example with negative bias turn-off on the channel-A driver using a Zener diode on

the isolated power supply output stage. The negative bias is set by the Zener diode voltage. If the isolated power

supply, V_A, is equal to 17 V, the turn-off voltage will be –5.1 V and turn-on voltage will be 17 V – 5.1 V ≈ 12 V.

The channel-B driver circuit is the same as channel-A, therefore, this configuration needs two power supplies for

a half-bridge configuration, and there will be steady state power consumption from R_Z.

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HV DC-Link

VDDA

OUTA

R_OFF

16

15

1

2

3

4

5

6

8

C_A1

+

V_A

œ

C_IN

R_Z

R_ON

C_A2

VSSA

V_Z

14

SW

Functional

Isolation

VDDB

11

10

9

OUTB

VSSB

Figure 10-2. Negative Bias with Zener Diode on Iso-Bias Power Supply Output

Figure 10-3 shows another example which uses two supplies (or single-input-double-output power supply).

Power supply V_A+determines the positive drive output voltage and V_A–determines the negative turn-off voltage.

The configuration for channel B is the same as channel A. This solution requires more power supplies than the

first example, however, it provides more flexibility when setting the positive and negative rail voltages.

HV DC-Link

VDDA

OUTA

R_OFF

R_ON

16

15

1

2

3

4

5

6

8

C_A1

+

V_A+

œ

C_IN

C_A2

+

V_A-

œ

VSSA

SW

14

Functional

Isolation

VDDB

11

10

9

OUTB

VSSB

Figure 10-3. Negative Bias with Two Iso-Bias Power Supplies

The last example, shown in Figure 10-4, is a single power supply configuration and generates negative bias

through a Zener diode in the gate drive loop. The benefit of this solution is that it only uses one power supply

and the bootstrap power supply can be used for the high side drive. This design requires the least cost and

design effort among the three solutions. However, this solution has limitations:

1. The negative gate drive bias is not only determined by the Zener diode, but also by the duty cycle, which

means the negative bias voltage will change when the duty cycle changes. Therefore, converters with a fixed

duty cycle (~50%) such as variable frequency resonant convertors or phase shift convertors will favor this

solution.

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2. The high side VDDA-VSSA must maintain enough voltage to stay in the recommended power supply range,

which means the low side switch must turn-on or have free-wheeling current on the body (or anti-parallel)

diode for a certain period during each switching cycle to refresh the bootstrap capacitor. Therefore, a 100%

duty cycle for the high side is not possible unless there is a dedicated power supply for the high side, like in

the other two example circuits.

VDD

R_BOOT

HV DC-Link

VDDA

C_Z

V_Z

R_OFF

R_ON

16

15

14

1

2

3

4

5

6

8

OUTA

VSSA

C_IN

C_BOOT

R_GS

SW

Functional

Isolation

VDD

VDDB

C_Z

V_Z

R_OFF

R_ON

11

10

9

OUTB

VSSB

C_VDD

R_GS

VSS

Figure 10-4. Negative Bias with Single Power Supply and Zener Diode in Gate Drive Path

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10.2.3 Application Curves

Figure 10-5 and Figure 10-6 shows the bench test waveforms for the design example shown in Figure 10-1

under these conditions: VCC = 5.0 V, VDD = 12 V, f_SW= 100 kHz, V_DC-Link= 400 V.

Channel 1 (Blue): Gate-source signal on the high side power transistor.

Channel 2 (Cyan): Gate-source signal on the low side power transistor.

Channel 3 (Pink): INA pin signal.

Channel 4 (Green): INB pin signal.

In Figure 10-5, INA and INB are sent complimentary 3.3-V, 20%/80% duty-cycle signals. The gate drive signals

on the power transistor have a 200-ns dead time with 400V high voltage on the DC-Link, shown in the

measurement section of Figure 10-5. Note that with high voltage present, lower bandwidth differential probes are

required, which limits the achievable accuracy of the measurement.

Figure 10-6 shows a zoomed-in version of the waveform of Figure 10-5, with measurements for propagation

delay and dead time. Importantly, the output waveform is measured between the power transistors’ gate and

source pins, and is not measured directly from the driver OUTA and OUTB pins.

Figure 10-5. Bench Test Waveform for INA/B and

OUTA/B

Figure 10-6. Zoomed-In bench-test waveform

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11 Power Supply Recommendations

The recommended input supply voltage (VCCI) for the UCC2154x is between 3 V and 5.5 V. The output bias

supply voltage (VDDA/VDDB) ranges from 6.0 V to 18 V. The lower end of this bias supply range is governed by

the internal under voltage lockout (UVLO) protection feature of each device. VDD and VCCI must not fall below

their respective UVLO thresholds during normal operation. (For more information on UVLO see Section 9.3.1).

The upper end of the VDDA/VDDB range depends on the maximum gate voltage of the power device being

driven by the UCC2154x . The recommended maximum VDDA/VDDB is 18 V.

A local bypass capacitor should be placed between the VDD and VSS pins, to supply current when the output

goes high into a capacitive load. This capacitor should be positioned as close to the device as possible to

minimize parasitic impedance. A low ESR, ceramic surface mount capacitor is recommended. If the bypass

capacitor impedance is too large, resistive and inductive parasitics could cause the supply voltage seen at the IC

pins to dip below the UVLO threshold unexpectedly. To filter high frequency noise between VDD and VSS, it can

be helpful to place a second capacitor with lower impedance at higher frequency. As an example, the primary

bypass capacitor could be 1 µF, with a secondary high frequency bypass capacitor of 100 nF.

Similarly, a bypass capacitor should also be placed between the VCCI and GND pins. Given the small amount of

current drawn by the logic circuitry within the input side of the UCC2154x, this bypass capacitor has a minimum

recommended value of 100 nF.

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12 Layout

12.1 Layout Guidelines

Consider these PCB layout guidelines for in order to achieve optimum performance for the UCC2154x.

12.1.1 Component Placement Considerations

•

Low-ESR and low-ESL capacitors must be connected close to the device between the VCCI and GND pins

and between the VDD and VSS pins to support high peak currents when turning on the external power

transistor.

To avoid large negative transients on the switch node VSSA (HS) pin in bridge configurations, the parasitic

inductances between the source of the top transistor and the source of the bottom transistor must be

minimized.

•

To improve noise immunity when driving the DIS pin from a distant micro-controller or high impedance

source, TI recommends adding a small bypass capacitor, ≥ 1000 pF, between the DIS pin and GND.

If the dead time feature is used, TI recommends placing the programming resistor R_DTand bypassing

capacitor close to the DT pin of the UCC2154x to prevent noise from unintentionally coupling to the internal

dead time circuit. The capacitor should be ≥ 2.2 nF.

12.1.2 Grounding Considerations

•

It is essential to confine the high peak currents that charge and discharge the transistor gates to a minimal

physical loop area. This will decrease the loop inductance and minimize noise on the gate terminals of the

transistors. The gate driver must be placed as close as possible to the transistors.

•

Pay attention to high current path that includes the bootstrap capacitor, bootstrap diode, local VSSB-

referenced bypass capacitor, and the low-side transistor body/anti-parallel diode. The bootstrap capacitor is

recharged on a cycle-by-cycle basis through the bootstrap diode by the VDD bypass capacitor. This

recharging occurs in a short time interval and involves a high peak current. Minimizing this loop length and

area on the circuit board is important for ensuring reliable operation.

12.1.3 High-Voltage Considerations

•

To ensure isolation performance between the primary and secondary side, avoid placing any PCB traces or

copper below the driver device. A PCB cutout is recommended in order to prevent contamination that may

compromise the isolation performance.

•

For half-bridge or high-side/low-side configurations, maximize the clearance distance of the PCB layout

between the high and low-side PCB traces. The DWK package has pin12 and pin13 removed and has a

minimum 3.3mm creepage distance which allows higher bus voltage.

12.1.4 Thermal Considerations

•

A large amount of power may be dissipated by the UCC2154x if the driving voltage is high, the load is heavy,

or the switching frequency is high (refer to Section 10.2.2.6 for more details). Proper PCB layout can help

dissipate heat from the device to the PCB and minimize junction to board thermal impedance (θ_JB).

Increasing the PCB copper connecting to VDDA, VDDB, VSSA and VSSB pins is recommended, with priority

on maximizing the connection to VSSA and VSSB (see Figure 12-2 and Figure 12-3). However, high voltage

PCB considerations mentioned above must be maintained.

If there are multiple layers in the system, it is also recommended to connect the VDDA, VDDB, VSSA and

VSSB pins to internal ground or power planes through multiple vias of adequate size. Ensure that no traces

or copper from different high-voltage planes overlap.

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12.2 Layout Example

Figure 12-1 shows a 2-layer PCB layout example with the signals and key components labeled for the SOIC-14

DW package, which has Pin 12 and Pin 13 removed. For more detailed information, please refer to the

UCC21540EVM design - "Using the UCC21540EVM - TI"

Figure 12-1. Layout Example

Figure 12-2 and Figure 12-3 shows top and bottom layer traces and copper.

Note

There are no PCB traces or copper between the primary and secondary side, which ensures isolation

performance.

PCB traces between the high-side and low-side gate drivers in the output stage are increased to maximize the

creepage distance for high-voltage operation, which will also minimize cross-talk between the switching node

VSSA (SW), where high dv/dt may exist, and the low-side gate drive due to the parasitic capacitance coupling.

Figure 12-3. Bottom Layer Traces and Copper

(Flipped)

Figure 12-2. Top Layer Traces and Copper

40

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Figure 12-4 and Figure 12-5 are 3-D layout pictures with top view and bottom views.

Note

The location of the PCB cutout between the primary side and secondary sides, which ensures

isolation performance.

Figure 12-4. 3-D PCB Top View

Figure 12-5. 3-D PCB Bottom View

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13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the Isolation Glossary

13.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Subscribe to updates to register and receive a weekly digest of any product information that has changed. For

change details, review the revision history included in any revised document.

13.3 Support Resources

TI E2E^™support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

13.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

13.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

42

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PACKAGE MATERIALS INFORMATION

www.ti.com

27-Feb-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UCC21540ADWKR

UCC21540ADWR

UCC21540DWKR

UCC21540DWR

UCC21541DWR

UCC21542ADWKR

UCC21542DWKR

UCC21542DWR

SOIC

DWK

DW

14

16

14

16

14

16

2000

330.0

16.4

10.75 10.7

2.7

12.0

16.0

Q1

DWK

DW

DWK

DW

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

27-Feb-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

UCC21540ADWKR

UCC21540ADWR

UCC21540DWKR

UCC21540DWR

UCC21541DWR

UCC21542ADWKR

UCC21542DWKR

UCC21542DWR

SOIC

DWK

DW

14

16

14

16

14

16

2000

350.0

43.0

DWK

DW

DWK

DW

Pack Materials-Page 2

GENERIC PACKAGE VIEW

DW 16

7.5 x 10.3, 1.27 mm pitch

SOIC - 2.65 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224780/A

www.ti.com

PACKAGE OUTLINE

DW0016B

SOIC - 2.65 mm max height

S

C

A

L

E

1

.

5

0

SOIC

C

10.63

9.97

SEATING PLANE

TYP

PIN 1 ID

AREA

0.1 C

A

14X 1.27

16

1

2X

10.5

10.1

NOTE 3

8.89

8

9

0.51

0.31

16X

7.6

7.4

B

2.65 MAX

0.25

C A

B

NOTE 4

0.33

0.10

TYP

SEE DETAIL A

0.25

GAGE PLANE

0.3

0.1

0 - 8

1.27

0.40

DETAIL A

TYPICAL

(1.4)

4221009/B 07/2016

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

5. Reference JEDEC registration MS-013.

www.ti.com

EXAMPLE BOARD LAYOUT

DW0016B

SOIC - 2.65 mm max height

SOIC

SYMM

16X (2)

1

16X (1.65)

SEE

DETAILS

SEE

DETAILS

1

16

16X (0.6)

SYMM

14X (1.27)

R0.05 TYP

9

8

R0.05 TYP

(9.75)

(9.3)

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

LAND PATTERN EXAMPLE

SCALE:4X

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

SOLDER MASK

DEFINED

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4221009/B 07/2016

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

DW0016B

SOIC - 2.65 mm max height

SOIC

SYMM

16X (1.65)

16X (2)

1

16

16X (0.6)

SYMM

14X (1.27)

8

9

8

9

R0.05 TYP

(9.75)

(9.3)

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

4221009/B 07/2016

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

PACKAGE OUTLINE

DWK0014A

SOIC - 2.65 mm max height

S

C

A

L

E

1

.

5

0

SMALL OUTLINE INTEGRATED CIRCUIT

C

10.63

9.97

SEATING PLANE

TYP

PIN 1 ID

AREA

0.1 C

A

11X 1.27

16

1

2X

10.5

10.1

NOTE 3

8.89

8

9

0.51

0.31

14X

7.6

7.4

B

2.65 MAX

0.25

C A

B

NOTE 4

0.33

0.10

TYP

SEE DETAIL A

0.25

GAGE PLANE

0.3

0.1

0 - 8

1.27

0.40

DETAIL A

TYPICAL

(1.4)

4224374/A 06/2018

NOTES:

1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm, per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.

5. Reference JEDEC registration MS-013.

www.ti.com

EXAMPLE BOARD LAYOUT

DWK0014A

SOIC - 2.65 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

SYMM

14X (2)

1

14X (1.65)

SEE

DETAILS

SEE

DETAILS

1

16

14X (0.6)

SYMM

11X (1.27)

R0.05 TYP

9

8

9

8

R0.05 TYP

(9.75)

(9.3)

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

LAND PATTERN EXAMPLE

SCALE:4X

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

SOLDER MASK

DEFINED

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

4224374/A 06/2018

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

DWK0014A

SOIC - 2.65 mm max height

SMALL OUTLINE INTEGRATED CIRCUIT

SYMM

14X (1.65)

14X (2)

1

16

14X (0.6)

SYMM

11X (1.27)

8

9

8

9

R0.05 TYP

(9.75)

(9.3)

HV / ISOLATION OPTION

8.1 mm CLEARANCE/CREEPAGE

IPC-7351 NOMINAL

7.3 mm CLEARANCE/CREEPAGE

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

4224374/A 06/2018

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

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These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

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型号：	UCC21542DWKR
厂家：	TEXAS INSTRUMENTS
描述：	UCC2154x Reinforced Isolation Dual-Channel Gate Driver With 3.3-mm Channel-to-Channel Spacing Option 栅
文件：	总54页 (文件大小：3066K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

UCC21542DWKR [TI]

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