V62/08607-09XE [TI]
LOW QUIESCENT CURRENT, PROGRAMMABLE DELAY SUPERVISORY CIRCUIT;型号: | V62/08607-09XE |
厂家: | TEXAS INSTRUMENTS |
描述: | LOW QUIESCENT CURRENT, PROGRAMMABLE DELAY SUPERVISORY CIRCUIT 光电二极管 |
文件: | 总15页 (文件大小:464K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS3808-EP
www.ti.com ................................................................................................................................................. SBVS103C–APRIL 2008–REVISED NOVEMBER 2008
LOW QUIESCENT CURRENT, PROGRAMMABLE DELAY SUPERVISORY CIRCUIT
1
FEATURES
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
2
•
Power-On Reset Generator With Adjustable
Delay Time: 1.25 ms to 10 s
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range(1)
•
•
•
Very Low Quiescent Current: 2.4 µA Typical
High Threshold Accuracy: 0.5% Typical
Fixed Threshold Voltages for Standard Voltage
Rails from 0.9 V to 5 V and Adjustable Voltage
Down to 0.4 V Are Available
•
•
•
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
•
•
•
•
Manual Reset (MR) Input
Open-Drain RESET Output
Temperature Range: –55°C to 125°C
Small SOT23 Package
APPLICATIONS
•
•
•
•
•
DSP or Microcontroller Applications
Notebook/Desktop Computers
PDAs/Hand-Held Products
Portable/Battery Powered Products
FPGA/ASIC Applications
(1) Custom temperature ranges available
DESCRIPTION/ORDERING INFORMATION
The TPS3808xxx family of microprocessor supervisory circuits monitors system voltages from 0.4 V to 5.0 V,
asserting an open-drain RESET signal when the SENSE voltage drops below a preset threshold or when the
manual reset (MR) pin drops to a logic low. The RESET output remains low for the user-adjustable delay time
after the SENSE voltage and manual reset (MR) return above the respective thresholds.
The TPS3808 uses a precision reference to achieve 0.5% threshold accuracy for VIT ≤ 3.3 V. The reset delay
time can be set to 20 ms by disconnecting the CT pin, 300 ms by connecting the CT pin to VDD using a resistor,
or can be user-adjusted between 1.25 ms and 10 s by connecting the CT pin to an external capacitor. The
TPS3808 has a very low typical quiescent current of 2.4 µA, so it is well-suited to battery-powered applications. It
is available in a small SOT23 package, and is fully specified over a temperature range of –55°C to +125°C (TJ).
1.2 V
3.3 V
DBV (SOT-23) PACKAGE
(TOP VIEW)
6
5
4
1
2
3
RESET
GND
MR
VDD
VI/O VCORE
SENSE VDD
SENSE VDD
SENSE
CT
TPS3808G12
TPS3808G33
DSP
RESET
MR
RESET
GPIO
GND
CT
CT
GND
GND
Typical Application Circuit
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPS3808-EP
SBVS103C–APRIL 2008–REVISED NOVEMBER 2008................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT(2)
NOMINAL SUPPLY
VOLTAGE(3)
THRESHOLD VOLTAGE (VIT)
TOP-SIDE MARKING
TPS3808G01MDBVTEP
TPS3808G09MDBVTEP(4)
TPS3808G12MDBVTEP(4)
TPS3808G125MDBVTEP(4)
TPS3808G15MDBVTEP(4)
TPS3808G18MDBVTEP(4)
TPS3808G25MDBVTEP(4)
TPS3808G30MDBVTEP(4)
TPS3808G33MDBVREP
TPS3808G50MDBVTEP(4)
Adjustable
0.9 V
0.405 V
0.84 V
1.12 V
1.16 V
1.40 V
1.67 V
2.33 V
2.79 V
3.07 V
4.65 V
NXS
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
PREVIEW
CHK
1.2 V
1.25 V
1.5 V
1.8 V
2.5 V
3.0 V
3.3 V
5.0 V
PREVIEW
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com. Devices are shipped on tape and reel with either 250 units per reel (part numbers ending with 'TEP') or 3000
units per reel (part numbers ending with 'REP').
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) Custom threshold voltages from 0.82 V to 3.3 V, 4.4 V to 5.0 V are available through the use of factory EEPROM programming.
Minimum order quantities apply. Contact factory for details and availability.
(4) Product Preview. Contact your TI sales representative for availability.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating junction temperature range, unless otherwise noted.
TPS3808
–0.3 to 7.0
–0.3 to VDD + 0.3
–0.3 to 7
5
UNIT
V
Input voltage range, VDD
CT voltage range, VCT
V
Other voltage ranges: VRESET, VMR, VSENSE
RESET pin current
V
mA
°C
°C
kV
V
(2)
Operating junction temperature range, TJ
–55 to +150
–65 to +150
2
Storage temperature range, Tstg
ESD rating, HBM
ESD rating, CDM
500
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
(2) As a result of the low dissipated power in this device, it is assumed that TJ = TA.
2
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Product Folder Link(s): TPS3808-EP
TPS3808-EP
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ELECTRICAL CHARACTERISTICS
1.7 V ≤ VDD ≤ 6.5 V, RLRESET = 100 kΩ, CLRESET = 50 pF, over operating temperature range (TJ = –55°C to +125°C), unless
otherwise noted. Typical values are at TJ = +25°C.
PARAMETER
Input supply range
TEST CONDITIONS
MIN
TYP
MAX UNIT
VDD
1.7
6.5
V
VDD = 3.3 V, RESET not asserted
MR, RESET, CT open
2.4
2.7
5.0
µA
IDD
Supply current (current into VDD pin)
VDD = 6.5 V, RESET not asserted
MR, RESET, CT open
6.0
µA
1.3 V ≤ VDD < 1.8 V, IOL = 0.4 mA
1.8 V ≤ VDD ≤ 6.5 V, IOL = 1.0 mA
VOL (max) = 0.2 V, IRESET = 15 µA
0.3
0.4
V
V
V
VOL
Low-level output voltage
Power-up reset voltage(1)
TPS3808G01
0.8
–2.0
–1.7
–2.0
±1.0
±0.5
±1.0
1.5
+2.0
+1.7
+2.0
3.0
Negative-going input
threshold accuracy
VIT
VIT ≤ 3.3 V
%
3.3 V < VIT ≤ 5.0 V
TPS3808G01
Fixed versions
VHYS
RMR
ISENSE
IOH
Hysteresis on VIT pin
%VIT
1.0
2.5
MR Internal pullup resistance
70
90
kΩ
nA
µA
nA
TPS3808G01
VSENSE = VIT
–25
25
Input current at
SENSE pin
Fixed versions
VSENSE = 6.5 V
1.7
RESET leakage current
VRESET = 6.5 V, RESET not asserted
VIN = 0 V to VDD
300
CT pin
5
5
Input capacitance,
any pin
CIN
pF
V
Other pins
VIN = 0 V to 6.5 V
VIL
VIH
MR logic low input
MR logic high input
0
0.3 VDD
VDD
0.7 VDD
SENSE
VIH = 1.05 VIT, VIL = 0.95 VIT
VIH = 0.7 VDD, VIL = 0.3 VDD
20
0.001
20
Input pulse width to
RESET
tw
µs
MR
CT = Open
CT = VDD
CT = 100 pF
CT = 180 nF
MR to RESET
12
180
0.75
0.7
29
440
1.8
1.8
ms
ms
ms
s
300
1.25
1.2
td
RESET delay time
Propagation delay
See Timing Diagram
VIH = 0.7 VDD, VIL = 0.3 VDD
VIH = 1.05 VIT, VIL = 0.95 VIT
150
ns
tpHL
High-to-low level
RESET delay
SENSE to RESET
20
µs
θJA
Thermal resistance, junction-to-ambient
290
°C/W
(1) The lowest supply voltage (VDD) at which RESET becomes active. Trise(VDD) ≥ 15 µs/V.
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TPS3808-EP
SBVS103C–APRIL 2008–REVISED NOVEMBER 2008................................................................................................................................................. www.ti.com
FUNCTIONAL BLOCK DIAGRAMS
VDD
VDD
VDD
TPS3808G01
VDD
Adjustable Voltage
90k
90k
RESET
RESET
MR
MR
SENSE
Reset
Logic
Timer
Reset
Logic
Timer
R1
−
−
SENSE
CT
CT
+
+
R2
0.4V
VREF
0.4V
VREF
Ω
R1 + R2 = 4M
GND
GND
Fixed Voltage Version
Adjustable Voltage Version
Figure 1. Adjustable and Fixed Voltage Versions
PIN ASSIGNMENTS
DBV PACKAGE
SOT23
(TOP VIEW)
6
5
4
1
2
3
RESET
GND
MR
VDD
SENSE
CT
Table 1. TERMINAL FUNCTIONS
TERMINAL
SOT23 (DBV)
NAME
PIN NO.
DESCRIPTION
RESET
1
RESET is an open-drain output that is driven to a low impedance state when RESET is asserted (either the
SENSE input is lower than the threshold voltage (VIT) or the MR pin is set to a logic low). RESET remains
low (asserted) for the reset period after both SENSE is above VIT and MR is set to a logic high. A pullup
resistor from 10 kΩ to 1 MΩ should be used on this pin, and allows the reset pin to attain voltages higher
than VDD
.
GND
MR
CT
2
3
4
Ground
Driving the manual reset pin (MR) low asserts RESET. MR is internally tied to VDD by a 90kΩ pullup resistor.
Reset period programming pin. Connecting this pin to VDD through a 40-kΩ to 200-kΩ resistor or leaving it
open results in fixed delay times (see Electrical Characteristics). Connecting this pin to a ground referenced
capacitor ≥ 100 pF gives a user-programmable delay time. See the Selecting the Reset Delay Time section
for more information.
SENSE
VDD
5
6
This pin is connected to the voltage to be monitored. If the voltage at this terminal drops below the threshold
voltage VIT, then RESET is asserted.
Supply voltage. It is good analog design practice to place a 0.1-µF ceramic capacitor close to this pin.
4
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TIMING DIAGRAM
VDD
0.8V
0.0V
RESET
tD = Reset Delay
tD
tD
tD
= Undefined State
SENSE
VIT + VHYS
VIT
MR
0.7VDD
0.3VDD
Time
Figure 2. TPS3808 Timing Diagram Showing MR and SENSE Reset Timing
TRUTH TABLE
MR
L
SENSE > VIT
RESET
0
1
0
1
L
L
L
H
L
H
H
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SBVS103C–APRIL 2008–REVISED NOVEMBER 2008................................................................................................................................................. www.ti.com
TYPICAL CHARACTERISTICS
At TJ = +25°C, VDD = 3.3 V, RLRESET = 100kΩ, and CLRESET = 50pF, unless otherwise noted.
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
RESET TIMEOUT PERIOD
vs
CT
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
100
10
_
+125 C
_
+85 C
−40°C, +25°C, +125°C
1
_
+25 C
0.1
0.01
_
−40 C
0.001
0
1
2
3
4
5
6
7
0.0001
0.001
0.01
0.1
1
10
V
DD
(V)
µ
CT ( F)
Figure 3.
Figure 4.
NORMALIZED RESET TIMEOUT PERIOD
vs
MAXIMUM TRANSIENT DURATION AT SENSE
TEMPERATURE
vs
(CT = OPEN, CT = VDD, CT = Any)
SENSE THRESHOLD OVERDRIVE VOLTAGE
100
10
1
10
8
6
4
RESET OCCURS
ABOVE THE CURVE
2
0
−2
−4
−6
−8
−10
0
5
10
15
20
25 30
35
45
40
50
10
30
50
70
90 110 130
−50 −30 −10
Overdrive (%VIT)
Temperature (°C)
Figure 5.
Figure 6.
NORMALIZED SENSE THRESHOLD VOLTAGE (VIT)
LOW-LEVEL RESET VOLTAGE
vs
vs
TEMPERATURE
RESET CURRENT
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
0.8
0.6
0.4
0.2
0
−0.2
−0.4
−0.6
VDD = 1.8V
−0.8
−1.0
10
30
50
70
90 110 130
−50 −30 −10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
RESET Current (mA)
Temperature (°C)
Figure 7.
Figure 8.
6
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TYPICAL CHARACTERISTICS (continued)
At TJ = +25°C, VDD = 3.3 V, RLRESET = 100kΩ, and CLRESET = 50pF, unless otherwise noted.
LOW-LEVEL RESET VOLTAGE
vs
RESET CURRENT
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD = 3.3V
VDD = 6.5V
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
RESET Current (mA)
Figure 9.
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SBVS103C–APRIL 2008–REVISED NOVEMBER 2008................................................................................................................................................. www.ti.com
DEVICE OPERATION
supply line can be used to allow the reset signal for
The TPS3808 microprocessor supervisory product
the microprocessor to have a voltage higher than VDD
family is designed to assert a RESET signal when
(up to 6.5 V). The pullup resistor should be no
either the SENSE pin voltage drops below VIT or the
smaller than 10 kΩ as a result of the finite impedance
manual reset (MR) is driven low. The RESET output
of the RESET line.
remains asserted for a user-adjustable time after both
the manual reset (MR) and SENSE voltages return
above the respective thresholds. A broad range of
SENSE INPUT
voltage threshold and reset delay time adjustments
are available, allowing these devices to be used in a
wide array of applications. Reset threshold voltages
can be factory-set from 0.82 V to 3.3 V or from 4.4 V
to 5.0 V, while the TPS3808G01 can be set to any
voltage above 0.405 V using an external resistor
divider. Two preset delay times are also
user-selectable: connecting the CT pin to VDD results
in a 300ms reset delay, while leaving the CT pin open
yields a 20-ms reset delay. In addition, connecting a
capacitor between CT and GND allows the designer
to select any reset delay period from 1.25 ms to 10 s.
The SENSE input provides a terminal at which any
system voltage can be monitored. If the voltage on
this pin drops below VIT, then RESET is asserted.
The comparator has a built-in hysteresis to ensure
smooth RESET assertions and de-assertions. It is
good analog design practice to put a 1-nF to 10-nF
bypass capacitor on the SENSE input to reduce
sensitivity to transients and layout parasitics.
The TPS3808G01 can be used to monitor any
voltage rail down to 0.405 V using the circuit shown
in Figure 11.
VIN
VOUT
RESET OUTPUT
VDD
VIT¢ = (1 + R1 ) 0.405
A typical application of the TPS3808G25 used with
the OMAP1510 processor is shown in Figure 10. The
open-drain RESET output is typically connected to
the RESET input of a microprocessor. A pullup
resistor must be used to hold this line high when
RESET is not asserted. The RESET output is
undefined for voltage below 0.8 V, but this is normally
not a problem since most microprocessors do not
function below this voltage. RESET remains high
(unasserted) as long as SENSE is above its threshold
(VIT) and the manual reset (MR) is logic high. If either
SENSE falls below VIT or MR is driven low, RESET is
asserted, driving the RESET pin to a low impedance.
R2
R1
TPS3808G01
SENSE
RESET
GND
R2
1nF
Figure 11. Using the TPS3808G01 to Monitor a
User-Defined Threshold Voltage
MANUAL RESET (MR) INPUT
2.5V
The manual reset (MR) input allows a processor or
other logic circuits to initiate a reset. A logic low
(0.3 VDD) on MR causes RESET to assert. After MR
returns to a logic high and SENSE is above its reset
threshold, RESET is de-asserted after the user
defined reset delay expires. Note that MR is internally
tied to VDD using a 90-kΩ resistor so this pin can be
left unconnected if MR will not be used.
V
SENSE
V
DD
DDSHV 1, 3, 6, 7, 9
Ω
1M
TPS3808G25
OMAP1510
MR
RESET
RESPWRON
GND
CT
GND
See Figure 12 for how MR can be used to monitor
multiple system voltages. Note that if the logic signal
driving MR does not go fully to VDD, there will be
some additional current draw into VDD as a result of
the internal pullup resistor on MR. To minimize
current draw, a logic-level FET can be used as
illustrated in Figure 13.
Figure 10. Typical Application of the TPS3808
with an OMAP Processor
Once MR is again logic high and SENSE is above VIT
+ VHYS (the threshold hysteresis), a delay circuit is
enabled which holds RESET low for a specified reset
delay period. Once the reset delay has expired, the
RESET pin goes to a high impedance state. The
pullup resistor from the open-drain RESET to the
8
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affected by the choice of resistor. Figure 14b shows a
1.2V
3.3V
fixed 20-ms delay time by leaving the CT pin open.
Figure 14c shows a ground referenced capacitor
connected to CT for a user-defined program time
between 1.25 ms and 10 s.
V
V
CORE
SENSE
V
SENSE V
DD
I/O
DD
The capacitor CT should be ≥ 100 pF nominal value
in order for the TPS3808xxx to recognize that the
capacitor is present. The capacitor value for a given
delay time can be calculated using the following
equation:
TPS3808G12
TPS3808G33
DSP
RESET
MR
RESET
GPIO
GND
CT
CT
GND
GND
*3
ƪ
ƫ
CT (nF) + tD (s)*0.5 10 (s) 175
(1)
The reset delay time is determined by the time it
takes an on-chip precision 220-nA current source to
charge the external capacitor to 1.23 V. When a
RESET is asserted the capacitor is discharged. When
the RESET conditions are cleared, the internal
current source is enabled and begins to charge the
external capacitor. When the voltage on this capacitor
reaches 1.23 V, RESET is deasserted. Note that a
low-leakage type capacitor such as a ceramic should
be used, and that stray capacitance around this pin
may cause errors in the reset delay time.
Figure 12. Using MR to Monitor Multiple System
Voltages
3.3V
V DD SENSE
90kW
MR
TPS3808xxx
IMMUNITY TO SENSE PIN VOLTAGE
TRANSIENTS
GND
The TPS3808 is relatively immune to short negative
transients on the SENSE pin. Sensitivity to transients
is dependent on threshold overdrive, as shown in the
Maximum Transient Duration at Sense vs Sense
Threshold Overdrive Voltage graph (Figure 6) in the
Typical Characteristics section.
Figure 13. Using an External MOSFET to Minimize
IDD When MR Signal Does Not Go to VDD
SELECTING THE RESET DELAY TIME
The TPS3808 has three options for setting the
RESET delay time as shown in Figure 14. Figure 14a
shows the configuration for a fixed 300-ms typical
delay time by tying CT to VDD; a resistor from 40 kΩ
to 200 kΩ must be used. Supply current is not
3.3V
3.3V
3.3V
SENSE VDD
SENSE VDD
SENSE VDD
Ω
50k
TPS3808G33
TPS3808G33
TPS3808G33
RESET
CT RESET
CT RESET
CT
CT
−3
Delay (s) = C (nF) + 0.5 x 10 (s)
T
300ms Delay
20ms Delay
175
(b)
(a)
(c)
Figure 14. Configuration Used to Set the RESET Delay Time
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PACKAGE OPTION ADDENDUM
www.ti.com
2-Feb-2009
PACKAGING INFORMATION
Orderable Device
TPS3808G01MDBVTEP
TPS3808G33MDBVREP
V62/08607-01XE
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
V62/08607-09XE
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3808G01MDBVTEP SOT-23
TPS3808G33MDBVREP SOT-23
DBV
DBV
6
6
250
179.0
179.0
8.4
8.4
3.2
3.2
3.2
3.2
1.4
1.4
4.0
4.0
8.0
8.0
Q3
Q3
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3808G01MDBVTEP
TPS3808G33MDBVREP
SOT-23
SOT-23
DBV
DBV
6
6
250
203.0
203.0
203.0
203.0
35.0
35.0
3000
Pack Materials-Page 2
IMPORTANT NOTICE
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