BSR202N [TYSEMI]

OptiMOS2 Small-Signal-Transistor Enhancement mode; OptiMOS2小信号三极管增强模式
BSR202N
型号: BSR202N
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

OptiMOS2 Small-Signal-Transistor Enhancement mode
OptiMOS2小信号三极管增强模式

晶体 晶体管 脉冲 光电二极管 局域网
文件: 总3页 (文件大小:251K)
中文:  中文翻译
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Product specification  
BSR202N  
OptiMOS®2 Small-Signal-Transistor  
Features  
Product Summary  
VDS  
20  
21  
33  
3.8  
V
• N-channel  
RDS(on),max  
VGS=4.5 V  
VGS=2.5 V  
mΩ  
• Enhancement mode  
• Super Logic level (2.5V rated)  
ID  
A
• Avalanche rated  
• Footprint compatible to SOT23  
• dv /dt rated  
PG-SC-59  
3
• Pb-free lead plating; RoHS compliant  
• Qualified according to AEC Q101  
1
2
Type  
Package  
Tape and Reel Information  
Marking  
Lead Free  
Packing  
BSR202N  
PG-SC-59  
L6327 = 3000 pcs. / reel  
LAs  
Yes  
Non dry  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
I D  
T A=25 °C  
T A=70 °C  
T A=25 °C  
Continuous drain current  
3.8  
3.1  
15.2  
30  
A
I D,pulse  
E AS  
Pulsed drain current  
I D=3.8 A, R GS=25 Ω  
Avalanche energy, single pulse  
mJ  
I D=3.8 A, V DS=16 V,  
di /dt =200 A/µs,  
Reverse diode dv /dt  
dv /dt  
6
kV/µs  
T
j,max=150 °C  
V GS  
Gate source voltage  
±12  
0.5  
V
P tot  
T A=25 °C  
Power dissipation  
W
°C  
T j, T stg  
Operating and storage temperature  
ESD Class  
-55 ... 150  
0 (0V to 250V)  
260 °C  
JESD22-A114-HBM  
Soldering Temperature  
IEC climatic category; DIN IEC 68-1  
55/150/56  
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sales@twtysemi.com  
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Product specification  
BSR202N  
Values  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Thermal characteristics  
Thermal resistance,  
junction - minimal footprint  
R thJA  
-
-
250 K/W  
Electrical characteristics, at T j=25 °C, unless otherwise specified  
Static characteristics  
V (BR)DSS V GS= 0 V, I D= 250 µA  
V GS(th) V DS=VGS , I D=30 µA  
Drain-source breakdown voltage  
Gate threshold voltage  
20  
0.7  
-
-
0.95  
-
-
1.2  
1
V
V DS=20 V, V GS=0 V,  
I DSS  
Drain-source leakage current  
μA  
T j=25 °C  
V
DS=20 V, V GS=0 V,  
-
-
100  
T j=150 °C  
I GSS  
V GS=12 V, V DS=0 V  
Gate-source leakage current  
-
-
-
-
100 nA  
R DS(on) V GS=2.5 V, I D=3 A  
GS=4.5 V, I D=3.8 A  
Drain-source on-state resistance  
25  
17  
33  
21  
mΩ  
V
|V DS|>2|I D|R DS(on)max  
I D=3.8 A  
,
g fs  
Transconductance  
17  
-
S
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Product specification  
BSR202N  
Values  
Parameter  
Symbol Conditions  
Unit  
min.  
typ.  
max.  
Dynamic characteristics  
Input capacitance  
Output capacitance  
Reverse transfer capacitance  
Turn-on delay time  
Rise time  
C iss  
-
-
-
-
-
-
-
863  
278  
40  
1147 pF  
370  
V GS=0 V, V DS=10 V,  
f =1 MHz  
C oss  
Crss  
t d(on)  
t r  
60  
8.8  
16.7  
19  
-
-
-
-
ns  
V
DD=10 V, V GS=4.5 V,  
I D=3.8 A, R G=6 Ω  
t d(off)  
t f  
Turn-off delay time  
Fall time  
3.7  
Gate Charge Characteristics  
Gate to source charge  
Gate to drain charge  
Gate charge total  
Q gs  
-
-
-
-
1.66  
1.1  
5.8  
1.9  
2.21 nC  
1.6  
Q gd  
V DD=10 V, I D=3.8 A,  
V
GS=0 to 4.5 V  
Q g  
8.8  
V plateau  
Gate plateau voltage  
-
V
A
Reverse Diode  
I S  
Diode continous forward current  
Diode pulse current  
-
-
-
-
0.8  
T A=25 °C  
I S,pulse  
15.2  
V GS=0 V, I F=3.8 A,  
T j=25 °C  
V SD  
Diode forward voltage  
-
0.8  
1.1  
-
V
t rr  
Reverse recovery time  
-
-
14.3  
7.6  
ns  
V R=10 V, I F=3.8 A,  
di F/dt =100 A/µs  
Q rr  
Reverse recovery charge  
nC  
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