XDL602B30382-Q_技术文档

XDL601/XDL602 Series

ETR44001-002

HiSAT-COT _®Control, 1.5A Inductor Built-in Step-Down “micro DC/DC” Converters

☆AEC-Q100 Grade2

☆Green Operation Compatible

■GENERAL DESCRIPTION

The XDL601/XDL602 series is a synchronous step-down micro DC/DC converter which integrates an inductor and a control

IC in one tiny package. An internal coil simplifies the circuit and enables minimization of noise and other operational trouble

due to the circuit wiring.

The XDL601/XDL602 series uses synchronous rectification at an operating frequency of 3.0MHz. The XDL601/XDL602

series uses HiSAT-COT ^(*)synchronous rectification. HiSAT-COT+PWM control (XDL601) or HiSAT-COT+automatic

PWM/PFM switching control (XDL602) can be selected.

XDL601/XD602 series employ the wettable flank plated packaging. This provides a visual indicator of solderability and lowers

the inspection time.

^(*)HiSAT-COT is a proprietary high-speed transient response technology for DC/DC converter which was developed by Torex.

It is Ideal for the LSI's that require high precision and high stability power supply voltage.

■FEATURES

■APPLICATIONS

●Car Navigation System

●Drive Recorder

●Car Audio

●Car-mounted camera

●ETC / Other automotive accessories

Input Voltage

:

2.5V ~ 5.5V

0.8V,1.0V,1.1V,1.2V,1.25V,1.3V,1.35V,

1.5V,1.8V,2.5V,3.0V,3.3V

3.0MHz

Output Voltage

Oscillation Frequency

Output Current

Efficiency

:

1.5A

93% (V_IN=5.0V,V_OUT=3.3V/500mA)

HiSAT-COT

Control Methods

100% Duty Cycle

HiSAT-COT+PWM (XDL601)

HiSAT-COT+PWM/PFM (XDL602)

Thermal Shut Down

Circuit Protection

Functions

:

Current Limit Circuit (Drop)

Short Circuit Protection (Latch)

Soft-start Circuit Built-in

UVLO

C_LDischarge

Output Capacitor

OperatingAmbient Temperature

Package

:

Low ESR Ceramic Capacitor

-40℃ ~ 105℃

DFN3625-11B (with Wettable Flanks)

EU RoHS Compliant, Pb Free

Environmental Friendly

■ TYPICAL PERFORMANCE

CHARACTERISTICS

XDL601/XDL602 (V_OUT=3.3V)

■TYPICALAPPLICATION CIRCUIT

L1

Lx

VIN

CIN

VOUT

CL

VIN

L2

CE

VOUT

PGND

AGND

1/21

XDL601/XDL602 Series

■BLOCK DIAGRAM

1) XDL601/XDL602 Series Type A

Inductor

L1

L2

V_OUT

FB

C

R1

R2

High Side

Current Limit

Phase

V^IN

Compensation

Error

Comparator

Amp.

S

R

AGND

CE

Synch

Buffer

Drive

Q

Logic

Lx

Vref with

Soft Start

CE Control Logic,

UVLO

Thermal Shutdown

Minimum On

Time

Generator

IN

V

PGND

V^OUT

/

PWM PFM

Selector

* The XDL601 offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.

The XDL602 control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM

automatic switching” internally.

Diodes inside the circuit are an ESD protection diode and a parasitic diode.

2) XDL601/XDL602 Series Type B

Inductor

L1

L2

Short

Protection

V_OUT

FB

C

R1

R2

High Side

Current Limit

Phase

V

IN

Compensation

Error

Comparator

Amp

.

S

Synch

Buffer

Drive

AGND

CE

Logic

Q

Lx

R

Vref with

Soft Start

CE Control Logic

,

Minimum On

UVLO

Time

V

IN

Thermal Shutdown

Generator

PGND

V_OUT

/

PWM PFM

Selector

* The XDL601 offers a fixed PWM control, a Control Logic of PWM/PFM Selector is fixed at “PWM” internally.

The XDL602 control scheme is a fixed PWM/PFM automatic switching, a Control Logic of PWM/PFM Selector is fixed at “PWM/PFM

automatic switching” internally.

Diodes inside the circuit are an ESD protection diode and a parasitic diode.

2/21

XDL601/XDL602

Series

■PRODUCT CLASSIFICATION

●Ordering Information

XDL601①②③④⑤⑥-⑦ PWM

XDL602①②③④⑤⑥-⑦ PWM/PFM Automatic switching control

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

A

B

①

Type

Refer to Selection Guide

Output Voltage options

e.g.)1.2V → ②=1, ③=2

1.25V → ②=1, ③=C

08,10,11,12,1C

13,1D,15,18

25,30,33^(*1)

②③

④

Output Voltage

0.05V Increments:

0.25=C,0.35=D

Oscillation Frequency

Package

3

3.0MHz

(*2)

⑤⑥-⑦

82-Q

DFN3625-11B (2,000pcs/Reel) ^(*3)

(Order Unit)

^(*1)Contact Torex sales representatives for other voltages. Product selections from 0.8V to 3.6V are available.

(*2)

The “-Q” suffix denotes “AEC-Q100” compliant.

^(*3)“Halogen and Antimony free” as well as being fully EU RoHS compliant. The products are shipped in a moisture-proof

packing.

●Selection Guide

LATCH or

SHORT

PROTECTION

OUTPUT

VOLTAGE DISCHARGE

C_LAUTO-

CHIP

ENABLE

CURRENT SOFT-

THERMAL

TYPE

UVLO

LIMIT

START SHUTDOWN

A

B

Fixed

No

Yes

Fixed

Yes

3/21

XDL601/XDL602 Series

■PIN CONFIGURATION

PGND

9

8

7

6

5

1

2

3

4

CE

AGND

V_OUT

V_IN

NC

L_X

PGND

10

L1

L2 11

12

L2

13

L1

DFN3625-11B

(BOTTOM VIEW)

* The dissipation pad, No.9 pin of the DFN3625-11B package, should be soldered in recommended

mount pattern and metal masking so as to enhance mounting strength and heat release.

The mount pattern for the dissipation pad should be connected to the GND pin (No.4, 5 and 7).

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTIONS

Power Input

1

V_IN

2

NC

No Connection

3

Lx

Switching Output

Power Ground

4

PGND

V_OUT

AGND

CE

5

Power Ground

6

7

Fixed Output Voltage PIN

Analog Ground

Chip Enable

8

9

PGND

L1

Power Ground

10,13

11,12

Inductor Electrodes

L2

* This 2-pin NC terminal is not connected to an IC chip.

■FUNCTION TABLE

PIN NAME

SIGNAL

STATUS

Stand-by

Active

Low

CE

High

* Please do not leave the CE pin open.

4/21

XDL601/XDL602

Series

■ABSOLUTE MAXIMUM RATINGS

PARAMETER

V_INPin Voltage

L_XPin Voltage

V_OUTPin Voltage

CE Pin Voltage

SYMBOL

RATINGS

-0.3 ~ 6.2

UNITS

V_IN

V_Lx

V_out

V_CE

V

-0.3 ~ V_IN+ 0.3 or 6.2^(*1)

-0.3 ~ V_IN+ 0.3 or 4.0 ^(*2)

-0.3 ~ 6.2

Power Dissipation

(Ta=25℃)

DFN3625-11B

Pd

2100 (JESD51-7 board) ^(*3)

mW

Operating Ambient Temperature

Storage Temperature

Topr

T_stg

-40 ~ 105

-55 ~ 125

℃

All voltages are described based on the GND (AGND and PGND) pin.

^(*1)The maximum value should be either V_IN+0.3V or 6.2V in the lowest voltage

^(*2)The maximum value should be either V_IN+0.3V or 4.0V in the lowest voltage

^(*3)The power dissipation figure shown is PCB mounted and is for reference only.

The mounting condition is please refer to PACKAGING INFORMATION.

5/21

XDL601/XDL602 Series

■ELECTRICAL CHARACTERISTICS

Ta=25℃

●XDL601/XDL602

PARAMETER

SYMBOL

CONDITIONS

MIN.

TYP.

MAX.

UNITS CIRCUIT

When connected to external components,

Output Voltage

V_OUT

V_IN

<E-1>

2.5

<E-2>

<E-3>

V

①

I_OUT=30mA

-

-40℃≦Ta

≦

105

℃

Operating Voltage Range

Maximum Output Current

-

5.5

-

When connected to external components ^(*1)

,

I_OUTMAX

1500

mA

V_IN=<C -1>

V_OUT=0.6V,Voltage which Lx pin

holding “L” level ^(*6)

UVLO Voltage^(*2)

V_UVLO

-40℃≦Ta

≦

105

℃

1.35

2.00

2.68

V

③

②

-

25.0

-

40.0

50.0

825

900

1.0

Quiescent Current

(XDL602)

Iq

V_OUT=V_OUT(T)× 1.1

μA

-40℃≦Ta

≦

105

℃

400

-

Quiescent Current

(XDL601)

Iq

V_OUT=V_OUT(T)× 1.1

V_CE=0V

μA

ns

②

①

-40℃≦Ta

≦

105

℃

Stand-by Current

I_STB

0.0

When connected to external components,

V_IN=<C-1>, I_OUT=1mA

Minimum ON time

t_ONmin

<E-5>

<E-6>

<E-7>

Thermal shutdown

Thermal shutdown hysteresis

Lx SW ”H” ON Resistance

Lx SW ”L” ON Resistance ^(*4)

Lx SW ”H” Leakage Current

Lx SW ”L” Leakage Current

Current Limit ^(*5)

T_TSD

T_HYS

R_LXH

R_LXL

I_LeakH

I_leakL

I_LIMH

-

150

30

-

℃

Ω

①

④

⑤

⑥

-

V_OUT=0.6V, I_LX=100mA ^(*3)

V_OUT=V_OUT(T)V × 1.1, I_LX=100mA ^(*3)

V_IN=5.5V, V_CE=0V, V_OUT=0V, V_LX=0V

V_IN=5.5V, V_CE=0V, V_OUT=0V, V_LX=5.5V

V_OUT=0.6V, I_Lxuntil Lx pin oscillates

-

0.14

0.10

0.0

0.28

0.20

1.0

30.0

4.5

-

Ω

μA

A

-

0.0

2.5

3.0

V_OUT=0.6V, Applied voltage to V_CE

Voltage changes Lx to “H” level ^(*6)

,

CE ”H” Voltage

CE ”L” Voltage

V_CEH

-40℃≦Ta

≦

105

℃

1.4

-

5.5

V

③

V_OUT=0.6V, Applied voltage to V_CE

Voltage changes Lx to “L” level ^(*6)

V_IN=5.5V, V_CE=5.5V, V_OUT=0V

V_IN=5.5V, V_CE=0V, V_OUT=0V

,

V_CEL

AGND

0.30

CE ”H” Current

CE ”L” Current

I_CEH

I_CEL

-0.1

-

0.1

μA

⑤

V_CE=0V

After "H" is fed to CE,

the time by when clocks are generated at Lx pin.

Sweeping V_OUT

→ 5.0V, V_OUT=V_OUT(T)× 0.9

Soft-start Time

t_SS

0.10

0.30

0.50

ms

③

Short Protection Threshold

Voltage (Type B)

,

V_SHORT

0.17

0.27

0.37

V

③

V_OUTvoltage which Lx becomes “L” level^(*6)

C_LDischarge (Type B)

Inductance

R_DCHG

L

V_CE=0V, V_OUT=4.0V

50

-

210

0.5

1.8

300

Ω

μH

A

⑦

-

Test Freq.=1MHz

-

Inductor Rated Current

I_DC

ΔT=+40deg

-

Unless otherwise stated, V_IN=5V, V_CE=5V, V_OUT(T)=Nominal Value,

The ambient temperature range (-40℃≦Ta≦105℃) is design Value.

NOTE:

^(*1)When the difference between the input and the output is small, 100% duty might come up and internal control circuits keep P-ch driver

turning on even though the output current is not so large.

If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.

^(*2)Including UVLO detect voltage, hysteresis operating voltage range for UVLO release voltage.

(*3)

R = (V_IN- Lx pin measurement voltage) / 100mA, R_LXL= Lx pin measurement voltage / 100mA

LXH

^(*4)Design value for the XDL602 series.

^(*5)Current limit denotes the level of detection at peak of coil current.

^(*6)"H"=V_IN~ V_IN- 1.2V, "L"=- 0.1V ~ 0.1V

6/21

XDL601/XDL602

Series

■ELECTRICAL CHARACTERISTICS

●SPEC Table (V_OUT, t_ONmin

)

V_OUT

(Ta=25℃)

V_OUT

t_ONmin

(Ta=25℃)

NOMINAL

OUTPUT

(-40℃≦Ta≦105℃)

VOLTAGE

<C-1>

<E-1>

MIN.

<E-2>

<E-3>

MAX.

<E-1>

<E-2>

<E-3>

<E-5>

<E-6>

TYP.

<E-7>

MAX.

VIN,

VCE

V_OUT(T)

TYP.

MIN.

TYP.

MAX.

MIN.

0.80

1.00

1.10

1.20

1.25

1.30

1.35

1.50

1.80

2.50

3.00

3.30

0.784

0.980

1.078

1.176

1.225

1.274

1.323

1.470

1.764

2.450

2.940

3.234

0.800

1.000

1.100

1.200

1.250

1.300

1.350

1.500

1.800

2.500

3.000

3.300

0.816

1.020

1.122

1.224

1.275

1.326

1.377

1.530

1.836

2.550

3.060

3.366

0.768

0.960

1.056

1.152

1.200

1.248

1.296

1.440

1.728

2.400

2.880

3.168

0.800

1.000

1.100

1.200

1.250

1.300

1.350

1.500

1.800

2.500

3.000

3.300

0.824

1.030

1.133

1.236

1.288

1.339

1.391

1.545

1.854

2.575

3.090

3.399

2.70

3.00

4.17

5.00

5.50

71

119

123

136

148

154

160

167

185

200

166

160

177

193

201

209

217

241

260

86

95

104

108

112

117

130

140

7/21

XDL601/XDL602 Series

■TEST CIRCUITS

①

< Circuit No.

>

< Circuit No. ②>

Wave Form Measure Point

L

L2

L1

Lx

L2

L1

Lx

V^OUT

AGND

CE

V^OUT

AGND

CE

A

V_IN

V

IN

C_L

V

R_L

1μF

C_IN

PGND

※External Components

L：0.5μH(Selected goods)

C

10μF(Ceramic)

:

IN

μF(Ceramic)

10

L

< Circuit No. ③>

< Circuit No. ④>

Wave Form Measure Point

L2

L1

L2

L1

V^OUT

Lx

V^OUT

Lx

V^IN

AGND

V^IN

AGND

V

1μF

R_Pulldown

200Ω

I

LX

1μF

PGND

CE

PGND

CE

R_LXH=(V_IN-V_L)/I_LX

R_LXL=V_LX/I_LX

< Circuit No. ⑤>

< Circuit No. ⑥>

Wave Form Measure Point

L2

L1

L2

L1

LeakH

I

A

V^OUT

Lx

V^OUT

Lx

I_LeakL

1μF

V^IN

AGND

V^IN

I_LIMH

1μF

CEH

I

V

A

PGND

CE

PGND

I_CEL

< Circuit No. ⑦>

L2

L1

A

V^OUT

Lx

V^IN

AGND

1μF

CE

PGND

8/21

XDL601/XDL602

Series

■TYPICAL CIRCUIT

L1

Lx

VIN

CIN

VOUT

CL

VIN

L2

CE

VOUT

PGND

AGND

NOTE:

The integrated Inductor can be used only for this DC/DC

converter. Please do not use this inductor for other reasons.

VALUE

PRODUCT NUMBER

CGA4J3X7S1A106K125AE (TDK)

GCM21BR71A106KE22L (murata)

C_IN

C_L

10V/10μF

9/21

XDL601/XDL602 Series

■OPERATIONAL EXPLANATION

The XDL601/XDL602 series consists of a reference voltage source, error amplifier, comparator, phase compensation,

minimum on time generation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel MOS

switching transistor for the synchronous switch, current limiter circuit, UVLO circuit, thermal shutdown circuit, short protection

circuit, PWM/PFM selection circuit and others. (See the BLOCK DIAGRAM below.)

Inductor

L1

L2

Short

Protection

VOUT

R1

R2

CFB

High Side

Current Limit

VIN

Phase

Compensation

Error

Amp.

Comparator

AGND

CE

S

Synch

Buffer

Drive

Q

Logic

Lx

R

Vref with

Soft Start

CE Control Logic,

UVLO

Thermal Shutdown

Minimum On

Time

Generator

VIN

PGND

VOUT

PWM/PFM

Selector

BLOCK DIAGRAM (XDL601/602 Series)

The method is HiSAT-COT (High Speed circuit Architecture for Transient with Constant On Time) control, which features on time

control method and a fast transient response that also achieves low output voltage ripple.

The on time is determined by the input voltage and output voltage, and turns on the Pch MOS driver Tr. for a fixed time. During

the off time, the voltage that is fed back through R1 and R2 is compared to the reference voltage by the error amp, and the error

amp output is phase compensated and sent to the comparator. The comparator compares this signal to the reference voltage,

and if the signal is lower than the reference voltage, sets the SR latch. On time then resumes. By doing this, PWM operation takes

place with the off time controlled to the optimum duty ratio and the output voltage is stabilized. The phase compensation circuit

optimizes the frequency characteristics of the error amp, and generates a ramp wave similar to the ripple voltage that occurs in

the output to modulate the output signal of the error amp. This enables a stable feedback system to be obtained even when a low

ESR capacitor such as a ceramic capacitor is used, and a fast transient response and stabilization of the output voltage are

achieved.

Generates an on time that depends on the input voltage and output voltage. The on time is set as given by the equations below.

t_ONmin=V_OUT/V_IN×333 ns

The switching frequency can be obtained from the on time which is determined by the input voltage and output voltage, and the

PWM controlled off time as given by the equation below.

f_OSC= (V_OUT/ V_IN) x (1 / t_ONmin

)

<100% duty cycle mode>

When the load current is heavy and the voltage difference between input voltage and output voltage is small, 100% duty cycle

mode is activated and it keeps the Pch MOS driver Tr. keep on. 100% duty cycle mode attains a high output voltage stability and

a high-speed response under all load conditions, from light to heavy, even in conditions where the dropout voltage is low.

The error amp monitors the output voltage. The voltage divided by the internal R1 and R2 resistors is a feedback voltage for

Error Amp. and compared to the reference voltage. The output voltage of the error amp becomes higher when the feedback

voltage is higher than the reference voltage. The frequency characteristics of the error amp are optimized internally.

10/21

XDL601/XDL602

Series

■OPERATIONAL EXPLANATION (Continued)

The reference voltage forms a reference that is used to stabilize the output voltage of the IC.

After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval.

This allows the voltage divided by the internal R1 and R2 resistors and the reference voltage to be controlled in a balanced manner,

and the output voltage rises in proportion to the rise in the reference voltage. This operation prevents rush input current and

enables the output voltage to rise smoothly.

If the output voltage does not reach the set output voltage within the soft start time, such as when the load is heavy or a large

capacity output capacitor is connected, the balancing of the voltage divided by the internal resistors R1 and R2 and the reference

voltage is lost, however, the current restriction function activates to prevent an excessive increase of input current, enabling a

smooth rise of the output voltage.

Regarding XDL601 which has PWM control method, it works with a continuous conduction mode, and operates at a stable

switching frequency by means of an on time that is determined by the input voltage and output voltage regardless of the load.

Regarding XDL602 which has PWM/PFM auto switching control method, it works with a discontinuous conduction mode at light

loads, and lowers the switching frequency to reduce switching loss and improve efficiency.

Operation starts when “H” voltage is input into the CE pin. The IC can be put in the shutdown state by inputting “L” voltage into

the CE pin. In the shutdown state, the supply current of the IC is 0μA (TYP.), and the Pch MOS driver Tr. and Nch MOS switch

Tr. for synchronous rectification turn off. The CE pin is a CMOS input and the sink current is 0μA.

When the V_INvoltage becomes 2.00V (TYP.) or lower, the P-ch MOS driver transistor output driver transistor is forced OFF to

prevent false pulse output caused by unstable operation of the internal circuitry. When the V_INpin voltage becomes 2.10V (TYP.)

or higher, switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output

startup operation. The UVLO circuit does not cause a complete shutdown of the IC,but causes pulse output to be suspended;

therefore, the internal circuitry remains in operation.

For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal shutdown

circuit starts operating and the P-ch MOS driver and N-ch MOS driver transistor will be turned off when the chip’s temperature

reaches 150℃. When the temperature drops to 120℃ or less after shutting of the current flow, the IC performs the soft-start

function to initiate output startup operation.

<Short-circuit protection function>

The B type short-circuit protection circuit protects the device that is connected to this product and to the input/output in situations

such as when the output is accidentally shorted to GND. The short-circuit protection circuit monitors the output voltage, and when

the output voltage falls below the short-circuit protection threshold voltage, it turns off the Pch MOS driver Tr and latches it. Once

in the latched state, operation is resumed by turning off the IC from the CE pin and then restarting, or by re-input into the V_INpin.

<C_LHigh Speed Discharge>

The B type can quickly discharge the electric charge at the output capacitor (C_L) when a low signal to the CE pin which enables

a whole IC circuit put into OFF state, is inputted via the N-ch MOS switch transistor located between the V_OUTpin and the GND

pin. When the IC is disabled, electric charge at the output capacitor (C_L) is quickly discharged so that it may avoid application

malfunction.

Output Voltage Dischage characteristics

R_DCHG= 210Ω (TYP) C_L=10μ F

τ

_–t /

V=V_OUT(T)×e

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

t=τln (V_OUT(T)/ V)

-

V_OUT= 1.2V

V: Output voltage after discharge

V_OUT(T): Output voltage

V_OUT= 1.8V

--

V_OUT= 3.3V

---

t: Discharge time

τ: C_L×R_DCHG

C_L: Capacitance of Output capacitor

R_DCHG: C^Lauto-discharge resistance,

but it depends on supply voltage.

0

2

4

6

8

10 12 14 16 18 20

Discharge Time: t(ms)

11/21

XDL601/XDL602 Series

■OPERATIONAL EXPLANATION (Continued)

The current limiter circuit of the XDL601/XDL602 series monitors the current flowing through the P-channel MOS driver

transistor connected to the Lx pin. When the driver current is greater than a specific level, the current limit function operates to

turn off the pulses from the Lx pin at any given timing. When the over current state is eliminated, the IC resumes its normal

operation.

■NOTE ON USE

1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated

if IC is used beyond the absolute MAX. specifications.

2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external

component selection, such as the coil inductance, capacitance values, and board layout of external components. Once the

design has been completed, verification with actual components should be done.

3. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics

of this IC, so refer to the specifications and standard circuit examples of each component when carefully considering which

components to select. Be especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R,

X5R (EIA standard) ceramic capacitors.

4. Make sure that the PCB GND traces are as thick and wide as possible. The V_SSpin or PGND pin and AGND pin fluctuation

caused by high ground current at the time of switching may result in instability of the IC. Therefore, the GND traces close to

the V_SSpin, PGND pin and AGND pin are important.

5. Mount external components as close as possible to the IC. Keep the wiring short and thick to lower the wiring impedance.

6. A feature of HiSAT-COT control is that it controls the off time in order to control the duty, which varies due to the effects of power

loss. In addition, changes in the on time due to 100% duty cycle mode are allowed. For this reason, caution must be exercised

as the characteristics of the switching frequency will vary depending on the external component characteristics, board layout,

input voltage, output voltage, load current and other parameters.

7. Due to propagation delay inside the product, the on time generated by the minimum on time generation circuit is not the same

as the on time that is the ratio of the input voltage to the output voltage.

8. With regard to the current limiting value, the actual coil current may at times exceed the electrical characteristics due to

propagation delay inside the product.

9. The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the input or ground, use the resistor not more

than 1MΩ or less. To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting

between pins, it is recommended that a resistor be connected.

10. In the B type, if the output voltage drops below the short circuit protection threshold voltage at the end of the soft start interval,

operation will stop.

11. Regarding XDL602 which has PWM/PFM auto switching control method, it works with a discontinuous conduction mode at

light loads, and in this case where the voltage difference between input voltage and output voltage is low or the coil inductance

is higher than the value indicated in the standard circuit example, the coil current may reverse when the load is light, and thus

pulse skipping will not be possible and light load efficiency will worsen.

12. When the voltage difference between input voltage and output voltage is low, the load stability feature may deteriorate.

13. Torex places an importance on improving our products and their reliability.We request that users incorporate fail-safe designs

and post-aging protection treatment when using Torex products in their systems.

12/21

XDL601/XDL602

Series

■NOTE ON USE (Continued)

14. Instructions of pattern layouts

The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high.

Please place the input capacitor(C_IN) and the output capacitor (C_L) as close to the IC as possible.

(1) In order to stabilize V_INvoltage level, we recommend that a by-pass capacitor (C_IN) be connected as close as possible to

the V_INpin, PGND pin and AGND pin.

(2) Please mount each external component as close to the IC as possible.

(3) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

(4) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents

at the time of switching may result in instability of the IC.

(5) This series’ internal driver transistors bring on heat because of the output current and ON resistance of P-channel and N-

channel MOS driver transistors. Please consider the countermeasures against heat if necessary.

< Reference Pattern Layout >

Layer 1

Layer 2

Layer 4

Layer 3

13/21

XDL601/XDL602 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency vs. Output Current

XDL601A083 / XDL602A083 Vout=0.8V

XDL601A183 / XDL602A183 Vout=1.8V

C

= 10μF(C2012X7R1A106M)

C

= 10μF(C2012X7R1A106M)

IN

C_L= 10μF(C2012X7R1A106M)

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

VIN = 2.5V

VIN = 5.5V

XDL601

XDL602

XDL601

VIN = 2.5V

VIN = 5.5V

XDL602

VIN = 2.5V

VIN = 5.5V

VIN = 2.5V

VIN = 5.5V

0.1

1

10

100

1000

10000

0.1

1

10

100

1000

10000

Output Current: I_OUT(mA)

XDL601A333 / XDL602A333 Vout=3.3V

C

= 10μF(C2012X7R1A106M)

IN

C_L= 10μF(C2012X7R1A106M)

100

90

80

70

60

50

40

30

20

10

0

XDL601

XDL602

V_IN= 5.5V

0.1

1

10

100

1000

10000

Output Current: I_OUT(mA)

(2) Output Voltage vs. Output Current

XDL601A333 Vout=3.3V

XDL601A183 Vout=0.8V

C

= 10μF(C2012X7R1A106M)

IN

C

= 10μF(C2012X7R1A106M)

IN

C_L= 10μF(C2012X7R1A106M)

3.60

2.00

1.90

1.80

1.70

1.60

3.50

3.40

3.30

3.20

3.10

3.00

V_IN= 5.5V

V_IN= 2.5V

0.1

1

10

100

1000

10000

0.1

1

10

100

1000

10000

Output Current: I_OUT(mA)

14/21

XDL601/XDL602

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(3) Ripple Voltage vs. Output Current

XDL601A333 / XDL602A333 Vout=3.3V

= 10μF(C2012X7R1A106M)

XDL601A183 / XDL602A183 Vout=1.8V

= 10μF(C2012X7R1A106M)

C

IN

C

IN

C_L= 10μF(C2012X7R1A106M)

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

XDL601

XDL602

XDL601

XDL602

V_IN= 3.3V

V_IN= 5.0V

0.1

1

10

100

1000

10000

0.1

1

10

100

1000

10000

Output Current: I_OUT(mA)

(4) Output Voltage vs. Ambient Temperature

XDL601A183 Vout=1.8V

(5) UVLO Voltage vs. Ambient Temperature

XDL601A083 Vout=0.8V

V_CE= V_IN

3.0

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

2.00

1.95

1.90

V_IN= 3.7V

1.85

1.80

1.75

1.70

1.65

1.60

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Ambient Temperature: Ta (℃)

(6) Quiescent Current vs. Ambient Temperature

XDL602A083 Vout=0.8V

XDL601A083 Vout=0.8V

1000

900

800

700

600

500

400

300

200

100

0

100

90

V_IN= 2.7V

V_IN= 3.7V

V_IN= 5.0V

80

70

V_IN=5.0V, 3.7V, 2.7V

60

50

40

30

20

10

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Ambient Temperature: Ta (℃)

15/21

XDL601/XDL602 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(7) Stand-by Current vs. Ambient Temperature

(8) Oscillation Frequency vs. Ambient Temperature

XDL601A083 Vout=0.8V

5.0

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

4.0

3.0

2.0

V_IN=5.0V

V_IN= 3.6V

V_IN= 3.0V

1.0

V_IN= 3.7V, 2.7V

0.0

-50

-25

0

25

50

75

100 125

0

250

500

750

1000 1250 1500

Ambient Temperature: Ta (℃)

Output Current: I_OUT(mA)

XDL601A333 Vout=3.3V

XDL601A183 Vout=1.8V

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

V_IN= 5.0V, 5.5V

V_IN=5.0V, 3.6V

V_IN= 3.0V

V_IN= 4.2V

0

250

500

750

1000 1250 1500

0

250

500

750

1000 1250 1500

Output Current: I_OUT(mA)

(9) Pch Driver ON Resistance vs. Ambient Temperature

XDL601A083 Vout=0.8V

(10) Nch Driver ON Resistance vs. Ambient Temperature

XDL601A083 Vout=0.8V

V_OUT= 0.6V , I_LX= 100mA

V_OUT= V_OUT(T)×1.1 , I = 100mA

LX

300

250

200

150

100

50

300

V_IN=5.0V

V_IN= 3.7V

V_IN= 2.7V

250

200

150

100

50

V_IN=5.0V

V_IN= 3.7V

V_IN= 2.7V

0

-50

-25

0

25

50

75

100

125

-50

-25

0

25

50

75

100 125

Ambient Temperature: Ta (℃)

16/21

XDL601/XDL602

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(11) Lx SW ”H” Leakage Current vs. Ambient Temperature

(12) Lx SW ”L” Leakage Current vs. Ambient Temperature

XDL601A083 Vout=0.8V

V_IN=5.5V , V_CE= 0V , V_OUT= 0V , V_LX= 5.5V

V_IN=5.5V , V_CE= 0V , V_OUT= 0V , V_LX= 0V

10.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100

125

Ambient Temperature : Ta (℃)

(13) CE ”H” Voltage vs. Ambient Temperature

(14) CE ”L” Voltage vs. Ambient Temperature

XDL601A083 Vout=0.8V

1.4

1.2

1.0

0.8

0.6

1.4

1.2

1.0

0.8

0.6

V_IN=5.0V

V_IN= 3.7V

V_IN= 2.7V

0.4

0.2

0.0

V_IN= 3.7V

V_IN= 2.7V

0.2

0.0

-50

-25

0

25

50

75

100

125

-50

-25

0

25

50

75

100

125

Ambient Temperature: Ta (℃)

(15) Soft-Start Time vs. Ambient Temperature

XDL601A083 Vout=0.8V

(16) Current Limit vs. Ambient Temperature

XDL601A083 Vout=0.8V

V_OUT= 0.6V

500

450

400

4000

3800

3600

3400

3200

3000

V_IN=5.0V

350

300

250

200

150

100

50

2800

V_IN=5.0V

2600

V_IN= 3.7V

V_IN= 2.7V

2400

2200

2000

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Ambient Temperature: Ta (℃)

Ambient Temperature : Ta (℃)

17/21

XDL601/XDL602 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(17) C_LDischarge Resistance vs. Ambient Temperature

(18) Short Protection Threshold vs. Ambient

XDL601B083 Vout=0.8V

500

V_IN= 5.0V , V_CE=0V , V_OUT= 4.0V

300

250

200

150

100

50

400

300

200

100

V_IN=5.0V, 3.7V, 2.7V

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

Ambient Temperature: Ta (℃)

(19) Load Transient Response

50

75

100

125

Ambient Temperature: Ta (℃)

V_IN= 5.0V , V_OUT= 1.8V , f_OSC= 3.0MHｚ , I_OUT= 10mA ⇒ 1.0A

C_IN= 10μF(C2012X7R1A106M) , C_L= 10μF(C2012X7R1A106M)

V_IN= 5.0V , V_OUT= 1.8V , f_OSC= 3.0MHｚ , I_OUT= 10mA ⇒ 1.0A

C_IN= 10μF(C2012X7R1A106M) , C_L= 10μF(C2012X7R1A106M)

V

_OUT：50mV/div , I_OUT：1A/div , Time：50μs/div

V

_OUT：50mV/div , I_OUT：1A/div , Time：50μs/div

I

_OUT：1.0A

I_OUT：1.0A

I

_OUT：10mA

I

_OUT：10mA

V

_OUT：50mV/div

V_OUT：50mV/div

V_IN= 5.0V , V_OUT= 3.3V , f_OSC= 3.0MHｚ , I_OUT= 10mA ⇒ 1.0A

C_IN= 10μF(C2012X7R1A106) , C_L= 10μF(C2012X7R1A106M)

V_IN= 5.0V , V_OUT= 3.3V , f_OSC= 3.0MHｚ , I_OUT= 10mA ⇒ 1.0A

C_IN= 10μF(C2012X7R1A106) , C_L= 10μF(C2012X7R1A106M)

V

_OUT：50mV/div ,

I

_OUT：1A/div , Time：50μs/div

V

_OUT：50mV/div , I_OUT：1A/div , Time：50μs/div

I

_OUT：1.0A

I

_OUT：1.0A

I

_OUT：10mA

I

_OUT：10mA

V

_OUT：50mV/div

V

_OUT：50mV/div

18/21

XDL601/XDL602

Series

■PACKAGING INFORMATION

For the latest package information go to, www.torexsemi.com/technical-support/packages

PACKAGE

OUTLIN / LAND PATTERN

DFN3625-11B PKG

THERMAL CHARACTERISTICS

DFN3625-11B Power Dissipation

DFN3625-11B

19/21

XDL601/XDL602 Series

■MARKING RULE

DDFFNN33662255--1111BB

●DFN3625-11B

8

7

5

11

6

TOREX

9

① ② ③ ④ ⑤

1

2

3

4

10

(図中”TOREX”は固定)

① represents product series

MARK

PRODUCT SERIES

Package

C

D

XDL601****8*-Q

XDL602****8*-Q

DFN3625-11B

② represents integer of the reference voltage and product type

Product

MARK

V_OUT(V)

PRODUCT SERIES

Type

A

B

C

D

E

F

0.x

1.x

2.x

3.x

0.x

1.x

2.x

3.x

XDL60*A0****-Q

XDL60*A1****-Q

XDL60*A2****-Q

XDL60*A3****-Q

XDL60*B0****-Q

XDL60*B1****-Q

XDL60*B2****-Q

XDL60*B3****-Q

A

B

H

K

B

③ represents decimal number of the output voltage

MARK

V_OUT(V)

x.0

PRODUCT SERIES

XDL60***0***-Q

XDL60***1***-Q

XDL60***2***-Q

XDL60***3***-Q

XDL60***4***-Q

XDL60***5***-Q

XDL60***6***-Q

XDL60***7***-Q

XDL60***8***-Q

XDL60***9***-Q

MARK

V_OUT(V)

x.05

x.15

x.25

x.35

x.45

x.55

x.65

x.75

x.85

x.95

PRODUCT SERIES

XDL60***A***-Q

XDL60***B***-Q

XDL60***C***-Q

XDL60***D***-Q

XDL60***E***-Q

XDL60***F***-Q

XDL60***H***-Q

XDL60***K***-Q

XDL60***L***-Q

XDL60***M***-Q

0

1

2

3

4

5

6

7

8

9

A

B

C

D

E

F

x.1

x.2

x.3

x.4

x.5

x.6

H

K

L

x.7

x.8

x.9

M

④,⑤ represents production lot number

01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order

(G, I, J, O, Q, W excluded*)No Character inversion used.

20/21

XDL601/XDL602

Series

1. The product and product specifications contained herein are subject to change without notice to

improve performance characteristics. Consult us, or our representatives before use, to confirm that

the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our

products. We neither make warranties or representations with respect to the accuracy or

completeness of the information contained in this datasheet nor grant any license to any intellectual

property rights of ours or any third party concerning with the information in this datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required by

such laws and regulations should also be followed, when the product or any information contained in

this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require

extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss

of human life, bodily injury, serious property damage including but not limited to devices or equipment

used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and

other transportation industry and 5) safety devices and safety equipment to control combustions and

explosions, excluding when specified for in-vehicle use or other uses.

Do not use the product for in-vehicle use or other uses unless agreed by us in writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products;

nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal

injury and/or property damage resulting from such failure, customers are required to incorporate

adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention

features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

Semiconductor Ltd in writing in advance.

21/21


型号：	XDL602B30382-Q
厂家：	Torex Semiconductor
描述：	HiSAT-COT Â® Control, 1.5A Inductor Built-in Step-Down âmicro DC/DCâ Converters
文件：	总21页 (文件大小：1235K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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