V62/03601-01XE [TI]
16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS; 具有三态输出的16位总线收发器
| 型号： | V62/03601-01XE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 16-BIT BUS TRANSCEIVER WITH 3-STATE OUTPUTS |
| 文件： | 总14页 (文件大小：655K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SN74ACT16245Q-EP
16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS677A – MAY 2002 – REVISED JULY 2002
DL PACKAGE
(TOP VIEW)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
1DIR
1B1
1B2
GND
1B3
1B4
1
2
3
4
5
6
7
8
9
48 1G
Extended Temperature Performance of
–40°C to 125°C
47 1A1
46 1A2
45 GND
44 1A3
43 1A4
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product Change Notification
†
V
42
V
Qualification Pedigree
CC
CC
1B5
1B6
41 1A5
40 1A6
39 GND
38 1A7
37 1A8
36 2A1
35 2A2
34 GND
33 2A3
32 2A4
Member of the Texas Instruments
Widebus Family
GND 10
1B7 11
1B8 12
2B1 13
2B2 14
GND 15
2B3 16
2B4 17
Inputs Are TTL-Voltage Compatible
3-State Outputs Drive Bus Lines Directly
Flow-Through Architecture Optimizes PCB
Layout
Distributed V
High-Speed Switching Noise
and GND Pins Minimize
CC
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, highly
accelerated stress test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life.
V
18
31
V
CC
CC
2B5 19
2B6 20
GND 21
2B7 22
2B8 23
2DIR 24
30 2A5
29 2A6
28 GND
27 2A7
26 2A8
25 2G
description
The SN74ACT16245Q-EP is a 16-bit bus
transceiver organized as dual-octal noninverting
3-state transceivers and designed for
asynchronous two-way communication between
data buses. The control-function implementation
minimizes external timing requirements.
The device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The enable (G) input can be used to disable the devices so
that the buses are effectively isolated.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
T
A
PACKAGE
–40°C to 125°C
SSOP – DL Tape and reel
SN74ACT16245QDLREP
ACT16245QEP
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT16245Q-EP
16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS677A – MAY 2002 – REVISED JULY 2002
FUNCTION TABLE
(each section)
CONTROL
INPUTS
OPERATION
G
DIR
L
L
L
B data to A bus
A data to B bus
Isolation
H
H
X
logic diagram (positive logic)
1
24
1DIR
2DIR
48
2
25
13
2G
1G
47
36
1A1
2A1
1B1
2B1
To Seven Other Transceivers
To Seven Other Transceivers
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±24 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±24 mA
Continuous current through V
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DL package . . . . . . . . . . . . . . . . . . . 1.2 W
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±260 mA
A
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT16245Q-EP
16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS677A – MAY 2002 – REVISED JULY 2002
recommended operating conditions (see Note 3)
MIN
4.5
2
MAX
UNIT
V
V
V
V
V
V
Supply voltage (see Note 4)
High-level input voltage
Low-level input voltage
Input voltage
5.5
CC
IH
IL
V
0.8
V
0
0
V
V
V
I
CC
Output voltage
V
O
CC
I
I
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
–16
16
mA
mA
ns/V
°C
OH
OL
∆t/∆v
0
10
T
–40
125
A
NOTES: 3. Unused inputs should be tied to V
through a pullup resistor of approximately 5 k or greater to keep them from floating. Refer
to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
CC
4. All V
and GND pins must be connected to the proper-voltage power supply.
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT16245Q-EP
16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS677A – MAY 2002 – REVISED JULY 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
4.4
TYP
MAX
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5 V
4.4
5.4
I
= –50 A
OH
5.4
V
3.94
4.94
3.94
4.94
3.85
V
OH
I
I
I
= –16 mA
= –24 mA
OH
OH
OL
0.1
0.1
0.1
0.1
0.5
0.5
0.5
±1
= 50
A
V
0.36
0.36
V
OL
I
I
= 16 mA
= 24 mA
OL
OL
I
I
I
Control inputs
A or B ports
V = V
or GND
±0.1
±0.5
8
A
A
I
I
CC
V
= V
or GND
±10
160
1
OZ
CC
O
CC
V = V
or GND,
I
O
= 0
A
I
CC
One input at 3.4 V, Other inputs at GND or V
CC
0.9
mA
pF
pF
∆I
CC
C
C
Control inputs
A or B ports
V = V
or GND
4.5
16
i
I
CC
= V or GND
CC
V
5 V
io
O
†
‡
§
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
For I/O ports, the parameter I includes the input leakage current I .
This is the increase in supply current for each input that is at one of the specified TTL-voltage levels rather than 0 V or V
OZ
I
.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 1)
T
A
= 25°C
TYP
6.9
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
3.2
2.6
2.7
3.4
5.8
5.5
MAX
9.3
t
t
t
t
t
t
3.2
2.6
2.7
3.4
5.8
5.5
11.5
11.1
10.9
12.6
13.4
12.7
PLH
PHL
PZH
PZL
PHZ
PLZ
A or B
B or A
B or A
B or A
6.4
9.2
6.4
9.1
ns
G
G
7.4
10.5
11.6
10.8
9.2
ns
8.5
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
= 50 pF, f = 1 MHz
L
TYP
52
UNIT
Outputs enabled
Outputs disabled
C
Power dissipation capacitance per transceiver
C
pF
pd
10
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SN74ACT16245Q-EP
16-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCAS677A – MAY 2002 – REVISED JULY 2002
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
TEST
S1
S1
500 Ω
t
/t
Open
PLH PHL
/t
From Output
Under Test
t
2 × V
CC
GND
PLZ PZL
t
/t
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
LOAD CIRCUIT
Output
Control
(low-level
enabling)
3 V
0 V
1.5 V
1.5 V
t
t
PLZ
PZL
3 V
0 V
Output
Waveform 1
≈V
CC
1.5 V
1.5 V
Input
50% V
CC
20% V
S1 at 2 × V
(see Note B)
CC
CC
V
OL
t
t
PHL
PLH
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
V
OH
V
OH
80% V
CC
50% V
50% V
Output
CC
CC
50% V
CC
V
OL
≈0 V
(see Note B)
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
NOTES: A.
C
includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
SN74ACT16245QDLREP
V62/03601-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DL
48
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SSOP
DL
48
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
SN74ACT16245QDLREP SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SSOP DL 48
SPQ
Length (mm) Width (mm) Height (mm)
346.0 346.0 49.0
SN74ACT16245QDLREP
1000
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
74ACT16245QDLREPG4
SN74ACT16245QDLREP
V62/03601-01XE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
DL
DL
DL
48
48
48
1000
1000
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN74ACT16245QDLREP SSOP
DL
48
1000
330.0
32.4
11.35 16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SSOP DL 48
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 55.0
SN74ACT16245QDLREP
1000
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
48
0.0135 (0,343)
0.008 (0,203)
0.005 (0,13)
M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
0°–ā8°
1
24
0.040 (1,02)
0.020 (0,51)
A
Seating Plane
0.004 (0,10)
0.008 (0,20) MIN
PINS **
0.110 (2,79) MAX
28
48
0.630
56
DIM
0.380
(9,65)
0.730
A MAX
A MIN
(16,00) (18,54)
0.370
(9,40)
0.620
0.720
(15,75) (18,29)
4040048/E 12/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
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相关型号：
V62/03608-01XE
14-BIT, 1/3/8 MSPS DSP COMPATIBLE ANALOG-TO-DIGITAL CONVERTERS WITH INTERNAL REFERENCE AND PGA
TI
V62/03608-02XE
14-BIT, 1/3/8 MSPS DSP COMPATIBLE ANALOG-TO-DIGITAL CONVERTERS WITH INTERNAL REFERENCE AND PGA
TI
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