CMS15 [TOSHIBA]

Switching Mode Power Supply Applications; 开关电源的应用
CMS15
型号: CMS15
厂家: TOSHIBA    TOSHIBA
描述:

Switching Mode Power Supply Applications
开关电源的应用

整流二极管 开关 测试 光电二极管
文件: 总5页 (文件大小:189K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CMS15  
TOSHIBA Schottky Barrier Diode  
CMS15  
Switching Mode Power Supply Applications  
(Output voltage: 12 V)  
Unit: mm  
DC/DC Converter Applications  
Forward voltage: V  
Average forward current: I  
Repetitive peak reverse voltage: V  
Suitable for compact assembly due to small surface-mount package  
“MFLATTM” (Toshiba package name)  
= 0.58 V (max)  
FM  
= 3.0 A  
F (AV)  
= 60 V  
RRM  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Repetitive peak reverse voltage  
Average forward current  
V
60  
V
A
RRM  
I
3.0 (Note 1)  
60 (50Hz)  
40~150  
40~150  
F (AV)  
Non-repetitive peak surge current  
Junction temperature  
I
A
FSM  
T
j
°C  
°C  
Storage temperature range  
T
stg  
Note 1: T= 95°C  
Device mounted on a ceramic board  
Board size: 50 mm × 50 mm  
Soldering size: 2 mm × 2 mm  
Board thickness: 0.64 t  
JEDEC  
JEITA  
Rectangular waveform (α = 180°), V = 30 V  
R
Note 2: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
TOSHIBA  
3-4E1A  
Weight: 0.023 g (typ.)  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
= 1.0 A (pulse test)  
Min  
Typ.  
Max  
Unit  
V
V
I
I
I
0.43  
0.49  
0.55  
1.0  
FM (1)  
FM (2)  
FM (3)  
FM  
FM  
FM  
Peak forward voltage  
V
V
= 2.0 A (pulse test)  
= 3.0 A (pulse test)  
0.58  
I
I
V
V
V
= 5 V (pulse test)  
= 60 V (pulse test)  
RRM (1)  
RRM (2)  
RRM  
RRM  
Peak repetitive reverse current  
Junction capacitance  
μA  
25  
300  
C
= 10 V, f = 1.0 MHz  
R
102  
pF  
j
Device mounted on a ceramic board  
(board size: 50 mm × 50 mm)  
(soldering land: 2 mm × 2 mm)  
(board thickness: 0.64 t)  
60  
Device mounted on a glass-epoxy board  
(board size: 50 mm × 50 mm)  
(soldering land: 6 mm × 6 mm)  
(board thickness: 1.6 t)  
Thermal resistance  
(junction to ambient)  
R
th (j-a)  
°C/W  
135  
Device mounted on a glass-epoxy board  
(board size: 50 mm × 50 mm)  
(soldering land: 2.1 mm × 1.4 mm)  
(board thickness: 1.6 t)  
210  
16  
Thermal resistance  
(junction to lead)  
R
th (j-)  
°C/W  
1
2006-11-13  
CMS15  
Marking  
Abbreviation Code  
SE  
Part No.  
CMS15  
Standard Soldering Pad  
Unit: mm  
1.4  
3.0  
1.4  
Handling Precaution  
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.  
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.  
Please take forward and reverse loss into consideration during design.  
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be  
exceeded during operation, even for an instant. The following are the general derating methodthat we  
recommend when you design a circuit with a device.  
V
RRM  
: Use this rating with reference to (1) above. V  
has a temperature coefficient of 0.1%/°C. Take  
RRM  
this temperature coefficient into account designing a device at low temperature.  
I : We recommend that the worst case current be no greater than 80% of the absolute maximum  
F (AV)  
rating of  
I
and T be below 120°C. When using this device, take a margin into consideration by using  
j
F (AV)  
an allowable Tamax-I  
curve.  
F (AV)  
I
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal  
operation, which seldom occurs during the lifespan of the device.  
FSM  
T : Derate this rating when using a device in order to ensure high reliability.  
j
We recommend that the device be used at a T of below 120°C.  
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.  
When using a device, design a circuit board and a soldering land size to match the appropriate thermal  
resistance value.  
4) Please refer to the Rectifiers databook for further information.  
2
2006-11-13  
CMS15  
i
– v  
P
– I  
F (AV) F (AV)  
F
F
100  
50  
30  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
Pulse test  
DC  
180°  
10  
T = 150°C  
j
5
3
120°  
α = 60°  
125°C  
75°C  
1
0.5  
0.3  
Rectangular  
waveform  
25°C  
0.1  
0.05  
0.03  
α 360°  
Conduction angle α  
0.01  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0.0  
0.8  
1.6  
2.4  
3.2  
4.0  
Instantaneous forward voltage  
v
F
(V)  
Average forward current  
I
(A)  
F (AV)  
Tmax – I  
Ta max – I  
F (AV)  
F (AV)  
160  
140  
120  
100  
80  
160  
140  
120  
100  
80  
Device mounted on a ceramic board: Rectangular  
waveform  
board size: 50 mm × 50 mm  
soldering land:  
2 mm × 2 mm  
board thickness:  
α 360°  
0.64 t  
I
F (AV)  
Conduction  
angle α  
= 30 V  
α = 60°  
180°  
120°  
DC  
V
R
180°  
120°  
Rectangular  
waveform  
60  
60  
DC  
40  
40  
α 360°  
I
F (AV)  
Conduction  
angle α  
= 30 V  
20  
20  
α = 60°  
V
R
0
0
0
0
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4  
0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4  
Average forward current  
I
(A)  
Average forward current  
I
(A)  
F (AV)  
F (AV)  
r
– t  
th (j-a)  
1000  
Device mounted on a glass-epoxy board:  
board size: 50 mm × 50 mm  
Soldering land: 2.1 mm × 1.4 mm  
board thickness: 1.6 t  
500  
300  
100  
50  
30  
Device mounted on a glass-epoxy board:  
board size: 50 mm × 50 mm  
Soldering land: 6.0 mm × 6.0 mm  
board thickness: 1.6 t  
10  
5
3
Device mounted on a ceramic board:  
board size: 50 mm × 50 mm  
Soldering land: 2.0 mm × 2.0 mm  
board thickness: 0.64 t  
1
0.001 0.003  
0.01  
0.03  
0.1  
0.3  
1
3
10  
30  
100  
300  
1000  
Time  
t (s)  
3
2006-11-13  
CMS15  
Surge forward current  
(non-repetitive)  
C – V  
j
(typ.)  
R
1000  
500  
80  
60  
40  
20  
0
Ta = 25°C  
f = 50 Hz  
Ta = 25°C  
f = 1 MHz  
100  
50  
10  
5
1
1
3
5
10  
30  
50  
100  
1
3
5
10  
30  
50  
100  
Reverse voltage  
V
(V)  
R
Number of cycles  
I
– T  
(typ.)  
P
– V  
(typ.)  
R
j
R (AV)  
R
100  
10  
1
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
Rectangular  
waveform  
Pulse test  
0°  
360°  
V
DC  
R
α
48 V  
Conduction angle α  
T = 125°C  
40 V  
300°  
0.1  
j
240°  
30 V  
20 V  
10 V  
180°  
0.01  
120°  
V
= 5 V  
0.001  
R
α = 60°  
0.0001  
0
20  
40  
60  
80  
100  
120  
140  
160  
0
6
12  
18  
24  
30  
36  
42  
48  
Junction temperature  
T
j
(°C)  
Reverse voltage  
V
(V)  
R
4
2006-11-13  
CMS15  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
5
2006-11-13  

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