bq500410ARGZR [TI]
Free Positioning, Qi Compliant Wireless Power Transmitter Manager; 免费定位,戚符合无线电源发送器管理器型号: | bq500410ARGZR |
厂家: | TEXAS INSTRUMENTS |
描述: | Free Positioning, Qi Compliant Wireless Power Transmitter Manager |
文件: | 总30页 (文件大小:1100K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
bq500410A
www.ti.com
SLUSB96 – NOVEMBER 2012
Free Positioning, Qi Compliant Wireless Power Transmitter Manager
Check for Samples: bq500410A
1
FEATURES
DESCRIPTION
The bq500410A is a free-positioning digital wireless
power controller that integrates all functions required
to control wireless power transfer to a WPC compliant
receiver. It is WPC 1.1 ready and designed for 12-V
systems but applicable to other supply voltages. The
bq500410A pings the surrounding environment for
WPC compliant devices to be powered, safely
engages the device, reads the packet feedback from
the powered device, and manages the power
transfer. A charging area of at least 70 mm x 20 mm
provides flexible receiver placement on a transmitter
pad. The bq500410A supports both Parasitic Metal
Detection (PMOD) and Foreign Object Detection
(FOD) by continuously monitoring the efficiency of the
established power transfer, protecting from power lost
due to metal objects misplaced in the wireless power
transfer path. Should any abnormal condition develop
during power transfer, the bq500410A handles it and
provides fault indicator outputs. Comprehensive
protection features provide a robust design to protect
the system in all receiver placements.
•
Expanded Free Positioning Using Three Coil
Transmit Array
•
•
Intelligent Control of Wireless Power Transfer
Conforms to Wireless Power Consortium
(WPC) A6 Transmitter Specification
•
•
Digital Demodulation Reduces Components
WPC1.1 Ready, Including Foreign Object
Detection (FOD)
•
Enhanced Parasitic Metal Detection (PMOD)
Assures Safety
•
•
Over-Current Protection
LED Indication of Charging State and Fault
Status
APPLICATIONS
•
WPC 1.1 Ready Wireless Chargers for:
–
–
–
–
Smart Phones and other Handhelds
Hermetically Sealed Devices and Tools
Cars and Other Vehicles
The bq500410A is available in an area saving 48-pin,
7 mm x 7 mm QFN package and operates over a
temperature range from –40°C to 110°C.
Tabletop Charge Surfaces
•
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
Functional Diagram and Efficiency Versus System Output Current
80
70
60
50
40
30
20
Transmitter
Receiver
Power
Power
Stage
Voltage
Conditioning
AC-DC
Rectification
Load
Communication
BQ500410A
Controller
Feedback
bq51k
0
1
2
3
4
5
Output Power (W)
G000
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
bq500410A
SLUSB96 – NOVEMBER 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION(1)
OPERATING
TEMPERATURE
RANGE, TA
TOP-SIDE
MARKING
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
bq500410ARGZR
bq500410ARGZT
48 pin
48 pin
Reel of 2500
Reel of 250
QFN
QFN
bq500410A
bq500410A
-40°C to 110°C
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN
–0.3
–0.3
–0.3
–40
MAX
3.6
Voltage applied at V33D to DGND
Voltage applied at V33A to AGND
3.6
V
(2)
Voltage applied to any pin
3.6
Storage temperature, TSTG
150
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.
2
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
3.0
NOM
MAX
3.6
UNIT
V
Supply voltage during operation, V33D, V33A
Operating free-air temperature range
Junction temperature
3.3
V
TA
TJ
–40
110
110
°C
UNITS
°C/W
THERMAL INFORMATION
bq500410A
RGZ
48 PINS
27.1
THERMAL METRIC(1)
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
θJCtop
θJB
12.9
4.3
ψJT
0.2
ψJB
4.3
θJCbot
0.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
UNIT
SUPPLY CURRENT
IV33A
V33A = 3.3 V
8
42
52
15
55
60
IV33D
ITotal
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
Supply current
V33D = 3.3 V
mA
V33D = V33A = 3.3 V
V33
3.3-V linear regulator
Emitter of NPN transistor
3.25
40
3.3
4
3.6
4.6
V
V33FB
IV33FB
Beta
3.3-V linear regulator feedback
Series pass base drive
Series NPN pass device
VIN = 12 V; current into V33FB pin
10
mA
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
V33A
Digital 3.3-V power
Analog 3.3-V power
TA = 25°C
TA = 25°C
3
3
3.6
3.6
V
3.3-V slew rate between 2.3 V and 2.9 V,
V33A = V33D
V33Slew
3.3-V slew rate
0.25
V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B-
VCM
Common mode voltage each pin
–0.15
1.631
V
COMM+,
COMM-
Modulation voltage digital resolution
1
mV
REA
Input Impedance
Ground reference
0.5
–5
1.5
3
5
MΩ
IOFFSET
Input offset current
1-kΩ source impedance
µA
ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN
VADC_SHORT
VADC_RANGE
INL
Voltage indicating open pin
Voltage indicating pin shorted to GND
Measurement range for voltage monitoring
ADC integral nonlinearity
Input leakage current
LED_MODE, LOSS_THR open
LED_MODE, LOSS_THR shorted to ground
ALL ANALOG INPUTS
2.37
0.36
2.5
V
0
-2.5
2.5
mV
nA
Ilkg
3 V applied to pin
Ground reference
100
RIN
Input impedance
8
MΩ
pF
CIN
Input capacitance
10
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
VOH
Low-level output voltage
IOL = 6 mA , V33D = 3 V
IOH = -6 mA , V33D = 3 V
V33D
- 0.6 V
High-level output voltage
V
VIH
High-level input voltage
Low-level input voltage
Output high source current
Output low sink current
V33D = 3 V
2.1
3.6
1.4
4
VIL
V33D = 3.5 V
IOH(MAX)
IOL(MAX)
mA
4
SYSTEM PERFORMANCE
VRESET
tRESET
fSW
Voltage where device comes out of reset
V33D Pin
2.3
2
2.4
V
Pulse width needed for reset
Switching Frequency
RESET pin
µs
112
205
0.5
kHz
Time to detect presence of device requesting
power
tdetect
s
4
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SLUSB96 – NOVEMBER 2012
DEVICE INFORMATION
Functional Block Diagram
7
8
9
MSP_RST/LED1
bq500410A
LED Control /
Low Power
MSP_MISO/LED2
MSP_TEST
Supervisor
Interface
COMM_A+ 37
COMM_A- 38
COMM_B+ 39
COMM_B- 40
14 MSP_SYNC
18 MSP_CLK
Digital
Demodulation
25 MSP_MOSI/LPWR_EN
26 MSP_RDY
12 DPWM_A
15 Coil 1.1
16 Coil 1.2
17 Coil 1.3
FOD
6
PWM/
Coil_Select
Controller
PMOD 13
V_IN 46
V_SENSE 45
I_SENSE 42
12-Bit
ADC
23 BUZ_AC
24 BUZ_DC
Buzzer
Control
T_SENSE
2
1
COIL_PEAK
LOSS_THR 43
LED_MODE 44
Power
Control
11 PMB_DATA
10 PMB_CLK
I2C
TEMP_INT
5
RESET
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48-Pin RGZ (QFN) Package
(Top View)
36
GND
COIL_PEAK
1
35 BPCAP
T_SENSE
AD03
2
3
34
V33A
33 V33D
AD08
RESET
4
5
32
GND
31
RESERVED
RESERVED
29 RESERVED
FOD
6
bq500410A
30
MSP_RST/LED1
MSP_MISO/LED2
MSP_TEST
7
8
RESERVED
28
27
26
25
9
PMB_CLK
10
RESERVED
EPAD
49
PMB_DATA 11
DPWM_A
MSP_RDY
12
MSP_MOSI/LPWR_EN
6
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SLUSB96 – NOVEMBER 2012
Table 1. bq500410A Pin Description
PIN
NAME
I/O
DESCRIPTION
NO.
1
2
COIL_PEAK
T_SENSE
I
I
Input from peak detect circuit
Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply
connecting to 3.3-V supply
3
AD03
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding
I
4
5
6
AD08
RESET
FOD
I
I
Reserved. Connect to 3.3-V supply
Device reset. Use 10-kΩ to 100-kΩ pull-up resistor to 3.3-V supply
FOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the FOD threshold resistor read at startup.
O
7
8
MSP_RST/LED1
MSP_MISO/LED2
A dual function pin. MSP – RST provides serial communication to the external supervisor.
LED1 -- If external MSP430 is not used, connect to a (green) LED via 470-Ω resistor for
status indication. Grounding pin 25 determines this pin's function.
I
A dual function pin. MSP – MISO provided serial communication to the external supervisor.
LED2 -- If external MSP430 is not used, connect to a (red) LED via 470-Ω resistor for status
indication. Grounding pin 25 determines this pin's function.
I
9
MSP_TEST
PMB_CLK
PMB_DATA
DPWM_A
PMOD
I
MSP – Test, If external MSP430 is not used, leave this pin open
10
11
12
13
I/O
I/O
O
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.
10-kΩ pull-up resistor to 3.3-V supply. I2C/PMBus is for factory use only.
PWM Output to half bridge driver. Switching dead times must be externally generated.
PMOD read pin. Leave open unless PMOD and FOD thresholds need to be different. It
controls the PMOD threshold resistor read at startup.
O
14
15
16
17
18
19
20
21
22
23
24
MSP_SYNC
COIL 1.1
O
O
O
O
I/O
O
I
MSP SPI_SYNC, If external MSP430 is not used, leave this pin open
Enables the first coil drive train and COMM signal selector
Enables the second coil drive train and COMM signal selector
Enables the third coil drive train and COMM signal selector
MSP430 JTAG_CLK, SPI_CLK. Used for boot loading the MSP430 supervisor
Reserved, leave this pin open.
COIL 1.2
COIL 1.3
MSP_CLK
RESERVED
RESERVED
DOUT_TX
DOUT_RX
BUZ_AC
Reserved, connect to GND.
I
Reserved, leave this pin open
I
Reserved, leave this pin open
O
AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins
BUZ_DC
DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected
to an LED via 470-Ω resistor.
O
25
MSP_MOSI/LPWR_EN
MSP-TDI, SPI-MOSI, Low Standby Power Supervisor Enable. Connect to GND if separate
MSP430 low power supervisor is not used.
I/O
26
27
28
29
30
31
MSP_RDY
I/O
I/O
I/O
I/O
I/O
I/O
MSP_RDY, MSP430 Programmed Indication
Reserved, leave this pin open
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
Reserved, leave this pin open
Reserved, leave this pin open
Reserved, leave this pin open
Reserved, connect 10-kΩ pull-down resistor to GND. Do not leave open.
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Table 1. bq500410A Pin Description (continued)
PIN
I/O
DESCRIPTION
NO.
32
NAME
GND
—
—
GND
33
V33D
Digital Core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
34
V33A
—
Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor
and additional bypass capacitors
35
36
37
38
39
40
41
42
BPCAP
GND
—
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND
GND
—
COMM_A+
COMM_A-
COMM_B+
COMM_B-
RESERVED
I_SENSE
I
I
I
I
I
I
Digital demodulation noninverting input A, connect parallel to input B+
Digital demodulation inverting input A, connect parallel to input B-
Digital demodulation noninverting input B, connect parallel to input A+
Digital demodulation inverting input B, connect parallel to input A-
Reserved, leave this pin open
Transmitter input current, used for parasitic loss calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amp
43
44
45
LOSS_THR
LED_MODE
V_SENSE
I
I
I
Input to program foreign metal object detection (FOD) threshold
LED Mode Select
Transmitter power train input voltage, used for FOD and Loss calculations. Voltage sample
point should be after current input sense resistor. Use 76.8-kΩ to 10-kΩ divider to minimize
quiescent loss.
46
47
48
49
V_IN
I
System input voltage selector. Connect this input to GND for 12-V operation.
GND
GND
—
I
ADCREF
EPAD
External reference voltage input. Connect this input to GND.
Flood with copper GND plane and stitch vias to PCB internal GND plane
—
8
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Principles of Operation
Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of a transmitter and
receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and
electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs once the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage and current flows. The secondary
voltage is rectified, and power can be transferred effectively to a load, wirelessly. Power transfer can be
managed via any of various familiar closed-loop control schemes.
Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
Standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, or to download a copy of the WPC specification, go to http://www.wirelesspowerconsortium.com/.
Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils is, the better the coupling. However, the practical distance is set to be
less than 5 mm, as defined within the WPC Specification, to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC
compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed.
Power transfer is thus regulated by changing the frequency along the resonance curve from 112 kHz to 205 kHz,
(that is the higher the frequency is, the lower the power). Duty cycle remains constant at 50% throughout the
power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimensions, materials of the coils and information regarding the tuning of the
coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
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Principles of Operation (continued)
Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side
electronics and the frequency of its coil-drive output is adjusted to close the regulation loop. The bq500410A
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the
resistive modulation approach, where a resistor is periodically added to the load, Figure 2 shows the resulting
amplitude change in the transmitter voltage. Figure 2 shows the capacitive modulation approach, where a
capacitor is periodically added to the load and the resulting amplitude change in the transmitter voltage.
Rectifier
Receiver
Capacitor
Amax
Receiver Coil
Modulation
Resitor
Operating state at logic “0”
Operating state at logic “1”
A(0)
A(1)
Comm
Fsw
F, kHz
a)
b)
Figure 1. Receiver Resistive Modulation Circuit
Rectifier
Receiver
Capacitor
Receiver Coil
Amax
Modulation
Capacitors
Operating state at logic “ 0”
Operating state at logic “ 1”
A(0)
A(1)
Comm
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 2. Receiver Capacitive Modulation Circuit
10
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The bq500410A
Description of Operation
The bq500410A pings the surroundings in 400-ms intervals by sequentially firing the three coils in the array. The
COMM feedback signal is multiplexed through analog switches and is synchronized to the coil being driven. To
select the best coil match, the bq500410A looks for the strongest COMM signal. The coil is engaged and driven,
note that only one coil is driven at a time. The driven coil is tolerant of slight misalignment of the RX while power
is being transferred. Actually displacing the RX to an adjacent coil while charging is allowable, the sequential
ping sequence and detection to determine the best matching coil to drive continues to repeat.
Capacitor Selection
Capacitor selection is critical to proper system operation. The total capacitance value of 2 nF x 68 nF (+5.6-nF
center coil) is required in the resonant tank. This is the WPC system compatibility requirement, not a guideline.
NOTE
A total capacitance value of 2 nF x 68 nF/100 V (68 nF + 5.6 nF center coil) (C0G
dielectric type) is required in the resonant tank to achieve the correct resonance
frequency.
The capacitors chosen must be rated for at least 100 V and must be of a high quality C0G dielectric (sometimes
also called NP0). These are typically available in a 5% tolerance, which is adequate. The use of X7R types or
below is not recommended if WPC compliance is required because critical WPC Certification Testing, such as
the minimum modulation or ensured power requirements, might fail.
The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work
depending on market availability. All capacitors must be of C0G types, not mixed with any other dielectric types.
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A6 Coil Specification
The coil and matching capacitor specification for the A6 transmitter has been established by WPC Standard. This
is fixed and cannot be changed on the transmitter side.
The bq500410A is primarily intended to drive a 3 coil array but it can also be used to drive a single coil. For
single coil operation the two outer coils and associated electronics are simply omitted. Please refer to the
application schematic at the end of this datasheet (See Figure 6).
Doo
Dol
Dil
Doe
Figure 3. Coil Specification Drawing
Table 2. Coil Specification
PARAMETER
Outer length
Inner length
Outer width
Inner width
SYMBOL
Dol
SPECIFICATION
53.2, (±0.5)
27.5, (±0.5)
45.2, (±0.5)
19.5, (±0.5)
1.5, (±0.5)
12
UNIT
Dil
Dow
Diw
Dc
mm
Thickness
Turns
N
Turns
mm
Layers
-
1
Odd displacement
Even displacement
Doo
Doe
49.2, (±4)
24.6, (±2)
NOTE
The performance of an A6 transmitter can vary based on the design of the A6 coil set. For
best performance with small receiver coils under heavy loading, it is best to design the coil
set such that the Doo dimension is on the low end of the specified tolerance.
For a current list of coil vendors please see:
•
bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649
12
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Option Select Pins
Two pins (pin 43 and pin 44) on the bq500410A are allocated to program the Loss Threshold and the LED mode
of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. The values of the operating
parameters set by these pins are determined using Table 4. For LED_MODE, the selected bin determines the
LED behavior based on Table 3; for the LOSS_THR, the selected bin sets a threshold used for parasitic metal
object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD) section).
bq500410A
LED_MODE
44
Resistors
LOSS_THR
43
to set
To 12-bit ADC
options
Figure 4. Option Programming
LED Modes
The bq500410A can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.
The selection resistor connected between pin 44 and GND selects one of the desired LED indication schemes
presented in Table 3.
Table 3. LED Modes
OPERATIONAL STATES
LED
LED
CONTROL
OPTION
SELECTION
RESISTOR
DESCRIPTION
LED
POWER
TRANSFER
CHARGE
COMPLETE
PMOD or FOD
WARNING
STANDBY
FAULT
0
1
<36.5 kΩ
42.2 kΩ
LEDs off
LED1, Green
LED2, Red
LED1, Green
LED2, Red
LED1, Green
LED2 Red
Off
Off
On
On
Off
Off
Off
Off
Blink slow(1)
On
Off
On
Off
On
Off
Off
Off
Off
On
Off
Blink fast(2)
Off
Generic
Off
Blink slow(1)
Off
2
3
4
48.7 kΩ
56.2 kΩ
Generic + standby
Generic Opt 1
Off
Off
On
On
Off
On
Blink fast(2)
Off
Off
Blink fast(2)
On
LED1, Green
LED2 Red
Off
Off
64.9 kΩ
> 75 kΩ
Generic Opt 2
Reserved
On
Blink fast(2)
(1) Blink slow = 0.625 Hz
(2) Blink fast = 2.5 Hz
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Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
The bq500410A is WPC1.1 ready and supports both enhanced PMOD and FOD features by continuously
monitoring the input voltage and current to calculate input power. Combining input power, known losses, and the
value of power reported by the RX device being charged, the bq500410A can estimate how much power is
unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this
unexpected loss exceeds the threshold set by the LOSS_THR resistor, a fault is indicated and power transfer is
halted. Whether the PMOD or the FOD algorithm is used is determined by the ID packet of the receiver being
charged.
PMOD has certain inherent weaknesses as rectified power is not ensured to be accurate per WPC1.0
Specification. The user has the flexibility to adjust the LOSS_THR resistor or to disable PMOD by leaving pin 43
open should issues with compliance or interoperability arise.
The FOD algorithm uses information from an in-system characterized and WPC1.1 certified RX and it is therefore
more accurate. Where the WPC1.0 specification requires merely the Rectified Power packet, the WPC1.1
specification additionally uses the Received Power packet which more accurately tracks power used by the
receiver.
As default, PMOD and FOD share the same LOSS_THR setting resistor for which the recommended starting
point is 400 mW (selected by a 56.2-kΩ resistor on the LOSS_THR option pin 43). If, for some reason, the
application requires disabling one or the other or setting separate PMOD and FOD thresholds, Figure 5 can be
used.
Resistor R39 sets the FOD threshold and R24 sets the PMOD threshold in this configuration. The control lines
(FOD and PMOD) are driven briefly at power-up when the resistor values are read.
To selectively disable PMOD support, R24 and Q8-B should be omitted from the above design.
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Table 4. Option Select Bins
LOSS THRESHOLD
BIN NUMBER
RESISTANCE (kΩ)
(mW)
0
1
<36.5
42.2
48.7
56.2
64.9
75.0
86.6
100
250
300
2
350
3
400
4
450
5
500
6
550
7
600
8
115
650
9
133
700
10
11
12
13
154
750
800
178
205
850
>237
Feature Disabled
SEE_NOTE
SEE_NOTE
R22
R39
R24
Q8-A
Q8-B
AGND
FOD
PMOD
Figure 5. LOSS_THR Connection Circuits
NOTE
Either one of these circuits is connected to LOSS_THR, but not both.
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Shut Down by Thermal Sensor or Trigger
Typical applications of the bq500410A does not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1.0-V
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shut down.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500410A device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1. Consult the NTC datasheet and find the resistence vs temperature curve.
2. Determine the actual temperature where the NTC will be placed by using a thermal probe.
3. Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4. Use the following formula to determine the upper leg resistor (R_Setpoint):
R _Setpoint = 2.3´R _NTC
(1)
The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature
is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
Fault Handling and Indication
The following is a table of End Power Transfer (EPT) packet responses, fault conditions, the duration how long
the condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the
condition or fault.
Table 5. Fault Handling and Indication
DURATION
CONDITION
HANDLING
(before retry)
Immediate
5 seconds
Infinite
EPT-00
EPT-01
Unknown
Charge complete
Internal fault
EPT-02
EPT-03
5 minutes
Immediate
Immediate
Infinite
Over temperature
Over voltage
EPT-04
EPT-05
Over current
EPT-06
Battery failure
Reconfiguration
No response
EPT-07
Not applicable
Immediate
Immediate
1 minute
EPT-08
OVP (over voltage)
OC (over current)
NTC (external sensor)
5 minutes
10 seconds LED only,
2 seconds LED +
buzzer
PMOD/FOD warning
PMOD/FOD
12 seconds
5 minutes
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Power Transfer Start Signal
The bq500410A features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. Do not exceed 4 mA loading from either of these pins which is more than adequate for small
signaling and actuation. If not used, these pins should be left open.
Power-On Reset
The bq500410A has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
External Reset, RESET Pin
The bq500410A can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
Trickle Charge and CS100
CS100 is supported. If CS100 is reported by the RX, the bq500410A indicates that charge is complete.
The WPC specification provides an End-of-Power Transfer message (EPT) to indicate charge complete. Upon
receipt of the charge complete message, the bq500410A changes the LED indication to solid green LED output
and halt power transfer for 5 seconds. Subsequently, transmitters pings the receiver again to see if its status has
changed, assuming it receives another EPT, the LED mode stays the same.
The WPC specification also provides reporting of the level of battery charge (Charge Status). In some battery
charging applications there is a benefit to continue the charging process in trickle-charge mode to top off the
battery. The bq500410A changes the LED indication to reflect charge complete when a 'Charge Status 100%'
message is received, but unlike the response to an EPT message, it does not halt power transfer while the LED
is solid green. The RX, the mobile device being charged, uses a CS100 packet to enable trickle charge mode.
Current Monitoring Requirements
The bq500410A is WPC1.1 ready. In order to enable the PMOD or FOD features, current monitoring must be
provided in the design.
Current monitoring is optional however, it is used for the foreign metal protection features and over current
protection. The system designer can choose not to include the current monitor and remain WPC1.0 compliant.
Alternately, the additional current monitoring circuitry can be added to the hardware design but not loaded. This
would enable a forward migration path to future WPC1.1 compatibility.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. The current sense resistor has a temperature
stability of ±200 PPM. Proper current sensing techniques in the application hardware should also be observed.
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Over-Current Protection
The bq500410A has an integrated current protection feature which monitors the input current reported by the
current sense resistor and amplifier. If the input current exceeds a safety threshold, a fault is indicated and power
transfer is halted for one minute.
If this feature is desired, the sense resistor and amplifier are required. If this feature is not desired, the I_SENSE
input pin to the bq500410A (pin 42) should be grounded.
NOTE
Always terminate the I_SENSE pin (pin 42), either with the output of a current monitor
circuit or by connecting to ground.
MSP430G2101 Low Power Supervisor
This is an optional low-power feature. By adding the MSP430G2101, as recommended in the bq500410A
application schematic, the bq500410A device is periodically shut down to conserve power, yet all relevant states
are recalled and all running LED status indicators remain active.
Since the bq500410A needs an external low-power mode to significantly reduce power consumption, the most
direct way to reduce power is to remove its supply and completely shut it down. In doing so, however, the
bq500410A goes through a reset and any data in memory would be lost. Important information regarding charge
state, fault condition, operating mode and indicator pins driven would be cleared.
The MSP430G2101, in its role as a low-power supervisor, is used to provide accurate 'ping' timing, retains
charge state, operating mode, fault condition and all relevant operation states. The LEDs are now driven and
controlled by the MSP430, not the bq500410A, which directly drives and maintains the LED status indication
during the bq500410A reset periods. Since the LED indicators are now driven by the MSP430G2101, care
should be taken not to exceed the pin output current drive limit.
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected
making it possible to achieve Energy Star rating.
The user does not need to program the MSP430G2101, an off-the-shelf part can be used. The required
MSP430G2101 firmware is embedded in the bq500410A and is boot loaded at first power up, similar to a field
update. The MSP430G2101 code cannot be modified by the user.
NOTE
The user cannot program the MSP430G2101 in this system.
All Unused Pins
All unused pins can be left open unless otherwise indicated. Please refer to Table 1. Grounding of unused pins, if
it is an option, can improve PCB layout.
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APPLICATION INFORMATION
Overview
The application schematic for the transmitter with reduced standby power is shown in Figure 7.
CAUTION
Please check the bq500410A product page for the most up-to-date schematic and list
of materials reference design package before starting a new project.
Input Regulator
The bq500410A requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down
from the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements
with respect to cost or efficiency.
The application example circuit utilizes a low-cost buck regulator, TPS54231.
Power Trains
The bq500410A drives three independent half bridges. Each half bridge drives one coil from the coil set
assembly. The TPS28225 is the recommended driver device for this application. It features high-side drive
capability which enables the use of N-channel MOSFETs throughout. Gate-drive supply can be derived from a
primitive active voltage divider. A highly regulated supply is not required to drive MOSFET gates.
Signal Processing Components
The COMM signal used to control power transfer is derived from the coil voltage. Each coil has its own signal
processing chain. The coil voltage is AC coupled and divided down to a manageable level and biased to a 1-V
offset. Series connected diodes are provided for protection from any possible transients. The three signal
processing chains are then multiplexed together via analog switches. Thus, the correct signal processing chain
and COMM signal used to control power transfer is from the coil being driven.
Low-Power Supervisor
Power reduction is achieved by periodically disabling the bq500410A while LED and housekeeping control
functions are continued by U4, the low-cost, low quiescent current micro controller MSP430G2101. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500410A pin 25), the bq500410A at first power-up
boots the MSP430G2101 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500410A periodically issues SLEEP command, Q1 pulls the supply to the bq500410A, therefore
eliminating its power consumption. Meanwhile, the MSP430G2101 maintains the LED indication and stores
previous charge state during this bq500410A reset period. This bq500410A off period is set by the
MSP430G2101. WPC compliance mandates the power transmitter controller, bq500410A, awakes every 400 ms
to produce an analog ping and check if a valid device is present. This time constant can not be altered to further
reduce power.
Disabling Low-Power Supervisor Mode
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for an application schematic
example.
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Input Power Requirements
For full wireless power system capability and WPC compliance, the AC power adapter selected for the
application should have a minimum rating of 12 V at 750 mA.
PCB Layout
Careful PCB layout practice is critical to proper system operation. There are many references on proper PCB
layout techniques. A few good tips are repeated here:
The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be
achieved though not as easily. Ideally, the approach to the layer stack-up has been:
•
•
•
•
Layer 1 component placement and as much ground plane as possible.
Layer 2 clean ground.
Layer 3 finish routing.
Layer 4 clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500410A GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500410A. A good GND reference is necessary for proper bq500410A operation,
such as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only ONE tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds!
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
The DC-to-DC buck regulator used from the 12-V input supplies the bq500410A with 3.3 V. Typically a single-
chip controller solution with integrated power FET and synchronous rectifier or outboard diode is used. Pull in the
buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, full-bridge
components should be pulled together as tight as possible. See the bq500410A EVM for an example of a good
layout technique.
References
1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/
2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant
Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401)
3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number
SLUSAL8)
4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas
Instruments Literature Number SLVSAT9)
5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635)
6. Application Note, bqTESLA Transmitter Coil Vendors, Texas Instruments Literature Number SLUA649
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bq500410A Single, Low-Power and Low-Cost Schematics
F
6 1 P T
5 1 P T
-
N I
T U O
+ N I
A 3 3 V
D A P E
9 4
D N G
2 3
4 3
3 3
D N G
6 3
D N G
7 4
D 3 3 V
D R B _ N I V
C C V _ 3 V 3
U T S A T S
T O I L P
Figure 6. bq500410A Single Coil Application Diagram
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F
0 . 0 1
F
0 . 0 1
F
0 . 0 1
2 7 R
0 8 R
6 8 R
0 . 0 1
0 . 0 1
0 . 0 1
2 R
3 7 R
1 8 R
-
N I
T U O
+ N I
A 3 3 V
D 3 3 V
D A P E
4 3
3 3
9 4
2 3
6 3
7 4
D N G
D N G
D N G
D R B _ N I V
C C V _ 3 V 3
U T S A T S
T O I L P
Figure 7. bq500410A Low-Power Application Diagram
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F
0 . 0 1
F
0 . 0 1
F
0 . 0 1
2 7 R
0 8 R
6 8 R
0 . 0 1
0 . 0 1
0 . 0 1
2 R
3 7 R
1 8 R
A 3 3 V
D 3 3 V
D A P E
D N G
D N G
D N G
4 3
3 3
9 4
2 3
6 3
7 4
U T S A T S
C C V
N I - V 2 1
C C V
Figure 8. bq500410A Low-Cost Application Diagram
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Nov-2012
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Samples
Drawing
(1)
(2)
(3)
(Requires Login)
BQ500410ARGZR
ACTIVE
VQFN
VQFN
RGZ
48
48
2500
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
BQ500410ARGZT
ACTIVE
RGZ
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ500410ARGZR
BQ500410ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
330.0
180.0
16.4
16.4
7.3
7.3
7.3
7.3
1.5
1.5
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
BQ500410ARGZR
BQ500410ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
367.0
210.0
367.0
185.0
38.0
35.0
Pack Materials-Page 2
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