US5506 [UPI]

High Slew Rate, High Current Drive Rail to Rail Operation Amplifier;
US5506
型号: US5506
厂家: uPI Semiconductor Corp.    uPI Semiconductor Corp.
描述:

High Slew Rate, High Current Drive Rail to Rail Operation Amplifier

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uS5506  
High Slew Rate, High Current Drive,  
and Rail to Rail Operation Amplifier  
Features  
General Description  
The uS5506 contains two independent, high slew rate and † 4.5V to 20V Input Voltae Re  
high current drive rail to rail operation amplifiers. The uS5506  
operates over a wide range of voltage 4.5V~20V with very  
† 600mA Peak Output Curre
low bias current.  
† Rail to Rail Output  
† 50V/uS Slew R
† 30MHz Bandwidth  
uS5506 provides peak output current to 600mAdrive rail to  
rail output and fast slew rate to 50V/us. Other features  
include over-temperature protection, over-current protection,  
and output short protection. They provide complete  
protection for system application. The uS5506 is available  
in MSOP-8L and PMSOP-8L packages.  
† 1.2mA Quiecent Crent Per Channel  
† Over Current otection  
† Over Trature Protection  
† Outpuort rotection  
Ordering Information  
Order Number  
uS5506PRA8  
uS5506PRU8  
Package Type  
MSOP-8L  
Top Marking  
uS5506P  
† M-8L and PMSOP-8L Packages  
† mpliant and Halogen Free  
PMSOP-8L  
uS5506P  
Applications  
Note:  
(1) uPI products are compatible with the current IPC/  
JEDEC J-STD-020 requirement. They are halogen-free,  
RoHS compliant and 100% matte tin (Sn) plating that  
are suitable for use in SnPb or Pb-free soldering  
processes.  
† TFTLCD VCOM Buffer  
† TFT-LCD Gamma Buffer  
Pin Cofiguration & Typical Application Circuit  
VIN  
VOUTA  
VINA-  
VINA+  
VS-  
V
1
2
3
4
8
7
6
5
VOUTB  
VS+  
V-  
VI+  
Load  
VIN+  
VIN-  
RS  
VOUT  
MSOP-8L  
VOUTA  
VINA-  
VINA+  
VS-  
VS+  
1
2
3
4
8
7
6
5
VOUTB  
VINB-  
VINB+  
VS-  
SOP-8L  
uS5506-DS-F0300, Mar. 2017  
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www.upi-semi.com  
uS5506  
Functional Pin Description  
No. Pin Name Pin Function  
Output for Amplifier-A.  
1
2
3
4
5
6
7
8
VOUTA  
VINA-  
VINA+  
VS-  
Negative Input for Amplifier-A.  
Positive Input for Amplifier-A.  
Negative Supply Input.  
Positive Input for Amplifier-B.  
Negative Input for Amplifier-B.  
Output for Amplifier-B.  
VINB+  
VINB-  
VOUTB  
VS+  
Positive Supply Input.  
Exposed Pad.  
EP  
Functional Block Diagram  
VOUTA  
VS+  
VINA-  
VINA+  
VINB-  
VINB+  
VS-  
VOUTB  
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uS5506  
Functional Description  
The uS5506 includes 2-Channel independent operation  
amplifiers. It has fast slew rate to 50V/uS and high current  
drive to 600mA peak current. It can operate within wide  
range from 4.5~20V and rail to rail output. It is suitable for  
TFT-LCD gamma and VCOM buffer voltage.  
The uS5506 features over-current protection, over-  
temperature, and output short protection function. These  
features supply complete protection for the TFT-LCDpanel  
application. When VIN = VS+ / 2, the output current will  
be limited to 600mA for m = normal operation. If output  
shorts to VS-, the over-current protection machine will  
keep regulating power dissipation to prevent power bus  
being burnt out.  
uS5506 has thermal protection function to prevent the  
excessive power dissipation from overheating. When the  
junction temperature exceeds 150OC, it will disable normal  
operation to lower chip operation temperature.  
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uS5506  
Absolute Maximum Rating  
Supply Voltage, VS+ to VS- (Note 1) -------------------------------------------------------------------------------------- -0.3V to +22.5V  
Input Voltage ---------------------------------------------------------------------------------------------------- (V)-0.5V to (VS+) + 0.5V  
Storage Temperature Range --------------------------------------------------------------------------------------------65oC to +150oC  
Junction Temperature -------------------------------------------------------------------------------------------------------------- 150oC  
Lead Temperature (Soldering, 10 sec) -------------------------------------------------------------------------------------- 260oC  
ESD Susceptibility (Note 2)  
HBM (Human Body Mode) ---------------------------------------------------------------------------------------------------- 2kV  
MM (Machine Mode) -------------------------------------------------------------------------------------------------------- 200V  
Thrmal Information  
Package Thermal Resistance (Note 3)  
MSOP-8L θJA ----------------------------------------------------------------------------------------------------------------------- 160oC/W  
MSOP-8L θJC ----------------------------------------------------------------------------------------------------------------------- 40oC/W  
PMSOP-8L θJA ---------------------------------------------------------------------------------------------------------------------- 86oC/W  
PMSOP-8L θJC -------------------------------------------------------------------------------------------------------------- 30oC/W  
PowerDissipation, PD @ TA = 25°C  
MSOP-8L ----------------------------------------------------------------------------------------------------------------------------------- 0.625W  
PMSOP-8L --------------------------------------------------------------------------------------------------------------------------- 1.16W  
Reended Operation Conditions  
Operating Junction Temperature Range (Note 4) --------------------------------------------------------------- -40°C to +125°C  
OperatingAmbient Temperature Range ------------------------------------------------------------------------- -40°C to +85°C  
Note 1. Stresses listed as the above “ Absolute Maximum Ras” may cause permanent damage to the device.  
These are for stress ratings. Functional operaof the device at these or any other conditions beyond  
those indicated in the operational sections othe spfications is not implied. Exposure to absolute  
maximum rating conditions for extended pds may remain possibility to affect device reliability.  
Note 2. Devices are ESD sensitive. Handling precaution commended.  
Note 3. θJA is measured in the natural convec= 25°C on a low effective thermal conductivity test board of  
JEDEC 51-3 thermal measurement s
Note 4. The device is not guaranteed to functioside its operating conditions.  
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uS5506  
Electrical Characteristics  
(VS+ = 20V,VS- = 0V, VL = 10k, CL = 10pF, TA = 25OC, unless otherwise specified)  
Parameter  
Symbol  
Test Conditions  
Min  
p  
Max Units  
Supply Input  
Input Offset Voltage  
VOS  
VCM = 10V  
--  
2  
5
15  
--  
mV  
Averaged Temperature  
Coefficient of Input Offset Voltage  
TCVOS  
uV/oC  
Input Bias Current  
I
VCM = 10V  
--  
--  
2
1
50  
--  
nA  
G  
pF  
V
IB  
Input Impedance  
RIN  
CIN  
Input Capacitance  
--  
1.5  
--  
--  
Common Mode Input Range  
Common Mode Rejection Ratio  
Open Loop Gain  
CMIR  
-0.5  
50  
50  
--  
+20.5  
--  
CMRR +0.5V < VOUT < +19.5V(Nd)  
70  
70  
100  
dB  
dB  
mV  
V
AVOL  
VOL  
+0.5V < VOUT < +19.5V(oad
IL = -5mA  
--  
Output Swing Low  
150  
--  
Output Swing High  
VOH  
IL = +5mA  
19.85 19.9  
average crrent of urce & sink  
current  
Peak Output Current  
IOUT  
--  
+/-600  
--  
mA  
Continuous Output Current  
Power Supply Rejection Ratio  
Supply Current(Per Channel)  
V
OUT = 1
60  
60  
--  
80  
80  
--  
--  
--  
mA  
dB  
PSRR +6V < VS+ < V  
IS  
No Lod  
1.2  
mA  
+0.5< VOUT < +19.5V, 20% to 80%  
(averagf rising and falling edge  
sate)  
Slew Rate  
SR  
--  
50  
--  
V/uS  
Setting to +/-0.1%(AV = +1)  
-3dB Bandwidth  
ts  
V step @ CL = 0pF  
Nad  
--  
--  
--  
--  
--  
--  
--  
200  
30  
--  
--  
--  
--  
--  
--  
--  
nS  
MHz  
MHz  
deg  
dB  
BW  
Gain Bandwidth Product  
Phase Margin  
GBWP o Load  
24  
PM  
CHS  
Load  
f = 5MHz  
50  
Channel Separation  
90  
Over-Temperature Thresho
Over-Temperature Hysteresis  
TOTP  
150  
20  
oC  
TTP_HYS  
oC  
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uS5506  
Typical Operation Characteristics  
Slew Rate (Rising)  
Slew Rate (Falling)  
VINA+(2V/Div)  
VOUTA (2V/Div)  
VOUTA (2V/Div)  
INA+(2V/Div)  
Time: 20ns/Div  
Time: 20ns/Div  
VS+ = 20V, VINA+ = 10V, No Load  
VS= 20V, VINA+ = 10V, No Load  
Small Signal Transient Response  
Large Signal Transient Response  
VINA+(5V/Div)  
VINA+(100mV/Div)  
VOUTA (100mV/Div)  
VOUTA (5V/Div)  
Time: 2ms/
Time: 2ms/Div  
VS+ = 20V, VINA+ = 0mV, No Ld  
VS+ = 20V, VINA+ = 10V, No Load  
Rail-to-R
Load Transient Response  
VINA+(5V/Div)  
VINA+(50mV/Div)  
IOUT (100mV/Div)  
VA (5V/Div)  
Time: 10ms/Div  
Time: 40us/Div  
VS+ = 10V, VINA+ = 10V, No Load  
VS+ = 20V, VINA+ = 10V, Load = 300mA  
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uS5506-DS-F0300, Mar. 2017  
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uS5506  
Typical Operation Characteristics  
Output Peak Current  
Output Continue Current  
VOUTA (5V/Div)  
VOTA
I(20mA/Div)  
IOUT (200mA/Div)  
Time: 4us/Div  
Time: 4us/Div  
VS+ = 20V, VINA+ = 10V, VOUTA short to GND  
= 20VINA+ = 10V, VOUTA short to GND  
uS5506-DS-F0300, Mar. 2017  
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uS5506  
Package Information  
MSOP-8L  
0.35 REF  
1.00 REF  
3.00 BSC  
0.65 REF  
0.65
0.30 BSC  
Recommended Solder Pad Layout  
0.75
0.15 TYP  
0.40 - 0.80  
0.00 - 0.15  
Note  
1.Package Outline Unit Description:  
BSC: Basic. Represents theoretical exact dor dimension target  
MIN: Minimum dimension specified.  
MAX: Maximum dimension specifie
REF: Reference. Represents dimnsion for reference use only. This value is not a device specification.  
TYP. Typical. Provided as a genal value. Tvalue is not a device specification.  
2.Dimensions in Millimeters.  
3.Drawing not to scale.  
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.  
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uS5506-DS-F0300, Mar. 2017  
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uS5506  
Package Information  
PMSOP-8L  
2.90 - 3.10  
1.40 - 2.15  
0.65 BSC  
0.22 - 0.38  
1.10 MAX  
0.00.15  
Note  
1.Package Outline Unit Description:  
BSC: Basic. Represents theoretical exact dor dimension target  
MIN: Minimum dimension specified.  
MAX: Maximum dimension specifie
REF: Reference. Represents dimnsion for reference use only. This value is not a device specification.  
TYP. Typical. Provided as a genal value. Tvalue is not a device specification.  
2.Dimensions in Millimeters.  
3.Drawing not to scale.  
4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.  
uS5506-DS-F0300, Mar. 2017  
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uS5506  
Important Notice  
uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improveents, and other  
changes to its products and services at any time and to discontinue any product or servicwit notice. Customers  
should obtain the latest relevant information before placing orders and should verify that sh iation is current and  
complete.  
uPI products are sold subject to the terms and conditions of sale supplied at the tiof order acknowledgment.  
However, no responsibility is assumed by uPI or its subsidiaries for its use or appliation of y product or circuit; nor  
for any infringements of patents or other rights of third parties which may result frouse or application, including but  
not limited to any consequential or incidental damages. No uPI components are designintended or authorized for  
use in military, aerospace, automotive applications nor in systems for surgical imtation or life-sustaining. No license  
is granted by implication or otherwise under any patent or patent rights of uPor its ssidiaries.  
COPYRIGHT (C) 2010, UPI SEMICONDUCTOR CORP.  
uPI Semiconductor Corp.  
Sales Branch Office  
uPI Semiconductor Cor
Headquarter  
12F-5, No. 408, Ruiguang Rd. Neihu District,  
Taipei Taiwan, R.O.C.  
TEL : 886.2.8751.2062 FAX : 886.2.8751.5064  
9F.,No.5, Taiyuan 1st St. Zubei City,  
Hsinchu Taiwan, R.C.  
TEL : 886.3.560.1666 FAX : 886.3.560.1888  
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uS5506-DS-F0300, Mar. 2017  
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