MG400Q2YS70A [TOSHIBA]

TRANSISTOR,IGBT POWER MODULE,HALF BRIDGE,1.2KV V(BR)CES,400A I(C);
MG400Q2YS70A
型号: MG400Q2YS70A
厂家: TOSHIBA    TOSHIBA
描述:

TRANSISTOR,IGBT POWER MODULE,HALF BRIDGE,1.2KV V(BR)CES,400A I(C)

栅 双极性晶体管
文件: 总15页 (文件大小:338K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MG400Q2YS70A  
TOSHIBA IGBT Module Silicon N Channel IGBT  
MG400Q2YS70A  
High Power Switching Applications  
Motor Control Applications  
Integrates a complete half bridge power circuit and fault-signal output circuit in one package.  
(short circuit and over temperature)  
The electrodes are isolated from case.  
Low thermal resistance.  
V
= 2.3 V (typ.)  
CE (sat)  
Equivalent Circuit  
1  
5
6
7
F
F
O
E1/C2  
4
1
OT  
2
3
O
E2  
Signal terminal  
1. G (L)  
2.  
6.  
F
F
(L)  
3. E (L)  
7. E (H)  
4.  
V
D
O
O
5. G (H)  
(H)  
8. Open  
1
2003-09-19  
MG400Q2YS70A  
Package Dimensions: 2-123C1B  
1. G (L)  
5. G (H)  
2.  
6.  
F
F
(L)  
3. E (L)  
7. E (H)  
4.  
V
D
O
O
(H)  
8. Open  
Signal Terminal Layout  
1. G (L)  
2. (L)  
3. E (L)  
4.  
5. G (H)  
6. (H)  
F
O
7
5
8
6
V
D
F
O
3
1
4
2
7. E (H)  
8. Open  
2.54  
Weight: 375 g  
2
2003-09-19  
MG400Q2YS70A  
Maximum Ratings (Ta = 25°C)  
Stage  
Characteristics  
Symbol  
Rating  
Unit  
Collector-emitter voltage  
Gate-emitter voltage  
V
V
1200  
V
V
CES  
±20  
GES  
DC  
1 ms  
DC  
I
400  
C
Collector current  
Forward current  
A
A
Inverter  
I
800  
400  
CP  
I
F
1 ms  
I
800  
FM  
Collector power dissipation (Tc = 25°C)  
Control voltage (OT)  
P
V
3750  
W
V
C
D
20  
Control  
Module  
Fault input voltage  
VF  
20  
V
O
Fault input current  
IF  
20  
mA  
°C  
°C  
°C  
V
O
Junction temperature  
Storage temperature range  
Operation temperature range  
Isolation voltage  
T
150  
j
T
40~125  
20~100  
2500 (AC 1 min)  
3 (M5)  
stg  
T
ope  
V
isol  
Screw torque  
Nm  
Electrical Characteristics (T = 25°C)  
j
1. Inverter stage  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
V
V
= ±20 V, V  
= +10 V, V  
= 0  
= 0  
+3/4  
100  
1.0  
mA  
nA  
mA  
V
GE  
GE  
CE  
CE  
CE  
CE  
Gate leakage current  
I
GES  
Collector cut-off current  
I
= 1200 V, V  
= 0  
CES  
GE  
Gate-emitter cut-off voltage  
V
= 5 V, I = 400 mA  
6.0  
7.0  
2.3  
8.0  
GE (off)  
C
T = 25°C  
j
2.7  
V
= 15 V,  
GE  
Collector-emitter saturation voltage  
V
V
CE (sat)  
I
= 400 A  
C
T = 125°C  
j
3.0  
Input capacitance  
Turn-on delay time  
C
V
= 10 V, V = 0, f = 1 MHz  
GE  
30000  
pF  
ies  
CE  
t
0.10  
1.00  
2.00  
0.50  
0.50  
2.8  
d (on)  
V
V
= 600 V, I = 400 A  
C
CC  
GE  
Switching time  
Turn-off time  
Fall time  
t
off  
= ±15 V, R = 5.1 Ω  
G
µs  
(Note 1)  
t
f
(See page 4)  
Reverse recovery time  
Forward voltage  
t
rr  
V
I
= 400 A  
2.4  
V
F
F
Note 1: Switching time test circuit & timing chart  
2. Control (Tc = 25°C)  
Characteristics  
Fault output current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
OC  
OT  
V
V
= 15 V  
800  
100  
125  
8
A
GE  
CC  
Over temperature  
°C  
µs  
Fault output delay time  
t
= 600 V, V  
= ±15 V  
GE  
d (Fo)  
3
2003-09-19  
MG400Q2YS70A  
3. Module (Tc = 25°C)  
Characteristics  
Symbol  
Test Condition  
Inverter IGBT stage  
Min  
Typ.  
Max  
Unit  
0.033  
0.068  
Junction to case thermal resistance  
Case to fin thermal resistance  
R
R
°C/W  
°C/W  
th (j-c)  
Inverter FRD stage  
With silicon compound  
0.013  
th (c-f)  
Switching Time Test Circuit  
R
G
I
F
V  
GE  
V
CC  
L
I
C
R
G
Timing Chart  
90%  
V
GE  
10%  
90% I  
rr  
I
rr  
20% I  
rr  
90%  
I
C
t
rr  
10%  
10%  
t
t
d (off)  
d (on)  
t
f
4
2003-09-19  
MG400Q2YS70A  
Remark  
<Short circuit capability condition >  
Short circuit capability is 6 µs after fault output signal.  
Please keep following condition to use fault output signal.  
<
V
750 V  
CC
=  
<
<
14.8 V  
V
GE
=  
17.0 V  
=
>
R
G
=  
5.1 Ω  
125°C  
<
T
j
=  
<Gate voltage >  
To use this product, V  
must be provided higher than 14.8 V  
GE  
In case V  
is less than 14.8 V, fault signal F may not be output even under error conditions.  
O
GE  
<For parallel use>  
For parallel use of this product, please use the same rank for both V  
and VF among IGBT in  
CE (sat)  
parallel without fail.  
V
Min  
Max  
CE (sat)  
24  
26  
28  
2.1  
2.3  
2.5  
2.4  
2.6  
2.7  
V
Min  
Max  
F
E
2.1  
2.3  
2.5  
2.4  
2.6  
2.8  
F
G
5
2003-09-19  
MG400Q2YS70A  
I
– V  
CE  
C
800  
600  
400  
200  
0
Common emitter  
T = 25°C  
V
= 20 V  
15 V  
12 V  
GE  
j
10 V  
9 V  
8 V  
0
1
2
3
4
5
Collector-emitter voltage  
V
(V)  
CE  
I
– V  
C
CE  
800  
600  
400  
200  
0
Common emitter  
T = 125°C  
j
15 V  
V
= 20 V  
GE  
12 V  
10 V  
9 V  
8 V  
0
1
2
3
4
5
Collector-emitter voltage  
V
(V)  
CE  
6
2003-09-19  
MG400Q2YS70A  
V
CE  
– V  
GE  
10  
8
Common emitter  
T = 25°C  
j
6
800 A  
4
400 A  
2
I
= 200 A  
C
0
0
4
8
12  
16  
20  
Gate-emitter voltage  
V
(V)  
GE  
V
CE  
– V  
GE  
10  
8
Common emitter  
T = 125°C  
j
6
800 A  
4
400 A  
2
I
= 200 A  
C
0
0
4
8
12  
16  
20  
Gate-emitter voltage  
V
(V)  
GE  
7
2003-09-19  
MG400Q2YS70A  
I
– V  
GE  
C
800  
600  
400  
200  
0
Common emitter  
= 5 V  
V
CE  
40°C  
125°C  
T = 25°C  
j
0
4
8
12  
Gate-emitter voltage  
V
(V)  
GE  
I – V  
F
F
800  
600  
400  
200  
0
Common cathode  
= 0 V  
V
GE  
T = 125°C  
j
25°C  
40°C  
0
1
2
3
4
5
Forward voltage  
V
(V)  
F
8
2003-09-19  
MG400Q2YS70A  
Switching time – R  
G
10000  
Common emitter  
V
= 600 V  
CC  
C
5000  
3000  
I
= 400 A  
T = 25°C  
j
T = 125°C  
j
V
= ± 15 V  
GE  
t
off  
1000  
t
d (off)  
t
on  
500  
300  
t
d (on)  
t
r
t
100  
f
50  
30  
10  
0
5
10  
Gate resistance  
15  
20  
R
G
()  
Switching time – I  
C
10000  
Common emitter  
V
= 600 V  
= 5.1 Ω  
CC  
5000  
3000  
R
GE  
T = 25°C  
j
T = 125°C  
j
G
V
= ± 15 V  
t
off  
1000  
t
d (off)  
500  
300  
t
on  
t
f
t
d (on)  
100  
50  
30  
t
r
10  
0
100  
200  
300  
400  
Collector current  
I
(A)  
C
9
2003-09-19  
MG400Q2YS70A  
E
, E – R  
G
on off  
1000  
Common emitter  
V
= 600 V  
CC  
C
I
= 400 A  
T = 25°C  
j
T = 125°C  
j
500  
300  
V
= ± 15 V  
GE  
E
E
on  
100  
off  
50  
30  
10  
0
5
10  
Gate resistance  
15  
20  
R
G
()  
E
, E – I  
C
on off  
100  
Common emitter  
V
= 600 V  
= 5.1 Ω  
CC  
R
T = 25°C  
j
T = 125°C  
G
50  
30  
V
= ± 15 V  
GE  
j
E
on  
E
off  
10  
5
3
1
0
100  
200  
300  
400  
Collector current  
I
(A)  
C
10  
2003-09-19  
MG400Q2YS70A  
I , t – I  
rr rr  
F
1000  
Common emitter  
V
= 600 V  
= 5.1 Ω  
CC  
R
T = 25°C  
j
T = 125°C  
j
G
500  
300  
V
= ± 15 V  
GE  
I
rr  
t
rr  
100  
50  
30  
10  
0
100  
200  
Forward current  
300  
400  
I
(A)  
F
E
– I  
F
dsw  
100  
Common emitter  
V
= 600 V  
= 5.1 Ω  
CC  
R
T = 25°C  
j
T = 125°C  
G
50  
30  
V
= ± 15 V  
GE  
j
10  
5
3
1
0
100  
200  
300  
400  
Forward current  
I
(A)  
F
11  
2003-09-19  
MG400Q2YS70A  
V
, V  
– Q  
CE GE G  
1000  
800  
600  
400  
200  
0
20  
16  
12  
8
Common emitter  
= 1.5 Ω  
R
L
T = 25°C  
j
400 V  
600 V  
200 V  
V
= 0 V  
CC  
4
0
0
900  
1800  
2700  
3600  
Charge  
Q
G
(nC)  
C – V  
CE  
100000  
50000  
30000  
C
ies  
10000  
5000  
3000  
C
oes  
C
res  
1000  
Common emitter  
V
= 0 V  
GE  
f = 1 MHz  
T = 25°C  
500  
300  
j
0.1  
0.3 0.5  
1
3
5
10  
(V)  
30  
50  
100  
Collector-emitter voltage  
V
CE  
12  
2003-09-19  
MG400Q2YS70A  
Safe-operating area  
3000  
1000  
I
max (pulsed)*  
C
50 µs∗  
500  
300  
I
max  
C
(continuous)  
100 µs∗  
1 ms∗  
100  
50  
30  
10  
*:Single  
nonrepetitive pulse  
Tc = 25°C  
5
3
Curves must be  
derated linearly with  
increase in  
temperature.  
1
1
10  
100  
Collector-emitter voltage  
1000  
10000  
V
(V)  
CE  
Reverse bias SOA  
800  
600  
400  
200  
0
Common emitter  
= 5.1 Ω  
R
G
T = 25°C  
j
0
400  
800  
1200  
Collector-emitter voltage  
V
(V)  
CE  
13  
2003-09-19  
MG400Q2YS70A  
R
th  
– t  
w
1
0.5  
0.3  
0.1  
Diode stage  
0.05  
0.03  
Transistor stage  
0.01  
0.005  
0.003  
0.001  
0.0005  
0.001  
0.01  
0.1  
Pulse width  
1
10  
t
(s)  
w
14  
2003-09-19  
MG400Q2YS70A  
RESTRICTIONS ON PRODUCT USE  
030619EAA  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
15  
2003-09-19  

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