IRLML2502PBF [TYSEMI]

Ultra Low On-Resistance SOT-23 Footprint N-Channel MOSFET Available in Tape and Reel; 超低导通电阻SOT -23尺寸的N沟道MOSFET可在磁带和卷轴
IRLML2502PBF
型号: IRLML2502PBF
厂家: TY Semiconductor Co., Ltd    TY Semiconductor Co., Ltd
描述:

Ultra Low On-Resistance SOT-23 Footprint N-Channel MOSFET Available in Tape and Reel
超低导通电阻SOT -23尺寸的N沟道MOSFET可在磁带和卷轴

晶体 晶体管 开关 脉冲 光电二极管 PC
文件: 总2页 (文件大小:248K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Product specification  
IRLML2502PbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l SOT-23 Footprint  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
G
S
1
2
VDSS = 20V  
3
D
RDS(on) = 0.045Ω  
l Lead-Free  
l Halogen-Free  
Description  
These N-Channel MOSFETs from International Rectifier  
utilizeadvancedprocessingtechniquestoachieveextremely  
low on-resistance per silicon area. This benefit, combined  
with the fast switching speed and ruggedized device design  
thatHEXFET® powerMOSFETsarewellknownfor,provides  
the designer with an extremely efficient and reliable device  
for use in battery and load management.  
Micro3™  
A thermally enhanced large pad leadframe has been  
incorporated into the standard SOT-23 package to produce  
a HEXFET Power MOSFET with the industry's smallest  
footprint. This package, dubbed the Micro3, is ideal for  
applications where printed circuit board space is at a  
premium. The low profile (<1.1mm) of the Micro3 allows it  
to fit easily into extremely thin application environments  
suchasportableelectronicsandPCMCIAcards.Thethermal  
resistance and power dissipation are the best available.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
20  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
4.2  
3.4  
A
33  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.25  
W
Power Dissipation  
0.8  
Linear Derating Factor  
0.01  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to + 150  
°C  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
75  
100  
°C/W  
http://www.twtysemi.com  
sales@twtysemi.com  
1 of 2  
Product specification  
IRLML2502PbF  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min.  
20  
Typ.  
–––  
Max. Units  
Conditions  
VGS = 0V, ID = 250uA  
V/°C Reference to 25°C, ID = 1.0mA  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
Breakdown Voltage Temp. Coefficient  
Static Drain-to-Source On-Resistance  
–––  
–––  
V
ΔV(BR)DSS/ΔTJ  
RDS(on)  
–––  
–––  
–––  
0.60  
–––  
5.8  
0.01  
Ω
0.035 0.045  
0.050 0.080  
VGS = 4.5V, ID = 4.2A  
VGS = 2.5V, ID = 3.6A  
VGS(th)  
ΔVGS(th)  
gfs  
Gate Threshold Voltage  
–––  
-3.2  
–––  
–––  
–––  
–––  
–––  
8.0  
1.8  
1.7  
7.5  
10  
1.2  
V
VDS = VGS, ID = 250μA  
Gate Threshold Voltage Coefficient  
Forward Transconductance  
Drain-to-Source Leakage Current  
––– mV/°C  
–––  
1.0  
S
VDS = 10V, ID = 4.0A  
VDS = 16V, VGS = 0V  
IDSS  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
μA  
25  
VDS = 16V, VGS = 0V, TJ = 70°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
100  
-100  
12  
VGS = 12V  
VGS = -12V  
ID = 4.0A  
nA  
nC  
Qg  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
2.7  
VDS = 10V  
VGS = 5.0V  
2.6  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
VDD = 10V  
ID = 1.0A  
RG = 6Ω  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
54  
26  
RD = 10Ω  
VGS = 0V  
VDS = 15V  
ƒ = 1.0MHz  
Ciss  
Coss  
Crss  
Input Capacitance  
740  
90  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
66  
Source-Drain Rating and Characteristics  
Parameter  
Min.  
Typ.  
Max. Units  
Conditions  
D
S
IS  
Continuous Source Current  
MOSFET symbol  
–––  
–––  
1.3  
(Body Diode)  
showing the  
A
G
ISM  
Pulsed Source Current  
integral reverse  
–––  
–––  
33  
(Body Diode)  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
–––  
–––  
–––  
–––  
16  
1.2  
24  
13  
V
TJ = 25°C, IS = 1.3A, VGS = 0V  
ns TJ = 25°C, IF = 1.3A  
di/dt = 100A/μs  
nC  
Qrr  
Reverse Recovery Charge  
8.6  
Notes:  
 Repetitive rating; pulse width limited by  
ƒ Surface mounted on FR-4 board, t 5sec.  
max. junction temperature. ( See fig. 11 )  
‚ Pulse width 300μs; duty cycle 2%.  
http://www.twtysemi.com  
sales@twtysemi.com  
2 of 2  

相关型号:

IRLML2502PBF-1

Compatible with Existing Surface Mount Techniques
INFINEON

IRLML2502PBF-1_15

Compatible with Existing Surface Mount Techniques
INFINEON

IRLML2502PBF_12

Ultra Low On-Resistance, N-Channel MOSFET, SOT-23 Footprint
INFINEON

IRLML2502TR

HEXFETPower MOSFET
INFINEON

IRLML2502TRPBF

HEXFET Power MOSFET
TYSEMI

IRLML2502TRPBF-1

Small Signal Field-Effect Transistor
INFINEON

IRLML2803

Power MOSFET(Vdss=30V, Rds(on)=0.25ohm)
INFINEON

IRLML2803GPBF

HEXFET Power MOSFET
INFINEON

IRLML2803GPBF_11

Generation V Technology, Ultra Low On-Resistance, N-Channel MOSFET
INFINEON

IRLML2803GTRPBF

暂无描述
INFINEON

IRLML2803PBF

HEXFET Power MOSFET
INFINEON

IRLML2803PBF-1

Compatible with Existing Surface Mount Techniques
INFINEON