TLP3320(TP15,F [TOSHIBA]
Transistor Output SSR;
| 型号： | TLP3320(TP15,F |
| 厂家： | 
TOSHIBA |
| 描述： | Transistor Output SSR 输出元件 光电 |
| 文件： | 总7页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP3320
Photocouplers Photorelay
TLP3320
1. Applications
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•
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High-Speed Memory Testers
High-Speed Logic IC Testers
Radio-Frequency Measuring Instruments
ATE (Automatic Test Equipment)
2. General
The TLP3320 is a photorelay in a 4-pin USOP that consists of a photo MOSFET optically coupled with an infrared
light emitting diode.
3. Features
(1) Normally open (1-Form-A)
(2) OFF-state output terminal voltage: 100 V (min)
(3) Trigger LED current: 3 mA (max)
(4) ON-state current: 100 mA (max)
(5) ON-state resistance: 8 Ω (typ.), 14 Ω (max)
(6) OFF-state Capacitance: 6 pF (typ.), 8 pF (max)
(7) Isolation voltage: 1000 Vrms (min)
(8) Safety standard
UL-approved: UL1577, File No.E67349
4. Packaging and Pin Assignment
1: Anode
2: Cathode
3: Drain
4: Drain
11-2C1S
Start of commercial production
2011-11
©2017-2018
2018-09-21
Rev.3.0
1
Toshiba Electronic Devices & Storage Corporation
TLP3320
5. Internal Circuit
6. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Rating
Unit
LED
Input forward current
IF
∆IF/∆Ta
VR
50
-0.5
mA
mA/
V
Input forward current derating
Input reverse voltage
(Ta ≥ 25 )
(Ta ≥ 25 )
5
Input power dissipation
Input power dissipation derating
Junction temperature
PD
50
mW
mW/
∆PD/∆Ta
Tj
-0.5
125
Detector OFF-state output terminal voltage
ON-state current
VOFF
ION
100
V
100
mA
ON-state current derating
ON-state current (pulsed)
Output power dissipation
Output power dissipation derating
Junction temperature
(Ta ≥ 25 )
∆ION/∆Ta
IONP
PO
-1.0
mA/
mA
(t = 100 ms, Duty = 1/10)
300
96
mW
mW/
(Ta ≥ 25 )
∆PO/∆Ta
Tj
-0.96
125
Common Storage temperature
Operating temperature
Tstg
-40 to 125
-40 to 85
260
Topr
Lead soldering temperature
Isolation voltage
(10 s)
Tsol
AC, 60 s, R.H. ≤ 60 %
BVS
(Note 1)
1000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
Caution:This device is sensitive to electrostatic discharge (ESD). Extreme ESD conditions should be guarded against
by using proper antistatic precautions for the worktable, operator, solder iron, soldering equipment and so on.
7. Recommended Operating Conditions (Note)
Characteristics
Symbol
Note
Min
Typ.
Max
Unit
Supply voltage
VDD
IF
5
7.5
80
20
V
Input forward current
ON-state current
mA
ION
Topr
-20
100
65
Operating temperature
Note: The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
©2017-2018
Toshiba Electronic Devices & Storage Corporation
2018-09-21
Rev.3.0
2
TLP3320
8. Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
IF = 10 mA
Min
Typ.
Max
Unit
LED
Input forward voltage
Input reverse current
Input capacitance
VF
IR
1.0
1.15
1.3
10
V
VR = 5 V
µA
pF
pA
pF
Ct
V = 0 V, f = 1 MHz
VOFF = 100 V
15
Detector OFF-state current
Output capacitance
IOFF
COFF
200
8
V = 0 V, f = 100 MHz, t < 1s
6
9. Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Trigger LED current
Symbol
Note
Test Condition
ION = 100 mA
Min
Typ.
Max
Unit
mA
IFT
IFC
0.1
0.5
8
3
Return LED current
ON-state resistance
IOFF = 10 µA
14
RON
ION = 100 mA, IF = 5 mA, t < 1 s
Ω
10. Isolation Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Total capacitance (input to output)
Isolation resistance
CS
RS
(Note 1) VS = 0 V, f = 1 MHz
(Note 1) VS = 500 V, R.H. ≤ 60 %
(Note 1) AC, 60 s
0.4
1014
pF
Ω
5 × 1010
1000
Isolation voltage
BVS
Vrms
Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are
shorted together.
11. Switching Characteristics (Unless otherwise specified, Ta = 25 )
Characteristics
Symbol
Note
Test Condition
Min
Typ.
Max
Unit
Turn-on time
Turn-off time
tON
See Fig. 11.1.
RL = 200 Ω, VDD = 20 V, IF = 5 mA
120
180
300
300
µs
tOFF
Fig. 11.1 Switching Time Test Circuit and Waveform
©2017-2018
Toshiba Electronic Devices & Storage Corporation
2018-09-21
Rev.3.0
3
TLP3320
12. Characteristics Curves and Circuit Connections
12.1. Characteristics Curves (Note)
Fig. 12.1.1 IF - Ta
Fig. 12.1.2 ION - Ta
Fig. 12.1.3 IF - VF
Fig. 12.1.4 ION - VON
Fig. 12.1.5 RON - Ta
Fig. 12.1.6 IFT - Ta
©2017-2018
2018-09-21
Rev.3.0
4
Toshiba Electronic Devices & Storage Corporation
TLP3320
Fig. 12.1.7 tON, tOFF - IF
Fig. 12.1.8 tON, tOFF - Ta
Fig. 12.1.9 IOFF - VOFF
Fig. 12.1.10 COFF/COFF(0 V) - VOFF
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
©2017-2018
Toshiba Electronic Devices & Storage Corporation
2018-09-21
Rev.3.0
5
TLP3320
Package Dimensions
Unit: mm
Weight: 0.03 g (typ.)
Package Name(s)
TOSHIBA: 11-2C1S
©2017-2018
Toshiba Electronic Devices & Storage Corporation
2018-09-21
Rev.3.0
6
TLP3320
RESTRICTIONS ON PRODUCT USE
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Hardware, software and systems described in this document are collectively referred to as "Product".
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TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
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ThoughTOSHIBAworkscontinuallytoimproveProduct'squalityandreliability,Productcanmalfunctionorfail.Customersareresponsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT
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applicable laws or regulations.
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PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.
https://toshiba.semicon-storage.com/
©2017-2018
2018-09-21
Rev.3.0
7
Toshiba Electronic Devices & Storage Corporation
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