TC58NVM9S3CTA00 [TOSHIBA]
TC58NVM9S3CTA00;
TOSHIBA 
SEMICONDUCTOR GENERAL CATALOG
Memories and Storage Devices
NAND Flash Memory
1
2009-8 SCE0004I
NAND Flash Memory
SLC Small Block
Access Time
Program/Erase Time (typ.)
Operating
Temperature
(°C)
Page Size
(bit)
Block Size
(bit)
Power Supply
(V)
Capacity
Part Number
Package
Serial cycle 1st access Program Time Block Erase Time
(min) (ns) (max) (µs)
(ms)
0.3
(ms)
512 Mbits TC58DVM92A3TA00
512 Mbits TC58DVM92A3BAJW
1 Gbits TC58DVG02A3TA00
(512 + 16) x 8
(512 + 16) x 8
(512 + 16) x 8
(16K + 512) x 8
(16K + 512) x 8
(16K + 512) x 8
50
50
50
30
30
30
3
3
3
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
0 to 70
−40 to 85
0 to 70
TSOP I 48-P-1220-0.50
P-TFBGA63-0813-0.80AZ
TSOP I 48-P-1220-0.50
0.3
0.3
•
Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
SLC Large Block Middle Capacity
Access Time
Program/Erase Time (typ.)
Power
Supply Temperature
(V)
Operating
Page Size
(bit)
Block Size
(bit)
Capacity
Part Number
Package
Serial cycle 1st access Program Time Block Erase Time
(min) (ns) (max) (µs)
(°C)
(ms)
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
0.3
(ms)
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
2.5
512 Mbits TC58NVM9S3CTA00
512 Mbits TC58NVM9S3CBAJW
1 Gbits TC58NVG0S3CTA00
1 Gbits TC58NVG0S3CBAJ5
1 Gbits TC58NVG0S3ETA00
2 Gbits TC58NVG1S3CTA00
2 Gbits TC58NVG1S3CBAJX
2 Gbits TC58NVG1S3ETA00
4 Gbits TC58NVG2S3ETA00
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(2048 + 64) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
(128K + 4K) x 8
50
50
50
50
25
50
50
25
25
30
30
30
30
30
30
30
30
30
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
0 to 70
−40 to 85
0 to 70
TSOP I 48-P-1220-0.50
P-TFBGA63-0813-0.80AZ
TSOP I 48-P-1220-0.50
−40 to 85 P-TFBGA63-0911-0.80CZ
*
0 to 70
0 to 70
TSOP I 48-P-1220-0.50
TSOP I 48-P-1220-0.50
P-TFBGA63-1013-0.80AZ
TSOP I 48-P-1220-0.50
TSOP I 48-P-1220-0.50
*: New product
−40 to 85
0 to 70
*
*
0 to 70
•
Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
SLC Large Capacity
Access Time
Program/Erase Time (typ.)
Operating
Temperature
(°C)
Page Size
(bit)
Block Size
(bit)
Power Supply
(V)
Capacity
Part Number
Package
Serial cycle 1st access Program Time Block Erase Time
(min) (ns) (max) (µs)
(ms)
0.3
(ms)
8 Gbits TC58NVG3S0DTG00
16 Gbits TH58NVG4S0DTG20
32 Gbits TH58NVG5S0DTG20
(4096 + 218) x 8
(4096 + 218) x 8
(4096 + 218) x 8
(256K + 13.6K) x 8
(256K + 13.6K) x 8
(256K + 13.6K) x 8
30
30
30
30
30
30
2
2
2
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
0 to 70
0 to 70
0 to 70
TSOP I 48-P-1220-0.50
TSOP I 48-P-1220-0.50
TSOP I 48-P-1220-0.50
0.3
0.3
•
Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
2
2009-8 SCE0004I
1
e-MMC*
The e-MMC series has an interface compatible with the JEDEC/MMCA V4.3 high-speed memory card standard, which simplifies its use as an embedded MMC memory (e-MMCTM-compatible) in end products.
Power Supply
Operating
Temperature
(°C)
Speed
(MHz)
Capacity
Part Number
Package
VCC
(V)
VCCQ
(V)
2 GBytes
4 GBytes
8 GBytes
16 GBytes
32 GBytes
THGBM1G4D1EBAI7
THGBM1G5D2EBAI7
THGBM1G6D4EBAI4
THGBM1G7D4EBAI2
THGBM1G8D8EBAI2
52
52
52
52
52
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
1.7 to 1.95, 2.7 to 3.6
1.7 to 1.95, 2.7 to 3.6
1.7 to 1.95, 2.7 to 3.6
1.7 to 1.95, 2.7 to 3.6
1.7 to 1.95, 2.7 to 3.6
−25 to 85
−25 to 85
−25 to 85
−25 to 85
−25 to 85
P-FBGA169-1216-0.50A4
P-FBGA169-1216-0.50A4
P-FBGA169-1218-0.50A4
P-FBGA169-1418-0.50A4
P-FBGA169-1418-0.50A4
•
Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
1
eSD (Embedded SD)*
The eSD series has an interface compatible with the SDA V2.0 (SDHC) SD card standard, which simplifies its use as an embedded SD-interface memory.
Speed
(MHz)
Power Supply
(V)
Operating Temperature
(°C)
Capacity
Part Number
Package
1 GByte
2 GByte
4 GByte
8 GByte
16 GByte
32 GByte
THGVS4G3D1EBAI8
THGVS4G4D1EBAI4
THGVS4G5D2EBAI4
THGVS4G6D4EBAI4
THGVS4G7D8EBAI0
THGVS4G8D8EBAI2
50
50
50
50
50
50
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
2.7 to 3.6
−25 to 85
−25 to 85
−25 to 85
−25 to 85
−25 to 85
−25 to 85
P-FBGA153-1113-0.50A4
P-FBGA169-1218-0.50A4
P-FBGA169-1218-0.50A4
P-FBGA169-1218-0.50A4
P-FBGA169-1218-0.50A4
P-FBGA169-1418-0.50A4
•
Contact the Toshiba sales representative for information about RoHS compliance before you purchase any components.
*
1: NAND flash memories with an integrated controller, which supports error correction, wear leveling, bad block management and so on. This eliminates the need for external control specifically required for NAND flash
and simplifies use of eSD.
3
2009-8 SCE0004I
(As of April 01, 2009)
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America
Toshiba Electronics Europe GmbH
Toshiba Electronics Asia, Ltd.
Electronic Components, Inc.
• Headquarters-Irvine, CA
Tel: (949)623-2900 Fax: (949)474-1330
• Düsseldorf Head Office
• Hong Kong Head Office
Tel: (0211)5296-0 Fax: (0211)5296-400
Tel: 2375-6111 Fax: 2375-0969
• France Branch
Tel: (1)48-12-48-12 Fax: (1)48-94-51-15
• Beijing Office
Tel: (010)6590-8796 Fax: (010)6590-8791
• Buffalo Grove (Chicago)
Tel: (847)484-2400 Fax: (847)541-7287
• Italy Branch
Tel: (039)68701 Fax: (039)6870205
• Chengdu Office
Tel: (028)8675-1773 Fax: (028)8675-1065
• Duluth, GA (Atlanta)
Tel: (770)931-3363 Fax: (770)931-7602
• Spain Branch
Tel: (91)660-6798 Fax:(91)660-6799
• Qingdao Office
Tel: (532)8579-3328 Fax: (532)8579-3329
• San Jose Engineering Center, CA
Tel: (408)526-2400 Fax:(408)526-2410
• U.K. Branch
Tel: (0870)060-2370 Fax: (01252)53-0250
Toshiba Electronics Shenzhen Co., Ltd.
Tel: (0755)2399-6897 Fax: (0755)2399-5573
• Wixom (Detroit)
Tel: (248)347-2607 Fax: (248)347-2602
• Sweden Branch
Tel: (08)704-0900 Fax: (08)80-8459
Toshiba Electronics (Shanghai) Co., Ltd.
• Shanghai Head Office
Tel: (021)6841-0666 Fax: (021)6841-5002
Toshiba Electronics do Brasil Ltda.
Tel: (011)2539-6681 Fax: (011)2539-6675
Toshiba Electronics Asia (Singapore) Pte. Ltd.
Tel: (6278)5252 Fax: (6271)5155
Toshiba India Private Ltd.
Tel: (011)2331-8422 Fax: (011)2371-4603
• Hangzhou Office
Tel: (0571)8717-5004 Fax: (0571)8717-5013
Toshiba Electronics Service (Thailand) Co., Ltd.
Tel: (02)501-1635 Fax: (02)501-1638
• Nanjing Office
Tel: (025)8689-0070 Fax: (025)8689-0125
Toshiba Electronics Trading (Malaysia) Sdn. Bhd.
• Kuala Lumpur Head Office
Tel: (03)5631-6311 Fax: (03)5631-6307
Toshiba Electronics (Dalian) Co., Ltd.
Tel: (0411)8368-6882 Fax: (0411)8369-0822
• Penang Office
Tel: (04)226-8523 Fax: (04)226-8515
Tsurong Xiamen Xiangyu Trading Co., Ltd.
Tel: (0592)226-1398 Fax: (0592)226-1399
Toshiba Electronics Philippines, Inc.
Tel: (02)750-5510 Fax: (02)750-5511
Toshiba Electronics Korea Corporation
• Seoul Head Office
Tel: (02)3484-4334 Fax: (02)3484-4302
• Daegu Office
Tel: (053)428-7610 Fax: (053)428-7617
Toshiba Electronics Taiwan Corporation
• Taipei Head Office
Tel: (02)2508-9988 Fax: (02)2508-9999
• Kaohsiung Office
Tel: (07)237-0826 Fax: (07)236-0046
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware,
software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is
permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and
for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could
cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and
comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used
with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use
of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs,
algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES
NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics
appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily
high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
(“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment
used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and
escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
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estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM
EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR
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Product may include products using GaAs (Gallium Arsenide). GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do
not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use,
stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology
may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related
software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Product may include products subject to foreign exchange and foreign trade control laws.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all
applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for
damages or losses occurring as a result of noncompliance with applicable laws and regulations.
In addition to the above, the following are applicable only to development tools.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Use the Product in a way which minimizes risk and avoid situations
in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. For using the Product, customers
must also refer to and comply with the latest versions of all relevant TOSHIBA information, including without limitation, this document, the instruction manual, the specifications, the
data sheets for Product.
Product is provided solely for the purpose of performing the functional evaluation of a semiconductor product. Please do not use Product for any other purpose, including without
limitation, evaluation in high or low temperature or humidity, and verification of reliability.
Do not incorporate Product into your products or system. Products are for your own use and not for sale, lease or other transfer.
2009
2009-8 SCE0004I
Semiconductor Company
Website: http://www.semicon.toshiba.co.jp/eng
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