TB6588FG [TOSHIBA]
3-Phase Full-Wave PWM Driver for Sensorless DC Motors; 3相全波PWM驱动器,用于无传感器直流电动机型号: | TB6588FG |
厂家: | TOSHIBA |
描述: | 3-Phase Full-Wave PWM Driver for Sensorless DC Motors |
文件: | 总20页 (文件大小:283K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TB6588FG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB6588FG
3-Phase Full-Wave PWM Driver for Sensorless DC Motors
The TB6588FG is a three-phase full-wave PWM driver for
sensorless brushless DC (BLDC) motors. It controls rotation speed
by changing the PWM duty cycle, based on the voltage of an
analog control input.
Features
•
•
•
Sensorless drive in three-phase full-wave mode
PWM chopper control
Controls the PWM duty cycle, based on an analog input
(7-bit ADC)
Weight: 0.79 g (typ.)
•
•
•
•
•
•
•
•
•
•
Output current: I
= 1.5 A typ. (2.5 A max)
OUT
Power supply: V = 7 to 42 V (50 V max)
M
Overcurrent protection
Forward and reverse rotation
Lead angle control (0°, 7.5°, 15°, 30°)
Overlapping commutation
Rotation speed detecting signal
DC excitation mode to improve starting characteristics
Adjustable DC excitation time and forced commutation time for a startup operation
Forced commutation frequency control: f /(6 × 216), f /(6 × 217), f /(6 × 218), f /(6 × 219)
osc
osc
osc
osc
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TB6588FG
Pin Assignment
VM1
1
2
3
4
5
6
7
8
9
36
35
34
33
32
31
30
29
28
VM3
U
V
N.C.
LA1
CW_CCW
EN
LA2
FPWM
FST1
FST2
FG_OUT
IR3
N.C.
FMAX
SEL_LAP
IR1
Fin
Fin
IR2
10
11
12
13
14
15
16
17
18
27
26
25
24
23
22
21
20
19
OSC_R
OSC_C
N.C.
W
PGND
OC
IP
START
SC
WAVEP
WAVEM
VM2
VSP
VREF
WAVE
SGND2
SGND1
2
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TB6588FG
Pin Description
Pin No.
1
Symbol
VM1
I/O
Description
Motor power supply pin (V = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the
M
⎯
IC.
2
3
U
V
O
O
U-phase output
V-phase output
Rotation direction select input (This pin has a pull-up resistor.)
4
CW_CCW
I
H or open: Clockwise (U → V → W)
L:
Counterclockwise (U → W → V)
Protection enable input (This pin has a pull-up resistor.)
This input determines whether or not to enable the protection functionality when either of the
following conditions is true:
5
EN
I
a) the maximum commutation frequency is exceeded.
b) the rotation speed falls below the forced commutation frequency.
H or open: Protection functionality enabled
L:
Protection functionality disabled
6
7
N.C.
⎯
No-connect
Selects the upper limit of the maximum commutation frequency. (This pin has a pull-up resistor.)
Maximum commutation frequency (f
H or open: f
L:
): cycles per second equivalent to an electrical degree
MAX
FMAX
I
/3 × 211
/3 × 212
Example: f
Example: f
0.8 kHz @ f
0.4 kHz @ f
= 5 MHz
= 5 MHz
∼
∼
f
f
MAX
MAX
osc
osc
MAX
MAX
osc
osc
∼
∼
f
Overlapping commutation select pin (This pin has a pull-up resistor.)
H or open: 120°commutation
8
SEL_LAP
I
L:
Overlapping commutation
9
IR1
IR2
Connection pins for an output shunt resistor
(IR1 and IR2 are connected together inside the IC. However, IR3 is not connected to IR1 or IR2
inside the IC; these three pins must be connected together externally.)
O
10
11
12
13
N.C.
W
⎯
O
No connect
W-phase output
Power ground pin
PGND
⎯
Overcurrent detection input (This pin has a pull-down resistor.)
All PWM output signals are stopped when OC ≥ 0.5 V (typ).
14
OC
I
15
16
WAVEP
WAVEM
I
I
Positive (+) position signal input
Negative (−) position signal input
Motor power supply pin (V = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the
M
17
VM2
⎯
⎯
IC.
18
19
SGND1
SGND2
Signal ground pin (SGND1 and SGND2 are connected together inside the IC.)
Position signal output
Provides a majority of the voltages of the three phase signals.
20
21
WAVE
VREF
O
O
Reference voltage output; V
= 5 V (typ.)
REF
Duty cycle/motor speed control input (This pin has a pull-down resistor.)
0 ≤ V < V (L):
Duty = 0%
SP
AD
22
VSP
I
V
V
(L) ≤ V ≤ V (H):
Sets the PWM duty cycle, based on the analog input.
≈100% duty cycle (127/128)
AD
AD
SP
AD
(H) < V ≤ V
:
SP
REF
Connection pin for a capacitor to set the startup commutation time and the ramp-up time for the
on state.
23
SC
I
DC excitation time setting pins
24
25
START
IP
O
I
When V ≥ 1 V (typ.), START is driven low, starting DC excitation. When the IP voltage has
SP
reached V
/2, the TB6588FG switches to forced commutation mode.
REF
OSC_C:
OSC_R:
Connection pins for the oscillator capacitor
Connection pins for the oscillator resistor
26
27
OSC_C
OSC_R
⎯
∼
5.25 MHz (typ.) when OSC_C = 100 pF and
Example: Internal oscillating frequency (f
)
osc
OSC_R = 20 kΩ
Connection pin for an output shunt resistor
28
IR3
O
(IR1 and IR2 are connected together inside the IC. However, IR3 is not connected to IR1 or IR2
inside the IC; these three pins must be connected together externally.)
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TB6588FG
Pin No.
29
Symbol
I/O
O
Description
Rotation speed output pin (open-drain)
This output is held low at startup and when an abnormality is detected. In sensorless mode,
pulses are generated at 3 ppr according to the back-EMF.
FG_OUT
Note: 3 ppr = 3 pulses per electrical degree (With a four-pole motor, six pulses are generated
per revolution.)
Forced commutation frequency select inputs (These pins have a pull-down resistor.)
30
31
FST2
FST1
Forced commutation frequency: cycles per second equivalent to an electrical degree
FST2: FST1 = H:
H:
f
f
f
f
f
/(6 × 216) → 12.7 Hz @ f
/(6 × 217) → 6.4 Hz @ f
= 5 MHz
∼
ST
ST
ST
ST
osc
osc
osc
osc
osc
osc
I
∼
FST2: FST1 = H:
L or Open: f
= 5 MHz
= 5 MHz
= 5 MHz
/(6 × 218) → 3.2 Hz @ f
/(6 × 219) → 1.6 Hz @ f
∼
FST2: FST1 = L or Open: H:
FST2: FST1 = L or Open: L or Open: f
f
osc
osc
∼
PWM frequency (f ) select input (This pin has a pull-down resistor.)
PWM
∼
∼
32
33
FPWM
LA2
I
I
H:
f
f
f
/128) → f
/256) → f
39 kHz @ f
osc
= 5 MHz
= 5 MHz
PWM
PWM
osc
osc
PWM
PWM
∼
∼
L or Open: f
19.5 kHz @ f
osc
Lead angle select input (These pins have a pull-up resistor.)
LA2: LA1 H or Open : H or Open : 30° lead angleI
LA2: LA1 H or Open : L
∼
−
∼
: 15° lead angle
: H or Open : 7.5° lead angle
−
∼
LA2: LA1
LA2: LA1
L
L
−
34
35
36
LA1
N.C.
VM3
∼
−
: L
: 0° lead angle
⎯
⎯
No connect
Motor power supply pin (V = 7 to 42 V). VM1, VM2 and VM3 are connected together inside the
M
IC.
Fin
This pin provides for thermal dissipation. Board traces should be designed, considering thermal
dissipation from the IC. (Since the fin and the package bottom are electrically connected, the Fin
pin should be connected to insulation or ground.)
Fin
Fin
⎯
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TB6588FG
Functional Description
1. Sensorless Drive Mode
Based on the analog voltage input for a startup operation, the rotor is aligned to a known position in DC
excitation mode. Then the forced commutation signal is generated to start the motor rotation. As the motor
rotates, the back-EMF occurs in each phase of the coil.
When a signal indicating the polarity of three phase voltage of the motor, including the back-EMF, is
detected at the position signal inputs (WAVEP, WAVEM), the motor driving signal is automatically switched
from the forced commutation PWM signal to the normal commutation PWM signal that is based on the
position signal input (back-EMF). Then, a BLDC motor starts running in sensorless commutation mode.
2. Startup Operation
At startup, no induced voltage is generated due to the stationary motor, and the rotor position cannot be
detected in sensorless mode. Therefore, the TB6588FG rotor is first aligned to a known position in DC
excitation mode for an appropriate period of time, and then the motor is started in forced commutation mode.
The DC excitation and forced commutation times are determined by external capacitors. These time settings
vary depending on the motor type and load, so that they should be adjusted experimentally.
V
SP
≥ 1.0 (V)
VSP
V
SP
V
AD (L)
SC
T
UP
T
UP
(typ.) = C × V /4.5 µA (s)
1 SP
START
V
REF
IP
V
REF
/2
V
SP
VSP
(a) (b)
GND
TB6588FG
SC
T
FIX
C
1
START
IP
(a): DC excitation time: T
(typ.) = 0.69 × C × R (s)
2 1
FIX
(b): Forced commutation time
R
1
C
2
The rotor is aligned to a known position specified in DC excitation mode for the period of (a), during which
the IP pin voltage decreases from V to V /2. The time constant for the period is determined by C and
REF
REF
2
R . Then, operation mode is switched to forced commutation mode for the period of (b) as shown above. The
1
duty cycles for DC excitation and forced commutation modes are determined according to the SC pin voltage.
When the motor rotation frequency exceeds the forced commutation frequency specified by FST1 and FST2,
the operation mode is switched to the sensorless mode. The duty cycle for sensorless mode is determined by
V
SP.
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TB6588FG
3. SC Signal Delay in Rotational Speed Control (V follow-up property of SC)
SP
The rotational speed and the starting and stopping of the motor are controlled based on an analog voltage at
the V input. However, the actual operation of the IC is determined by the voltage applied to the SC pin.
SP
The voltage at the SC pin equals the charging voltage of the capacitor C , which is determined by the
1
charging/discharging time of C . This causes a delay in the SC voltage level relative to the V input. When
SP
1
the voltage at the V pin rises from 1 to 4 V, the SC signal delay occurs as shown below.
SP
V
SPU
V
SPL
V
SPU
V
SPL
VSP
SC
T
UP
T
DOWN
•
•
Charging time of C (when accelerating): T
(typ.) = C × (V
SPU
− V
)/4.5 µA (s)
1
UP
1
SPL
Discharging time of C (when decelerating): T
(typ.) = C × (V
SPU
− V )/37 µA (s)
SPL
1
DOWN
1
Note: When the motor is stopped (V < 1 V), the capacitor C at the SC pin is instantly discharged.
SP
1
(The C is discharged through 2 kΩ (typ.) to GND.)
1
4. Forced Commutation Frequency
The forced commutation frequency at startup is determined as follows.
Since the optimal frequency varies depending on the motor type and load, it must be adjusted
experimentally.
The forced commutation frequency is determined by the value of external capacitor and resistor, and the
logic level of the FST1 and FST2 pins (These pins have a pull-down resistor).
/(6 × 216)
/(6 × 217)
/(6 × 218)
/(6 × 219)
∼
FST2: FST1 = H
FST2: FST1 = H
FST2: FST1 = L or Open : H
: H
: Forced commutation frequency f
ST osc
f
∼
: L or Open : Forced commutation frequency f
f
ST osc
∼
: Forced commutation frequency f
f
ST osc
∼
FST2: FST1 = L or Open : L or Open : Forced commutation frequency f
f
ST osc
5. PWM Frequency
The PWM frequency is determined by the value of the external capacitor and resistor, and the logic level of
the FPWM pin (which has a pull-down resistor).
FPWM: H or Open: f
FPWM: L or Open: f
= f /128
osc
= f /256
osc
PWM
PWM
The PWM frequency must be sufficiently high relative to the electrical frequency of the motor and within
the range permitted by the driver circuit.
The PWM turn the high-side output transistors off.
PWM signal
driving high-side
transistors
PWM signal
driving low-side
transistors
Motor terminal
voltage
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TB6588FG
6. Motor Speed Control Pin (VSP)
An analog voltage applied to the VSP pin is converted by a 7-bit AD converter and used to control the duty
cycle of the PWM.
0 ≤ V < V
SP
(L) → Duty cycle = 0%
AD
V
V
(L) ≤ V ≤ V
SP
(H) < V ≤ V
SP
(H) → Figure on the right (1/128 to 127/128)
→ Duty cycle ≈ 100% (127/128)
AD
AD
AD
REF
Duty Cycle
100%
0%
V
SP
V
AD
(L)
V
AD
(H)
7. Fault Protection Operation
The logic level of the EN pin determines whether to enable the protection functionality.
(The EN pin has a pull-up resistor.)
H or Open : Protection functionality enabled
L
: Protection functionality disabled
When a behavior as shown below is detected via the WAVEP and WAVEM pins, as the motor is deemed to be
in an abnormal state and the output transistors are turned off. About one second later, the motor is
restarted. The device begins cycling into and out of the protection mode if the abnormality persists.
•
The maximum commutation frequency is exceeded.
•
The rotation speed falls below the forced commutation frequency.
V
= 1 V or higher
SP
VSP
When the SC pin capacitor = 0.47 µF and
Output pin
START
ON
OFF
ON
V
SP
= 4 V
CSC ×(VSP−1)
(a): T
=
OFF
i
0.47μF ×(4 −1)
1.6μA
=
= 880 ms (typ.)
IP
(a)
SC
V
SP
1 V
Fault detected
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2008-4-25
TB6588FG
8. Motor Position Detection Error
The position detection is performed synchronizing with the PWM signal generated in the IC. Thus, a
position detection error related to the PWM signal frequency is induced. Care should be taken when the
TB6588FG is used in high-speed motor applications.
The detection is performed on the falling edge of the PWM signal. An error is recognized when the terminal
voltage exceeds the reference voltage.
Detection lag < 1/f
f : PWM frequency = f /256, f /128
p osc osc
f
: Internal oscillating frequency
osc
p
Output: ON
Internal PWM signal
Terminal voltage
Terminal voltage
Reference voltage
Position detection
Ideal detection timing
Actual detection timing
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TB6588FG
9. Lead Angle Control
The TB6588FG runs in forced commutation mode with a lead angle of 0° at startup. After switching to
normal commutation mode, the lead angle is automatically changed to the value set by the LA1 and LA2
pins.
U
V
W
Induced voltage
PWM signal
30°
22.5°
15°
(1) Lead angle of 0°
U
V
W
(2) Lead angle of 7.5°
U
V
W
(3) Lead angle of 15°
U
V
W
0°
(4) Lead angle of 30°
U
V
W
10. Overlapping Commutation Control
When SEL_LAP = High, the TB6588FG runs in 120° commutation mode; When SEL_LAP = Low, it runs in
overlapping commutation mode. In overlapping commutation mode, there occurs an overlapping period due
to the lengthened commutation time between the zero cross point and the 120° commutation timing upon
PWM signal switching as shown in the shaded areas. These periods vary depending on the lead angle
setting.
U
V
W
Induced voltage
PWM signal
30°
22.5°
15°
(1) Lead angle of 0°
U
V
W
(2) Lead angle of 7.5°
U
V
W
(3) Lead angle of 15°
U
V
W
0°
(4) Lead angle of 30°
U
V
W
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TB6588FG
11. Thermal Shutdown (TSD) Circuit (Note)
When the die temperature exceeds the rated TSD temperature, the TSD circuit detects it as the abnormal
state of the motor and the output transistors are turned off.
At the same time, START and SC are set High and Low respectively.
After the TSD circuit is disabled, the TB6588FG restarts its operation following the startup sequence.
V
= 1 V or higher
SP
VSP
Output pin
START
ON
OFF
ON
IP
SC
V
SP
1 V
GND
TSD
165°C
TSD Return
150°C
(Reference value) (Reference value)
Note: The TSD circuit is not intended to provide protection against all abnormal conditions. Therefore, the
TB6588FG should exit the abnormal state immediately after the TSD circuit is enabled.
If the device is used beyond the maximum ratings, the TSD circuit may not operate properly, or the device
may break down before the protection circuit is activated.
Also, if the motor keeps running due to inertia after the TSD circuit is activated, the startup sequence may
lose synchronization with the motor rotation, which may prevent the motor from restarting after the TSD
circuit is disabled.
Thus, for a restart operation after the TSD circuit operation, it should be ensured that the motor be stopped
once before being restarted.
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TB6588FG
12. Overcurrent Protection Circuit (Note)
The overcurrent protection circuit limits the current by turning the high-side output transistors off. The
output current is monitored as a voltage across R . If it exceeds the rated V
1
voltage (0.5 V (typ.)), the
OC
protection functionality is enabled.
The current value that trips the overcurrent protection circuit is calculated as:
= Overcurrent detection voltage V /Resistor value R
I
OUT
OC
1
R and C used as an RC filter should be adjusted properly to prevent the malfunction of the overcurrent
2
2
protection circuit due to the PWM switching noise.
∼
Example: When R = 0.33 [Ω], I (typ.) = 0.5 [V] (typ.)/0.33 [Ω] 1.5 [A]
1
OUT
VM1 VM2
VM3
TB6588FG
U
V
200 kΩ
W
V
OC
= 0.5 V
OC IR3
R
IR1
IR2
2
I
OUT
R
1
C
2
Note: The overcurrent protection circuit (normally a current limiter) is not intended to provide protection against
all abnormal conditions. Therefore, the TB6588FG should exit the abnormal state immediately after the
overcurrent protection circuit is enabled.
If the device is used beyond the maximum ratings, the overcurrent protection circuit may not operate
properly, or the device may break down before the protection circuit is activated.
Also, if the overcurrent still persists after the protection circuit is activated, the device may be destroyed
due to overheating.
If the overcurrent protection circuit remains active, the timing of the position detection that is performed
synchronously with the PWM signal changes. Thus, the motor may lose synchronization. Therefore, the
overcurrent protection circuit must be configured not to operate under normal operation.
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TB6588FG
Input Equivalent Circuits
Some parts are omitted from the equivalent circuit diagrams or simplified for the sake of simplicity.
1. VSP
2. SC
V
REF
V
V
REF
REF
VSP
SC
4. CW_CCW, LA1, LA2, FMAX, SEL_LAP,
EN
3. FPWM, FST1, FST2
V
REF
V
REF
V
REF
Input
Input
5. WAVE, WAVEM, WAVEP
6. OC
V
REF
V
REF
200 kΩ
WAVEM
WAVEP
OC
WAVE
7. FG_OUT
8. U, V, W
V ,V ,V
M1 M2 M3
V
REF
W
V
U
100 Ω
FG_OUT
IR3
IR2
IR1
9. IP
10. START
V
REF
V
REF
100 Ω
IP
START
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2008-4-25
TB6588FG
11. OSC_R,OSC_C
12. VREF
V
V
V
V
REF
V
REF REF REF
V
M
REF
V
M
VREF
OSC_R
OSC_C
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2008-4-25
TB6588FG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Power supply voltage
Symbol
Rating
50
Unit
V
V
M
V
V
(Note 1) −0.3 to V
+ 0.3
REF
IN1
Input voltage
V
V
(Note 2)
OUT
−0.3 to 30
2.5 (Note 3)
1.3 (Note 4)
3.2 (Note 5)
−30 to 105
−55 to 150
IN2
I
PWM signal output current
Power dissipation
P
W
D
Operating temperature
Storage temperature
T
opr
°C
°C
T
stg
Note 1:
V
is applicable to the voltage at the following pins: FPWN, FMAX, VSP, CW_CCW, LA1, LA2, OC,
IN1
SEL_LAP, FST1, FST2 and EN
Note 2:
V
IN2
is applicable to the voltage at the following pins: WAVEP, WAVEM
Note 3: Output current may be limited by the ambient temperature or a heatsink.
The maximum junction temperature should not exceed T
= 150°C.
jmax
Note 4: Measured for the IC only. (Ta = 25°C)
Note 5: Measured when mounted on the board. (140 mm × 70 mm × 1.6 mm, Cu 50%, R
: 39°C/W)
th (j-a)
Operating Ranges (Ta = −30 to 105°C)
Characteristics
Power supply voltage
Symbol
Min
7
Typ.
Max
42
Unit
V
M
24
V
V
Input voltage
V
(Note 1) GND
⎯
V
REF
IN1
Package Power Dissipation
P
D
– Ta
3.5
(3)
3
2.5
2
(2)
(1)
1.5
1
0.5
0
0
25
50
75
100
125
150
Ambient Temperature Ta (°C)
(1)
R
only (96°C/W)
th (j-a)
(2) When mounted on the board (114 mm × 75 mm × 1.6 mm, Cu 20% , R
(3) When mounted on the board (140 mm × 70 mm × 1.6 mm, Cu 50% , R
: 65°C/W)
: 39°C/W)
th (j-a)
th (j-a)
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2008-4-25
TB6588FG
Electrical Characteristics (Ta = 25 °C, V = 24 V, unless otherwise specified)
M
Characteristics
Symbol
IM
Test Conditions
= 0 V, OSC_C = 0 V
Min
⎯
Typ.
3.5
Max
6
Unit
mA
mA
Static power supply current at V
V
V
M
SP
Dynamic power supply current at
= 2.5 V, Output: Open
(OSC_C = 100 pF,OSC_R = 20 kΩ)
SP
IM
⎯
4.5
8
(opr)
V
M
V
= V , SEL_LAP,FMAX
IN
REF
I
(H)
(L)
⎯
0
1
IN-1
CW_CCW, LA1, LA2, EN
V
IN
= 0 V, SEL_LAP,FMAX
I
−75
−50
⎯
IN-1
CW_CCW, LA1, LA2, EN
I
I
(H)
(L)
(H)
(L)
V
IN
V
IN
V
IN
V
IN
= V
, OC,FST1, FST2, FPWM
⎯
−1
⎯
−1
50
0
75
⎯
IN-2
REF
I
= 0 V, OC, FST1, FST2, FPWM
= V , V
IN-2
Input current
µA
90
0
150
⎯
IN-3
REF SP
I
= 0 V, V
SP
IN-3
WAVEM; WAVEM = V /2,WAVEP= 0V
M
I
(H)
(L)
⎯
0
0.25
IN-4
WAVEP; WAVEM = V /2,WAVEP = V
M
M
WAVEM; WAVEM= V /2,WAVEP = V
M
M
I
-0.25
−6
-0.1
4
⎯
IN-4
WAVEP; WAVEM = V /2,WAVEP = 0V
M
Input offset voltage
Input voltage
V
WAVE; WAVEP-WAVEM
14
mV
V
INO
SEL_LAP, CW_CCW, LA1, LA2, FMAX,
FST1, FST2, EN, FPWM
V
(H)
(L)
3.5
⎯
V
IN-1
REF
SEL_LAP, CW_CCW, LA1, LA2, FMAX,
FST1, FST2, EN, FPWM
V
GND
⎯
1.5
IN-1
Input voltage hysteresis
V
IP
⎯
GND
⎯
0.45
⎯
0
⎯
0.5
10
V
V
H
Low-level FG_OUT output voltage
FG_OUT leakage current
V
I
=1 mA
= 5.5 V
FG_OUT
FG_OUT
FG_OUT
IL
V
µA
FG_OUT
R
(H)
(L)
I
I
= 1.5 A
U, V, W
U, V, W
U, V, W
U, V, W
⎯
0.3
0.3
0
0.35
0.35
1
ON
OUT
OUT
Output ON-resistance
Output leakage current
Ω
R
= −1.5 A
⎯
ON
I
(H)
V
V
V
= 0 V
⎯
L
OUT
OUT
SP
µA
I
(L)
= 50 V
⎯
0
1
L
FPWM = L
V
(L)
1.0
1.2
1.4
AD
AD
(OSC_C = 100 pF, OSC_R = 20 kΩ)
PWM input voltage
V
V
(H)
3.9
3.0
⎯
4.1
4.5
880
0.5
4.3
6.5
⎯
C
SC
charge current
I
SC
V = 2.5 V
SP
µA
ms
V
SC
Fault recovery time
T
V
= 4 V, SC pin = 0.47 µF
OFF
SP
Overcurrent detection voltage
V
OC
0.46
0.54
OC
FPWM = H
F
H
L
36
18
40
20
44
22
C
(OSC_C = 100 pF, OSC_R = 20 kΩ)
PWM frequency
kHz
FPWM = L
(OSC_C = 100 pF, OSC_R = 20 kΩ)
F
C
Thermal shutdown temperature
(Design target only.)
TSD
150
165
180
Thermal shutdown
°C
V
Thermal shutdown hysteresis
(Design target only.)
TSDhys
⎯
15
5
⎯
V
REF
output voltage
V
REF
IV = −1 mA
REF
4.5
5.5
15
2008-4-25
TB6588FG
Application Circuit Example
MCU
10 kΩ
VREF
Reference voltage circuit
FG_OUT
FPWM
VM1 VM2 VM3
VSP
SC
Speed control
input (analog
voltage)
Startup time
setting
7-bit AD
converter
PWM
control
START
IP
PWM
U
V
signal
generator
1-phase excitation
control circuit
V
REF
FST1
FST2
FMAX
W
Startup commutation
frequency setting
Timing
setting
SBD
IR3
IR2
Maximum commutation
frequency setting
IR1
LA1
LA2
Overcurrent
protection
circuit
TSD
OC
Lead angle setting
CW_CCW
SEL_LAP
EN
R
1
WAVEP
WAVEM
Clock
generation
Position
detection circuit
SGND2 SGND1 PGND Fin
OSC_C OSC_R
WAVE
Note 1: Utmost care is necessary in the design of the output, V , and GND lines since the IC may be destroyed in case of a short-circuit across outputs, a short-circuit to power supply, or a short-circuit to
M
ground.
Note 2: The above application circuit including constant values is provided only as a guide. Since each value may vary depending on the motor type, the optimal values must be determined experimentally.
Note 3: C , C and R should be connected, if necessary, to prevent malfunction due to noise.
1
2
1
Note 4: A Schottky barrier diode (SBD; Toshiba CMS15) must be connected externally between W and GND to ensure smooth current recovery upon output switching.
16
2008-4-25
TB6588FG
Package Dimensions
Weight: 0.79 g (typ.)
17
2008-4-25
TB6588FG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
18
2008-4-25
TB6588FG
Points to Remember on Handling of ICs
(1) Over current protection circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs
under all circumstances. If the Over current protection circuits operate against the over current, clear
the over current status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the over current protection circuit to not operate properly or IC breakdown before operation.
In addition, depending on the method of use and usage conditions, if over current continues to flow for
a long time after operation, the IC may generate heat resulting in breakdown.
(2) Thermal shutdown circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal
shutdown circuits operate against the over temperature, clear the heat generation status immediately.
Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings
can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation.
(3) Heat radiation design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any
time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(4) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
(5) Damage due to Short-Circuits Between Neighboring Pin
Short-circuits between pins 1 and 2, pins 3 and 4 and pins 12 and 13 cause permanent damage to the
TB6588FG. As a result, a large current continuously flow into the device, leading to smoke and
possibly fire. To avoid this, the device application should be designed and adjusted properly, including
the external fail-safe mechanism, such as power supply fuses and overcurrent protection circuitry for
power supply. To minimize the effect of such a current flow in case of damage, ensure that the fuse
capacity, fusing time and overcurrent protection circuitry are properly adjusted.
19
2008-4-25
TB6588FG
RESTRICTIONS ON PRODUCT USE
070122EBA_R6
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third
parties. 070122_C
• Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of
controlled substances.
Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and
regulations. 060819_AF
• The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E
20
2008-4-25
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