TPC8012-H_06 [TOSHIBA]

Switching Regulator Applications Switching Regulator Applications; 开关稳压器应用开关稳压器的应用
TPC8012-H_06
型号: TPC8012-H_06
厂家: TOSHIBA    TOSHIBA
描述:

Switching Regulator Applications Switching Regulator Applications
开关稳压器应用开关稳压器的应用

稳压器 开关
文件: 总7页 (文件大小:264K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPC8012-H  
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (π-MOSV)  
TPC8012-H  
Switching Regulator Applications  
Unit: mm  
DCDC Converter Applications  
Low drain-source ON-resistance: R  
= 0.28 (typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 1.35 S (typ.)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 200 V)  
DSS  
DS  
Enhancement mode: V = 3.0 to 5.0 V (V  
= 10 V, I = 1 mA)  
DS D  
th  
Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
V
V
200  
200  
±30  
1.8  
V
V
V
Drain-source voltage  
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
DGR  
GS  
V
GSS  
DC  
(Note 1)  
I
D
Drain current  
A
Pulse (Note 1)  
I
7.2  
DP  
Drain power dissipation  
Drain power dissipation  
(t = 10 s)  
(Note 2a)  
(t = 10 s)  
(Note 2b)  
JEDEC  
JEITA  
P
1.9  
1.0  
W
W
D
D
TOSHIBA  
2-6J1B  
P
Weight: 0.085 g (typ.)  
Single-pulse avalanche energy  
(Note 3)  
E
2.05  
1.8  
mJ  
A
AS  
Avalanche current  
I
AR  
Circuit Configuration  
Repetitive avalanche energy  
E
0.19  
mJ  
AR  
8
7
6
5
(Note 2a) (Note 4)  
T
T
150  
°C  
°C  
Channel temperature  
ch  
55 to 150  
Storage temperature range  
stg  
Note: For Notes 1 to 4, refer to the next page.  
This transistor is an electrostatic-sensitive device. Handle with care.  
1
2
3
4
1
2006-01-17  
TPC8012-H  
Thermal Characteristics  
Characteristic  
Symbol  
Max  
65.8  
Unit  
Thermal resistance, channel to ambient  
R
°C/W  
th (ch-a)  
(t = 10 s)  
(Note 2a)  
Thermal resistance, channel to ambient  
R
125  
°C/W  
th (ch-a)  
(t = 10 s)  
(Note 2b)  
Marking (Note 5)  
TPC8012  
H
Part No. (or abbreviation code)  
Lot No.  
A line indicates  
lead (Pb)-free package or  
lead (Pb)-free finish.  
Note 1: The channel temperature should not exceed 150°C during use.  
Note 2: (a) Device mounted on a glass-epoxy board (a)  
(b) Device mounted on a glass-epoxy board (b)  
FR-4  
FR-4  
25.4 × 25.4 × 0.8  
(Unit: mm)  
25.4 × 25.4 × 0.8  
(Unit: mm)  
(a)  
(b)  
Note 3:  
V
DD  
= 50 V, T = 25°C (initial), L = 1.0 mH, R = 25 Ω, I = 1.8 A  
AR  
ch  
G
Note 4: Repetitive rating: pulse width limited by maximum channel temperature  
Note 5: on the lower left of the marking indicates Pin 1.  
* Weekly code: (Three digits)  
Week of manufacture  
(01 for first week of the year, continuing up to 52 or 53)  
Year of manufacture  
(The last digit of the calendar year)  
2
2006-01-17  
TPC8012-H  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
V
= ±25 V, V  
= 200 V, V  
= 0 V  
= 0 V  
±10  
100  
μA  
μA  
V
GSS  
GS  
DS  
DS  
Drain cutoff current  
I
DSS  
(BR) DSS  
GS  
Drain-source breakdown voltage  
Gate threshold voltage  
Drain-source ON-resistance  
Forward transfer admittance  
Input capacitance  
V
I
= 10 mA, V  
= 0 V  
200  
3.0  
D
GS  
V
V
V
V
= 10 V, I = 1 mA  
5.0  
0.40  
V
th  
DS  
GS  
DS  
D
R
= 10 V, I = 0.9 A  
0.28  
1.35  
440  
80  
Ω
DS (ON)  
|Y |  
D
= 10 V, I = 0.9 A  
0.65  
S
fs  
D
C
C
iss  
V
= 10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
260  
oss  
Rise time  
t
23  
28  
22  
73  
11  
r
I
= 0.9 A  
D
10 V  
V
GS  
V
OUT  
0 V  
Turn-on time  
Switching time  
t
on  
ns  
Fall time  
t
f
V
100 V  
DD  
Turn-off time  
t
off  
<
Duty 1%, t = 10 μs  
w
Total gate charge  
Q
g
(gate-source plus gate-drain)  
V
I
160 V, V  
= 10 V,  
GS  
DD  
= 1.8 A  
nC  
Gate-source charge 1  
Q
gs  
6
5
D
Gate-drain (“Miller”) charge  
Q
gd  
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Drain reverse current  
Forward voltage (diode)  
Pulse (Note 1)  
I
7.2  
A
V
DRP  
V
I
= 1.8 A, V = 0 V  
GS  
1.5  
DSF  
DR  
3
2006-01-17  
TPC8012-H  
I
– V  
I
– V  
D DS  
D
DS  
5
4
3
2
1
0
5
4
3
2
1
0
Common source  
Ta = 25°C  
Common source  
15  
10  
8
8
7.6  
15  
7.6  
7.3  
Ta = 25°C  
10  
Pulse test  
Pulse test  
7.3  
7
7.0  
6.6  
6.6  
6
6
V
= 5 V  
GS  
0
1
2
3
4
5
0
4
8
12  
16  
20  
Drain-source voltage  
V
(V)  
Drain-source voltage  
V
(V)  
DS  
DS  
I
D
– V  
GS  
V
– V  
GS  
DS  
1.0  
0.8  
6
Common source  
= 10 V  
Common source  
Ta = 25°C  
V
DS  
Pulse test  
Pulse test  
5
4
0.6  
0.4  
ID = 1.8 A  
3
2
1
0
Ta = −55°C  
0.9  
100  
0.2  
0
0.45  
25  
0
3
6
9
12  
15  
0
2
6
8
10  
4
Gate-source voltage  
V
(V)  
Gate-source voltage  
V
(V)  
GS  
GS  
R
– I  
D
DS (ON)  
|Y | – I  
fs  
D
100  
1
Common source  
Ta = 25°C  
Pulse test  
Common source  
= 10 V  
V
DS  
Pulse test  
V
= 10 V  
GS  
10  
25  
0.1  
Ta = −55°C  
100  
1
0.01  
0.1  
0.1  
1
10  
0.1  
1
10  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
4
2006-01-17  
TPC8012-H  
R
Ta  
I
– V  
DS  
DS (ON)  
DR  
1
10  
Common source  
Ta = 25°C  
Common source  
Pulse test  
Pulse test  
0.8  
0.6  
0.4  
I
= 2.8A,5.5A,11A  
D
10  
1
4.5  
V
= 10 V  
GS  
3
1
0.2  
0
V
= 0 V  
GS  
0.1  
80  
40  
0
40  
80  
120  
160  
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
Ambient temperature Ta (°C)  
Drain-source voltage  
V
(V)  
DS  
Capacitance – V  
V
Ta  
th  
DS  
10000  
1000  
5.0  
4.0  
3.0  
2.0  
C
iss  
C
oss  
100  
Common source  
1.0  
0
V
I
= 10 V  
DS  
C
rss  
= 1 mA  
D
Common source  
Ta = 25°C  
f = 1 MHz  
Pulse test  
80  
40  
0
40  
80  
120  
160  
V
= 0 V  
GS  
10  
0.1  
1
10  
100  
Ambient temperature Ta (°C)  
Drain-source voltage  
V
(V)  
DS  
Dynamic input/output  
characteristics  
P
Ta  
D
2.0  
200  
20  
Common source  
I
Ta = 25°C  
Pulse test  
(1) Device mounted on a  
glass-epoxy board (a)  
(Note 2a)  
= 1.8 A  
D
(1)  
V
DS  
1.6  
1.2  
0.8  
160  
120  
80  
16  
(2) Device mounted on a  
glass-epoxy board (b)  
(Note 2b)  
t = 10 s  
V
= 40 V  
DD  
12  
8
80 V  
(2)  
160 V  
0.4  
0
40  
4
0
0
0
40  
80  
120  
160  
0
4
8
12  
16  
20  
Total gate charge  
Q
g
(nC)  
Ambient temperature Ta (°C)  
5
2006-01-17  
TPC8012-H  
r t  
th  
w
1000  
100  
10  
(1) Device mounted on a glass-epoxy board (a) (Note 2a)  
(2) Device mounted on a glass-epoxy board (b) (Note 2b)  
(2)  
(1)  
1
Single - pulse  
100 1000  
0.1  
0.001  
0.01  
0.1  
1
10  
Pulse width  
t
(s)  
w
Safe operating area  
10  
I
MAX (Pulse) *  
D
t =1 ms *  
10 ms *  
1
0.1  
V
DSS  
MAX  
* Single-pulse  
Ta = 25°C  
Curves must be derated  
linearly with increase in  
temperature.  
0.01  
0.1  
1
10  
100  
1000  
Drain-source voltage  
V
(V)  
DS  
6
2006-01-17  
TPC8012-H  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
7
2006-01-17  

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