10-F007NRA050SG-P966F09 [VINCOTECH]

Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current;
10-F007NRA050SG-P966F09
型号: 10-F007NRA050SG-P966F09
厂家: VINCOTECH    VINCOTECH
描述:

Easy paralleling;Low turn-off losses;Low collector emitter saturation voltage;Positive temperature coefficient;Short tail current

文件: 总32页 (文件大小:5285K)
中文:  中文翻译
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10-F007NRA050SG-P966F09  
datasheet  
flowNPC 0 IGBT  
1200 V / 50 A  
Features  
flow 0 17 mm housing  
● Neutral point clamped inverter  
● Reactive power capability  
● Low inductance layout  
● Improved LVRT capability  
Schematic  
Target applications  
● Solar inverter  
● UPS  
Types  
● 10-F007NRA050SG-P966F09  
Copyright Vincotech  
1
28 Jul. 2021 / Revision 3  
10-F007NRA050SG-P966F09  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Buck Switch  
VCES  
Collector-emitter voltage  
650  
51  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
150  
119  
±20  
5
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 400 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Buck Diode  
VRRM  
Peak repetitive reverse voltage  
650  
23  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Surge (non-repetitive) forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
IFRM  
IFSM  
Ptot  
tp limited by Tjmax  
70  
A
Single Half Sine Wave,  
tp = 8,3 ms  
Tj = 150 °C  
Ts = 80 °C  
50  
A
Tj = Tjmax  
47  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Buck Sw. Protection Diode  
VRRM  
Peak repetitive reverse voltage  
650  
18  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
20  
A
Ptot  
33  
W
°C  
Tjmax  
Maximum junction temperature  
175  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
2
10-F007NRA050SG-P966F09  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Boost Switch  
VCES  
Collector-emitter voltage  
1200  
42  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
105  
101  
±20  
10  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
25  
V
A
IF  
Forward current (DC current)  
Surge (non-repetitive) forward current  
Surge current capability  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
IFSM  
I2t  
100  
50  
A
Single Half Sine Wave,  
tp = 10 ms  
A2s  
W
°C  
Ptot  
Total power dissipation  
Tj = Tjmax  
61  
Tjmax  
Maximum junction temperature  
175  
Boost Sw. Protection Diode  
VRRM  
Peak repetitive reverse voltage  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
1200  
16  
V
A
IF  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
14  
A
Ptot  
36  
W
°C  
Tjmax  
Maximum junction temperature  
150  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
3
10-F007NRA050SG-P966F09  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
tp = 2 s  
4000  
2500  
V
AC Voltage  
tp = 1 min  
V
>12,7  
>12,7  
≥ 200  
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
4
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Switch  
Static  
VGE(th)  
VCEsat  
ICES  
IGES  
rg  
Gate-emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
VCE = VGE  
0,0008  
50  
25  
4,2  
5,1  
5,6  
V
V
25  
1,38  
1,89  
2,17  
2,22(1)  
15  
0
125  
650  
0
25  
25  
2,8  
µA  
nA  
Ω
0
150  
None  
3100  
90  
Cies  
pF  
pF  
f = 1 Mhz  
0
20  
25  
Cres  
Reverse transfer capacitance  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,8  
K/W  
25  
66  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
66,6  
67  
ns  
ns  
7,4  
tr  
125  
150  
25  
8,8  
9
Rgon = 4 Ω  
Rgoff = 4 Ω  
103,2  
124  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
129,8  
6,92  
11,96  
16,34  
0,134  
0,18  
0,192  
0,254  
0,455  
0,498  
±15  
350  
35  
tf  
125  
150  
25  
ns  
QrFWD=0,072 µC  
QrFWD=0,075 µC  
QrFWD=0,075 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
5
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Diode  
Static  
25  
1,37  
1,55  
1,63  
3,2  
1,55(1)  
320  
VF  
IR  
Forward voltage  
16  
125  
150  
25  
V
Reverse leakage current  
Thermal  
Vr = 650 V  
µA  
150  
48  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
2,03  
K/W  
25  
20,69  
19,95  
19,58  
9,07  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
8,95  
ns  
8,97  
0,072  
0,075  
0,075  
7,853x10-3  
6,428x10-3  
7,703x10-3  
di/dt=3796 A/µs  
di/dt=5003 A/µs  
di/dt=4290 A/µs  
Qr  
Recovered charge  
±15  
350  
35  
125  
150  
25  
μC  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
6945  
6615  
6348  
(dirf/dt)max  
125  
150  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
6
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Buck Sw. Protection Diode  
Static  
25  
1,23  
1,67  
1,54  
1,87(1)  
0,14  
VF  
IR  
Forward voltage  
10  
V
125  
Reverse leakage current  
Thermal  
Vr = 650 V  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
2,87  
K/W  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
7
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Switch  
Static  
VGE(th)  
VCEsat  
ICES  
IGES  
rg  
Gate-emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
VCE = VGE  
0,0012  
35  
25  
5,3  
5,8  
6,3  
V
25  
1,58  
2,07  
2,13  
2,07(1)  
15  
0
V
125  
1200  
0
25  
25  
5
µA  
nA  
Ω
20  
120  
None  
2000  
70  
Cies  
Cres  
Qg  
pF  
pF  
nC  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
15  
0
270  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,94  
K/W  
25  
44,2  
44,6  
td(on)  
Turn-on delay time  
Rise time  
ns  
ns  
125  
25  
5,4  
tr  
125  
25  
8,4  
Rgon = 4 Ω  
Rgoff = 4 Ω  
147,6  
192,2  
70,47  
110,11  
0,372  
0,631  
1,25  
td(off)  
Turn-off delay time  
Fall time  
ns  
125  
25  
±15  
350  
35  
tf  
ns  
125  
25  
QrFWD=2,24 µC  
QrFWD=4,25 µC  
Eon  
Eoff  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
mWs  
mWs  
125  
25  
125  
1,92  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
8
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Diode  
Static  
25  
2,3  
2,74(1)  
VF  
IR  
Forward voltage  
25  
125  
150  
25  
2,41  
V
2,79(1)  
60  
Reverse leakage current  
Thermal  
Vr = 1200 V  
µA  
150  
1600  
1,56  
3300  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
K/W  
25  
65,21  
66,56  
43,39  
122,12  
2,24  
IRRM  
Peak recovery current  
Reverse recovery time  
Recovered charge  
A
125  
25  
trr  
ns  
125  
25  
di/dt=2585 A/µs  
di/dt=2622 A/µs  
Qr  
±15  
350  
35  
μC  
125  
25  
4,25  
0,591  
1,18  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
mWs  
A/µs  
125  
25  
5361  
3861  
(dirf/dt)max  
125  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
9
10-F007NRA050SG-P966F09  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Boost Sw. Protection Diode  
Static  
25  
2,01  
1,66  
3,5(1)  
250  
VF  
IR  
Forward voltage  
7
V
125  
Reverse leakage current  
Thermal  
Vr = 1200 V  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
1,92  
K/W  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
-5  
5
5
mW  
mW/K  
K
d
25  
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
10  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
150  
125  
VGE  
:
7 V  
8 V  
125  
100  
75  
50  
25  
0
9 V  
100  
75  
50  
25  
0
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
0
1
2
3
4
5
0
1
2
3
4
5
V
CE(V)  
VCE(V)  
tp  
=
=
tp  
=
250  
15  
μs  
V
250  
125  
μs  
°C  
25 °C  
Tj:  
VGE  
Tj =  
125 °C  
VGE from 7 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
40  
10  
-1  
30  
20  
10  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
2
4
6
8
10  
10  
10  
tp(s)  
V
GE(V)  
tp  
VCE  
=
=
250  
10  
μs  
V
D =  
tp / T  
0,795  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
6,19E-02  
1,10E-01  
4,12E-01  
1,04E-01  
5,73E-02  
4,98E-02  
2,26E+00  
4,08E-01  
9,23E-02  
2,31E-02  
5,67E-03  
8,49E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
11  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
100µs  
1ms  
1
10ms  
100ms  
DC  
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
12  
10-F007NRA050SG-P966F09  
datasheet  
Buck Diode Characteristics  
figure 6.  
FWD  
figure 7.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
40  
30  
20  
10  
0
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
2,032  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
1,81E-01  
4,90E-01  
7,30E-01  
4,51E-01  
1,81E-01  
1,80E+00  
1,58E-01  
4,04E-02  
4,19E-03  
6,96E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
13  
10-F007NRA050SG-P966F09  
datasheet  
Buck Sw. Protection Diode Characteristics  
figure 8.  
FWD  
figure 9.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
30  
25  
20  
15  
10  
5
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
2,873  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
6,53E-02  
1,48E-01  
1,31E+00  
7,32E-01  
4,04E-01  
2,11E-01  
3,94E+00  
4,48E-01  
5,96E-02  
1,36E-02  
2,79E-03  
5,37E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
14  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switch Characteristics  
figure 10.  
IGBT  
figure 11.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
100  
100  
VGE  
:
7 V  
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
75  
50  
25  
0
75  
50  
25  
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
V
CE(V)  
VCE(V)  
tp  
=
=
tp  
=
250  
15  
μs  
250  
125  
μs  
°C  
25 °C  
Tj:  
VGE  
Tj =  
V
125 °C  
VGE from 7 V to 17 V in steps of 1 V  
figure 12.  
IGBT  
figure 13.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
35  
10  
30  
25  
20  
15  
10  
5
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
2,5  
5,0  
7,5  
10,0  
12,5  
10  
10  
tp(s)  
V
GE(V)  
tp  
=
=
250  
10  
μs  
V
D =  
tp / T  
0,938  
25 °C  
Tj:  
VCE  
125 °C  
Rth(j-s) =  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,15E-01  
4,15E-01  
2,99E-01  
7,22E-02  
3,82E-02  
9,47E-01  
1,24E-01  
4,81E-02  
5,86E-03  
5,62E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
15  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switch Characteristics  
figure 14.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
10µs  
100µs  
1ms  
1
10ms  
100ms  
DC  
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
16  
10-F007NRA050SG-P966F09  
datasheet  
Boost Diode Characteristics  
figure 15.  
FWD  
figure 16.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
70  
60  
50  
40  
30  
20  
10  
0
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0
1
2
3
4
5
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,556  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
4,65E-02  
1,06E-01  
4,71E-01  
4,83E-01  
2,34E-01  
1,81E-01  
3,38E-02  
4,86E+00  
8,11E-01  
1,09E-01  
3,07E-02  
7,03E-03  
1,25E-03  
3,28E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
17  
10-F007NRA050SG-P966F09  
datasheet  
Boost Sw. Protection Diode Characteristics  
figure 17.  
FWD  
figure 18.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
20  
15  
10  
5
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
μs  
1,5  
2,0  
2,5  
3,0  
3,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
D =  
tp / T  
1,919  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
8,83E-02  
4,61E-01  
8,36E-01  
3,41E-01  
1,94E-01  
2,18E+00  
1,63E-01  
4,26E-02  
5,57E-03  
7,35E-04  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
18  
10-F007NRA050SG-P966F09  
datasheet  
Thermistor Characteristics  
figure 19.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
19  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switching Characteristics  
figure 20.  
IGBT  
figure 21.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
1,0  
0,8  
0,6  
0,4  
0,2  
0,0  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
Eon  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eon  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
125 °C  
150 °C  
350  
±15  
35  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
V
A
Rgon  
Rgoff  
Ω
Ω
4
figure 22.  
FWD  
figure 23.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
0,010  
0,008  
0,006  
0,004  
0,002  
0,000  
0,008  
0,007  
0,006  
0,005  
0,004  
0,003  
0,002  
0,001  
0,000  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
35  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
20  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switching Characteristics  
figure 24.  
IGBT  
figure 25.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(on)  
td(off)  
-1  
10  
-1  
10  
td(on)  
tr  
tf  
tf  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
±15  
4
°C  
150  
350  
±15  
35  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
Ω
Ω
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
4
figure 26.  
FWD  
figure 27.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn off gate resistor  
trr = f(IC)  
trr = f(Rgoff)  
0,0150  
0,0125  
0,0100  
0,0075  
0,0050  
0,0025  
0,0000  
0,0150  
0,0125  
0,0100  
0,0075  
0,0050  
0,0025  
0,0000  
trr  
trr  
trr  
trr  
trr  
trr  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
35  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
21  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switching Characteristics  
figure 28.  
FWD  
figure 29.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn off gate resistor  
Qr = f(IC)  
Qr = f(Rgoff)  
0,09  
0,08  
0,07  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
0,12  
0,10  
0,08  
0,06  
0,04  
0,02  
0,00  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
125 °C  
150 °C  
350  
±15  
35  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Ω
figure 30.  
FWD  
figure 31.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn off gate resistor  
IRM = f(IC)  
IRM = f(Rgoff)  
22,5  
20,0  
17,5  
15,0  
12,5  
10,0  
7,5  
30  
25  
20  
15  
10  
5
IRM  
IRM  
IRM  
IRM  
IRM  
5,0  
2,5  
0,0  
0
0,0  
0
10  
20  
30  
40  
50  
60  
70  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
125 °C  
150 °C  
350  
±15  
35  
V
125 °C  
Tj:  
V
A
Ω
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
22  
10-F007NRA050SG-P966F09  
datasheet  
Buck Switching Characteristics  
figure 32.  
FWD  
figure 33.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn off gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgoff)  
9000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
8000  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
R
goff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
35  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 34.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
120  
IC MAX  
100  
80  
60  
40  
20  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
4
°C  
Ω
Rgon  
Rgoff  
=
=
4
Ω
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
23  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switching Characteristics  
figure 35.  
IGBT  
figure 36.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eoff  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eon  
Eon  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
125 °C  
350  
±15  
35  
V
125 °C  
V
V
A
Rgon  
Rgoff  
Ω
Ω
4
figure 37.  
FWD  
figure 38.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
125 °C  
350  
±15  
35  
V
125 °C  
V
A
Ω
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
24  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switching Characteristics  
figure 39.  
IGBT  
figure 40.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(off)  
tf  
td(on)  
tf  
-1  
10  
-1  
10  
td(on)  
tr  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
125  
350  
±15  
4
°C  
125  
350  
±15  
35  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
Ω
Ω
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
4
figure 41.  
FWD  
figure 42.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn off gate resistor  
trr = f(IC)  
trr = f(Rgoff)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,30  
0,25  
0,20  
0,15  
0,10  
0,05  
0,00  
trr  
trr  
trr  
trr  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
350  
±15  
35  
V
125 °C  
V
A
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
25  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switching Characteristics  
figure 43.  
FWD  
figure 44.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn off gate resistor  
Qr = f(IC)  
Qr = f(Rgoff)  
7
6
5
4
3
2
1
0
6
5
4
3
2
1
0
Qr  
Qr  
Qr  
Qr  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
125 °C  
350  
±15  
35  
V
125 °C  
V
V
A
Ω
figure 45.  
FWD  
figure 46.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn off gate resistor  
IRM = f(IC)  
IRM = f(Rgoff)  
100  
80  
60  
40  
20  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
IRM  
IRM  
IRM  
IRM  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
125 °C  
350  
±15  
35  
V
125 °C  
V
A
Ω
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
26  
10-F007NRA050SG-P966F09  
datasheet  
Boost Switching Characteristics  
figure 47.  
FWD  
figure 48.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn off gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgoff)  
8000  
10000  
8000  
6000  
4000  
2000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
dirr/dt ──────  
0
10  
20  
30  
40  
50  
60  
70  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
Tj:  
Tj:  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
350  
±15  
35  
V
V
A
125 °C  
figure 49.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
80  
IC MAX  
70  
60  
50  
40  
30  
20  
10  
0
0
250  
500  
750  
1000  
1250  
1500  
V
CE(V)  
Tj =  
At  
125  
°C  
Rgon  
Rgoff  
=
=
4
4
Ω
Ω
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
27  
10-F007NRA050SG-P966F09  
datasheet  
Switching Definitions  
figure 50.  
IGBT  
figure 51.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 52.  
IGBT  
figure 53.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
28  
10-F007NRA050SG-P966F09  
datasheet  
Switching Definitions  
figure 54.  
FWD  
figure 55.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
29  
10-F007NRA050SG-P966F09  
datasheet  
Ordering Code  
Version  
Ordering Code  
Without thermal paste  
10-F007NRA050SG-P966F09  
10-F007NRA050SG-P966F09-/7/  
10-F007NRA050SG-P966F09-/3/  
With thermal paste (4,4 W/mK, PTM6000)  
With thermal paste (3,4 W/mK, PSX-P7)  
Marking  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
G6  
33,6  
30,7  
27,8  
22  
0
2
0
S4/6  
G4  
3
0
4
0
-DC  
-DC  
GND  
S2  
5
19,2  
11,4  
0
0
6
0
7
0
8
0
2,9  
9,9  
12,7  
15,5  
19,7  
22,6  
22,6  
22,6  
22,6  
22,6  
22,6  
22,6  
14,8  
8,2  
G2  
9
0
Line  
Line  
Line  
G1  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
0
0
0
0
S1  
10,1  
17,9  
20,8  
27,8  
30,7  
33,6  
33,6  
33,6  
GND  
+DC  
+DC  
G3  
S3/5  
G5  
NTC1  
NTC2  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
30  
10-F007NRA050SG-P966F09  
datasheet  
Pinout  
+DC  
15,16  
T5  
T1  
D13  
D1  
19  
G5  
18 S3/5  
17  
G3  
D9  
D3  
D4  
12 G1  
13 S1  
GND  
6,14  
Line  
9,10,11  
T2  
T6  
D10  
D14  
8 G2  
7 S2  
NTC  
D2  
1
G6  
2 S4/6  
G4  
3
NTC1  
20  
NTC2  
21  
-DC  
4,5  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T5, T6  
D3, D4  
D13, D14  
T1, T2  
D2, D1  
D9, D10  
NTC  
IGBT  
FWD  
650 V  
650 V  
50 A  
16 A  
10 A  
35 A  
25 A  
7 A  
Buck Switch  
Buck Diode  
FWD  
650 V  
Buck Sw. Protection Diode  
Boost Switch  
IGBT  
1200 V  
1200 V  
1200 V  
FWD  
Boost Diode  
FWD  
Boost Sw. Protection Diode  
Thermistor  
Thermistor  
28 Jul. 2021 / Revision 3  
Copyright Vincotech  
31  
10-F007NRA050SG-P966F09  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 135  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 0 packages see vincotech.com website.  
Package data  
Package data for flow 0 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
New brand, PCM Rth values  
10-F007NRA050SG-P966F09-D2-14  
20 Jun. 2016  
10-F007NRA050SG-P966F09-D3-14  
28 Jul. 2021  
Buck Diode change  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
32  
28 Jul. 2021 / Revision 3  

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