TB2923HQ [TOSHIBA]
IC 29 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM25, 1 MM PITCH, PLASTIC, HZIP-25, Audio/Video Amplifier;
| 型号： | TB2923HQ |
| 厂家： | 
TOSHIBA |
| 描述： | IC 29 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM25, 1 MM PITCH, PLASTIC, HZIP-25, Audio/Video Amplifier 局域网 放大器 信息通信管理 商用集成电路 |
| 文件： | 总17页 (文件大小：298K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB2923HQ
TOSHIBA Bi-CMOS Linear Integrated Circuit Silicon Monolithic
TB2923HQ
50 W × 4-ch BTL Audio Power IC
The TB2923HQ is a four-channel BTL power amplifier for car
audio applications.
This IC has a pure complementary P-ch and N-ch DMOS output
stage, offering maximum output power (P
MAX) of 50 W.
OUT
It includes a standby switch, mute function and various
protection features.
Features
•
High output power
Weight: 7.7 g (typ.)
•
•
•
•
•
P
(V
MAX (1) = 50 W (typ.)
= 15.2 V, f = 1 kHz, JEITA max, R = 4 Ω)
OUT
CC
L
P
OUT
MAX (2) = 43 W (typ.)
= 13.7 V, f = 1 kHz, JEITA max, R = 4 Ω)
(V
CC
L
P
OUT
MAX (3) = 80 W (typ.)
= 14.4 V, f = 1 kHz, JEITA max, R = 2 Ω)
(V
CC
L
P
OUT
(1) = 29 W (typ.)
= 14.4 V, f = 1 kHz, THD = 10%, R = 4 Ω)
(V
CC
L
P
OUT
(2) = 25 W (typ.)
(V
CC
= 13.2 V, f = 1 kHz, THD = 10%, R = 4 Ω)
L
•
•
Low THD: 0.005% (typ.) (V
= 13.2 V, f = 1 kHz, P = 5 W, R = 4 Ω)
OUT L
CC
Low noise: V
= 50 µVrms (typ.)
NO
(V
CC
= 13.2 V, R = 0 Ω, BW = 20 Hz to 20 kHz, R = 4 Ω)
g L
•
•
•
•
Standby switch (pin 4)
Mute function (pin 22)
Output DC offset detection (pin 25)
Various protection features
Thermal overload; overvoltage; output short-circuits to GND, V
and across the load; speaker current limiting
CC
•
Operating supply voltage: V (opr) = 8.0 to 18 V (R = 4 Ω)
CC L
Note 1: Install the device correctly. Otherwise, the device or system may be degraded, damaged or even destroyed.
Note 2: The protection features are intended to avoid output short-circuits or other abnormal conditions temporarily. It
is not guaranteed that they will prevent the IC from being damaged.
Exposure to conditions beyond the guaranteed operating ranges may not activate the protection features,
resulting in an IC damage due to output short-circuits.
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TB2923HQ
Block Diagram
+B
10
1
6
20
Ripple
TAB
V
V
CC1
CC2
C1
IN1
Out1 (+)
11
9
8
7
PW-GND1
R
L
R
L
R
L
R
L
Out1 (−)
C1
IN2
Out2 (+)
PW-GND2
Out2 (−)
12
5
2
3
13 Pre-GND
C1
C6
C1
IN3
15
Out3 (+)
17
18
19
PW-GND3
Out3 (−)
16 AC-GND
IN4
14
Out4 (+)
PW-GND4
Out4 (−)
21
24
23
5 V
4 Stby
Play
Mute
R1
22 Mute
25
Offset/short
Some of the functional blocks, circuits or constants may be omitted from the block diagram or simplified for
explanatory purposes.
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TB2923HQ
Detailed Description
1. Standby Switch (pin 4)
The power supply can be turned on or off via
pin 4 (Stby). The threshold voltage of pin 4 is
V
CC
set at about 3 V
current is about 0.01 µA (typ.) in the standby
(typ.). The power supply
BE
ON
Power
10 kΩ
4
≈ 2 V
BE
state.
OFF
to Bias
filter network
Standby Control Voltage (V ): Pin 4
SB
Standby
Power
V
(V)
SB
ON
OFF
ON
0 to 0.9
OFF
2.9 to VCC
Figure 1 Setting Pin 4 High Turns on
Power
Check the pop levels when the time constant of
pin 4 is changed.
Benefits of the Standby Switch
(1)
V
CC
can be directly turned on or off by a microcontroller, eliminating the need for a switching relay.
(2) Since the control current is minuscule, a low-current-rated switching relay can be used.
Relay
High-current-rated switch
Battery
Battery
From
microcontroller
V
V
CC
CC
– Conventional Method –
From microcontroller
Low-current-rated switch
Battery
Battery
Standby
V
Standby
V
CC
CC
– Using the Standby Switch –
Figure 2 Standby Switch
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2006-11-30
TB2923HQ
2. Mute Function (pin 22)
The audio mute function is enabled by setting pin 22 Low. R and C determine the time constant of the
1
4
mute function. The time constant affects pop noise generated when power or the mute function is turned on
or off; thus, it must be determined on a per-application basis. (Refer to Figures 4 and 5.)
The value of the external pull-up resistor is determined, based on pop noise value.
For example, when the control voltage is changed from 5 V to 3.3 V, the pull-up resistor should be:
3.3 V/5 V × 47 kΩ = 31 kΩ
ATT – V
MUTE
20
0
V
= 13.2 V
CC
f = 1 kHz
R
= 4 Ω
L
V
= 20dBm
O
−20
−40
−60
BW = 400 Hz to 30 kHz
5 V
1 kΩ
22
−80
−100
−120
R
1
C
4
Mute On/Off
control
0
0.5
1
1.5
2
2.5
3
Pin 22 control voltage: V
(V)
MUTE
Figure 3 Mute Function
Figure 4 Mute Attenuation − V
(V)
MUTE
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TB2923HQ
3. DC Offset Detection
The purpose of the integrated DC offset detector is to avoid an anomalous DC offset on the outputs,
produced by the input capacitor due to leakage current or short-circuit.
Positive DC offset (+)
(caused by R
V
)
S1
/2 (normal DC voltage)
V
CC
Leakage current
or short-circuit
V
Negative DC offset (−)
(caused by R
ref
)
S2
+
−
R
S1
Elec. vol
5 V
V
V
bias
ref/2
25
LPF
To a microcontroller
A
B
The microcontroller shuts down the
system if the output is lower than
the specified voltage.
Figure 5 DC Offset Detection Mechanism
OUT(+)
Amp output
V
/2
CC
Offset detection
threshold (R
)
S2
OUT(-)
Time
GND
Voltage at (A)
(pin 25)
GND
Time
Voltage at (B)
(LPF output)
GND
Time
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2006-11-30
TB2923HQ
4. Layer Short Detection
The TB2923HQ may be properly connected to a load such as a 4-Ω speaker, but one of the speaker lines may
be shorted to ground through a low-impedance path. The TB2923HQ can detect such a condition.
V
CC
IC
out
out
SP = 4 Ω
GND
The negative (−) speaker connection is shorted to ground
through a low-impedance path due to some irregularities.
Figure 6 Layer Short
As is the case with output DC offset detection, pin 25 is also activated when there is a short on one of the
speaker lines as shown above. The detection impedance is 2.5 Ω (typ.).
This feature allows detection of a short-circuit through a low-impedance path other than the speaker
impedance. It helps to avoid speaker damage in case of anomalous system conditions and improve system
reliability.
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2006-11-30
TB2923HQ
5. Pop Noise Suppression
Since the TB2923HQ uses the AC-GND pin (pin 16) as the common input reference voltage pin for all
amplifiers, the ratio of the input capacitance (C1) to the AC-to-GND capacitance (C6) should be 1:4.
Also, if power is removed before C1 and C6 are completely charged, pop noise will be generated because of
unbalanced DC currents.
To avoid this problem, it is recommended to use a larger capacitor as C2 to increase the charging times of C1
and C6. Note, however, that C2 also affects the time required from power-on to audio output.
The pop noise generated by the muting and unmuting of the audio output varies with the time constant of
C4. A larger capacitance reduces the pop noise, but increases the time from when the mute control signal is
applied to C4 to when the mute function is enabled.
6. External Component Constants
Effects
Recommended
Component
Purpose
Notes
When lower than
When higher than
Value
recommended value
recommended value
Pop noise is
generated
Cut-off frequency is
increased.
C1
0.22 µF
To eliminate DC
To reduce ripple
Cut-off frequency is reduced.
Powering on/off is slower.
when V
is
CC
turned on.
C2
C3
47 µF
Powering on/off is faster.
To provide
sufficient
0.1 µF
Reduces noise and provides sufficient oscillation margin
oscillation margin
High pop noise. Duration until Low pop noise. Duration until
mute function is turned on/off mute function is turned on/off
To reduce pop
noise
C4
C5
1 µF
is short.
is long.
3900 µF
Ripple filter
Common
Power supply humming and ripple filtering.
Pop noise is
generated
C6
1 µF
reference voltage Pop noise is suppressed when C1: C6 = 1:4.
for all input
when V
is
CC
turned on.
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2006-11-30
TB2923HQ
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
(surge)
Rating
Unit
Peak supply voltage (0.2 s)
DC supply voltage
V
50
V
V
CC
V
(DC)
(opr)
25
18
CC
CC
Operating supply voltage
Output current (peak)
Power dissipation
V
V
I
(peak)
9
A
O
P
(Note 7)
125
W
°C
°C
D
Operating temperature
Storage temperature
T
opr
−40 to 85
−55 to 150
T
stg
Note 5: Package thermal resistance θ = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)
j-T
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must
not be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered and the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation
in other equipment. Applications using the device should be designed so that no absolute maximum rating
will ever be exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
Electrical Characteristics
(V = 13.2 V, f = 1 kHz, R = 4 Ω, Ta = 25°C unless otherwise specified)
CC
L
Test
Circuit
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
mA
Quiescent supply current
Output power
I
V
V
V
V
= 0
180
50
300
CCQ
IN
P
P
MAX (1)
MAX (2)
= 15.2 V, max POWER
= 13.7 V, max POWER
= 14.4 V, RL=2Ω, max
OUT
OUT
CC
CC
CC
43
W
P
MAX (3)
80
OUT
POWER
P
P
(1)
(2)
V
= 14.4 V, THD = 10%
23
29
25
OUT
OUT
CC
THD = 10%
Total harmonic distortion
Voltage gain
THD
P
V
V
= 5 W
0.005
26
0.07
27
%
OUT
OUT
OUT
G
V
= 0.775 Vrms
= 0.775 Vrms
= 0 Ω, DIN45405
= 0 Ω,
25
dB
dB
Channel-to-channel voltage gain
∆G
−1.0
0
1.0
V
V
(1)
R
R
60
NO
g
Output noise voltage
µVrms
g
V
(2)
50
55
65
80
70
NO
BW = 20 Hz to 20 kHz
f
= 100 Hz, R = 620 Ω
rip
g
Ripple rejection ratio
Crosstalk
R.R.
C.T.
dB
dB
V
= 0.775 Vrms
rip
R
P
= 620 Ω
g
= 4 W
OUT
Output offset voltage
Input resistance
Standby current
V
−90
2.9
0
0
90
mV
kΩ
µA
OFFSET
R
IN
90
0.1
I
Standby condition, V4=0,V22=0
POWER: ON
1
SB
V
H
L
VCC
0.9
VCC
0.9
SB
Standby control voltage
Mute control voltage
V
V
V
POWER: OFF
SB
V
H
MUTE: OFF
2.9
0
M
V
L
MUTE: ON, R = 47 kΩ
1
M
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2006-11-30
TB2923HQ
Test
Circuit
Characteristics
Mute attenuation
Symbol
ATT M
Test Condition
Min
Typ.
Max
Unit
MUTE: ON、DIN_AUDIO
85
100
250
±1.5
dB
kHz
V
V
= 7.75 Vrms → Mute: OFF
OUT
G = 26dB, −3dB
V
Upper cut-off frequency
F
th
Rpull-up = 10 kΩ, +V = 5.0 V
OUT(+)-OUT(-)
DC offset threshold voltage
V
±1.0
±2.0
off-set
Rpull-up = 10 kΩ, +V = 5.0 V
channel (+) or (−) shorted to
Layer short detection impedance
R half-short
P25-Sat
2.5
Ω
GND, when between R
s
impedance output to GND.
Pin 25 saturation voltage
(at each detector ON condition)
Rpull-up = 10 kΩ, +V = 5.0 V
(pin 25 = low)
100
500
mV
Test Circuit
+B
10
1
6
20
Ripple
TAB
V
V
CC1
CC2
C1: 0.22 µF
11
IN1
Out1 (+)
9
8
7
PW-GND1
R
L
R
L
R
L
R
L
= 4 ohm
Out1 (−)
C1: 0.22 µF
IN2
Out2 (+)
PW-GND2
Out2 (−)
12
5
2
3
= 4 ohm
= 4 ohm
= 4 ohm
13 Pre-GND
C1: 0.22 µF
IN3
15
Out3 (+)
17
18
19
PW-GND3
C6: 1 µF
Out3 (−)
16 AC-GND
C1: 0.22 µF
IN4
14
Out4 (+)
PW-GND4
Out4 (−)
21
24
23
5 V
4 Stby
Play
Mute
R1: 47 kΩ
22 Mute
25
Offset/short
Components in the test circuit are only used to determine the device characteristics.
It is not guaranteed that the system will work properly with these components.
9
2006-11-30
TB2923HQ
THD – P
(ch1)
THD – P
(ch2)
OUT
OUT
100
100
V
= 13.2 V
CC
V
= 13.2 V
CC
50
30
50
30
R
= 4 Ω
L
R
= 4 Ω
L
Filter
100 Hz : to 30 kHz
Filter
100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz
10 kHz : 400 Hz to
1kHz : 400 Hz to 30 kHz
10 kHz : 400 Hz to
10
10
20 kHz : 400 Hz to
20 kHz : 400 Hz to
5
3
5
3
20 kHz
10 kHz
20 kHz
10 kHz
1
1
0.5
0.3
0.5
0.3
0.1
0.1
0.05
0.03
0.05
0.03
1 kHz
1 kHz
0.01
0.01
f = 100 Hz
f = 100 Hz
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
THD – P
(ch3)
OUT
THD – P
(ch4)
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
Filter
100 Hz : to 30 kHz
Filter
100 Hz : to 30 kHz
1kHz : 400 Hz to 30 kHz
10 kHz : 400 Hz to
1kHz : 400 Hz to 30 kHz
10 kHz : 400 Hz to
10
10
20 kHz : 400 Hz to
20 kHz : 400 Hz to
5
3
5
3
20 kHz
10 kHz
20 kHz
10 kHz
1
1
0.5
0.3
0.5
0.3
0.1
0.1
0.05
0.03
0.05
0.03
1 kHz
1 kHz
0.01
0.01
f = 100 Hz
f = 100 Hz
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
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2006-11-30
TB2923HQ
THD – P
(ch1)
THD – P
(ch2)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
f = 1 kHz
f = 1 kHz
13.2 V
13.2 V
Filter
Filter
400 Hz to 30 kHz
400 Hz to 30 kHz
10
10
5
3
5
3
V
= 9 V
16 V
V
= 9 V
CC
16 V
CC
1
1
0.5
0.3
0.5
0.3
0.1
0.1
0.05
0.03
0.05
0.03
0.01
0.01
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
OUT
Output power
P
(W)
OUT
THD – P
(ch3)
THD – P
(ch4)
OUT
OUT
100
100
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
50
30
50
30
R
= 4 Ω
L
f = 1 kHz
f = 1 kHz
13.2 V
13.2 V
Filter
Filter
400 Hz to 30 kHz
400 Hz to 30 kHz
10
10
5
3
5
3
V
= 9 V
16 V
V
= 9 V
CC
16 V
CC
1
1
0.5
0.3
0.5
0.3
0.1
0.1
0.05
0.03
0.05
0.03
0.01
0.01
0.005
0.003
0.005
0.003
0.001
0.001
0.1
0.3 0.5
1
3
5
10
30 50 100
0.1
0.3 0.5
1
3
5
10
30 50 100
Output power
P
(W)
Output power
P
(W)
OUT
OUT
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2006-11-30
TB2923HQ
muteATT – f
THD – f
0
−20
3
1
V = 13.2 V
CC
V
= 13.2 V
CC
R
= 4 Ω
R
L
= 4 Ω
L
V
= 7.75 Vrms (20dBm)
OUT
P
= 5 W
OUT
No filter
0.3
0.1
−40
−60
0.03
0.01
1 ch~3 ch
−80
1 ch~4 ch
−100
−120
2 ch
0.003
0.001
10
100
1 k
10 k
100 k
0.01
0.1
1
10
100
frequency
f
(Hz)
frequency
f
(Hz)
G
V
– f
R.R. – f
40
30
20
10
0
0
−20
−40
−60
−80
V
= 13.2 V
CC
R
= 4 Ω
L
Vrip = 0.775 Vrms (0dBm)
1 ch~4 ch
1 ch~4 ch
V
= 13.2 V
CC
R
= 4 Ω
L
V
= 0.775 Vrms (0dBm)
OUT
0.01
0.1
1
10
100
0.01
0.1
1
10
100
frequency
f
(Hz)
frequency
f
(Hz)
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2006-11-30
TB2923HQ
V
– P
(ch1)
V
– P
(ch2)
OUT
IN
OUT
IN
100Hz,-20kHz
100Hz,-20kHz
40
30
40
30
20
20
V
= 13.2 V
V
= 13.2 V
CC
CC
10
0
10
0
R
= 4 Ω
R = 4 Ω
L
L
No filter
No filter
0
2
4
6
8
10
10
25
0
2
4
6
8
10
Input voltage
V
(Vrms)
Input voltage
V
(Vrms)
IN
IN
V
– P
(ch3)
V
– P
(ch4)
OUT
IN
OUT
IN
100Hz,-20kHz
100Hz,-20kHz
40
30
40
30
20
20
V
= 13.2 V
V
= 13.2 V
CC
CC
R = 4 Ω
L
10
0
10
0
R
L
= 4 Ω
No filter
No filter
0
2
4
6
8
0
2
4
6
8
10
Input voltage
V
IN
(Vrms)
Input voltage
V
IN
(Vrms)
I
– V
P MAX – Ta
D
CCQ
CC
200
160
120
80
120
100
80
60
40
20
0
(1) INFINITE HEAT SINK
R
= ∞
L
RθJC = 1°C/W
V
= 0 V
IN
(2) HEAT SINK (RθHS = 3.5°C/W
RθJC + RθHS = 4.5°C/W
(3) NO HEAT SINK
RθJA = 39°C/W
(1)
40
(2)
(3)
0
0
5
10
15
20
0
25
50
75
100
125
150
Supply voltage
V
CC
(V)
Ambient temperature Ta (°C)
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2006-11-30
TB2923HQ
C.T. – f (ch1)
C.T. – f (ch2)
0
−20
−40
−60
−80
0
−20
−40
−60
−80
V
R
V
R
= 13.2 V
= 4 Ω
V
R
V
R
= 13.2 V
CC
CC
L
= 4 Ω
L
= 0.775 Vrms (0dBm)
= 0.775 Vrms (0dBm)
OUT
OUT
= 620 Ω
= 620 Ω
G
G
CT (1-2)
CT (2-1)
CT (1-3)
CT (2-4)
CT (2-3)
CT (1-4)
10 k
10
100
1 k
100 k
10
100
1 k
10 k
100 k
frequency
f
(Hz)
frequency
f
(Hz)
C.T. – f (ch3)
C.T. – f (ch4)
0
−20
−40
−60
−80
0
−20
−40
−60
−80
V
R
V
R
= 13.2 V
= 4 Ω
V
R
V
R
= 13.2 V
CC
CC
L
= 4 Ω
L
= 0.775 Vrms (0dBm)
= 0.775 Vrms (0dBm)
OUT
OUT
= 620 Ω
= 620 Ω
G
G
CT (4-1)
CT (3-4)
CT (4-2)
CT (3-1)
CT (3-2)
10 k
CT (4-3)
10
100
1 k
100 k
10
100
1 k
10 k
100 k
frequency
f
(Hz)
frequency
f
(Hz)
V
– R
P – P
D OUT
NO
g
300
200
100
0
80
60
40
20
0
V
= 13.2 V
f = 1 kHz
CC
R
= 4 Ω
R
L
= 4 Ω
L
Filter:
20 Hz~20 kHz
4ch drive
18 V
13.2 V
1ch~4ch
V
= 9.0 V
CC
10
100
1 k
10 k
100 k
0
5
10
15
20
25
30
Signal source resistance
R
g
(Ω)
Output power
P
(W)
OUT
14
2006-11-30
TB2923HQ
Package Dimensions
Weight: 7.7 g (typ.)
15
2006-11-30
TB2923HQ
• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current
can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition,
depending on the method of use and usage conditions, if over current continues to flow for a long time after
operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to
not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC chip.
In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of silicon
rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and heat sink
installation, refer to individual technical datasheets or IC databooks.
16
2006-11-30
TB2923HQ
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
17
2006-11-30
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