V62/10605-01XE [TI]

PRECISION, LOW POWER INSTRUMENTATION AMPLIFIERS; 精密低功耗仪表放大器
V62/10605-01XE
型号: V62/10605-01XE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

PRECISION, LOW POWER INSTRUMENTATION AMPLIFIERS
精密低功耗仪表放大器

运算放大器 仪表放大器 放大器电路 光电二极管
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中文:  中文翻译
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INA129-EP  
www.ti.com  
SBOS508 DECEMBER 2009  
PRECISION, LOW POWER INSTRUMENTATION AMPLIFIERS  
Check for Samples: INA129-EP  
1
FEATURES  
SUPPORTS DEFENSE, AEROSPACE  
AND MEDICAL APPLICATIONS  
Low Offset Voltage  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Military (–55°C/125°C)  
Temperature Range(1)  
Low Input Bias Current  
High CMR  
Inputs Protected to ±40 V  
Wide Supply Range: ±2.25 V to ±18 V  
Low Quiescent Current  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
APPLICATIONS  
Bridge Amplifier  
Thermocouple Amplifier  
RTD Sensor Amplifier  
Medical Instrumentation  
Data Acquisition  
D PACKAGE  
(TOP VIEW)  
1
2
3
4
8
7
6
5
RG  
RG  
V+  
VO  
Ref  
V- IN  
V+  
IN  
V-  
(1) Custom temperature ranges available  
DESCRIPTION  
The INA129 is a low power, general purpose instrumentation amplifier offering excellent accuracy. The versatile  
3-op amp design and small size make it ideal for a wide range of applications. Current-feedback input circuitry  
provides wide bandwidth even at high gain (200 kHz at G = 100).  
A single external resistor sets any gain from 1 to 10,000. The INA129 provides an industry-standard gain  
equation; the INA129 gain equation is compatible with the AD620.  
The INA129 is laser trimmed for very low offset voltage, drift and high common-mode rejection (113 dB at  
G 100). It operates with power supplies as low as ±2.25 V, and quiescent current is only 750 μA - ideal for  
battery operated systems. Internal input protection can withstand up to ±40 V without damage.  
The INA129 is available in an SO-8 surface-mount package specified for the –55°C to 125°C temperature range.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
INA129-EP  
SBOS508 DECEMBER 2009  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
V+  
7
49.4 kW  
G = 1 +  
RG  
INA129  
2
1
-
VIN  
Over-Voltage  
Protection  
A1  
40 kW  
40 kW  
24.7 kW  
6
5
A3  
VO  
RG  
8
3
24.7 kW  
A2  
Ref  
+
VIN  
Over-Voltage  
Protection  
40 kW  
40 kW  
4
V-  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–55°C to 125°C  
SOIC-D  
INA129MDREP  
129EP  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
±18  
UNIT  
V
VS  
Supply voltage  
Analog input voltage range  
Output short-circuit (to ground)  
Operating temperature  
±40  
V
Continuous  
TA  
–55 to 125  
–55 to 125  
150  
°C  
°C  
°C  
°C  
TSTG  
TJ  
Storage temperature range  
Junction temperature  
Lead temperature (soldering, 10s)  
300  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
2
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SBOS508 DECEMBER 2009  
ELECTRICAL CHARACTERISTICS  
At TA = 25°C, VS = ±15 V, RL = 10 kΩ (unless otherwise noted)  
Boldface limits apply over the specified temperature range, TA = –55°C to 125°C.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT  
Offset Voltage, RTI  
TA = 25°C  
Over temperature  
±100 ±800/G  
±150 ±2050/G  
±1.6 ±175/G  
±1.8 ±175/G  
Initial  
µV  
TA = 25°C, VS = ±2.25 V to ±18 V  
Over temperature  
vs power supply  
µV/V  
Long-term stability  
Impedance, differential  
Common mode  
±1 ±3/G  
µV/mo  
Ω || pF  
Ω || pF  
V
1010 || 2  
1011||9  
Common mode voltage range(1)  
VO = 0 V  
(V+) 2  
(V+) 1.4  
(V) + 1.7  
(V) + 2  
V
Safe input voltage  
±40  
V
G = 1  
Over temperature  
G = 10  
75  
67  
86  
106  
125  
130  
93  
Over temperature  
G = 100  
84  
VCM = ±13 V,  
ΔRS = 1 kΩ  
Common-mode rejection  
dB  
113  
98  
Over temperature  
G = 1000  
113  
98  
Over temperature  
CURRENT  
±2  
±1  
±8  
±16  
±8  
Bias current  
nA  
nA  
Over temperature  
Offset Current  
Over temperature  
±16  
NOISE  
f = 10 Hz  
10  
8
f = 100 Hz  
nV/Hz  
G = 1000,  
RS = 0 Ω  
Noise voltage, RTI  
Noise current  
f = 1 kHz  
8
fB = 0.1 Hz to 10 Hz  
f = 10 Hz  
0.2  
0.9  
0.3  
30  
µVpp  
pA/Hz  
pAPP  
G = 1000,  
RS = 0 Ω  
f = 1 kHz  
fB = 0.1 Hz to 10 Hz  
GAIN  
1 +  
(49.4 kΩ/RG)  
Gain equation  
Range of gain  
V/V  
V/V  
1
10000  
±0.1  
G = 1  
±0.05  
±0.02  
±0.05  
±0.5  
Over temperature  
G = 10  
±0.15  
±0.5  
Gain error  
Over temperature  
G = 100  
±0.65  
±0.65  
±1.1  
%
Over temperature  
G = 1000  
±2  
(1) Input common-mode range varies with output voltage — see typical curves.  
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SBOS508 DECEMBER 2009  
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ELECTRICAL CHARACTERISTICS (continued)  
At TA = 25°C, VS = ±15 V, RL = 10 kΩ (unless otherwise noted)  
Boldface limits apply over the specified temperature range, TA = –55°C to 125°C.  
PARAMETER  
Gain vs temperature(2)  
49.4-kΩ resistance(2) (3)  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
G = 1  
±1  
±10  
ppm/°C  
ppm/°C  
±25  
±100  
VO = ±13.6 V,  
G = 1  
±0.0001  
±0.0018  
Over temperature  
G = 10  
±0.0035  
±0.0035  
±0.0055  
±0.0035  
±0.0055  
±0.0003  
±0.0005  
±0.001  
Nonlinearity  
% of FSR  
Over temperature  
G = 100  
Over temperature  
G = 1000  
(4)  
See  
OUTPUT  
Positive  
Voltage  
RL = 10 kΩ  
RL = 10 kΩ  
(V+) 1.4  
(V) + 1.4  
(V+) 0.9  
(V) + 0.8  
1000  
V
Negative  
Load capacitance stability  
Short-curcuit current  
pF  
+6/15  
mA  
FREQUENCY RESPONSE  
G = 1  
G = 10  
1300  
700  
200  
20  
Bandwidth, 3 dB  
Slew rate  
kHz  
G = 100  
G = 1000  
VO = ±10 V,  
G = 10  
4
V/µs  
G = 1  
G = 10  
7
7
Settling time, 0.01%  
µs  
µs  
G = 100  
9
G = 1000  
50% overdrive  
80  
4
Overload recovery  
POWER SUPPLY  
Voltage range  
±2.25  
±15  
±18  
±750  
V
VIN = 0 V  
±700  
Current, total  
µA  
Over temperature  
±1200  
TEMPERATURE RANGE  
Specification  
55  
55  
125  
125  
°C  
°C  
Operating  
8-pin DIP  
80  
θJA  
°C/W  
SO-8 SOIC  
150  
(2) Specified by wafer test.  
(3) Temperature coefficient of the 49.4-kΩ term in the gain equation.  
(4) Nonlinearity measurements in G = 1000 are dominated by noise. Typical nonlinearity is ±0.001%.  
4
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INA129-EP  
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SBOS508 DECEMBER 2009  
TYPICAL CHARACTERISTICS  
At TA = 25°C, VS = ±15 V, unless otherwise noted.  
GAIN  
vs  
COMMON-MODE REJECTION  
vs  
FREQUENCY  
FREQUENCY  
140  
120  
100  
80  
60  
50  
40  
30  
20  
10  
0
G =1000V/V  
G =100V/V  
G = 1000V/V  
G = 100V/V  
G = 10V/V  
G =10V/V  
G =1V/V  
60  
40  
G = 1V/V  
20  
10  
20  
0
1k  
10k  
100k  
1M  
10M  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
Frequency (Hz)  
Figure 1.  
Figure 2.  
POSITIVE POWER SUPPLY REJECTION  
NEGATIVE POWER SUPPLY REJECTION  
vs  
vs  
FREQUENCY  
FREQUENCY  
140  
120  
100  
80  
140  
120  
100  
80  
G = 1000V/V  
G =100V/V  
G =1000V/V  
G =100V/V  
60  
60  
G=10V/V  
G=1V/V  
G= 10V/V  
G=1V/V  
40  
40  
20  
20  
0
0
10  
100  
1k  
10k  
100k  
1M  
10  
Frequency (Hz)  
Frequency (Hz)  
Figure 3.  
Figure 4.  
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SBOS508 DECEMBER 2009  
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TYPICAL CHARACTERISTICS (continued)  
At TA = 25°C, VS = ±15 V, unless otherwise noted.  
INPUT COMMON-MODE RANGE  
INPUT COMMON-MODE RANGE  
vs  
vs  
OUTPUT VOLTAGE  
(VS = ±15 V)  
OUTPUT VOLTAGE  
(VS = ±5 V, ±2.5 V)  
5
4
3
2
1
0
15  
G
10  
G
10  
G
10  
G
10  
10  
5
G=1  
G=1  
G=1  
G = 1  
G
10  
G=1  
+15V  
VD/2  
VD/2  
VCM  
0
+
+
VO  
1
2
Ref  
5
-15V  
3
4
5
V
V
= ±5V  
10  
S
S
= ±2.5V  
15  
-1  
0
1
2
3
4
5
-5  
-4  
-3  
-2  
-15  
-10  
-5  
0
5
10  
15  
Output Voltage (V)  
Output Voltage (V)  
Figure 5.  
Figure 6.  
INPUT-REFERRED NOISE  
SETTLING TIME  
vs  
vs  
FREQUENCY  
GAIN  
100  
10  
1
1k  
100  
10  
1
0.01%  
0.1%  
G = 1V / V  
G =10V/V  
100  
10  
1
G =100, 1000V/V  
Current Noise  
0.1  
10  
100  
1000  
1
1
10  
100  
1k  
10k  
Gain (V/V)  
Frequency (Hz)  
Figure 7.  
Figure 8.  
6
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SBOS508 DECEMBER 2009  
TYPICAL CHARACTERISTICS (continued)  
At TA = 25°C, VS = ±15 V, unless otherwise noted.  
QUIESCENT CURRENT AND SLEW RATE  
vs  
TEMPERATURE  
INPUT OVER-VOLTAGE V/I CHARACTERISTICS  
5
0.85  
0.8  
6
5
4
3
2
1
4
3
2
1
0
Flat region represents  
normal linear operation.  
G = 1000V/V  
G = 1V / V  
0.75  
Slew Rate  
+15V  
0.7  
1
2
G = 1 V / V  
IQ  
0.65  
3
4
5
VIN  
G = 1000V/V  
IIN  
15V  
0 6  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
-50 -40 -30 -20 -10  
0
10  
20  
30  
40  
50  
Temperature (°C)  
Input Voltage (V)  
Figure 9.  
Figure 10.  
INPUT BIAS CURRENT  
vs  
INPUT OFFSET VOLTAGE WARM-UP  
TEMPERATURE  
10  
2
1
0
8
6
4
2
IOS  
0
-2  
-4  
-6  
-8  
-10  
IB  
1
2
Typical I and I  
OS  
B
Range ±2nA at 25°C  
500  
400  
300  
Time (ms)  
200  
100  
0
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Figure 11.  
Figure 12.  
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SBOS508 DECEMBER 2009  
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TYPICAL CHARACTERISTICS (continued)  
At TA = 25°C, VS = ±15 V, unless otherwise noted.  
OUTPUT VOLTAGE SWING  
vs  
OUTPUT VOLTAGE SWING  
vs  
OUTPUT CURRENT  
POWER SUPPLY VOLTAGE  
(V+)  
(V+)  
(V+)-0.4  
(V+)-0.4  
+85°C  
+25°C  
(V+)-0.8  
(V+)-1.2  
(V+)-0.8  
(V+)-1.2  
-40 °C  
+25°C  
RL = 10 kΩ  
(V-)+1.2  
(V-)+0.8  
(V-)+0.4  
(V-)  
(V-)+1.2  
-40 °C  
+85°C  
-40 °C  
(V-)+0.8  
(V-)+0.4  
(V-)  
+85°C  
0
5
10  
15  
20  
0
1
2
3
4
Output Current (mA)  
Power Supply Voltage (V)  
Figure 13.  
Figure 14.  
SHORT-CIRCUIT OUTPUT CURRENT  
MAXIMUM OUTPUT VOLTAGE  
vs  
vs  
TEMPERATURE  
FREQUENCY  
30  
25  
20  
15  
10  
5
18  
16  
14  
12  
10  
8
G =10, 100  
-I  
SC  
G = 1  
G = 1000  
6
+I  
SC  
4
2
0
0
1k  
10k  
100k  
1M  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
Temperature (°C)  
Frequency (Hz)  
Figure 15.  
Figure 16.  
8
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TYPICAL CHARACTERISTICS (continued)  
At TA = 25°C, VS = ±15 V, unless otherwise noted.  
TOTAL HARMONIC DISTORTION + NOISE  
vs  
SMALL SIGNAL  
(G = 1, 10)  
FREQUENCY  
1
VO = 1 V r m s  
G = 1  
500kHz Measurement  
Bandwidth  
RL = 10kW  
G = 1  
20mV/div  
G = 10  
0.1  
G =100, RL = 100kW  
0.01  
G =10V/V  
RL = 100kW  
G =1, RL = 100kW  
Dashed Portion  
is noise limited.  
0.001  
100  
1k  
10k  
100k  
5ms/div  
Frequency (Hz)  
Figure 17.  
Figure 18.  
SMALL SIGNAL  
(G = 100, 1000)  
LARGE SIGNAL  
(G = 1, 10)  
G = 10 0  
20mV/div  
G = 10 0 0  
G = 1  
5V/div  
G = 10  
5ms/div  
20ms/div  
Figure 19.  
Figure 20.  
LARGE SIGNAL  
(G = 100, 1000)  
VOLTAGE NOISE 0.1 Hz TO 10 Hz  
INPUT-REFERRED, G 100  
G =100  
5V/div  
0.1mV/div  
G =1000  
20ms/div  
1s/div  
Figure 21.  
Figure 22.  
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APPLICATION INFORMATION  
Figure 23 shows the basic connections required for operation of the INA129. Applications with noisy or high  
impedance power supplies may require decoupling capacitors close to the device pins as shown.  
The output is referred to the output reference (Ref) terminal which is normally grounded. This must be a  
low-impedance connection to assure good common-mode rejection. A resistance of 8 Ω in series with the Ref pin  
will cause a typical device to degrade to approximately 80 dB CMR (G = 1).  
Setting the Gain  
Gain is set by connecting a single external resistor, RG, between pins 1 and 8.  
49.4 kW  
G = 1 +  
RG  
(1)  
Commonly used gains and resistor values are shown in Figure 23.  
The 49.9-kΩ term in Equation 1 comes from the sum of the two internal feedback resistors of A1 and A2. These  
on-chip metal film resistors are laser trimmed to accurate absolute values. The accuracy and temperature  
coefficient of these internal resistors are included in the gain accuracy and drift specifications of the INA129.  
The stability and temperature drift of the external gain setting resistor, RG, also affects gain. RG’s contribution to  
gain accuracy and drift can be directly inferred from Equation 1. Low resistor values required for high gain can  
make wiring resistance important. Sockets add to the wiring resistance which will contribute additional gain error  
(possibly an unstable gain error) in gains of approximately 100 or greater.  
V+  
0.1mF  
49.4kW  
RG  
G = 1 +  
7
2
1
Over Voltage  
Protection  
-
DESIRED  
GAIN (V/V)  
NEAREST  
1% RG (W)  
RG  
VIN  
(W)  
A1  
40kΩ  
40kΩ  
-
VO  
=
G · (VIN+ - VIN  
)
1
2
5
10  
20  
50  
100  
200  
500  
1000  
2000  
5000  
10000  
NC  
NC  
24.7kΩ  
49.4K  
12.35K  
5489  
2600  
1008  
499  
248  
99  
49.5  
24.7  
9.88  
4.94  
49.9K  
12.4K  
5.49K  
2.61K  
1K  
499  
249  
100  
49.9  
24.9  
9.76  
4.87  
6
5
A3  
RG  
+
8
24.74kΩ  
A2  
VO  
-
Load  
+
VIN  
3
Over Voltage  
Protection  
Ref  
40kΩ  
40kΩ  
4
0.1mF  
NC: No Connection  
-
IN  
V
V-  
Also drawn in simplified form:  
V
R
G
O
Ref  
+
IN  
V
Figure 23. Basic Connections  
Dynamic Performance  
Figure 1 shows that, despite its low quiescent current, the INA129 achieves wide bandwidth, even at high gain.  
This is due to the current-feedback topology of the input stage circuitry. Settling time also remains excellent at  
high gain.  
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Noise Performance  
The INA129 provides very low noise in most applications. Low frequency noise is approximately 0.2 μVPP  
measured from 0.1 Hz to 10 Hz (G 100). This provides dramatically improved noise when compared to  
state-of-the-art chopper-stabilized amplifiers.  
Offset Trimming  
The INA129 is laser trimmed for low offset voltage and offset voltage drift. Most applications require no external  
offset adjustment. Figure 24 shows an optional circuit for trimming the output offset voltage. The voltage applied  
to Ref terminal is summed with the output. The operational amplifier buffer provides low impedance at the Ref  
terminal to preserve good common-mode rejection.  
-
VIN  
V+  
VO  
RG  
INA129  
Ref  
100mA  
1/2 REF200  
+
VIN  
100W  
100W  
10kW  
OPA177  
±10mV  
Adjustment Range  
100mA  
1/2 REF200  
V-  
Figure 24. Optional Trimming of Output Offset Voltage  
Input Bias Current Return Path  
The input impedance of the INA129 is extremely high (approximately 1010 Ω). However, a path must be provided  
for the input bias current of both inputs. This input bias current is approximately ±2 nA. High input impedance  
means that this input bias current changes very little with varying input voltage.  
Input circuitry must provide a path for this input bias current for proper operation. Figure 25 shows various  
provisions for an input bias current path. Without a bias current path, the inputs will float to a potential which  
exceeds the common-mode range, and the input amplifiers will saturate.  
If the differential source resistance is low, the bias current return path can be connected to one input (see the  
thermocouple example in Figure 25). With higher source impedance, using two equal resistors provides a  
balanced input with possible advantages of lower input offset voltage due to bias current and better  
high-frequency common-mode rejection.  
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Microphone,  
Hydrophone  
etc.  
INA129  
47kW  
47kW  
Thermocouple  
INA129  
10kW  
INA129  
Center-tap provides  
bias current return.  
Figure 25. Providing an Input Common-Mode Current Path  
Input Common-Mode Range  
The linear input voltage range of the input circuitry of the INA129 is from approximately 1.4 V below the positive  
supply voltage to 1.7 V above the negative supply. As a differential input voltage causes the output voltage  
increase, however, the linear input range will be limited by the output voltage swing of amplifiers A1 and A2. So  
the linear common-mode input range is related to the output voltage of the complete amplifier. This behavior also  
depends on supply voltage (see Figure 5 and Figure 6).  
Input-overload can produce an output voltage that appears normal. For example, if an input overload condition  
drives both input amplifiers to their positive output swing limit, the difference voltage measured by the output  
amplifier will be near zero. The output of A3 will be near 0 V even though both inputs are overloaded.  
Low Voltage Operation  
The INA129 can be operated on power supplies as low as ±2.25 V. Performance remains excellent with power  
supplies ranging from ±2.25 V to ±18 V. Most parameters vary only slightly throughout this supply voltage range.  
Operation at very low supply voltage requires careful attention to assure that the input voltages remain within  
their linear range. Voltage swing requirements of internal nodes limit the input common-mode range with low  
power supply voltage. Figure 5 and Figure 6 show the range of linear operation for ±15 V, ±5 V, and ±2.5 V  
supplies.  
12  
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): INA129-EP  
INA129-EP  
www.ti.com  
SBOS508 DECEMBER 2009  
+5V  
-
2.5V ∆V  
VO  
RG  
INA129  
300W  
Ref  
2.5V + ∆V  
Figure 26. Bridge Amplifier  
-
VO  
VIN  
+
RG  
INA129  
Ref  
R1  
C
1
0.1mF  
1MW  
1
=
f
-3dB  
2pR1C1  
OPA130  
= 1.59 Hz  
Figure 27. AC-Coupled Instrumentation Amplifier  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Link(s): INA129-EP  
INA129-EP  
SBOS508 DECEMBER 2009  
www.ti.com  
V+  
10.0V  
6
REF102  
2
R1  
R2  
4
Pt100  
Cu  
Cu  
K
VO  
RG  
INA129  
Ref  
R3  
100Ω = Pt100 at 0°C  
SEEBECK  
COEFFICIENT  
(mV/°C)  
ISA  
TYPE  
R1, R2  
MATERIAL  
+Chromel  
-Constantan  
+Iron  
-Constantan  
+Chromel  
-Alumel  
58.5  
50.2  
39.4  
38  
66.5kW  
76.8kW  
97.6kW  
102kW  
E
J
K
T
+Copper  
-Constantan  
Figure 28. Thermocouple Amplifier With RTD Cold-Junction Compensation  
VIN  
-
IO  
=
R1  
· G  
R1  
VIN  
+
RG  
INA129  
Ref  
IB  
A1  
IO  
Load  
A
1
I
ERROR  
B
OPA177  
OPA131  
OPA602  
OPA128  
± 1.5 nA  
± 50 pA  
± 1 pA  
± 75 fA  
Figure 29. Differential Voltage to Current Converter  
14  
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): INA129-EP  
INA129-EP  
www.ti.com  
SBOS508 DECEMBER 2009  
RG = 5.6kW  
2.8kW  
G = 10  
VO  
LA  
RG/2  
INA129  
Ref  
RA  
2.8kW  
VG  
390kW  
VG  
1/2  
NOTE: Due to the INA129’s current-feedback  
OPA2131  
1/2  
10kW  
RL  
topology, V is approximately 0.7 V less than  
G
OPA2131  
the common-mode input voltage. This DC offset  
in this guard potential is satisfactory for many  
guarding applications.  
390kW  
Figure 30. ECG Amplifier With Right-Leg Drive  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Link(s): INA129-EP  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Oct-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
INA129MDREP  
V62/10605-01XE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
8
8
2500  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Request Free Samples  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Request Free Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF INA129-EP :  
Catalog: INA129  
NOTE: Qualified Version Definitions:  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Oct-2010  
Catalog - TI's standard catalog product  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
INA129MDREP  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
INA129MDREP  
D
8
2500  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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