CRS03(TE85L,C,X,M) [TOSHIBA]
Rectifier Diode;
| 型号： | CRS03(TE85L,C,X,M) |
| 厂家： | 
TOSHIBA |
| 描述： | Rectifier Diode 二极管 |
| 文件： | 总5页 (文件大小：392K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CRS03
TOSHIBA Schottky Barrier Diode
CRS03
○ Radio-Frequency Rectification in Switching Regulators
Unit: mm
○ Reverse-Current Protection in Mobile Devices
•
•
•
•
Repetitive peak reverse voltage : V
= 30 V
= 1.0 A
RRM
Average forward current
Peak forward voltage
: I
: V
F (AV)
= 0.45 V (max) @ IFM = 0.7 A
FM
Small, thin package suitable for high-density board assembly
TM
Toshiba Nickname: “S-FLAT
”
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
30
Unit
V
V
RRM
I
1.0 (Note 1)
20 (50 Hz)
−40 to 150
−40 to 150
A
F (AV)
Non-repetitive peak forward surge current
Junction temperature
I
A
FSM
T
°C
°C
j
JEDEC
JEITA
―
―
Storage temperature
T
stg
Note 1: Ta = 61°C
Device mounted on a glass-epoxy board
TOSHIBA
3-2A1S
Board size
: 50 mm × 50 mm
: 6 mm × 6 mm
: 1.6 mm
Soldering land size
Board thickness
Weight: 0.013 g (typ.)
Rectangular waveform : α = 180°, V = 15 V
R
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
= 0.1 A (pulse test)
Min
Typ.
0.33
0.425
0.45
0.5
Max
Unit
V
V
V
V
I
I
I
FM (1)
FM (2)
FM (3)
FM
FM
FM
Peak forward voltage
= 0.7 A (pulse test)
= 1.0 A (pulse test)
0.45
I
V
V
V
= 5 V (pulse test)
= 30 V (pulse test)
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
µA
I
100
C
j
= 10 V, f = 1.0 MHz
R
40
pF
Device mounted on a ceramic board
board size
soldering land size
board thickness
50 mm × 50 mm
2 mm × 2 mm
0.64 mm
70
Thermal resistance
(junction to ambient)
R
°C/W
th (j-a)
Device mounted on a glass-epoxy board
board size 50 mm × 50 mm
soldering land size 6 mm × 6 mm
140
20
board thickness
1.6 mm
Thermal resistance (junction to lead)
R
°C/W
th (j-ℓ)
Start of commercial production
1998-06
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CRS03
Marking
Abbreviation Code
S3
Part No.
CRS03
Land pattern dimensions for reference only
Unit: mm
1.2
1.2
2.8
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V : Use this rating with reference to the above. V
RRM
has a temperature coefficient of 0.1%/°C. Take this
RRM
temperature coefficient into account designing a device at low temperature.
I
I
: We recommend that the worst case current be no greater than 80% of the absolute maximum rating of
F (AV)
I
and T be below 120°C. When using this device, take the margin into consideration by using an
j
F(AV)
allowable Tamax-I
curve.
F(AV)
:
This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,
which seldom occurs during the lifespan of the device.
FSM
T :
j
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T of below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
4) For other design considerations, see the Toshiba website.
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CRS03
I
– V
P
– I
F (AV)
F
F
F (AV)
180°
10
0.6
0.5
0.4
0.3
0.2
0.1
0
DC
T = 150°C
j
1
120°
125°C
75°C
α = 60°
25°C
Rectangular
waveform
0.1
0.01
0° α 360°
Pulse test
1.0
Conduction angle α
1.0 1.2 1.4
0
0.2
0.4
0.6
0.8
1.2
1.6
1.6
0
0.2
0.4
0.6
0.8
1.6
Forward voltage
V
(V)
Average forward current
I
(A)
F (AV)
F
Ta max – I
Ta max – I
F (AV)
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a ceramic board
board size: 50 mm × 50 mm
Soldering land size : 2 mm × 2 mm
board thickness : 0.64 mm
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm
Soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
α = 60°
120°
180°
DC
α = 60°
Rectangular
waveform
Rectangular
waveform
60
60
40
40
0° α 360°
0° α 360°
I
I
120°
180°
DC
F (AV)
F (AV)
20
20
Conduction
Conduction
angle α
angle α
V
= 15 V
V = 15 V
R
R
0
0
0
0
0.2
0.4
0.6
0.8
1.0
1.2
F (AV)
1.4
(A)
0.2
0.4
0.6
0.8
1.0
1.2
F (AV)
1.4
(A)
1.6
Average forward current
I
Average forward current
I
Tℓ max – I
r
– t
F (AV)
th (j-a)
160
140
120
100
80
10000
1000
100
10
Device mounted on a glass-epoxy board
board size : 50 mm × 50 mm
Soldering land size : 6 mm × 6 mm
board thickness : 1.6 mm
α = 60°
120°
180°
DC
Rectangular
waveform
60
40
Device mounted on a ceramic board
0° α 360°
board size : 50 mm × 50 mm
I
F (AV)
Soldering land size : 2 mm × 2 mm
20
Conduction
board thickness : 0.64 mm
angle α
V
R
= 15 V
0
0
1
0.2
0.4
0.6
0.8
1.0
I
1.2
1.4
(A)
0.001
0.01
0.1
1
10
100
Average forward current
Time
t (s)
F (AV)
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CRS03
Repetitive peak forward current
C – V
j
R
32
28
24
20
16
12
8
500
100
Ta = 25°C
f = 50 Hz
f = 1 MHz
Ta = 25°C
4
10
1
10
100
0
1
10
100
Number of cycles
Reverse voltage
V
(V)
R
I
– T
P
– V
R (AV) R
R
j
100
10
0.5
0.4
0.3
0.2
0.1
0
Rectangular
waveform
Pulse test
0°
360°
DC
V
R
V
= 30 V
R
300°
240°
1
Conduction angle α
T = 150°C
j
20 V
0.1
180°
120°
10 V
0.01
0.001
0.0001
5 V
α = 60°
0
20
40
60
80
100
T
120
(°C)
140
160
0
10
Reverse voltage
20
30
Junction temperature
V
(V)
j
R
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CRS03
RESTRICTIONS ON PRODUCT USE
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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
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all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR
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•
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EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH
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2018-09-05
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