CUS03 [TOSHIBA]
Switching Mode Power Supply Applications; 开关电源的应用
| 型号： | CUS03 |
| 厂家： | 
TOSHIBA |
| 描述： | Switching Mode Power Supply Applications |
| 文件： | 总5页 (文件大小：178K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CUS03
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS03
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Application
•
•
•
•
Forward voltage: V
= 0.52 V@I = 0.7 A
FM F
Average forward current: I
= 0.7A
F (AV)
Repetitive peak reverse voltage: V
= 40 V
RRM
Suitable for compact assembly due to small surface-mount package
“US−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
Unit
V
V
40
RRM
0.7
(Note 1)
I
A
F (AV)
Peak one cycle surge forward current
Junction temperature
I
20 (50 Hz)
−40 to 150
−40 to 150
A
FSM
T
j
°C
°C
JEDEC
JEITA
―
Storage temperature range
T
stg
Note 1: Ta = 53°C: Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
TOSHIBA
3-2B1A
Land size: 6 mm × 6 mm
Rectangular waveform (α = 180°), V = 20 V
Weight: 0.004 g (typ.)
R
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
I
I
= 0.1 A
= 0.7 A
―
―
―
―
―
0.37
0.48
0.4
―
0.52
―
FM (1)
FM (2)
FM
FM
Peak forward voltage
I
V
V
V
= 5 V
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
I
= 40 V
3.0
100
―
C
= 10 V, f = 1.0 MHz
R
45
pF
j
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
―
―
75
Thermal resistance
(junction to ambient)
R
°C/W
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
―
―
―
―
150
30
Thermal resistance (junction to lead)
R
Junction to lead of cathode side
°C/W
th (j-ℓ)
1
2006-11-13
CUS03
Marking
Abbreviation Code
Part No.
CUS03
3
Standard Soldering Pad
Unit: mm
2.0
0.5
0.8
1.1
0.8
Handling Precaution
1) Schottky barrier diodes have reverse current characteristics compared to other diodes.
There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.
Please take forward and reverse loss into consideration during design.
2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we
recommend when you design a circuit with a device.
V
RRM
: Use this rating with reference to (1) above. V
has a temperature coefficient of 0.1%/°C. Take
RRM
this temperature coefficient into account when designing a device at low temperature.
I : We recommend that the worst case current be no greater than 80% of the absolute maximum
F (AV)
rating of
I
and T be below 120°C. When using this device, please take the margin into consideration
j
F (AV)
by using an allowable Tamax-I
curve.
F (AV)
I
: This rating specifies the non-repetitive peak current. This is only applied for an abnormal
operation, which seldom occurs during the lifespan of the device.
FSM
T : Derate this rating when using a device to ensure high reliability.
j
We recommend that the device be used at a T of below 120°C.
j
3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.
When using a device, design a circuit board and a soldering land size to match the appropriate thermal
resistance value.
4) Please refer to the Rectifiers databook for further information.
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CUS03
i
– v
P
– I
F (AV) F (AV)
F
F
10
0.5
0.4
0.3
0.2
0.1
0
DC
180°
T = 150°C
j
1
120°
75°C
25°C
α = 60°
100°C
Rectangular
waveform
0.1
0.01
0° α 360°
Conduction
angle: α
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Instantaneous forward voltage
v
F
(V)
Average forward current
I
(A)
F (AV)
Ta max – I
F (AV)
Ta max – I
F (AV)
160
140
120
100
80
160
140
120
100
80
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm,
land size: 6 mm × 6 mm)
Device mounted on a ceramic board
(board size: 50 mm × 50 mm,
land size: 2 mm × 2 mm)
α = 60°
120°
180°
DC
α = 60°
Rectangular
waveform
Rectangular
waveform
60
60
40
40
120°
180°
0.8
DC
0° α 360°
0° α 360°
20
20
Conduction
Conduction
angle: α
angle: α
V
= 20 V
0.2
R
V
= 20 V
0.2
R
0
0.0
0
0.0
0.4
0.6
0.8
1.0
1.2
0.4
0.6
1.0
1.2
Average forward current
I
(A)
Average forward current
I
(A)
F (AV)
F (AV)
Tℓ max – I
r
– t
F (AV)
th (j-a)
10000
1000
160
140
120
100
80
(1) Device mounted on a ceramic board
Soldering land: 2.0 mm × 2.0 mm
(2) Device mounted on a glass-epoxy board
Soldering land: 6.0 mm × 6.0 mm
(3) Device mounted on a glass-epoxy board
Standard soldering pad
(3)
(2)
(1)
100
10
1
α = 60°
120°
180°
DC
Rectangular
waveform
60
40
0° α 360°
Conduction
angle: α
20
0
V
= 20 V
0.2
R
0.0
0.4
0.6
0.8
1.0
1.2
0.001
0.01
0.1
1
10
100
1000
Average forward current
I
(A)
Time t (s)
F (AV)
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CUS03
Surge forward current (non-repetitive)
C – V
j
(typ.)
R
24
20
16
12
8
1000
100
10
Ta = 25°C
f = 50 Hz
Ta = 25°C
f = 1 MHz
4
0
1
10
100
1
10
100
Number of cycles
Reverse voltage
V
(V)
R
I
– T
(typ.)
P
– V
R
(typ.)
R
j
R (AV)
100
10
1
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Rectangular
waveform
Pulse test
V
= 40 V
R
0° α 360°
DC
Conduction
30 V
angle: α
300°
T = 150°C
j
240°
20 V
0.1
0.01
180°
10 V
5 V
120°
60°
0.001
0.0001
0
20
40
60
80
100
120
140
160
0
10
20
30
40
Junction temperature
T
j
(°C)
Reverse voltage
V
(V)
R
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2006-11-13
CUS03
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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2006-11-13
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