XC612N3619DR [TOREX]

Power Management Circuit;


型号：	XC612N3619DR
厂家：	Torex Semiconductor
描述：	Power Management Circuit 光电二极管
文件：	总15页 (文件大小：536K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC612Series

ETR0204_002

2-Channel Voltage Detectors

■GENERAL DESCRIPTION

The XC612 series consist of 2 voltage detectors, in 1 mini-molded, SOT-25 package.

The series provides accuracy and low power consumption through CMOS processing and laser trimming and consists of a

highly accurate voltage reference source, 2 comparators, hysteresis and output driver circuits.

The input (VIN1) for voltage detector 1 (VD1) dually functions as the power supply pin for both detector 1 (VD1) and detector 2

(VD2).

■APPLICATIONS

■FEATURES

Detect voltage accuracy

Low Power Consumption

±2%

2.0μA(TYP.)

(VIN1=VIN2=2.0V, Static state)

●Microprocessor reset circuitry

●Memory battery back-up circuits

●Power-on reset circuits

Detect Voltage

: 1.5V ~ 5.0V programmable in

100mV steps. Detector’s voltages can

be set-up independently

●Power failure detection

●System battery life and charge voltage monitors

●Delay circuitry

Conditionaly;

XC612N : VDET1>VDET2

XC612D, XC612E : VDET1 VDET2,

VDET1<VDET2

Operating Voltage Range : 1.5V ~ 10.0V

Temperature Characteristics

Output Configuration

Operating Ambient Temperature

Packages

100ppm/

℃ (TYP.)

: N-channel open drain,CMOS

: SOT-25, USP-6B

-40℃~＋85℃

Environmentally Friendly : EU RoHS Compliant, Pb Free

■TYPICAL APPLICATION CRICUIT

■TYPICAL PERFORMANCE

CHARACTERISTICS

1/15

XC612 Series

■PIN CONFIGURATION

●SOT-25

●USP-6B

VSS

VIN1

VIN2

* The dissipation pad for the USP-6B package should be

VDET2

V^DET1solder-plated in recommended mount pattern and metal

masking to enhance mounting strength and heat release. If the

pad needs to be connected to other pins, it should be connected

to the V^INlevel.

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTION

SOT-25

USP-6B

V_DET1

V_IN1

Voltage Detector 1 Output

Detector 1 Input, Power Supply

Ground

V_SS

V_IN2

Voltage Detector 2 Input

Voltage Detector 2 Output

V_DET2

No Connect

■PRODUCT CLASSIFICATION

●Selection Guide

TYPE

VDET1

VDET2

XC612N

N-ch Open Drain

XC612D

XC612E

N-ch Open Drain

CMOS

N-ch Open Drain

●Ordering Information

XC612①②③④⑤⑥⑦

DESIGNATOR

ITEM

Type

SYMBOL

DESCRIPTION

①

Refer to selection guide

Detect voltage

(V_DET1

Detect Voltage

(V_DET2

②③

④⑤

15～50

V_DET1e.g. 2.5V→②2, ③5

V_DET2e.g. 3.3V→②3, ③3

)

MR-G

SOT-25(3,000/Reel)

USP-6B(3,000/Reel)

Packages

⑥⑦-⑧

(Order Unit)

DR-G

^(*1)The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.

2/15

XC612

Series

■BLOCK DIAGRAMS

XC612N Series

XC612D Series

XC612E Series

3/15

XC612 Series

■ABSOLUTE MAXIMUM RATINGS

Ta = 25℃

PARAMETER

SYMBOL

V_IN1

RATINGS

V_SS-0.3～V_SS+12

V_SS-0.3～V_IN1+0.3

V_SS-0.3～V_SS+12

V_SS-0.3～V_IN1+0.3≦V_SS+12

V_SS-0.3～V_SS+12

V_SS-0.3～V_IN1+0.3≦V_SS+12

UNITS

V_IN1

V_IN2

Input Voltage

V_IN2

V_IN2D/E

V_DET1(Nch open drain

V_DET_１(CMOS)

V_DET2(Nch open drain

V_DET2(CMOS)

V_ＤＥＴ１

)

V_DET1

V_DET2

I_DET1

Output Voltage

Output Current

V_DET2

I_DET2

SOT-25

250

120

Power

Dissipation

USP-6B

Operating Ambient Temperature

Storage Temperature

Topr

Tstg

-40～+85

-55～+125

℃

4/15

XC612

Series

■ELECTRICAL CHARACTERISTICS

Ta=25℃

PARAMETER

SYMBOL

V_DF1

CONDITIONS

MIN.

TYP.

MAX. UNITS CIRCUITS

Detect Voltage

(VDET1)

Voltage when VDET1 changes from

H to L following a reduction of VIN1

V_DF1(T)

x 0.98

V_DF1(T)

①

x 1.02

Detect Voltage

(VDET2)

Voltage when VDET2 changes from

H to L following a reduction of VIN2

V_DF2(T)

x 0.98

V_DF2(T)

x 1.02

V_DF2

V_HYS1

V_HYS2

V_DF2(T)

V_DF1

Voltage (VDR1) - VDF1 when VDET1 changes

from L to H following an increase of VIN1

V_DF1

Hysteresis Range 1

Hysteresis Range 2

①

x 0.02 x 0.05 x 0.08

Voltage (V_DR2) - V_DF2when V_DET2changes

from L to H following an increase of V_IN2

V_DF2

x 0.02 x 0.05 x 0.08

V_IN1= 1.5V

=2.0V

1.35

1.50

1.95

2.40

3.00

0.45

0.50

0.65

0.80

1.00

3.90

4.50

5.10

5.70

6.30

1.30

1.50

1.70

1.90

2.10

Supply Current

(VIN1 Input

Current)

I_SS

V_IN=V_IN1

μA

②

=3.0V

=4.0V

=5.0V

V_IN2= 1.5V

=2.0V

VIN2 Input Current

Operating Voltage

I_IN2

V_IN=V_IN1=V_IN2

μA

②

=3.0V

=4.0V

=5.0V

V_IN1

V_DF(T)= 1.5V to 5.0V

1.0

0.3

3.0

5.0

6.0

7.0

V_IN1=1.0V

=2.0V

2.2

7.7

N-ch,V_DS=0.5V

=3.0V

10.1

11.5

13.0

Output Current ^(*1)

I_DET

③

=4.0V

=5.0V

P-ch (CMOS)

V_DS=-2.1V

=8.0V

-10.0

±100

-2.0

ΔV_DF

(ΔTopr･

V_DF

Temperature

-40℃ ≦ Topr ≦ 85℃

ppm/℃

①

④

Characteristics ^(*1)

)

Delay Time ^(*1)

(Release Voltage

→

t_DLY

(V_DR→ V_DETinversion)

0.2

Output inversion)

^(*1)The Features of output current, temperature characteristics and delay time are common between V_DET1and V_DET2

Note:

VDF1(T), VDF2(T) : Nominal detect voltage.

Release voltage (VDR) = VDF +VHYS

N type Input Voltage : please ensure that VIN1 > VIN2

(Input voltage of XC612D and XC612E series : please ensure that VIN1 VIN2, VIN1 < VIN2.)

VIN1 pin serve both ISS and power supply pin so that VIN2 operates VIN1 as a power supply source. For normal operation of VIN2,

operating voltage higher than the minimum is needed to be applied to power supply pin VIN1.

For CMOS output products, high level output voltage which is generated when the transient response is released becomes input

voltage of VIN.

5/15

XC612 Series

■OPERATONAL EXPLANATION

●Timing Chart (Pull up voltage =Input voltage VIN1)

入力電圧 (V

）

)

IN1

Input Voltage(V_IN1

解除電圧 (V_DR1

Release Voltage(V_DR1

検出電圧 (V_DF1

Detect Voltage(V_DF1

)

⑥

)

最低動作電圧 (V

Ground Voltage(V

グランド電位 (V_SS

)

Min. Operating_MV_INoltage(V_MIN

)

入力電圧 (V

解除電圧 (V_DR2

）

)

IN2

Input Voltage(V_IN2

)

Release Voltage(V_DR2

)

検出電圧 (V_DF2

)

Detect Voltage(V_DF2

)

最低動作電圧 (V_MIN

)

Min. Operating Voltage(V_MIN

)

グランド電位 (V_SS

Ground Voltage(V_SS

)

出O力ut電pu圧t V(oVltage)(V_DET1

)

DET1

最低動作電圧 (V_MIN

)

Min. Operating Voltage(V_MIN

グランド電位 (V_SS

Ground Voltage(V_SS

)

出力電圧 (V_DET2

)

Output Voltage(V_DET2

)

最低動作電圧 (V

)

Min. Operating Voltage(V

MIN

グGラroンuドnd電V位oltag(Ve_S(_SV)_SS

)

①

②

③

④

⑤

①

②

③

④

⑤

条件Ａ

条件Ｂ

●Operational Notes (N-ch Open drain)

Timing Chart A (VIN1=voltages above release voltage, VIN2=sweep voltage)

Because a voltage higher than the minimum operating voltage is applied to the voltage input pin (VIN), ground voltage will be

output at the output pin (VDET) during stage 3. (Stages 1, 2, 4, 5 are the same as in B below).

Timing Chart B (VIN1=VIN2)

① When a voltage greater than the release voltage (VDR) is applied to the voltage input pin (VIN1, VIN2), input voltage (VIN1,

VIN2) will gradually fall.

When a voltage greater than the detect voltage (VDF) is applied to the voltage input pin (VIN1, VIN2), a state of high

impedance will exist at the output pin (VDET1, VDET2), so should the pin be pulled up, voltage will be equal to pull up

voltage.

② When input voltage (VIN1, VIN2) falls below detect voltage (VDF), output voltage (VDET1, VDET2) will be equal to ground

level (VSS).

③ Should input voltage (VIN1, VIN2) fall below the minimum operational voltage (VMIN), output will become unstable. Should

VIN2 fall below VMIN, voltage at the output pin (VDET2) will be equal to ground level (VSS) if the power supply (VIN1) is

within the operating voltage range.

*In general the output pin is pulled up so output will be equal to pull up voltage.

④ Should input voltage (VIN1, VIN2) rise above ground voltage (VSS), output voltage (VDET1, VDET2) will equal ground level

until the release voltage level (VDR) is reached.

⑤ When input voltage (VIN1, VIN2) rises above release voltage, the output pin's (VDET1, VDET2) voltage will be equal to the

voltage dependent on pull up.

Note : The difference between release voltage (VDR) and detect voltage (VDF) is the Hysteresis Range ⑥.

6/15

XC612

Series

■NOTES ON USE

1. Please use this IC within the specified maximum absolute ratings, for temporary, transitional voltage drop or voltage

rising phenomenon, the IC is liable to malfunction should the

ratings be exceeded.

2. When use N type, please ensure that input voltage VIN2 is less than VIN1 + 0.3V. (refer to N.B. 1 below)

3. With a resistor R_INconnected between the VIN1 pin and the power supply, oscillation is liable to occur as a result of

through current at the time of release. (refer to N.B. 2 below)

4. With a resistor R_INconnected between the VIN1 pin and the power supply, V_IN1pin voltage will fall as a result of the IC's

supply current flowing through the VIN1 pin.

5. In order to stabilize the IC's operations, please ensure that the VIN1 pin's input frequency's rise and fall times are more

than 5 msec/V.

6. Should the power supply voltage VIN1 exceed 6V, voltage detector 2's detect voltage (VDF2) and the release voltage

(VDR2) will shift somewhat.

7. For CMOS output products, high level output voltage which is generated when the transient response is released

becomes input voltage of VIN.

8. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request

user fail-safe design and post-aging treatment on system or equipment.

●N.B.

1. Voltage detector 2's input voltage (VIN2) N Type.

An input protect diode is connected from input detector 2's input (VIN2) to input detector 1's input. Therefore, should the

voltage applied to VIN2 exceed VIN1, current will flow through VIN1 via the diode. (refer to diagram1)

2. Oscillation as a result of through current

Since the XC612 series are CMOS ICs, through current will flow when the IC's internal circuit switching operates

(during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at the

through current's resistor (RIN) during release voltage operations. (refer to diagram 2)

Since hysteresis exists during detect operations, oscillation is unlikely to occur.

Diagram 1. Voltage detector 2's input voltage VIN2

Diagram 2. Through current oscillation

7/15

XC612 Series

■TEST CIRCUITS

Circuit 1

* A resistor is not needed for CMOS output type.

Circuit 2

Circuit 3

IN1

IN2

IDET

V_DET1

Ａ

V_DET2

V_SS

V_DS

XC612N Type

XC612E Type

XC612D Type

8/15

XC612

Series

■TEST CIRCUITS (Continued)

Circuit 4

Waveform

measurmen

Waveform

measurmen

* A resistor is not needed for CMOS output type.

9/15

XC612 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

Ambient Temperature Topr (℃)

Note: Unless otherwise stated, pull up resistance = 100kΩwith N-ch open drain output type.

10/15

XC612

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

11/15

XC612 Series

■APPLICATION CIRCUITS EXAMPLE *Example covers N-channel open drain product's circuits

●Window comparator circuit

●Detect voltages above respective established voltages circuit

On resistors R1 and R2 equation (1) and (2)

Detect voltage = { (R1 + R2) ÷ R2} × VDF2

N.B. VDF2 = detect voltage VD2

(1)

Hysteresis (VHYS2) = { (R1 + R2) ÷R2 } × VHYS2

(2)

Note: Please ensure that input voltage 2 (VIN2) is less than VIN1 + 0.3V

●Detect voltage circuit with delay built-in

Note: Delay operates at both times of release and

detect operations.

12/15

XC612

Series

■PACKAGING INFORMATION

●SOT-25

●USP-6B

1.8±0.05

1PIN INDENT

0.2±0.05

0.1±0.03

0.5±0.05 0.5±0.05

1.6±0.05

13/15

XC612 Series

■MARKING RULE

●SOT-25

①Represents output configuration

CONFIGURATION

MARK

PRODUCT SERIES

VDET1

N-ch Open Drain

CMOS

VDET2

N-ch Open Drain

CMOS

XC612NxxxxMx

XC612DxxxxMx

XC612ExxxxMx

①

②

③

④

N-ch Open Drain

②, ③Represents sequence number

④Represents production lot number

0 to 9, A to Z repeated. (G, I, J, O, Q, W excepted.)

●USP-6B

0.5±0.1

（0.05）

（0.45）（0.45）

（0.45）

USP-6B

① represents output configuration

CONFIGURATION

MARK

PRODUCT SERIES

VDET1

VDET2

N-ch open drain

CMOS

N-ch open drain

CMOS

XC612N****D*

XC612D****D*

XC612E****D*

N-ch open drain

②,③ represent detect voltage（VDET1）

④,⑤ represent detect voltage（VDET2）

SYMBOL

PRODUCT SERIES

VOLTAGE(V

)

PRODUCT SERIES

VOLTAGE(V

)

②

③

④

⑤

3.3

5.0

XC612*33**D*

XC612*50**D*

3.3

5.0

XC612***33D*

XC612***50D*

⑥ represents production lot number

0～9、A～Z repeated. (G、I、J、O、Q、W excluded.)

*No character inversion used.

14/15

XC612

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this catalog is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this catalog.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this catalog.

4. The products in this catalog are not developed, designed, or approved for use with such

equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this catalog within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of Torex Semiconductor Ltd.

15/15

XC612N3619DR [TOREX]

相关型号：

XC612N3619DR-G

XC612N3619ML

XC612N3619MR-G

XC612N3620DR-G

XC612N3620ML

XC612N3620MR-G

XC612N3621DR

XC612N3621ML

XC612N3621MR

XC612N3621MR-G

XC612N3622DR

XC612N3622MR