DMG3420U-7 [TYSEMI]

N-CHANNEL ENHANCEMENT MODE MOSFET Low On-Resistance; N沟道增强型MOSFET的低导通电阻
DMG3420U-7
型号: DMG3420U-7
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

N-CHANNEL ENHANCEMENT MODE MOSFET Low On-Resistance
N沟道增强型MOSFET的低导通电阻

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中文:  中文翻译
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Product specification  
DMG3420U  
N-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
Low On-Resistance  
I
D max  
Low Input Capacitance  
V(BR)DSS  
RDS(ON) max  
TA = +25°C  
Fast Switching Speed  
21mΩ @ VGS = 10V  
25m@ VGS = 4.5V  
6.5A  
Low Input/Output Leakage  
20V  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. “Green” Device (Note 3)  
Qualified to AEC-Q101 Standards for High Reliability  
5.2A  
Description  
This new generation MOSFET has been designed to minimize the on-  
state resistance (RDS(on) and yet maintain superior switching  
Mechanical Data  
)
Case: SOT23  
performance, making it ideal for high efficiency power management  
applications.  
Case Material: Molded Plastic, “Green” Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish Matte Tin annealed over Copper leadframe.  
Applications  
e3  
Solderable per MIL-STD-202, Method 208  
General Purpose Interfacing Switch  
Power Management Functions  
Terminals Connections: See Diagram Below  
Weight: 0.008 grams (approximate)  
Drain  
SOT23  
D
Gate  
S
G
Source  
Equivalent Circuit  
TOP VIEW  
TOP VIEW  
Ordering Information (Note 4)  
Part Number  
DMG3420U-7  
DMG3420UQ-7  
Qualification  
Commercial  
Automotive  
Case  
SOT23  
SOT23  
Packaging  
3000/Tape & Reel  
3000/Tape & Reel  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
Marking Information  
G31 = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: W = 2009)  
G31  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2009  
2010  
2011  
2012  
2013  
2014  
2015  
Code  
W
X
Y
Z
A
B
C
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
http://www.twtysemi.com  
sales@twtysemi.com  
1 of 2  
Product specification  
DMG3420U  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
20  
Units  
V
V
Gate-Source Voltage  
±12  
VGSS  
TA = 25°C  
TA = 85°C  
Steady  
State  
5.47  
3.43  
Continuous Drain Current (Note 5)  
Pulsed Drain Current (Note 6)  
A
A
ID  
20  
IDM  
Thermal Characteristics  
Characteristic  
Symbol  
PD  
Value  
0.74  
Unit  
W
Power Dissipation (Note 5)  
167  
°C/W  
°C  
Thermal Resistance, Junction to Ambient @TA = 25°C (Note 5)  
Operating and Storage Temperature Range  
RθJA  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 7)  
Drain-Source Breakdown Voltage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
20  
1.0  
V
BVDSS  
IDSS  
VGS = 0V, ID = 250μA  
VDS = 20V, VGS = 0V  
VGS = ±12V, VDS = 0V  
µA  
nA  
Zero Gate Voltage Drain Current TJ = +25°C  
Gate-Source Leakage  
±100  
IGSS  
ON CHARACTERISTICS (Note 7)  
Gate Threshold Voltage  
0.5  
0.95  
21  
1.2  
29  
35  
48  
91  
V
VGS(th)  
VDS = VGS, ID = 250μA  
VGS = 10V, ID = 6A  
VGS = 4.5V, ID = 5A  
25  
Static Drain-Source On-Resistance  
mꢀ  
RDS(ON)  
34  
V
V
GS = 2.5V, ID = 4A  
GS = 1.8V, ID = 2A  
65  
Forward Transfer Admittance  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 8)  
Input Capacitance  
9
S
V
|Yfs|  
VSD  
VDS = 5V, ID = 3.8A  
VGS = 0V, IS = 1A  
0.75  
1.0  
434.7  
69.1  
61.2  
1.53  
5.4  
pF  
pF  
pF  
Ciss  
Coss  
Crss  
Rg  
VDS = 10V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS = 0V, VGS = 0V, f = 1MHz  
VGS = 4.5V, VDS = 10V,  
Total Gate Charge  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
Qg  
Gate-Source Charge  
Gate-Drain Charge  
0.9  
Qgs  
Qgd  
tD(on)  
tr  
I
D = 6A  
1.5  
Turn-On Delay Time  
6.5  
Turn-On Rise Time  
8.3  
VDD = 10V, VGS = 5V,  
RL = 1.7, RG = 6ꢀ  
Turn-Off Delay Time  
21.6  
5.3  
tD(off)  
tf  
Turn-Off Fall Time  
Notes:  
3. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
4. Repetitive rating, pulse width limited by junction temperature.  
5. Short duration pulse test used to minimize self-heating effect.  
6. Guaranteed by design. Not subject to production testing.  
http://www.twtysemi.com  
sales@twtysemi.com  
2 of 2  

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