CMZB13 [TOSHIBA]
TOSHIBA Zener Diode Silicon Diffused Type; 东芝齐纳二极管硅DIFFUSED TYPE
| 型号： | CMZB13 |
| 厂家： | 
TOSHIBA |
| 描述： | TOSHIBA Zener Diode Silicon Diffused Type |
| 文件： | 总5页 (文件大小：177K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CMZB12~CMZB53
TOSHIBA Zener Diode Silicon Diffused Type
CMZB12~CMZB53
○Communication, Control and
Unit: mm
Measurement Equipment
○Constant Voltage Regulation
○Transient Suppressors
②
•
•
•
Average power dissipation: P = 1.0 W
Zener voltage: V = 12 to 53 V
Z
Suitable for high-density board assembly due to the use of a small
TM
surface-mount package, M−FLAT
①
0.16
1.75 ± 0.1
Absolute Maximum Ratings (Ta = 25°C)
+ 0.2
2.4 − 0.1
Characteristics
Power dissipation
Symbol
P
Rating
Unit
1.0 (Note 1)
−40 to 150
−40 to 150
W
°C
°C
① ANODE
② CATHODE
Junction temperature
T
j
Storage temperature range
T
stg
Note 1: Ta = 40°C
JEDEC
―
―
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering size: 6 mm × 6 mm
Board thickness: 1.6 mm
JEITA
TOSHIBA
3-4E1A
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating temperature / current /
voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Start of commercial production
2005-09
1
2013-11-01
CMZB12~CMZB53
Electrical Characteristics (Ta = 25°C)
Temperature
Coefficient
Of Zener
Zener Voltage
Vz (V)
Zener Impedance
r (Ω)
Forward Voltage
Reverse Current
V
(V)
I (μA)
R
d
F
Type
Measure-
ment
Measure-
ment
αT (mV/°C)
Measure-
ment
Measure-
ment
Current
Current
Current
Voltage
Min
Typ.
Max
Max
Typ.
Max
Max
Max
I
(mA)
I
Z
(mA)
I
(A)
V (V)
R
Z
F
CMZB12
CMZB13
CMZB15
CMZB16
CMZB18
CMZB20
CMZB22
CMZB24
CMZB27
CMZB30
CMZB33
CMZB36
CMZB39
CMZB43
CMZB47
CMZB51
CMZB53
10.8
11.7
13.5
14.4
16.2
18.0
19.8
21.6
24.3
27.0
29.7
32.4
35.1
38.7
42.3
45.9
47.7
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
53
13.2
14.3
16.5
17.6
19.8
22.0
24.2
26.4
29.7
33.0
36.3
39.6
42.9
47.3
51.7
56.1
58.3
10
30
30
30
30
30
30
30
30
30
30
30
30
35
40
65
65
85
10
8
13
14
17
19
23
26
28
32
36
40
41
45
48
53
60
68
77
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.2
0.2
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
8
10
10
10
10
10
10
10
10
10
10
9
10
10
10
10
10
10
10
10
10
10
9
9
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
9
11
12
14
16
18
20
23
25
26
28
30
33
38
43
49
10
11
13
14
16
17
19
21
26.4
28.8
31.2
34.4
37.6
40.8
42.4
8
8
7
7
6
6
6
6
5
5
2
2013-11-01
CMZB12~CMZB53
Marking
Abbreviation Code
Part No.
Part No.
Abbreviation Code
B12
B13
B15
B16
B18
B20
B22
B24
B27
CMZB12
CMZB13
CMZB15
CMZB16
CMZB18
CMZB20
CMZB22
CMZB24
CMZB27
B30
B33
B36
B39
B43
B47
B51
B53
CMZB30
CMZB33
CMZB36
CMZB39
CMZB43
CMZB47
CMZB51
CMZB53
Standard Soldering Pad
Unit: mm
1.4
3.0
1.4
Handling Precaution
1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even
for a moment. Do not exceed any of these ratings. The following are the general derating methods that we
recommend when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the
absolute maximum rating of power dissipation. Carry out adequate heat design.
P
RSM:
We recommend that a device be used within the recommended area in the figure,
P
-tw.
RSM
T :
j
Derate this rating when using a device in order to ensure high reliability.
We recommend that the device be used at T of below 120°C.
j
2) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
3) Please refer to the Rectifiers databook for further information.
3
2013-11-01
CMZB12~CMZB53
Ta max – P
P
– tW (reference value)
RSM
160
120
80
1000
100
10
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
P
RSM
t
W
Ta = 25°C
Rectangular pulse
Recommended
40
0
0
0.2
0.4
0.6
0.8
1.0
1.2
0.1
1
10
Power dissipation
P
(W)
Pulse width
t
W
(ms)
α
T – VZ
(typ.)
α
T – VZ
(typ.)
50
25
20
15
10
5
CMZB12 to CMZB27
CMZB30 to CMZB53
45
40
35
30
25
26
10
15
20
25
30
30
34
38
42
46
50
54
58
Zener voltage VZ (V)
Zener voltage VZ (V)
r
– t
th (j-a)
1000
100
10
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
Board thickness: 1.6 mm
Device mounted on a glass-epoxy board:
Board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
Board thickness: 1.6 mm
1
Device mounted on a ceramic board:
Board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
Board thickness: 0.64 mm
0.1
0.001
0.01
0.1
1
10
100
1000
Time
t (s)
4
2013-11-01
CMZB12~CMZB53
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
APPLICATIONS.
•
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your
TOSHIBA sales representative.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the
U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
5
2013-11-01
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