VSP5000PMRG6 [TI]
SPECIALTY CONSUMER CIRCUIT, PQFP64, GREEN, PLASTIC, LQFP-64;型号: | VSP5000PMRG6 |
厂家: | TEXAS INSTRUMENTS |
描述: | SPECIALTY CONSUMER CIRCUIT, PQFP64, GREEN, PLASTIC, LQFP-64 商用集成电路 |
文件: | 总6页 (文件大小:563K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Not Recommended For New Designs
VSP5000
SLES057 – DECEMBER 2002
12-BIT 30 MSPS DUAL CHANNEL
CCD SIGNAL FRONT END FOR DIGITAL COPIER
FEATURES
APPLICATIONS
D
D
D
Copiers
D
D
D
Dual Channel CCD Signal Processing:
– Correlated Double Sampler (CDS)
– Sample Hold Mode
– Digital Programmable Amplifier
– CCD Offset Correction (OB loop)
Scanners
Facsimiles
DESCRIPTION
The VSP5000 device is a complete application specific
standard product (ASSP) for charge-coupled device
(CCD) line sensor applications such as copiers, scanners,
and facsimiles. The VSP5000 device provides two
independent channels of processing lines and performs
analog front-end processing and analog-to-digital (A/D)
conversion. Each channel has a correlated double
sampler (CDS)/sample hold (SH) circuit, a 14-bit
analog-to-digital converter (ADC), a digital programmable
gain amplifier (DPGA), and an optical black (OB)
correction loop. Data output is 12 bits in length and the
2-channel A/D data is multiplexed and output.
High Performance A/D:
– 12-Bit Resolution
– INL: ±2 LSB
– DNL: ±0.5 LSB
– No Missing Codes
High-Speed Operation
– Sample Rate: 30 MHz (Minimum)
D
D
78-dB Signal-To-Noise Ratio (at 0-dB Gain)
Low Power Consumption:
– Low Voltage: 3 V to 3.6 V
– Low Power: 290 mW (Typ) at 3.3 V
– Standby Mode: 20 mW (Typ)
The VSP5000 is available in a 64-lead LQFP package and
operates from a single 3.3-V supply.
Pleasebe aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2002, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
17-Apr-2014
PACKAGING INFORMATION
Orderable Device
VSP5000PM
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-25 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
NRND
LQFP
LQFP
PM
64
64
160
Green (RoHS
& no Sb/Br)
A42 SNBI
Level-1-260C-UNLIM
VSP5000
VSP5000
VSP5000PMG6
NRND
PM
160
Green (RoHS
& no Sb/Br)
A42 SNBI
Level-1-260C-UNLIM
-25 to 85
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Apr-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTQF008A – JANUARY 1995 – REVISED DECEMBER 1996
PM (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
M
0,08
33
48
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
0,25
12,20
SQ
0,05 MIN
0°–7°
11,80
1,45
1,35
0,75
0,45
Seating Plane
0,08
1,60 MAX
4040152/C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. May also be thermally enhanced plastic with leads connected to the die pads.
1
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